JP2003282976A - Brazing material for micro board and method for manufacturing peltier element - Google Patents
Brazing material for micro board and method for manufacturing peltier elementInfo
- Publication number
- JP2003282976A JP2003282976A JP2002080054A JP2002080054A JP2003282976A JP 2003282976 A JP2003282976 A JP 2003282976A JP 2002080054 A JP2002080054 A JP 2002080054A JP 2002080054 A JP2002080054 A JP 2002080054A JP 2003282976 A JP2003282976 A JP 2003282976A
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- substrate
- island
- brazing material
- filler metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005219 brazing Methods 0.000 title claims abstract description 121
- 239000000463 material Substances 0.000 title claims abstract description 109
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000000034 method Methods 0.000 title claims abstract description 8
- 239000000758 substrate Substances 0.000 claims description 52
- 239000000945 filler Substances 0.000 claims description 45
- 239000002184 metal Substances 0.000 claims description 45
- 229910052751 metal Inorganic materials 0.000 claims description 45
- 238000005304 joining Methods 0.000 claims description 12
- 150000002739 metals Chemical class 0.000 claims description 11
- 230000008878 coupling Effects 0.000 abstract 6
- 238000010168 coupling process Methods 0.000 abstract 6
- 238000005859 coupling reaction Methods 0.000 abstract 6
- 238000010586 diagram Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910002909 Bi-Te Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910015363 Au—Sn Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000002305 electric material Substances 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ペルチェ素子等の
微小な回路基板を製造する際に好適なろう材に関する。TECHNICAL FIELD The present invention relates to a brazing material suitable for manufacturing a minute circuit board such as a Peltier element.
【０００２】[0002]
【従来の技術】図４は、一般的なペルチェ素子の構造を
示す。図４においてペルチェ素子は、基板１０の上に適
宜のパターンにより配置された電極１１の間に熱電材料
チップ１２が接合されたサンドイッチ構造を有する。熱
電材料チップ１２は、ｐ型、ｎ型の半導体材料が用いら
れており、交互に配置されている。また、半導体材料と
しては、Ｂｉ−Ｔｅ系半導体材料（例えば、ｐ型材料と
して（Ｂｉ０．２５Ｓｂ ０．７５）２（Ｔｅ０．９５Ｓ
ｅ０．０５）３が、ｎ型材料としてＢｉ２（Ｔｅ
０．９５Ｓｅ０．０５）３が用いられている。）が良く
用いられている。2. Description of the Related Art FIG. 4 shows the structure of a general Peltier device.
Show. In FIG. 4, the Peltier device is mounted on the substrate 10.
Thermoelectric material between the electrodes 11 arranged in a suitable pattern
It has a sandwich structure in which the chips 12 are joined. heat
The electric material chip 12 is made of a p-type or n-type semiconductor material.
Are arranged alternately. Also, with semiconductor materials
Then, a Bi-Te based semiconductor material (for example, a p-type material and
Then (Bi0.25Sb 0.75)Two(Te0.95S
e0.05)ThreeHowever, as an n-type material, BiTwo(Te
0.95Se0.05)ThreeIs used. ) Is good
It is used.
【０００３】このペルチェ素子は、ノンフロンの冷却装
置であり環境にも優しく、騒音を発生しないことから、
大型の冷蔵庫等にも利用されることが多いが、上記特徴
に加え、温度制御が容易で、特に、小型化・軽量化が容
易であることからレーザーダイオード、光モジュール等
の小型装置の冷却装置として利用も検討されている。Since this Peltier element is a non-CFC cooling device, is environmentally friendly and does not generate noise,
It is often used for large refrigerators, etc., but in addition to the above features, temperature control is easy, and in particular, it is easy to reduce size and weight, so it is a cooling device for small devices such as laser diodes and optical modules. It is also being considered for use.
