JP2003318452A - Thermoelectric device and storage house - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enhance the cooling efficiency of a thermoelectric device and to facilitate setting of the thermoelectric device in a storage house by making compact the structure thereof. <P>SOLUTION: The thermoelectric device comprises a thermoelectric module 6 having a heat dissipation surface 6a and a heat absorbing surface 6b facing each other, a heat dissipation heat sink 9 bonded to the heat dissipation surface 6a and exchanging heat therewith, and a cooling heat sink 10 bonded to the heat absorbing surface 6b and exchanging heat therewith wherein a space surrounded by the outer circumferential surface of the thermoelectric module 6, the bonding face of the heat dissipation heat sink 9 and the bonding face of the cooling heat sink 10 is filled with one planar vacuum heat insulating material 7 having a hole 8 for containing the thermoelectric module 6. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermoelectric device using a thermoelectric module having a Peltier effect and a storage using the thermoelectric device.

[0002]

2. Description of the Related Art In recent years, the ozone layer depleting action of chlorofluorocarbon has become a global problem, and there has been an urgent need to develop storages and the like that do not use chlorofluorocarbon. As one of the storages that does not use CFCs, a storage that uses a thermoelectric module is drawing attention.

Here, the thermoelectric module is a Peltier (P
known as an electronic module, a thermo module, or a thermoelectric chip, a thermoelectric element,
It is a member that has two heat transfer surfaces and has a function of heating one heat transfer surface and cooling the other heat transfer surface by passing an electric current (applying a predetermined voltage). That is, in the thermoelectric module, one surface functions as a heat radiation surface and the other surface functions as a heat absorption surface.

An example of a thermoelectric device using a thermoelectric module is disclosed in Japanese Patent Laid-Open No. 176796/1995.

The conventional thermoelectric device will be described below with reference to the drawings.

FIG. 8 shows a sectional view of a conventional thermoelectric device.

In FIG. 8, reference numeral 1 denotes a thermoelectric module, which has a heat radiating surface 1a on one of two opposing flat surfaces and a heat absorbing surface 1b on the other. Reference numeral 2 is a heat sink for heat dissipation, which has a plurality of fins 2a on one side, and the back side of the fins 2a is the thermoelectric module 1
Is thermally bonded to the heat radiation surface 1a. 3 is a cooling heat sink having a plurality of fins 3a on one side.
The back side of a is thermally joined to the heat absorbing surface 1b of the thermoelectric module 1 via the block 4.

In the general case where the conventional thermoelectric device configured as described above is used in a refrigerator or the like, a through hole is provided in a part of a heat insulating wall that separates the inside and the outside of the refrigerator, and the heat sink 2 for heat dissipation is provided. The cooling heat sink 3 is attached so as to be located on the outer side and the inner side of the refrigerator with a through hole interposed therebetween.

In FIG. 8, reference numeral 5 is a heat insulating wall. The thermoelectric module 1 and the block 4 are inserted into the penetrating portion provided in the heat insulating wall 5, and the heat sinks 2 for heat radiation are provided on both sides of the heat insulating wall 5.
And the heat sink 3 for cooling projects.

[0010]

However, in the above conventional technique, it is necessary to minimize the through holes provided in the heat insulating wall 5 in order to suppress the amount of heat entering from the outside to the inside of the refrigerator. In addition, the heat sink 2 for heat dissipation and the heat sink 3 for cooling have a size in the planar direction in order to expand the heat transfer area due to the low heat transfer coefficient of the airflow for heat exchange.
Need to be larger than the thermoelectric module 1
Since the amount of heat radiation is larger than the amount of cooling by the amount of electric input to the heat sink 2, the heat sink 2 for heat radiation is usually larger than the heat sink 3 for cooling.

In order to satisfy these requirements, the heat sink 2 for heat radiation and the heat sink 3 for cooling are mounted with the heat insulating wall 5 sandwiched therebetween, and the block 4 compensates for the difference between the thickness of the heat insulating wall 5 and the thickness of the thermoelectric module 1. Becomes

Therefore, due to an increase in contact thermal resistance due to an increase in the number of joints and a thermal resistance inside the block 4, the total thermal resistance on the cooling side between the air flow inside the refrigerator and the thermoelectric module 1 becomes large, and the thermoelectric module is increased. There is a problem that the temperature difference between the heat radiation surface 1a and the heat absorption surface 1b of No. 1 becomes large and the cooling efficiency of the thermoelectric module 1 becomes low.

Further, as described above, the heat sink 2 for heat dissipation and the heat sink 3 for cooling are projected from the heat insulating wall 5, so that the thermoelectric device cannot be made compact in the thickness direction of the heat insulating wall 5.

Further, since the size of the heat sink 2 for cooling and the size of the heat sink 3 for cooling are larger than the through holes of the heat insulating wall 5, at least one of the heat sink 2 for cooling and the heat sink 3 for cooling is blocked from the thermoelectric module 1 and the block. Since it was necessary to insert 4 into the through hole of the heat insulating wall 5 and then to join them, there was a problem that the thermoelectric device could not be unitized and the assembly process became complicated.

Therefore, the present invention solves the above-mentioned problems of the prior art, and enables the thermoelectric device to be attached to a storage or the like without using a component such as a block that increases the thermal resistance, and the thermoelectric device can be attached. The purpose is to improve the cooling efficiency of. Another object is to make the thermoelectric device compact. Furthermore, it aims at facilitating the incorporation of the thermoelectric device into a storage or the like.

[0016]

In order to achieve this object, the invention of a thermoelectric device according to claim 1 of the present invention is such that when a heat radiating surface and a heat absorbing surface face each other and a predetermined voltage is applied, the heat is radiated from the heat radiating surface. A thermoelectric module that absorbs heat from a surface, a heat-radiating side heat exchange means that is joined to the heat-dissipating surface so that a joint surface that is larger than the heat-dissipating surface completely exchanges heat with the heat-dissipating surface, and that is larger than the heat-absorbing surface Endothermic side heat exchange means joined to the endothermic surface so that the joint surface completely covers the endothermic surface and exchanging heat with the endothermic surface, and at least one outer peripheral surface of the thermoelectric module and the heat radiating side heat exchanging means. A thermoelectric device is constituted by a vacuum heat insulating material provided so as to fill a space surrounded by the joint surface of (1) and the joint surface of the heat absorption side heat exchange means.

According to the first aspect of the present invention, a vacuum heat insulating material is provided so as to fill a space surrounded by the outer peripheral surface of the thermoelectric module, the joint surface of the heat radiation side heat exchange means, and the joint surface of the heat absorption side heat exchange means. Since the vacuum heat insulating material has a higher heat insulating performance than the foam heat insulating material, the heat insulating material can be thinner than the foam heat insulating material, so that the interval between the heat radiating side heat exchanging means and the heat absorbing side heat exchanging means can be narrowed to adjust the thickness. It becomes possible to directly join the heat radiation side heat exchange means and the heat absorption side heat exchange means to the heat transfer surface (heat radiation surface and heat absorption surface) of the thermoelectric module without interposing the block which is the component of the thermoelectric device. The cooling efficiency can be increased.

