JP2003318347A - Lead frame, semiconductor package and resin sealing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lead frame capable of being applied with the clamping force of a metal mold at the position of a mold cavity wherein the lead frames are batch-molded. <P>SOLUTION: Either of die pads 2 and leads 3, 5 are formed so as to abut against the surface of a clamp while the other are formed so as to abut against the recessed surface 13 of the cavity when the lead frame 1 is clamped in the metal mold. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die frame portion on which a semiconductor chip is mounted, a lead frame on which a chip mounting portion having a lead portion is formed, and resin molding using the lead frame. The present invention relates to a resin sealing device.

[0002]

2. Description of the Related Art QFN is an example of a semiconductor package.
When mass-producing a (Quad / Flat / Non-leaded) type semiconductor package, a die pad portion on which a semiconductor chip is mounted as a molded product and a chip mounting portion around which a lead portion is formed are arranged in a matrix. Lead frames are used. A molded product having a semiconductor chip mounted on the lead frame is carried into a molding die and clamped, and one surface on which the semiconductor chip is mounted is resin-molded. The lead portion (and the die pad portion) is exposed and formed from the sealing resin. After the resin molding, a semiconductor device is manufactured by dicing a molded product into individual pieces for each semiconductor chip by a dicing device.

The applicant of the present invention, as a method of resin-sealing a QFN type semiconductor package, is a method of molding using a release film (Japanese Patent Laid-Open No. 11-77734). In order to prevent the resin flash of (1), a method of molding using an adhesive film (Japanese Patent Laid-Open No. 2001-170962) was proposed.

[0004]

In recent years, in order to improve the productivity of semiconductor packages, a plurality of semiconductor chips arranged in a matrix on a lead frame may be housed in a mold cavity for collective molding. ing. However, with the miniaturization of the semiconductor chip, the cavity area for accommodating the semiconductor chips mounted in a matrix shape on the lead frame is expanded, while there is no means for pressing the lead portion against the mold clamping surface in the mold cavity. Even if a release film is used, resin flash between the lead part and the mold cannot be prevented. In contrast,
It is possible to adhere an adhesive tape of polyimide or the like to the lead portion on the surface of the lead frame opposite to the chip mounting surface for resin sealing, but the adhesive tape is expensive and the production cost increases.

An object of the present invention is to solve the above-mentioned problems of the prior art, and a lead frame capable of exerting a clamping force by a molding die at a die cavity position, and a resin flash occurring using the lead frame. An object of the present invention is to provide a resin sealing device that can be resin-sealed at low cost.

[0006]

In order to solve the above problems, the present invention has the following constitution. That is, in a lead frame having a die pad portion on which a semiconductor chip is mounted and a chip mounting portion having lead portions formed around the die pad portion, when the lead frame is clamped in a mold die, It is characterized in that one of the die pad portion and the exposed lead portion is formed so as to be able to come into contact with the mold clamping surface and the other is brought into contact with the cavity concave surface. Further, the lead portion around the die pad portion on which the semiconductor chip is mounted is formed so as to be able to contact the mold clamping surface,
It is characterized in that the die pad portion is suspended and supported by the suspension lead portion so as to be able to contact the concave surface of the cavity while changing its height from the surrounding frame portion. Further, the bonding surface of the lead portion wire-bonded to the semiconductor chip is a step surface separated from the mold clamping surface. Further, the semiconductor chip, the lead portion to be wire-bonded, and the die pad portion are both suspended and supported so as to come into contact with the concave surface of the cavity. In addition, the die pad portion is characterized in that a convex portion that contacts the concave surface of the cavity is formed. Further, the die pad portion on which the semiconductor chip is mounted and the peripheral lead portion can be brought into contact with the mold clamping surface, and the suspension lead portion supporting the die pad portion is bent and formed so as to be able to come into contact with the cavity concave surface. Is characterized by. In addition, the semiconductor chip is mounted on the die pad part, and a part of the lead part of the lead frame, which is wire-bonded to the surrounding lead part, is exposed as an externally exposed terminal part on one surface of the resin encapsulation part and is sealed with the resin. In the stopped semiconductor package, both the die pad portion and a part of the lead portion around the die pad portion are exposed and formed on a surface of the resin sealing portion opposite to the externally exposed terminal portion.