【０００４】かかる構造を有するペルチェ素子の製造方
法としては、図５に示すようなものが一般的である。ま
ず、熱電材料の単結晶インゴット２０を製造した後にこ
のインゴットからウエハー２１を切り出し、更にウエハ
ー２１をチップ形状にダイシングして熱電材料チップ１
２を製造する。そして、予めめっき法等により所定のパ
ターンに形成された電極１１上に熱電材料チップ１２を
載置して接合し、同様にもう一方の基板１０’を被せて
接合する。ここで、基板１０、１０’上の電極１１、１
１’と熱電材料チップ１２との接合においては、接合強
度を確保するためにろう材によりろう付けするのが通常
であり、その際には電極と熱電材料チップとのいずれか
にろう材を取り付けている。As a method of manufacturing a Peltier device having such a structure, a method as shown in FIG. 5 is generally used. First, after manufacturing a single crystal ingot 20 of a thermoelectric material, a wafer 21 is cut out from this ingot, and the wafer 21 is diced into a chip shape to form a thermoelectric material chip 1.
2 is produced. Then, the thermoelectric material chip 12 is placed and bonded on the electrode 11 which is formed in a predetermined pattern by a plating method or the like in advance, and the other substrate 10 'is similarly covered and bonded. Here, the electrodes 11, 1 on the substrates 10, 10 '
When joining 1'and the thermoelectric material chip 12, it is usual to braze with a brazing material in order to secure the bonding strength. At that time, the brazing material is attached to either the electrode or the thermoelectric material chip. ing.
【０００５】[0005]
【発明が解決しようとする課題】このペルチェ素子の例
のように、回路基板には基板上に複数の部品（それらが
同種のものか否かによらず）取り付けることにより製造
されるものが多いが、その製造工程は上記ペルチェ素子
の場合と同様、接合ずる部材にろう材を融着し、これを
基板上に接合している。As in the case of this Peltier element, many circuit boards are manufactured by mounting a plurality of components (regardless of whether they are of the same type or not) on the circuit board. However, in the manufacturing process, as in the case of the Peltier element, the brazing material is fused to the member to be joined, and this is joined to the substrate.
【０００６】しかし、多数の電極又は部材上に一つ一つ
ろう材を取り付けるのは作業効率上好ましいものではな
い。特に、近年のデバイスは小型化される傾向にあると
ともに、部材の集積度も高くすることが要求される。そ
して、そのような小型、高密度のデバイスを製造するた
めに部材一つ一つにろう材を接合するのは一層困難を極
める。However, it is not preferable in terms of work efficiency to attach the brazing material to each of a large number of electrodes or members. In particular, recent devices tend to be miniaturized, and higher integration of members is required. Further, it is more difficult to join the brazing filler metal to each member in order to manufacture such a small-sized and high-density device.
【０００７】そこで、本発明は以上のような背景のもと
になされたものであり、特に小型の基板上に複数の部材
を取り付ける方法において、部材の接合を簡易に行なう
ことができ、効率的に回路を製造することのできる手法
を提供することを目的とする。Therefore, the present invention has been made based on the background as described above, and particularly in a method of mounting a plurality of members on a small-sized substrate, the members can be easily joined and efficiently. It is an object of the present invention to provide a method capable of manufacturing a circuit.
【０００８】[0008]
【課題を解決するための手段】本発明者等は上記課題を
解決すべく検討を行ない、基板と部材との接合におい
て、基板上の部材接合部位にまずろう材を接合してから
部材を接合することとした。そして、その上で基板への
ろう材の接合工程につき、複数の接合対象にろう材を１
回のセット（ろう材の載置、溶融）のみで接合できるよ
うにし、そのために基板上の接合対象の配置パターンに
対応する複数のろう材を一体化させ、このろう材の適用
に想到した。Means for Solving the Problems The inventors of the present invention have conducted studies to solve the above problems, and when joining a substrate and a member, first join a brazing material to a member joining site on the substrate and then join the member. It was decided to. Then, in the step of joining the brazing material to the substrate, the brazing material is applied to a plurality of joining objects.
