JP2003282682A - Board holding device - Google Patents

Board holding device

Info

Publication number
JP2003282682A
JP2003282682A JP2002088757A JP2002088757A JP2003282682A JP 2003282682 A JP2003282682 A JP 2003282682A JP 2002088757 A JP2002088757 A JP 2002088757A JP 2002088757 A JP2002088757 A JP 2002088757A JP 2003282682 A JP2003282682 A JP 2003282682A
Authority
JP
Japan
Prior art keywords
substrate
droplet
holding device
holding
holding portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2002088757A
Other languages
Japanese (ja)
Inventor
Masahiro Motomura
雅洋 基村
Hidehiko Ozaki
秀彦 尾崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Priority to JP2002088757A priority Critical patent/JP2003282682A/en
Publication of JP2003282682A publication Critical patent/JP2003282682A/en
Abandoned legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To prevent adhesion of a residue or generation of particles due to a remaining liquid by promoting falling of a droplet. <P>SOLUTION: A board holding device 1 is provided with contact supporting parts 25 and 27 and a falling prevention part 29 in its holding part that are brought into contact with a periphery of a board W and keep the board W erected, and it is also provided with droplet guides 25c, 27c and 29c for promoting the falling of a droplet in the contact supporting parts 25 and 27 and the falling prevention part 29. The droplet guides 25c, 27c and 29c promote the falling of the droplets adhering on the front and rear surfaces or in the periphery of the board W, so that no droplet is left in the contact supporting parts 25 and 27 and around the falling prevention part 29. Therefore, the adhesion of the residue or the generation of the particles due to the remaining liquid can be prevented. <P>COPYRIGHT: (C)2004,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】この発明は、半導体ウエハや
液晶表示装置用のガラス基板(以下、単に基板と称す
る)の周縁部に当接して基板を起立姿勢で保持するため
の基板保持装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate holding device for holding a substrate in an upright posture by contacting a peripheral portion of a semiconductor wafer or a glass substrate for liquid crystal display (hereinafter, simply referred to as a substrate).

【0002】[0002]

【従来の技術】従来、この種の基板保持装置として、複
数枚の基板を整列させる方向に延出された保持部を備え
たものがある。この保持部には、基板の周縁部に当接し
て基板を起立姿勢で保持するための板状のガイド部材が
取り付けられている。
2. Description of the Related Art Conventionally, as a substrate holding device of this type, there is a device provided with a holding portion extending in a direction for aligning a plurality of substrates. A plate-shaped guide member for abutting the peripheral portion of the substrate and holding the substrate in an upright posture is attached to the holding portion.

【0003】このような構成の基板保持装置は、例え
ば、処理槽に貯留された処理液中に下降して、保持部に
保持した基板を処理液中に浸漬する。そして、所定の処
理時間の経過後、基板保持装置は、基板とともに処理液
上方に上昇される。このときIPA蒸気が供給される等
して、基板の乾燥が促進されることもある。
In the substrate holding device having such a structure, for example, the substrate held in the holding section is lowered into the processing liquid stored in the processing tank and immersed in the processing liquid. Then, after the lapse of a predetermined processing time, the substrate holding device is raised above the processing liquid together with the substrate. At this time, the IPA vapor may be supplied to accelerate the drying of the substrate.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、このよ
うな構成を有する従来例の場合には、次のような問題が
ある。すなわち、従来の装置は、基板面を伝って周縁部
を経て流れ落ちる液滴がガイド部材や保持部の影響によ
って、基板面やその周縁、さらにガイド部や保持部付近
に残ることがある。そのためガイド部材や保持部近辺に
位置する基板の周縁付近の乾燥が阻害される。したがっ
て、その部分に残渣が付着したり、パーティクルが発生
する現象が生じたりするという問題がある。
However, the conventional example having such a structure has the following problems. That is, in the conventional device, the droplets that flow down the peripheral surface of the substrate surface may remain on the surface of the substrate and the peripheral edge thereof, and in the vicinity of the guide portion and the holding portion due to the influence of the guide member and the holding portion. Therefore, the vicinity of the peripheral edge of the substrate located near the guide member and the holding portion is prevented from drying. Therefore, there is a problem that a residue adheres to that portion or particles are generated.

