JP2003300255A - Film sticking method, fixture for sticking film, and film sticking apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a film sticking method eliminating necessity for cutting a film after sticking to prevent the wasteful consumption of the film, generating no warpage or crack in a substrate after the sticking of the film and not involving air bubbles. <P>SOLUTION: After the film 3 to be cut is arranged above the substrate 4 so as to expand the central part of the film 3 downwardly when the film is placed in a vacuum atmosphere, the vacuum atmosphere is generated to press the film 3 to the substrate 4 from the central part thereof so that the film 3 goes outwardly from the central part thereof. This film 3 is pressed and sticked to the substrate 4 in a heated state to be cooled while pressed. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film sticking method, a film sticking jig, and a film sticking apparatus. In particular, the present invention relates to a film sticking method, a film sticking jig, and a film sticking device for sticking films in a single-wafer manner.

[0002]

2. Description of the Related Art A substrate such as a semiconductor wafer having an electronic circuit formed thereon is coated with a film on its front surface or back surface for various purposes.

As a film sticking technique, a technique of sticking a roll-shaped film is known. For example,
It is described as a conventional technique in Japanese Patent Laid-Open No. 2001-210701.

Description will be made with reference to FIG. While the semiconductor wafer 102 is placed on the table 101 in the air, the adhesive film 103 is stretched over the vicinity of the semiconductor wafer 102 while being inclined, and the adhesive film 103 is pressed by the rolling roller 104. A method of attaching to the upper surface of the semiconductor wafer 102 is known. Also, in the case of sticking an adhesive film on the uneven surface where the electronic circuit is formed as in the back grinding process, similarly, the semiconductor wafer is kept parallel to the sticky adhesive film and the adhesive film is attached. It is a method in which the semiconductor wafers are made parallel to each other in an inclined state and brought close to each other, and the adhesive film is directly attached to the entire concavo-convex surface of the semiconductor wafer 102 with the rolling roller.

However, the technique of sticking a roll-shaped film consumes more than the required amount of film.

Further, as pointed out in Japanese Patent Laid-Open No. 2001-210701, there are the following problems. If air is trapped when the adhesive film 103 is attached to the semiconductor wafer 102 in the air as described above, the air is trapped between the semiconductor wafer 102 and the adhesive film 103 as shown in FIG. With bubbles 10
6 is made. As a result, when ultraviolet rays are irradiated after the back grinding process or the dicing process is completed, the air trapped in the air bubbles 106 does not impede the curing due to the crosslinking reaction and the adhesive force does not decrease.
At the peripheral portion of 6, the adhesive 107 remains, and the adhesive film 103 is still attached to the semiconductor wafer 102. Therefore, workability at the time of peeling the adhesive film 103 is reduced, and the organic adhesive is used as the semiconductor wafer 10.
If it remains 2, the product reliability will be reduced. Particularly recently, the thickness of the semiconductor wafer 102 is 1
The back surface may be thinly ground to a thickness of 00 μm or less, and further to 50 μm or less, but with such a thickness, the chip of the semiconductor wafer 102 cannot be pushed up from below with the pin in the bonding process from below the adhesive film 103. In order to pick up the chip by slightly pushing up the adhesive film 103, the bubbles 1
If the adhesive 107 remains on the peripheral portion of 06, there is a problem that the pickup cannot be reliably executed.

The technique described in Japanese Patent Application Laid-Open No. 2001-210701 is to solve such a problem. That is, when attaching the adhesive film to the semiconductor wafer, the generation of bubbles between the semiconductor wafer and the adhesive film is reduced,
In addition, even if bubbles are generated, air is prevented from entering into the bubbles and avoids obstruction by the air when irradiated with ultraviolet rays, and reliably reduces the adhesive force of the adhesive film over the entire area of the semiconductor wafer. It is intended to improve the workability in peeling off the wafer and the pick-up property of the thin plate chip, and to improve the reliability of the product by not leaving a part of the adhesive on the semiconductor wafer.

Therefore, as shown in FIG. 7, the enclosed space 1
The semiconductor wafer 102 and the adhesive film 103 are held in a state of facing each other in 14 and the sealed space is replaced with a nitrogen atmosphere, and then the adhesive film 103 is pressed and attached to the semiconductor wafer 102.

