JP2003318449A - Led light source and its fabricating method - Google Patents
Led light source and its fabricating methodInfo
- Publication number
- JP2003318449A JP2003318449A JP2003141765A JP2003141765A JP2003318449A JP 2003318449 A JP2003318449 A JP 2003318449A JP 2003141765 A JP2003141765 A JP 2003141765A JP 2003141765 A JP2003141765 A JP 2003141765A JP 2003318449 A JP2003318449 A JP 2003318449A
- Authority
- JP
- Japan
- Prior art keywords
- led
- pad
- resin
- substrate
- light source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
Description
【発明の属する技術分野】本発明は、基板上面に配置し
たＬＥＤチップを透光性樹脂によってモ−ルドしたＬＥ
Ｄ光源、及びその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LE in which an LED chip arranged on the upper surface of a substrate is molded with a transparent resin.
The present invention relates to a D light source and a manufacturing method thereof.
【従来の技術】光源の小型化要求に伴って、既製の樹脂
モールドＬＥＤランプに代わり、基板に直接ＬＥＤチッ
プを配置してそれを透光性樹脂によってモ−ルドしたＬ
ＥＤ光源が提案され、実用化されている。この種のＬＥ
Ｄ光源においては、ＬＥＤチップを樹脂モ−ルドするた
め、流動状態の樹脂を基板に直接所定量滴下させ、この
流動状態の樹脂を硬化させる手法が用いられている。と
ころが、基板上面は前記樹脂となじみが良いので、滴下
された流動状態の樹脂が基板表面に沿って広がりやす
く、樹脂形状を一様にできない、樹脂の厚みを厚くでき
ないなどの問題があった。このような点を考慮し、本願
出願人は、ＬＥＤ用パッドの全周を囲む溝を形成し、こ
の溝との境界部分における表面張力によって樹脂の流れ
を規制する手法（特許文献１）を開発し、ある程度の改
善を行うことができた。しかしながら、光学特性の向上
とワイヤボンド線の安定的な埋没を図るために、樹脂の
高さを更に高めるべく滴下する樹脂量を多くしたとこ
ろ、パッドと溝の境界部分の表面張力を越える力が作用
し、樹脂の流れ出しが発生する個所が現れた。そして、
樹脂の流れ出しが生じた個所においては、逆に樹脂の高
さが低くなり、光学特性の不均一化、ワイヤボンド線の
露出の要因になることが分かった。2. Description of the Related Art With the demand for miniaturization of light sources, an LED chip is directly arranged on a substrate instead of a ready-made resin-molded LED lamp, and the LED chip is molded with a transparent resin.
An ED light source has been proposed and put into practical use. LE of this kind
In the D light source, in order to resin mold the LED chip, a method is used in which a fluid resin is dropped directly onto the substrate by a predetermined amount and the fluid resin is cured. However, since the upper surface of the substrate is well compatible with the resin, there is a problem that the dropped resin in a fluidized state is likely to spread along the substrate surface, the resin shape cannot be made uniform, and the resin cannot be thickened. In consideration of such a point, the applicant of the present application has developed a method (Patent Document 1) of forming a groove surrounding the entire circumference of the LED pad and controlling the resin flow by the surface tension at the boundary with the groove. However, I was able to make some improvements. However, in order to improve the optical characteristics and to bury the wire bond wire stably, when the amount of dropped resin was increased to further increase the height of the resin, a force exceeding the surface tension at the boundary between the pad and the groove was found. A portion where the resin acted and the resin flowed out appeared. And
On the contrary, it was found that at the place where the resin flows out, the height of the resin becomes low, which causes non-uniformity of optical characteristics and exposure of wire bond lines.
【特許文献１】特願平７−１５１８２３号（特開平９−
６２５９号公報）[Patent Document 1] Japanese Patent Application No. 7-151823
(6259 publication)
【発明が解決しようとする課題】そこで本発明は、上記
の点を考慮し、光学特性の均一化、ワイヤボンド線の露
出防止を図ったＬＥＤ光源を提供することを主な課題と
する。SUMMARY OF THE INVENTION In view of the above points, the present invention has as its main object to provide an LED light source in which the optical characteristics are made uniform and the wire bond lines are prevented from being exposed.
