CN111681977B - Wafer cassette purge assembly and wafer cassette apparatus - Google Patents
Wafer cassette purge assembly and wafer cassette apparatus Download PDFInfo
- Publication number
- CN111681977B CN111681977B CN202010680998.XA CN202010680998A CN111681977B CN 111681977 B CN111681977 B CN 111681977B CN 202010680998 A CN202010680998 A CN 202010680998A CN 111681977 B CN111681977 B CN 111681977B
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- air
- cassette
- wafer
- air outlet
- shell
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- 238000010926 purge Methods 0.000 title claims abstract description 89
- 238000007664 blowing Methods 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 239000013618 particulate matter Substances 0.000 abstract description 6
- 235000012431 wafers Nutrition 0.000 description 66
- 239000007789 gas Substances 0.000 description 32
- 230000007246 mechanism Effects 0.000 description 16
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 7
- 238000007789 sealing Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000012495 reaction gas Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a wafer box purging component which is used for purging a wafer box. In the wafer storage box purging component provided by the invention, the air outlet areas of the plurality of air outlets are adjustable, and the difference between the air flow rates blown out by the air outlets can be eliminated by adjusting the air outlet areas of the air outlets, so that the air flow rates at the height positions of the wafer storage box are equal, thereby relieving the particle pollution on the surface of a wafer and improving the removal efficiency of the air discharged by the wafer storage box. The invention also provides a storage box device.
Description
Technical Field
The invention relates to the field of semiconductor equipment, in particular to a wafer storage box purging component and a wafer storage box device.
Background
In the semiconductor process, in order to ensure that the wafers are kept in a clean state during transportation, the wafers are usually hermetically loaded in a wafer box, a sealing cover of the wafer box is opened by a door opening mechanism before the corresponding process is performed, the wafers are taken out of the wafer box by a manipulator and placed on a wafer boat, and then the wafers are lifted into a reaction chamber along with the wafer boat. In order to avoid the influence of the gas in the wafer cassette on the reaction gas components in the reaction chamber, the door opening mechanism is generally provided with a gas inlet structure and a gas outlet structure for replacing the gas in the wafer cassette with the gas with less influence on the reaction gas components in the reaction chamber, such as nitrogen.
Fig. 1 and 2 show a schematic diagram of an air inlet scheme of a porous tube 1 with an air inlet structure in the prior art, and the porous tube 1 is provided with an air inlet hole and a plurality of air outlet holes communicated with the air inlet hole. When the sealing cover of the storage box 20 is opened by the door opening mechanism, the nitrogen is blown into the storage box 20 through the plurality of air outlet holes on the porous tube 1 along the gaps between the storage box and the sealing cover (the direction indicated by the arrow in fig. 1 and 2 is the ideal nitrogen flowing direction). However, when the wafer cassette 20 is purged by using the existing perforated tube 1, the wafers are easily contaminated during the purge process, and the removal efficiency of the original gas (e.g., oxygen) in the wafer cassette 20 is low, which affects the overall operation efficiency of the machine.
Therefore, how to provide a wafer cassette purge assembly that is efficient and beneficial for maintaining clean wafers is a technical problem to be solved in the art.
Disclosure of Invention
The invention aims to provide a wafer box purging assembly and a wafer box opening mechanism, wherein the wafer box purging assembly has high purging efficiency and is easy to keep wafers clean.
In order to achieve the above object, as one aspect of the present invention, there is provided a cassette purging assembly for purging a cassette, the cassette purging assembly including a housing having an inlet port for inputting a purge gas and a plurality of outlet ports for outputting the purge gas to the cassette, wherein an outlet area of each of the outlet ports is adjustable.
Preferably, the purge component of the storage box further comprises a plurality of adjusting parts which are arranged in one-to-one correspondence with the air outlets, the adjusting parts are movably connected with the shell, and the air outlet area of the air outlets is changed along with the movement of the corresponding adjusting parts relative to the shell.
Preferably, the plurality of air outlets are distributed on the housing along the length direction of the housing, and the opening size of the air outlets at the two ends of the housing is smaller than the opening size of the air outlets between the two ends of the housing.