【0005】この発明は、このような事情に鑑みてなさ
れたものであって、液滴の流下を促すことによって、液
残りに起因する残渣の付着やパーティクルの発生を防止
することができる基板保持装置を提供することを目的と
する。
The present invention has been made in view of the above circumstances, and by promoting the flow of droplets, it is possible to prevent the attachment of residues and the generation of particles due to the remaining liquid. The purpose is to provide a device.

【0006】[0006]

【課題を解決するための手段】この発明は、このような
目的を達成するために、次のような構成をとる。すなわ
ち、請求項1に記載の発明は、基板の周縁部に当接して
基板を起立姿勢で保持するガイド部材を保持部に備えた
基板保持装置において、液滴の流下を促す液滴ガイドを
前記ガイド部材に付設したことを特徴とするものであ
る。
The present invention has the following constitution in order to achieve such an object. That is, in the invention according to claim 1, in the substrate holding device including a guide member for holding the substrate in an upright posture by abutting on the peripheral portion of the substrate, the droplet guide for promoting the flow of the droplets is provided. It is characterized by being attached to a guide member.

【0007】(作用・効果)ガイド部材に付設された液
滴ガイドが、基板の表裏面や周縁部に付着している液滴
の流下を促すので、基板やガイド部材や保持部近辺に液
滴が残ることを防止できる。したがって、液残りに起因
する残渣の付着やパーティクルの発生を防止することが
できる。
(Operation / Effect) The droplet guide attached to the guide member promotes the flow of the droplets adhering to the front and back surfaces of the substrate and the peripheral portion thereof, so that the droplets near the substrate, the guide member and the holding portion. Can be prevented from remaining. Therefore, it is possible to prevent the adhesion of the residue and the generation of particles due to the remaining liquid.

【0008】また、請求項2に記載の発明は、請求項1
に記載の基板保持装置において、前記保持部は、基板の
周縁部に沿って3カ所に配備され、少なくとも中央部の
ガイド部材に前記液滴ガイドを備えたことを特徴とする
ものである。
The invention described in claim 2 is the same as claim 1.
In the substrate holding apparatus described in the above item 3, the holding portion is provided at three locations along the peripheral edge of the substrate, and the droplet guide is provided in at least a central guide member.

【0009】(作用・効果)中央部のガイド部材には両側
から液滴が流下してくるので、ガイド部材や保持部に付
着する液滴の量が多い。したがって、この部分に液滴ガ
イドを設けることにより、効率的に残渣の付着やパーテ
ィクルの発生を抑制することができる。
(Operation / Effect) Since droplets flow down from both sides to the central guide member, a large amount of droplets adhere to the guide member and the holding portion. Therefore, by providing the droplet guide in this portion, it is possible to efficiently suppress the attachment of residues and the generation of particles.

【0010】また、ガイド部材は、基板の周縁部に当接
する一対の板状部材を備えていることが多く(請求項
3)、その隙間を含む基板周縁部に液滴が残りやすい。
したがって、一対の板状部材の間にガイドを設けると
(請求項4)、効果的に液滴の流下を促すことができ
る。その液滴ガイドは、基板の周縁部側から下方に向か
って末広がり形状にすることで(請求項5)、液滴の流
下を容易にすることができる。
Further, the guide member is often provided with a pair of plate-shaped members which come into contact with the peripheral portion of the substrate (claim 3), and droplets are likely to remain on the peripheral portion of the substrate including the gap.
Therefore, if a guide is provided between the pair of plate-shaped members (claim 4), the flow of the droplets can be effectively promoted. The droplet guide can be made to spread downward from the peripheral edge side of the substrate (claim 5) to facilitate the flow of the droplet.

【0011】[0011]

【発明の実施の形態】以下、図面を参照してこの発明の
一実施例を説明する。図1ないし図3はこの発明の一実
施例に係り、図1は実施例に係る基板保持装置を備えた
基板処理装置の概略構成を示す斜視図であり、図2は実
施例に係る基板保持装置の概略構成を示す斜視図であ
り、図3は基板保持装置の要部を示す縦断面図である。
BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to the drawings. 1 to 3 relate to an embodiment of the present invention, FIG. 1 is a perspective view showing a schematic configuration of a substrate processing apparatus including a substrate holding apparatus according to the embodiment, and FIG. 2 is a substrate holding according to the embodiment. FIG. 3 is a perspective view showing a schematic configuration of the apparatus, and FIG. 3 is a vertical sectional view showing a main part of the substrate holding apparatus.