Further, in the resin sealing device, the molding product in which the semiconductor chip is mounted on the die pad portion of the lead frame described above is molded with the adhesive film adhered to at least one surface including the exposed lead portion. It is characterized in that it is clamped by a mold, and the other surface of the molded product including the semiconductor chip is housed in a mold cavity and sealed with resin. In addition, a press portion provided with a mold die in which an air suction hole capable of adsorbing an adhesive film is provided on one die clamp surface, and a die cavity is formed on the other side,
Adhesive to one side including the loader part that carries the molded product and sealing resin into the press part, the unloader part that carries out the molded product after resin sealing from the press part, and the lead part of the molded product It is characterized by comprising a film supply mechanism for supplying a pressure-sensitive adhesive film to the mold clamping surface with the pressure-sensitive adhesive surface facing the other mold, and a film peeling mechanism for peeling the pressure-sensitive adhesive film from the molded product after resin sealing. . In addition, the clamp claw mechanism has a clamp claw that is always urged to hold the frame part against the mold surface. When the molded product is separated and taken out by the unloader section, the clamp claw is separated from the mold surface when the molded product is released. Further, the loader section holds the molded product on the upper surface side, holds the resin material on the lower surface side and carries it into the press section, and the molded product held on the upper surface side is sucked and held by the clamp surface of the upper die. The molded product is adhered and held by the adhesive film, and the resin material held on the lower surface side is supplied to each pot of the lower mold. In addition, an adhesive film is stretched on the other mold clamping surface of the mold, and is adhered to an exposed part including a die pad part and a lead part which is brought into contact with the bottom of the mold cavity to be resin-sealed. Is characterized by.

The above-described molded product having the semiconductor chip mounted on the die pad portion of the lead frame is clamped by a molding die in which at least one surface including the exposed lead portion has a release film stretched on the die clamping surface. ,
The other surface of the molded product including the semiconductor chip is housed in a mold cavity and resin-sealed. Further, an air suction hole capable of adsorbing a release film is provided on one mold clamping surface, and a press part having a mold mold having a mold cavity formed on the other side, a molded product and a sealing resin are described above. The loader section that carries in the press section, the unloader section that carries out the molded product after resin sealing from the press section, and the release film that covers one surface including the exposed lead section of the molded product It is characterized by comprising a film supply mechanism for supplying the mold clamp surface and a film peeling mechanism for peeling the release film from the molded product after resin sealing. In addition, it is equipped with a clamp claw mechanism that has a clamp claw that is urged to hold the frame part to the mold surface, and when supplying the molded product to the mold, the loader part separates the clamp claw from the mold surface. When the molded product is taken out by the unloader unit, the clamp claw is separated from the mold surface when the molded product is released from the mold. In addition, a release film is stretched on the other mold clamping surface of the mold, and an exposed portion including a die pad portion and a lead portion that is held in contact with the bottom of the die cavity is covered and resin-sealed. It is characterized by

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of a lead frame and a resin sealing device according to the present invention will be described in detail below with reference to the accompanying drawings. FIG. 1 is a plan view showing an example of a lead frame arranged in a matrix, and FIGS. 2 (a) to 2 (d) are plan views of a molded product viewed from the die pad side, a front view of the molded product, and a molded product. A partially enlarged sectional view in the direction of arrow P-P including a lead portion and an arrow Q-Q including a hanging lead portion of a molded product
3A to 3D are partially enlarged cross-sectional views in a direction, and FIG. 3A to FIG. 3D are plan views of the molded product as seen from the lead portion side, sectional views in the direction of arrow P-P including the lead portion of the molded product, and suspension of the molded product. A cross-sectional view in the direction of arrow Q-Q including a lead part and a plan view of a molded product viewed from the die pad part side, and FIGS. 4A and 4B are plan views of a molded product according to another example viewed from the die pad part side. 4C and 4D are sectional views including lead portions of the molded product and sectional views including suspended lead portions of the molded product, and FIGS. 5 to 7 are semiconductor packages according to other examples. 8 is a cross-sectional explanatory view of FIG.
0 is a plan view, front view and right side view of the resin sealing device, FIG.
1 is an explanatory view of a resin sealing device according to another example, FIG.
(B) is an explanatory view showing the composition of the lower mold of the resin sealing device concerning other examples.

First, a schematic structure of the lead frame and the resin sealing device will be described with reference to FIGS. 1 and 8 to 10. In FIG. 1, reference numeral 1 is a lead frame in which a die pad portion 2 on which a semiconductor chip is mounted and a chip mounting portion around which a lead portion 3 is formed are formed in a matrix. The die pad portion 2 is supported by suspension lead portions 5 that are connected to the frame portion 4 that partitions the chip mounting portion at the four corners. A slit 6 is formed in the frame portion 4 so as to surround the chip mounting portion. In addition, pilot holes 7 are formed in the frame portions 4 on both sides of the lead frame 1 in the width direction as a reference for carrying and positioning the lead frame 1.

When the lead frame 1 is clamped in a molding die described later, the lead portion 3 and the die pad portion 2
Is pressed against the clamp surface of the upper mold 11 and the cavity concave surface 13 of the lower mold 12 to be exposed from the sealing resin. Specifically, the die pad portion 2 is suspended and supported downward by the suspension lead portion 5 and can come into contact with the lower die cavity, and the exposed lead portion 3 around the die pad portion 2 contacts the clamp surface of the upper die. It is formed so that it can touch.