We made it possible to join by only one set (placement and melting of the brazing material), and for that purpose, we integrated a plurality of brazing materials corresponding to the arrangement pattern of the objects to be joined on the substrate, and thought about the application of this brazing material.
【０００９】即ち、本発明は、微小基板上に所定のパタ
ーンで配置された複数の接合対象上に接合可能なろう材
であって、前記複数の接合対象の配置パターンに対応し
て配置される複数の島状ろう材と、該島状ろう材どうし
を連結する島状ろう材と同材質の連結部材とからなり、
前記連結部材の体積が前記島状ろうの体積よりも小さ
く、１の島状ろう材が隣接する少なくとも一つの他の島
状ろう材と連結部材により連結されることにより複数の
島状ろう材が一体化されてなる微小基板用のろう材であ
る。That is, the present invention is a brazing filler metal that can be bonded on a plurality of bonding targets arranged in a predetermined pattern on a micro substrate, and is arranged corresponding to the plurality of bonding pattern of the bonding targets. A plurality of island-shaped brazing filler metals, and a connecting member made of the same material as the island-shaped brazing filler metals for connecting the island-shaped brazing filler metals,
The volume of the connecting member is smaller than the volume of the island-shaped brazing material, and one island-shaped brazing material is connected to at least one other island-shaped brazing material by the connecting member to form a plurality of island-shaped brazing materials. It is a brazing material for micro substrates that is integrated.
【００１０】本発明に係るろう材は、基板上の接合対象
に対応させて島状ろう材を配し、それらを一体化させる
ことでろう材の位置決め、接合を１セットでできるよう
にしたものである。そして、複数の島状ろう材を一体化
させる連結部材は、その体積が島状ろう材の体積より小
さくなるよう形成されている。これは、ろう材接合時
（溶融時）において溶融した連結部材が、表面張力によ
り島状ろう材に引っ張られるようするためである。この
ようにすることにより、ろう材の接合時に溶融した連結
部材が接合対象以外の箇所に残るのを抑制している。In the brazing material according to the present invention, an island-shaped brazing material is arranged in correspondence with the objects to be joined on the substrate and they are integrated so that the brazing material can be positioned and joined in one set. Is. The connecting member that integrates the plurality of island-shaped brazing filler metals is formed so that its volume is smaller than that of the island-shaped brazing filler metal. This is because the connecting member melted at the time of joining (melting) the brazing filler metal is pulled by the island-shaped brazing filler metal due to the surface tension. By doing so, it is possible to prevent the connecting member melted at the time of joining the brazing materials from remaining at a portion other than the joining target.
【００１１】そして、このように溶融時の表面張力によ
り連結部材が島状ろう材により吸収されるためには、特
に、複数の連結部材を基板上に残ることなく確実に消失
させるためには、島状ろう材の体積と連結部材の体積と
の比率を６０：１〜３０：１とするのが好ましい。連結
部材の体積を３０：１より大きくすると、全ての連結部
材が島状ろう材に吸収されないおそれがあり、また、連
結部材の体積が６０：１未満と小さすぎると（細すぎる
と）ろう材全体の強度が不足して作業中にろう材が破壊
することがあるからである。また、連結部材があまりに
細いろう材を製造するのは困難だからである。In order for the connecting members to be absorbed by the island-shaped brazing material due to the surface tension at the time of melting in this way, in particular, in order to surely eliminate the plurality of connecting members without remaining on the substrate, The ratio of the volume of the island-shaped brazing material to the volume of the connecting member is preferably 60: 1 to 30: 1. When the volume of the connecting member is larger than 30: 1, all the connecting members may not be absorbed by the island-shaped brazing material, and when the volume of the connecting member is less than 60: 1 (too thin), the brazing material is too small. This is because the brazing filler metal may break during the work due to insufficient overall strength. Also, it is difficult to manufacture a brazing filler metal whose connecting member is too thin.
