JP2003321614A - Plastically deformable radiation-shielding resin composition - Google Patents

Plastically deformable radiation-shielding resin composition

Info

Publication number
JP2003321614A
JP2003321614A JP2002127805A JP2002127805A JP2003321614A JP 2003321614 A JP2003321614 A JP 2003321614A JP 2002127805 A JP2002127805 A JP 2002127805A JP 2002127805 A JP2002127805 A JP 2002127805A JP 2003321614 A JP2003321614 A JP 2003321614A
Authority
JP
Japan
Prior art keywords
resin
radiation
tungsten powder
resin composition
plastically deformable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002127805A
Other languages
Japanese (ja)
Other versions
JP2003321614A5 (en
Inventor
Masaharu Saito
雅春 斉藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanebo Synthetic Fibers Ltd
Kanebo Ltd
Original Assignee
Kanebo Synthetic Fibers Ltd
Kanebo Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanebo Synthetic Fibers Ltd, Kanebo Ltd filed Critical Kanebo Synthetic Fibers Ltd
Priority to JP2002127805A priority Critical patent/JP2003321614A/en
Publication of JP2003321614A publication Critical patent/JP2003321614A/en
Publication of JP2003321614A5 publication Critical patent/JP2003321614A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a radiation-shielding material freed of conventional technological problems, using no lead-based material, and plastically deformable so as to afford a shape needed on-site in use. <P>SOLUTION: The radiation-shielding material is a resin composition comprising a base resin and 97-80 wt.% tungsten powder, wherein the base resin has a kinematic viscosity of 500-300,000 cSt at 100°C, being preferably a polyisobutene resin or polybutene resin, or a blend thereof, or copolymer thereof, and 1,000-30,000 in average molecular weight. <P>COPYRIGHT: (C)2004,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、放射線医療機器、
放射線発生装置、放射線格納容器、原子力施設等におい
て、放射線遮蔽体の間隙部から漏洩する放射線を遮蔽す
る目的やX線写真撮影時の表示マーカーとして用いるこ
とが出来る、塑性変形可能な放射線遮蔽用樹脂に関する
ものである。
TECHNICAL FIELD The present invention relates to a radiation medical device,
Plastic deformable radiation shielding resin that can be used in radiation generators, radiation storage containers, nuclear facilities, etc. to shield radiation leaking from the gap of the radiation shield and as a display marker during X-ray photography. It is about.

【0002】[0002]

【従来の技術】従来、放射線医療機器、放射線発生装
置、放射線格納容器、原子力施設等において、放射線遮
蔽体の間隙部から漏洩する放射線を遮蔽する目的におい
ては、主に塑性変形可能な金属である鉛もしくは鉛合金
が用いられてきた。また、X線写真撮影時の表示マーカ
ーとしては、鉛もしくは鉛合金を事前に文字や数字の形
に賦形した物や鉛もしくは鉛合金からなるシート状材や
棒材をその場で切断や変形させて用いていた。
2. Description of the Related Art Conventionally, in a radiation medical device, a radiation generator, a radiation storage container, a nuclear facility, etc., a plastically deformable metal is mainly used for the purpose of shielding the radiation leaking from the gap of the radiation shield. Lead or lead alloys have been used. In addition, as a display marker during X-ray photography, a lead or lead alloy is preliminarily shaped in the shape of letters or numbers, or a sheet or bar made of lead or lead alloy is cut or deformed on the spot. I was using it.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、近年、
鉛害による環境破壊の問題や鉛の人体への影響が懸念さ
れ非鉛への動きが急速に高まりつつある。非鉛系材料を
用いた放射線遮蔽材料としては、タングステンやタング
ステン合金を焼結により賦形して用いる物や、タングス
テン粉末や硫酸バリウム粉末等をナイロン樹脂などの熱
可塑性樹脂と複合化させ射出成形法や押出し成形法によ
り賦形して用いたり、同じくタングステン粉末や硫酸バ
リウム粉末等をエポキシ樹脂などの熱硬化性樹脂と複合
化させ注型加熱法やトランスファ成形法により賦形され
ている。
However, in recent years,
Due to concerns about environmental damage due to lead damage and the effects of lead on the human body, the movement toward lead-free is increasing rapidly. Radiation-shielding materials that use lead-free materials include tungsten and tungsten alloys that are shaped by sintering, and tungsten powder and barium sulfate powder that are compounded with thermoplastic resins such as nylon resin and injection molded. Or shaped by a extrusion molding method, or similarly shaped by a casting heating method or a transfer molding method in which tungsten powder, barium sulfate powder or the like is compounded with a thermosetting resin such as an epoxy resin.