Next, a schematic structure of the resin sealing device will be described with reference to FIGS. The molded product 9 (see FIG. 2) in which the semiconductor chip 8 is mounted on the die pad portion 2 formed in a matrix on the lead frame 1 is the lead portion 3
The mold die (the upper die 11 and the lower die 1) with the adhesive film 10 adhered to one surface thereof (or with the one surface including the lead portion 3 covered with the release film).
It is designed to be clamped by 2). And
The other surface of the molded product 9 including the semiconductor chip 8 is housed in the lower mold cavity 12a and is collectively resin-sealed. Furthermore, when it is desired to prevent resin flash of the die pad portion 2 that is housed and exposed at the bottom of the lower mold cavity 12a, the lower mold cavity 12a may be covered with the adhesive film 10 (or release film).

A release film used in place of the adhesive film 10 is stretched so as to come into contact with one surface of the lead frame 1 opposite to the chip mounting surface. In this embodiment, the clamp surface of the upper mold 11 is stretched. Stretched over. The release film has heat resistance that can withstand the heating temperature of the mold, is a film that is easily peeled from the upper mold and the sealing resin, and has flexibility and extensibility.
For example, PTFE, ETFE, PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidene chloride and the like are preferably used.

In FIG. 8, the resin encapsulation apparatus includes a press section A having a molding die, a molded article supply section B for supplying an article to be molded, and a resin supply section C for supplying an encapsulating resin such as a resin tablet. , A loader section D for carrying the molded product and the sealing resin into the press section A, an unloader section E for carrying out the molded article from the press section A, and a molded article storage section for storing the molded article taken out by the unloader section E. Equipped with F etc.

The configuration of each part will be described below. Figure 9
In, the press section A includes an upper die 11 and a lower die 12 as molding dies. Upper mold 11 is fixed platen 14
Further, the lower mold 12 is supported by the movable platen 15. The movable platen 15 is moved up and down by a known hydraulic press mechanism to open and close the mold. In FIG. 10, an air suction hole capable of sucking the adhesive film 10 (or release film) is provided on the clamp surface of the upper mold 11. Further, in FIG. 9, the lower mold 12 is formed with a lower mold cavity 12a for accommodating the semiconductor chips 8 arranged in a matrix. This lower mold cavity 12a
Is filled with a sealing resin in a pot 12b provided in the lower mold 12 and the plunger 12c is moved upward, so that the sealing resin passes through a resin path (runner gate) and the lower mold cavity 1
2a is filled.

In FIG. 8 and FIG. 9, the molded product supply section B
Is provided with a plurality of supply magazines 16 accommodating the product 9 to be molded, and the product 9 is supplied by the cutting arm 17 onto the turntable 18 while moving the supply magazine 16 in the vertical direction. 2 for turntable 18
The article to be molded is placed by rotating 180 degrees so that the article to be molded can be mounted symmetrically on one sheet. In addition, a parts feeder 1 that aligns and sends the resin tablets to the resin supply section C.
9 are provided, and the resin tablets are aligned by the alignment unit 20 according to the pot pitch and are supplied toward the turntable 18.

In FIG. 8, the articles to be molded and the resin tablets supplied to the turntable 18 are collectively held by the loader section D and the lower mold 1 of the press section A opened.
It is carried to 2. The loader section D is a turntable 18
And the press section A are reciprocated.
Further, the molded product after resin sealing is released from the mold as the mold is opened, held by the unloader section E, and carried out from the press section A to the moving table 21. The unloader unit E reciprocates between the press unit A and the take-out position (the position on the right side of the press unit A).

In FIG. 10, the movable table 21 standing by at the take-out position is delivered with the molded product, and a gate break is performed to remove unnecessary resin. Then, only the molded product is placed on the moving table 21 and conveyed to the molded product storage portion F. In FIG. 9, a molded product pickup 22 is provided in the molded product storage portion F, and when the movable table 21 moves to the take-out position after holding the molded product from the moving table 21, a storage magazine 23 provided below is held. It is designed to be stored in. The storage magazine 23 is provided with an elevating mechanism 24 whose bottom moves downward each time a molded product is loaded and stored.

Further, in FIGS. 8 to 10, the upper mold 11 of the press part A is provided with a film supply mechanism G. The film supply mechanism G supplies the adhesive film 10 to be adhered to one surface of the molded product including the lead portion 3 to the clamp surface of the upper mold 11 such that the adhesive surface is on the lower mold side (or of the molded product). A release film covering one surface including the lead portion 3 is supplied to the clamp surface of the upper die 11. Further, the upper die 11 is a film for peeling the adhesive film 10 (or the release film) from the molded product after resin sealing. A peeling mechanism H is provided.

In the film supply mechanism G, a long adhesive film 10 (or a release film) is supplied from the front side of the apparatus through the clamping surface of the upper mold 11 toward the rear side of the apparatus in FIG. That is, the supply roll 25 is provided on the front side of the device, and the winding roll 26 is provided on the back side of the device.
Is provided. The adhesive film 10 has an adhesive layer provided on the same film substrate as the release film,
A mount tape 27 is attached to the surface of the adhesive layer. This mount tape 27 has the adhesive film 10 on the upper mold 1
The tape peeling mechanism is used to peel the adhesive film 10 immediately before it is loaded onto the clamp surface 1.