【課題を解決するための手段】本発明のＬＥＤ光源は、
基板上面にＬＥＤチップを配置し、このＬＥＤチップを
透光性樹脂によってモ−ルドしたＬＥＤ光源において、
前記基板上面に前記透光性樹脂の外周縁に沿って撥油性
被膜を一定の幅で環状に設けたことを特徴とする。本発
明のＬＥＤ光源は、チップ配置用及びワイヤボンド用パ
ッドからなるＬＥＤ用パッドを基材上面に形成した基板
と、前記チップ配置用パッドに配置されて前記ワイヤボ
ンド用パッドにワイヤボンド線を介して接続されるＬＥ
Ｄチップと、前記ＬＥＤチップをモ−ルドする透光性樹
脂を備えるＬＥＤ光源において、前記ＬＥＤ用パッドを
囲むように前記基板上面に環状の凹部を設け、この凹部
内に撥油性被膜を設けたことを特徴とする。本発明のＬ
ＥＤ光源の製造方法は、チップ配置用及びワイヤボンド
用パッドからなるＬＥＤ用パッドを基材上面に形成した
基板を準備する工程と、該基板に前記ＬＥＤ用パッドを
囲むように撥油性被膜をメッシュ版あるいはメタル版を
用いて設ける工程と、前記被膜が形成された前記基板の
前記チップ配置用パッドにＬＥＤチップを固定して前記
ワイヤボンド用パッドにワイヤボンド線を接続する工程
と、前記撥油性被膜によって規定される領域内に前記Ｌ
ＥＤチップを埋めるように流動状態の樹脂を配置し、該
樹脂を硬化させる工程を備えることを特徴とする。The LED light source of the present invention comprises:
In the LED light source in which the LED chip is arranged on the upper surface of the substrate and the LED chip is molded by the translucent resin,
An oil-repellent coating is annularly provided on the upper surface of the substrate along the outer peripheral edge of the translucent resin with a constant width. The LED light source of the present invention includes a substrate on which LED pads, which are pads for chip arrangement and pads for wire bonding, are formed on the upper surface of a base material, and a wire bond wire that is arranged on the pad for chip arrangement and through the wire bond pad. LE connected by
In an LED light source including a D chip and a translucent resin that molds the LED chip, an annular recess is provided on the upper surface of the substrate so as to surround the LED pad, and an oil repellent coating film is provided in the recess. It is characterized by L of the present invention
The method of manufacturing an ED light source includes a step of preparing a substrate having LED pads, which are pads for arranging chips and pads for wire bonding, formed on an upper surface of a base material, and an oil-repellent coating is meshed on the substrate to surround the LED pads. Providing using a plate or a metal plate, fixing an LED chip to the chip arranging pad of the substrate on which the film is formed and connecting a wire bond wire to the wire bond pad, and the oil repellency Within the area defined by the coating, the L
The method is characterized by including a step of disposing a fluid resin so as to fill the ED chip and curing the resin.