Further, since the distance between the heat radiation side heat exchange means and the heat absorption side heat exchange means can be narrowed, the thermoelectric device can be made compact, and the outer peripheral surface of the thermoelectric module and the joint surface of the heat radiation side heat exchange means and the heat absorption side heat exchange. Since the vacuum heat insulating material is provided so as to fill the space surrounded by the joint surface of the means, the size of the thermoelectric device excluding the heat exchange means having the larger joint surface between the heat radiation side heat exchange means and the heat absorption side heat exchange means. By inserting and fitting the heat insulation wall (heat insulation box body) with the through hole formed according to the height into the through hole, the thermoelectric device can be easily attached (built-in) to the storage or the like in one operation. The thermoelectric device can be unitized.

The invention of a thermoelectric device according to claim 2 is
The thermoelectric module in the invention according to claim 1 is configured by a plurality of thermoelectric modules alone arranged in parallel to the joint surface of the heat radiation side heat exchange means or the heat absorption side heat exchange means, and the heat radiation side heat exchange means or the heat absorption side. By increasing the contact area between the side heat exchanging means and the thermoelectric module, the amount of heat exchange between the heat radiating side heat exchanging means or the heat absorbing side heat exchanging means and the thermoelectric module increases, and the cooling capacity of the thermoelectric device can be increased. Further, by arranging a plurality of thermoelectric modules alone in parallel with the joint surface of the heat radiation side heat exchange means or the heat absorption side heat exchange means, the outer peripheral surface of the thermoelectric module and the joint surface of the heat radiation side heat exchange means and the heat absorption side heat exchange means The space surrounded by the joint surface becomes smaller, and the amount of vacuum heat insulating material provided to fill the space can be reduced.

The invention of a thermoelectric device according to claim 3 is
The thermoelectric module according to the invention of claim 1 is composed of a plurality of thermoelectric modules alone which are vertically stacked on the joint surface of the heat radiation side heat exchange means or the heat absorption side heat exchange means.
The cooling temperature can be lowered by increasing the temperature difference between the heat radiation surfaces at both ends of the stacked (overlapping) thermoelectric modules. Also, when adjusting the thickness of the vacuum insulation material to the thickness of the thermoelectric module, one thermoelectric module (single unit)
Even if sufficient vacuum insulation cannot be obtained with a vacuum insulation having a thickness that matches the above, the thickness of the vacuum insulation can be increased by stacking multiple thermoelectric modules to make the thermoelectric module thicker. The heat insulation performance is improved, the amount of heat transfer between the heat radiation side heat exchange means and the heat absorption side heat exchange means is reduced, and the cooling efficiency of the thermoelectric device can be increased.

Further, the invention of a thermoelectric device according to claim 4 is
One or both of the heat radiation side heat exchange means and the heat absorption side heat exchange means in the invention according to any one of claims 1 to 3;
A heat sink is provided with a plurality of fins for heat exchange with air on the side opposite to the joint surface, and the invention according to any one of claims 1 to 3, the heat radiation side heat exchange means and the heat absorption side heat exchange. It can be applied to a thermoelectric device using one or both of the means as a heat sink.

The invention of a thermoelectric device according to claim 5 is
At least one of the heat radiation side heat exchange means and the heat absorption side heat exchange means in the invention according to any one of claims 1 to 3,
A heat exchanger through which a liquid flows is provided. The invention according to any one of claims 1 to 3, wherein the liquid flows through at least one of the heat radiation side heat exchange means and the heat absorption side heat exchange means. It can be applied to a thermoelectric device as a heat exchanger.

The invention of a thermoelectric device according to claim 6 is
At least one of the heat radiation side heat exchange means and the heat absorption side heat exchange means in the invention according to any one of claims 1 to 3,
A heat pipe is used, and the invention according to any one of claims 1 to 3 can be applied to a thermoelectric device in which at least one of the heat radiation side heat exchange means and the heat absorption side heat exchange means is a heat pipe. it can.

The invention of a thermoelectric device according to claim 7 is
A hole or notch having the vacuum heat insulating material according to any one of claims 1 to 6, which has substantially the same thickness as the thermoelectric module and accommodates the thermoelectric module according to the size of the thermoelectric module. A hole or a notch as a vacuum heat insulating material filling the space surrounded by the outer peripheral surface of the thermoelectric module, the joint surface of the heat radiation side heat exchange means, and the joint surface of the heat absorption side heat exchange means. By using a single plate-shaped vacuum heat insulating material having a plurality of plate-shaped vacuum heat insulating materials, higher heat insulation performance can be obtained and the cooling efficiency of the thermoelectric device can be improved, compared with the case where a plurality of plate-shaped vacuum heat insulating materials are combined to surround the thermoelectric module. You can Also, by using one plate-shaped vacuum heat insulating material with holes or notches,
It is easier to assemble the thermoelectric device than when a plurality of plate-shaped vacuum heat insulating materials are combined to surround the thermoelectric module.

The invention of a thermoelectric device according to claim 8 is
A plate shape having a hole or a cutout in which the vacuum heat insulating material according to any one of claims 1 to 6 is thicker than the thermoelectric module and accommodates the thermoelectric module according to the size of the thermoelectric module. At least one of the heat radiation side heat exchange means and the heat absorption side heat exchange means in the invention according to any one of claims 1 to 6 is engaged with the hole or the notch in the joint surface, and It has a protrusion that compensates for the insufficient thickness of the thermoelectric module.

In the invention described in claim 8, as in the invention described in claim 7, by using one plate-shaped vacuum heat insulating material having holes or notches, high heat insulating performance can be obtained, and the thermoelectric device can be obtained. The cooling efficiency can be improved and the thermoelectric device can be easily assembled. Further, even if the thickness of the vacuum heat insulating material is made thicker in order to ensure the heat insulating performance, the hole of the vacuum heat insulating material is formed on the joint surface of at least one of the heat radiation side heat exchange means and the heat absorption side heat exchange means. Alternatively, by providing a protrusion that engages with the notch and compensates for the lack of thickness of the thermoelectric module with respect to the vacuum heat insulating material, the heat transfer surface (heat dissipation surface and heat absorption surface) of the thermoelectric module can be directly inserted without interposing a block that is a component for adjusting the thickness. The heat radiation side heat exchange means and the heat absorption side heat exchange means can be joined to the surface), and the cooling efficiency of the thermoelectric device can be improved.

The invention of a thermoelectric device according to claim 9 is
In the invention according to any one of claims 1 to 8, the outer dimensions of the vacuum heat insulating material excluding the thickness dimension are the same as those of the heat radiation side heat exchange means or the heat absorption side heat exchange means, whichever has the smaller joint surface. The heat insulating wall (adiabatic box body), which has substantially the same size as that of the heat radiating side heat exchanging means or the heat absorbing side heat exchanging means, has a through hole having substantially the same size as the joint surface having the smaller joint surface. On the other hand, by inserting and fitting the through hole into the through hole, the thermoelectric device can be easily attached (assembled) to the storage or the like in one operation, and the size of the through hole does not change in the through direction of the hole. Is easy to form, and the vacuum insulation cannot be seen from the outside after the thermoelectric device is attached (assembled) to the through hole of the insulation wall (insulation box), so the vacuum insulation can be protected from damage and the vacuum insulation You can secure long-term reliability.

The invention of the storage according to claim 10 is
It provided with the heat insulation box which has a through-hole formed according to the size of the thermoelectric device as described in any one of Claim 1 to 9, and the said thermoelectric device inserted and fitted in the said through-hole. In addition, assembling (manufacturing) and disassembling (maintenance) are easy, cooling efficiency is high, energy saving is achieved, and the thermoelectric device is reduced in size and weight, so that the weight of the storage can be reduced.