That is, the mount tape 27 is supplied from the supply roll 25.
The adhesive film 10 delivered together with the adhesive tape 10 is separated by the rotatable separation roller 28 so that only the mount tape 27 is separated and wound up on the mount take-up reel 28, and only the adhesive film 10 is supplied toward the clamp surface of the upper mold 11. It has become so. When the adhesive film 10 does not require the mount tape 27, the mount tape 26 and the mount take-up reel 29 can be omitted, or even when the release film is used instead of the adhesive film 10. Is. As the film base material of the adhesive film 10, a film material having heat resistance, flexibility and cushioning property is used. For example, FEP film, PET film, fluorine-impregnated glass cloth, polyvinylidene chloride, ETFE film, PTFE film. , Polypropylene, etc. are preferably used

The adhesive film 10 from which the mount tape 27 has been peeled off is pitch-fed along the clamp surface of the upper mold 11 with the adhesive surface facing the lower mold 12. Adhesive film 10 (or release film)
Is adsorbed by performing air suction from an air suction hole provided on the clamp surface of the upper mold 11.

After the resin is sealed, the film peeling mechanism H pushes down the adhesive film 10 (or the release film) from the clamp surface of the opened upper mold 11 to separate it, and again feeds the pitch in preparation for the next resin sealing operation. It is provided to do so. Vertical movement mechanisms 30a and 30b are provided near the supply roll and the take-up roll of the upper mold 11. By pushing down the vertical movement mechanisms 30a and 30b after resin sealing, the adhesive film 10 (or release film) is separated from the upper mold 11 and pitch-fed. The take-up roll 26, the supply roll 25 and the mount paper take-up reel 29 are rotationally driven in synchronization with each other.

The outline of the resin sealing operation will be described below.
The molded article 9 is supplied from the supply magazine 16 to the turntable 18
When the resin tablet is delivered to the center of the turntable 18 by the aligning section 20, the loader section D
Holds the article to be molded 9 and the resin tablet and carries them into the opened press section A, the semiconductor chip 8 is housed in the cavity 12a of the lower mold 12, and the resin tablet is supplied to the pot 12b. Then, after the loader section D is retracted,
The lower die 12 is raised and the adhesive surface of the adhesive film 10 adsorbed to the clamp surface of the upper die 11 adheres to the frame portion 4 including the lead portion 3 of the article 9 to be clamped. Accordingly, even if the lower mold cavity 12a is filled with the sealing resin, the resin can be sealed without wrapping around to the exposed surface side of the lead portion 3.

Since the encapsulating resin not only seals the article 9 to be molded but also adheres to the adhesive surface (or release film) of the adhesive film 10, it must be peeled off from the molded article after the resin encapsulation. For example, when opening the mold after resin sealing,
When the molded product is released from the lower mold 12, the lower mold 12 can be moved downward and peeled while the adhesive film 10 (or the release film) is adsorbed on the clamp surface of the upper mold 11.

Further, in FIGS. 12 (a) and 12 (b), in order to prevent the molded product from sticking to or sticking to the adhesive film 10 (or the release film) when the mold is opened, the lower mold 12 is further moved. A clamp claw mechanism 31 may be provided on the lower mold 12 to perform the positioning. Further, the clamp claw mechanism 31 may be provided on both sides of the lead frame 1 as required.

A clamp claw 32 is provided on the lower mold 12 so as to be rotatable around a fulcrum 33. A claw portion 32a that presses the frame portion 4 of the lead frame 1 is formed at one end of the clamp claw 32, and the other end 32b is biased upward by a spring 34. That is, the clamp claw 32 has the fulcrum 3
3 is urged in the counterclockwise direction around the claw portion 32.
The a presses the lower clamp surface.

Therefore, when the molded product 9 is supplied to the lower die 12, the other end 32b of the clamp claw 32 is pushed down against the urging force of the spring 34 by the open / close pin 35 provided in the loader portion D. Therefore, it is necessary to set the claw portion 32a on one end side apart from the lower mold surface (rotate the clamp claw 32 in the clockwise direction around the fulcrum 33).
Further, when the loader section D is retracted, the pushing motion of the opening / closing pin 35 is eliminated, so that the clamp claw 32 is rotated in the counterclockwise direction about the fulcrum 33 by the urging force of the spring 34, and the claw part 32a. Presses the frame part 4. When the lower mold 12 is moved downward by opening the mold, the ejector pin is abutted against the molded product and the mold is released. At this time,
By providing the ejector pin plate with a push-up pin 36 capable of abutting against one end side of the clamp claw 32, the clamp claw 32 is rotated clockwise around the fulcrum 33 against the biasing force of the spring 34. The claw portion 32a can be separated from the frame portion 4 and taken out by the unloader portion E.

