JP2003297818A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2003297818A5 JP2003297818A5 JP2002104011A JP2002104011A JP2003297818A5 JP 2003297818 A5 JP2003297818 A5 JP 2003297818A5 JP 2002104011 A JP2002104011 A JP 2002104011A JP 2002104011 A JP2002104011 A JP 2002104011A JP 2003297818 A5 JP2003297818 A5 JP 2003297818A5
- Authority
- JP
- Japan
- Prior art keywords
- gas
- substrate processing
- gas supply
- processing apparatus
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007789 gas Substances 0.000 claims 77
- 239000000758 substrate Substances 0.000 claims 49
- 210000002381 Plasma Anatomy 0.000 claims 3
- 230000001681 protective Effects 0.000 claims 3
- 230000004913 activation Effects 0.000 claims 2
- 239000011261 inert gas Substances 0.000 claims 2
- 238000011144 upstream manufacturing Methods 0.000 claims 1
Claims (21)
ガス導入部と、 A gas introduction part;
バッファ室と、を備えた基板処理装置であって、 A substrate processing apparatus comprising a buffer chamber,
前記ガス導入部は、前記基板の積層配置方向に沿って設けられ、基板処理用のガスを前記バッファ室に導入し、 The gas introduction part is provided along the stacking arrangement direction of the substrates, introduces a substrate processing gas into the buffer chamber,
前記バッファ室は、前記基板の積層配置方向に沿って設けられた複数のガス供給口を有し、前記ガス導入部から導入される前記処理用ガスを前記複数のガス供給口から前記反応室に供給することを特徴とする基板処理装置。 The buffer chamber has a plurality of gas supply ports provided along the stacking direction of the substrates, and the processing gas introduced from the gas introduction unit is transferred from the gas supply ports to the reaction chamber. A substrate processing apparatus characterized by being supplied.
前記バッファ室に設けられた前記複数のガス供給口の開口面積がほぼ等しいことを特徴とする基板処埋装置。The substrate processing apparatus according to claim 1,
The substrate processing apparatus, wherein the plurality of gas supply ports provided in the buffer chamber have substantially the same opening area.
前記リモートプラズマユニットにより活性化された前記基板処理用のガスを前記ガス導入部から前記バッファ室に導入することを特徴とする請求項1又は2記載の基板処理装置。 The substrate processing apparatus according to claim 1, wherein the substrate processing gas activated by the remote plasma unit is introduced into the buffer chamber from the gas introduction unit.
複数のバッファ室と、 Multiple buffer chambers;
基板処理用のガスを前記複数のバッファ室にそれぞれ導入する複数のガス導入部と、を備えた基板処理装置であって、 A substrate processing apparatus comprising a plurality of gas introduction portions for introducing a substrate processing gas into each of the plurality of buffer chambers,
前記複数のバッファ室は、前記基板の積層配置方向に沿って設けられた複数のガス供給口をそれぞれ有し、前記複数のガス導入部からそれぞれ導入される前記処理用ガスを前記複数のガス供給口から前記反応室にそれぞれ供給することを特徴とする基板処理装置。 The plurality of buffer chambers each have a plurality of gas supply ports provided along a stacking arrangement direction of the substrates, and supply the processing gases respectively introduced from the plurality of gas introduction portions. A substrate processing apparatus, wherein the substrate processing apparatus supplies the reaction chamber through a mouth.
複数のバッファ室と、 Multiple buffer chambers;
基板処理用のガスを前記複数のバッファ室にそれぞれ導入する複数のガス導入部と、を備えた反応容器であって、 A plurality of gas introduction portions for introducing substrate processing gases into the plurality of buffer chambers, respectively,
前記複数のバッファ室は、前記基板の積層配置方向に沿って設けられた複数のガス供給口をそれぞれ有し、前記複数のガス導入部からそれぞれ導入される前記基板処理用のガスを前記複数のガス供給口から前記反応室にそれぞれ供給することを特徴とする反応容器。 The plurality of buffer chambers each have a plurality of gas supply ports provided along the stacking direction of the substrates, and the substrate processing gases respectively introduced from the plurality of gas introduction portions are supplied to the plurality of buffer chambers. A reaction vessel that is supplied to each of the reaction chambers from a gas supply port.
