JP2003298033A - Imaging element - Google Patents
Imaging elementInfo
- Publication number
- JP2003298033A JP2003298033A JP2002093002A JP2002093002A JP2003298033A JP 2003298033 A JP2003298033 A JP 2003298033A JP 2002093002 A JP2002093002 A JP 2002093002A JP 2002093002 A JP2002093002 A JP 2002093002A JP 2003298033 A JP2003298033 A JP 2003298033A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- image pickup
- protective member
- elastic member
- image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、被写体光を光電的
に取り込むことで被写体画像を得る撮像素子に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image pickup device that obtains a subject image by photoelectrically capturing subject light.
【0002】[0002]
【従来の技術】近年急速に普及しているデジタルカメラ
やビデオカメラの本体内には、被写体光を光電信号に変
換して画像を記録するCCDイメージセンサなどの撮像
素子が組み込まれている。2. Description of the Related Art In recent years, main bodies of digital cameras and video cameras, which have been rapidly popularized, incorporate an image pickup device such as a CCD image sensor for converting an object light into a photoelectric signal to record an image.
【0003】従来の撮像素子は、受光面に複数の受光素
子がマトリクス状に配列された撮像チップを、光透過性
の透明なガラス板またはプラスチック板などからなり、
撮像チップの受光面を保護する保護部材と、受光面と対
向する面側から撮像チップを保持するベース部材とで形
成されたパッケージの内部に固定した構成になってい
る。この撮像素子は、パッケージの内部に塵やゴミなど
の異物が混入して撮像チップ表面へ付着することによ
り、撮影画像の読み取り精度が低下することがないよう
に、クリーンルームなどの清浄な環境で作製される。A conventional image pickup device comprises an image pickup chip in which a plurality of light receiving devices are arranged in a matrix on a light receiving surface, and is made of a transparent glass plate or a plastic plate having a light transmitting property.
It is configured to be fixed inside a package formed by a protection member that protects the light receiving surface of the image pickup chip and a base member that holds the image pickup chip from the side facing the light receiving surface. This image sensor is manufactured in a clean environment such as a clean room so that foreign substances such as dust and dirt get inside the package and adhere to the surface of the image sensor chip, which does not reduce the accuracy of reading captured images. To be done.
【0004】上記のような撮像素子では、保護部材が撮
像チップに接近して設けられることが多く、撮像チップ
の受光面は画像の結像面であるため、結像面に近い位置
にある保護部材表面に付着した塵やゴミなどが撮影時に
画像の一部として読み取られてしまう場合がある。In the image pickup device as described above, the protective member is often provided close to the image pickup chip, and since the light receiving surface of the image pickup chip is the image forming surface of the image, the protective member is located near the image forming surface. Dust and dust adhering to the surface of the member may be read as part of the image at the time of shooting.
【0005】[0005]
【発明が解決しようとする課題】上記のような撮影画像
への影響は、保護部材と撮像チップとの間隔が空いてい
るほど軽減される。したがって、保護部材に塵やゴミな
どが付着した場合でも撮影画像に影響を与えないために
は、保護部材と撮像チップとの間隔がある程度空いてい
ればよい。しかしながら、保護部材と撮像チップとの間
隔を単純に空けるだけでは、空けた分だけ撮像素子の厚
みが大きくなるため、製品の小型化という観点からは好
ましくない。The influence on the photographed image as described above is alleviated as the distance between the protective member and the image pickup chip is increased. Therefore, in order to prevent the captured image from being affected even if dust or dirt adheres to the protective member, it is sufficient that the protective member and the imaging chip are spaced to some extent. However, if the space between the protective member and the imaging chip is simply opened, the thickness of the imaging element is increased by the space, which is not preferable from the viewpoint of product miniaturization.
【0006】本発明は、撮像チップへの異物の付着を防
ぐとともに、保護部材表面に付着した異物による撮影画
像への影響を軽減させ、製品の小型化をも実現させた撮
像素子を提供することを目的とする。The present invention provides an image pickup device that prevents foreign matter from adhering to the image pickup chip, reduces the influence of the foreign matter attached to the surface of the protective member on the photographed image, and realizes downsizing of the product. With the goal.
