JP2003320470A - Ultraviolet laser beam machining method by infrared laser beam assist and machining device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To execute laser beam machining such as boring and cutting, or groove machining while preventing occurrence of cracks by executing abrasion processing by irradiation of an ultraviolet laser beam on the face to be machined of a workpiece by using the ultraviolet laser beam in the near ultraviolet and the far ultraviolet regions with the wavelength of ≤355 nm, and at the same time, by the irradiation of an infrared laser beam to the same place. <P>SOLUTION: The abrasion processing is executed by the irradiation of the ultraviolet laser beam L1 in the near ultraviolet and the far ultraviolet regions with the wavelength of ≤355 nm on the face to be machined of the workpiece 1 and by the assist irradiation of the infrared laser beam to the same place. The irradiation of the ultraviolet laser beam L1 is executed via a beam expander 4, an aperture 5, a reflection mirror 6, a homogenizer 7, an image formation optical system 8 or the like. Working processes are observed and recorded by using an observation optical system provided to the upper part of the reflection mirror 6 and a CCD camera 9. The device is driven freely movably so as to focus on a machining position. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention uses a near-ultraviolet or far-ultraviolet ultraviolet laser having a wavelength of 355 nm or less to irradiate the surface of a workpiece with an ultraviolet laser to perform ablation, and at the same time. By irradiating the surface with an infrared laser and performing ablation processing, laser processing such as drilling, cutting or groove processing is performed while preventing the generation of cracks.

[0002]

2. Description of the Related Art Conventional processing methods have been mainly thermal processing with a diamond tool or an infrared laser alone, or ablation processing with an ultraviolet laser alone, but these methods have some problems. Need to improve.

In the processing using a laser, the high energy property, the high efficiency, the light converging property, the directivity, etc. of the laser are utilized to perform the processing without any contact by concentrating temporally and spatially. Or, depending on the oscillation wavelength, excimer lasers and nitrogen lasers were also used. There are materials that cause cracks in the ablation process using an ultraviolet laser. Therefore, the effectiveness of the ablation process, which is characterized in that it can be processed without using heat, is halved.

[0004]

Although it has been processed by using a diamond tool or an infrared laser, it has problems such as pre-processing required and fine (1 mm or less) processing not possible. , These improvements were needed.

In machining with a diamond tool, it is necessary to carry out a pretreatment. Lubricant must be used to reduce friction. Processing speed is slow and takes time. Since lubricating oil is used, cleaning with an organic solvent is required. The tool wears and needs to be replaced regularly. Fine (1 mm or less) drilling and grooving are not possible. There were problems such as.

In the processing by the infrared laser, it is necessary to perform a processing pretreatment. Cannot process thin plates.
Fine (1 mm or less) drilling is not possible.
Micro cracks appear. The plate is warped due to heat processing, and it cannot be processed in close proximity. Post-treatment required. There were problems such as.

Cracking may occur in the processing by the ultraviolet laser. Chips (losses) may occur. There were problems such as.

As a problem to solve the problems of the prior art, fine (1 mm or less) groove processing, fine (1 mm or less) drilling, processing in which an object to be processed does not warp, processing in a close place, There has been a long-awaited technology that enables easy and precise laser processing of thin plates and cutting.

[0009]

The present invention is capable of solving the drawbacks of the prior art, does not require pre-processing of an object to be processed, and makes fine (1 mm or less) grooving, boring, To provide an ultraviolet laser processing method and processing device with infrared laser assist that enables cutting, etc., and can also process an object to be processed without warping, and can perform processing in close proximity, thin plate processing, etc. It is a thing.