Preferably, the adjusting piece comprises a columnar body and an adjusting hole penetrating through the columnar body, the adjusting hole and the columnar body are eccentrically arranged, the columnar body is movably connected with the shell, and the overlapping area of the adjusting hole and the air outlet is changed along with the movement of the columnar body relative to the shell.
Preferably, a plurality of rotary grooves are formed on the shell, the rotary grooves and the air outlets are in one-to-one correspondence, the adjusting piece is arranged in the rotary grooves, and the adjusting piece can rotate in the rotary grooves.
Preferably, the cartridge purge assembly further comprises a seal ring located between the cylindrical body and the inner wall of the swivel groove.
Preferably, a torsion groove is formed on one side of the columnar body, which is away from the air outlet, and the torsion groove is used for inserting a torsion tool, so that the torsion tool can drive the columnar body to rotate through the torsion groove.
Preferably, the torsion groove is a hexagon socket, and the torsion tool is a hexagon socket wrench.
Preferably, the number of the air inlets is two, and the two air inlets are respectively arranged at two ends of the shell.
As a second aspect of the present invention, there is provided a cartridge device comprising a housing having an opening formed therein and a door for closing the opening, and further comprising the aforementioned cartridge purge assembly provided on an inner wall of the housing for blowing a purge gas into the housing when the door is opened.
In the wafer box purging component and the wafer box device provided by the invention, the air outlet areas of the plurality of air outlets in the wafer box purging component are adjustable, when the wafer box is purged by using the wafer box purging component provided by the invention, the air outlet areas of the air outlets can be adjusted, the difference between the air flow rates of the air flows blown out by the air outlets is eliminated, so that the air flow rates of the wafer box at all height positions are equal, the particle pollution on the surface of a wafer is relieved, the removal efficiency of the air discharged by the wafer box is improved, and the overall operation efficiency of a machine is further improved.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate the invention and together with the description serve to explain, without limitation, the invention. In the drawings:
FIG. 1 is a schematic illustration of a prior art air intake structure for blowing air into a cassette;
FIG. 2 is a schematic perspective view of the solution shown in FIG. 1;
FIG. 3 is a schematic view of a purge assembly for a wafer cassette according to an embodiment of the present invention;
FIG. 4 is a left side view of the cassette purge assembly of FIG. 3;
FIG. 5 is a top view of the cassette purge assembly of FIG. 4;
FIG. 6 is a schematic view of a housing of a cassette purge assembly according to an embodiment of the present invention;
FIG. 7 is a right side view of the housing of FIG. 6;
FIG. 8 is a schematic view of the structure of an adjustment member of the purge assembly of a cassette according to an embodiment of the present invention;
FIG. 9 is a right side view of the adjustment member of FIG. 8;
FIG. 10 is a partial view of a cassette purge assembly provided by an embodiment of the present invention;
FIG. 11 is a right side view of the cassette purge assembly of FIG. 20;
FIG. 12 is a schematic view of a purge assembly for a wafer cassette according to another embodiment of the present invention;
FIG. 13 is a schematic illustration of the effect of blowing air flow in the cassette with each air outlet opening to a maximum air outlet area in the cassette purge assembly of FIG. 12;
FIG. 14 is a perspective view of the effect diagram of FIG. 13;
fig. 15 and 16 are schematic diagrams of the change of the wind speed of each gas outlet when the flow rate of the purge gas is reduced;
fig. 17 to 19 are schematic views showing a process of adjusting an air outlet area using an allen wrench according to an embodiment of the present invention;
FIG. 20 is a schematic view of the area of the air outlet surface of the air outlet in the purge assembly of the storage box according to the embodiment of the present invention, which varies with the rotation angle of the columnar body;
fig. 21 to 22 are schematic diagrams illustrating the working principle of a magazine opening mechanism according to an embodiment of the present invention;
fig. 23 to 24 are schematic views illustrating an operation principle of a cassette opening mechanism according to another embodiment of the present invention;
FIG. 25 is a schematic view of a cassette assembly in a semiconductor processing apparatus according to an embodiment of the present invention;
fig. 26 is a schematic structural diagram of a semiconductor processing apparatus according to an embodiment of the present invention.
