JP2003282774A - Wiring board and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring board which enables an electronic component mounted on an insulating base to operate normally and stably for a long term by firmly bonding the insulating base and a metal frame together with an adhesive layer which is nearly uniform in thickness. <P>SOLUTION: The wiring board is equipped with the insulating base 1 provided with a mounting area A where the electronic component 4 is mounted on its top surface and a plurality of wiring conductors 5 extending from the undersurface of the mounting area A, and the metal frame 2 bonded to the top surface of the insulating base 1 through the intermediary of the adhesive layer 3 so as to surround the mounting area A. The adhesive layer 3 is a glass fiber fabric impregnated with a thermosetting resin, and the insulating base 1 and the metal frame 2 are bonded together under the condition in which the insulating base 1 and the metal frame 2 are pressure-welded to the glass fiber fabric of the adhesive layer 3. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an upper surface of an insulating substrate having a mounting portion on which an electronic component is mounted, and a metal frame body bonded to the upper surface of the insulating substrate via an adhesive layer so as to take in the mounting portion. The present invention relates to a wiring board.

[0002]

2. Description of the Related Art Conventionally, as a wiring board, for example, a mounting portion on which an electronic component such as a semiconductor element is mounted on the upper surface by flip-chip connection and is led out from this mounting portion to the lower surface and electrically connected to an electrode of the electronic component. And an organic material-based insulating base having a wiring conductor made of copper, and a copper bonded to the upper surface of the insulating base via an adhesive layer made of a thermosetting resin such as epoxy resin so as to surround the mounting portion. There is known a wiring board including a metal frame body made of.

This wiring board is a flip chip in which electronic components such as semiconductor elements are electrically connected to a mounting portion of an insulating substrate so that respective electrodes thereof are electrically connected to wiring conductors of the mounting portion through solder bumps or gold bumps. The product is mounted by connection, and then the metal lid is airtightly joined to the upper surface of the metal frame body so that the lower surface is thermally coupled to the upper surface of the electronic component through the thermally conductive grease. The electronic device is mounted on the external electric circuit board and is mounted on the external electric circuit board by connecting the wiring conductor led out on the lower surface of the insulating substrate to the wiring conductor of the external electric circuit board via solder. The electrodes of the component will be electrically connected to the external electrical circuit. Then, the heat generated when the electronic component operates is transferred to the metal lid and the metal frame via the heat conductive grease, and is radiated to the outside from there.

In such a wiring board, in order to bond the insulating base and the metal frame, an adhesive sheet made of a semi-cured thermosetting resin is sandwiched between the insulating base and the metal frame. And stack them with 0.3M from the top and bottom.
A method of bonding by applying a pressure of about Pa and heating to cure the thermosetting resin of the adhesive sheet has been adopted.

[0005]

However, according to this conventional wiring board, a large variation in the thickness of the adhesive layer is likely to occur due to the pressure applied when the insulating base body and the metal frame body are bonded via the adhesive layer. Therefore, the gap between the electronic component mounted on the mounting portion of the insulating base and the metal lid varies, which makes it difficult to thermally and satisfactorily bond the both with each other via the thermally conductive grease. There is a problem in that the heat generated during the operation of the component is not well dissipated to the outside through the metal lid and the metal frame, and the mounted electronic component cannot be stably operated. Further, when the insulating base and the metal frame are joined together via the adhesive layer, the thermosetting resin of the adhesive layer is likely to protrude to the outside, so that a large pressure cannot be applied to the adhesive layer. A void remains between the frame and the adhesive layer, and the bonding strength between the insulating base and the metal frame becomes weak, and the heat generated during operation of the electronic component is repeatedly applied between the insulating base and the metal frame. Then, peeling occurs between the insulating base and the metal frame due to thermal stress generated due to the difference in thermal expansion coefficient between the two, and as a result, the airtightness between the insulating base and the metal frame is reduced. There has been a problem that the electronic parts to be mounted are torn and cannot be operated normally.

The present invention has been devised in view of the above conventional problems, and an object thereof is to prevent a large variation in the thickness of an adhesive layer for adhering an insulating substrate and a metal frame, The electronic component mounted on the mounting portion of the insulating base and the metal lid can be fixed at a constant distance, and both can be thermally excellently coupled through the thermally conductive grease, and the insulating base and the metal frame can be connected to each other. Firmly adhered via the adhesive layer,
Accordingly, it is an object of the present invention to provide a wiring board capable of operating electronic components mounted on an insulating substrate normally and stably for a long period of time.

