JP2003307527A - Probe guard - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To restrain generation of a leak current, and to restrain influence of external noise in a probe guard. <P>SOLUTION: This probe guard is formed as a structure for arranging guard wires 6, 16 and 26 via an insulating layer around force wires 7, 17 and 27 in a probe needle 2, a connecting terminal 3, and a signal conductor pattern for constituting the probe guard, and is also formed as a structure for arranging GND wires 5, 15 and 25 via the insulating layer around these guard wires 6, 16 and 26. An external circuit is connected to the probe guard having such a structure. When performing tentative measurement, these guard wires 6, 16 and 26 are put in the same electric potential as the force wires 7, 17 and 27. The GND wires 5, 15 and 25 are put in earth electric potential. Thus, generation of the leak current and influence of the external noise can be restrained at tentative measurement time. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe card used for test measurement of electronic components such as semiconductor integrated circuits.

[0002]

2. Description of the Related Art Generally, a probe card is used for test measurement of electronic parts such as semiconductor integrated circuits. Figure 9
Shows a conventional probe card. For example, as shown in FIG. 9, in the probe card, a large number of probe needles 51, which are measuring needles, are arranged in a radial pattern so that the tip faces the opening 50a formed in the insulating substrate 50. The probe needle 51 is arranged in accordance with a large number of electrodes included in the electronic component.

The probe card has a connection terminal 52 at the end of the insulating substrate 50. A signal conductor pattern that electrically connects the probe needle 51 and the connection terminal 52 is formed on the insulating substrate 50.

This probe card is connected to an external circuit such as a test and measurement device via a connection terminal 52. Then, the probe needle 51 is brought into contact with the electrode of the electronic component, and the electronic component and the test and measurement device are electrically connected via the signal conductor pattern 53 and the connection terminal 52. In this way, the test measurement of the electronic component is performed.

[0005]

However, in the probe card as shown in FIG. 9, the probe needle 51, the signal conductor pattern 53, and the connection terminal 52 are force lines for applying a voltage to the electronic component at the time of test measurement. It was composed of only.

In such a structure, the potential around the force line is lower than that of the force line, so that there is a problem that a leak current is likely to occur. Further, since it is composed only of force lines, there is a problem that it is easily affected by external noise. For this reason, it has been impossible to accurately perform the minute current measurement and the high-accuracy measurement by the normal usage method.

In view of the above points, an object of the present invention is to provide a probe card capable of suppressing the generation of leak current. Moreover, it aims at providing the probe card which can suppress the influence of external noise.

[0008]

In order to achieve the above object, in the invention described in claim 1, the insulating substrate (1), the measuring needle (2) formed on the insulating substrate (1), and the insulating A connection terminal (3) formed on the substrate (1); and a signal conductor pattern formed on the insulating substrate (1) for electrically connecting the measuring needle (2) and the connection terminal (3), Each of the measuring needle (2), the signal conductor pattern, and the connection terminal (3) has a force wire (7, 17, 27) for sending a signal for test measurement and a force wire (7, 17, 27).
Of the guard wire (6, 7), which is formed around and insulated from the force wire (7, 17, 27) and has the same potential as the force wire.
16, 26).

When the probe card having such a structure is connected to an external circuit and a test measurement is performed, a guard wire (6, 16,
By setting 26) to have the same potential as the force lines (7, 17, 27), it is possible to prevent a leak current from flowing from the force lines (7, 17, 27) to the periphery thereof.

According to the second aspect of the invention, at least one of the measuring needle (2), the signal conductor pattern and the connection terminal (3) is provided on the outer circumference of the guard wire (6, 16, 26).
The structure is characterized by having a GND line (5, 15, 25) that is at ground potential.

In this way, the force wires (7, 17, 2)
Guard lines (6, 16, 26) are placed around 7),
Further, since the GND lines (5, 15, 25) are arranged around these, in addition to the effect of claim 1, further,
The influence of external noise can be suppressed.

As for the structure of the signal conductor pattern, as in claim 3, for example, the force line (7) and the guard line (6) are used.
c, 6d) are arranged on the same plane, and on the same plane, the force line (7) is the guard line (6c, 6d).
The structure can be surrounded by.

Further, as in claim 4, for example, a multilayer insulating substrate is used as the insulating substrate (1), and the force wire (7) is used.
However, the force line (7) may be sandwiched between the guard lines (6a, 6b) via the insulating layers (4b, 4c).

By combining with the third aspect, it is possible to suppress the generation of leak current more than the structure of the third aspect.

