JP2003324091A5 - - Google Patents

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Publication number
JP2003324091A5
JP2003324091A5 JP2002126400A JP2002126400A JP2003324091A5 JP 2003324091 A5 JP2003324091 A5 JP 2003324091A5 JP 2002126400 A JP2002126400 A JP 2002126400A JP 2002126400 A JP2002126400 A JP 2002126400A JP 2003324091 A5 JP2003324091 A5 JP 2003324091A5
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JP
Japan
Prior art keywords
ruthenium film
electrode
processing
substrate
electrolytic processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002126400A
Other languages
English (en)
Japanese (ja)
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JP2003324091A (ja
JP3833139B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002126400A priority Critical patent/JP3833139B2/ja
Priority claimed from JP2002126400A external-priority patent/JP3833139B2/ja
Priority to US10/337,357 priority patent/US7101465B2/en
Priority to US10/669,468 priority patent/US7638030B2/en
Publication of JP2003324091A publication Critical patent/JP2003324091A/ja
Publication of JP2003324091A5 publication Critical patent/JP2003324091A5/ja
Application granted granted Critical
Publication of JP3833139B2 publication Critical patent/JP3833139B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2002126400A 2001-06-18 2002-04-26 電解加工装置 Expired - Fee Related JP3833139B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2002126400A JP3833139B2 (ja) 2002-04-26 2002-04-26 電解加工装置
US10/337,357 US7101465B2 (en) 2001-06-18 2003-01-07 Electrolytic processing device and substrate processing apparatus
US10/669,468 US7638030B2 (en) 2001-06-18 2003-09-25 Electrolytic processing apparatus and electrolytic processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002126400A JP3833139B2 (ja) 2002-04-26 2002-04-26 電解加工装置

Publications (3)

Publication Number Publication Date
JP2003324091A JP2003324091A (ja) 2003-11-14
JP2003324091A5 true JP2003324091A5 (https=) 2005-09-15
JP3833139B2 JP3833139B2 (ja) 2006-10-11

Family

ID=29540826

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002126400A Expired - Fee Related JP3833139B2 (ja) 2001-06-18 2002-04-26 電解加工装置

Country Status (1)

Country Link
JP (1) JP3833139B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4978292B2 (ja) * 2007-04-19 2012-07-18 東ソー株式会社 ルテニウムのエッチング用組成物の除害方法
KR102820838B1 (ko) 2019-02-13 2025-06-13 가부시끼가이샤 도꾸야마 오늄염을 포함하는 반도체 웨이퍼의 처리액
JP2024033198A (ja) * 2022-08-30 2024-03-13 株式会社Screenホールディングス 基板処理装置

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