JP2003297818A5 - - Google Patents

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JP2003297818A5
JP2003297818A5 JP2002104011A JP2002104011A JP2003297818A5 JP 2003297818 A5 JP2003297818 A5 JP 2003297818A5 JP 2002104011 A JP2002104011 A JP 2002104011A JP 2002104011 A JP2002104011 A JP 2002104011A JP 2003297818 A5 JP2003297818 A5 JP 2003297818A5
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Prior art keywords
gas
substrate processing
gas supply
processing apparatus
chamber
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JP2002104011A
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Japanese (ja)
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JP2003297818A (en
JP3957549B2 (en
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Priority claimed from JP2002104011A external-priority patent/JP3957549B2/en
Priority to JP2002104011A priority Critical patent/JP3957549B2/en
Priority to KR1020030021100A priority patent/KR100829327B1/en
Priority to US10/406,279 priority patent/US20040025786A1/en
Priority to CN 200510118668 priority patent/CN1789489A/en
Priority to TW092107724A priority patent/TWI222677B/en
Priority to CN2010102436568A priority patent/CN101985747A/en
Priority to CNB2005101186672A priority patent/CN100480421C/en
Priority to CN2008101795814A priority patent/CN101435074B/en
Priority to CNB031093434A priority patent/CN100459028C/en
Publication of JP2003297818A publication Critical patent/JP2003297818A/en
Publication of JP2003297818A5 publication Critical patent/JP2003297818A5/ja
Publication of JP3957549B2 publication Critical patent/JP3957549B2/en
Application granted granted Critical
Priority to US11/933,190 priority patent/US20080251015A1/en
Priority to US11/933,208 priority patent/US7900580B2/en
Priority to US11/933,169 priority patent/US8047158B2/en
Priority to KR1020070110898A priority patent/KR100802232B1/en
Priority to KR1020070110899A priority patent/KR100802233B1/en
Priority to KR1020070115418A priority patent/KR100813367B1/en
Priority to US12/823,001 priority patent/US8261692B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Claims (21)

