JP2003317774A - Flow passage built-in pedestal - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a flow passage built-in pedestal capable of being cooled without taking out hot fluid to the outside thereof. <P>SOLUTION: In this flow passage built-in pedestal formed by connecting a pipe side plate 2 having a groove 8 to an equipment side plate 3 sealing the groove 8, cooling fins 15 are provided on the non-connected surface 2b of the pipe side plate. The cooling fins are provided at least one the rear surface of the groove at specified intervals. Multiple stages of pipe side plates may be stacked each other in a three-dimensional pipe structure. The cooling fins may be formed integrally with the non-connected surface, may be fixed individually to the non-connected surface, or may be fixed to the non-connected surface through a fin substrate. The relational expression of a cooling fan interval S to a cooling fan height h is 0.36≤S/h≤0.6 and the relational expression of the cooling fin height h to a flow passage built-in pedestal thickness H is 0.29≤h/H≤0.35, and the plate thickness of the cooling fins comes desirably within the range of 0.8 to 1.0 mm. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pedestal with a built-in flow passage, which is applied to a fixed unit in which piping or the like is incorporated in a device, a unit integrated for transport, and the like. It is useful when the (groove) is applied when a high temperature fluid flows.

[0002]

2. Description of the Related Art As an application example of a flow path built-in pedestal in a fixed unit in which piping or the like is incorporated in a device or a unit that is transportably integrated, for example, a fuel cell power generation system Is mentioned.

A fuel cell power generation system is generally composed of various devices, parts, piping, wiring, etc. as shown in FIG. Therefore, when the fuel cell power generation system is a fixed unit or a unit that can be transported, a pedestal with a built-in flow path is effective for downsizing. In particular, when the fuel cell power generation system is integrated in a transportable manner for the purpose of being mounted on a vehicle, downsizing of the unit is strongly required. However, it is very difficult to arrange a large number of devices and pipes at a high density.
Therefore, it is very effective to reduce the size of the unit by using a channel-containing pedestal that allows the pipes to be densely integrated by the groove that has the function of the pipe.

FIG. 7 is an exploded perspective view showing the structure of the flow path built-in pedestal that has been developed so far. As shown in the figure, the flow path built-in pedestal 21 is connected to the pipe side (groove side) plate 2
No. 2 joint surface 22a and equipment-side plate 23 joint surface 23a
And an adhesive 24 to bond them to each other, and are arranged on the non-bonding surface 23b of the device-side plate 23 (the arrangement state on the device-side plate is indicated by a dashed line) to form a device or a device (hereinafter, 25), which is also referred to as a device and the like, is integrally fixed together with the pipe side plate 22 and the device side plate 23 by means of studs 26, nuts 27 and the like.

Then, the joint surface 22 of the pipe side plate 22
A groove 28 is formed in a, and the groove 28 is sealed by the device-side plate 23 to form a flow path. That is, the groove 28
Has a function as a pipe for flowing a fluid (liquid or gas) necessary for a device to which the flow path built-in pedestal 21 is applied, and has a predetermined cross-sectional area suitable for the velocity of the fluid flowing through the groove 28. However, it is formed in an appropriate length and direction corresponding to the position of the device or the like 25 arranged on the non-bonding surface 23b of the device side plate 23. Groove 28 provided in pipe side plate 22
The devices and the like 25 arranged on the device side plate 23 are communicated with each other by the communication holes 30 formed in the device side plate 23. In addition, 29 and 31 in the figure are bolt holes through which the studs 26 are inserted.

However, in the fuel cell power generation system using the pedestal 21 with a built-in flow path, etc., when the fluid flowing through the groove 28 and the communication hole 30 becomes high in temperature due to exothermic reaction or temperature rise due to adiabatic compression. There is. And
The flow of such a high-temperature fluid may cause problems such as damage to the device 25, deterioration of the adhesive 24, and leakage of fluid due to occurrence of strain due to local high temperature.

Therefore, as a countermeasure against this, until now, a high-temperature fluid was once drawn out of the system of the flow path built-in base 21 by piping, cooled by an appropriate cooling device, and then returned to the flow path built-in base 21 again. It was Therefore, the piping structure is complicated, the required space is large, and the number of parts is increased, resulting in high cost.

Therefore, in view of the above situation, it is an object of the present invention to provide a pedestal with a built-in flow path which is capable of cooling a high temperature fluid without taking it out of the pedestal with a built-in flow path.