The joint surface of the heat radiating side heat exchange means (heat exchange means on the outside of the cabinet) is larger than the joint surface of the heat absorbing side heat exchange means (heat exchange means on the inside of the cabinet) and is outside the heat insulating box (outside the cabinet). If a thermoelectric device is installed from the inside, the amount of protrusion of the heat absorption side heat exchange means (heat exchange means on the inside of the refrigerator) to the inside of the refrigerator can be reduced, and the effective space inside the refrigerator is expanded by the amount of protrusion. it can. On the contrary, the joint surface of the heat absorption side heat exchange means (heat exchange means inside the cabinet) is larger than the joint surface of the heat radiation side heat exchange means (heat exchange means outside the cabinet) and inside the heat insulation box (chamber interior).
If a thermoelectric device is attached from the heat sink to the heat sink side, the amount of heat radiation on the heat radiation side (heat exchange means on the outer side) can be reduced to the outside (heat radiation chamber or heat radiation space). The external dimensions (usually the depth dimension) of the storage can be reduced.

Further, the invention of the storage according to claim 11 is
The vacuum heat insulating material of the thermoelectric device according to claim 7 or 8, which is wider than a joint surface of both the heat radiating side heat exchanging means and the heat absorbing side heat exchanging means, and constitutes at least a part of the heat insulating wall of the heat insulating box. By attaching the vacuum insulation material of the thermoelectric device to the unfinished insulation box before attaching the thermoelectric device as an insulation wall of at least a part of the insulation box, the insulation box is completed and at the same time A thermoelectric device can be attached. At this time, if the surface of the vacuum heat insulating material is reinforced, the vacuum heat insulating material can be used as it is as the heat insulating wall of at least a part of the heat insulating box. When at least a part of the heat insulating wall of the heat insulating box is formed of a vacuum heat insulating material, the vacuum heat insulating material has a higher heat insulating performance than the foam heat insulating material, and therefore, the thickness of the heat insulating wall can be made thinner than the foam heat insulating material.
By making the heat insulation wall thin, the inside of the storage can be widened,
The external dimensions of the storage can be reduced.

[0031]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below.

(Embodiment 1) FIG. 1 is a vertical cross-sectional view showing a state in which a thermoelectric device according to Embodiment 1 of the present invention is inserted and fitted into a through hole of a heat insulating wall which constitutes a heat insulating box of a storage. It is a side view.

In FIG. 1, reference numeral 6 denotes a thermoelectric module, which has a heat radiating surface 6a and a heat absorbing surface 6b on both sides substantially in parallel. 7
Reference numeral a denotes a non-air-permeable outer jacket material. A core material 7b is housed inside the outer jacket material 7a, and the inside of the outer jacket material 7a is kept in a decompressed state to form a vacuum heat insulating material 7. . The vacuum heat insulating material 7 is
It is known that it can be manufactured at a vacuum degree of 1.3 to 133 Pa and exhibits a heat insulating performance about 2 to 3 times that of a conventional heat insulating material such as urethane foam.

Here, the jacket material 7a is a plastic laminate bag having excellent gas barrier properties. The outermost layer is nylon (15 μm), the inner side is polyethylene terephthalate (12 μm), the intermediate layer is aluminum foil (6 μm), and the outermost layer is The inner layer is a heat-welding layer and has a four-layer structure made of low density polyethylene (100 μm). The outermost layer and its inside are materials with excellent external impact resistance and abrasion resistance.
Biaxially oriented polypropylene or the like can be used, and it is preferable to include at least one of these three materials. The intermediate layer is a material having an excellent gas barrier property, and in addition to aluminum foil, a gas barrier material having an aluminum vapor deposition layer can be used.
The innermost layer is a heat-welding material, and in addition to the above, high density polyethylene, amorphous polypropylene, amorphous polyethylene terephthalate, ethylene vinyl alcohol copolymer and the like can be used, and those having a low melting point are preferable from the viewpoint of sealing stability. .

The core material 7b is for preventing the space sealed under reduced pressure by the outer covering material 7a from being crushed by atmospheric pressure, and a porous body having a completely communicating structure can be used. Fine pores that exhibit high heat insulation performance even in low vacuum are preferable. For example, there are amorphous silica powder, urethane foam having an open cell structure, fine fiber glass wool, and the like. In particular, fine fiber glass wool has excellent heat insulation performance and has flexibility when a vacuum heat insulation container is formed. Is preferred. Further, it is not limited to silica powder, and known materials such as perlite powder, calcium silicate plate, continuous foam, and glass wool may be used.

Although the main constituent materials are as described above, especially when used at high temperature or when required performance and service life are severe, a room temperature active type getter or the like is used as a water adsorbent or an air adsorbent as an auxiliary. It is preferable. The water adsorbent is not limited to zeolite, and generally known water adsorbents such as calcium hydroxide, calcium chloride, lithium chloride, activated carbon and silica gel can be used. Chemical adsorption of calcium hydroxide, calcium chloride, lithium chloride, etc. is excellent in terms of adsorption ability, but zeolite activated carbon, which is physical adsorption, is suitable in view of handleability.

Further, the vacuum heat insulating material 7 is provided with a through hole (hole) 8, and the heat radiating surface 6a and the heat absorbing surface 6b of the thermoelectric module 6 are provided in the through hole (hole) 8 through the through hole (hole) 8. It is arranged perpendicular to the forming direction. Reference numeral 9 denotes a heat sink for heat dissipation, which has a plurality of fins 9a, and the back side of the fins 9a is thermally bonded directly or indirectly to the heat dissipation surface 6a of the thermoelectric module 6. Reference numeral 10 denotes a cooling heat sink having a plurality of fins 10a, and the back surface side of the fins 10a is thermally bonded directly or indirectly to the heat absorption surface 6b of the thermoelectric module 6.

The heat sink 9 for heat dissipation and the heat sink 10 for cooling are made of a material having excellent thermal conductivity such as aluminum. Each of the heat radiation heat sink 9 and the cooling heat sink 10 has a plate-shaped portion that diffuses heat from the thermoelectric module 6 serving as a base, and a large number of fins 9a and 10a are provided on the surface side thereof.

The heat sink 9 for heat dissipation and the heat sink 10 for cooling have fins 9a, 10a formed by thinly scraping the surface of a plate-like portion and raising the scraped portion, or the fin 9a.
a and 10a are thin plate-shaped members having a substantially L shape or a substantially I shape, and the heat sink 9 for heat dissipation and the heat sink 1 for cooling 1
There is one in which the surface side of the plate-shaped portion of No. 0 is joined by performing processing such as caulking or ultrasonic welding.

When the thermoelectric device configured as described above is used for a storage or the like, a through hole is provided in a part of a heat insulating wall that separates the inside and the outside of the refrigerator so that the heat sink for heat radiation is outside and the cooling is performed. The thermoelectric device is attached to the through hole so that the heat sink for the interior faces the inside of the refrigerator.

In FIG. 1, reference numeral 11 denotes an adiabatic wall which constitutes an adiabatic box of a storage, and inside a through hole (hole) 8 provided with a thermoelectric module 6 in a vacuum adiabatic material 7 at a penetrating portion provided in the adiabatic wall 11. The heat sink 10 for cooling and the heat sink 9 for heat dissipation are already joined and inserted.
Then, only the heat radiation heat sink 9 projects to the outside of the heat insulating wall 11, and the cooling heat sink 10 is the vacuum heat insulating material 7.
At the same time, the heat insulating wall 11 is inserted into the through hole.
Generally, the heat insulating wall 11 is made of a thin steel plate or a vacuum formed plastic member on the front and back surfaces, and is filled with a heat insulating material such as urethane foam.