[0007]

A wiring board according to the present invention includes an insulating base having an upper surface on which an electronic component is mounted and a plurality of wiring conductors extending from the mounting surface to a lower surface, and an upper surface of the insulating base. A wiring board comprising a metal frame joined to the mounting portion via an adhesive layer so as to surround the mounting portion, wherein the adhesive layer is formed by impregnating a glass fiber woven fabric with a thermosetting resin, Further, the insulating base and the metal frame are joined to each other in a state of being pressed against the glass fiber woven fabric.

Further, in the method for manufacturing a wiring board of the present invention, an insulating base having a mounting portion on which an electronic component is mounted and a plurality of wiring conductors extending from the mounting portion to the lower surface, and an opening surrounding the mounting portion. A step of preparing a metal frame body having: and an adhesive sheet obtained by impregnating an uncured thermosetting resin into a frame-shaped glass fiber woven fabric having a size corresponding to the metal frame body; And the adhesive sheet and the metal frame are sequentially stacked so as to surround the mounting portion, and these are heated from above and below while applying a pressure of 0.5 MPa or more to the glass fiber woven fabric, the insulating substrate, and the The insulating frame and the metal frame are brought into contact with each other via an adhesive layer formed by curing the thermosetting resin of the adhesive sheet by pressing the metal frame with the thermosetting resin. It is characterized in that comprising a step of.

According to the wiring board of the present invention, the adhesive layer for joining the insulating base and the metal frame is formed by impregnating a glass fiber woven fabric with a thermosetting resin, and the insulating base and the metal frame. Is bonded to the glass fiber woven fabric in a pressure-contact state, the thickness of the adhesive layer for bonding the insulating substrate and the metal frame is controlled to a substantially constant thickness by the thickness of the glass fiber woven fabric. The base body and the metal frame body are firmly bonded via the adhesive layer.

Further, according to the method for manufacturing a wiring board of the present invention, an adhesive sheet made by impregnating a glass fiber woven fabric with an uncured thermosetting resin and a metal frame are sequentially stacked on the insulating substrate, and These are heated from above and below while applying a pressure of 0.5 MPa or more to bring the glass fiber woven fabric into pressure contact with the insulating substrate and the metal frame, and at the same time to thermoset the thermosetting resin to produce the insulating substrate and the above. Since the metal frame and the metal frame are joined via the adhesive layer formed by curing the thermosetting resin of the adhesive sheet, the thickness of the adhesive layer is controlled to be substantially constant by the thickness of the glass fiber woven fabric and the insulating substrate is formed. It is possible to obtain a wiring board in which the metal frame body and the metal frame body are firmly bonded to each other via the adhesive layer.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a wiring board of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a cross-sectional view showing an example of an embodiment of a wiring board of the present invention, in which 1 is an insulating substrate, 2 is a metal frame, 3 is an adhesive layer, and these mainly constitute the wiring board of the present invention. ing.

The insulating substrate 1 is formed by impregnating a glass fiber woven fabric in which glass fibers are woven longitudinally and transversely with a thermosetting resin such as epoxy resin or bismaleimide triazine resin. Layer 1b made of thermosetting resin such as or bismaleimide triazine resin
Is a multi-layered plate of an organic material system in which a plurality of layers are laminated, and an electronic component 4 such as a semiconductor element is provided at the center of the upper surface.
Is mounted, and a plurality of wiring conductors 5 made of a copper foil, a copper plating film, or the like are formed from the mounting portion A to the lower surface. Then, the electronic component 4 such as a semiconductor element is mounted on the mounting portion A by flip-chip connection in which the respective electrodes thereof and the wiring conductors 5 are electrically connected via the solder bumps 6.

The core body 1a constituting the insulating substrate 1 has a thickness of about 0.3 to 1.5 mm and has a plurality of through holes 7 having a diameter of about 0.1 to 1 mm from its upper surface to its lower surface. There is. A part of the wiring conductor 5 is attached to the upper and lower surfaces and the inner wall of each through hole 7, and the upper and lower wiring conductors 5 are electrically connected through the through hole 7.

Such a core 1a is manufactured by heat-curing a sheet in which a glass fabric is impregnated with an uncured thermosetting resin, and then performing a drilling process from the upper surface to the lower surface. The wiring conductors 5 on the upper and lower surfaces of the core 1a have a thickness of 3 to 50 on the entire upper and lower surfaces of the sheet for the core 1a.
A copper foil having a thickness of about μm is attached, and the copper foil is etched to form a predetermined pattern after being cured. In addition, the wiring conductor 5 on the inner wall of the through hole 7
Is formed by forming a through hole 7 in the core body 1a and then depositing a copper plating film having a thickness of about 3 to 50 μm on the inner wall of the through hole 7 by an electroless plating method and an electrolytic plating method.