[0009]

[Means for Solving the Problems] First to solve the above problems
The flow path built-in pedestal of the invention is a flow path built-in pedestal in which a pipe side plate having a groove for forming a flow path on one surface thereof and a device side plate for sealing the groove are joined. The plate is provided with a communication hole, and the device and component fixed to the non-bonding surface of the device-side plate or the device or component and the groove provided in the pipe-side plate communicate with each other through the communication hole, and A cooling fin is provided on the non-bonding surface.

The pedestal with a built-in flow passage according to the second invention is the first pedestal.
In the pedestal with a built-in flow passage of the invention, the cooling fins are provided at least on the back surface of the groove with a predetermined space.

The pedestal with a built-in flow passage according to the third aspect of the present invention is the first aspect.
Alternatively, in the pedestal with a built-in flow passage according to the second aspect of the present invention, the pipes on the piping side are stacked and joined in a plurality of stages, and the groove and the device and the parts or the devices or parts, or the grooves are mutually provided. It is characterized in that a communication hole is provided in the device side plate or a communication hole provided in the piping side plate to establish a three-dimensional piping structure, and the cooling fin is provided on a non-bonding surface of the piping side plate.

The pedestal with a built-in flow passage according to a fourth aspect of the present invention is the first aspect.
In the pedestal with a built-in flow passage according to any one of the invention to the fourth invention,
The cooling fin forms a part of the pipe side plate and is integrally formed on a non-bonding surface of the pipe side plate.

The pedestal with a built-in flow passage of the fifth invention is the first
In the pedestal with a built-in flow passage according to any one of the invention to the fourth invention,
The cooling fins are individually fixed to the non-bonding surface of the pipe side plate.

The pedestal with a built-in flow passage according to a sixth aspect of the present invention is the first aspect.
In the pedestal with a built-in flow passage according to any one of the invention to the fourth invention,
The cooling fin is fixed to a non-bonding surface of the pipe side plate via a fin substrate.

The pedestal with a built-in flow passage according to the seventh aspect of the present invention is the first aspect.
In the pedestal with a built-in flow passage according to any one of the invention to the sixth invention,
With respect to the cooling fins, when the spacing between the cooling fins is S, the height of the cooling fins is h, and the thickness of the pedestal with a built-in flow path is H, the relational expression between S and h is 0.36 ≦ S / h ≦ 0.6,
In addition, the relational expression between h and H is 0.29 ≦ h / H ≦ 0.35.

The pedestal with a built-in flow passage according to an eighth aspect of the present invention is the first aspect.
In the pedestal with a built-in channel according to any one of the invention to the seventh invention,
The plate thickness of the cooling fin is in the range of 0.8 to 1.0 mm.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a sectional view showing the structure of a pedestal with a built-in flow path according to an embodiment of the present invention, and FIG. 2 is a view taken along the line AA of FIG.

As shown in FIG. 1, a cooling fin 1 is provided on a pedestal 1 with a built-in flow path according to the present embodiment in order to cool a high temperature fluid.
5 are provided. Specifically, the pedestal 1 with a built-in flow path
Is a device which is bonded to the joint surface 2a of the pipe side (groove side) plate 2 and the joint surface 3a of the device side plate 3 with an appropriate adhesive 4 and is appropriately arranged on the non-joint surface 3b of the device side plate 3. The component or device (hereinafter, also referred to as device) 5 of (1) is integrally fixed together with the pipe side plate 2 and the device side plate 3 by the studs 6 and nuts 7.

A groove 8 is formed in the joint surface 2a of the pipe side plate 2, and the groove 28 is sealed by the device side plate 3 to form a flow path. That is, the groove 8 is the pedestal 1 with a built-in flow path.
Is responsible for the function of the piping for the fluid (liquid or gas) required for the device to which is applied. Therefore, the cross-sectional area of the groove 8 is determined by the properties of the fluid flowing in the groove 8, the flow velocity, the pressure loss, etc., and the length and direction of the groove 8 are the device side plate 23.
It is determined by the position of the device or the like 25 arranged on the non-bonding surface 23b. Further, the groove 28 provided in the pipe side plate 22 and the device 5 arranged on the device side plate 23 are
The communication is performed by the communication hole 10 formed in the device side plate 23. In the figure, 9 and 11 are bolt holes for inserting the implant bolt 6, and 12 is an O-ring. In addition, when the temperature of the fluid flowing in the groove 8 is particularly high, or depending on its properties, a means such as brazing or welding may be used instead of the adhesive 4.