When a predetermined current is applied (voltage is applied) to the thermoelectric module 6, the heat radiating surface 6a is heated and the heat absorbing surface 6b is cooled. In the inside of the refrigerator, when the heat absorbing surface 6b is cooled, the cooling heat sink 10 is almost directly cooled by the heat absorbing surface 6b, and the air flow inside the refrigerator heats the heat sink 10 for cooling.
Cooled by. Through this process, the air flow inside the refrigerator is efficiently cooled by the thermoelectric module 6.

On the outside of the refrigerator, when the heat radiating surface 6a is heated, the heat radiating heat sink 9 is directly heated by the heat radiating surface 6a, and the air flow outside the refrigerator is radiated by the heat sink 9.
Heated by. Through this process, the heat from the thermoelectric module 6 is efficiently exhausted to the air flow outside the refrigerator. Furthermore, since the periphery of the thermoelectric module 6 is held by the vacuum heat insulating material 7, heat transfer due to convection and heat conduction inside the thermoelectric module 6 is suppressed, and the efficiency of the thermoelectric module 6 is improved.

As described above, the thermoelectric device according to the first embodiment of the present invention has the heat absorbing surface 6b and the heat radiating surface 6a, and the current is applied (voltage is applied) to heat the heat radiating surface 6a. Thermoelectric module 6 to be cooled and vacuum heat insulating material 7
Is composed of at least a non-breathable outer covering material 7a and a core material 7b having a heat insulating property, the inside of the outer covering material 7a is kept in a reduced pressure state, and the vacuum heat insulating material 7 is provided with a through hole (hole) 8. , The thermoelectric module 6 is inserted into the through hole (hole) 8
By arranging the cooling surface 6b or the heat radiating surface 6a of the above in a direction perpendicular to the hole forming direction of the through hole (hole) 8, the vacuum heat insulating material 7 having excellent heat insulating performance is integrally formed around the thermoelectric module 6. Since it is configured, it is possible to reduce the wall thickness that was conventionally required to secure heat insulation around the thermoelectric device. In addition, it is possible to suppress heat leakage from the periphery of the thermoelectric module 6 in a compact area, and to suppress an increase in the thermal resistance of the block for adjusting the thickness or the like, which has been conventionally required, and the contact thermal resistance generated at the joint portion. The cooling efficiency of the thermoelectric device can be improved.

Further, the heat radiation surface 6a and the heat absorption surface 6b of the thermoelectric module 6 are directly or indirectly thermally joined to the heat radiation heat sink 9 or the cooling heat sink 10 to add a function of exchanging heat with the airflow to the thermoelectric device. At the same time, the periphery of the thermoelectric module 6 can be completely insulated with the vacuum heat insulating material 7 on the back surfaces of the heat sink 9 for heat dissipation and the heat sink 10 for cooling, and a thermoelectric device including the heat sink 9 for heat dissipation and the heat sink 10 for cooling can be provided. It is possible to make it compact, and to expand the internal volume of the cooling heat sink 10 without projecting it inside.

Further, both the heat sink 9 for heat radiation and the heat sink 10 for cooling can be attached to the heat insulating wall 11 in a state of being joined to the thermoelectric module 6, and the assembling process can be simplified by making it a unit as a thermoelectric device. It is lightweight because it uses a thermoelectric module. In addition, there is no restriction on the installation posture.

Further, in the first embodiment of the present invention, the heat radiation heat sink 9 is located outside the cabinet, and the cooling heat sink 1 is also provided.
The thermoelectric device is attached to the storage so that 0 faces the inside of the cabinet, but the heat sink 9 for heat dissipation is attached to the inside of the cabinet, and the thermosink 10 for cooling is attached to the outside of the cabinet so that the inside of the cabinet is heated. Can also be used as

Further, in the first embodiment of the present invention, the heat radiation heat sink 9 is placed outside the refrigerator, and the cooling heat sink 1 is used.
Although the thermoelectric device is attached to the storage so that 0 faces the inside of the refrigerator and the inside of the refrigerator is a refrigerator or a freezer, even if the thermoelectric device is attached as in the first embodiment of the present invention, the current supplied to the thermoelectric module 6 It can be used as a cold storage by using a current supply device whose direction can be switched.

In summary, the thermoelectric device of this embodiment has the thermoelectric module 6 in which the heat radiating surface 6a and the heat absorbing surface 6b face each other, and when a predetermined voltage is applied, the heat radiating surface 6a radiates heat and the heat absorbing surface 6b absorbs heat. A heat dissipating heat sink (heat dissipating side heat exchanging means) 9 that is joined to the heat dissipating surface 6a so that the joint surface larger than the heat dissipating surface 6a completely covers the heat dissipating surface 6a, and a joint surface larger than the heat absorbing surface 6b. Is joined to the heat absorbing surface 6b so as to completely cover the heat absorbing surface 6b and exchanges heat with the heat absorbing surface 6b (heat absorbing side heat exchange means) 10
And the outer peripheral surface of the thermoelectric module 6 (heat dissipation surface 6a and heat absorption surface 6
A vacuum provided so as to fill a space surrounded by the bonding surface of the heat sink for heat dissipation (heat exchange means on the heat dissipation side) 9 and the bonding surface of the heat sink for heat dissipation (heat exchange means on the heat absorption side) 10. A thermoelectric device is composed of the heat insulating material 7.

In the present embodiment, the outer peripheral surfaces (four surfaces) of the thermoelectric module 6 and a heat sink for heat dissipation (heat dissipation side heat exchange means).
9 joint surface and cooling heat sink (heat absorption side heat exchange means)
The vacuum heat insulating material 7 is provided so as to fill the space surrounded by the joint surface of 10. Since the vacuum heat insulating material 7 has a higher heat insulating performance than the foam heat insulating material, the heat insulating material can be thinner than the foam heat insulating material. , Heat sink for heat radiation (heat exchange means on the heat radiation side)
The gap between the heat sink 9 for cooling and the heat sink (heat exchange means for heat absorption) 10 can be narrowed, and the heat transfer surface (heat dissipation surface 6) of the thermoelectric module 6 can be directly applied without interposing a block which is a component for adjusting the thickness.
a and a heat absorbing surface 6b), a heat sink for heat radiation (heat radiation side heat exchange means) 9 and a heat sink for cooling (heat radiation side heat exchange means) 1
It is possible to join with 0, and the cooling efficiency of the thermoelectric device can be improved.

A heat sink for heat radiation (heat exchange means on the heat radiation side) 9 and a heat sink for cooling (heat exchange means on the heat absorption side) 1
Since the distance from 0 can be narrowed, the thermoelectric device can be made compact, and the outer peripheral surface of the thermoelectric module 6 and the joint surface of the heat dissipation heat sink (heat dissipation side heat exchange means) 9 and the cooling heat sink (heat absorption side heat exchange means) 10 can be made. Since the vacuum heat insulating material 7 is provided so as to fill the space surrounded by the joint surface, either the heat sink for heat radiation (heat radiation side heat exchange means) 9 or the heat sink for cooling (heat absorption side heat exchange means) 10 has a larger joint surface. The heat insulating wall (heat insulating box) 11 having a through hole formed in accordance with the size of the thermoelectric device excluding the heat exchanging means is inserted into and fitted into the through hole, so that the thermoelectric device can be easily operated in one operation. Can be attached (assembled) to a storage or the like, and therefore, the thermoelectric device can be unitized.