【発明の実施の形態】以下本発明の実施例を図１に示す
線状のＬＥＤ光源１に適用した場合を例にとって説明す
る。このＬＥＤ光源１は、基板２の上面に複数のＬＥＤ
発光部３を直線的に配置して構成している。まず基板２
の構造、並びにその製造手順について図２〜図４を参照
して説明する。基板２は、ガラスエポキシ等の長尺基材
２１の表面に銅箔が形成されたものが用意され、それを
エッチング処理することにより、複数のＬＥＤ用パッド
２２とこれらを接続する配線パターン２３を導電パター
ンとして備えて構成される。各ＬＥＤ用パッド２２は、
それぞれが半円形状を成すチップ配置用のパッド２２ａ
とワイヤボンド用のパッド２２ｂを備え、全体が円ない
し楕円形状を成している。このＬＥＤ用パッド２２の周
囲を凹部２４が環状に囲むように、ＬＥＤ用パッド２２
とその周囲に位置する配線パターン２３の間には、基材
２１が露出する所定幅の間隔が設けられている。次に、
上記の基板２は、その表面の光反射性を高めるために、
図３に示すように、チップ配置用のパッド２２ａとワイ
ヤボンド用のパッド２２ｂの必要部分、その他の回路素
子配置に必要な部分のみを露出させ、残りの大部分を絶
縁性を有する白色系のレジスト膜２５によって被覆する
処理が施される。このレジスト膜２５によって被覆され
ない導電パターン部分は、必要に応じてメッキ処理を施
すことが望ましい。このように基板２を準備し、次にこ
の基板２の表面にＬＥＤ用パッド２２を囲むように撥油
性被膜２６を形成する。撥油性被膜２６は、撥油剤の撥
油性を粒状に滴下されたｎ−ヘキサデカンの接触角度で
表す（撥水剤の撥水性を水滴の接触角度で表すのと同
様）場合に、その接触角度がより大きい、すなわち撥油
性の高い材料が選択して用いられる。尚、前記白色系の
レジスト膜２５や、導電パターンの撥油性を前記接触角
度で表すと、材料にもよるが概ね１０度以下であり撥油
性は低い。この例では、撥油性被膜２６として前記接触
角度が３０度以上であるシリコンを主成分とする白色シ
リコン樹脂を用いている。このシリコン樹脂を例えばメ
ッシュ版を用いたスクリーン印刷によって前記導電パタ
ーン部分の厚みと略同じ３０μｍ前後の厚みとなるよう
に形成し、前記凹部２４内に収まるように配置してい
る。このように撥油性被膜２６をメッシュ版を用いたス
クリーン印刷によって形成する場合は、撥油性被膜２６
の幅を狭くしすぎると目詰まりの要因になりやすいの
で、撥油性被膜２６の幅は、０．３ｍｍ以上に設定する
のが好ましく、より好ましくは、０．５ｍｍ前後に設定
するのがよい。次に、ＬＥＤ発光部３の構造、並びにそ
の製造手順について図４、図５を参照して説明する。図
３に示す状態の基板２を用意し、この基板２に一辺が
０．３ｍｍ前後の立方体形状をしたＬＥＤチップ３１の
固定とワイヤボンド配線を行う。すなわち、各ＬＥＤ用
パッド２２のチップ配置用パッド２２ａにＬＥＤチップ
３１を導電性接着剤を介して接着固定する。次いで各Ｌ
ＥＤチップ３１とワイヤボンド用パッド２２ｂの間にワ
イヤボンド線３２をワイヤボンド接続する。図４はこの
状態を示している。ＬＥＤチップ３１に接続されたワイ
ヤボンド線３２の頂上部分の高さは基板２表面から０．
７ｍｍ前後となる。引き続き図４、図５を参照して硬化
時に透光性を有する樹脂３３によるＬＥＤチップ３１の
樹脂モールドについて説明する。流動状態にある透光性
樹脂３３をＬＥＤチップ３１の上から所定量滴下させる
と、樹脂３３はその流動性によって四方に拡がっていく
が、その裾野部分が環状の撥油性被膜２６に達すると、
撥油性被膜２６によってその拡がりが阻止される。透光
性樹脂３３は、例えばエポキシ系の樹脂等を油性の溶媒
に溶かされ形成されるので、撥油性被膜２６と接触する
と、撥油性被膜２６にはじかれて撥油性被膜２６と接触
する面積を小さくするような力、すなわち樹脂３３の表
面張力を大きくする力が作用し、樹脂３３の拡がりが阻
止される。その結果、撥油性被膜２６によって裾野部分
の拡がりが規制された樹脂３３は、その拡がりが高さ方
向に向けられ、厚みを厚くすることができる。従来構造
における樹脂の厚みは１ｍｍ程度が限度であったのに対
して、従来と同一条件下で厚さが３０μ前後と極めて薄
い撥油性被膜２６を追加するのみで、樹脂３３の厚みを
最高でその４倍の４ｍｍ以上にすることができることを
確認した。しかしながら、樹脂３３の厚みを必要以上に
厚くすると、逆にＬＥＤ光源１の厚み増加になるので、
この例では、ワイヤボンド線３２の頂上部分（基板２表
面から０．７ｍｍ前後）を完全に埋没でき、しかもＬＥ