However, this technique allows the presence of bubbles even though they are nitrogen gas bubbles, and is accompanied by the complexity that a nitrogen gas atmosphere has to be provided. Furthermore, it is a technology that is premised on the irradiation of ultraviolet rays after the film is attached.

On the other hand, as a technique of using a cut film instead of a roll-shaped film, Japanese Patent Laid-Open No. 07-045555
There is a technique described in Japanese Patent No. FIG. 8 shows the process.

In this technique, the tape 201 is attached to the frame ring 206 while being tensioned in all directions, and the tape 201 attached to the frame ring 206 is attached to the wafer 209.
In the deaeration atmosphere, the soft rubber pad 210 is pressed and adhered. Then, the tape 201 is affixed to the frame ring 206 with tension in all directions.
Since No. 01 is adhered to the wafer 209, no wrinkles or wrinkles occur between the adhesive surfaces of the wafer 209 and the tape 201. Further, since the wafer 209 is adhered to the tape 201 in a degassing atmosphere, air bubbles do not remain between the tape 201 and the wafer 209. Further, when the tape 201 is attached to the wafer 209, the rubber pad 210 is pressed against the tape 201 on the wafer 209, so that there is an effect that it is possible to reliably prevent the remaining of air bubbles and the occurrence of lumps and wrinkles.

However, with the technique described in Japanese Patent Laid-Open No. 07-045559, it is possible to surely prevent the remaining of bubbles and the generation of wrinkles and wrinkles, but in reality, the remaining of bubbles is unavoidable.

On the other hand, although not described in the above publication, the substrate is heated when the film is attached.

However, there is a problem in that after the film is attached, the substrate may be warped for unknown reasons, or if the substrate is thin, the substrate may be cracked.
When the substrate is warped, the characteristics of the device formed on the substrate are impaired, and processing in the next step (for example, dicing step) becomes impossible.

[0015]

DISCLOSURE OF THE INVENTION The present invention has been made as a result of intensive studies in view of such a situation, and an object thereof is to solve all the problems of the above-mentioned prior art. .

It is an object of the present invention to provide a film sticking method which does not require cutting of the film after sticking.

An object of the present invention is to provide a film sticking method that does not waste film.

It is an object of the present invention to provide a film sticking method in which the substrate is not warped or cracked even after the film is stuck.

It is an object of the present invention to provide a film sticking method which does not involve air bubbles.

It is an object of the present invention to provide a film sticking jig which allows sticking of a film without entrainment of bubbles and without warping or cracking of the substrate.

[0021]

[Means for Solving the Problems] The method for attaching a film according to the present invention is such that, when the film is placed in a reduced pressure atmosphere, the cut film is arranged above the substrate so that the central portion of the film swells downward. , A reduced pressure atmosphere, and then
It is characterized in that the film is pressed against the substrate from the central portion toward the outside.

The film sticking method of the present invention is a film sticking method for sticking a film on a surface of a substrate,
It is characterized in that the film is pressed and attached to the substrate in a heated state and cooled while being pressed.

The film sticking jig substrate of the present invention has a bottom portion on which the substrate is placed and a rising portion rising from the periphery of the bottom portion, and the cut film is placed on the upper surface of the rising portion. It is characterized by having done. The film sticking apparatus of the present invention is a film sticking apparatus for sticking a film on a substrate by pressing the film in a vacuum, wherein the pressing member is constituted by a diaphragm movable by the pressure of gas, and the gas is heated. It is characterized in that a means for cooling and a means for cooling are provided.

[0024]

[Operation and Modes for Carrying Out the Invention] Also in the technique described in Japanese Patent Application Laid-Open No. 7-45559, the film is attached in a degassing atmosphere. However, since the film is attached while being tensioned in all directions, the tension state is maintained even when the film is placed in a reduced pressure atmosphere.

The present inventor has found that when the film is placed in a reduced pressure environment, the central part of the film bulges downward. When the bulge occurs, the bulge becomes a barrier of the gas flow path. When a barrier is created in the center, the gas will naturally flow outwards. Therefore, if the film is attached to the substrate from the inflated part toward the outside, the gas that remains even under the reduced pressure environment will be pushed out, and the film can be attached to the substrate without entraining bubbles. It will be possible.