Description of the reference numerals
100: cassette purge assembly 110: shell body
111: air inlet 112: rotary groove
120: air outlet 130: adjusting piece
131: columnar body 132: adjusting hole
133: torsion groove 140: sealing ring
150: socket head cap wrench 20: storage box
21: the box 22: cabin door
200: cassette opening assembly 210: cylinder
220: door opening mechanism 30: reaction chamber
40: transport chamber 41: mechanical arm
42; crystal boat
Detailed Description
The following describes specific embodiments of the present invention in detail with reference to the drawings. It should be understood that the detailed description and specific examples, while indicating and illustrating the invention, are not intended to limit the invention.
The inventor of the present invention found through experimental study that the apertures of the air outlet holes at each place on the existing porous tube 1 are consistent, but the air outlet holes at different positions have different air flow rates (as shown in fig. 1 and 2, which are typical conditions), and the difference changes with the change of the air flow rates, and the air flow rate difference between the air outlet holes easily causes particles in the wafer storage box 20 to fly, thereby causing pollution to wafers. In addition, at the position with too small airflow velocity, the purging efficiency of the air is lower than that of other positions, so that the time required by the whole purging is prolonged, and the whole operation efficiency of the machine is influenced.
To solve the above-mentioned problems, as an aspect of the present invention, there is provided a cassette purging assembly 100 for purging a cassette for storing wafers, the cassette purging assembly 100 including a housing 110, as shown in fig. 3 to 5, the housing 110 having an inlet port 111 for inputting a purge gas and a plurality of outlet ports 120 for outputting the purge gas to the cassette 20, wherein an outlet area of each of the outlet ports 120 is adjustable.
It should be noted that, the air outlet area of the air outlet 120 indicates the size of the air outlet surface of the air outlet 120 that actually sprays air outwards in the use process, in the embodiment of the present invention, the air outlet areas of the plurality of air outlets 120 on the wafer box purging component 100 are adjustable, when the wafer box purging component 100 provided by the present invention is used to purge the wafer box 20, the air outlet areas of the air outlets 120 can be adjusted, so as to eliminate the difference between the air flow rates blown out by the air outlets 120, and make the air flow rates at the height positions of the wafer box 20 equal, thereby alleviating the particle pollution on the wafer surface, improving the removal efficiency of the air discharged from the wafer box, and further improving the overall operation efficiency of the machine.
The embodiment of the present invention does not specifically limit how to realize the adjustable air outlet area of the air outlet 120, for example, the air outlet 120 may be partially covered by a movable member, specifically: as shown in fig. 8 to 11, the purge assembly 100 further includes a plurality of adjusting members 130 disposed in one-to-one correspondence with the plurality of air outlets 120, the adjusting members 130 are movably connected with the housing 110, and an air outlet area of the air outlets 120 is changed along with movement of the corresponding adjusting members 130 relative to the housing 110. That is, as the regulating member 130 moves relative to the housing 110, the area of the portion of the air outlet 120 not covered by the regulating member 130 (i.e., the air outlet face) changes.
The inventor also finds that the difference between the gas flow rates blown out by the gas outlet holes at each position on the existing porous tube 1 is particularly obvious when the gas flow rate is higher after further experimental study. For example, in the purge process, when the total flow rate reaches 150L/min or more, there is a large gradient difference in the nitrogen gas flow blown out from each gas outlet along the height direction of the storage box 20, and as shown in fig. 1 and 2, the flow velocity of the gas flow blown out from the gas outlet located at the center among the plurality of gas outlets is far smaller than the flow velocity of the gas flow blown out from the gas outlets at the two ends of the porous tube 1.
In order to solve the above-mentioned problems and to improve the adjustment accuracy of the cassette purge assembly 100, it is preferable that a plurality of air outlets 120 are distributed on the housing 110 along the length direction of the housing 110 as shown in fig. 12 to 14, and the opening size of the air outlets 120 located at both ends of the housing 110 is smaller than the opening size of the air outlets 120 located between both ends of the housing 110 among the plurality of air outlets 120.