【0012】本実施例に係る基板保持装置1を備えた基
板処理装置として、図1に示す構成のものが例示され
る。この基板処理装置は、例えば、基板Wに対して洗浄
処理を施すものである。奥側に位置する正面側3には、
基板搬出入口5を備えている。この基板搬出入口5の反
対側に位置する列には、複数個の処理部が並設されてい
る。
A substrate processing apparatus having the substrate holding apparatus 1 according to this embodiment is exemplified by one having a structure shown in FIG. This substrate processing apparatus performs a cleaning process on a substrate W, for example. On the front side 3 located on the back side,
A substrate loading / unloading port 5 is provided. A plurality of processing units are arranged in parallel in a row located on the opposite side of the substrate loading / unloading port 5.

【0013】例えば、正面側3の反対側に位置する奥側
(図1の左側)には第1洗浄処理部7、その手前側に第
2洗浄処理部9、さらにその手前に第3洗浄処理部11
が配備されている。各洗浄処理部7,9,11は、複数
枚の基板Wを自身の処理槽間で移動させるための搬送機
構7a,9a,11aをそれぞれ備えている。これらは
各々独立して昇降可能であって、かつ水平方向への移動
が可能となっている。
For example, the first cleaning processing section 7 is located on the back side (left side in FIG. 1) located on the opposite side of the front side 3, the second cleaning processing section 9 is on the front side thereof, and the third cleaning processing is on the front side thereof. Part 11
Has been deployed. Each cleaning processing unit 7, 9, 11 is provided with a transport mechanism 7a, 9a, 11a for moving a plurality of substrates W between its own processing tanks. These can be raised and lowered independently of each other and can be moved in the horizontal direction.

【0014】また、第3洗浄処理部11の手前側には、
1ロット分の基板Wを各洗浄処理部7,9,11との間
で受け渡すための主搬送機構13が配備されている。
Further, on the front side of the third cleaning processing section 11,
A main transfer mechanism 13 is provided for transferring one lot of substrates W to and from the cleaning processing units 7, 9, 11.

【0015】上記搬送機構7a,9a,11aには、そ
れぞれ基板保持装置1が備わっている。基板保持装置1
は、図2に示すように、各搬送機構7a,9a,11a
の各ベース部材15に取り付けられている。
Each of the transfer mechanisms 7a, 9a, 11a is equipped with a substrate holding device 1. Substrate holding device 1
As shown in FIG. 2, each transport mechanism 7a, 9a, 11a
Is attached to each base member 15.

【0016】ベース部材15は、各処理部に基板Wを浸
漬することができる長さを備えた板状の部材である。そ
の処理槽側には、本発明における保持部に相当する第1
保持部17と、第2保持部19と、第3保持部21とが
取り付けられている。例えば、これらの第1保持部17
と、第2保持部19と、第3保持部21は角棒状を呈
し、それらの先端部側が連結部材23によって固定され
ている。
The base member 15 is a plate-shaped member having a length such that the substrate W can be immersed in each processing section. On the side of the processing tank, there is provided
The holding portion 17, the second holding portion 19, and the third holding portion 21 are attached. For example, these first holding portions 17
The second holding portion 19 and the third holding portion 21 are in the shape of a rectangular rod, and their tip end sides are fixed by the connecting member 23.

【0017】第1保持部17と、第2保持部19と、第
3保持部21とは、図3に示すように、基板Wの上下方
向の中心位置よりも下方に位置するように配備されてい
る。
As shown in FIG. 3, the first holding portion 17, the second holding portion 19, and the third holding portion 21 are arranged so as to be located below the vertical center of the substrate W. ing.

【0018】第1保持部17と第3保持部21には、基
板Wの周縁部に当接する当接支持部25,27(本発明
におけるガイド部材に相当する)が立設されている。当
接支持部25,27は、それぞれ一対の板状部材25
a,25b,27a,27bを備えている。
Contact support portions 25 and 27 (corresponding to guide members in the present invention) that abut the peripheral portion of the substrate W are erected on the first holding portion 17 and the third holding portion 21. The contact support portions 25 and 27 are respectively a pair of plate-shaped members 25.
a, 25b, 27a, 27b.