When the signal conductor pattern has a GND line, as in claim 5, for example, the force line (7), the guard line (6c, 6d), and the GND line (5).
c, 5d) are arranged on the same plane, and the force line (7) is connected to the guard line (6c, 6d) through the insulating layer (4).
Surrounded by, and further connected to the GND line (5
The structure can be surrounded by c and 5d).

When the signal conductor pattern has a GND line as in claim 6, a multilayer insulating substrate is used as the insulating substrate (1), and in the signal conductor pattern, the force line (7) is an insulating layer. It is sandwiched by the guard lines (6a, 6b) via (4b, 4c), and the force line (7) and the guard lines (6a, 6b) are separated by the insulating layer (4a, 6b).
It is possible to have a structure sandwiched between the GND lines (5a, 5b) through 4d).

It is possible to combine this structure with the structure shown in claim 5. As a result, the occurrence of leakage current and the influence of external noise can be suppressed more than in the structure of claim 5.

The reference numerals in parentheses of the above-mentioned means indicate the correspondence with the concrete means described in the embodiments described later.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION (First Embodiment) FIG. 1 shows a probe card according to a first embodiment of the present invention.

In the probe card of this embodiment, a guard wire is arranged around the force wire and a GND wire is arranged around the guard wire in each of the probe needle, the signal conductor pattern, and the connection terminal. It has a triple structure.

Specifically, as shown in FIG. 1, the probe card has an opening 1a near the center of a multilayer insulating printed board 1 made of, for example, glass epoxy resin or ceramics. A large number of probe needles 2, which are measuring needles, are arranged in a radial pattern so that the tips project from the openings 1a. In addition, the probe card has connection terminals 3 for connecting the connectors of the test and measurement equipment to the left and right edges.
Is equipped with.

FIG. 2 shows a cross section taken along the line AA 'in FIG.
1 shows a BB ′ cross section in FIG. FIG. 2 shows one probe needle 2 formed on a multi-layer insulating printed circuit board 1,
The signal conductor pattern for electrically connecting the probe needle 2 to the connection terminal 3 is shown.

The multi-layered insulating printed circuit board 1 has an insulating layer and a conductive pattern laminated, and in this embodiment, as shown in FIG. 2, for example, four insulating layers 4 (4a, 4b, 4).
c, 4d).

In FIG. 2, when the upper side of the figure is the front side and the lower side is the back side, the GND line patterns 5 (5a, 5b) are formed on the front side and the back side of the multilayer insulating printed circuit board 1.
The GND line pattern 5 is formed on the entire multilayer insulating printed circuit board 1 as shown by the diagonal lines in FIG.

Then, guard line patterns 6a and 6b are formed on the back sides of the first and third insulating layers 4a and 4c from the top. Further, a force line pattern 7 is formed on the back side of the second insulating layer 4b from the top. The force line pattern 7 is for transmitting a signal from the test and measurement device, like the conventional conductor pattern. Further, the guard line patterns 6a and 6b are formed wider than the force line pattern 7, as shown in FIG.

As described above, the multilayer insulating printed circuit board 1 is
The force line pattern 7 is sandwiched between the guard line patterns 6a and 6b via the insulating layer 4. Further, the force line pattern 7 and the guard line patterns 6a and 6b are sandwiched between the GND line patterns 5a and 5b via the insulating layer 4 from the outside of the guard line patterns 6a and 6b. That is, in the multilayer insulated printed circuit board 1, the force line pattern 7 is surrounded by the guard line pattern 6 and further by the GND line pattern 5 in the direction perpendicular to the surface of the substrate 1.
It has a heavy structure.

Further, as shown in FIG. 3, the guard line patterns 6c and 6d and the GND line patterns 5c and 5d are the same as the force line pattern 7, and the second insulating layer 4 from the top.
It is also formed on the back side of b. In other words, 3 from the top
The force line pattern 7, the guard line patterns 6c and 6d, and the GND line patterns 5c and 5 are provided on the insulating layer 4c of the second layer.
d is formed.

The guard line patterns 6c and 6d are arranged on both sides of the force line pattern 7 with the insulating layer 4 interposed therebetween. Further, the GND line patterns 5c and 5d are arranged outside the guard line patterns 6c and 6d with the insulating layer 4 interposed therebetween.

In this embodiment, although not shown, the guard line patterns 6c and 6d have a substantially elliptical shape centered on the force line pattern 7 as viewed from above in FIG. In addition, the guard line patterns 6c and 6
d, and the first and third insulating layers 4a from the top in FIG.
The guard line patterns 6a and 6b arranged on the back side of 4c are electrically connected by conductors embedded in the through holes 8a and 8b in the insulating layer 4.