【００１２】また、複数の島状ろう材を一体化する連結
部材の配置は、全ての島状ろう材を相互に連結されるよ
うに配置されている必要はなく、一の島状ろう材が隣接
する少なくとも一つの他の島状ろう材と連結され、ろう
材全体として一体化が可能となるように配されていれば
良い。即ち、例えば、図１（ａ）のように、島状ろう材
に隣接する全ての島状ろう材が連結部材により相互に連
結されていても良いが、図１（ｂ）のように、隣接する
島状ろう材のいずれかを連結しつつ全体的に一体化を図
っても良い。但し、上述のように連結部材はろう材の接
合時に島状ろう材に吸収されることとなるので、連結部
材の配置を部分的にすると個々の島状ろう材の体積にバ
ラツキが生じるおそれがある。また、ろう材全体の強度
も低下し取り扱い時に破断するおそれもある。そこで、
一の島状ろう材が隣接する全ての他の島状ろう材と連結
されるのが好ましい。Further, the arrangement of the connecting members for integrating a plurality of island-shaped brazing filler metals does not need to be arranged so as to connect all the island-shaped brazing filler metals to each other, and one island-shaped brazing filler metal is adjacent to each other. It suffices if it is connected to at least one other island-shaped brazing material and arranged so that the brazing material as a whole can be integrated. That is, for example, as shown in FIG. 1A, all the island-shaped brazing materials adjacent to the island-shaped brazing material may be connected to each other by a connecting member, but as shown in FIG. Any one of the island-shaped brazing filler metals may be connected and integrated as a whole. However, as described above, since the connecting member is absorbed by the island-shaped brazing filler metal when the brazing filler metal is joined, the volume of each island-shaped brazing filler metal may vary when the connecting members are partially arranged. is there. In addition, the strength of the brazing material as a whole is reduced, and there is a risk of breakage during handling. Therefore,
It is preferable that one brazing filler metal is connected with all other neighboring brazing filler metals.
【００１３】尚、この本発明に係るろう材の製造は、所
定の組成のろう材を鋳造し、シート状又はテープ状のろ
う材に加工した後、打ち抜き加工により島状ろう材部分
と連結部材部分とを一度に製造するのが好ましい。ま
た、本発明においては、島状ろう材と連結部材とは同一
材質であるが、このろう材の材質としては、特に限定さ
れるものではない。従って、いわゆるはんだ（Ｐｂ−Ｓ
ｎ合金）の他、Ａｕ系ろう材（Ａｕ−Ｓｎ系、Ａｕ−Ｇ
ｅ系）でも本発明のろう材とすることができる。特に、
最近では環境問題への配慮から、電子材料分野において
は鉛フリーの接合材料の適用が好ましいとされているこ
とから、本発明に係るろう材についても、Ａｕ系ろう材
により構成することで今後の利用が期待される。The brazing filler metal according to the present invention is manufactured by casting a brazing filler metal having a predetermined composition into a sheet-shaped or tape-shaped brazing filler metal and then punching the brazing filler metal to the island-shaped brazing filler metal portion and the connecting member. It is preferred to manufacture the parts and the parts at once. Further, in the present invention, the island-shaped brazing material and the connecting member are made of the same material, but the material of the brazing material is not particularly limited. Therefore, so-called solder (Pb-S
n alloy), Au-based brazing material (Au-Sn-based, Au-G)
e)) can also be used as the brazing material of the present invention. In particular,
Recently, in consideration of environmental issues, it is preferable to apply lead-free bonding materials in the field of electronic materials. Therefore, the brazing filler metal according to the present invention will be made of Au-based brazing filler metals in the future. Expected to be used.
【００１４】このように、本発明によれば、微小基板上
の複数の接合対象に対し、１回のセットで同時にろう材
を融着させることができる。これにより微小回路の製造
を効率的に行なうことができる。As described above, according to the present invention, it is possible to simultaneously fuse the brazing material to a plurality of objects to be joined on the micro substrate in one set. This allows the microcircuit to be manufactured efficiently.