【0019】板状部材25a,25bは、基板Wの周縁
外形に沿うように、基板Wの左端に近い側の方が長く形
成されている。また、液滴が板状部材25a,25bに
沿って流下せず、基板Wの最下端に向かって流下するの
を抑制するために、板状部材25a,25bの、基板W
の左端側に向かう面が下方に向かって傾斜した形状を呈
する。また、基板Wの右端側に向かう面が下方に向かっ
て傾斜して形成されている以外は、板状部材27a,2
7bも上記板状部材25a,25bと同様の形状を呈す
る。板状部材25a,25b,27a,27bには複数
枚の基板Wが保持できるように、例えば、Vの字状を呈
する切り欠きが複数箇所に所定間隔で形成されている。
The plate-like members 25a and 25b are formed to be longer on the side closer to the left end of the substrate W so as to follow the outer shape of the peripheral edge of the substrate W. Further, in order to prevent the liquid droplets from flowing down along the plate-shaped members 25a and 25b and toward the lowermost end of the substrate W, the substrate W of the plate-shaped members 25a and 25b is suppressed.
The surface toward the left end side of the has a shape inclined downward. In addition, the plate-shaped members 27a, 2a are provided except that the surface of the substrate W facing the right end side is formed to be inclined downward.
7b also has the same shape as the plate members 25a and 25b. The plate-shaped members 25a, 25b, 27a, 27b are provided with, for example, V-shaped notches at a plurality of predetermined intervals so that a plurality of substrates W can be held.

【0020】第2保持部19は、基板Wの面方向(図の
紙面方向)への倒れを防止するものである。この第2保
持部19は、同一高さに形成された一対の板状部材29
a,29bを備えている。これらの板状部材29a,2
9bは、例えば、Vの字状の切り欠きが形成されている
が、基板Wの表裏面に当接して倒れを防止するために、
その幅が基板Wの厚さよりも広く形成されている。ま
た、液滴が板状部材29a,29bに沿って流下せず、
基板Wの最下端に流下するのを抑制するために、基板W
の左右端に近い側の面が下方に向かって傾斜した形状を
呈する。
The second holding portion 19 prevents the substrate W from tilting in the surface direction (paper surface direction in the drawing). The second holding portion 19 has a pair of plate-like members 29 formed at the same height.
a and 29b. These plate-shaped members 29a, 2
9b has, for example, a V-shaped notch formed therein, but in order to prevent it from coming into contact with the front and back surfaces of the substrate W,
The width is formed wider than the thickness of the substrate W. In addition, the droplet does not flow down along the plate-shaped members 29a and 29b,
In order to prevent the substrate W from flowing down to the lowermost end, the substrate W
The surface on the side close to the left and right ends of the has a shape inclined downward.

【0021】第1保持部17の当接支持部25には、液
滴の流下を促す液滴ガイド25cが付設されている。具
体的には、一対の板状部材25a,25bの間に立設さ
れている。この例における液滴ガイド25cは、縦断面
形状が三角形状を呈している。その高さは、頂点が基板
Wの端縁に当接する程度であってもよく、基板Wの端縁
から離間していてもよい。これは、表面張力が作用する
ので、離間していても液滴の流下を促進することができ
るからである。
A droplet guide 25c for accelerating the flow of droplets is attached to the contact support portion 25 of the first holding portion 17. Specifically, it is erected between the pair of plate-shaped members 25a and 25b. The droplet guide 25c in this example has a triangular cross section. The height may be such that the apex abuts on the edge of the substrate W or may be separated from the edge of the substrate W. This is because the surface tension acts so that the flow of droplets can be promoted even if they are separated.

【0022】なお、液滴ガイド25c,29c,27c
を構成する材料としては、例えば、優れた機械的特性と
機能性を合わせ持つ熱可塑性の超耐熱性高分子樹脂であ
って、特に耐熱性・耐薬品性・耐衝撃性・耐疲労性等に
優れるPEEK(ポリエーテル・エーテル・ケトン)が
好ましい。また、使用温度範囲、耐薬品性、電気絶縁
性、低摩擦性、非粘着性、耐候性、難燃性などの優れた
特性を有するPTFEや、良好な機械的、熱的、電気特
性に加え、優れた耐薬品性を持ったPVDFであっても
よく、シリコン等であってもよい。
The droplet guides 25c, 29c, 27c
For example, the material used to make is a thermoplastic super-heat-resistant polymer resin that has both excellent mechanical properties and functionality, and especially in heat resistance, chemical resistance, impact resistance, fatigue resistance, etc. The excellent PEEK (polyether ether ketone) is preferred. In addition to PTFE, which has excellent characteristics such as operating temperature range, chemical resistance, electrical insulation, low friction, non-adhesiveness, weather resistance, and flame resistance, as well as good mechanical, thermal, and electrical characteristics, Alternatively, PVDF having excellent chemical resistance may be used, or silicon or the like may be used.