The loader section D is adapted to hold the molded article 9 and the resin tablet from the position of the turntable 18 on the lower mold surface side and carry them into the lower mold 12, but the invention is not limited to this. A configuration such as 11 may be used. That is, the molded product 9 may be held on the upper surface side of the loader portion D and the resin tablet T may be held on the lower surface side and carried into the lower mold 12. The movable pin 3 is attached to the molded product mounting portion of the loader portion D.
7 is provided so that it can be pushed up. The movable pin 37 can push up the molded product 9 by operating the push-up cylinder 38. The loader section D enters the mold die opened to load the resin tablet into the pot 12b of the lower mold 12, and at the same time, the push-up cylinder 38 is operated to project the movable pin 37 to project the movable pin 37 into the frame section of the molded article 9. It is also possible to press 4 onto the pressure-sensitive adhesive film 10 that is suction-held on the clamp surface of the upper mold 11 so as to retain the pressure-sensitive adhesive. At this time, in order to prevent the molded product 9 from falling, the clamp claw mechanism 3 similar to that shown in FIG.
1 may be provided.

Next, the structure of the lead frame 1 constituting the molded product 9 will be described in detail with reference to FIGS. As described above, when the lead frame 1 is clamped in the molding die, the die pad portion 2 and the lead portion 3 have the clamp surface of the upper die 11 and the cavity concave surface 13 of the lower die 12.
(See FIGS. 8 and 9) and is exposed from the sealing resin. 2A and 2B show the molded product 9 before resin sealing. The lead frame 1 shown in FIG. 2A has chip mounting portions formed in a matrix, but unlike FIG. 1, a plurality of chip mounting portions are collectively sealed by the section bar 41 in the lead frame 1. It is partitioned so that it will be formed at the location. Further, in this embodiment, the bonding surface of the lead portion 3 wire-bonded to the semiconductor chip 8 is formed to be a step surface separated from the clamp surface of the upper die 11.

Specifically, in FIGS. 2C and 2D,
The upper portion of the lead portion 3 and the frame portion 4 can contact the clamping surfaces of the upper die 11 and the lower die 12, and the lower portions of the die pad portion 2 and the lead portion 3 can contact the cavity concave surface 13. Each die pad portion 2 is supported below the frame portion 4 by suspension lead portions 5 provided at four corners. In addition, the die pad portion 2 has a semiconductor chip 8
Is die-bonded, and is wire-bonded to the upper surface of the lower portion of the lead portion 3. The curved upper position of the bonding wire 39 is lower than the upper position of the lead portion 3.

Further, the lead portion 3 is formed so as to be inclined from the outer upper position toward the inner lower position, so that the inner lower portion (portion on the die pad portion 2 side) can abut the cavity concave surface 13 together with the die pad portion 2. And lead part 3
The outer upper position of the above can contact the clamp surface of the upper mold 11 together with the frame portion 4. As a result, any part of the lead frame 1 in which the chip mounting portions are formed in a matrix can contact the clamping surface of the upper mold 11 and the cavity concave surface 13 of the lower mold 12 at the cavity position. In the closed state, the clamping force can be applied to the exposed lead portion 3 that adheres to the adhesive film 10 (or is covered with the release film), and the resin flash can be effectively prevented.

FIGS. 3A to 3D show a molded product (semiconductor package) after resin sealing. The semiconductor chips 8 are collectively resin-sealed, and the resin-sealed portion (package portion) 4
From 0, it can be seen that the die pad portion 2 and a part of the lead portion 3 around the die pad portion 2 are exposed and formed on the upper and lower surfaces. A part of the lead part 3 is exposed as an externally exposed terminal part on one surface of the package part 40 and is resin-sealed (see FIG. 3A), and a part of the die pad part 2 and the lead part 3 around it. And are both exposed and formed from the opposite side of the package portion 40 (FIG. 3).
(See (d)). Through this exposed lead portion 3, a product inspection such as an OS check can be performed even after mounting on a substrate. Further, when the adhesive film 10 is used, the area in contact with the matrix-shaped lead portion 3 is small, and the adhesive force of the adhesive applied to the film base material indicates whether or not a resin flash has occurred and is easy to handle ( Whether to peel from the molded product)
Have a close relationship with. According to the experiment, the adhesive film 1
The adhesive strength of 0 is approximately 0.32 N / mm ^{2 to} 0.73 N
It has been proved that it can withstand practical use when it is set in the range of / mm ² .

4A and 4B show a molded product 9 before resin sealing according to another example, and FIGS. 4C and 4D show a molded product after resin sealing. In FIG. 4A, the schematic structure of the lead frame 1 is the same as that of FIG. 2A.

In this embodiment, in FIG. 4B, the lead portion 3 is formed so as to be inclined downward, and the inner lower portion (end portion on the die pad portion 2 side) 3a is formed to a position above the die pad portion 2. Has been done. The lead portion 3 has an outer upper portion 3b.
Can contact the clamp surface of the upper die 11 together with the frame portion 4, and the die pad portion 2 can contact the cavity concave surface 13. In FIG. 4D, each die pad portion 2 is supported below the frame portion 4 by suspension lead portions 5 provided at four corners.