In the present invention, the opening size of the air outlet 120 indicates the opening size of the air outlet 120 on the outer surface of the housing 110, the opening of the air outlet 120 on the outer surface of the housing 110 may be partially covered by the adjusting member 130, and the portion of the opening not covered by the adjusting member 130 is the air outlet surface of the air outlet 120.
In the embodiment of the present invention, the apertures of the plurality of air outlets 120 are regularly arranged with small two sides and large middle on the housing 110, so that when all the air outlets 120 are fully opened (i.e. all the air outlets 120 are not covered by the adjusting member 130), the difference between the air flow rates blown out by the air outlets 120 is primarily eliminated, so that the air flow rates of the air storage box 20 at different height positions are substantially equal (as shown in fig. 13 and 14, when all the air outlets 120 are fully opened and the total flow reaches 150L/min, the air flow field in the air storage box 20 is schematically shown). When the air outlet area of the air outlet 120 is adjusted, the situation that the flow velocity of the air flow blown out by the air outlet 120 positioned at the center is far smaller than the flow velocity of the air flow blown out by the air outlets 120 at the two ends of the porous tube 1 is not needed to be considered, so that the area adjustment range of the air outlet 120 is reduced, and the air flow velocity adjustment precision of the air storage box purging assembly 100 is improved.
The shape and size of the air outlets 120 are not particularly limited in the embodiment of the present invention, for example, the shape of the plurality of air outlets 120 may be circular, and the diameter of the air outlets 120 may be 3mm-6mm. For ease of understanding by those skilled in the art, the present invention provides one embodiment for reference: 14 air outlets 120 are formed on the shell, and the diameters of the 14 air outlets 120 from top to bottom are respectively as follows: d1 D2=3.2 mm, d3=3.5 mm, d4=4.0 mm, d5=4.7 mm, d6=5.3 mm, d7=6.0 mm, d8=6.0 mm, d9=5.3 mm, d10=4.7 mm, d11=4.0 mm, d12=3.5 mm, d13=3.2 mm, d14=3.0 mm.
The number of the air inlets 111 is not particularly limited in the embodiment of the present invention, and for example, as a preferred embodiment of the present invention, the number of the air inlets 111 is two, and the two air inlets 111 are respectively provided at both ends of the housing 110.
In order to improve the intuitiveness of observing the size of the air outlet 120, as shown in fig. 8, preferably, the adjusting member 130 includes a cylindrical body 131 and an adjusting hole 132 penetrating the cylindrical body 131, the cylindrical body 131 is movably connected with the housing 110, the adjusting hole 132 is eccentrically arranged with the cylindrical body 131, and the overlapping area of the adjusting hole 132 and the air outlet 120 is changed along with the movement of the cylindrical body 131 relative to the housing 110.
It should be noted that, the size and shape of the adjusting hole 132 are preferably the same as those of the corresponding air outlet 120, and in the embodiment of the present invention, the degree of variation of the air outlet area of the air outlet 120 can be intuitively observed only by observing the degree of staggering of the adjusting hole 132 and the air outlet 120, thereby improving the convenience of adjusting the air flow velocity.
In order to improve accuracy and stability of adjusting the flow rate of the air flow, it is preferable that a plurality of rotary grooves 112 are formed on the housing 110, and the rotary grooves 112 are in one-to-one correspondence with the air outlets 120, and an adjusting member 130 is disposed in the rotary grooves 112, and the adjusting member 130 is rotatable in the rotary grooves 112, as shown in fig. 6 and 7.
In this embodiment, the overlapping degree of the adjusting hole 132 and the air outlet 120 is changed by rotating the columnar body 131, so that the control of the air outlet area is converted into the control of the rotation angle, and when the rotation angle is adjusted, the accuracy and stability of the angle control can be improved by increasing the length of the power arm (for example, by using a torsion tool such as a wrench).
For example, in order to achieve precise adjustment of the rotation angle of the cylindrical body 131, as a preferred embodiment of the present invention, as shown in fig. 8 to 10, a torsion groove 133 is formed at a side of the cylindrical body 131 facing away from the air outlet 120, and the torsion groove 133 is used for inserting a torsion tool so that the torsion tool can rotate the cylindrical body 131 through the torsion groove 133, and the torsion groove 133 is non-circular in shape.