【0023】次に、このように構成された基板保持装置
1を用いて、基板Wを第1洗浄処理部7で処理する場合
について図4を参照しながら説明する。なお、図4は基
板保持装置1における液滴の流れを示した模式図であっ
て、第2保持部19の部分を拡大した図である。
Next, a case where the substrate W is processed by the first cleaning processing unit 7 using the substrate holding apparatus 1 thus constructed will be described with reference to FIG. 4 is a schematic diagram showing the flow of droplets in the substrate holding device 1, and is an enlarged view of the second holding portion 19.

【0024】主搬送機構13から複数枚の基板Wを基板
保持装置1に対して渡す。これにより各基板Wは、下方
の周縁部のうち左右に位置する部分が、第1保持部17
と第3保持部21によって当接支持される。さらに、基
板Wの下端周縁部に第2保持部19が近接して位置し、
基板Wの表裏面のいずれか一方に当接して倒れが防止さ
れる。
A plurality of substrates W are transferred from the main transport mechanism 13 to the substrate holding device 1. As a result, in each of the substrates W, the left and right portions of the lower peripheral edge portion are located at the first holding portion 17
And is supported by the third holding portion 21. Further, the second holding portion 19 is located close to the lower edge of the substrate W,
The substrate W is prevented from falling by coming into contact with either one of the front and back surfaces of the substrate W.

【0025】このように基板Wを支持した基板保持装置
1は、第1洗浄部7に移動し、純水を貯留した処理槽に
下降する。これにより一定時間の水洗処理を行った後、
例えば、純水の置換を行いながら基板Wを引き上げる。
具体的には、IPAの蒸気を供給しつつ基板保持装置1
を処理槽から引き上げる。その後、窒素等の不活性ガス
を供給し、処理槽内を減圧することによって基板Wに対
して乾燥処理を施す。
The substrate holding apparatus 1 supporting the substrate W in this way moves to the first cleaning unit 7 and descends into the processing tank storing pure water. After doing this for a certain period of water washing,
For example, the substrate W is pulled up while replacing the pure water.
Specifically, the substrate holding device 1 while supplying the vapor of IPA
Is pulled out of the processing tank. After that, an inert gas such as nitrogen is supplied and the inside of the processing tank is depressurized to dry the substrate W.

【0026】上記の処理において、基板保持装置1を処
理槽から引き上げた際には、図4中に二点鎖線で示すよ
うに、液滴が基板Wの下方に向かって流下してくる。こ
の位置には、第2保持部19があるので、その一部は板
状部材29a,29bに向かって流れ、その傾斜等に沿
って下方に流れ落ちる。また、基板Wの中央部上方から
流下してきた液滴は、基板Wの下縁や一対の板状部材2
9a,29bの間に留まろうとするが、液滴ガイド29
cによってその流下が促され、液滴ガイド29cを伝っ
て円滑に流れ落ちる。
In the above process, when the substrate holding device 1 is pulled up from the processing tank, the liquid droplets flow down toward the lower side of the substrate W as shown by the chain double-dashed line in FIG. Since the second holding portion 19 is located at this position, a part of the second holding portion 19 flows toward the plate-shaped members 29a and 29b, and flows downward along the inclination and the like. Further, the liquid droplets flowing down from above the central portion of the substrate W are the lower edge of the substrate W and the pair of plate-shaped members 2.
The droplet guide 29 tries to stay between 9a and 29b.
The downward flow is promoted by c and smoothly flows down along the droplet guide 29c.

【0027】なお、第1保持部17と、第3保持部21
においても液滴ガイド25c,27cにより、基板Wの
下端周縁部や一対の板状部材25a,25bの間、一対
の板状部材27a,27bの間に留まろうとする液滴の
流下が促されて液滴が円滑に流れ落ちる。
The first holding portion 17 and the third holding portion 21
Also in the above, the liquid droplet guides 25c and 27c promote the flow of the liquid droplets that try to stay at the lower edge portion of the substrate W, between the pair of plate-shaped members 25a and 25b, and between the pair of plate-shaped members 27a and 27b. The liquid drops smoothly.