When the cut film is supported at its periphery and arranged so as to face the substrate and then a reduced pressure atmosphere is applied, the central portion swells downward.

In order to hold the cut film in the periphery thereof and arrange it so as to face the substrate, for example, a bottom portion for mounting the substrate and a rising portion rising from the periphery of the bottom portion are provided. It is preferable to use a film sticking jig characterized in that the cut film is placed on the upper surface of the section.

[0028]

[Example] (Example 1)

The jig used in this example is shown in FIG.

This jig 7 is disclosed in Japanese Patent Laid-Open No. 2001-21070.
It has an extremely simple structure as compared with the device shown in Japanese Patent Publication No. That is, it has a bottom portion 1 and a rising portion 2 that rises from the periphery of the bottom portion. In the example shown in FIG. 1, the bottom portion 1 has a step, the lower step has the same diameter as the substrate, and the substrate 4 is placed on this lower step.

The jig 7 can be made of plastic, metal, ceramic or any other material. In addition, because of its structure, it can be molded and can be mass-produced at low cost.

The cut film 3 may be placed on the upper surface 5 of the rising portion 2 of the jig. The diameter of the cutting film 3 is the same as the outer diameter of the jig 7 in the example shown in FIG. In this case, the periphery of the film 3 (the portion corresponding to the upper surface 5) may be pressed from the back surface of the film 3 so that the film 3 does not drop. Alternatively, an adhesive (for example, an adhesive having a weak adhesive strength of 10 gf / 25 mm or less at room temperature) may be applied around the film 3 and temporarily fixed to the upper surface 5. The amount of swelling of the film in a reduced pressure atmosphere varies depending on the material of the film, the thickness of the film, the pressing force on the upper surface 5, etc., but the specific material, thickness and pressing force may be obtained by experiments. . In addition, as the material, the elastic coefficient is small, the thickness is thin, and the pressing force is small, the bulge is likely to occur.

On the other hand, in the example shown in FIG. 2, the cutting film 3 is made larger than the outer diameter of the jig 7. In this case, the protruding portion 6 functions as a weight and serves as a substitute for the pressing force shown in FIG. Even if the central portion swells due to the reduced pressure atmosphere, the film 3 does not fall from the jig 7. The length of the protruding portion 6 may be appropriately adjusted. Further, only the protruding portion 6 may be made heavy.

In both cases of FIG. 1 and FIG. 2, the film 3 is used.
Are preferably placed on the substrate 4 without tension. In the case of arranging without tension, the central portion tends to bulge downward when a reduced pressure atmosphere is reached. In addition,
Even when placed without tension, no tarmi or wrinkles are observed.

The film 3 swells downward in the central portion when placed in a vacuum atmosphere, but it is preferable that the central portion contact the surface of the substrate 4 in the swollen state. When the central portion of the film 3 comes into contact with the substrate 4, that portion becomes a gas wall. Therefore, the gas is carried to the open part (that is, in the outer peripheral direction) having no wall. As a result, gas entrapment is further prevented.

In order for the central portion of the film 3 to contact the surface of the substrate 4 when the film 3 swells, it is preferable to reduce the distance between the film 3 and the substrate 4. Further, although it is also affected by the degree of vacuum, the elasticity of the film, the thickness of the film 3, and the pressing force of the film 3, this can also be obtained by an experiment by changing the conditions for a specific material.

The film 3 is coated with an adhesive layer on its surface (side surface of the substrate). Alternatively, the substrate 4 may be coated with an adhesive layer. When the adhesive layer is applied to the substrate 4, spin coating is preferably used. In particular, if the substrate 4 is set on the jig 7 shown in FIGS. 1 and 2 and the jig 7 is rotated, spin coating can be performed in the set state. From this point, the usefulness of the above jig is recognized. When the jig 7 is not used, the substrate itself is rotated for spin coating and then placed in the vacuum chamber 20 (FIG. 3). However, in this case, the risk of contaminating the adhesive layer formed on the substrate before the placement in the vacuum chamber 20 increases.

After the film 3 is placed on the film sticking jig 7 shown in FIG. 1 or 2, the jig 7 is introduced into a vacuum device.