Further, the semiconductor chip 8 is provided on the die pad portion 2.
Is die-bonded, and is wire-bonded to the inner lower portion 3a of the lead portion 3 located above the die pad portion 2. The curved upper position of the bonding wire 39 is lower than the upper position of the lead portion 3.

Further, the outer upper portion 3b of the lead portion 3 and the frame portion 4 can come into contact with the clamp surface of the upper die 11, and the die pad portion 2 can come into contact with the cavity concave surface 13. In this way, any part of the lead frame 1 can be brought into contact with the clamp surface of the upper die 11 and the cavity concave surface 13 of the lower die 12 at the cavity position. As a result, the clamp force of the die pad portion 2 that abuts the cavity concave surface 13 when the lower die 12 is closed is adhered to the adhesive film 10 via the suspension lead portion 5 (or covered with the release film). The resin flash can be effectively prevented.

Although the lead portion 3 was plastically deformed to form the step surface, as shown in FIG. 5, the bonding surface on the inner end side of the lead portion 3 was half-etched to obtain the step surface 4.
1 may be formed. The semiconductor chip 8 die-bonded to the die pad portion 2 is wire-bonded to the step surface 41 of the lead portion 3. Also in this case, the outer end portion of the lead portion 3 and the frame portion 4 are not
It is possible to contact the clamping surface of the die pad 2
Can contact the cavity concave surface 13. As a result, the clamping force of the die pad portion 2 that abuts the cavity concave surface 13 in the mold closed state can be exerted on the exposed lead portion 3 that adheres to the adhesive film 10 via the suspension lead portion 5, effectively preventing resin flash. be able to.

Further, in the semiconductor package of FIG.
When the die pad portion 2 is sealed in the package portion 40 without being exposed, the lower die 12 is formed on the lower surface of the die pad portion 2.
The convex portion 42 that abuts the concave surface 13 of the cavity may be formed. In addition, in the semiconductor package of FIG.
In a lead frame 1 in which a die pad portion 2 on which a semiconductor chip 8 is mounted and a lead portion 3 are formed on the same surface, a suspension lead portion 5 that supports the die pad portion 2 at four corners is a lower mold 1.
It may be bent so as to be able to contact the concave surface 13 of the second cavity. In this case, the die pad portion 2 and the lead portion 3 are formed in contact with the clamp surface of the upper die 11 to be exposed, and the lower die 1
The suspension lead portion 5 abuts on the concave surface 13 of the cavity 2 to be exposed.

It should be noted that the semiconductor chip 8 is die-bonded to one surface of the ordinary lead frame 1 in which the die pad portion 2 and the lead portion 3 are formed on the same surface, and the lead portion 3 is wire-bonded to the molded product. May be
In this case, the clamping force of the molding die at the cavity position cannot be exerted on the adhesive portion of the lead portion 3. However, the article to be molded 9 is carried in using the loader section D shown in FIG. 11, and the movable pin 37 is pushed up to the adhesive surface of the adhesive film 10 attracted to the clamp surface of the upper mold 11 to lead the article 9 to be molded. By pressing the portion 3, the lead portion 3 can be surely adhered, and resin encapsulation can be performed without causing resin flash.

When the lead frame 1 is used, one of the die pad portion 2 and the lead portion 3 (or the hanging lead portion 5) of the upper die 11 is located at the position of the lower die cavity 12a when clamped in the molding die. Since the clamping surface and the other are formed so as to be able to contact the cavity concave surface 13 of the lower mold 12, any exposed portion of the lead frame 1 abuts the mold clamping surface and the cavity concave surface 13 at the cavity position to clamp. Power can be applied.

In the resin encapsulation device, the molded article 9 having the semiconductor chip 8 mounted on the die pad portion 2 formed in the matrix of the lead frame 1 adheres to one surface including the exposed lead portion 3. Since the film 10 is clamped by the molding die while the film 10 is adhered or one surface including the exposed lead portion 3 is covered with the release film, the clamping surface of the upper mold 11 and the cavity of the lower mold 12 in the mold closed state. Since the exposed portion including the die pad portion 2 and the lead portion 3 that abut on the concave surface 13 can be pressed against the mold clamping surface for resin sealing, resin flash can be effectively prevented. Further, since the adhesive film 10 using a resin-encapsulating film base material can be adhered to the lead frame 1 or the lead frame 1 can be covered with a release film for resin encapsulation, the matrix can be used without using an expensive film material. The semiconductor chips 8 mounted in a shape can be collectively molded at low cost.