【0028】このように上述した構成の基板保持装置1
によれば、基板Wの表裏面や周縁部に付着している液滴
の流下を液滴ガイド25c,27c,29cが促すの
で、当接支持部25,27や倒れ防止部29の近辺に液
滴が残ることを防止できる。したがって、液残りに起因
する残渣の付着やパーティクルの発生を防止することが
できる。その結果、プロセス性能が向上するとともに、
処理時間の短縮化も図ることができる。その上、IPA
の消費量も削減することができるので、コストの低減が
可能である。
The substrate holding device 1 having the above-mentioned structure
According to the above, since the liquid droplet guides 25c, 27c, and 29c promote the flow of the liquid droplets attached to the front and back surfaces of the substrate W and the peripheral portion thereof, the liquid is not formed near the contact support portions 25 and 27 and the fall prevention portion 29. It is possible to prevent drops from remaining. Therefore, it is possible to prevent the adhesion of the residue and the generation of particles due to the remaining liquid. As a result, process performance is improved and
The processing time can also be shortened. Besides, IPA
It is possible to reduce the consumption amount of the so that the cost can be reduced.

【0029】なお、上記の実施例では、第1保持部1
7、第2保持部19、第3保持部21の全てに液滴ガイ
ド25c,29c,27cを備えているが、液滴の流下
が最も多い中央部に位置する第2保持部19だけに液滴
ガイド29cを設けるようにしてもよい。このような構
成であっても、従来例に比較して液残りに起因する残渣
の付着やパーティクルの発生を防止することが可能であ
る。
In the above embodiment, the first holding portion 1
Although the liquid droplet guides 25c, 29c, and 27c are provided in all of 7, 7, the second holding unit 19, and the third holding unit 21, only the second holding unit 19 located in the central portion where the liquid drops most flow A drop guide 29c may be provided. Even with such a configuration, it is possible to prevent the adhesion of residues and the generation of particles due to the remaining liquid, as compared with the conventional example.

【0030】<変形例>図5を参照して本発明の変形例
について説明する。なお、図5は、基板保持装置の変形
例を示す縦断面図である。
<Modification> A modification of the present invention will be described with reference to FIG. Note that FIG. 5 is a vertical cross-sectional view showing a modified example of the substrate holding device.

【0031】この基板保持装置1Aは、上述した第1保
持部17と第3保持部21に相当する第1保持部17A
と第3保持部21Aを、上述した第1保持部17と第3
保持部21の配置間隔よりも狭い間隔で基板Wの下端付
近に備えている。第1保持部17Aは、当接支持部25
Aに、一対の板状部材25Aa,25Abを備えてい
る。その間には、液滴ガイド25Acを備えている。ま
た、第3保持部21Aは、当接支持部27Aに、一対の
板状部材27Aa,27Abを備えるとともに、その間
に液滴ガイド27Acを備えている。
This substrate holding device 1A has a first holding portion 17A corresponding to the above-mentioned first holding portion 17 and third holding portion 21.
And the third holding part 21A, and the first holding part 17 and the third holding part 21 described above.
It is provided near the lower end of the substrate W at an interval narrower than the arrangement interval of the holding portions 21. The first holding portion 17A includes the contact support portion 25.
A is provided with a pair of plate-shaped members 25Aa and 25Ab. In the meantime, the droplet guide 25Ac is provided. Further, the third holding portion 21A includes a pair of plate-shaped members 27Aa and 27Ab on the contact support portion 27A, and a droplet guide 27Ac between them.

【0032】さらに、倒れ防止のための第2保持部19
に相当する第2保持部19Aを、基板Wの下端ではな
く、基板Wの右斜め下方に備えている。但し、この第2
保持部19Aは、倒れ防止部29Aだけを備え、液滴ガ
イドを省略している。
Further, the second holding portion 19 for preventing the falling.
The second holding portion 19A corresponding to is provided not on the lower end of the substrate W but on the diagonally lower right side of the substrate W. However, this second
The holding unit 19A includes only the fall prevention unit 29A, and the droplet guide is omitted.

【0033】このような基板保持装置1Aの構成を採用
しても、液滴ガイド25Ac,27Acの作用により、
上述した基板処理装置1とほぼ同様の効果を奏すること
ができる。
Even if such a structure of the substrate holding device 1A is adopted, due to the action of the droplet guides 25Ac and 27Ac,
The same effects as those of the substrate processing apparatus 1 described above can be obtained.

【0034】なお、上記の説明においては、液滴ガイド
の縦断面形状が三角形であるものを例に採って説明した
が、本発明における液滴ガイドはこのような形状に限定
されるものではないことは言うまでもない。
In the above description, the case where the droplet guide has a triangular vertical cross-sectional shape has been described as an example, but the droplet guide in the present invention is not limited to such a shape. Needless to say.