【0004】しかし、これらの賦形方法においては、使
用場所、用途、形状などに合わせて事前に金型を準備
し、各種成形方法により賦形することが必要であり、使
用する現場において必要とする形状を得ることは不可能
であった。本発明の目的は、上記の従来の技術の問題点
を解消し、鉛系材料を使用せず、かつ使用するその場に
おいて必要とする形状を得る為の塑性変形可能な放射線
遮蔽材料を提供することを目的とする。
However, in these shaping methods, it is necessary to prepare a mold in advance according to the place of use, application, shape, etc., and perform shaping by various molding methods. It was impossible to obtain a shape that does. An object of the present invention is to solve the above-mentioned problems of the conventional techniques and to provide a plastically deformable radiation shielding material for obtaining a shape required without using a lead-based material and in situ. The purpose is to

【0005】[0005]

【課題を解決するための手段】本発明は、ベース樹脂と
タングステン粉末からなる樹脂塑性物であって、ベース
樹脂の100℃における動粘度が500〜300000
cStであり、タングステン粉末の比率が97〜80重
量%である放射線遮蔽性材料を得るものである。
The present invention is a resin plastic material comprising a base resin and a tungsten powder, the kinematic viscosity of the base resin at 100 ° C. being 500 to 300,000.
A radiation shielding material having a cSt and a tungsten powder ratio of 97 to 80% by weight is obtained.

【0006】[0006]

【発明の実施の形態】タングステン粉末をナイロン樹脂
に代表される熱可塑性樹脂やエポキシ樹脂に代表される
熱硬化性樹脂と複合化させ放射線遮蔽材料として用いる
ことは、既に行われている。しかし、熱可塑性樹脂を用
いる場合の成形方法としては射出成形や押出し成形を行
う為に射出成形機や押出し成形機が必要であり、また、
熱硬化性樹脂においてもトランスファー成形機や熱硬化
炉と言った機器が必要である。それゆえに使用する現場
での成形加工は不可能であった。
BEST MODE FOR CARRYING OUT THE INVENTION It has already been practiced to compound tungsten powder with a thermoplastic resin typified by nylon resin or a thermosetting resin typified by epoxy resin to be used as a radiation shielding material. However, as a molding method when a thermoplastic resin is used, an injection molding machine or an extrusion molding machine is required to perform injection molding or extrusion molding.
Even for thermosetting resins, equipment such as transfer molding machines and thermosetting furnaces are required. Therefore, it was not possible to perform on-site molding.

【0007】本発明に使用するベース樹脂とは、常温で
粘稠を示す不乾燥性の樹脂を指し、具体的には長鎖炭化
水素樹脂、石油ワックス、鉱油、シリコン樹脂等が挙げ
られる。その中でも化学的に安定でかつ他のものへの移
染性のない長鎖炭化水素樹脂が良い。
The base resin used in the present invention refers to a non-drying resin which is viscous at room temperature, and specific examples thereof include long-chain hydrocarbon resin, petroleum wax, mineral oil and silicone resin. Among them, a long-chain hydrocarbon resin that is chemically stable and does not transfer to another is preferable.