Ｄ光源１の厚みを薄く設定できる最適範囲として、硬化
後の樹脂３３の厚みが１．５ｍｍ前後になるように設定
している。その後、この樹脂３３は硬化のために加熱処
理される。このように樹脂３３の厚みを厚くすることに
よって、ワイヤボンド線３２を樹脂３３に完全に埋没す
ることができるようになり、露出ワイヤボンド線の断線
等の問題を解消することができた。また、撥油性被膜２
６によって、流動状態の樹脂３３の形状を互いに独立し
た一定の形状に保つことができ、各ＬＥＤ発光部３の光
学特性を均一に揃えることができる。さらにまた、樹脂
３３と基板２の接触部分付近における気泡の発生を抑制
することもできる。上記実施例は、撥油性被膜２６をＬ
ＥＤ用パッド２２を囲むように環状に形成した凹部２４
内に配置して基板２の表面と撥油性被膜２６の表面をほ
ぼ同じ高さ（配線パターン２３の存在によって基板２の
表面よりも突出する部分も存在）にする場合を示した
が、図６に示すように、ＬＥＤ用パッド２２を囲む撥油
性被膜２６を環状の凹部２４の外に配置したり、図７に
示すように、撥油性被膜２６を環状の凹部の内、すなわ
ちＬＥＤ用パッド２２の外周縁部分上に配置してもよ
い。このようにすれば、図５に示す場合に比べて撥油性
被膜２６によるＬＥＤチップの光の遮光が多少増大する
恐れがあるが、撥油性被膜２６自体の厚みによる堰止め
効果が加わって樹脂の流れ出しをより確実に阻止するこ
とができる。また、上記実施例はメッシュ版により撥油
性被膜２６を形成する例を示したが、図４〜図７に示す
撥油性被膜２６を、メタル版等を用いて例えば図８
（ａ），（ｂ）に示すように複数の撥油性被膜要素２６
ａ，２６ｂを用いて形成することもできる。この場合、
撥油性被膜２６は図４に示すような切れ目のないもので
はなく、切れ目部分２６ｃが存在した環状になる。この
切れ目部分２６ｃは、撥油性被膜２６をメタル版を用い
て形成する場合に、ＬＥＤ用パッド２２に相応する部分
を覆う部材を保持するための連結片が必要となり、その
連結片の存在する部分によって形成される。この切れ目
部分２６ｃは、存在しない方が好ましいが、設ける必要
がある場合はその幅を樹脂３３の流れ出しを阻止するに
必要とされる幅以内に設定して形成する。この図８に示
す例では、直径（長軸）が３．２ｍｍ程度の環状を成す
撥油性被膜２６に対して、その切れ目部分２６ｃの幅を
０．３ｍｍに設定しているが、被膜２６で囲まれる領域
内に流動状態の樹脂３３を高さが３ｍｍ程度になるまで
流しても、切れ目部分２６ｃからの樹脂３３の流れ出し
は全く生じなかった。また、同様に、直径（長軸）が
４．４ｍｍ程度の環状を成す撥油性被膜２６に対して、
その切れ目部分２６ｃの幅を０．５ｍｍに設定した場合
においても、切れ目部分２６ｃからの樹脂３３の流れ出
しは全く生じなかった。また、撥油性被膜２６に形成す
る切れ目２６ｃは、その幅が１ｍｍ程度以下であれば樹
脂３３の流れ出しを防止することができ、樹脂の流れ出
しを防止する幅以内に設定されたものであれば、撥油性
被膜２６に複数個設けることができる。すなわち、撥油
性被膜２６は、樹脂３３の裾野部分の外郭形状を規定す
るように樹脂３３の外周縁に沿って配置されていれば、
分割された複数の要素を集合して環状に形成してもよい
し、連続する１つの要素によって形成してもよい。ま
た，上記実施例は撥油性被膜２６としてシリコンを主成
分とする撥油剤を用いる場合を例示したが、撥油性の高
い部材、すなわち上記接触角度が３０度以上、好ましく
は５０度以上、より好ましくは７０度以上の撥油剤をこ
れに代えて用いることもでき、例えばフッ素系ポリマ−
を主成分とする撥油剤やそれに類する撥油剤を用いても
同様の効果が得られる。また，上記実施例は線状のＬＥ
Ｄ光源１を例に取ったが、これ以外の面状のＬＥＤ光源
等も対象とすることもでき、例えばＬＥＤ発光部３を１
個備えるものや、ＬＥＤ発光部３を複数個を備える他の
ＬＥＤ光源にも適用することができる。BEST MODE FOR CARRYING OUT THE INVENTION A case where the embodiment of the present invention is applied to the linear LED light source 1 shown in FIG. 1 will be described below as an example. This LED light source 1 includes a plurality of LEDs on the upper surface of a substrate 2.