Further, the core 1a is filled with a resin column 8 made of a thermosetting resin such as an epoxy resin or a bismaleimide triazine resin inside the through hole 7. The resin column 8 is for closing the through hole 7 so that the insulating layer 1b can be formed immediately above and below the through hole 7.
It is formed by filling an uncured pasty thermosetting resin into the through holes 7 by a screen printing method, thermally curing the resin, and polishing the upper and lower surfaces thereof to be substantially flat. The insulating layer 1 is formed on the upper and lower surfaces of the core body 1a including the resin columns 8.
b are stacked.

Insulating layer 1b laminated on the upper and lower surfaces of the core 1a
Has a thickness of about 20 to 60 μm and has a plurality of through holes 9 having a diameter of about 30 to 100 μm from the upper surface to the lower surface of each layer. These insulating layers 1b are
The purpose is to provide an insulating space for wiring the wiring conductors 5 at high density. Then, the upper layer wiring conductor 5 and the lower layer wiring conductor 5 are electrically connected to each other through the through holes 9, so that high-density wiring can be three-dimensionally formed. For such an insulating layer 1b, an uncured thermosetting resin film having a thickness of about 20 to 60 μm is adhered to the upper and lower surfaces of the core body 1a, which is heat cured, and the through holes 9 are punched by laser processing. Further, it is formed by successively stacking the next insulating layer 1b thereon in the same manner. In addition,
The wiring conductor 5 deposited on the surface of each insulating layer 1b and in the through hole 9 has a thickness of copper of about 5 to 50 μm on the surface of each insulating layer 1b and in the through hole 9 each time the insulating layer 1b is formed. It is formed by depositing the plating film in a predetermined pattern by a known pattern forming method such as a semi-additive method or a subtractive method.

The wiring conductor 5 formed from the mounting portion A to the lower surface of the insulating substrate 1 functions as a conductive path for connecting each electrode of the electronic component 4 to an external electric circuit board,
A part of the part provided on the mounting portion A of the insulating base 1 is exposed on the lower surface of the insulating base 1 with the electronic part connecting pad 5a joined to each electrode of the electronic part 4 via the solder bump 6. The portion forms an external connection pad 5b which is connected to the external electric circuit board via the solder ball 10. In the electronic component connection pad 5a and the external pad 5b, the outer peripheral portion of the substantially circular pattern connected to the wiring conductor 5 is formed by the outermost insulating layer 1b called a solder resist.
By covering with a width of about 150 μm to define the outer peripheral edge, the diameter is about 70 to 200 μm for the electronic component connection pad 5a, and about 0.5 to 2 for the external connection pad 5b. It is formed to be about 5 mm. The solder resist 1b is used to connect the electronic component connection pads 5a to each other or to the external connection pads 5b.
Electrical short circuit due to mutual soldering is effectively prevented, and electronic component connection pad 5a and external connection pad 5b
The bonding strength with respect to the insulating substrate 1 is high.

Further, a metal frame body 2 made of a metal such as copper or stainless steel is joined to the outer peripheral portion of the upper surface of the insulating substrate 1 via an adhesive layer 3 so as to surround the mounting portion A. A metal lid 11 made of a metal having good thermal conductivity such as copper or aluminum is bonded onto the body 2 via an adhesive such as an epoxy resin. The metal frame 2 has a thickness of 0.5 to
It has a square, hexagonal, octagonal, or circular frame shape of about 2 mm, and functions as a pedestal for joining the metal lid 11 to the insulating base body 1, and increases the rigidity of the insulating base body 1 to warp the insulating base body 1. It functions as a reinforcing member that prevents the occurrence of deformation, and also as a heat dissipation member that dissipates the heat generated during operation of the electronic component 4 to the outside. Such a metal frame body 2 is formed into a frame shape by subjecting a metal plate made of copper or the like to punching, cutting, etching or the like.

The adhesive layer 3 for joining the insulating substrate 1 and the metal frame 2 to each other is a glass fiber woven fabric in which several tens of glass fibers having a diameter of 5 to 7 μm are put together and woven at intervals of 0.5 to 2 mm. Insulating base 1 is obtained by impregnating a thermosetting resin such as epoxy resin with a glass fiber woven fabric having a shape corresponding to metal frame 2 and impregnating the uncured thermosetting resin.
It is formed by sandwiching it between the metal frame 2 and the metal frame body 2 and heating them while pressurizing them from above and below to thermoset the thermosetting resin in the adhesive sheet. Such an adhesive layer 3
Has a thickness of about 0.05 to 0.15 mm.