積層配置された基板を収納する反応室と、  A reaction chamber for storing stacked substrates;
ガス導入部と、  A gas introduction part;
バッファ室と、を備えた基板処理装置であって、  A substrate processing apparatus comprising a buffer chamber,
前記ガス導入部は、前記基板の積層配置方向に沿って設けられ、基板処理用のガスを前記バッファ室に導入し、  The gas introduction part is provided along the stacking arrangement direction of the substrates, introduces a substrate processing gas into the buffer chamber,
前記バッファ室は、前記基板の積層配置方向に沿って設けられた複数のガス供給口を有し、前記ガス導入部から導入される前記処理用ガスを前記複数のガス供給口から前記反応室に供給することを特徴とする基板処理装置。  The buffer chamber has a plurality of gas supply ports provided along the stacking direction of the substrates, and the processing gas introduced from the gas introduction unit is transferred from the gas supply ports to the reaction chamber. A substrate processing apparatus characterized by being supplied.
請求項1に記載の基板処埋装置であって、
前記バッファ室に設けられた前記複数のガス供給口の開口面積がほぼ等しいことを特徴とする基板処埋装置。
The substrate processing apparatus according to claim 1,
The substrate processing apparatus, wherein the plurality of gas supply ports provided in the buffer chamber have substantially the same opening area.
前記ガス導入部には、前記基板の積層配置方向に沿って複数のガス導入口が設けられたことを特徴とする請求項1又は2記載の基板処理装置。The substrate processing apparatus according to claim 1, wherein the gas introduction unit is provided with a plurality of gas introduction ports along a stacking direction of the substrates. 前記ガス導入部は、前記バッファ室の中に設けられたガス供給管を備え、前記ガス供給管には、前記基板の積層配置方向に沿って複数のガス導入口が設けられたことを特徴とする請求項1又は2記載の基板処理装置。The gas introduction unit includes a gas supply pipe provided in the buffer chamber, and the gas supply pipe is provided with a plurality of gas introduction ports along a stacking arrangement direction of the substrates. The substrate processing apparatus according to claim 1 or 2. 前記ガス導入部の前記複数のガス導入口は、上流より下流に向うに従って開口面積が大きくなっていることを特徴とする請求項3記載の基板処理装置。The substrate processing apparatus according to claim 3, wherein an opening area of the plurality of gas introduction ports of the gas introduction portion increases from the upstream side toward the downstream side. 前記バッファ室の前記複数のガス供給口は、前記積層配置された基板のピッチと同ピッチに配置されていることを特徴とする請求項1又は2記載の基板処理装置。3. The substrate processing apparatus according to claim 1, wherein the plurality of gas supply ports of the buffer chamber are arranged at the same pitch as the pitch of the stacked substrates. バッファ室を更にもう1つ備えることを特徴とする請求項1又は2記載の基板処理装置。The substrate processing apparatus according to claim 1, further comprising another buffer chamber. 前記バッファ室の中に、前記基板処理用ガスを活性化させるガス活性部材を設けたことを特徴とする請求項1又は2記載の基板処理装置。The substrate processing apparatus according to claim 1, wherein a gas activation member that activates the substrate processing gas is provided in the buffer chamber. 前記ガス活性部材が、プラズマ発生用の電極であることを特徴とする請求項8記載の基板処理装置。9. The substrate processing apparatus according to claim 8, wherein the gas activation member is an electrode for generating plasma. 前記電極に保護部材を設け、前記バッファ室雰囲気と前記電極とを非接触とすることを特徴とする請求項9記載の基板処理装置。The substrate processing apparatus according to claim 9, wherein a protective member is provided on the electrode so that the buffer chamber atmosphere and the electrode are not in contact with each other. 前記保護部材内に不活性ガスを充填するか、または前記保護部材内を不活性ガスによりパージすることを特徴とする請求項10記載の基板処理装置。11. The substrate processing apparatus according to claim 10, wherein the protective member is filled with an inert gas or the protective member is purged with an inert gas. 前記ガス導入部に接続するリモートプラズマユニットを更に備え、A remote plasma unit connected to the gas introduction unit;
前記リモートプラズマユニットにより活性化された前記基板処理用のガスを前記ガス導入部から前記バッファ室に導入することを特徴とする請求項1又は2記載の基板処理装置。  The substrate processing apparatus according to claim 1, wherein the substrate processing gas activated by the remote plasma unit is introduced into the buffer chamber from the gas introduction unit.
積層配置された基板を収納する反応室と、A reaction chamber for storing stacked substrates;
複数のバッファ室と、  Multiple buffer chambers;
基板処理用のガスを前記複数のバッファ室にそれぞれ導入する複数のガス導入部と、を備えた基板処理装置であって、  A substrate processing apparatus comprising a plurality of gas introduction portions for introducing a substrate processing gas into each of the plurality of buffer chambers,
前記複数のバッファ室は、前記基板の積層配置方向に沿って設けられた複数のガス供給口をそれぞれ有し、前記複数のガス導入部からそれぞれ導入される前記処理用ガスを前記複数のガス供給口から前記反応室にそれぞれ供給することを特徴とする基板処理装置。  The plurality of buffer chambers each have a plurality of gas supply ports provided along a stacking arrangement direction of the substrates, and supply the processing gases respectively introduced from the plurality of gas introduction portions. A substrate processing apparatus, wherein the substrate processing apparatus supplies the reaction chamber through a mouth.
積層配置された基板を収納する反応室と、A reaction chamber for storing stacked substrates;
複数のバッファ室と、  Multiple buffer chambers;
基板処理用のガスを前記複数のバッファ室にそれぞれ導入する複数のガス導入部と、を備えた反応容器であって、  A plurality of gas introduction portions for introducing substrate processing gases into the plurality of buffer chambers, respectively,