The light emitting parts 3 are arranged linearly. First substrate 2
2 and the manufacturing procedure thereof will be described with reference to FIGS. The substrate 2 is prepared by forming a copper foil on the surface of a long base material 21 such as glass epoxy. By etching the same, a plurality of LED pads 22 and a wiring pattern 23 connecting these are formed. It is provided and configured as a conductive pattern. Each LED pad 22 is
Pads 22a for chip placement, each of which has a semicircular shape
And a pad 22b for wire bonding are provided, and the whole has a circular or elliptical shape. The LED pad 22 is formed such that the recess 24 annularly surrounds the LED pad 22.
A space having a predetermined width is provided between the wiring pattern 23 and the wiring pattern 23 located around the wiring pattern 23 to expose the base material 21. next,
The substrate 2 has the following properties in order to enhance the light reflectivity of its surface.
As shown in FIG. 3, only a necessary portion of the pad 22a for arranging the chip and the pad 22b for wire bonding and other portions necessary for arranging the circuit elements are exposed, and most of the rest are of a white type having an insulating property. A process of covering with the resist film 25 is performed. The conductive pattern portion not covered with the resist film 25 is desirably plated as necessary. Thus, the substrate 2 is prepared, and then the oil-repellent coating 26 is formed on the surface of the substrate 2 so as to surround the LED pads 22. When the oil repellency of the oil repellent agent is represented by the contact angle of n-hexadecane dropped in a granular form (similar to the water repellency of the water repellent agent by the contact angle of water droplets), the oil repellent coating film 26 has a contact angle of A larger material, that is, a material having high oil repellency is selected and used. When the oil repellency of the white resist film 25 and the conductive pattern is represented by the contact angle, it is approximately 10 degrees or less, depending on the material, and the oil repellency is low. In this example, as the oil-repellent coating 26, a white silicone resin containing silicon having a contact angle of 30 degrees or more as a main component is used. This silicon resin is formed by screen printing using, for example, a mesh plate so as to have a thickness of about 30 μm, which is approximately the same as the thickness of the conductive pattern portion, and is arranged so as to fit in the recess 24. When the oil repellent coating film 26 is formed by screen printing using a mesh plate as described above, the oil repellent coating film 26 is formed.
The width of the oil-repellent coating 26 is preferably set to 0.3 mm or more, and more preferably set to about 0.5 mm because the width of the oil-repellent coating 26 is likely to cause clogging. Next, the structure of the LED light emitting section 3 and the manufacturing procedure thereof will be described with reference to FIGS. The substrate 2 in the state shown in FIG. 3 is prepared, and the LED chip 31 having a cubic shape with one side of approximately 0.3 mm is fixed and the wire bond wiring is performed on the substrate 2. That is, the LED chip 31 is bonded and fixed to the chip placement pad 22a of each LED pad 22 via a conductive adhesive. Then each L
A wire bond wire 32 is wire-bonded between the ED chip 31 and the wire bond pad 22b. FIG. 4 shows this state. The height of the top portion of the wire bond wire 32 connected to the LED chip 31 is 0.