In the wiring board of the present invention, the insulating substrate 1 and the metal frame 2 are bonded to the glass fiber woven fabric in the adhesive layer 3 under pressure, which is important. In this way, since the insulating substrate 1 and the metal frame body 2 are bonded to the glass fiber woven fabric in the adhesive layer 3 while being pressed, the thickness of the adhesive layer 3 depends on the thickness of the glass fiber woven fabric therein. The thermosetting resin in the adhesive layer 3 is controlled to a substantially constant thickness, and when the insulating substrate 1 and the metal frame body 2 are bonded via the adhesive layer 3, it is difficult for the thermosetting resin to squeeze out. Can be applied, and as a result,
Voids are unlikely to be formed between the insulating base 1 and the metal frame 2 and the adhesive layer 3, and the two are bonded extremely firmly. Therefore, according to the wiring board of the present invention, the thickness of the adhesive layer 3 for adhering the insulating base 1 and the metal frame body 2 does not vary greatly, and the electronic components mounted on the mounting portion A of the insulating base 1 are prevented. The component 4 and the metal lid body 2 can be thermally bonded to each other with a constant gap between them through the thermally conductive grease, and the insulating base body 1 and the metal frame body 2 can be joined together via the adhesive layer 3. By firmly adhering, the electronic component 4 mounted on the insulating substrate 1 can be operated normally and stably for a long period of time.

Thus, according to the wiring board of the present invention, the electronic component 4 is electrically connected to the mounting portion A of the insulating substrate 1 and each electrode thereof is electrically connected to the wiring conductor 5 via the solder bump 6. It is mounted by flip-chip connection, and then the metal lid 11 is attached to the upper surface of the metal frame body 2, and the lower surface of the metal lid body 11 is thermally coupled to the upper surface of the electronic component through the thermally conductive grease, so that the epoxy resin is applied. An electronic device as a product is obtained by air-tightly bonding with an adhesive such as a resin.

Next, a method for manufacturing the above-described wiring board of the present invention will be described with reference to FIGS.

First, as shown in the sectional view of FIG. 2, the above-mentioned insulating substrate 1, the metal frame 2, and the adhesive sheet 3a for the adhesive layer 3 are prepared. The adhesive sheet 3a includes, for example, a glass fiber woven fabric placed on a release film made of polyethylene terephthalate, and an uncured thermosetting resin made of epoxy resin or the like in the glass fiber woven fabric such as methyl ethyl ketone. After impregnating a liquid varnish dissolved in an organic solvent, it is dried at a temperature of 60 to 100 ° C. to form a sheet, and this is punched into a size corresponding to the heat sink 3. It is produced by. At this time, the inner and outer peripheries of the adhesive sheet 3a are smaller than those of the inner and outer peripheries of the metal frame body 2.
By setting the size to be about 1 to 1 mm inside, it is possible to effectively prevent the thermosetting resin contained in the adhesive sheet 3a from protruding when the insulating substrate 1 and the metal frame 2 are joined. Therefore, the inner and outer circumferences of the adhesive sheet 3a are 0.1 to 1 mm larger than the inner and outer circumferences of the metal frame body 2.
It is preferable to set it to the inside.

Next, as shown in the sectional view of FIG. 3, the adhesive sheet 3a and the metal frame 2 are successively stacked on the insulating substrate 1 so as to surround the mounting portion A, and these are pressed together by the pressing jig 21. While being pressurized from above and below with a pressure of about 0.5 to 1 MPa, the glass fiber woven fabric in the adhesive sheet 3a and the insulating substrate 1 are heated at a temperature of about 150 to 200 ° C. for several minutes to several hours.
And the metal sheet 2 and the adhesive sheet 3
By thermosetting the thermosetting resin in a, the insulating substrate 1 and the metal frame body 2 are joined via the adhesive layer 3 formed by curing the thermosetting resin in the adhesive sheet 3a. At this time,
On the insulating substrate 1, an adhesive sheet 3a made of glass fiber woven fabric impregnated with an uncured thermosetting resin and a metal frame 2 are sequentially stacked, and these are placed from the top to the bottom at 0.5 to 1 MP.
The glass fiber woven fabric in the adhesive sheet 3a is brought into pressure contact with the insulating substrate 1 and the metal frame body 2 while applying the pressure a, and the thermosetting resin in the adhesive sheet 3a is thermally cured to form the insulating substrate 1. Since the metal frame body 2 and the metal frame body 2 are joined via the adhesive layer 3 formed by curing the thermosetting resin in the adhesive sheet 3a, the thickness of the adhesive layer 3 is controlled to be substantially constant by the thickness of the glass fiber fabric therein. At the same time, the generation of voids between the insulating substrate 1 and the metal frame 2 and the adhesive layer 3 due to the pressure is effectively prevented, and as a result, the insulating substrate 1 and the metal frame 2 form the adhesive layer 3. It is possible to obtain the wiring board of the present invention that is strongly bonded via the above.