In this embodiment, the cooling heat sink 10 (heat radiation side heat exchange means 9 and heat absorption side heat exchange means 10) is used.
Since the thermoelectric module 6 is arranged at the center of the joint surface (the smaller one of the two), the vacuum heat insulating material 7 surrounds all the outer peripheral surfaces (four surfaces) of the thermoelectric module 6, but the thermoelectric module 6 Cooling heat sink (heat absorption side heat exchange means) 1
When arranging in accordance with one side of the bonding surface of 0 except the corners, the vacuum heat insulating material 7 covers the three outer peripheral surfaces of the thermoelectric module 6. Further, when the thermoelectric module 6 is arranged in accordance with the corner portion of the joint surface of the cooling heat sink (heat absorption side heat exchange means) 10, the vacuum heat insulating material 7 covers the two outer peripheral surfaces of the thermoelectric module 6. Also, one side of the thermoelectric module 6 has the same length as one side of the joint surface of the cooling heat sink (heat absorption side heat exchange means) 10, and the thermoelectric module 6 has one side of the joint surface of the cooling heat sink (heat absorption side heat exchange means) 10. , The vacuum heat insulating material 7 is located next to the thermoelectric module 6 and covers one surface of the outer peripheral surface of the thermoelectric module 6.

In addition, the thermoelectric module 6 is used in this embodiment.
Both the heat radiation side heat exchange means and the heat absorption side heat exchange means that are joined to the heat transfer surface (heat radiation surface 6a and heat absorption surface 6b) of the above are provided with a plurality of fins 9a and 10a for heat exchange with air on the opposite joint surface side. The heat sink is equipped with the thermoelectric module 6
When a predetermined voltage is applied (a predetermined current is applied) to the air, the air around the fins 9a of the heat sink 9 for heat dissipation and the heat dissipation surface 6a of the thermoelectric module 6 are passed through the heat sink 9 for heat dissipation.
And heat exchange with each other, and the heat generated on the heat radiation surface 6a of the thermoelectric module 6 is radiated to the air around the fin 9a of the heat sink 9 for heat radiation. In addition, heat is exchanged between the air around the fins 10a of the cooling heat sink 10 and the heat absorbing surface 6b of the thermoelectric module 6 via the cooling heat sink 10, so that the heat of the air around the fins 10a of the cooling heat sink 10 becomes thermoelectric. The heat is conducted to the heat absorption surface 6b of the module 6, whereby the air around the fins 10a of the cooling heat sink 10 is cooled.

When the thermoelectric device is attached to the storage so that the heat sink 9 for heat dissipation faces the outside and the heat sink 10 for cooling faces the inside, the heat sink 10 for cooling, the thermoelectric module 6, and the heat sink 9 for heat dissipation.
The heat of the air inside the cabinet is radiated to the air outside the cabinet via
As a result, the inside of the refrigerator is cooled. In other words, the temperature of the air inside the refrigerator is lower than the temperature of the air outside the refrigerator by a predetermined temperature (a temperature close to the temperature difference between the heat radiating surface 6a and the heat absorbing surface 6b of the thermoelectric module 6).

In addition, the thermoelectric module 6 is used in this embodiment.
The plate-shaped vacuum heat insulating material 7 having substantially the same thickness as the above and having the hole 8 capable of accommodating the thermoelectric module 6 according to the size of the thermoelectric module 6 is used for the thermoelectric device.

A vacuum heat insulating material filling a space surrounded by the outer peripheral surface of the thermoelectric module 6, the joint surface of the heat sink for heat dissipation (heat exchange means on the heat dissipation side) 9 and the joint surface of the heat sink for cooling (heat exchange means on the heat absorption side) 10. By using one plate-shaped vacuum heat insulating material having holes 8 as 7, a higher heat insulating performance can be obtained than when a plurality of plate-shaped vacuum heat insulating materials are combined to surround the thermoelectric module 6. The cooling efficiency can be increased.

Further, by using one plate-shaped vacuum heat insulating material 7 having the holes 8, as compared with the case where a plurality of plate-shaped vacuum heat insulating materials are combined to surround the thermoelectric module 6,
The thermoelectric device is easy to assemble.

The thermoelectric module 6 is provided with the vacuum heat insulating material 7.
When covering three or two outer peripheral surfaces, one plate-shaped vacuum heat insulating material 7 having a notch is used.

Further, in the present embodiment, the external dimensions of the vacuum heat insulating material 7 excluding the thickness dimension are selected from among the heat radiation heat sink (heat radiation side heat exchange means) 9 and the cooling heat sink (heat absorption side heat exchange means) 10. The size of the joint surface of the cooling heat sink (heat absorption side heat exchange means) 10 having the smaller joint surface is substantially the same.

Heat sink for heat dissipation (heat dissipation side heat exchange means)
9 and the cooling heat sink (heat absorption side heat exchange means) 10, which has a smaller joint surface, has a through hole having substantially the same size as the joint surface of the cooling heat sink (heat absorption side heat exchange means) 10 ( By inserting and fitting the heat insulating box 11 into the through hole, the thermoelectric device can be easily attached (assembled) to a storage or the like in one operation, and the size of the through hole in the through direction of the hole can be increased. Since it does not change, it is easy to form a through hole, and since the vacuum heat insulating material 7 cannot be seen from the outside after the thermoelectric device is attached (installed) to the through hole of the heat insulating wall (heat insulating box body) 11, the vacuum heat insulating material 7 is damaged. Vacuum insulation 7
The long-term reliability of can be secured.

Further, the storage according to the present embodiment is provided with a heat insulating box having a through hole formed in accordance with the size of the thermoelectric device and a thermoelectric device inserted and fitted into the through hole. The assembly (manufacturing) and the disassembly (maintenance) are easy, the cooling efficiency is high, the energy is saved, and the thermoelectric device is small and lightweight, so that the weight of the storage can be reduced.

Further, in the present embodiment, the joint surface of the heat radiation heat sink (heat radiation side heat exchange means) 9 which is the heat exchange means on the outside of the refrigerator is such that the heat sink for cooling (heat absorption side heat) which is the heat exchange means on the inside of the refrigerator. Exchange means) 10 is larger than the joint surface,
Since the thermoelectric device is attached from the outside (outside of the cabinet) of the heat insulating box, the amount of protrusion of the cooling heat sink (heat absorption side heat exchange means) 10 that is the heat exchange means inside the cabinet can be reduced, and the amount of protrusion can be reduced. The effective space in the refrigerator can be expanded by the amount that has decreased.

On the contrary, if the joint surface of the cooling heat sink (heat absorbing side heat exchanging means) 10 which is the heat exchanging means inside the cabinet is the heat radiating heat sink (radiating side heat exchanging means) 9 that is the heat exchanging means outside the cabinet. When the thermoelectric device is attached from the inside of the heat-insulating box (the inside of the cabinet), which is larger than the joint surface, the outside of the cabinet of the heat sink for heat radiation (heat exchange means on the radiating side) 9 that is the heat exchange means on the outside of the cabinet (radiation chamber or The amount of protrusion to the heat radiation space) can be reduced, and the outer dimension (usually the depth dimension) of the storage can be reduced by the amount of protrusion.