【0008】また、使用するベース樹脂のJIS K2
283法による100℃における動粘度が500〜30
0000cStであることが好ましく、動粘度が300
0〜10000cStであることがより好ましい。動粘
度が500cSt未満の場合には、タングステン粉末と
の複合化は出来てもその自重により変形が生じる。ま
た、動粘度が300000cStを超える場合には、タ
ングステン粉末との複合化が難しく、具体的にはタング
ステン粉末の鬆(す)を生じたり、変形させようとして
もちぎれてしまい塑性変形出来ない。
The base resin used is JIS K2.
Kinematic viscosity at 100 ° C. according to 283 method is 500 to 30
It is preferably 0000 cSt and has a kinematic viscosity of 300.
It is more preferably 0 to 10000 cSt. When the kinematic viscosity is less than 500 cSt, the tungsten powder is deformed due to its own weight even if it can be composited. Further, if the kinematic viscosity exceeds 300,000 cSt, it is difficult to form a composite with the tungsten powder, and specifically, voids of the tungsten powder are generated, or even if an attempt is made to deform the tungsten powder, it will be torn and cannot be plastically deformed.

【0009】長鎖炭化水素樹脂の中でもイソブテンの重
合体であるポリイソブテン樹脂やノルマルブテンの重合
体であるのポリブテン樹脂のいずれかもしくは、混合物
もしくは、共重合物は、可撓性に富み好ましい。
Among the long-chain hydrocarbon resins, any one of a polyisobutene resin which is a polymer of isobutene and a polybutene resin which is a polymer of normal butene, or a mixture or a copolymer thereof is preferable because of its high flexibility.

【0010】イソブテンの重合体であるポリイソブテン
樹脂やノルマルブテンの重合体であるのポリブテン樹脂
のいずれかもしくは、混合物もしくは、共重合物の平均
分子量は、1000〜30000のものが好適に用いら
れる。
The polyisobutene resin, which is a polymer of isobutene, and the polybutene resin, which is a polymer of normal butene, or a mixture or a copolymer thereof having an average molecular weight of 1,000 to 30,000 is preferably used.

【0011】平均分子量がこの範囲であると、樹脂の自
重による変形もなく、タングステン粉末とも容易に均一
に混合されるので好ましい。
When the average molecular weight is within this range, there is no deformation due to the weight of the resin, and the tungsten powder can be easily and uniformly mixed, which is preferable.

【0012】ここでの平均分子量とは、平均分子量20
000未満に関しては蒸気圧浸透圧法での値が適用さ
れ、平均分子量が20000以上に関しては、粘度平均
分子量を適用した。
The average molecular weight here means an average molecular weight of 20.
When the average molecular weight is 20000 or more, the viscosity average molecular weight is applied.

【0013】なお、本塑性物には、本発明の目的を損な
わない範囲で、酸化防止剤、熱安定剤、紫外線吸収剤、
着色剤等を添加することが出来る。
Incidentally, the present plastic material includes an antioxidant, a heat stabilizer, an ultraviolet absorber, and an ultraviolet absorber within a range not impairing the object of the present invention.
A colorant or the like can be added.

【0014】本発明に使用するタングステン粉末は、ベ
ース樹脂に均一に分散させる必要があることから、平均
粒径が5〜100μmの物が好ましく用いられる。
Since the tungsten powder used in the present invention needs to be uniformly dispersed in the base resin, a tungsten powder having an average particle diameter of 5 to 100 μm is preferably used.

【0015】タングステン粉末の表面をアミノシラン等
でカップリング処理することは、樹脂への分散性を上
げ、かつ樹脂からの脱落防止となり有効である。
Coupling the surface of the tungsten powder with aminosilane or the like is effective in improving dispersibility in the resin and preventing the tungsten powder from falling off.

【0016】タングステン粉末の割合は、97〜80重
量%が必要であり、より高い放射線遮蔽性を得るために
は、97〜90重量%がより好ましい。タングステン粉
末の割合が80重量%未満の場合には、ベース樹脂中へ
の分散に斑が生じ易くなる為、さらに最悪の場合は、未
分散部分が生じ放射線遮蔽のピンホールが生じる。ま
た、タングステン粉末の割合が97重量%を超える場合
には、ベース樹脂中へ完全に分散させることが出来ず、
複合物を塑性変形させようとした場合、容易にちぎれ
る。
The proportion of the tungsten powder is required to be 97 to 80% by weight, and 97 to 90% by weight is more preferable in order to obtain a higher radiation shielding property. When the proportion of the tungsten powder is less than 80% by weight, unevenness in dispersion in the base resin is likely to occur, and in the worst case, an undispersed portion occurs and a radiation shielding pinhole occurs. Further, when the ratio of the tungsten powder exceeds 97% by weight, it cannot be completely dispersed in the base resin,
When trying to plastically deform a composite, it is easily torn.