When the pressure for pressing the insulating base 1, the adhesive sheet 3a and the metal frame 2 from above and below when the insulating base 1 and the metal frame 2 are joined is less than 0.5 MPa, a wiring board obtained. In the above, the thickness of the adhesive layer 3 for joining the insulating base body 1 and the metal frame body 2 tends to be large, and the bonding strength between the insulating base body 1 and the metal frame body 2 tends to be small. Therefore, when the insulating base 1 and the metal frame 2 are joined together, the pressure for pressing the insulating base 1, the adhesive sheet 3a and the metal frame 2 from above and below is specified to be 0.5 MPa or more. Further, when the pressure for pressing the insulating substrate 1, the adhesive sheet 3a and the metal frame body 2 from above and below when the insulating substrate 1 and the metal frame body 2 are joined exceeds 1 MPa, even if a higher pressure is applied. The variation in the thickness of the adhesive layer 3 cannot be further remarkably reduced, and the bonding strength between the insulating substrate 1 and the metal frame 2 cannot be further remarkably increased. Therefore, the insulating substrate 1 and the metal frame 2
The pressure for pressing the insulating substrate 1, the adhesive sheet 3a, and the metal frame body 2 from above and below when joining and is preferably in the range of 0.5 to 1 MPa.

By the way, the pressing jig 21 is made of stainless steel, and is a flat plate-shaped mounting table 2 on which the stacked insulating base 1, adhesive sheet 3a and metal frame 2 are mounted.
2, stacked insulating substrate 1 and adhesive sheet 3a
And a pressing plate 23 for pressing the metal frame body 2 from above. The pressing plate 23 is supported by a guide post 24 in a vertically movable state, and is further urged downward by a coil spring 25. And these mounting tables 22
Between the insulating substrate 1 and the adhesive sheet 3a
And the metal frame body 2 are overlapped and sandwiched, and the coil spring 25
The pressure is applied by the force of.

It is needless to say that the present invention is not limited to the above-described example of the embodiment, and various modifications can be made without departing from the scope of the present invention.

[0028]

EXAMPLE First, a glass fiber woven fabric impregnated with epoxy resin and having a thickness of 1 mm has a thickness of 60 μm on the upper and lower surfaces thereof.
m, each of which is formed by laminating three insulating layers made of epoxy resin, and has a substantially square insulating base with a side of 35 mm, and a substantially square frame with a peripheral side of 34 mm, a thickness of 0.65 mm, and a width of 6 mm on each side. -Shaped metal frame made of copper and glass fiber woven fabric impregnated with uncured epoxy resin, the thickness is 140 μm, and the outer and inner circumferences are 0.5 mm inward from the outer and inner circumferences of the metal frame, respectively. A square frame-shaped adhesive sheet was prepared.

Next, while the adhesive sheet and the metal frame are sequentially stacked on the upper surface of the insulating substrate, and a pressure of 0.3 to 1 MPa is applied from above and below by a pressure jig,
By heating the thermosetting resin in the adhesive sheet to cure it, the insulating substrate and the metal frame are joined together via an adhesive layer formed by thermosetting the thermosetting resin in the adhesive sheet. 1 for each of 5 types of samples for evaluation for comparison
I got 0 each.

Next, these samples for evaluation were cut so as to traverse the metal frame, the variation in the thickness of the adhesive layer on the cut surface was measured, and the glass fiber woven fabric and the insulating substrate in the adhesive layer were measured. And the degree of contact with the metal frame was observed. Further, the force when the metal frame body was peeled from the insulating base body was measured by pulling one end of one side of the cut metal frame body vertically, and the minimum value was defined as the bonding strength between the insulating base body and the metal frame body. Furthermore, it was confirmed whether glass fibers were attached to the lower surface of the peeled metal frame. The results are shown in Table 1.
Shown in.

