JP2003306775A - Patterning method for plating - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a patterning method for plating in which no resist is used and no influence is produced upon a pattern mask and which is capable of repeated use and requires relatively low equipment cost and can cope with the recent demand for finer pattern. <P>SOLUTION: In the patterning method for plating, the surface of a substrate is etched, irradiated with plasma using a pattern mask together, and then subjected to catalyst treatment and electroless plating. <P>COPYRIGHT: (C)2004,JPO

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating patterning method for forming a metal layer having a pattern on the surface of a non-conductive substrate for forming an electric circuit or applying various designs. About. 2. Description of the Related Art The following four methods have been known as methods for forming plating having a pattern such as an electric circuit on a surface of a non-conductive substrate or the like by utilizing chemical plating. However, each method had advantages and disadvantages, and had disadvantages. Specifically, it is as follows. [0003] Photoetching using a resist:
A photoresist and residual metal removal step is required. Metal deposition using a pattern mask: The equipment cost is large, the operation is complicated and it takes a long time, and since the metal is deposited on the pattern mask, its removal or periodic replacement is required. [0004] Thermal spraying using a pattern mask: The damage to the substrate is large, the equipment cost is large, it is not possible to cope with the formation of a fine pattern, and since metal is deposited on the pattern mask, its removal or periodic replacement is necessary. Become. [0005] Patterning of plating by ultraviolet rays (Japanese Patent Application Laid-Open No. Hei 6-77626): Since ultraviolet rays have a high heating power with respect to the deactivating power of the plastic substrate surface, the distance from the ultraviolet lamp to the plastic substrate and the deactivating power are high. Is difficult to adjust, and sufficient plating patterning cannot be performed, which is not practical as a plating circuit forming method. As described above, there is a need for a plating patterning method which can be used repeatedly without using a resist, has no influence on a pattern mask, has relatively small equipment cost, and can cope with a fine pattern. Was. The present invention solves the above-mentioned conventional problems, that is, it can be used repeatedly without using a resist and without affecting a pattern mask. It is an object of the present invention to provide a plating patterning method that has a relatively small facility cost and can handle a fine pattern. [0008] In order to solve the above-mentioned problems, the plating patterning method of the present invention, as described in claim 1, etches the surface of a base material and then uses a pattern mask together with the etching. Irradiating the substrate surface with plasma, and then performing a catalyst process, is a plating patterning method of performing electroless plating.With such a configuration, without using a resist, it is also possible to use a pattern mask. It has no effect, can be used repeatedly, has relatively low equipment cost, and can handle fine patterns. DETAILED DESCRIPTION OF THE INVENTION In the plating patterning method of the present invention, a base material requires a catalyst such as an ABS resin having an acrylonitrile-butadiene-styrene copolymer, polyester, polycarbonate, polyacetal and the like. Any material can be used as long as it is made of a material in which the electroless plating method exists. The portion of the substrate to be plated is subjected to a degreasing treatment with an organic solvent, a neutral detergent or the like, if necessary.
Removes fingerprints, oils, dirt, etc. on the surface. Next, an etching process is performed (an image diagram is shown in FIG. 1A). The etching needs to be performed on one surface of the portion of the base material to be plated. This etching chemically roughens the base material surface so that an anchor effect can be obtained between the base material surface and the plating layer. At the same time, a carboxyl group (—COOH) and a sulfone group (—SO ₃ H) are introduced into the substrate surface by this etching. Such etching is achieved by using, for example, chromic anhydride and sulfuric acid in combination. After that, the chemical used at the time of etching must be sufficiently washed and removed. When chromic anhydride is used, reduction is performed if necessary, and then sufficient washing is performed with dilute hydrochloric acid, water, or the like. Thereafter, the substrate surface is irradiated with plasma by using a pattern mask together (FIG. 1B shows an image diagram). Due to this plasma treatment, the portion irradiated with the plasma has a reduced amount of catalyst adsorbed by the later-described catalyst treatment, and as a result, a plating layer is not formed by electroless plating. Therefore, as a pattern mask,