As shown in FIGS. 1 and 2, cooling fins 15 are provided on the non-bonding surface 2b of the pipe side plate 2. The cooling fins 15 are protruded from the fin substrate (fin mounting plate) 16 at regular intervals.
6 is attached to the pipe side plate 22 with the screw 17, and is fixed to the non-bonding surface 22b. Cooling fin 15
May be formed by shaving, and may be cast (material FC20 or the like) together with the fin substrate 16.

As shown in FIG. 1, the cooling fins 15 have a distance S between the cooling fins 15, a height h of the cooling fins 15 and a thickness H of the flow path built-in pedestal 21. It is desirable that the relational expression is 0.36 ≦ S / h ≦ 0.6, and the relational expression between h and H is 0.29 ≦ h / H ≦ 0.35. The thickness H of the pedestal 21 with a built-in flow path includes the thickness of the fin substrate 16 in addition to the thickness of the pipe-side plate 2 and the device-side plate 2 joined together. Also,
The plate thickness t of the cooling fin 15 is preferably in the range of 0.8 to 1.0 mm. Cooling fins 15 for shaving
The plate thickness t of is increased.

The cooling fins 15 are not limited to those protruding from the fin substrate 16, but may be integrally formed with the pipe side plate 2 or by a method with a small thermal resistance such as brazing or pressure bonding. It is also possible to fix it to the non-bonding surface 2b of the plate 2. Further, the material of the pipe side plate 2 and the cooling fin 15 is not limited, but an aluminum plate or a copper-based plate is effective in terms of easiness of processing and good thermal conductivity, and it is easy to form the cooling fin 15. Cast products are also effective.

3 and 4 show specific examples of the fin structure. FIG. 3 shows the case where the material is iron (steel), and in the flow path built-in pedestal 1 of FIG. 3, the cooling fins 15 are welded to the non-bonding surface 2b of the pipe side plate 2. FIG. 4 shows the case where the material is aluminum, and in the flow path built-in pedestal 1 of FIG. 4, the groove 2b-1 is processed in the non-bonding surface 2b of the pipe side plate 2, and the cooling fin 15 is planted in this groove 2b-1. It is embedded. In addition,
Also in the case of FIG. 3 and FIG. 4, the relational expression between the cooling fin interval S and the cooling fin height h, the relational expression between the cooling fin height h and the flow channel built-in pedestal thickness H, and the cooling fin plate thickness t are It is desirable to be as described above.

By the way, the number of the pipe side plates 2 constituting the flow path built-in pedestal 1 is not limited to one, and as shown in FIG. 5, a plurality of the pipe side plates 2 may be stacked to form a three-dimensional pipe structure. . In FIG. 5, two pipe side plates 2
Are joined with an adhesive 4 to form a two-stage stack. The device-side plate 3 is joined to the upper pipe-side plate 2 with the adhesive 4, and the stud 6 is attached on the non-joint surface 3b.
The device 5 is fixed by the nut 7 and the nut 7. Then, the groove 8 and the device 5 provided on the upper and lower pipe-side plates 2 or the grooves 8 are communicated with each other through the communication holes 30 provided on the device-side plate 3 and the pipe-side plate 2 to form a three-dimensional piping structure. Has become. In this case, the cooling fins 15 are provided on the non-bonding surface 22b of the lower pipe-side plate 22 (not shown).

If necessary, the cooling fins 9 are
It is also effective to provide a fan (not shown) for applying cooling air.

As described above, according to this embodiment, since the cooling fins 15 are provided on the non-bonding surface 2b of the pipe side plate 2, the heat quantity of the high temperature fluid flowing in the groove 8 is equal to that of the pipe. The heat is conducted to the cooling fins 15 through the side plates 2 and is naturally radiated from the cooling fins 15, so that the cooling is efficiently performed. Therefore, it is no longer necessary to guide the high temperature fluid out of the flow path built-in pedestal by piping, cool it with a cooling device provided separately, and return it to the flow path built-in pedestal again, which simplifies the system configuration. Therefore, space saving and cost reduction can be achieved. If more powerful cooling is required, a fan is provided at an appropriate position outside the flow path built-in pedestal 1 to allow the cooling air to flow along the cooling fins 15 to remarkably improve the cooling effect. Can be increased.

Further, since the cooling fins 15 are provided at least on the back surface of the groove 8 with a certain space therebetween, the heat radiation effect can be further enhanced.