It will be around 7 mm. Next, with reference to FIGS. 4 and 5, the resin molding of the LED chip 31 with the resin 33 having a light-transmitting property when cured will be described. When a predetermined amount of the translucent resin 33 in a fluid state is dropped from above the LED chip 31, the resin 33 spreads in all directions due to its fluidity, but when its skirt reaches the annular oil-repellent coating 26,
The oil-repellent coating 26 prevents its spread. The translucent resin 33 is formed, for example, by dissolving an epoxy resin or the like in an oily solvent. Therefore, when the translucent resin 33 comes into contact with the oil repellent coating 26, the area of contact with the oil repellent coating 26 is repelled by the oil repellent coating 26. A force to reduce the force, that is, a force to increase the surface tension of the resin 33 acts, and the spread of the resin 33 is prevented. As a result, the resin 33, the expansion of the skirt of which is restricted by the oil-repellent coating 26, is directed in the height direction, and the thickness can be increased. Although the thickness of the resin in the conventional structure is limited to about 1 mm, under the same conditions as the conventional one, the thickness of the resin 33 can be maximized only by adding the extremely thin oil-repellent coating 26 having a thickness of around 30 μ. It was confirmed that it could be four times as large as 4 mm or more. However, if the thickness of the resin 33 is made thicker than necessary, the thickness of the LED light source 1 is increased.
In this example, the top portion of the wire bond wire 32 (about 0.7 mm from the surface of the substrate 2) can be completely buried, and LE
As an optimum range in which the thickness of the D light source 1 can be set thin, the thickness of the cured resin 33 is set to about 1.5 mm. Then, the resin 33 is heat-treated for curing. By increasing the thickness of the resin 33 in this way, the wire bond wire 32 can be completely buried in the resin 33, and problems such as disconnection of the exposed wire bond wire can be solved. In addition, the oil-repellent coating 2
6, the shape of the resin 33 in the fluidized state can be maintained at a constant shape independent of each other, and the optical characteristics of the LED light emitting units 3 can be made uniform. Furthermore, it is possible to suppress the generation of bubbles near the contact portion between the resin 33 and the substrate 2. In the above-mentioned embodiment, the oil-repellent coating 26 is L
An annular recess 24 surrounding the ED pad 22
6 shows a case in which the surface of the substrate 2 and the surface of the oil-repellent coating 26 are arranged at substantially the same height (there is a portion projecting from the surface of the substrate 2 due to the presence of the wiring pattern 23). 7, the oil repellent coating 26 surrounding the LED pad 22 is disposed outside the annular recess 24, or as shown in FIG. 7, the oil repellent coating 26 is disposed inside the annular recess, that is, the LED pad 22. You may arrange | position on the outer peripheral edge part of. By doing so, the light blocking of the LED chip light by the oil repellent coating 26 may be slightly increased as compared with the case shown in FIG. 5, but the blocking effect by the thickness of the oil repellent coating 26 itself is added and the resin The outflow can be prevented more reliably. Further, in the above-mentioned embodiment, the example in which the oil repellent coating film 26 is formed by the mesh plate is shown. However, the oil repellent coating film 26 shown in FIGS.
As shown in (a) and (b), a plurality of oil-repellent coating elements 26 are provided.