【0035】ところで、上述した実施例では、一対の板
状部材の間に液滴ガイド25c,27c,29cを備
え、変形例でも一対の板状部材の間に液滴ガイド25A
c,27Ac,29Acを備えている。しかし、本発明
は、基板保持装置に一対の板状部材を備えていることが
必須要件ではない。
By the way, in the above-described embodiment, the droplet guides 25c, 27c, 29c are provided between the pair of plate-like members, and in the modification, the droplet guide 25A is provided between the pair of plate-like members.
c, 27Ac, 29Ac. However, in the present invention, it is not essential that the substrate holding device is provided with the pair of plate-shaped members.

【0036】具体的には、図6を参照しながら第2保持
部39を例に採って説明する。この第2保持部39の倒
れ防止部41は、その中央部に板状部材41aを備え、
この部分が基板Wの倒れを防止している。その左右に
は、上述した板状部材29a,29b(図4参照)と縦
断面形状がほぼ相似する液滴ガイド41b,41cが備
わっている。このような第2保持部39の場合であって
も、上述した実施例及び変形例と同等の効果を奏するこ
とができる。
Specifically, the second holding portion 39 will be described as an example with reference to FIG. The fall prevention portion 41 of the second holding portion 39 includes a plate-shaped member 41a at the center thereof,
This portion prevents the substrate W from collapsing. On the left and right sides thereof, there are provided droplet guides 41b and 41c whose longitudinal sectional shapes are substantially similar to those of the plate-shaped members 29a and 29b (see FIG. 4) described above. Even in the case of such a second holding portion 39, it is possible to achieve the same effects as those of the above-described embodiment and modification.

【0037】なお、上記の説明では複数枚の基板Wを保
持する構成を例示しているが、1枚や数枚の基板Wを保
持する形態であっても本発明を適用できる。
In the above description, the structure in which a plurality of substrates W are held is illustrated, but the present invention can be applied to a mode in which one or several substrates W are held.

【0038】[0038]

【発明の効果】以上の説明から明らかなように、本発明
によれば、基板の表裏面や周縁部に付着している液滴の
流下を液滴ガイドが促すので、ガイド部材や保持部近辺
に液滴が残ることを防止できる。したがって、液残りに
起因する残渣の付着やパーティクルの発生を防止でき
る。
As is apparent from the above description, according to the present invention, the droplet guide promotes the flow of droplets adhering to the front and back surfaces and the peripheral portion of the substrate. It is possible to prevent a droplet from remaining on the surface. Therefore, it is possible to prevent the adhesion of the residue and the generation of particles due to the remaining liquid.

【0039】その結果、プロセス性能が向上するととも
に、処理時間の短縮化を図ることができる。その上、乾
燥時に併用される溶剤等の消費量も削減することができ
るので、コストの低減が可能である。
As a result, the process performance can be improved and the processing time can be shortened. In addition, it is possible to reduce the consumption amount of the solvent and the like used together during drying, so that the cost can be reduced.

【図面の簡単な説明】[Brief description of drawings]

【図1】実施例に係る基板保持装置を備えた基板処理装
置の概略構成を示す斜視図である。
FIG. 1 is a perspective view showing a schematic configuration of a substrate processing apparatus including a substrate holding device according to an embodiment.

【図2】実施例に係る基板保持装置の概略構成を示す斜
視図である。
FIG. 2 is a perspective view showing a schematic configuration of a substrate holding device according to an embodiment.

【図3】基板保持装置の要部を示す縦断面図である。FIG. 3 is a vertical cross-sectional view showing a main part of the substrate holding device.

【図4】基板保持装置における液滴の流れを示した模式
図である。
FIG. 4 is a schematic diagram showing a flow of droplets in the substrate holding device.

【図5】基板保持装置の変形例を示す縦断面図である。FIG. 5 is a vertical sectional view showing a modified example of the substrate holding device.

【図6】基板保持装置の変形例であって、その要部を示
す縦断面図である。
FIG. 6 is a vertical cross-sectional view showing a main part of a modified example of the substrate holding device.