The vacuum device is shown in FIG. The vacuum device 10 is
A vacuum chamber 20 is formed by the outer wall 17. Vacuum chamber 2
A pressing member 16 that can move up and down is provided in the position 0.
A vacuum pump 11 is connected to the vacuum chamber 20. The above is the basic configuration of the vacuum device. The structure is extremely simple, and a general vacuum device can be easily diverted simply by providing a pressing member. In this example, the pedestal 15 is provided for mounting the jig, but it is not always necessary. A heater 12 is embedded in the pedestal 15 as a heating means. The heating means is for heating the substrate or the film, and its setting place and method are arbitrary as long as the object can be achieved. For example, an infrared lamp may be radiated for heating, or a heater may be provided outside the vacuum device to heat the entire vacuum chamber.

In this example, a sensor 13 for detecting the temperature and a controller 14 for controlling the temperature by the signal from the sensor 13 are further provided. Further, the temperature control in the vacuum chamber may be performed manually. The temperature is preferably variable in the range of room temperature to 250 ° C. This makes it possible to set temperatures corresponding to the temperature for setting the substrate, the temperature for melting the adhesive, the temperature for attaching the film, and the temperature for taking out the substrate.

After the substrate and the film are set on the film sticking jig, they are placed on the pedestal 15 in the vacuum device 10.

Next, the vacuum device 1 is operated by the vacuum pump 11.
The vacuum chamber 20 of 0 is set to a reduced pressure atmosphere. The reduced pressure atmosphere causes the central portion of the film 3 to bulge downward. Next, the heater 12 is turned on to raise the substrate temperature. When the substrate temperature reaches a predetermined temperature, the pressing member 16 is lowered to press the film 3 onto the substrate 4. The lower surface of the pressing member 16 has a semicircular shape, and the film is attached from the central portion toward the outer peripheral portion.

The pressure at the time of pressurization is 0.1 to 0.5 Mp.
a / cm ² is preferred.

After the attachment is completed, the heater 12 is turned off and the substrate is cooled. At this time, the pressurized state is maintained. In addition, at the time of cooling, it is preferable that a water cooling device is embedded in the pedestal to perform rapid cooling. Glass transition point (T
Rapid cooling to g) is preferred. Ie 1
It is preferable to cool to a temperature not higher than Tg within minutes.
When the temperature reaches Tg or lower, the pressure may be applied as it is to continue the cooling, or the pressure may be released and the temperature may be gradually cooled to room temperature.

By thus maintaining the pressurized state even during cooling, the film can be attached without causing warpage or cracking even in the case of a thin silicon wafer of 50 μm, for example. .

The film is preferably a plastic film. Examples thereof include polyolefins such as polyethylene and polypropylene or copolymers thereof, polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyvinyl chloride, polyvinyl acetate copolymers and the like.

Further, those having high flexibility are preferable. The thickness of the film is preferably 10 to 100 μm. With such a thickness, a bulge in a vacuum atmosphere can be obtained more easily. The elastic modulus may be 3000 MPa or less, for example.

The adhesive is not particularly limited. Examples thereof include acrylic resin, silicone resin, natural rubber, synthetic rubber and the like. Any material having tackiness at room temperature may be used. Acrylic resin-based adhesives are preferably used.

The pressing temperature varies depending on the type of film, adhesive, etc., but is usually 150 to 200 ° C.

The distance between the film and the substrate is 0.5 to 5 m.
m is preferable, and 0.5-2 mm is more preferable. With such an interval, the bulge of the film easily contacts the substrate. Further, even if it is 0.5 mm, the gas escapes to the outside on the circumferential side, and the gas is not entrained.

The degree of vacuum in the vacuum atmosphere is preferably high in order to reduce the absolute amount of gas. However, in order to achieve a high degree of vacuum, there is a facility and time burden, so in the present invention, it is preferable to set it to 10,000 Pa or less. That is, in the present invention, even if the gas remains, it is possible to prevent the gas from being entrapped, so that the depressurized state with a relatively low degree of vacuum may be used. It is more preferably 1500 Pa or less.

As the substrate, warpage is likely to occur, for example, 3
It is possible to attach a film without warping or cracking even on a wafer having a diameter of 00 mm or more and without causing entrainment of bubbles.

Further, even if the thickness of the substrate is 50 μm or less, it is possible to attach the film without warping or cracking and without causing bubble entrapment. It goes without saying that a substrate having a thickness of 50 μm or more is also effective.