ガス導入部と、 A gas introduction part;
バッファ室と、を備えた反応容器であって、 A reaction vessel comprising a buffer chamber,
前記ガス導入部は、前記基板の積層配置方向に沿って設けられ、基板処理用のガスを前記バッファ室に導入し、 The gas introduction part is provided along the stacking arrangement direction of the substrates, introduces a substrate processing gas into the buffer chamber,
前記バッファ室は、前記基板の積層配置方向に沿って設けられた複数のガス供給口を有し、前記ガス導入部から導入される前記処理用ガスを前記複数のガス供給口から前記反応室に供給することを特徴とする反応容器。 The buffer chamber has a plurality of gas supply ports provided along the stacking direction of the substrates, and the processing gas introduced from the gas introduction unit is transferred from the gas supply ports to the reaction chamber. A reaction vessel characterized by being supplied.
複数の第1のガス供給口を含む第1のガス供給部と、 A first gas supply unit including a plurality of first gas supply ports;
複数の第2のガス供給口を含む第2のガス供給部と、 A second gas supply unit including a plurality of second gas supply ports;
複数の第3のガス供給口を含む第3のガス供給部と、を備えた基板処理装置であって、 A substrate processing apparatus comprising: a third gas supply unit including a plurality of third gas supply ports;
活性化された状態で前記基板の処理に使用される第1の処理ガスであって、前記第2のガス供給部に供給される前記第1の処理ガスが、前記複数の第2のガス供給口から前記第1のガス供給部内に供給され、更に前記第2のガス供給部から供給された前記第1の処理ガスが前記複数の第1のガス供給口から前記処理室内に供給され、 A first processing gas used for processing the substrate in an activated state, wherein the first processing gas supplied to the second gas supply unit is the plurality of second gas supplies. The first processing gas supplied from the opening into the first gas supply unit and further supplied from the second gas supply unit is supplied from the plurality of first gas supply ports into the processing chamber;
前記第3のガス供給部に供給される活性化されない第2の処理ガスが、前記複数の第3のガス供給口から前記処理室内に供給されることを特徴とする基板処理装置。 The substrate processing apparatus, wherein the second processing gas that is not activated and is supplied to the third gas supply unit is supplied into the processing chamber from the plurality of third gas supply ports.
複数のバッファ室と、 Multiple buffer chambers;
基板処理用のガスを前記複数のバッファ室にそれぞれ導入可能な複数のガス導入部と、を備えた細長形状の反応容器であって、 A plurality of gas introduction portions capable of introducing a substrate processing gas into each of the plurality of buffer chambers, and an elongated reaction vessel comprising:
前記複数のバッファ室は、反応容器の長手方向に沿って設けられた複数のガス供給口をそれぞれ有し、前記複数のガス導入部からそれぞれ導入される前記基板処理用のガスを前記複数のガス供給口から前記反応室にそれぞれ供給可能とすることを特徴とする反応容器。 The plurality of buffer chambers each have a plurality of gas supply ports provided along a longitudinal direction of the reaction vessel, and the substrate processing gases respectively introduced from the plurality of gas introduction portions are supplied to the plurality of gases. A reaction vessel capable of being supplied to each of the reaction chambers from a supply port.
ガス導入部と、 A gas introduction part;
バッファ室と、を備えた細長形状の反応容器であって、 An elongated reaction vessel comprising a buffer chamber,
前記複数のガス導入部は、基板処理用のガスを前記バッファ室に導入可能であって、反応容器の長手方向に沿って設けら、 The plurality of gas introduction portions can introduce a substrate processing gas into the buffer chamber, and are provided along the longitudinal direction of the reaction vessel.
前記バッファ室は、反応容器の長手方向に沿って設けられた複数のガス供給口を有し、前記ガス導入部から導入される前記基板処理用のガスを前記複数のガス供給口から前記反応室に供給可能とすることを特徴とする反応容器。 The buffer chamber has a plurality of gas supply ports provided along the longitudinal direction of the reaction vessel, and the substrate processing gas introduced from the gas introduction unit is supplied from the gas supply ports to the reaction chamber. A reaction vessel characterized in that it can be supplied to the reactor.