(Second Embodiment) Hereinafter, a thermoelectric device according to a second embodiment of the present invention will be described with reference to FIG. 2. The same components as those of the first embodiment are designated by the same reference numerals and their details will be described. Detailed description is omitted.

FIG. 2 is a vertical sectional view of a thermoelectric device according to the second embodiment of the present invention.

In the thermoelectric device of the first embodiment, the thermoelectric module 6 is accommodated in the through hole (hole) 8 provided in the vacuum heat insulating material 7, but in the second embodiment, as shown in FIG. In addition, the thermoelectric module 6 has a through hole (hole) 8 for the vacuum heat insulating material 7.
A plurality of them are arranged in a plane direction perpendicular to the hole forming direction.

In the thermoelectric device according to the second embodiment, the thermoelectric module 6 is provided with a heat sink for heat radiation (heat radiation side heat exchange means).
9 or cooling heat sink (heat exchange means on the heat absorption side) 10
The thermoelectric module is composed of a plurality of thermoelectric modules alone 6 arranged in parallel to the joint surface of the above.

In this embodiment, the contact area between the heat sink for heat dissipation (heat exchanging side heat exchanging means) 9 or the cooling heat sink (heat absorbing side heat exchanging means) 10 and the thermoelectric module 6 is increased, so that the heat sink for heat dissipation (heat dissipation side) The heat exchange amount between the thermoelectric module 6 and the side heat exchange means 9) or the cooling heat sink (heat absorption side heat exchange means) 10 is increased, and the cooling capacity of the thermoelectric device can be enhanced. Further, by arranging the plurality of thermoelectric module units 6 in parallel with the joint surface of the heat sink for heat dissipation (heat dissipation side heat exchange means) 9 or the cooling heat sink (heat absorption side heat exchange means) 10, heat radiation from the outer peripheral surface of the thermoelectric module 6 is performed. The space enclosed by the joint surface of the heat sink (heat radiation side heat exchange means) 9 and the joint surface of the cooling heat sink (heat absorption side heat exchange means) 10 becomes small, and the vacuum heat insulating material 7 provided to fill the space is provided. The amount of can be reduced.

(Third Embodiment) Hereinafter, a thermoelectric device according to a third embodiment of the present invention will be described with reference to FIG. 3. The same components as those of the first embodiment are designated by the same reference numerals and their details will be described. Detailed description is omitted.

FIG. 3 is a vertical sectional view of a thermoelectric device according to a third embodiment of the present invention.

In the thermoelectric device of the first embodiment, the thermoelectric module 6 housed in the through hole (hole) 8 provided in the vacuum heat insulating material 7 has one stage, but in the third embodiment, as shown in FIG. In addition, the thermoelectric module 6 has a through hole (hole) 8 for the vacuum heat insulating material 7.
A plurality of layers are stacked in the hole forming direction.

As a result, the through hole (hole) of the vacuum heat insulating material 7 is formed.
By increasing the temperature difference between the heat radiating surface 6a and the heat absorbing surface 6b at both ends of the hole forming direction of 8, the temperature of the cooling heat sink 10 can be further lowered, and the cooling temperature of the air flow inside the refrigerator can be further lowered.

In the thermoelectric device according to the third embodiment, the thermoelectric module 6 is provided with a heat sink for heat radiation (heat radiation side heat exchange means).
9 or cooling heat sink (heat exchange means on the heat absorption side) 10
Is composed of a plurality (two) of thermoelectric module units 6 that are vertically stacked on the joint surface of, and the cooling temperature is increased by increasing the temperature difference between the heat dissipation surfaces at both ends of the stacked (superposed) thermoelectric modules 6. Can be lowered.

Further, when the thickness of the vacuum heat insulating material 7 is adjusted to the thickness of the thermoelectric module 6, when the vacuum heat insulating material 7 having a thickness suitable for one thermoelectric module (single unit) 6 cannot provide sufficient heat insulating performance. Even if there is a plurality of thermoelectric module single bodies 6 and the thermoelectric module 6 is thickened, the thickness of the vacuum heat insulating material 7 can be increased, so that the heat insulating performance of the vacuum heat insulating material 7 is improved and the heat sink for heat radiation (heat radiation side heat exchange). Means) 9 and cooling heat sink (heat absorption side heat exchange means) 10
The amount of transfer of heat between and can be reduced, and the cooling efficiency of the thermoelectric device can be improved.

(Fourth Embodiment) Hereinafter, a thermoelectric device according to a fourth embodiment of the present invention will be described with reference to FIG. 4. The same components as those in the first embodiment are designated by the same reference numerals and their details will be described. Detailed description is omitted.

FIG. 4 is a vertical sectional view of a thermoelectric device according to the fourth embodiment of the present invention.

In the thermoelectric device of the first embodiment, the heat sink 9 for heat dissipation is joined to the heat dissipation surface 6a of the thermoelectric module 6, but in the fourth embodiment, as shown in FIG. Pipe 1 forming a fluid flow path in 6a
Two are joined.

As a result, a function of exchanging heat with the liquid can be added to the thermoelectric device, and heat transfer between the thermoelectric device and a remote place can be enabled.

In the thermoelectric device according to the fourth embodiment, of the heat radiation side heat exchange means and the heat radiation side heat exchange means, the heat radiation side heat exchange means is a pipe (a heat exchanger through which a liquid flows) which constitutes a fluid flow path. The configuration other than the pipe (heat radiation side heat exchange means) 12 is the same as that of the thermoelectric device of the first embodiment.

(Embodiment 5) Hereinafter, a thermoelectric device according to Embodiment 5 of the present invention will be described with reference to FIG. 5. The same components as those in Embodiment 1 are designated by the same reference numerals and their details will be described. Detailed description is omitted.

FIG. 5 is a vertical sectional view of a thermoelectric device according to the fifth embodiment of the present invention.

In the thermoelectric device of the first embodiment, the heat sink 9 for heat dissipation is joined to the heat dissipation surface 6a of the thermoelectric module 6, but in the fifth embodiment, as shown in FIG. The heat pipe 13 is joined to 6a.

This enables the thermoelectric device to transfer heat to and away from the thermoelectric device.

In the thermoelectric device according to the fifth embodiment, the heat radiating side heat exchanging means among the heat radiating side heat exchanging means and the heat absorbing side heat exchanging means is the heat pipe 13. ) Configurations other than 13 are the same as in the first embodiment.
Same as the thermoelectric device.

(Sixth Embodiment) Hereinafter, a thermoelectric device according to a sixth embodiment of the present invention will be described with reference to FIG. 6. The same components as those of the first embodiment are designated by the same reference numerals and their details will be described. Detailed description is omitted.

FIG. 6 is a vertical sectional view of a thermoelectric device according to a sixth embodiment of the present invention.

In the thermoelectric device according to the sixth embodiment, the vacuum heat insulating material 7 is in the form of a plate having a hole 8 which is thicker than the thermoelectric module 6 and can accommodate the thermoelectric module 6 according to the size of the thermoelectric module 6. Of the heat sinks for heat dissipation (heat dissipation side heat exchange means) 9 and the heat sinks for cooling (heat absorption side heat exchange means) 10, the heat sinks for cooling (heat absorption side heat exchange means) 10 engage with the holes 8 on the joint surface and vacuum heat insulation is performed. It has a protrusion 10b for compensating for the insufficient thickness of the thermoelectric module 6 with respect to the material 7.