【００１５】そして、本発明はペルチェ素子の製造に特
に好適である。即ち、ペルチェ素子の製造工程は、上述
のように、一の基板上に配置された電極上に熱電材料を
接合した後、他の基板を一の基板に対向させて、該他の
基板上の電極と該熱電素子とを接合する工程よりなる。
そこで、熱電材料を基板に接合する工程において、ま
ず、一の基板又は他の基板の少なくともいずれかに本発
明に係るろう材により電極上にろう材を融着してろう材
つきの基板とし、この基板上に熱電材料を順次接合する
ものである。これにより、熱電材料一つ一つにろう材を
取り付けて電極に接合する必要がなく、ペルチェ素子の
製造を効率的に行なうことができる。The present invention is particularly suitable for manufacturing a Peltier device. That is, in the manufacturing process of the Peltier device, as described above, after bonding the thermoelectric material on the electrode arranged on one substrate, the other substrate is made to face the one substrate and the other substrate is placed on the other substrate. The step of joining the electrode and the thermoelectric element.
Therefore, in the step of joining the thermoelectric material to the substrate, first, a brazing material is fused on the electrodes by the brazing material according to the present invention to at least one of the one substrate and the other substrate to obtain a substrate with the brazing material, The thermoelectric material is sequentially bonded onto the substrate. As a result, it is not necessary to attach a brazing material to each thermoelectric material and bond it to the electrodes, and the Peltier device can be manufactured efficiently.
【００１６】[0016]
【発明の実施の形態】以下、本発明の好適と思われる実
施の形態について説明する。本実施形態では、ろう材組
成として金系ろう材（Ａｕ８０％−Ｓｎ２０％）の微小
基板用ろう材を製造し。このろう材を用いてペルチェ素
子を製造した。BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the present invention will be described below. In this embodiment, a brazing material for a fine substrate, which is a gold-based brazing material (Au 80% -Sn 20%) as a brazing material composition, is manufactured. A Peltier device was manufactured using this brazing material.
【００１７】ろう材の製造：まず、所定組成のろう材を
溶解鋳造してインゴットとし、これを圧延加工して厚さ
５０μｍ、幅２０ｍｍ、長さ１０ｍの単尺テープ状のろ
う材を加工製造した。そして、このテープ状ろう材を打
ち抜き加工により図２に示すような微小基板用ろう材１
とした。微小基板用ろう材１は、島状ろう材２と連結部
材３とからなり、この島状ろう材の配置は、ペルチェ素
子基板の電極のパターンに対応して配置されている。ま
た、本実施形態に係るろう材の寸法は、島状ろう材が
０．８×１．８ｍｍ、連結部材は０．１×０．２ｍｍと
した（厚さは共に５０μｍである。また、島状ろう材と
連結部材との体積比は約５０：１である。）。 Manufacture of a brazing material : First, a brazing material having a predetermined composition is melt-cast into an ingot, which is rolled and processed to manufacture a single tape-shaped brazing material having a thickness of 50 μm, a width of 20 mm and a length of 10 m. did. Then, this tape-shaped brazing material is punched to form a brazing material 1 for a micro substrate as shown in FIG.
And The brazing filler metal 1 for a micro substrate is composed of an island brazing filler metal 2 and a connecting member 3. The island brazing filler metal is arranged corresponding to the electrode pattern of the Peltier element substrate. Further, the dimensions of the brazing filler metal according to the present embodiment are 0.8 × 1.8 mm for the island-shaped brazing filler metal and 0.1 × 0.2 mm for the connecting member (both have a thickness of 50 μm. The volume ratio of the brazing filler metal to the connecting member is about 50: 1.).