Priority Applications (16)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002104011A JP3957549B2 (en) | 2002-04-05 | 2002-04-05 | Substrate processing equipment |
KR1020030021100A KR100829327B1 (en) | 2002-04-05 | 2003-04-03 | Substrate processing apparatus and reaction tube |
US10/406,279 US20040025786A1 (en) | 2002-04-05 | 2003-04-04 | Substrate processing apparatus and reaction container |
CN 200510118668 CN1789489A (en) | 2002-04-05 | 2003-04-04 | Substrate processing apparatus |
TW092107724A TWI222677B (en) | 2002-04-05 | 2003-04-04 | Treatment device of substrate |
CN2010102436568A CN101985747A (en) | 2002-04-05 | 2003-04-04 | Substrate processing apparatus |
CNB2005101186672A CN100480421C (en) | 2002-04-05 | 2003-04-04 | Reaction container |
CN2008101795814A CN101435074B (en) | 2002-04-05 | 2003-04-04 | Substrate processing apparatus |
CNB031093434A CN100459028C (en) | 2002-04-05 | 2003-04-04 | Substrate board treatment device and reaction container |
US11/933,169 US8047158B2 (en) | 2002-04-05 | 2007-10-31 | Substrate processing apparatus and reaction container |
US11/933,190 US20080251015A1 (en) | 2002-04-05 | 2007-10-31 | Substrate Processing Apparatus and Reaction Container |
US11/933,208 US7900580B2 (en) | 2002-04-05 | 2007-10-31 | Substrate processing apparatus and reaction container |
KR1020070110898A KR100802232B1 (en) | 2002-04-05 | 2007-11-01 | Substrate processing apparatus |
KR1020070110899A KR100802233B1 (en) | 2002-04-05 | 2007-11-01 | Reaction tube |
KR1020070115418A KR100813367B1 (en) | 2002-04-05 | 2007-11-13 | Substrate processing apparatus and processing tube |
US12/823,001 US8261692B2 (en) | 2002-04-05 | 2010-06-24 | Substrate processing apparatus and reaction container |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002104011A JP3957549B2 (en) | 2002-04-05 | 2002-04-05 | Substrate processing equipment |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004127686A Division JP3960987B2 (en) | 2004-04-23 | 2004-04-23 | Reaction vessel |
JP2007104727A Division JP4746581B2 (en) | 2007-04-12 | 2007-04-12 | Substrate processing equipment |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2003297818A JP2003297818A (en) | 2003-10-17 |
JP2003297818A5 true JP2003297818A5 (en) | 2005-03-03 |
JP3957549B2 JP3957549B2 (en) | 2007-08-15 |
Family
ID=29389496
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002104011A Expired - Lifetime JP3957549B2 (en) | 2002-04-05 | 2002-04-05 | Substrate processing equipment |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP3957549B2 (en) |
CN (3) | CN101435074B (en) |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100829327B1 (en) | 2002-04-05 | 2008-05-13 | 가부시키가이샤 히다치 고쿠사이 덴키 | Substrate processing apparatus and reaction tube |
JP4204840B2 (en) * | 2002-10-08 | 2009-01-07 | 株式会社日立国際電気 | Substrate processing equipment |
JP3973567B2 (en) * | 2003-01-17 | 2007-09-12 | 東京エレクトロン株式会社 | Thin film forming method and thin film forming apparatus |
JP4329403B2 (en) * | 2003-05-19 | 2009-09-09 | 東京エレクトロン株式会社 | Plasma processing equipment |
JP4354987B2 (en) * | 2004-02-27 | 2009-10-28 | 株式会社日立国際電気 | Substrate processing equipment |
US20050287806A1 (en) | 2004-06-24 | 2005-12-29 | Hiroyuki Matsuura | Vertical CVD apparatus and CVD method using the same |
US7966969B2 (en) * | 2004-09-22 | 2011-06-28 | Asm International N.V. | Deposition of TiN films in a batch reactor |
JP4634155B2 (en) * | 2005-01-07 | 2011-02-16 | 株式会社日立国際電気 | Substrate processing apparatus and film forming method |