【0017】[0017]

【発明の効果】本発明の放射線遮蔽用樹脂組成物によ
り、鉛害の無い塑性変形可能な放射線遮蔽性材料として
使用することが出来る。
The radiation shielding resin composition of the present invention can be used as a radiation shielding material which is free from lead damage and is plastically deformable.

【0018】[0018]

【実施例】以下、実施例によって本発明を詳細に説明す
る。実施例に先立ちって、ベース樹脂とタングステン粉
末の複合化方法について説明する。所定量のベース樹脂
とタングステン粉末を常温にて高速攪拌翼付き混合機
(スーパーミキサー)で予備混合した後、スクリュー径
25mmの単軸押出し機で100℃にて混練し、複合樹
脂を得た。
The present invention will be described in detail below with reference to examples. Prior to the examples, a method of compounding the base resin and the tungsten powder will be described. A predetermined amount of base resin and tungsten powder were premixed at room temperature with a mixer (super mixer) equipped with a high-speed stirring blade, and then kneaded at 100 ° C. with a single-screw extruder having a screw diameter of 25 mm to obtain a composite resin.

【0019】(実施例1〜4、比較例1〜4)表1に示
したベース樹脂およびタングステン粉末の比率にて、上
記方法にて複合させた。得られた複合樹脂を5mm厚さ
の板状に形成し、工業用X−レイフィルム(富士写真フ
ィルム製 ENVELOPAK)上に置き、60kV、
200mA、0.04秒の露光を行った後、常法にて現
像を行いX線の遮蔽性を評価した。評価結果を表1に合
わせて示した。
(Examples 1 to 4 and Comparative Examples 1 to 4) The base resin and the tungsten powder shown in Table 1 were mixed in the above-mentioned method at the ratio. The obtained composite resin was formed into a plate shape having a thickness of 5 mm, placed on an industrial X-ray film (ENVELOPAK manufactured by Fuji Photo Film), and 60 kV,
After exposure at 200 mA for 0.04 seconds, development was carried out by a conventional method to evaluate the X-ray shielding property. The evaluation results are also shown in Table 1.

【0020】[0020]

【表1】 [Table 1]

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 ベース樹脂とタングステン粉末からなる
樹脂塑性物であって、ベース樹脂の100℃における動
粘度が500〜300000cStであり、タングステ
ン粉末の比率が97〜80重量%であることを特徴とす
る放射線遮蔽用樹脂組成物。
1. A resin plastic material comprising a base resin and a tungsten powder, wherein the base resin has a kinematic viscosity at 100 ° C. of 500 to 300,000 cSt, and a tungsten powder ratio of 97 to 80% by weight. A resin composition for radiation shielding.
【請求項2】 ベース樹脂が、ポリイソブテン樹脂、ポ
リブテン樹脂のいずれかもしくは、混合物もしくは、共
重合物であり、その平均分子量が1000〜30000
であることを特徴とする請求項1記載の放射線遮蔽用樹
脂組成物。
2. The base resin is a polyisobutene resin, a polybutene resin, a mixture or a copolymer, and the average molecular weight thereof is 1,000 to 30,000.
The radiation-shielding resin composition according to claim 1, wherein
JP2002127805A 2002-04-30 2002-04-30 Plastically deformable radiation-shielding resin composition Pending JP2003321614A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002127805A JP2003321614A (en) 2002-04-30 2002-04-30 Plastically deformable radiation-shielding resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002127805A JP2003321614A (en) 2002-04-30 2002-04-30 Plastically deformable radiation-shielding resin composition