In the thermoelectric device according to the sixth embodiment, by using the single plate-shaped vacuum heat insulating material 7 having the holes 8, high heat insulating performance can be obtained, and the cooling efficiency of the thermoelectric device can be improved. Assembling the thermoelectric device is easy. Further, even if the thickness of the vacuum heat insulating material 7 is made thicker in order to ensure the heat insulating performance,
The heat sink (heat radiation side heat exchange means) 9 and the cooling heat sink (heat absorption side heat exchange means) 10 of the heat radiation heat sink (heat radiation side heat exchange means) 9 have holes 8 at the joint surface.
By providing a protrusion 10b that engages with the vacuum heat insulating material 7 to compensate for the insufficient thickness of the thermoelectric module 6, the heat transfer surface (heat dissipation surface 6a) of the thermoelectric module 6 can be directly inserted without interposing a block that is a component for adjusting the thickness. The heat sink (radiation side heat exchange means) 9 and the cooling heat sink (heat absorption side heat exchange means) 10 can be joined to the heat absorption surface 6b), and the cooling efficiency of the thermoelectric device can be improved.

It should be noted that instead of providing the projection 10b that engages with the hole 8 and compensates for the insufficient thickness of the thermoelectric module 6 with respect to the vacuum heat insulating material 7 on the joint surface of the cooling heat sink (heat absorption side heat exchange means) 10, the cooling heat sink is used. When a block, which is a component for adjusting the thickness, is joined to the joint surface of the (heat absorption side heat exchange means) 10, the cooling heat sink (heat absorption side heat exchange means) 10 is directly joined to the heat absorption surface 6b of the thermoelectric module 6. However, the cooling performance is somewhat deteriorated, but the cooling performance is less deteriorated because the thickness of the block is smaller than that when the vacuum heat insulating material 7 is not used, and the manufacturing cost is lower than when the protrusion 10b is provided. Can be reduced.

Cooling heatsink (heat absorption side heat exchange means)
When a block, which is a component for adjusting the thickness, is joined to the joint surface of 10, a heat sink for cooling (heat absorption side heat exchange means)
A heat sink for cooling (heat absorption side heat exchange means) 10 so that heat can be sufficiently transferred at the joint surface between 10 and the block.
It is preferable that the block and the block are firmly bonded in advance.

(Embodiment 7) Hereinafter, a thermoelectric device according to Embodiment 7 of the present invention will be described with reference to FIG. 7. The same components as those in Embodiment 1 are designated by the same reference numerals and their details will be described. Detailed description is omitted.

FIG. 7 is a vertical sectional view of a thermoelectric device according to the seventh embodiment of the present invention.

In the storage according to the first embodiment, the heat insulating wall 11 forming the heat insulating box is made of a foamed heat insulating material such as urethane foam, but in the seventh embodiment, as shown in FIG.
The vacuum heat insulating material 7 having the through hole (hole) 8 used for the thermoelectric device constitutes a part of the heat insulating wall 11 forming the heat insulating box.

In the thermoelectric device according to the seventh embodiment, the vacuum heat insulating material 7 is a heat sink for heat radiation (heat radiation side heat exchange means) 9
The heat insulating wall is wider than the joint surface of both the heat sink (cooling side) and the heat sink for cooling (heat absorption side heat exchange means) 10 and constitutes at least a part of the heat insulating wall of the heat insulating box. By attaching at least a part of the heat insulating wall to an incomplete heat insulating box before the thermoelectric device is attached, the heat insulating box can be completed and the thermoelectric device can be attached to the heat insulating box at the same time. At this time, if the surface of the vacuum heat insulating material 7 is reinforced in advance, the vacuum heat insulating material 7 can be used as it is as a heat insulating wall of at least a part of the heat insulating box. When at least a part of the heat insulating wall of the heat insulating box is formed of the vacuum heat insulating material 7, the vacuum heat insulating material 7 has a higher heat insulating performance than the foam heat insulating material, and therefore, the thickness of the heat insulating wall can be made thinner than the foam heat insulating material. The inside of the storage can be widened or the external dimensions of the storage can be reduced by the amount of thinning the heat insulating wall.

[0095]

As described above, the invention according to claim 1 is surrounded by at least one outer peripheral surface of the thermoelectric module, the joint surface of the heat radiation side heat exchange means, and the joint surface of the heat absorption side heat exchange means. Since the vacuum heat insulating material is provided so as to fill the space provided, the gap between the heat radiation side heat exchange means and the heat absorption side heat exchange means can be narrowed, and the thermoelectric module can be directly connected without interposing a block which is a component for thickness adjustment. It is possible to join the heat radiation side heat exchange means and the heat absorption side heat exchange means to the heat transfer surface (heat radiation surface and heat absorption surface) of, and the cooling efficiency of the thermoelectric device can be improved.

Further, the thermoelectric device can be made compact, and by inserting and fitting the heat insulating wall (heat insulating box) in which the through hole is formed according to the size of the thermoelectric device into the through hole, one operation can be performed. The thermoelectric device can be easily attached (assembled) to a storage or the like, and therefore, the thermoelectric device can be unitized.

According to a second aspect of the present invention, the thermoelectric module according to the first aspect is a plurality of thermoelectric modules alone arranged in parallel to the joint surface of the heat radiation side heat exchange means or the heat absorption side heat exchange means. Since it is configured, the cooling capacity of the thermoelectric device can be increased, and the amount of vacuum heat insulating material provided to fill the space can be reduced.

According to a third aspect of the invention, the thermoelectric module according to the first aspect of the invention is composed of a plurality of thermoelectric modules that are vertically stacked on the joint surface of the heat radiation side heat exchange means or the heat absorption side heat exchange means. Therefore, the cooling temperature can be lowered by increasing the temperature difference between the heat radiation surfaces at both ends of the stacked (overlapping) thermoelectric modules.

Further, when the thickness of the vacuum heat insulating material is adjusted to the thickness of the thermoelectric module, the thickness of the vacuum heat insulating material can be increased, so that the heat insulating performance of the vacuum heat insulating material is improved and the heat radiating side heat exchanging means and the heat absorbing side heat exchanging means. The amount of heat transferred to and from the means is reduced, and the cooling efficiency of the thermoelectric device can be improved.

According to the invention described in claim 4,
5. One or both of the heat radiation side heat exchange means and the heat absorption side heat exchange means in the invention described in any one of 1 to 3 are heat sinks provided with a plurality of fins for heat exchange with air on the side opposite to the joint surface. You can

According to the invention of claim 5, claim 1
At least one of the heat radiation side heat exchange means and the heat absorption side heat exchange means in the invention described in any one of 1 to 3 can be a heat exchanger through which a liquid flows.

Further, according to the invention of claim 6,
At least one of the heat radiation side heat exchange means and the heat absorption side heat exchange means in the invention described in any one of 1 to 3 can be a heat pipe.

Further, according to the invention of claim 7, as a vacuum heat insulating material filling a space surrounded by the outer peripheral surface of the thermoelectric module, the joint surface of the heat radiation side heat exchange means and the joint surface of the heat absorption side heat exchange means Alternatively, by using one plate-shaped vacuum heat insulating material having a notch, a high heat insulating performance can be obtained, the cooling efficiency of the thermoelectric device can be improved, and the thermoelectric device can be easily assembled.