Although various preferred embodiments of the present invention have been described above, the lead frame and the resin sealing device are not limited to the above-described embodiments, but the shape of the lead portion 3 and the suspension lead portion 5 are not limited thereto. The shape of can be formed arbitrarily. Also,
The sealing resin is not limited to the resin tablet (solid resin), and may be any of granular resin, liquid resin, and sheet resin. In the resin sealing device, the case where the cavity is formed in the lower mold of the molding die has been described, but it may be formed in the upper mold, and the device configuration is not limited to the transfer molding device, and the compression molding device may be used. It may be.
Further, the adhesive film or the release film may be stretched not only on one mold clamping surface including the exposed lead portion 3 but also on the other mold clamping surface in which the cavity concave portion is formed. Furthermore, the lead frame is not limited to a product in which semiconductor chips are mounted in a matrix, and may be a lead frame arranged in a single row. The adhesive layer of the adhesive film does not have to be the entire surface and corresponds to the lead portion. It may be an adhesive striped film formed in a stripe shape by
Of course, many modifications can be made without departing from the spirit of the law.

[0044]

When the lead frame according to the present invention is used, one of the die pad portion and the lead portion has a die clamping surface and the other has a cavity concave surface at the die cavity position when clamped in the die. Since it is formed so as to be able to abut, any exposed portion of the lead frame abuts the mold clamping surface and the cavity concave surface at the cavity position, and a clamping force can be applied. Further, in the semiconductor package, a part of the lead portion is exposed as an externally exposed terminal portion on one surface of the resin sealing portion and is resin-sealed, and the die pad portion and a part of the lead portion around the die pad portion are both resin-molded. Since it is exposed from the surface of the encapsulation that is on the opposite side of the externally exposed terminals, the mold clamping force can be applied through the exposed leads inside the cavity for resin encapsulation, improving molding quality and exposing the leads. The product inspection such as the OS check can be performed through the section even after the board is mounted. Further, in the resin sealing device, the molded product in which the semiconductor chip is mounted on the die pad portion of the lead frame has the adhesive film adhered to one surface including the exposed lead portion or the one including the exposed lead portion. Since the surface is covered with the release film and clamped by the molding die, any exposed part including the die pad part and the lead part of the lead frame remains adhered to the adhesive film or is covered with the release film when the mold is closed. Since the resin can be sealed by pressing it against the mold clamping surface and the cavity concave surface as it is, the resin flash can be effectively prevented. In addition, the adhesive film that uses the resin encapsulation film base material can be adhered to the lead frame or covered with the release film with the lead frame for resin encapsulation, making it possible to reduce the cost of semiconductor chips without using expensive film materials. Can be resin-sealed.

[Brief description of drawings]

FIG. 1 is a plan view showing an example of a lead frame having a matrix arrangement.

FIG. 2 is a plan view of the molded product viewed from the die pad portion side, a front view of the molded product, and an arrow P-P including the lead portion of the molded product.
3 is a partially enlarged cross-sectional view in the direction of arrow and a partially enlarged cross-sectional view in the direction of arrow QQ including a suspension lead portion of a molded product.

FIG. 3 is a plan view of the molded product viewed from the lead side, a cross-sectional view in the direction of arrow P-P including the lead of the molded product, a cross-sectional view in the direction of arrow Q-Q including the suspension lead of the molded product, and molding. It is the top view which looked at the goods from the die pad part side.

FIG. 4 is a plan view of a molded product according to another example as viewed from the die pad portion side, a front view of the molded product, a cross-sectional view including a lead portion of the molded product, and a cross-sectional view including a hanging lead portion of the molded product. is there.

FIG. 5 is a cross-sectional explanatory diagram of a semiconductor package according to another example.

FIG. 6 is a cross-sectional explanatory diagram of a semiconductor package according to another example.

FIG. 7 is a cross-sectional explanatory diagram of a semiconductor package according to another example.

FIG. 8 is a plan view of a resin sealing device.

FIG. 9 is a front view of a resin sealing device.

FIG. 10 is a right side view of the resin sealing device.

FIG. 11 is an explanatory diagram of a resin sealing device according to another example.

FIG. 12 is an explanatory diagram showing a configuration of a lower mold of a resin sealing device according to another example.

[Explanation of symbols]

1 lead frame 2 Die pad part 3 lead part 4 frame part 5 Hanging leads 6 slits 7 pilot holes 8 semiconductor chips 9 Molded product 10 Adhesive film 11 Upper mold 12 Lower mold 12a Lower mold cavity 12b pot 12c plunger 13 Cavity concave 14 Fixed platen 15 Movable platen 16 Supply magazine 17 Cutting arm 18 turntable 19 parts feeder 20 Alignment section 21 Moving table 22 Molded product pickup 23 Storage magazine 24 Lifting mechanism 25 supply rolls 26 winding roll 27 Mount tape 28 Separation roller 29 Mount winding reel 30a, 30b Vertical movement mechanism 31 Clamp claw mechanism 32 clamp claws 32a claw 33 fulcrum 34 Spring 35 open / close pin 36 push-up pin 37 movable pins 38 Lifting cylinder 39 Bonding wire 40 package 41 step 42 convex

Claims (16)