【0007】[0007]
【課題を解決するための手段】上記目的を達成するため
に、本発明は、受光面に複数の受光素子が配列された撮
像チップと、この撮像チップを保持するベース部材と、
前記受光面を覆う透明な保護部材とからなる撮像素子に
おいて、前記保護部材と撮像チップとの間に弾性部材を
設け、この弾性部材により前記保護部材を撮像チップか
ら離す方向に付勢すること特徴とする。To achieve the above object, the present invention provides an image pickup chip having a plurality of light receiving elements arranged on a light receiving surface, and a base member for holding the image pickup chip.
In an image sensor including a transparent protective member that covers the light receiving surface, an elastic member is provided between the protective member and the imaging chip, and the elastic member urges the protective member in a direction away from the imaging chip. And
【0008】なお、前記撮像チップの表面側に突出し、
前記保護部材が弾性部材の付勢に抗して押圧されたとき
に、前記撮像チップとの接触を阻止するストッパーを備
えることが好ましい。It should be noted that the above-mentioned image pickup chip is projected to the surface side,
It is preferable to provide a stopper that prevents contact with the imaging chip when the protective member is pressed against the bias of the elastic member.
【0009】[0009]
【発明の実施の形態】図1に、本発明を実施した撮像素
子の断面図を示す。撮像素子2は、受光面3aに複数の
受光素子が配列された撮像チップ3と、撮像チップ3の
受光面3aを保護する保護部材4と、受光面3aと対向
する面側から撮像チップ3を保持するベース部材5と、
弾性部材6とから構成される。保護部材4は、光透過性
の透明なガラス板またはプラスチック板などからなる。
ベース部材5の背面には、図示しないフレキシブル回路
基板が取り付けられており、このフレキシブル回路基板
に撮像チップ3が接続され、撮像チップ3からの受光信
号が出力される。なお、保護部材4は、カメラの撮影レ
ンズの一部、あるいはローパスフィルタであってもよ
い。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a sectional view of an image pickup device embodying the present invention. The image pickup element 2 includes an image pickup chip 3 in which a plurality of light receiving elements are arranged on a light receiving surface 3a, a protective member 4 for protecting the light receiving surface 3a of the image pickup chip 3, and the image pickup chip 3 from the side facing the light receiving surface 3a. A base member 5 to hold,
And an elastic member 6. The protection member 4 is made of a transparent glass plate or a plastic plate that is transparent to light.
A flexible circuit board (not shown) is attached to the back surface of the base member 5, the image pickup chip 3 is connected to the flexible circuit board, and a light reception signal from the image pickup chip 3 is output. The protection member 4 may be a part of the taking lens of the camera or a low pass filter.
【0010】弾性部材6は略蛇腹形状をしており、保護
部材4を撮像チップ3から離す方向(X方向)に付勢し
ている。この弾性部材6の両端部は、受光面3aの受光
素子が形成されていない部分と、この部分と対向する保
護部材4の面とにシリコン系接着剤などで固着されてい
る。これら保護部材4、ベース部材5および弾性部材6
で撮像チップ3が密閉され、撮像チップ3への塵やゴミ
などの異物の混入を防止している。なお、この撮像素子
2は、内部に塵やゴミなどの異物が混入することがない
ように、クリーンルームなどの清浄な環境で作製され
る。The elastic member 6 has a substantially bellows shape and urges the protection member 4 in a direction (X direction) away from the image pickup chip 3. Both ends of the elastic member 6 are fixed to a portion of the light-receiving surface 3a where the light-receiving element is not formed and a surface of the protection member 4 facing this portion with a silicone adhesive or the like. These protective member 4, base member 5 and elastic member 6
The image pickup chip 3 is hermetically sealed by the above to prevent foreign matter such as dust and dirt from entering the image pickup chip 3. The image pickup device 2 is manufactured in a clean environment such as a clean room so that foreign matters such as dust and dirt are not mixed therein.