【００１８】ペルチェ素子の製造：次に、製造した微小
基板用ろう材１を用いてペルチェ素子の製造を行なっ
た。図３に示すように、予め電極１１がめっきにより形
成された基板１０上に、ろう材１を電極１１と島状ろう
材とが重なるように載置した。そして、この基板を電気
炉中で３２０℃に６０秒加熱してろう材を溶融させた。
冷却後の基板を観察した所、全ての電極上にろう材が接
合されており、電極部分以外の箇所にろう材の付着はな
かった。 Manufacture of Peltier element : Next, a Peltier element was manufactured by using the manufactured brazing filler metal 1 for a micro substrate. As shown in FIG. 3, the brazing filler metal 1 was placed on the substrate 10 on which the electrodes 11 were formed by plating in advance so that the electrodes 11 and the island-shaped brazing filler metal overlap each other. Then, this substrate was heated at 320 ° C. for 60 seconds in an electric furnace to melt the brazing material.
When the substrate after cooling was observed, the brazing material was bonded on all the electrodes, and the brazing material was not attached to the parts other than the electrode parts.
【００１９】次に、ろう材接合後の基板上に、熱電材料
チップ（ｎ型、ｐ型Ｂｉ−Ｔｅ系半導体材料）１２を電
極（ろう材）上に順次載置、固定し、再度基板をリフロ
ーして熱電材料チップを接合した。更に、もう一方の基
板１０’の電極１１’についても、同様にろう材を融着
させた後、電極１１’と熱電材料チップ１２との位置合
せを行ないつつ基板１０’を被せ熱電材料チップ１２と
電極１１’とを接合した。Next, the thermoelectric material chips (n-type and p-type Bi-Te based semiconductor material) 12 are sequentially mounted and fixed on the electrodes (brazing material) on the substrate after the brazing material is joined, and the substrate is again mounted. Reflow was performed to bond the thermoelectric material chips. Similarly, for the electrode 11 'of the other substrate 10', after the brazing material is similarly fused, the electrode 11 'and the thermoelectric material chip 12 are aligned and the substrate 10' is covered to cover the thermoelectric material chip 12 And the electrode 11 'were joined.
【００２０】以上の工程により製造されたペルチェ素子
につきその製造を検査したところ、問題のない冷却性能
を示すことが確認された。When the manufacturing of the Peltier device manufactured by the above process was inspected, it was confirmed that the Peltier device showed a cooling performance without problems.
【００２１】[0021]
【発明の効果】以上説明したように本発明によれば、微
小な基板上の複数の接合対象へのろう材の融着を、ろう
材の1回セットで行なうことができる。そして、これに
より複数の接合対象への部材の接合を効率的にし、回路
基板の製造効率を向上させることができる。特に、ペル
チェ素子は、基板上に多数の熱電材料を接合するもので
あることから、本発明によれば、ペルチェ素子の製造効
率を向上させることができる。As described above, according to the present invention, it is possible to fuse the brazing material to a plurality of objects to be joined on a minute substrate with one set of the brazing material. This makes it possible to efficiently join the members to the plurality of joining targets and improve the manufacturing efficiency of the circuit board. In particular, since the Peltier device is one in which a large number of thermoelectric materials are bonded on the substrate, the present invention can improve the manufacturing efficiency of the Peltier device.
【図１】本発明に係る微小基板用ろう材の構成を概略示
す図。FIG. 1 is a diagram schematically showing a configuration of a brazing material for a micro substrate according to the present invention.
【図２】本実施形態に係る微小基板用ろう材を概略示す
図。FIG. 2 is a diagram schematically showing a brazing material for a micro substrate according to the present embodiment.
【図３】本実施形態に係るペルチェ素子の製造工程を概
略示す図。FIG. 3 is a diagram schematically showing a manufacturing process of the Peltier device according to the present embodiment.
【図４】ペルチェ素子の一般的な構成を示す図。FIG. 4 is a diagram showing a general configuration of a Peltier device.
【図５】ペルチェ素子の一般的な製造工程を示す図。FIG. 5 is a diagram showing a general manufacturing process of a Peltier device.
