JP2003283174A - Sealing cover-equipped board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To moderate stress produced in a board owing to a force applied to a mounting region where parts are mounted in a sealing cover-equipped board, and improve cooling efficiency upon cooling the parts. <P>SOLUTION: Between a mounting region 11 for mounting a CCD device 1 in a board 10, and a holding region 12 held between a pair of surface side cover 20 and a back side cover 21 for holding the surroundings of the mounting region 11 from the surface and the back surface and containing the CCD device 1 therein to close the same there is formed a slit 40 penetrating the surface and the back of the board 10. Further, the CCD device 1 is cooled by a Peltier device 30 disposed on the back side cover 21. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate with a hermetic cover, and more particularly to a substrate with a hermetic cover having a function of cooling mounted components that are hermetically housed.

[0002]

2. Description of the Related Art A dark current is generated in a CCD depending on the temperature, and this dark current increases as the temperature rises. Since the dark current is mixed as noise in the signal photoelectrically converted by the CCD, the CCD is cooled by a Peltier element to reduce the dark current, especially when trying to acquire the signal with a high S / N. The noise mixed in is suppressed. Further, in order to prevent dew condensation due to the cooling, the periphery of the mounting area in the substrate on which the CCD to be cooled is mounted is sandwiched by a pair of front and back covers from the front and back sides of the substrate, and the CCD is housed inside. Techniques are also known.

[0003]

However, even if heat is taken from the CCD by cooling the Peltier element, it is sandwiched between the pair of front cover and back cover, C
Since heat is conducted from the outside through the substrate on which the CD is mounted and heat is applied to this CCD, there is a problem that the cooling efficiency for cooling the CCD is reduced.

In order to remove heat from the CCD, the CC
When the position of the cooling surface of the Peltier element that is in close contact with D does not match the position of the cooled surface of the CCD that is in close contact with this cooling surface and that is mounted on the substrate, the CCD is pressed by the Peltier element and the CCD is mounted. There is a problem that the above-mentioned substrate is distorted by the force applied to the substrate and a stress is generated in the substrate, which causes a disconnection of the substrate wiring and deteriorates the sealing property of the front and back covers.

The present invention has been made in view of the above circumstances, and alleviates the stress generated in the substrate by the force applied to the mounting area in the substrate on which the component is mounted, and cools the component. It is an object of the present invention to provide a substrate with a hermetic cover, which can enhance the cooling efficiency when performing.

[0006]

A substrate with a hermetic cover according to the present invention sandwiches a substrate on which a component is mounted and a mounting region of the substrate on which the component is mounted from both front and back sides of the substrate. A substrate with a hermetically-sealing cover, comprising a pair of front and back covers for accommodating and hermetically sealing the components therein, and cooling means arranged on the front or back cover to cool the components. A slit is formed between the sandwiching region sandwiched between the front cover and the back cover, and the mounting region, the slit penetrating the substrate to the front and back.

The slit is 1/3 of the circumference of the mounting area.
It is preferably formed over 2/3 or less.

The component may be a CCD, and the cooling means may be a Peltier element. Further, the substrate can be a flexible printed circuit board (also referred to as an FPC board).

The slits are not limited to being formed continuously around the mounting area, but may be formed intermittently.

[0010]

According to the substrate with the hermetic cover of the present invention,
In the board, between the holding area sandwiched between the front cover and the back cover and the mounting area, a slit is formed so as to penetrate the board to the front and back sides. On the other hand, the mounting region is easily displaced, and the stress generated in the substrate by the force applied to the mounting region in which the component is mounted can be relieved. Along with this, a part of the heat conduction path transmitted to the mounting area through the holding area is blocked by the slit, and the unit time transmitted from the holding area to the mounting area is greater than when the slit is not formed. Since the amount of heat per hit is reduced, it is possible to improve the cooling efficiency when cooling the components in the mounting area.

If the slits are formed over 1/3 or more and 2/3 or less of the circumference of the mounting area, the slits are formed over 2/3 or less of the circumference of the mounting area. It is possible to obtain the effect of doing so, that is, the effect of surely securing the area necessary for wiring and the area necessary for holding the mounting area, and the slit extends over 1/3 or more of the circumference of the mounting area. It is possible to obtain the effect of the formation, that is, the effect of surely increasing the cooling efficiency for cooling the components in the mounting area as compared with the case where there is no slit.

Further, if the above component is a CCD and the cooling means is a Peltier element, the dark current generated in the CCD increases sensitively to a rise in temperature. Therefore, the dark current is improved by improving the cooling efficiency. It is possible to enjoy a great effect of reducing the temperature and surely cool the CCD. Also, if the above-mentioned board is a flexible printed board, since the flexible printed board has a relatively high thermal conductivity compared to other types of boards, the amount of heat per unit time that is formed by forming a slit and is conducted to the mounting area. It is possible to enjoy a great effect of improving the cooling efficiency by reducing the amount.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Specific embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic view showing the configuration of a substrate with a hermetic cover according to an embodiment of the present invention, and FIG. 1A is a plan view of the substrate with a hermetic cover seen from above with the front cover removed. FIG. 2B is a cross-sectional view showing a side surface of the substrate with the hermetic cover, and FIG. 2 is a view showing how the Peltier device cools the CCD device.