【符号の説明】[Explanation of symbols]

W … 基板 1 … 基板保持装置 17 … 第1保持部(保持部) 25 … 当接支持部(ガイド部材) 25a,25b … 板状部材 25c … 液滴ガイド 19 … 第2保持部(保持部) 29 … 倒れ防止部(ガイド部材) 29a,29b … 板状部材 29c … 液滴ガイド 21 … 第3保持部(保持部) 27 … 当接支持部(ガイド部材) 27a,27b … 板状部材 27c … 液滴ガイド 23 … 連結部材 W ... Substrate 1 ... Substrate holding device 17 ... 1st holding part (holding part) 25 ... Contact support part (guide member) 25a, 25b ... Plate-shaped member 25c ... Droplet guide 19 ... 2nd holding part (holding part) 29 ... Tilt prevention unit (guide member) 29a, 29b ... Plate-shaped member 29c ... Droplet guide 21 ... Third holding portion (holding portion) 27 ... Contact support portion (guide member) 27a, 27b ... Plate-shaped member 27c ... Droplet guide 23 ... Connecting member

───────────────────────────────────────────────────── フロントページの続き (72)発明者 尾崎 秀彦 京都市上京区堀川通寺之内上る4丁目天神 北町1番地の1 大日本スクリーン製造株 式会社内 Fターム(参考) 5F031 CA02 CA05 FA01 FA02 FA09 FA12 FA18 HA73 HA74 PA26   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Hidehiko Ozaki             4-chome Tenjin, which runs up to Teranouchi, Horikawa-dori, Kamigyo-ku, Kyoto             1 Kitamachi No. 1 Dai Nippon Screen Manufacturing Co., Ltd.             Inside the company F-term (reference) 5F031 CA02 CA05 FA01 FA02 FA09                       FA12 FA18 HA73 HA74 PA26

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 基板の周縁部に当接して基板を起立姿勢
で保持するガイド部材を保持部に備えた基板保持装置に
おいて、 液滴の流下を促す液滴ガイドを前記ガイド部材に付設し
たことを特徴とする基板保持装置。
1. In a substrate holding device having a holding member for holding a substrate in an upright posture by abutting on a peripheral portion of the substrate, a droplet guide for promoting the flow of droplets is attached to the guide member. A substrate holding device.
【請求項2】 請求項1に記載の基板保持装置におい
て、 前記保持部は、基板の周縁部に沿って3カ所に配備さ
れ、 少なくとも中央部のガイド部材に前記液滴ガイドを備え
たことを特徴とする基板保持装置。
2. The substrate holding device according to claim 1, wherein the holding portion is provided at three locations along a peripheral edge of the substrate, and at least a central guide member is provided with the droplet guide. A characteristic substrate holding device.
【請求項3】 請求項1または2に記載の基板保持装置
において、 前記ガイド部材は、基板の周縁部に当接する一対の板状
部材を備えていることを特徴とする基板保持装置。
3. The substrate holding device according to claim 1, wherein the guide member includes a pair of plate-shaped members that are in contact with a peripheral portion of the substrate.
【請求項4】 請求項3に記載の基板保持装置におい
て、 前記液滴ガイドは、前記一対の板状部材の間に設けられ
ていることを特徴とする基板保持装置。
4. The substrate holding device according to claim 3, wherein the droplet guide is provided between the pair of plate-shaped members.
【請求項5】 請求項1ないし4のいずれかに記載の基
板保持装置において、 前記液滴ガイドは、基板の周縁部側から下方に向かって
末広がり形状を呈することを特徴とする基板保持装置。
5. The substrate holding device according to any one of claims 1 to 4, wherein the droplet guide has a shape that widens toward the bottom from the peripheral edge side of the substrate.
JP2002088757A 2002-03-27 2002-03-27 Board holding device Abandoned JP2003282682A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002088757A JP2003282682A (en) 2002-03-27 2002-03-27 Board holding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002088757A JP2003282682A (en) 2002-03-27 2002-03-27 Board holding device

Publications (1)

Publication Number Publication Date
JP2003282682A true JP2003282682A (en) 2003-10-03

Family

ID=29234532

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002088757A Abandoned JP2003282682A (en) 2002-03-27 2002-03-27 Board holding device

Country Status (1)

Country Link
JP (1) JP2003282682A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013098304A (en) * 2011-10-31 2013-05-20 Tokyo Electron Ltd Substrate processing apparatus, substrate processing method, and computer readable storage medium storing substrate processing program

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013098304A (en) * 2011-10-31 2013-05-20 Tokyo Electron Ltd Substrate processing apparatus, substrate processing method, and computer readable storage medium storing substrate processing program

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