The shape of the torsion groove 133 is not particularly limited in the embodiment of the present invention, and for example, the torsion groove 133 may be a hexagon socket. Accordingly, the torsion tool may be an allen wrench 150, and one end of the allen wrench 150 can be inserted into the torsion slot 133 and rotate around the axis of the cylindrical body 131 to rotate the cylindrical body 131, as shown in fig. 18 to 19. As shown in fig. 17, the other end of the socket head cap wrench 150 may be bent to form the socket head cap wrench 150 into an L-shaped member, so as to increase the length of the power arm during the torsion adjustment, and improve the accuracy and stability of the angle control.
It should be noted that, in the purge assembly 100 of the storage box provided in the embodiment of the present invention, the air outlet area of the air outlet 120 needs to be adjusted when the flow rate of the purge gas is changed, that is, the plurality of adjusting members 130 need to be rotated each time the flow rate of the purge gas is changed, because the air speed variation of the purge gas ejected from each air outlet 120 is different when the flow rate of the purge gas is changed.
For example, when the flow rate of the purge gas is reduced from 80L/min to 50L/min in the case where the air outlets 120 are adjusted to have the same air speed, the air speed of the purge gas ejected from each of the air outlets 120 is larger than the air speed of the air outlets 120 at both ends by the air speed reduction of the air outlet 120 located in the middle as shown in fig. 15 and 16, and at this time, the plurality of adjusting members 130 need to be rotated again to adjust so that the air speeds of the air outlets 120 are the same.
To further improve the stability of the air outlet surface area control of the air outlet 120, the cassette purge assembly 100 preferably further includes a sealing ring 140, as shown in fig. 9, where the sealing ring 140 is located between the columnar body 131 and the inner wall of the rotation groove 112. Accordingly, grooves may be formed on the rotation surface of the cylindrical body 131 and the inner wall of the rotation groove 112 to accommodate the sealing rings 140.
In this embodiment, the seal ring 140 can maintain the rotation angle of the columnar body 131 in the rotary groove 112 by friction force, so as to improve the stability of the air outlet surface area adjustment control of the air outlet 120.
As shown in fig. 20, the area of the air outlet surface of one air outlet 120 on the purge module 100 of the storage box according to an embodiment of the present invention changes with the rotation angle of the columnar body 131, and as the columnar body 131 rotates, the area of the air outlet surface of the air outlet 120 changes from 100% of the area of the air outlet 120 (the case shown in fig. 20 (a)) to 80% of the area of the air outlet 120 (the case shown in fig. 20 (b)), and after the columnar body 131 rotates 180 °, the minimum 40% of the area of the air outlet 120 is reached (the case shown in fig. 20 (c)).
As a second aspect of the present invention, there is provided a cartridge opening mechanism 10, as shown in fig. 21 to 24, the cartridge opening mechanism 10 including a cartridge opening assembly 200 and a cartridge purge assembly 100, the cartridge 20 including a cartridge body 21 and a door 22, the cartridge body 21 being formed with an opening, the door 22 being for closing the opening, and the cartridge purge assembly being for introducing purge gas into the cartridge body 21 through a gap between the door 22 and the opening of the cartridge body 21 when the cartridge opening assembly 200 opens the door 22 of the cartridge 20, wherein the cartridge purge assembly is the cartridge purge assembly 100 provided in the previous embodiment.
In the wafer box opening mechanism 10 provided by the invention, the air outlet areas of the plurality of air outlets 120 on the wafer box purging component 100 are adjustable, when the wafer box 20 is purged by the wafer box purging component 100, the air outlet areas of the air outlets 120 can be adjusted, the difference between the flow rates of the air flows blown out by the air outlets 120 is eliminated, so that the flow rates of the air flows at the height positions of the wafer box 20 are equal, the particle pollution on the surface of a wafer is relieved, the removal efficiency of the air (such as oxygen) in the wafer box 20 is improved, and the overall operation efficiency of a machine is further improved.