Similarly to the guard line patterns 6c and 6d, the GND line patterns 5c and 5d have a substantially elliptical shape when viewed from above in FIG. It surrounds the line pattern 6. Further, in the GND line patterns 5c and 5d and in FIG.
GND line pattern 5 arranged on the front side and the back side of the substrate 1
The conductors a and 5b are electrically connected by the conductors embedded in the through holes 9a and 9b in the insulating layer 4.

Thus, each conductor pattern is formed on the same plane, and even in the direction parallel to the surface of the substrate 1, the force line pattern 7 is surrounded by the guard line pattern 6 and further by the GND line pattern 5. It has a triple structure.

Next, the structure of the connection terminal 3 will be described. Figure 4
1 shows an enlarged view of a region T which is a part of the connection terminal 3 in FIG. This figure is a view of the connection terminal 3 seen from the upper side of the drawing in FIG.

The insulating layer 11 is arranged around the force wire terminal 17. A guard wire terminal 16 surrounds the insulating layer 11. Furthermore, this guard terminal 1
An insulating layer 12 is disposed around the insulating layer 6.
A GND line terminal 15 surrounds the area 2.

The connection terminal 3 thus configured is electrically connected to each conductor pattern in FIG. As shown in FIG. 2, the force line terminal 17 is electrically connected to the force line pattern 7 via the conductor formed in the through hole 13 a in the insulating layer 4. Guard wire terminal 16
Is also electrically connected to the guard line pattern 8 through the through hole 8a in the insulating layer 4. Further, the GND line terminal 15 is electrically connected to the GND line pattern 5a on the substrate 1. In addition, in FIG. 4, the circular portions 16a and 15a in the guard wire terminal 16 and the GND wire terminal 15 are portions to be connected to the connector of the test and measurement instrument.

Next, the structure of the probe needle 2 will be described. Figure 5
2 shows a CC ′ cross section in FIG. The insulating layer 21 is formed around the force line 27, and the guard line 26 is further formed around the insulating layer 21. The insulating layer 22 is formed around the guard line 26, and the GND line 25 is further formed around the insulating layer 22.

As shown in FIG. 2, the force line 27 is not covered with the guard line 26 and the GND line 25 at the tip of the probe needle 2.

The force line 27 is electrically connected to the force line pattern 7 through a conductor formed in the through hole 13b, as shown in FIG. Similarly, the guard line 26 is also electrically connected to the guard line pattern 6 via the conductor formed in the through hole 8c. In addition, the GND line 25, as shown in FIG.
It is connected to the D line pattern 5b.

As described above, the probe card of the present embodiment passes from the probe needle 2 through the conductor pattern to the connection terminal 3
The force wires 7, 17, and 27 are electrically connected to. Then, around the force lines 7, 17, 27, guard lines 6, 16, 26 electrically insulated from the force lines 7, 17, 27 are arranged. further,
Force lines 7, 17, 27 and guard lines 6, 16, 26
Around the GND line 5, which is electrically insulated from them,
15 and 25 are arranged.

Next, a method of using this probe card will be described. The connector of the test and measurement device is connected to the connection terminal 3 of the probe card, and the tip of the probe needle 2, that is, the force wire 27 is brought into contact with the electrode of the electronic component that is the object to be measured. In this way, the electrical characteristics of the electronic component are tested.

In some test and measurement instruments, the wiring structure has a triple structure composed of a force line, a guard line, and a GND line. Since such a test and measurement device is used in this embodiment, only the outline of the structure of the connector and the test and measurement device connected to the probe card will be described here.

FIG. 6 shows a diagram for explaining the structure of the connector of the test and measurement equipment. In this connector 30, a guard wire terminal 36 is arranged around the force wire terminal 37, and a GND wire terminal 35 is arranged around the guard wire terminal, corresponding to the structure of the connection terminal 3. In this embodiment, for example, a connector in which the connector 30 is a female type and the connection terminal 3 of the probe card is a male type is adopted.
Since the connection is made by the male and female connectors in this way, the connection between the probe card and the test and measurement device can be easily performed.

As shown in FIG. 6, the guard line 36a connected to the guard line terminal 36 has the same potential as the force line 37a connected to the force line terminal 37. In addition, the G connected to the GND line terminal 35
The ND line is set to the ground potential.

Therefore, in the probe card connected to the test and measurement equipment, the guard line has the same potential as the force line, and the GND line has the ground potential.