Further, a liquid crystal substrate, a glass substrate or a magnetic medium substrate may be used. Further, it may be a substrate having unevenness such as bumps for external connection on the surface. Adhesive for stack package on the back side of wafer, bump on board with bump, adhesive on rigid board (copper, iron or other metal board, organic material board, ceramic board), board-to-board It can also be applied to a plurality of laminated layers that are laminated with an adhesive, and a laminated layer of a rigid substrate.

The substrate shape is not particularly limited. It may be circular or rectangular.

(Embodiment 2) FIG. 4 shows another example of the film sticking apparatus.

In this example, a pneumatic diaphragm is used as the pressing member.

The vacuum chamber 10 in this example is of an open / close type. A seal 19 is provided between the upper lid and the lower lid to prevent a leak in the vacuum chamber 10.

At the bottom of the vacuum chamber 10, a heat insulating material 18
Is provided. The pedestal 15 is placed on the heat insulating material 18. The jig 7 is placed on the pedestal 15. Since the heat insulating material 18 is provided, it becomes easy to control the temperature of the pedestal 15 and thus the substrate 4 placed in the jig 7.

A heater A12 is embedded in the pedestal 15. Further, a temperature sensor 13 for measuring the temperature of the substrate 4 or the film 3 is embedded.

On the other hand, a cooling water passage 20 for flowing cooling water to cool the pedestal 15 and further the substrate 4 is formed in the pedestal 15.

In this example, the pressing member 16 is composed of the diaphragm 16 which is movable by pneumatic pressure.

The diaphragm has flexibility.

That is, above the vacuum chamber 20 of the vacuum apparatus 10, the diaphragm 16 having both ends fixed is provided. A space 21 is formed further above the diaphragm 16.

A vacuum line A22 is connected to the space 21 as a line for evacuating the space 21. A gas line A23 for introducing gas (air) into the space 21 is also connected. This gas line A
A heater B24 for heating the introduced gas is provided in the middle of 23.
Is provided. In addition, it is preferable to use a heater that can adjust the gas temperature as the heater B24. In the example shown in the figure, a heater is wound around the outside of the gas pipe forming the gas line A23.

An exhaust line 25 for exhausting the gas in the space 21 is connected to the space 21.

A gas line B having a cooler 27 is connected to the space 21 so that cooling gas can be introduced into the space 21.

This device operates in the following procedure. 1 The substrate 4 and the cut film 4 are set on the jig 7. 2 The jig 7 is placed in the vacuum chamber 20 of the vacuum device 10. 3 Close the top cover. 4 A vacuum is drawn from the vacuum line A22 to make the space 21 a vacuum. At this time, the valves V2, V3 and V4 are closed. 5. The inside of the vacuum chamber 20 is evacuated by vacuuming from the vacuum line B28. 6 Turn on the heater A12 to heat the substrate 4 and the film 3. The temperature is confirmed by the temperature sensor 13. 7 Stop vacuuming from the vacuum line A22. 8 Turn on the heater B24. The heater B24 may be turned on at any time. 9 The valves V2 and V3 are opened, and gas is introduced into the space 21 from the gas line A23. The gas is introduced into the space 21 and is exhausted from the exhaust line 25. The diaphragm 16 is heated by continuing to flow the gas. 10 When the temperature of the diaphragm 16 reaches a predetermined temperature, the valve V3 is closed. The introduction of gas from the gas line A23 continues. 11 The diaphragm 16 starts to bend from the central portion as the pressure in the space 21 increases, and contacts the central portion of the film 3. The diaphragm 16 presses the film 3 from the center to the outside as the gas pressure increases. 12 After maintaining the pressed state for a while, heater A12
Turn off. Meanwhile, the coolant is introduced into the coolant passage 20. Further, the valve 4 is opened to introduce the cooling gas from the gas line B into the space 21. 13 The valve V3 is opened to exhaust gas from the exhaust line 25. However, the pressure in the space 21 is maintained so that the pressure of the diaphragm 16 is maintained. 14 When the cooling progresses and the temperature becomes lower than a predetermined temperature, the evacuation from the vacuum line B28 is stopped, the upper lid is opened, and the jig is taken out.

[0069]

According to the present invention, the following various effects can be achieved.

It is not necessary to cut the film after applying the film.