A plate having a "negative pattern" which is inverted with respect to a plating pattern to be formed is used. Since the pattern mask is merely irradiated with plasma, if a durable material, for example, a plastic film such as stainless steel or polyimide is used, the pattern mask can be used semipermanently repeatedly. [0015] The plasma irradiation condition is not required as long as the plating layer is not finally formed on the irradiated portion, and the substrate may be thermally deformed under a long-time treatment or under severe conditions. It is performed under as mild a condition as possible. According to a method capable of subjecting a substrate to a plasma treatment in a radical state, inactivation of a functional group such as a carboxyl group or a sulfone group which assists in providing a catalyst can be effectively achieved. Here, plasma treatment using oxygen gas is more preferable than using nitrogen gas because a higher effect can be obtained. After the plasma irradiation process, a catalyst process is performed (an image diagram is shown in FIG. 1C). This is a step of adsorbing a palladium-tin complex complex compound as a catalyst on a portion of the etched substrate surface that has not been irradiated with plasma. After the catalyst treatment, when the substrate is made of an acrylonitrile-butadiene-styrene copolymer resin, an accelerator treatment with hydrochloric acid or dilute hydrochloric acid is performed to remove excess tin and activate palladium. Next, electroless plating is performed (FIG. 1D).
Is shown in the image). Various electroless plating baths are commercially available. In the present invention, any plating bath capable of imparting a catalyst can be applied, and a plating bath of copper, nickel, silver, gold, cobalt, or the like can be used. After plating, washing is performed if necessary. The plated portion formed by the electroless plating may be used as an electrode, and the same metal or a different metal may be further electroplated. The following is a specific description of the plating patterning method of the present invention. <Degreasing treatment of substrate surface> Acrylonitrile as base material
10cm × 5c made of butadiene-styrene copolymer
A flat plate (hereinafter, “substrate”) having a thickness of 3 mm and a thickness of 3 mm was used. This substrate was washed with Okuno Pharmaceutical Co., Ltd. detergent A-screen A-22.
The sample was immersed in a 50 g / L aqueous solution (about 50 ° C.) for 4 minutes, washed by vibrating in the solution, and then washed with water. <Etching treatment> As an etching solution, an aqueous solution was prepared by adding water to 400 g of chromic anhydride and 400 g of concentrated sulfuric acid to make 1 L. The substrate is immersed in this etching solution maintained at 68 ° C. for 10 minutes to perform an etching treatment on the surface on which the plating layer is formed, and then washed with a 5% by weight aqueous solution of sodium hydrogen sulfite to remove the remaining hexavalent chromium. To trivalent,
Thereafter, the surface was washed with dilute hydrochloric acid to remove chromium on the surface. When the obtained substrate was analyzed by XPS (X-ray photoelectron spectroscopy), it was confirmed that a carboxyl group and a sulfone group were introduced on the surface. <Plasma Treatment> A stainless steel (SUS-304) pattern mask (a negative pattern) having a desired circuit shape was brought into close contact with the substrate surface to perform a plasma treatment. Irradiation was performed for 10 minutes at an interelectrode treatment of 40 mm, a sample position as a lower electrode, an RF power source of 150 W, an oxygen gas as a gas type, and a pressure of 27 Pa. XPS analysis of the surface confirmed that there was no change in the carboxyl group and the sulfone group in the masked portion, but it was confirmed that both the carboxyl group and the sulfone group were reduced in the plasma-treated portion. <Catalyst treatment> A palladium-tin complex compound (Catalyst C 40 mL, Okuno Pharmaceutical Co., Ltd.) was added to water together with 150 mL of concentrated hydrochloric acid to water to obtain a 1 L catalyst solution (room temperature). ) For about 3 minutes, lifted, and then immersed in dilute sulfuric acid at 40 ° C. for 5 minutes to perform accelerator treatment (when dilute hydrochloric acid is used, the temperature is preferably 35 ° C.). <Electroless Plating Treatment> A plating treatment for 7 minutes using a TMP chemical nickel plating bath (30 ° C.) manufactured by Okuno Pharmaceutical Co., Ltd., which was previously adjusted to pH 8.5 to 9.5 with an aqueous ammonia solution. Was done. As a result of observing the obtained plated portion in detail, it was confirmed that the plated portion was formed into a desired shape (a negative image of the pattern mask used in the plasma treatment) and the plating thickness was about 0.3 μm. The plating patterning method of the present invention comprises:
This is an excellent plating patterning method.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an image view showing each step of a plating patterning method of the present invention. (A) Etching treatment (b) Plasma irradiation treatment on substrate surface using pattern mask together (c) Catalyst treatment (d) Electroless plating treatment

   ────────────────────────────────────────────────── ─── Continuation of front page    (72) Inventor Zheng Wei             1500 Yajuku Sogyo Co., Ltd., Susono City, Shizuoka Prefecture             Inside (72) Inventor Yoshihiko Watanabe             1500 Yajuku Sogyo Co., Ltd., Susono City, Shizuoka Prefecture             Inside F term (reference) 4K022 AA11 AA23 AA41 AA42 BA01                       BA03 BA06 BA08 BA14 BA35                       CA07 CA29 DA01                 5E343 AA02 AA37 BB44 BB71 CC38                       CC43 CC50 CC52 CC54 CC73                       DD33 EE36 ER02 GG08 GG11

Claims (1)

Claims: 1. After etching a substrate surface, irradiating the substrate surface with plasma using a pattern mask, performing a catalyst process, and then performing electroless plating. A patterning method for plating.