[0031]

[Table 1]

In Table 1, sample numbers 1 and 2 are samples for comparison outside the scope of the present invention. Further, the allowable range of thickness variation of the adhesive layer is 3 μm or less, and the bonding strength between the insulating base and the metal frame is required to be 25 N or more.

As shown in Table 1, in the samples of sample numbers 1 and 2 which are out of the scope of the present invention, the variation in the thickness of the adhesive layer is 3.
The bonding strength between the insulating substrate and the metal frame is as small as 25 N or less, while the sample Nos. 3, 4, and 5 within the scope of the present invention show variation in the thickness of the adhesive layer. It is as small as 2.5 μm or less within the allowable range, and the bonding strength between the insulating base and the metal frame is 27.
It can be seen that it is a sufficiently large value of 5 N or more. Further, in each of the samples of the present invention, the glass fiber woven fabric in the adhesive layer was in full contact with the insulating substrate and the metal frame body, and the glass fiber was formed on the lower surface of the metal frame body after peeling from the insulating substrate. It can be seen that the glass fiber woven fabric, the insulating substrate and the metal frame are firmly pressed against each other.

[0034]

According to the wiring board of the present invention, the adhesive layer for joining the insulating base and the metal frame is formed by impregnating a glass fiber woven fabric with a thermosetting resin, and the insulating base and the metal frame. Since the body is bonded to the glass fiber woven fabric while being pressed, the thickness of the adhesive layer for bonding the insulating substrate and the metal frame body is controlled to a substantially constant thickness by the thickness of the glass fiber woven fabric. The insulating base and the metal frame are firmly joined together via the adhesive layer. Therefore, it is possible to operate the electronic component mounted on the insulating substrate normally and stably for a long period of time.

Further, according to the method of manufacturing a wiring board of the present invention, an adhesive sheet formed by impregnating a glass fiber woven fabric with an uncured thermosetting resin and a metal frame are sequentially stacked on the insulating substrate, and These are heated from above and below while applying a pressure of 0.5 MPa or more to bring the glass fiber woven fabric into pressure contact with the insulating substrate and the metal frame, and at the same time to thermoset the thermosetting resin to produce the insulating substrate and the above. Since the metal frame and the metal frame are joined via the adhesive layer formed by curing the thermosetting resin of the adhesive sheet, the thickness of the adhesive layer is controlled to be substantially constant by the thickness of the glass fiber woven fabric and the insulating substrate is formed. It is possible to obtain a wiring board in which the metal frame body and the metal frame body are firmly bonded to each other via the adhesive layer.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an example of an embodiment of a wiring board of the present invention.

FIG. 2 is a cross-sectional view for explaining the method for manufacturing a wiring board according to the present invention.

FIG. 3 is a cross-sectional view for explaining the method for manufacturing a wiring board according to the present invention.

[Explanation of symbols]

1 ... Insulating substrate 2 ... Metal frame 3 ... Adhesive layer 4 ・ ・ Electronic parts 5 ... Wiring conductor A ・ ・ ・ ・ Mounting part

Claims (2)

[Claims] 1. An insulating base having a mounting portion on which an electronic component is mounted and a plurality of wiring conductors extending from the mounting portion to a lower surface, and an adhesive layer surrounding the mounting portion on the upper surface of the insulating base. A wiring board comprising: a metal frame body bonded via a metal frame body, wherein the adhesive layer is formed by impregnating a glass fiber woven fabric with a thermosetting resin, and the insulating substrate and the metal frame body are A wiring board, wherein the wiring board is bonded to the glass fiber woven fabric while being pressed. 2. An insulating base having a mounting portion on which an electronic component is mounted and a plurality of wiring conductors extending from the mounting portion to a lower surface, a metal frame body having an opening surrounding the mounting portion, and the metal frame. A step of preparing an adhesive sheet formed by impregnating an uncured thermosetting resin into a frame-shaped glass fiber woven fabric having a size corresponding to the body, and the adhesive sheet and the metal frame body on the insulating substrate. Are sequentially stacked so as to surround the mounting part, and these are placed on top of each other by 0.5
The glass fiber fabric is heated while applying a pressure of MPa or more to bring the glass fiber woven fabric into pressure contact with the insulating base and the metal frame, and the thermosetting resin is thermoset to heat the insulating base and the metal frame. A method of manufacturing a wiring board, comprising the steps of: joining via an adhesive layer formed by curing the thermosetting resin of the adhesive sheet.