【0011】(A)に示すように、撮像素子2を使用す
る際には、弾性部材6は保護部材4をX方向に付勢した
状態となっており、これにより撮像チップ3と保護部材
4との間隔が空けられる。一方、撮像素子2の非使用時
には、(B)に示すように、弾性部材6は付勢に抗して
縮んだ状態となる。このとき、撮像チップ3と保護部材
4とが互いに干渉しない距離L1をもってこの状態が保
持される。したがって、非使用時には撮像素子2の厚み
を小さくしておくことができる。As shown in (A), when the image pickup device 2 is used, the elastic member 6 is in a state of biasing the protective member 4 in the X direction, whereby the image pickup chip 3 and the protective member 4 are made. Can be separated from. On the other hand, when the image sensor 2 is not used, the elastic member 6 is in a contracted state against the bias as shown in (B). At this time, this state is maintained at a distance L1 at which the image pickup chip 3 and the protection member 4 do not interfere with each other. Therefore, the thickness of the image sensor 2 can be reduced when not in use.
【0012】撮像チップ3は、保護部材4、ベース部材
5および弾性部材6により囲まれる空間内に密閉されて
いる。このため、この空間内に塵やゴミなどの異物の混
入するおそれがなく、撮像チップ3の表面へ異物が付着
することもない。The image pickup chip 3 is sealed in a space surrounded by the protective member 4, the base member 5 and the elastic member 6. Therefore, there is no possibility that foreign matter such as dust or dirt will be mixed into this space, and no foreign matter will adhere to the surface of the imaging chip 3.
【0013】撮像素子2を使用する場合、弾性部材6は
保護部材4をX方向に付勢した状態となっており、撮像
チップ3と保護部材4との間隔が空けられ、結像面であ
る受光面3aから離れるようになる。したがって、もし
保護部材4に塵やゴミなどが付着した場合でも、撮影画
像への影響を軽減することが可能である。また、撮像素
子2の非使用時には、弾性部材6は付勢に抗して縮んだ
状態となる。このため、撮像素子の小型化も実現でき
る。When the image pickup device 2 is used, the elastic member 6 is in a state of urging the protective member 4 in the X direction, and the image pickup chip 3 and the protective member 4 are spaced apart from each other to form an image plane. It comes away from the light receiving surface 3a. Therefore, even if dust or dirt adheres to the protective member 4, it is possible to reduce the influence on the captured image. Further, when the image pickup device 2 is not used, the elastic member 6 is in a contracted state against the bias. Therefore, the size of the image sensor can be reduced.
【0014】なお、上記実施形態では、略蛇腹形状の弾
性部材を用いたが、保護部材4を付勢するものであれば
これに限らず、例えばゴム状やスポンジ状のもの、ある
いは圧縮バネやコイルなどを用いてもよい。In the above embodiment, the elastic member having a substantially bellows shape is used, but the elastic member is not limited to this as long as it biases the protective member 4, and may be, for example, a rubber-like or sponge-like one, or a compression spring or the like. A coil or the like may be used.
【0015】また、図2に示すように、受光面3aの受
光素子が形成されていない部分にストッパー11を設け
て、弾性部材6が付勢に抗して縮んだときに保護部材4
が撮像チップ3に接触しないように、距離L2をもって
この状態を保持してもよい。Further, as shown in FIG. 2, a stopper 11 is provided at a portion of the light receiving surface 3a where the light receiving element is not formed, and the protective member 4 is provided when the elastic member 6 contracts against the bias.
This state may be maintained at a distance L2 so that the above does not contact the image pickup chip 3.
【0016】さらに、図3に示すように、本体部20に
沈胴式の鏡胴21を有するカメラに本発明を適用する場
合は、撮影レンズ22の使用時(C)および収納時
(D)に、鏡胴21の移動と連動して弾性部材6を伸縮
させるようにすれば、沈胴時のカメラをコンパクト化す
ることができる。Further, as shown in FIG. 3, when the present invention is applied to a camera having a collapsible lens barrel 21 in the main body 20, when the photographing lens 22 is used (C) and stored (D). If the elastic member 6 is expanded / contracted in conjunction with the movement of the lens barrel 21, the camera when retracted can be made compact.
【0017】[0017]
【発明の効果】以上のように、本発明の撮像素子によれ
ば、保護部材と撮像チップとの間に弾性部材を設け、こ
の弾性部材により保護部材を撮像チップから離す方向に
付勢するので、撮像チップへの異物の付着を防ぐととも
に、保護部材表面に付着した異物による撮影画像への影
響を軽減させ、製品の小型化をも実現させることができ
る。As described above, according to the image pickup device of the present invention, the elastic member is provided between the protective member and the image pickup chip, and the elastic member urges the protective member in the direction away from the image pickup chip. Further, it is possible to prevent foreign matter from adhering to the image pickup chip, reduce the influence of foreign matter adhering to the surface of the protective member on the photographed image, and realize downsizing of the product.