Further, in the invention described in claim 8,
In addition to the effects of the invention described, even if the thickness of the vacuum heat insulating material is made thicker in order to secure the heat insulating performance, the joining surface of at least one of the heat radiation side heat exchange means and the heat absorption side heat exchange means By providing a protrusion that engages with the hole or notch of the vacuum heat insulating material and compensates for the lack of thickness of the thermoelectric module with respect to the vacuum heat insulating material, it is possible to directly transfer the thermoelectric module without interposing a block that is a component for thickness adjustment. The heat radiating side heat exchanging means and the heat absorbing side heat exchanging means can be joined to the heat surface (heat radiating surface and heat absorbing surface), and the cooling efficiency of the thermoelectric device can be improved.

Further, in the invention according to claim 9, the heat insulating wall (heat insulating wall) in which the through hole having substantially the same size as the size of the joint surface of the heat radiating side heat exchanging means or the heat absorbing side heat exchanging means, whichever is smaller, is formed. By inserting and fitting the box into the through hole, the thermoelectric device can be easily attached (assembled) to the storage etc. in one operation, the through hole can be easily formed, and the vacuum heat insulating material can be protected from damage. Can protect and ensure long-term reliability of vacuum insulation.

The invention according to claim 10 is the same as claim 1
10. A heat insulating box having a through hole formed in accordance with the size of the thermoelectric device according to any one of items 1 to 9, and the thermoelectric device inserted and fitted into the through hole. It is easy to assemble (manufacture) and disassemble (maintenance), has high cooling efficiency, saves energy, and the thermoelectric device is small and lightweight, so that the weight of the storage can be reduced. In addition, the effective space in the refrigerator can be expanded or the external dimensions of the storage can be shortened, and the volumetric efficiency can be improved.

According to the eleventh aspect of the present invention, the vacuum heat insulating material of the thermoelectric device is attached to the uncompleted heat insulating box body before attaching the thermoelectric device as a heat insulating wall of at least a part of the heat insulating box body. At the same time when the heat insulating box is completed, the thermoelectric device can be attached to the heat insulating box. Moreover, the interior of the storage can be widened or the external dimensions of the storage can be reduced by the amount corresponding to the reduction in the thickness of the heat insulating wall, thereby improving the volumetric efficiency.

[Brief description of drawings]

FIG. 1 is a vertical cross-sectional view showing a state in which a thermoelectric device according to Embodiment 1 of the present invention is attached to a heat insulating wall.

FIG. 2 is a vertical sectional view of a thermoelectric device according to a second embodiment of the present invention.

FIG. 3 is a vertical sectional view of a thermoelectric device according to a third embodiment of the present invention.

FIG. 4 is a vertical sectional view of a thermoelectric device according to a fourth embodiment of the present invention.

FIG. 5 is a vertical sectional view of a thermoelectric device according to a fifth embodiment of the present invention.

FIG. 6 is a vertical sectional view of a thermoelectric device according to a sixth embodiment of the present invention.

FIG. 7 is a vertical sectional view of a thermoelectric device according to a seventh embodiment of the present invention.

FIG. 8 is a vertical sectional view of a conventional thermoelectric device.

[Explanation of symbols]

6 thermoelectric module 6a Heat dissipation surface 6b Endothermic surface 7 vacuum insulation 8 through holes 9 Heat sink for heat dissipation 9a fin 10 Cooling heat sink 10a fin 10b protrusion 11 heat insulation wall 12 pipes 13 heat pipe

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Hideo Nishihata             2-3-3 Nojihigashi, Kusatsu City, Shiga Prefecture             Within Matsushita Cold Machinery Co., Ltd. (72) Inventor Hikaru Taniguchi ▲ Nori ▼             2-3-3 Nojihigashi, Kusatsu City, Shiga Prefecture             Within Matsushita Cold Machinery Co., Ltd. (72) Inventor Noriyuki Miyaji             2-3-3 Nojihigashi, Kusatsu City, Shiga Prefecture             Within Matsushita Cold Machinery Co., Ltd. F-term (reference) 3L045 AA06 BA01 CA02 DA04 PA04

Claims (11)

[Claims] 1. A thermoelectric module in which a heat dissipation surface and a heat absorption surface are opposed to each other and a predetermined voltage is applied, heat is dissipated from the heat dissipation surface and is absorbed from the heat absorption surface, and a joint surface larger than the heat dissipation surface completely covers the heat dissipation surface. A heat radiation side heat exchange means joined to the heat radiation surface and exchanging heat with the heat radiation surface; and a joint surface larger than the heat absorption surface joined to the heat absorption surface so as to completely cover the heat absorption surface and heat exchange with the heat absorption surface. A heat absorption side heat exchange means, and a space surrounded by at least one surface of the outer peripheral surface of the thermoelectric module, the joint surface of the heat radiation side heat exchange means, and the joint surface of the heat absorption side heat exchange means. A thermoelectric device comprising a vacuum heat insulating material provided in the. 2. The thermoelectric device according to claim 1, wherein the thermoelectric module is composed of a plurality of thermoelectric modules alone arranged in parallel to the joint surface of the heat radiation side heat exchange means or the heat absorption side heat exchange means. 3. The thermoelectric device according to claim 1, wherein the thermoelectric module is composed of a plurality of thermoelectric modules that are vertically stacked on the joint surface of the heat radiation side heat exchange means or the heat absorption side heat exchange means. 4. One of or both of the heat radiating side heat exchanging means and the heat absorbing side heat exchanging means is a heat sink having a plurality of fins for heat exchange with air on the side opposite to the joint surface. The thermoelectric device according to claim 1. 5. The thermoelectric device according to claim 1, wherein at least one of the heat radiation side heat exchange means and the heat absorption side heat exchange means is a heat exchanger through which a liquid flows. 6. A heat pipe according to claim 1, wherein at least one of the heat radiation side heat exchange means and the heat absorption side heat exchange means is a heat pipe.
The thermoelectric device according to claim 1. 7. The vacuum heat insulating material has a thickness substantially the same as that of the thermoelectric module, and has a plate shape having a hole or a cutout that can accommodate the thermoelectric module according to the size of the thermoelectric module. 7. The thermoelectric device according to claim 6. 8. The vacuum heat insulating material is thicker than the thermoelectric module and has a plate shape having a hole or a cutout that can accommodate the thermoelectric module according to the size of the thermoelectric module. The thermoelectric device according to any one of claims 1 to 6, wherein at least one of the heat absorption side heat exchange means has a protrusion on a joint surface that engages with the hole and compensates for the insufficient thickness of the thermoelectric module with respect to the vacuum heat insulating material. 9. The vacuum heat insulating material, except for the thickness, has an outer dimension which is substantially the same as a dimension of a joint surface of either the heat radiation side heat exchange means or the heat absorption side heat exchange means, whichever has the smaller joint surface.
9. The thermoelectric device according to claim 8. 10. An adiabatic box body having a through hole formed in accordance with the size of the thermoelectric device according to claim 1, and the thermoelectric device inserted and fitted into the through hole. Storage with equipment. 11. The vacuum heat insulating material for a thermoelectric device according to claim 7, wherein the vacuum heat insulating material is wider than the joint surface of both the heat radiating side heat exchanging means and the heat absorbing side heat exchanging means, and at least a part of the heat insulating wall of the heat insulating box is provided. The constituent storage.