The substrate 50 with a hermetic cover according to the embodiment of the present invention includes a flexible printed circuit board (hereinafter referred to as an FPC board 10) on which the CCD element 1 which is a component is mounted, and the CCD element 1 in the FPC board 10. A pair of front and back covers 20 and 21 for sandwiching the periphery of the mounting area 11 on which is mounted from both sides of the front and back of the FPC board 10 to accommodate and seal the CCD element 1 therein.
The mounting area 11 in the FPC board 10 and the sandwiching area 12 sandwiched between the front cover 20 and the back cover 21 are provided with a Peltier element 30 arranged on the back cover 21 to cool the CCD element 1. In between, a slit 40 that penetrates the FPC board 10 on the front and back is formed.

The slit 40 is provided in the mounting area 11
Is continuously formed over 1/3 or more and 2/3 or less of the circumference.

The driving power of the CCD element 1, the photoelectrically converted signal, and the like are input and output from a connector 16 provided in the lead-out portion 15 of the FPC board 10. The front cover 20 has a light receiving window 21 at a position facing the light receiving surface 2 of the CCD element 1, and external light enters through the light receiving window 21 and is received by the light receiving surface 2.

Further, the Peltier device 30 has a back cover 21.
It is fixed on the inner surface 22 of the. The Peltier element 30 is screwed to the CCD element 1, and the cooling surface 31 of the Peltier element 30 is in close contact with the cooled surface 3 of the CCD element 1 opposite to the light receiving surface 2 via grease. Therefore, the position of the CCD element 1 is substantially irrespective of the position of the holding area 12 in the FPC board 10, and the Peltier element 30 is substantially located.
It is determined according to the position of the cooling surface 31 of the. At this time, a force is applied to the mounting area 11 by the Peltier element 30 and the position of the mounting area 11 changes with respect to the position of the holding area 12. It is absorbed and no large stress is generated in the substrate 10. The power supply for driving the Peltier device 30 is supplied by the connector 35 provided on the back cover 21.
Through.

The substrate 50 with the hermetic cover is fixed to the base table 60 having the heat dissipation fins 61 and having a high thermal conductivity via the back cover 21.

Here, cooling of the CCD element 1 by the Peltier element 30 will be described with reference to FIG.

When the Peltier element 30 is driven, the Peltier element 30 draws heat from the CCD element 1 through the cooling surface 31 to cool the CCD element 1. The heat taken by the Peltier element 30 from the CCD element 1 is conducted from the heat radiation surface 32 opposite to the cooling surface 31 to the base 60 through the back cover 21 and is radiated.

On the other hand, when the CCD element 1 is cooled, the CC
When the temperature of the D element 1 is lowered, the heat transferred through the FPC board 10 is applied to the CCD element 1 through the pin 5 of the CCD element. That is, the heat applied to the back cover 21 and the front cover 20 from the outside gas by heat transfer (see arrow H1 in the figure), and the Peltier element 30 by heat conduction.
The heat (see the arrow H2 in the figure) transferred from the heat radiation surface 32 of the device to the back cover 21 is conducted to the CCD element 1 through the holding area 12 and the mounting area 11 of the FPC board 10 (see the arrow H3 in the figure). . However, the FPC board 10
The slit 40 is provided between the holding area 12 and the mounting area 11 of
Are formed, the CCD element 1 is
The amount of heat per unit time transmitted to the mounting area 11 where is mounted is small, and the Peltier device 30 can efficiently cool the CCD device 1.

In the above embodiment, the Peltier element is arranged on the back cover, but it may be arranged on the front cover to cool the CCD element.

Further, in the above embodiment, the slit is formed over 1/3 or more and 2/3 or less of the periphery of the mounting area, but the formation range of this slit is not necessarily the above range. The present invention is not limited to this, and even if the slit is formed in a range of 1/3 or less around the mounting area, or even if the slit is formed in a range of 2/3 or more around the mounting area, the same effect as above can be obtained. it can.

Further, it is not always necessary to use CCD as the above component and the Peltier device as the cooling means, and the above component may be another type of image pickup device, CPU, or any other component whose characteristics are improved by cooling. Any component may be used, and the cooling means may be of any type as long as it removes heat from the component.

Further, in the above-mentioned embodiment, the substrate is the FPC substrate, but the same effect as above can be obtained even if the substrate is another type such as a glass epoxy substrate.

[Brief description of drawings]

FIG. 1 is a schematic diagram showing a configuration of a substrate with a hermetic cover according to an embodiment of the present invention.

FIG. 2 is a sectional view showing a state in which a CCD element is cooled by a Peltier element from a side surface.

[Explanation of symbols]

1 CCD element 10 FPC board 11 mounting area 12 Narrow area 20 Front cover 21 Back cover 30 Peltier element 40 slits 50 Substrate with airtight cover 60 base stand

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Claims (4)

[Claims] 1. A board on which a component is mounted, and a pair of front sides for accommodating and sealing the component inside by sandwiching the periphery of a mounting area of the substrate on which the component is mounted from both front and back sides of the substrate. A substrate with a hermetic cover, comprising a cover and a back cover, and cooling means arranged on the front cover or the back cover to cool the component, the substrate being sandwiched between the front cover and the back cover in the substrate. A substrate with a hermetic cover, characterized in that a slit is formed between the sandwiching region and the mounting region, the slit penetrating the substrate to the front and back. 2. The slit is formed around the mounting area.
The substrate with a hermetic cover according to claim 1, wherein the substrate is formed over / 3 or more and 2/3 or less. 3. The substrate with a hermetic cover according to claim 1, wherein the component is a CCD and the cooling means is a Peltier device. 4. The board with a hermetic cover according to claim 1, wherein the board is a flexible printed board.