The structure of the cassette opening assembly 200 is not particularly limited in this embodiment of the present invention, for example, as shown in fig. 21 and 22, the cassette opening assembly 200 may include an air cylinder 210 and a door opening mechanism 220, and after the door opening mechanism 220 is connected to the door 22 of the cassette 20, the air cylinder 210 pulls the door opening mechanism 220 to open the door, and the cassette purge assembly 100 introduces purge gas into the cassette 21 through a gap between the door 22 and an opening of the cassette 21.
As a third aspect of the present invention, there is provided a cartridge device comprising a housing 21 and a door 22, the housing 21 having an opening formed therein, the door 22 being adapted to close the opening. The cassette apparatus further includes the cassette purge assembly 100 provided in the previous embodiments, the cassette purge assembly 100 being disposed on an inner wall of the cassette 21 and configured to blow purge gas into the cassette 21 when the door 22 is opened.
In the wafer box device provided by the invention, the air outlet areas of the plurality of air outlets 120 on the wafer box purging component 100 are adjustable, when the wafer box purging component 100 is utilized to purge the wafer box 20, the air outlet areas of the air outlets 120 can be adjusted, the difference between the flow rates of the air flows blown out by the air outlets 120 is eliminated, so that the flow rates of the air flows at the height positions of the wafer box 20 are equal, the particle pollution on the surface of a wafer is relieved, the removal efficiency of the air (such as oxygen) in the wafer box 20 is improved, and the overall operation efficiency of a machine is further improved.
The embodiment of the present invention is not particularly limited as to how to open and close the door 22, for example, the cartridge opening mechanism 10 provided in the previous embodiment may be provided in the cartridge device provided in the present invention, that is, the cartridge device further includes the cartridge opening assembly 200.
As a fourth aspect of the present invention, there is provided a semiconductor process apparatus including a cassette opening mechanism 10, a cassette apparatus, a reaction chamber 30, and a transport chamber 40 as shown in fig. 25 and 26, the cassette apparatus being provided in the previous embodiment, a robot 41 for loading and unloading wafers 2 from a cassette body 21 of the cassette apparatus, and a boat 42 for carrying and transporting wafers 2 into the reaction chamber 30 being provided in the transport chamber 40.
In the semiconductor process equipment provided by the invention, the air outlet areas of the plurality of air outlets 120 on the wafer box purging assembly 100 in the wafer box opening mechanism 10 are adjustable, when the wafer box purging assembly 100 is utilized to purge the wafer box 20, the air outlet areas of the air outlets 120 can be adjusted, the difference between the flow rates of air flows blown out by the air outlets 120 is eliminated, so that the flow rates of the air flows at the height positions of the wafer box 20 are equal, the particle pollution on the surface of a wafer is relieved, the removal efficiency of the gas discharged by the wafer box is improved, and the overall operation efficiency of a machine is further improved.
It is to be understood that the above embodiments are merely illustrative of the application of the principles of the present invention, but not in limitation thereof. Various modifications and improvements may be made by those skilled in the art without departing from the spirit and substance of the invention, and are also considered to be within the scope of the invention.
Claims (7)
1. The wafer box purging component is used for purging the wafer box and is characterized by comprising a shell, wherein an air inlet used for inputting purge gas and a plurality of air outlets used for outputting the purge gas to the wafer box are formed on the shell, and the air outlet area of each air outlet is adjustable so that the air flow rate of each height position of the wafer box is equal;
the plurality of air outlets are distributed on the shell along the length direction of the shell, and the opening size of the air outlets positioned at the two end parts of the shell is smaller than that of the air outlets positioned between the two end parts of the shell;
the opening size of the air outlet is the opening size of the air outlet on the outer surface of the shell;
the number of the air inlets is two, and the two air inlets are respectively arranged at two ends of the shell;
the wafer storage box purging component further comprises a plurality of adjusting pieces which are arranged in one-to-one correspondence with the air outlets, the adjusting pieces are movably connected with the shell, and the air outlet area of the air outlets is changed along with the movement of the corresponding adjusting pieces relative to the shell.