The infrared laser assisted ultraviolet laser processing method of the present invention will be described in detail with reference to FIG. 1. The surface 2 to be processed of the object 1 to be processed is irradiated with an ultraviolet laser L1 in the near ultraviolet or far ultraviolet region having a wavelength of 355 nm or less. When processing the object 1 to be processed, an ultraviolet laser processing method using an infrared laser assist in which the infrared laser L2 is also used as an assist, wherein the surface 2 to be processed of the object 1 to be placed on the XYZ table 12 is The ultraviolet laser L1 having a wavelength of 355 nm or less emitted from the ultraviolet laser oscillator 3 is irradiated through the beam expander 4, the aperture 5, the reflection mirror 6, the homogenizer 7, the imaging optical system 8's, and the like. Observe the work process using the observation optical system and CCD camera 9 installed at the top.
On the other hand, in common with the ultraviolet laser L1, the infrared laser L2 is recorded at the same position as the ultraviolet laser irradiation spot 13 on the processed surface 2 of the processing object 1 within a range of 180 degrees from the upper side of the processed surface 2. In order to increase the molecular energy momentum of the object to be processed 1 by performing focused irradiation, the XYZ table 1
2 is movably installed, or the infrared laser assist is such that the imaging optical systems 8 and 10 of the ultraviolet laser L1 and the infrared laser L2 are movably driven so as to focus on the processing position of the processing object 1. It is a method of processing an ultraviolet laser according to.

The ultraviolet laser L1 used in the present invention is limited to the near ultraviolet and far ultraviolet regions having an oscillation wavelength of 355 nm or less, but the oscillation wavelength is limited to 400 nm, and the ultraviolet light oscillated through the beam expander 4 is used. The laser L1 is
Unnecessary ultraviolet laser light is to be cut by the aperture 5.

The ultraviolet laser processing apparatus 14 according to the present invention, which is assisted by infrared laser, will be described in detail with reference to FIG.
The laser beam emitted from the image forming optical system 8 of the ultraviolet laser oscillator 3 and the image forming optical system 10 of the infrared laser oscillator 11 by the infrared laser assist is arranged so as to be condensed and emitted to the surface 2 to be processed. The imaging optical system 8 of the ultraviolet laser oscillator 3 includes a beam expander 4, an aperture 5, a reflection mirror 6, a homogenizer 7, and an imaging optical system between the ultraviolet laser oscillator 3 and the surface 2 to be processed of the processing object 1. The system 8 is provided, and the reflection mirror 6 uses the homogenizer 7 for the ultraviolet laser L1 emitted from the ultraviolet laser oscillator 3.
Is arranged at a corner on the optical path bent so as to be reflected in the direction of, and an observation optical system and a CC are provided above the reflection mirror 6.
The D camera 9 is provided, while the image forming optical system 10 of the infrared laser oscillator 11 is provided between the infrared laser oscillator 11 and the surface 2 to be processed of the workpiece 1, and The XYZ table 12 on which the processing object 1 is placed is movably installed at the same position as the ultraviolet laser irradiation position 13 on the surface 2 to be processed of the processing object 1 so that the infrared laser L2 is irradiated, or Laser L1 and infrared laser L2
The ultraviolet laser processing device 14 is an infrared laser assisted device that drives the respective imaging optical systems 8 and 10 to be movable so as to focus on the processing position of the processing object 1.

A beam expander 4 is disposed in front of an ultraviolet laser oscillator 3 which oscillates an ultraviolet laser L1, and an aperture 5 and a reflecting mirror 6 are interposed between the beam expander 4 and a homogenizer 7, and a reflecting mirror. Reference numeral 6 is arranged at a corner on an optical path bent so that the ultraviolet laser L1 is reflected in the direction of the homogenizer 7, and an image forming optical system 8 is arranged in front of the homogenizer 7, and the tip of the image forming optical system 8 is arranged. The XYZ table 12 on which the processing object 1 is placed
Is movably installed, while the image forming optical system 10 of the infrared laser oscillator 11 is arranged between the infrared laser oscillator 11 and the surface 2 to be processed of the workpiece 1, and The imaging optical systems 8 and 10 of the ultraviolet laser L1 and the infrared laser L2 are movably driven so as to focus on the processing position of the processing object 1, and the processing object 1 is mounted on the XYZ table 12. Since it is placed and processed, the ultraviolet laser oscillator 3, the beam expander 4, the aperture 5, the reflection mirror 6, the homogenizer 7, the imaging optical system 8, the CCD camera 9, the imaging optical system 10, the infrared laser oscillator 11, the XYZ table. It is composed of twelve etc.

The processing method of the present invention will be described in detail with reference to the embodiment shown in FIG. 2. The processing surface 2 of the processing object 1 is irradiated with the ultraviolet laser L1 and the infrared laser L2 at the same location. is there.