Further, a plurality of pipe side plates 2 are superposed and joined to each other, and the groove 8 and the device 5 provided in these pipe side plates 2 or the grooves 8 are mutually connected to the device side plate 3 or the pipe side plate 2. When the three-dimensional piping structure is formed by communicating with the communication hole 10 provided in the above, it is possible to cope with the case where the piping structure (groove structure) of the flow path built-in pedestal 1 is more complicated, and it is versatile. It can be applied.

Further, the cooling fins 15 are connected to the pipe side plate 2
When it is formed integrally with the non-bonding surface 2b of the pipe side plate 2, the heat resistance is small and the heat radiation effect can be further enhanced.

Further, as shown in FIGS. 3 and 4, the cooling fin 1
When 5 is individually fixed to the non-bonding surface 2b of the pipe side plate 2, when any one of the cooling fins 15 is damaged, it can be dealt with by replacing only the cooling fin 15.

Further, when the cooling fins 15 are fixed to the non-bonding surface 2b of the pipe side plate 2 via the fin substrate 16, the work is easier than when the cooling fins 15 are fixed one by one.

Further, regarding the cooling fin 15, the relational expression of the cooling fin interval S and the cooling fin height h is 0.36≤S / h≤.
0.6 and the relational expression between the cooling fin height h and the flow path built-in pedestal thickness H is set to 0.29 ≦ h / H ≦ 0.35 so that the heat is radiated more efficiently. Can be cooled.

Further, the plate thickness t of the cooling fin is 0.8-1.
By setting it in the range of 0 mm, it is possible to radiate heat more efficiently and cool it.

The flow path built-in pedestal of the present invention can be applied to a fuel cell power generation system as shown in FIG. 6, for example. In FIG. 6, 41a and 41b are fuels, 42 is a vaporizer, 43 is a heat exchanger, 44 is a desulfurization device, 45 is a steam separator, 46 is a Co converter, 49 is a reformer, 52 is a condenser, and 54 is a fuel. A battery main body, 58 is air, 64 is an inverter, 69 is a control device, and 72 is a shunt. In addition to these main devices, it has various devices as shown in FIG.

The pedestal with a built-in flow passage according to the present invention is not limited to the fuel cell power generation system, but can be applied to other devices.

[0037]

As described above in detail with the embodiments of the invention, according to the pedestal with a built-in flow passage of the first aspect of the invention, the pipe side plate having the groove for forming the flow passage on one surface is provided. And a device-side plate that joins the device-side plate that seals the groove, in the device-side plate provided with a communication hole in the device-side plate and fixed to the non-bonding surface of the device-side plate, or Since the parts and the groove provided in the pipe side plate are communicated with each other through the communication hole, and the cooling fins are provided on the non-bonding surface of the pipe side plate, the high-temperature fluid flowing in the groove has its heat amount. Is conducted to the cooling fin through the pipe side plate and radiated from the cooling fin, so that the cooling is efficiently performed. Therefore, it is no longer necessary to guide the high temperature fluid out of the flow path built-in pedestal by piping, cool it with a cooling device provided separately, and return it to the flow path built-in pedestal again, which simplifies the system configuration. Therefore, space saving and cost reduction can be achieved.

Further, according to the pedestal with a built-in flow passage of the second invention, in the pedestal with a built-in flow passage according to the first invention, the cooling fins are provided at least on the back surface of the groove with a certain space between them. It is possible to enhance the heat dissipation effect.

According to the pedestal with a built-in flow passage according to the third invention, in the pedestal with a built-in flow passage according to the first or second invention, the pipe-side plates are stacked and joined in a plurality of stages, and are provided on the pipe-side plate. A groove and the device and component or device or component, or the grooves are mutually connected by a communication hole provided in the device side plate or a communication hole provided in the pipe side plate to form a three-dimensional piping structure, By providing the cooling fins on the non-bonding surface of the pipe side plate, it is possible to deal with a case where the piping structure (groove structure) of the flow path built-in pedestal is made more complicated, and it can be applied to various purposes.

According to the flow path built-in base of the fourth invention, in any of the flow path built-in bases of the first invention to the fourth invention, the cooling fins form a part of the pipe side plate, By being integrally formed on the non-bonding surface of the pipe side plate, the thermal resistance is small and the heat radiation effect can be further enhanced.

Further, according to the pedestal with a built-in flow passage of the fifth invention, in the pedestal with a built-in flow passage according to any one of the first to fourth inventions, the cooling fins are individually provided on the non-bonding surface of the pipe side plate. Since any of the cooling fins is damaged by being fixed to the above, it is possible to deal with it by simply replacing only the cooling fin.