JP4426518B2 (en) | 2005-10-11 | 2010-03-03 | 東京エレクトロン株式会社 | Processing equipment |
US20070259111A1 (en) * | 2006-05-05 | 2007-11-08 | Singh Kaushal K | Method and apparatus for photo-excitation of chemicals for atomic layer deposition of dielectric film |
KR100807216B1 (en) | 2006-09-29 | 2008-02-28 | 삼성전자주식회사 | Apparatus and method of forming an thin layer having an improved thickness uniformity |
JP4746581B2 (en) * | 2007-04-12 | 2011-08-10 | 株式会社日立国際電気 | Substrate processing equipment |
JP5137462B2 (en) * | 2007-05-21 | 2013-02-06 | 株式会社日立国際電気 | Substrate processing apparatus, gas supply unit, and thin film forming method |
KR100898038B1 (en) * | 2007-10-05 | 2009-05-19 | 한국원자력연구원 | A coating apparatus with multi substrate holder in a load lock chamber |
KR100945429B1 (en) * | 2007-10-05 | 2010-03-05 | 한국원자력연구원 | A coating apparatus for mass production by using a loading and unloading Multi substrate holder |
JP5198299B2 (en) * | 2008-04-01 | 2013-05-15 | 株式会社日立国際電気 | Substrate processing apparatus, semiconductor device manufacturing method, and substrate processing method |
KR101101164B1 (en) * | 2008-04-01 | 2011-12-30 | 가부시키가이샤 히다치 고쿠사이 덴키 | Substrate processing apparatus |
JP5423205B2 (en) * | 2008-08-29 | 2014-02-19 | 東京エレクトロン株式会社 | Deposition equipment |
JP5549754B2 (en) * | 2008-08-29 | 2014-07-16 | 東京エレクトロン株式会社 | Deposition equipment |
JP4938805B2 (en) * | 2009-01-13 | 2012-05-23 | 株式会社日立国際電気 | Substrate processing equipment |
JP5114457B2 (en) * | 2009-07-10 | 2013-01-09 | 株式会社アルバック | Catalytic CVD equipment |
KR101205242B1 (en) * | 2010-04-30 | 2012-11-27 | 주식회사 테라세미콘 | Plasma processing apparatus |
TWI520177B (en) | 2010-10-26 | 2016-02-01 | Hitachi Int Electric Inc | Substrate processing apparatus , semiconductor device manufacturing method and computer-readable recording medium |
JP5718031B2 (en) * | 2010-11-26 | 2015-05-13 | 株式会社日立国際電気 | Substrate processing apparatus and semiconductor device manufacturing method |
JP2012248779A (en) * | 2011-05-31 | 2012-12-13 | Spp Technologies Co Ltd | Etching device, etching method and etching program of silicon oxide |
US20130068161A1 (en) * | 2011-09-15 | 2013-03-21 | Applied Materials, Inc. | Gas delivery and distribution for uniform process in linear-type large-area plasma reactor |
JP5598728B2 (en) * | 2011-12-22 | 2014-10-01 | 株式会社ダイフク | Inert gas injection device |
DE102012024340A1 (en) * | 2012-12-13 | 2014-06-18 | Oerlikon Trading Ag, Trübbach | plasma source |
JP5792215B2 (en) * | 2013-03-08 | 2015-10-07 | 国立大学法人東北大学 | Hot wire processing equipment |
CN103646902A (en) * | 2013-11-26 | 2014-03-19 | 上海华力微电子有限公司 | Gas injection tube for optimizing semiconductor processing conditions |
CN103818861A (en) * | 2014-03-12 | 2014-05-28 | 合肥彩虹蓝光科技有限公司 | Upper cover lifting system of reaction chamber cavity body |
JP6320903B2 (en) * | 2014-11-19 | 2018-05-09 | 東京エレクトロン株式会社 | Nozzle and substrate processing apparatus using the same |
CN105142324A (en) * | 2015-08-17 | 2015-12-09 | 深圳市华鼎星科技有限公司 | Linear plasma generator |
KR101760316B1 (en) | 2015-09-11 | 2017-07-21 | 주식회사 유진테크 | Substrate Processing Apparatus |
JP6737139B2 (en) * | 2016-11-14 | 2020-08-05 | 東京エレクトロン株式会社 | Gas injector and vertical heat treatment equipment |
JP6647260B2 (en) * | 2017-09-25 | 2020-02-14 | 株式会社Kokusai Electric | Semiconductor device manufacturing method, substrate processing apparatus, and program |