Since the infrared laser L2 is focused and irradiated on the same position as the ultraviolet laser irradiation position 13 on the surface 2 to be processed of the object to be processed, the molecular energy momentum of the object to be processed is increased and the bond of molecules is weakened. By the UV laser L1
It was possible to improve the processing efficiency when irradiating with, and there was an advantage that cracks and chips were eliminated.

The surface 2 to be processed of the object 1 can be processed either on a transparent surface or on a "plain" surface having fine irregularities such as pear skin.

[0017]

According to the infrared laser assisted ultraviolet laser processing method of the present invention, not only the diamond tool and the processing pretreatment at the time of processing by the infrared laser are not required, but not only the drawbacks of the prior art are solved but also cracks are generated. Fine (1 mm or less) drilling, cutting, and groove processing that do not occur have become possible.

Further, it becomes possible to perform fine (1 mm or less) drilling, cutting and grooving without chipping.

Further, it is needless to say that processing of the object to be processed can be performed without warping, processing at a close place is possible, and processing of a thin plate is possible.

Since the processing apparatus according to the infrared laser assisted ultraviolet laser processing method of the present invention can be provided, it is possible to further apply the ultraviolet laser processing, which is often used in industry.

[Brief description of drawings]

FIG. 1 is a schematic view of an ultraviolet laser processing apparatus used in the present invention.

FIG. 2 is a diagram showing a working example of an object to be processed.

[Explanation of symbols]

1: Object to be processed 2: Surface to be processed 3: Ultraviolet laser oscillator 4: Beam expander 5: Aperture 6: Reflection mirror 7: Homogenizer 8: Imaging optical system 9: CCD camera 10: Imaging optical system 11: Infrared laser oscillator 12: XYZ table 13: UV laser irradiation point 14: Ultraviolet laser processing device L1: UV laser L2: Infrared laser

Claims (2)

[Claims] 1. An ultraviolet ray assisted by an infrared laser, which shares an infrared laser as an assist when a surface to be processed of an object to be processed is irradiated with an ultraviolet laser having a wavelength of 355 nm or less in the near ultraviolet or far ultraviolet region. In the laser processing method, an ultraviolet laser having a wavelength of 355 nm or less oscillated from an ultraviolet laser oscillator is applied to a surface to be processed of an object to be processed placed on an XYZ table by a beam expander, an aperture, a reflection mirror, a homogenizer, an imaging lens, etc. And observing and recording the work process using the observation optical system and CCD camera arranged above the reflection mirror, while using the UV laser in common.
In order to increase the molecular energy momentum of the object to be processed by concentrating and irradiating the infrared laser on the same position as the ultraviolet laser irradiation position on the object to be processed in the range of 180 degrees from the upper side of the surface to be processed, An infrared laser assisted ultraviolet laser processing method in which an XYZ table is movably installed or the respective imaging optical systems of the ultraviolet laser and the infrared laser are movably driven so as to focus on a processing position of an object to be processed. . 2. Laser light emitted from an image forming optical system of an ultraviolet laser oscillator and an image forming optical system of an infrared laser oscillator assisted by infrared laser to a work surface of an object to be processed placed on an XYZ table. The configuration is such that the laser beam is focused and irradiated, and the imaging optical system of the ultraviolet laser oscillator consists of a beam expander, an aperture, a reflection mirror, a homogenizer, and an imaging optics between the ultraviolet laser oscillator and the surface to be processed of the workpiece. The system is arranged, the reflection mirror is arranged at a corner on the optical path bent so that the ultraviolet laser emitted from the ultraviolet laser oscillator is reflected in the direction of the homogenizer, and the observation optical system and the observation optical system are provided above the reflection mirror. C
A CD camera is provided, while the image forming optical system of the infrared laser oscillator is provided with an image forming optical system between the infrared laser oscillator and the work surface of the object to be processed. The XYZ table on which the object to be processed is movably installed so that the infrared laser is irradiated to the same place as the ultraviolet laser irradiation position above, or the imaging optical system for each of the ultraviolet laser and the infrared laser is installed on the object to be processed. An infrared laser assisted ultraviolet laser processing device that is driven so that it can move freely so that it focuses on the processing position.