Since a pre-cut film is used, the management of the material is easy, the production quantity is easily controlled, and the waste of the material is reduced.

Even if the substrate is thin, the film can be attached without warping or cracking.

A wafer having a large diameter of 300 mm or more can be attached with a film without entraining bubbles.

[0074]

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an example of an embodiment of a pasting method of the present invention.

FIG. 2 is a cross-sectional view showing another embodiment example of the sticking method of the present invention.

FIG. 3 is a cross-sectional view showing an example of a vacuum device used in the attaching step of the present invention.

FIG. 4 is a cross-sectional view showing another example of a vacuum device used in the attaching step of the present invention.

FIG. 5 is a cross-sectional view showing a conventional example.

FIG. 6 is a cross-sectional view showing a conventional example.

FIG. 7 is a cross-sectional view showing a pasting device according to a conventional example.

FIG. 8 shows a conventional example.

[Explanation of symbols]

1 bottom 2 rising part 3 cut film 4 substrates 5 upper surface 6 protruding part 7 jig 10 Vacuum device (film pasting device) 11 vacuum pump 12 Heating means (heater) 13 sensors 14 Controller 15 pedestal 16 Pressing member (diaphragm) 19 seal 20 vacuum chamber 21 space 22 Vacuum line A 23 Gas line A 24 heater B 25 exhaust line 26 Gas line B 27 Cooler 28 Vacuum line B V1, V2, V3, V4 valves

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Urushijima Road High             1-28-24 Nakamachi, Machida, Tokyo 102 Taisei Building             Utem Co., Ltd. (72) Inventor Isamu Takahashi             18-4 Sakuragaoka-cho, Shibuya-ku, Tokyo             Mu Be Kay Microtech (72) Inventor Hitoshi Hirai             Shizuoka Prefecture Iwata-gun Toyota-cho Otate 485-1 Stock Association             Company mechanical world F-term (reference) 4F211 AG02 AG03 AH36 AM28 AR06                       TA03 TA04 TC02 TD11 TH02                       TH06 TH19 TJ22 TJ30 TN07                       TN67 TQ01 TQ04 TQ07 TQ10                       TQ11 TQ13 TW23

Claims (13)

[Claims] 1. A reduced pressure atmosphere is obtained by arranging the cut film above the substrate so that the central portion of the cut film bulges downward when placed in a reduced pressure atmosphere, and then outward from the central portion. A film sticking method, characterized in that the film is pressed against the substrate toward the substrate. 2. A method of attaching a film, comprising supporting the cut film in the periphery thereof and arranging the film so as to face the substrate, and then applying a reduced pressure atmosphere, and then pressing the film from the central portion outward to the substrate. 3. The film is adapted to come into contact with the substrate surface when the central portion swells.
Or the film sticking method described in 2. 4. The film sticking method according to claim 1, wherein an adhesive layer is formed on the surface of the film facing the substrate. 5. The film sticking method according to claim 1, wherein an adhesive layer is applied to the surface of the substrate. 6. The film sticking method according to claim 5, wherein the adhesive is applied by spin coating. 7. A substrate is placed on the bottom of a film sticking jig having a bottom for placing the substrate and a rising portion rising from the periphery of the bottom, and after the film is placed on the rising portion, the curing is performed. The film sticking method according to any one of claims 1 to 6, wherein the tool is introduced into a vacuum atmosphere. 8. The film is pressed and attached to a substrate in a heated state, and the film is cooled while being pressed.
8. The film sticking method according to any one of 7 to 7. 9. A film sticking method for sticking a film on a surface of a substrate, wherein the film is pressed and stuck to the substrate in a heated state, and the film is cooled while being pressed. 10. The film sticking method according to claim 9, wherein the sticking is performed in a reduced pressure atmosphere. 11. A substrate for placing a substrate and a rising portion rising from the periphery of the bottom portion, and the cut film is placed on the upper surface of the rising portion. Jig for film sticking. 12. The film sticking jig according to claim 11, wherein a heating means is provided in the bottom portion. 13. A film sticking apparatus for sticking a film on a substrate by pressing the film in vacuum, wherein the pressing member is composed of a diaphragm movable by the pressure of gas, and is for heating the gas. A film sticking apparatus provided with a means and a means for cooling.