１ 微小基盤用ろう材 ２ 島状ろう材 ３ 連結部材 １０、１０’ 基板 １１，１１’ 電極 １２ 熱電材料チップ ２０ 熱電材料インゴット ２１ 熱電材料ウエハー 1 Brazing material for micro substrate 2 Island brazing material 3 connecting members 10, 10 'substrate 11,11 'electrode 12 Thermoelectric material chips 20 Thermoelectric material ingot 21 Thermoelectric material wafer
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｃ２２Ｃ 11/06 Ｃ２２Ｃ 11/06 13/00 13/00 ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 7 Identification code FI theme code (reference) C22C 11/06 C22C 11/06 13/00 13/00
Claims (4)
複数の接合対象上に接合可能なろう材であって、 前記複数の接合対象の配置パターンに対応して配置され
る複数の島状ろう材と、該島状ろう材どうしを連結する
島状ろう材と同材質の連結部材とからなり、 前記連結部材の体積が前記島状ろうの体積よりも小さ
く、 一の島状ろう材が、隣接する少なくとも一つの他の島状
ろう材と連結部材により連結されることにより複数の島
状ろう材が一体化されてなる微小基板用のろう材。1. A brazing filler metal capable of being bonded onto a plurality of bonding targets arranged in a predetermined pattern on a micro substrate, wherein a plurality of island shapes are arranged corresponding to the plurality of bonding target layout patterns. A brazing filler metal and a connecting member of the same material as the island-shaped brazing filler metal that connects the island-shaped brazing filler metals, wherein the volume of the connecting member is smaller than the volume of the island-shaped brazing filler metal, and one island-shaped brazing filler metal is adjacent to A brazing filler metal for a micro substrate, which is formed by integrating a plurality of island brazing filler metals by being connected to at least one other island brazing filler metal by a connecting member.
率が６０：１〜３０：１である請求項１記載の微小基板
用のろう材。2. The brazing material for a micro substrate according to claim 1, wherein the ratio of the volume of the island-shaped brazing material to the volume of the connecting member is 60: 1 to 30: 1.
ろう材と連結される請求項１又は請求項２記載微小基板
用のろう材。3. The brazing material for a micro substrate according to claim 1, wherein one brazing material for islands is connected to all the other brazing materials for islands adjacent to each other.
を接合した後、他の基板を一の基板に対向させて、該他
の基板上の電極と該熱電材料とを接合するペルチェ素子
の製造方法において、 前記一の基板及び／又は他の基板の電極上に請求項１〜
請求項３記載のろう材を載置して融着させた後に熱電材
料を接合するペルチェ素子の製造方法。4. A thermoelectric material is bonded onto an electrode arranged on one substrate, and then another substrate is opposed to the one substrate to bond the electrode on the other substrate to the thermoelectric material. A method for manufacturing a Peltier device, wherein the electrodes of the one substrate and / or the other substrate are provided.
A method of manufacturing a Peltier element, comprising the steps of placing the brazing material according to claim 3 and fusing the brazing material and then joining the thermoelectric materials.
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|---|---|---|---|
| JP2002080054A JP2003282976A (en) | 2002-03-22 | 2002-03-22 | Brazing material for micro board and method for manufacturing peltier element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002080054A JP2003282976A (en) | 2002-03-22 | 2002-03-22 | Brazing material for micro board and method for manufacturing peltier element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003282976A true JP2003282976A (en) | 2003-10-03 |
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ID=29229246
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
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| Country | Link |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014168811A (en) * | 2013-03-05 | 2014-09-18 | Mitsubishi Materials Corp | Brazing sheet, brazing sheet constitution body, and method for manufacturing power module circuit substrate |
-
2002
- 2002-03-22 JP JP2002080054A patent/JP2003282976A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014168811A (en) * | 2013-03-05 | 2014-09-18 | Mitsubishi Materials Corp | Brazing sheet, brazing sheet constitution body, and method for manufacturing power module circuit substrate |
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