It can also be formed using a and 26b. in this case,
The oil-repellent coating 26 is not a continuous one as shown in FIG. 4 but has an annular shape with a cut portion 26c. When the oil-repellent coating 26 is formed by using a metal plate, the cut portion 26c needs a connecting piece for holding a member that covers a portion corresponding to the LED pad 22, and the portion where the connecting piece exists. Formed by. It is preferable that the cut portion 26c does not exist, but if it is necessary to provide the cut portion 26c, the width thereof is set within a width required to prevent the resin 33 from flowing out. In the example shown in FIG. 8, the width of the cut portion 26c is set to 0.3 mm for the oil-repellent coating 26 having an annular shape with a diameter (major axis) of about 3.2 mm. Even if the resin 33 in a fluid state was flowed in the enclosed area until the height became about 3 mm, the resin 33 did not flow out from the cut portion 26c at all. Similarly, with respect to the oil-repellent coating 26 having an annular shape with a diameter (major axis) of about 4.4 mm,
Even when the width of the cut portion 26c was set to 0.5 mm, the resin 33 did not flow out from the cut portion 26c at all. Further, the cut 26c formed in the oil repellent coating film 26 can prevent the resin 33 from flowing out if the width thereof is about 1 mm or less, and if it is set within the width that prevents the resin flowing out, A plurality of oil repellent coatings 26 can be provided. That is, if the oil-repellent coating 26 is arranged along the outer peripheral edge of the resin 33 so as to define the outer shape of the skirt portion of the resin 33,
A plurality of divided elements may be aggregated to form an annular shape, or may be formed by one continuous element. Further, although the above example illustrates the case where the oil repellent agent containing silicon as the main component is used as the oil repellent coating film 26, a member having high oil repellency, that is, the contact angle is 30 degrees or more, preferably 50 degrees or more, and more preferably Can be replaced with an oil repellent having a temperature of 70 degrees or more, for example, a fluoropolymer.
The same effect can be obtained by using an oil repellent mainly composed of or an oil repellent similar thereto. In addition, the above embodiment is a linear LE.
Although the D light source 1 is taken as an example, other planar LED light sources or the like can be used.
The present invention can be applied to an individual LED light source or another LED light source including a plurality of LED light emitting units 3.
【発明の効果】以上のように本発明によれば、薄い撥油
性被膜によってモ−ルド用樹脂の形状の安定化を図るこ
とができ、光学特性の均一なＬＥＤ光源を提供すること
ができる。撥油性被膜によってモ−ルド用樹脂の厚みを
厚くすることができ、ワイヤボンド線を樹脂に埋没して
ワイヤボンド線を確実に保護することができる。As described above, according to the present invention, the shape of the resin for molding can be stabilized by the thin oil-repellent coating, and the LED light source with uniform optical characteristics can be provided. The oil-repellent coating can increase the thickness of the molding resin, and the wire bond wire can be buried in the resin to reliably protect the wire bond wire.
【図１】本発明の一実施例を示す線状ＬＥＤ光源の平面
図である。FIG. 1 is a plan view of a linear LED light source showing an embodiment of the present invention.
【図２】同実施例の基板（導電パターン形成済）の要部
を示す平面図である。FIG. 2 is a plan view showing a main part of a substrate (having a conductive pattern formed) of the same example.
【図３】同実施例の基板（レジスト形成済）の要部を示
す平面図である。FIG. 3 is a plan view showing a main part of a substrate (resist formed) of the embodiment.
【図４】同実施例の基板（ＬＥＤチップ配置済）の要部
を示す平面図である。FIG. 4 is a plan view showing a main part of a substrate (with LED chips arranged) of the embodiment.
【図５】図１の要部断面図である。5 is a cross-sectional view of the main parts of FIG.
【図６】他の実施例の要部断面図である。FIG. 6 is a cross-sectional view of main parts of another embodiment.
【図７】さらに他の実施例の要部断面図である。FIG. 7 is a cross-sectional view of a main part of still another embodiment.
【図８】（ａ），（ｂ）は撥油性被膜の他の構成例を示
す平面図である8A and 8B are plan views showing another configuration example of the oil-repellent coating.