【図1】本発明を実施した撮像素子の断面図であり、
(A)は弾性部材により保護部材4がX方向に付勢され
た状態、(B)は弾性部材が縮んだ状態をそれぞれ示
す。FIG. 1 is a cross-sectional view of an image sensor embodying the present invention,
(A) shows a state in which the protective member 4 is biased in the X direction by the elastic member, and (B) shows a state in which the elastic member is contracted.
【図2】本発明の別の実施形態を示す図である。FIG. 2 is a diagram showing another embodiment of the present invention.
【図3】沈胴式のレンズ鏡胴を有するカメラに本発明を
適用した場合の実施形態を示す図であり、(C)は撮影
レンズ使用時、(D)は収納時をそれぞれ示す。3A and 3B are views showing an embodiment in which the present invention is applied to a camera having a retractable lens barrel, in which FIG. 3C shows a photographing lens in use and FIG.
2 撮像素子 3 撮像チップ 4 保護部材 5 ベース部材 6 弾性部材 10 撮像素子 11 ストッパー 21 レンズ鏡胴 22 撮影レンズ 2 image sensor 3 Imaging chip 4 Protective member 5 Base member 6 Elastic member 10 Image sensor 11 stopper 21 lens barrel 22 Shooting lens
───────────────────────────────────────────────────── フロントページの続き (72)発明者 三沢 岳志 埼玉県朝霞市泉水3−13−45 富士写真フ イルム株式会社内 Fターム(参考) 4M118 AA05 AA10 AB01 BA10 FA06 GC03 GC20 GD03 GD07 HA03 HA27 HA40 5C024 BX01 CY48 EX23 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Takeshi Misawa 3-13-45 Izumi, Asaka City, Saitama Prefecture Fuji Photo Group Within Ilum Co., Ltd. F term (reference) 4M118 AA05 AA10 AB01 BA10 FA06 GC03 GC20 GD03 GD07 HA03 HA27 HA40 5C024 BX01 CY48 EX23
Claims (2)
像チップと、この撮像チップを保持するベース部材と、
前記受光面を覆う透明な保護部材とからなる撮像素子に
おいて、 前記保護部材と撮像チップとの間に弾性部材を設け、こ
の弾性部材により前記保護部材を撮像チップから離す方
向に付勢すること特徴とする撮像素子。1. An image pickup chip in which a plurality of light receiving elements are arranged on a light receiving surface, and a base member for holding the image pickup chip,
In an image sensor including a transparent protective member that covers the light receiving surface, an elastic member is provided between the protective member and the imaging chip, and the elastic member urges the protective member in a direction away from the imaging chip. Image sensor.
保護部材が弾性部材の付勢に抗して押圧されたときに、
前記撮像チップとの接触を阻止するストッパーを備えた
ことを特徴とする請求項1に記載の撮像素子。2. When the protective member is projected toward the front surface side of the imaging chip and is pressed against the bias of the elastic member,
The image pickup device according to claim 1, further comprising a stopper that blocks contact with the image pickup chip.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002093002A JP3832820B2 (en) | 2002-03-28 | 2002-03-28 | Image sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002093002A JP3832820B2 (en) | 2002-03-28 | 2002-03-28 | Image sensor |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2003298033A true JP2003298033A (en) | 2003-10-17 |
JP3832820B2 JP3832820B2 (en) | 2006-10-11 |
Family
ID=29386707
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002093002A Expired - Fee Related JP3832820B2 (en) | 2002-03-28 | 2002-03-28 | Image sensor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3832820B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006100425A (en) * | 2004-09-28 | 2006-04-13 | Casio Comput Co Ltd | Imaging element unit |
-
2002
- 2002-03-28 JP JP2002093002A patent/JP3832820B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006100425A (en) * | 2004-09-28 | 2006-04-13 | Casio Comput Co Ltd | Imaging element unit |
JP4552580B2 (en) * | 2004-09-28 | 2010-09-29 | カシオ計算機株式会社 | Image sensor unit |
Also Published As
Publication number | Publication date |
---|---|
JP3832820B2 (en) | 2006-10-11 |
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