JP6820816B2 (en) * | 2017-09-26 | 2021-01-27 | 株式会社Kokusai Electric | Substrate processing equipment, reaction tubes, semiconductor equipment manufacturing methods, and programs |
CN114402421A (en) | 2019-09-27 | 2022-04-26 | 株式会社国际电气 | Substrate processing apparatus, elevating mechanism, method for manufacturing semiconductor device, and program |
WO2021181450A1 (en) * | 2020-03-09 | 2021-09-16 | 株式会社Kokusai Electric | Substrate treatment device, production method for semiconductor device, and program |
CN111681977B (en) * | 2020-07-15 | 2024-01-05 | 北京北方华创微电子装备有限公司 | Wafer cassette purge assembly and wafer cassette apparatus |
WO2022195886A1 (en) | 2021-03-19 | 2022-09-22 | 株式会社Kokusai Electric | Substrate holder, substrate processing device, semiconductor device manufacturing method, and program |
WO2023132130A1 (en) * | 2022-01-07 | 2023-07-13 | 芝浦機械株式会社 | Surface treatment device |
CN115125523B (en) * | 2022-06-28 | 2023-09-08 | 北京北方华创微电子装备有限公司 | Reaction chamber and semiconductor device |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5383984A (en) * | 1992-06-17 | 1995-01-24 | Tokyo Electron Limited | Plasma processing apparatus etching tunnel-type |
US6424091B1 (en) * | 1998-10-26 | 2002-07-23 | Matsushita Electric Works, Ltd. | Plasma treatment apparatus and plasma treatment method performed by use of the same apparatus |
TW452635B (en) * | 1999-05-21 | 2001-09-01 | Silicon Valley Group Thermal | Gas delivery metering tube and gas delivery metering device using the same |
-
2002
- 2002-04-05 JP JP2002104011A patent/JP3957549B2/en not_active Expired - Lifetime
-
2003
- 2003-04-04 CN CN2008101795814A patent/CN101435074B/en not_active Expired - Lifetime
- 2003-04-04 CN CN 200510118668 patent/CN1789489A/en active Pending
- 2003-04-04 CN CNB2005101186672A patent/CN100480421C/en not_active Expired - Lifetime
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2003297818A5 (en) | ||
EP1674592A3 (en) | Thin film processing system with different processing chambers | |
CN100480421C (en) | Reaction container | |
WO2002086987A3 (en) | Hydrogen generation apparatus and method for using same | |
JP5138594B2 (en) | Apparatus, method and use thereof for continuous chemical vapor deposition under atmospheric pressure | |
JP2004134466A5 (en) | ||
SG152060A1 (en) | Pressure-based gas delivery system and method for reducing risks associated with storage and delivery of high pressure gases | |
JP2008196001A (en) | Plasma cvd apparatus | |
SG144854A1 (en) | Single chamber, multiple tube high efficiency vertical furnace system | |
CN101985747A (en) | Substrate processing apparatus | |
ES2139812T3 (en) | IMPROVED FLUCTUING PRESSURE ADSORPTION PROCEDURE. | |
JP2010515821A5 (en) | ||
WO2009003552A3 (en) | Treatment system for flat substrates | |
MX2009010502A (en) | Low-pressure-drop mixing device and use thereof in the mixing of two gases/vapours. | |
JP2005064305A5 (en) | ||
JP2008066413A (en) | Shower head structure and treatment device using the same | |
TW201217060A (en) | Nozzle head and apparatus | |
JP2004228601A5 (en) | ||
WO2005060486A3 (en) | Small volume, fuel cell inlet fuel gas distributor having low pressure drop | |
TW200639930A (en) | Inner tube for furnace and furnace apparatus using the same | |
CN102589924A (en) | Chlorosilane sampling system | |
JP2005260015A5 (en) | ||
JP2010223483A (en) | Burning furnace and solar battery cell produced using the burning furnace | |
WO2010087638A3 (en) | Batch-type substrate-processing apparatus | |
JP2013020836A (en) | Atmospheric pressure plasma processing system |