１ 線状ＬＥＤ光源 ２ 基板 ２１ 基材 ２２ ＬＥＤ用パッド ２２ａ チップ配置用パッド ２２ｂ ワイヤボンド用パッド ２５ レジスト膜 ２６ 撥油性被膜 ３ ＬＥＤ発光部 ３１ ＬＥＤチップ ３２ ワイヤボンド線 ３３ 透光性樹脂 1 linear LED light source 2 substrates 21 Base material 22 LED pad 22a Chip placement pad 22b Wire bond pad 25 Resist film 26 Oil repellent coating 3 LED light emitting part 31 LED chip 32 wire bond wire 33 Translucent resin
───────────────────────────────────────────────────── フロントページの続き (72)発明者 上橋 幸春 鳥取県鳥取市南吉方３丁目201番地 鳥取 三洋電機株式会社内 Ｆターム(参考） 5F041 AA42 AA47 CA77 DA02 DA07 DA13 DA39 DA43 DA55 DA56 DA59 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Koharu Uehashi 3-201 Minamiyoshikata, Tottori City, Tottori Prefecture Tottori Sanyo Electric Co., Ltd. F-term (reference) 5F041 AA42 AA47 CA77 DA02 DA07 DA13 DA39 DA43 DA55 DA56 DA59
Claims (3)
ＬＥＤチップを透光性樹脂によってモ−ルドしたＬＥＤ
光源において、前記基板上面に前記透光性樹脂の外周縁
に沿って撥油性被膜を一定の幅で環状に設けたことを特
徴とするＬＥＤ光源。1. An LED in which an LED chip is arranged on the upper surface of a substrate and the LED chip is molded with a light-transmissive resin.
In the light source, an LED light source is characterized in that an oil-repellent coating is provided in a ring shape on the upper surface of the substrate along the outer peripheral edge of the translucent resin so as to have a constant width.
からなるＬＥＤ用パッドを基材上面に形成した基板と、
前記チップ配置用パッドに配置されて前記ワイヤボンド
用パッドにワイヤボンド線を介して接続されるＬＥＤチ
ップと、前記ＬＥＤチップをモ−ルドする透光性樹脂を
備えるＬＥＤ光源において、前記ＬＥＤ用パッドを囲む
ように前記基板上面に環状の凹部を設け、この凹部内に
撥油性被膜を設けたことを特徴とするＬＥＤ光源。2. A substrate having an LED pad, which is a chip placement pad and a wire bond pad, formed on an upper surface of a base material.
An LED light source including an LED chip arranged on the chip arranging pad and connected to the wire bond pad via a wire bond wire, and an LED light source comprising a translucent resin that molds the LED chip, wherein the LED pad An LED light source characterized in that an annular recess is provided on the upper surface of the substrate so as to surround the above, and an oil repellent coating film is provided in the recess.
ドからなるＬＥＤ用パッドを基材上面に形成した基板を
準備する工程と、該基板に前記ＬＥＤ用パッドを囲むよ
うに撥油性被膜をメッシュ版あるいはメタル版を用いて
設ける工程と、前記被膜が形成された前記基板の前記チ
ップ配置用パッドにＬＥＤチップを固定して前記ワイヤ
ボンド用パッドにワイヤボンド線を接続する工程と、前
記撥油性被膜によって規定される領域内に前記ＬＥＤチ
ップを埋めるように流動状態の樹脂を配置し、該樹脂を
硬化させる工程を備えることを特徴とするＬＥＤ光源の
製造方法。3. A step of preparing a substrate on which an LED pad including a chip arranging pad and a wire bonding pad is formed on an upper surface of a base material, and an oil-repellent coating on the substrate so as to surround the LED pad or a mesh plate or A step of providing using a metal plate; a step of fixing an LED chip to the chip arranging pad of the substrate on which the film is formed and connecting a wire bond wire to the wire bond pad; A method of manufacturing an LED light source, comprising a step of disposing a resin in a fluid state so as to fill the LED chip in a defined region and curing the resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003141765A JP4030463B2 (en) | 2003-05-20 | 2003-05-20 | LED light source and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003141765A JP4030463B2 (en) | 2003-05-20 | 2003-05-20 | LED light source and manufacturing method thereof |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8292791A Division JPH10144963A (en) | 1996-11-05 | 1996-11-05 | Led light source and its manufacture |
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| JP2003318449A true JP2003318449A (en) | 2003-11-07 |
| JP4030463B2 JP4030463B2 (en) | 2008-01-09 |
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|---|---|---|---|
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