前記複数のバッファ室は、前記基板の積層配置方向に沿って設けられた複数のガス供給口をそれぞれ有し、前記複数のガス導入部からそれぞれ導入される前記基板処理用のガスを前記複数のガス供給口から前記反応室にそれぞれ供給することを特徴とする反応容器。  The plurality of buffer chambers each have a plurality of gas supply ports provided along the stacking direction of the substrates, and the substrate processing gases respectively introduced from the plurality of gas introduction portions are supplied to the plurality of buffer chambers. A reaction vessel that is supplied to each of the reaction chambers from a gas supply port.
前記複数のガス導入部の少なくとも一つは、前記基板の積層方向に沿っAt least one of the plurality of gas introduction portions is along a stacking direction of the substrates. て設けられていることを特徴とする請求項14記載の反応容器。The reaction container according to claim 14, wherein the reaction container is provided. 積層配置された基板を収納する反応室と、A reaction chamber for storing stacked substrates;
ガス導入部と、  A gas introduction part;
バッファ室と、を備えた反応容器であって、  A reaction vessel comprising a buffer chamber,
前記ガス導入部は、前記基板の積層配置方向に沿って設けられ、基板処理用のガスを前記バッファ室に導入し、  The gas introduction part is provided along the stacking arrangement direction of the substrates, introduces a substrate processing gas into the buffer chamber,
前記バッファ室は、前記基板の積層配置方向に沿って設けられた複数のガス供給口を有し、前記ガス導入部から導入される前記処理用ガスを前記複数のガス供給口から前記反応室に供給することを特徴とする反応容器。  The buffer chamber has a plurality of gas supply ports provided along the stacking direction of the substrates, and the processing gas introduced from the gas introduction unit is transferred from the gas supply ports to the reaction chamber. A reaction vessel characterized by being supplied.
複数の基板を収容する処理室と、A processing chamber containing a plurality of substrates;
複数の第1のガス供給口を含む第1のガス供給部と、  A first gas supply unit including a plurality of first gas supply ports;
複数の第2のガス供給口を含む第2のガス供給部と、  A second gas supply unit including a plurality of second gas supply ports;
複数の第3のガス供給口を含む第3のガス供給部と、を備えた基板処理装置であって、  A substrate processing apparatus comprising: a third gas supply unit including a plurality of third gas supply ports;
活性化された状態で前記基板の処理に使用される第1の処理ガスであって、前記第2のガス供給部に供給される前記第1の処理ガスが、前記複数の第2のガス供給口から前記第1のガス供給部内に供給され、更に前記第2のガス供給部から供給された前記第1の処理ガスが前記複数の第1のガス供給口から前記処理室内に供給され、  A first processing gas used for processing the substrate in an activated state, wherein the first processing gas supplied to the second gas supply unit is the plurality of second gas supplies. The first processing gas supplied from the opening into the first gas supply unit and further supplied from the second gas supply unit is supplied from the plurality of first gas supply ports into the processing chamber;
前記第3のガス供給部に供給される活性化されない第2の処理ガスが、前記複数の第3のガス供給口から前記処理室内に供給されることを特徴とする基板処理装置。  The substrate processing apparatus, wherein the second processing gas that is not activated and is supplied to the third gas supply unit is supplied into the processing chamber from the plurality of third gas supply ports.
前記第1の処理ガスは、前記複数の第2のガス供給口から前記第1のガス供給部内に供給された後、前記第1のガス供給部内にて活性化されること特徴とする請求項17記載の基板処理装置。The first processing gas is activated in the first gas supply section after being supplied into the first gas supply section from the plurality of second gas supply ports. 18. The substrate processing apparatus according to 17. 複数の基板を収納可能な反応室と、A reaction chamber capable of storing a plurality of substrates;
複数のバッファ室と、  Multiple buffer chambers;
基板処理用のガスを前記複数のバッファ室にそれぞれ導入可能な複数のガス導入部と、を備えた細長形状の反応容器であって、  A plurality of gas introduction portions capable of introducing a substrate processing gas into each of the plurality of buffer chambers, and an elongated reaction vessel comprising:
前記複数のバッファ室は、反応容器の長手方向に沿って設けられた複数のガス供給口をそれぞれ有し、前記複数のガス導入部からそれぞれ導入される前記基板処理用のガスを前記複数のガス供給口から前記反応室にそれぞれ供給可能とすることを特徴とする反応容器。  The plurality of buffer chambers each have a plurality of gas supply ports provided along a longitudinal direction of the reaction vessel, and the substrate processing gases respectively introduced from the plurality of gas introduction portions are supplied to the plurality of gases. A reaction vessel capable of being supplied to each of the reaction chambers from a supply port.
前記複数のガス導入部の少なくとも一つは、反応容器の長手方向に沿って設けられていることを特徴とする請求項19記載の反応容器。The reaction container according to claim 19, wherein at least one of the plurality of gas introduction portions is provided along a longitudinal direction of the reaction container. 複数の基板を収納可能な反応室と、A reaction chamber capable of storing a plurality of substrates;
ガス導入部と、  A gas introduction part;
バッファ室と、を備えた細長形状の反応容器であって、  An elongated reaction vessel comprising a buffer chamber,
前記複数のガス導入部は、基板処理用のガスを前記バッファ室に導入可能であって、反応容器の長手方向に沿って設けら、  The plurality of gas introduction portions can introduce a substrate processing gas into the buffer chamber, and are provided along the longitudinal direction of the reaction vessel.
前記バッファ室は、反応容器の長手方向に沿って設けられた複数のガス供給口を有し、前記ガス導入部から導入される前記基板処理用のガスを前記複数のガス供給口から前記反応室に供給可能とすることを特徴とする反応容器。  The buffer chamber has a plurality of gas supply ports provided along the longitudinal direction of the reaction vessel, and the substrate processing gas introduced from the gas introduction unit is supplied from the gas supply ports to the reaction chamber. A reaction vessel characterized in that it can be supplied to the reactor.
JP2002104011A 2002-04-05 2002-04-05 Substrate processing equipment Expired - Lifetime JP3957549B2 (en)