At the time of test measurement, a voltage is applied to the electronic component from the test and measurement device via the force wires 7, 17, and 27 of the probe card to test the electrical characteristic of the electronic component.

At this time, conventionally, a leak current is generated because the potential around the force line is lower than that of the force line. Such a problem was likely to occur particularly in the connection terminal 52. Further, also in the signal conductor pattern 53, the gap between the conductors has become narrower with the increase in the number of pins, so that a leak current is likely to occur.

On the other hand, in the present embodiment, in the probe needle 2, the connection terminal 3, and the signal conductor pattern, around the force lines 7, 17, and 27, the guard lines 6 and 16 having the same potential as the force lines are provided. , 26 are arranged. This can prevent a leak current from flowing around the force line from the force line.

Further, in the present embodiment, the force line 7,
The GND lines 5, 15, 25 set to the ground potential are arranged around 17, 27 and the guard lines 6, 16, 26. As a result, a shield effect can be obtained and the influence of external noise can be suppressed.

From the above, by using the probe card of the present invention, it is possible to accurately perform the minute current measurement and the high precision measurement of the electronic component.

Conventionally, in the case of performing high-accuracy measurement using the probe card shown in FIG. 9, in order to avoid current leakage and external noise, the coaxial cable of the test measuring instrument is directly connected without passing through the connection terminal 52. A means for soldering to one end of the probe needle 51 has been used.

However, the probe needles 5 arranged in high density
It takes a great deal of labor and time to solder the coaxial cable to No. 1. Further, since the probe card is exchanged at any time depending on the type and size of electronic parts, soldering failure is likely to occur and accuracy cannot be guaranteed. Therefore, it is not preferable to perform soldering.

On the other hand, in this embodiment, high-accuracy measurement can be performed without soldering the coaxial cable of the test and measurement device directly to one end of the probe needle.

Since the insulation between the adjacent force line patterns 7 is improved as compared with the conventional structure, the force line patterns 7 can be arranged closer to each other than in the conventional case. is there. As a result, the probe card has a large number of pins, and a probe card capable of performing test measurement of a semiconductor integrated circuit having a high degree of integration can be obtained.

(Second Embodiment) FIG. 7 shows a part of a probe card according to this embodiment. In addition, this figure is
It is a figure which shows the BB 'cross section in the inside. The structure of this embodiment has the GND line pattern 5 on both sides of the guard line pattern 6a in the signal conductor pattern in FIG. 3 of the first embodiment.
e and 5f are added, and GN is provided on both sides of the guard line pattern 6b.
This is a structure in which D line patterns 5g and 5h are added.

Incidentally, the GND line patterns 5e to 5f
Are electrically connected to other GND line patterns through the conductors 9a and 9b formed in the through holes.

As described above, by adding the GND line pattern 5, the shielded area is increased. Thereby, the influence of external noise can be suppressed more than in the first embodiment.

(Third Embodiment) Further, in the present embodiment, in the structure of the signal conductor pattern shown in FIG. 7 in the second embodiment, the guard lines and the GND lines are continuous through holes. I am trying. FIG. 8 shows a part of the probe card in this embodiment. In addition,
This figure is a view showing a BB ′ cross section in FIG. 1.

As shown in FIG. 8, the GND line pattern 5a
And 5b are electrically connected via the conductor 45 formed in the through hole. Also, the guard line pattern 6
a and 6b are electrically connected via a conductor 46 formed in the through hole. This through hole is shown in Figure 2.
It is formed in all regions in which the force line pattern 7 is formed.

In this embodiment, the multi-layer insulating printed board 1
In, the force line pattern 7 is replaced with the guard line pattern 6
However, it is completely surrounded by the insulating layer 4. Further, the GND line pattern 5 completely surrounds the force line pattern 7 and the guard line pattern 6 via the insulating layer. As a result, the generation of leak current can be suppressed more than in the first and second embodiments, and the influence of external noise can also be suppressed.

(Other Embodiments) The probe needles can be increased by adopting a structure in which two or more multilayer insulating printed circuit boards 1 are stacked in the structure of each of the above-described embodiments. For example, in the cross-sectional view shown in FIG. 2, the number of insulating layers 4 and conductor patterns may be increased, and the number of force line patterns 7 may be increased. As a result, it is possible to increase the number of pins.