2. The cassette purge assembly of claim 1, wherein the adjustment member comprises a cylindrical body and an adjustment aperture extending through the cylindrical body, the adjustment aperture being eccentrically disposed with the cylindrical body, the cylindrical body being movably coupled to the housing, an area of overlap of the adjustment aperture with the air outlet changing as the cylindrical body moves relative to the housing.
3. The cassette purge assembly of claim 2, wherein the housing has a plurality of swivel slots formed therein, and wherein the plurality of swivel slots are in one-to-one correspondence with the plurality of air outlets, and wherein the adjustment member is disposed in the swivel slots, and wherein the adjustment member is rotatable in the swivel slots.
4. A cassette purge assembly according to claim 3, further comprising a seal ring located between the cylindrical body and the inner wall of the swivel groove.
5. A cassette purge assembly as claimed in claim 3, wherein a torsion slot is formed in a side of the cylindrical body facing away from the air outlet, the torsion slot being for insertion of a torsion tool such that the torsion tool can rotate the cylindrical body through the torsion slot.
6. The cassette purge assembly of claim 5, wherein the torsion slot is a socket head cap slot and the torsion tool is a socket head cap wrench.
7. A wafer cassette device comprising a cassette body and a door, wherein an opening is formed in the cassette body, the door is used for closing the opening, and the wafer cassette device is characterized in that the wafer cassette device further comprises a wafer cassette purging component according to any one of claims 1-6, wherein the wafer cassette purging component is arranged on the inner wall of the cassette body and is used for blowing purging gas into the cassette body when the door is opened.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010680998.XA CN111681977B (en) | 2020-07-15 | 2020-07-15 | Wafer cassette purge assembly and wafer cassette apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010680998.XA CN111681977B (en) | 2020-07-15 | 2020-07-15 | Wafer cassette purge assembly and wafer cassette apparatus |
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| Publication Number | Publication Date |
|---|---|
| CN111681977A CN111681977A (en) | 2020-09-18 |
| CN111681977B true CN111681977B (en) | 2024-01-05 |
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| CN202010680998.XA Active CN111681977B (en) | 2020-07-15 | 2020-07-15 | Wafer cassette purge assembly and wafer cassette apparatus |
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| CN115178435B (en) * | 2022-09-14 | 2022-12-30 | 上海图双精密装备有限公司 | Automatic wafer glue spreader |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003297818A (en) * | 2002-04-05 | 2003-10-17 | Hitachi Kokusai Electric Inc | Substrate treatment apparatus |
| KR20140055699A (en) * | 2012-11-01 | 2014-05-09 | 우범제 | A purge gas pipe of the wafer purging cassette |
| CN104867853A (en) * | 2015-03-30 | 2015-08-26 | 上海华力微电子有限公司 | FOUP structure and FOUP cleaning method |
| JP2016127106A (en) * | 2014-12-26 | 2016-07-11 | Tdk株式会社 | Gas purge unit |
| JP2017017264A (en) * | 2015-07-06 | 2017-01-19 | 信越ポリマー株式会社 | Substrate housing container |
| CN110325283A (en) * | 2017-02-08 | 2019-10-11 | Oem集团有限责任公司 | Flow rate adjustable nozzle system |
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| JP5494734B2 (en) * | 2011-08-15 | 2014-05-21 | Ｔｄｋ株式会社 | Purge device and load port device having the purge device |
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003297818A (en) * | 2002-04-05 | 2003-10-17 | Hitachi Kokusai Electric Inc | Substrate treatment apparatus |
| KR20140055699A (en) * | 2012-11-01 | 2014-05-09 | 우범제 | A purge gas pipe of the wafer purging cassette |
| JP2016127106A (en) * | 2014-12-26 | 2016-07-11 | Tdk株式会社 | Gas purge unit |
| CN104867853A (en) * | 2015-03-30 | 2015-08-26 | 上海华力微电子有限公司 | FOUP structure and FOUP cleaning method |
| JP2017017264A (en) * | 2015-07-06 | 2017-01-19 | 信越ポリマー株式会社 | Substrate housing container |
| CN110325283A (en) * | 2017-02-08 | 2019-10-11 | Oem集团有限责任公司 | Flow rate adjustable nozzle system |
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