Priority Applications (16)

Application Number Priority Date Filing Date Title
JP2002104011A JP3957549B2 (en) 2002-04-05 2002-04-05 Substrate processing equipment
KR1020030021100A KR100829327B1 (en) 2002-04-05 2003-04-03 Substrate processing apparatus and reaction tube
US10/406,279 US20040025786A1 (en) 2002-04-05 2003-04-04 Substrate processing apparatus and reaction container
CN 200510118668 CN1789489A (en) 2002-04-05 2003-04-04 Substrate processing apparatus
TW092107724A TWI222677B (en) 2002-04-05 2003-04-04 Treatment device of substrate
CN2010102436568A CN101985747A (en) 2002-04-05 2003-04-04 Substrate processing apparatus
CNB2005101186672A CN100480421C (en) 2002-04-05 2003-04-04 Reaction container
CN2008101795814A CN101435074B (en) 2002-04-05 2003-04-04 Substrate processing apparatus
CNB031093434A CN100459028C (en) 2002-04-05 2003-04-04 Substrate board treatment device and reaction container
US11/933,169 US8047158B2 (en) 2002-04-05 2007-10-31 Substrate processing apparatus and reaction container
US11/933,190 US20080251015A1 (en) 2002-04-05 2007-10-31 Substrate Processing Apparatus and Reaction Container
US11/933,208 US7900580B2 (en) 2002-04-05 2007-10-31 Substrate processing apparatus and reaction container
KR1020070110898A KR100802232B1 (en) 2002-04-05 2007-11-01 Substrate processing apparatus
KR1020070110899A KR100802233B1 (en) 2002-04-05 2007-11-01 Reaction tube
KR1020070115418A KR100813367B1 (en) 2002-04-05 2007-11-13 Substrate processing apparatus and processing tube
US12/823,001 US8261692B2 (en) 2002-04-05 2010-06-24 Substrate processing apparatus and reaction container

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JP2004127686A Division JP3960987B2 (en) 2004-04-23 2004-04-23 Reaction vessel
JP2007104727A Division JP4746581B2 (en) 2007-04-12 2007-04-12 Substrate processing equipment

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JP2003297818A JP2003297818A (en) 2003-10-17
JP2003297818A5 true JP2003297818A5 (en) 2005-03-03
JP3957549B2 JP3957549B2 (en) 2007-08-15

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TW452635B (en) * 1999-05-21 2001-09-01 Silicon Valley Group Thermal Gas delivery metering tube and gas delivery metering device using the same

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