Further, according to the pedestal with a built-in flow passage of the sixth invention, in the pedestal with a built-in flow passage according to any one of the first to fourth inventions, the cooling fin is provided on the pipe side plate through the fin substrate. Since it is fixed to the non-bonding surface, the work is easier than when the cooling fins are fixed one by one.

Further, according to the pedestal with a built-in flow passage of the seventh invention, in the pedestal with a built-in flow passage according to any one of the first to sixth inventions, the cooling fins have an interval S between the cooling fins. When the height of the cooling fin is h and the thickness of the pedestal with a built-in passage is H, the relational expression of S and h is 0.36 ≦ S / h
≦ 0.6 and the relational expression between h and H is 0.29 ≦ h / H ≦
Since it is 0.35, heat can be more efficiently dissipated and cooled.

According to the pedestal with a built-in flow passage of the eighth invention, in the pedestal with a built-in flow passage according to any of the first to seventh inventions, the plate thickness of the cooling fin is 0.8 to 1.0 mm. Within the range, the heat can be released and cooled more efficiently.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a configuration of a channel-embedded pedestal according to an embodiment of the present invention.

FIG. 2 is a view taken along the line AA of FIG.

FIG. 3 is a cross-sectional view showing another configuration of the flow channel built-in pedestal according to the embodiment of the present invention.

FIG. 4 is a cross-sectional view showing another configuration of the flow channel built-in pedestal according to the embodiment of the present invention.

FIG. 5 is a cross-sectional view showing a configuration of a pedestal with a built-in flow path when a plurality of pipe side plates are stacked.

FIG. 6 is a flow diagram of a general fuel cell power generation system.

FIG. 7 is an exploded perspective view showing the configuration of a pedestal with a built-in flow path.

[Explanation of symbols]

1 Flow path built-in pedestal 2 Piping side plate 2a Bonding surface 2b Non-bonded surface 2b-1 groove 3 Device side plate 3a Bonding surface 3b Non-bonded surface 4 adhesive 5 parts or equipment 6 Implant bolt 7 nuts 8 grooves 9 bolt holes 10 communication holes 11 bolt holes 12 O-ring 15 cooling fins 16 fin substrate 17 screws

Claims (8)

[Claims] 1. A pedestal with a built-in flow passage, which is formed by joining a pipe side plate having a groove for forming a flow passage on one surface and a device side plate for sealing the groove, and is in communication with the device side plate. A hole is provided, and a device and a component fixed to the non-bonding surface of the device-side plate or a device or a component and a groove provided in the pipe-side plate communicate with each other through the communication hole, and a non-bonding surface of the pipe-side plate. Is a pedestal with a built-in flow passage, which is provided with cooling fins. 2. The pedestal with a built-in flow passage according to claim 1, wherein the cooling fins are provided at least on the back surface of the groove with a predetermined space. 3. The pedestal with a built-in flow passage according to claim 1 or 2, wherein the pipe-side plates are stacked and joined in a plurality of stages, and the groove provided in the pipe-side plate and the device and component or the device or component, Alternatively, the grooves are communicated with each other through a communication hole provided in the device side plate or a communication hole provided in the piping side plate to form a three-dimensional piping structure, and the cooling fin is provided on the non-bonding surface of the piping side plate. A pedestal with a built-in flow passage, which is provided. 4. The pedestal with a built-in flow passage according to claim 1, wherein the cooling fins form a part of the pipe side plate, and the non-joint surface of the pipe side plate. A pedestal with a built-in flow passage, which is formed integrally. 5. The pedestal with a built-in passage according to claim 1, wherein the cooling fins are individually fixed to the non-bonding surface of the pipe side plate. A pedestal with a built-in flow path. 6. The pedestal with a built-in flow passage according to claim 1, wherein the cooling fins are fixed to a non-bonding surface of the pipe side plate via a fin substrate. A pedestal with a built-in flow path. 7. The pedestal with a built-in flow passage according to claim 1, wherein the cooling fins have an interval S between the cooling fins and a height h of the cooling fins. When the thickness of the pedestal with a built-in flow passage is H, the relational expression between S and h is 0.36 ≦ S / h ≦ 0.6,
In addition, the flow path built-in pedestal, wherein the relational expression between h and H is 0.29 ≦ h / H ≦ 0.35. 8. The pedestal with a built-in flow path according to claim 1, wherein the cooling fin has a plate thickness in a range of 0.8 to 1.0 mm. Pedestal with built-in flow path.