Publications (2)

Publication Number Publication Date
JP2003321614A true JP2003321614A (en) 2003-11-14
JP2003321614A5 JP2003321614A5 (en) 2005-06-09

Family

ID=29541758

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002127805A Pending JP2003321614A (en) 2002-04-30 2002-04-30 Plastically deformable radiation-shielding resin composition

Country Status (1)

Country Link
JP (1) JP2003321614A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007513251A (en) * 2003-12-05 2007-05-24 バー−レイ・プロダクツ・インコーポレーテッド Low weight ultra thin flexible radiation attenuating composition
JP2008093332A (en) * 2006-10-16 2008-04-24 Shimadzu Corp X-ray movable diaphragm device
CN103165208A (en) * 2011-12-09 2013-06-19 株式会社富士克 Radiation shield body and radiation shield product using the same
WO2022072281A1 (en) * 2020-09-29 2022-04-07 Pennzsuppress Corp. Anticorrosive agents and methods of manufacture and use

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007513251A (en) * 2003-12-05 2007-05-24 バー−レイ・プロダクツ・インコーポレーテッド Low weight ultra thin flexible radiation attenuating composition
JP2008093332A (en) * 2006-10-16 2008-04-24 Shimadzu Corp X-ray movable diaphragm device
CN103165208A (en) * 2011-12-09 2013-06-19 株式会社富士克 Radiation shield body and radiation shield product using the same
WO2022072281A1 (en) * 2020-09-29 2022-04-07 Pennzsuppress Corp. Anticorrosive agents and methods of manufacture and use

Similar Documents

Publication Publication Date Title
JP5318733B2 (en) Thermally conductive grease
DE112014007281B4 (en) silicone composition
JP5340558B2 (en) Epoxy resin composition for semiconductor encapsulation and semiconductor device obtained using the same
CN1195359A (en) Polypropylene compatible grease compositions for optical fiber cable
DE102004012683A1 (en) Laser sintering with lasers with a wavelength of 100 to 3000 nm
JP2007277406A (en) Highly heat-conductive resin compound, highly heat-conductive resin molded article, compounding particle for heat-releasing sheet, highly heat-conductive resin compound, highly heat-conductive resin molded article, heat-releasing sheet, and method for producing the same
CN1114968A (en) Low expansion polymeric compositions
JP2003321614A (en) Plastically deformable radiation-shielding resin composition
JP2004514042A (en) Thermally conductive casting material
Rossegger et al. 3D Printing of Soft Magnetoactive Devices with Thiol‐Click Photopolymer Composites
EP0572844B1 (en) Process for the preparation of a curable moulding composition
DE3153142C2 (en)
CN113045819B (en) Glass microsphere filled polypropylene composition and preparation method thereof
US20080041271A1 (en) High-Density Composite Material Containing Tungsten Powder
JPH08245755A (en) Epoxy resin composition and sealed device of electronic part
JP2008189835A (en) Thermally conductive composition and its manufacturing method
JP2019001849A (en) Filler, molding, and heat radiation material
JP3385784B2 (en) Inorganic filler anti-settling type casting resin composition and premix composition
JP2576713B2 (en) Epoxy resin composition and semiconductor device
JP3375107B2 (en) Epoxy resin composition for semiconductor encapsulation
JP6561410B2 (en) Thermally conductive composition and thermally conductive member
GB2193594A (en) Water blocking in cables
WO2023080202A1 (en) Thermally conductive composition and thermally conductive member
JPS58167657A (en) Epoxy resin powder composition
JP2005281612A (en) Heat-conductive molding

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040823

A621 Written request for application examination

Effective date: 20040823

Free format text: JAPANESE INTERMEDIATE CODE: A621

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A711

Effective date: 20051128

A521 Written amendment

Effective date: 20051129

Free format text: JAPANESE INTERMEDIATE CODE: A821

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20060922

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20061012

A02 Decision of refusal

Effective date: 20070220

Free format text: JAPANESE INTERMEDIATE CODE: A02