In each of the above-mentioned embodiments, the guard line is arranged around the force line, and the surrounding G
Although the description has been given by taking the case of the triple structure in which the ND line is arranged as an example, the GND line is not arranged in the probe needle 2, the connection terminal 3, and the signal conductor pattern, and the guard is provided around the force line. A double structure in which lines are arranged may be used. As a result, the generation of leak current can be suppressed.

Alternatively, the GND line is arranged around the force line and the guard line in only one or two of the probe needle 2, the connection terminal 3, and the signal conductor pattern having the double structure. A triple structure can also be used.

With such a structure, the effect of suppressing the influence of external noise is also obtained.

When the connection terminal 3 has a double structure and the parts other than the connection terminal 3 have a triple structure, for example, by directly connecting the GND line to the outside without using the connection terminal 3, The GND line is set to the ground potential.

Since a plurality of connection terminals 3 are formed corresponding to the probe needles 2, one of the connection terminals is provided with the GND line terminal 15. G formed on the surface of the multilayer insulating printed circuit board 1 or the probe needle 2
Since all the ND lines have a continuous structure, the GND line may be set to the ground potential in this way.

[Brief description of drawings]

FIG. 1 is a plan view of a probe card according to a first embodiment of the present invention.

FIG. 2 is a view showing a cross section taken along the line A-A ′ in FIG.

FIG. 3 is a diagram showing a B-B ′ cross section in FIG. 1;

FIG. 4 is an enlarged view of a region T in FIG.

5 is a diagram showing a cross section taken along the line C-C ′ in FIG. 2;

FIG. 6 is a diagram for explaining the configuration of the connector of the test measuring instrument.

FIG. 7 is a diagram showing a part of a probe card according to a second embodiment of the invention.

FIG. 8 is a diagram showing a part of a probe card according to a third embodiment of the invention.

FIG. 9 is a plan view of a conventional probe card.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Multilayer insulating printed circuit board, 1a ... Opening part, 2 ... Probe needle, 3 ... Connection terminal, 4 ... Insulating layer, 5 ... GND line pattern, 6 ... Guard line pattern, 7 ... Force line pattern,
8, 9, 13 ... Conductors formed in through holes, 1
1, 12, 21, 22 ... Insulating layer, 15 ... GND line terminal,
16 ... Guard wire terminal, 17 ... Force wire terminal, 25 ...
GND line, 26 ... Guard line, 27 ... Force line.

Continued front page    F-term (reference) 2G003 AA07 AG03 AG04 AG08 AH09                 2G011 AA02 AA17 AB06 AB09 AC14                       AC32 AC33 AE01 AE02 AF07                 4M106 BA01 BA14 DD10 DD11

Claims (6)

[Claims] 1. An insulating substrate (1) and the insulating substrate (1)
A measuring needle (2) formed on the insulating substrate (1), a connecting terminal (3) formed on the insulating substrate (1), the measuring needle (2) and the connecting terminal formed on the insulating substrate (1). (3) and a signal conductor pattern for electrically connecting the measuring needle (2), the signal conductor pattern, and the connection terminal (3), each for sending a signal for test measurement. A force line (7, 17, 27) is formed around the force line (7, 17, 27) so as to be insulated and separated from the force line (7, 17, 27), and has the same potential as the force line. Guard lines (6, 16, 2
6) A probe card comprising: 2. At least one of the measuring needle (2), the signal conductor pattern, and the connection terminal (3) is grounded to the ground potential on the outer circumference of the guard line (6, 16, 26). The probe card according to claim 1, wherein the probe card has a structure having lines (5, 15, 25). 3. The signal conductor pattern according to claim 1, wherein the force line (7) and the guard line (6c, 6d) are arranged on the same plane. The probe card described in 2. 4. A multilayer insulating substrate is used as the insulating substrate (1), and in the signal conductor pattern, the force line (7) is provided through the insulating layers (4b, 4c) to the guard line. The probe card according to any one of claims 1 to 3, which has a structure sandwiched between (6a, 6b). 5. When the signal conductor pattern has the GND line, the signal conductor pattern has the force line (7), the guard lines (6c, 6d), and the GND.
The probe card according to claim 2, wherein the lines (5c, 5d) have a structure arranged on the same plane. 6. When the signal conductor pattern has the GND line, a multi-layer insulating substrate is used as the insulating substrate (1), and in the signal conductor pattern, the force line (7) is an insulating layer. The guard lines (6a, 6) through (4b, 4c).
It is sandwiched between b) and the force line (7) and the guard line (6a, 6b).
Through the insulating layers (4a, 4d), the GND line (5
The probe card according to claim 2 or 5, wherein the probe card has a structure sandwiched between a and 5b).