[Claims] 1. A lead frame having a die pad portion on which a semiconductor chip is mounted and a chip mounting portion having lead portions formed around the die pad portion, wherein a die is formed when the lead frame is clamped by a mold die. A lead frame, wherein one of the die pad portion and the exposed lead portion is formed so as to be capable of abutting against the mold clamping surface and the other is capable of contacting with the cavity concave surface at the cavity position. 2. A lead portion around a die pad portion on which the semiconductor chip is mounted is formed so as to be able to abut on a mold clamping surface, and the die pad portion is changed in height from a surrounding frame portion by a suspension lead portion. The lead frame according to claim 1, wherein the lead frame is suspended and supported so as to be able to contact the concave surface of the cavity. 3. The lead frame according to claim 2, wherein the bonding surface of the lead portion wire-bonded to the semiconductor chip is a step surface separated from the mold clamping surface. 4. The lead frame according to claim 1, wherein both the lead portion and the die pad portion, which are wire-bonded to the semiconductor chip, are suspended and supported so as to be able to contact the cavity concave surface. 5. The lead frame according to claim 2, wherein the die pad portion is formed with a convex portion that abuts a concave surface of the cavity. 6. A die pad portion on which the semiconductor chip is mounted and a peripheral lead portion can be brought into contact with a mold clamping surface, and a suspension lead portion supporting the die pad portion can be bent so as to be able to come into contact with a cavity concave surface. The lead frame according to claim 1, wherein the lead frame is formed. 7. A semiconductor chip is mounted on a die pad part, and a part of the lead part of the lead frame, which is wire-bonded to the surrounding lead part, is exposed as an externally exposed terminal part on one surface of the resin sealing part. In a semiconductor package sealed with a resin, the die pad portion and a part of the lead portion around the die pad portion are both exposed and formed on a surface of the resin sealed portion opposite to the externally exposed terminal portion. Semiconductor package. 8. A molded product having a semiconductor chip mounted on a die pad portion of the lead frame according to claim 1, wherein an adhesive film is provided on at least one surface including an exposed lead portion. A resin encapsulation device characterized in that it is clamped by a molding die while being adhered, and the other surface of the molded article including the semiconductor chip is housed in a die cavity for resin encapsulation. 9. A press part having a mold die having an air suction hole capable of adsorbing an adhesive film on one die clamp surface and a die cavity formed on the other side, a molded article and sealing. A loader part for carrying the resin into the press part, an unloader part for carrying out the molded product after resin sealing from the press part, and an adhesive film for sticking to one surface of the molded product including the exposed lead part. 9. A film supply mechanism, the adhesive surface of which supplies to the mold clamping surface toward the other mold, and a film peeling mechanism for peeling the adhesive film from the molded product after resin sealing. Resin sealing device. 10. A clamp pawl mechanism having a clamp pawl biased so as to constantly hold the frame portion against the die surface is provided, and when the molding target is supplied to the die, the clamp pawl is attached by the loader portion. The clamped pawl is separated from the mold surface when the molded product is released from the mold surface when the molded product is supplied while being separated from the mold surface and the molded product is taken out by the unloader section. Alternatively, the resin sealing device according to item 9. 11. The loader section holds the molded article on the upper surface side, holds the resin material on the lower surface side, and carries it into the press section, and holds the molded article held on the upper surface side on the clamp surface of the upper die. Adhesive holding of the molded product to the adhesive film that is adsorbed and held,
The resin sealing device according to claim 8 or 9, wherein the resin material held on the lower surface side is supplied to each of the lower mold pots. 12. An adhesive film is stretched on the other mold clamping surface of the molding die, and is adhered to an exposed portion including a die pad portion and a lead portion which is brought into contact with a bottom portion of the die cavity and is resin-sealed. 9. It stops, The said 8 characterized by the above-mentioned.
Alternatively, the resin sealing device according to item 9. 13. The method according to any one of claims 1 to 6.
The molded product on which the semiconductor chip is mounted on the die pad portion of the lead frame described in paragraph, is clamped by a mold die in which at least one surface including the exposed lead portion is stretched with a release film on the die clamp surface, A resin sealing device, wherein the other surface of the molded product including a semiconductor chip is housed in a mold cavity and resin-sealed. 14. A press part having a mold die having an air suction hole capable of adsorbing a release film on one die clamp surface and a die cavity formed on the other side, a molded article and sealing. A loader section for carrying the resin into the press section; an unloader section for carrying out the molded product after resin sealing from the press section; and the release film covering one surface of the molded product including the exposed lead section. 2. A film supply mechanism for supplying to one of the mold clamping surfaces, and a film peeling mechanism for peeling a release film from a molded product after resin sealing.
3. The resin sealing device according to 3. 15. A clamp pawl mechanism having a clamp pawl urged to hold the frame portion against the die surface is provided, and when the molding target is supplied to the die, the clamp pawl is attached to the die by the loader portion. 15. The resin sealing device according to claim 13, wherein the clamp claw is separated from the mold surface when the molded product is released from the mold, when the molded product is taken out by the unloader section. . 16. A release film is stretched on the other mold clamping surface of the mold to cover an exposed part including a die pad part and a lead part which is abutted against a bottom part of the mold cavity and is covered with a resin. 15. The resin sealing device according to claim 13 or 14, which is stopped.