JP2003282621A - Sphere holding device, and fine sphere delivery method and its device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To eliminate the difficulty of peeling of a fine sphere stored in an alignment pit from the bottom surface and the inner circumferential wall of an alignment pit readily and surely without raising any problems. <P>SOLUTION: The sphere holding device has an alignment pallet 12 with a plurality of alignment pits 11 opened to a surface side, wherein a solder ball 1 is stored; a pallet pad 13 holding the alignment pallet 12; and a pallet stroke device 14 which provides the alignment pallet 12 with impact force such that the solder ball 2 stored in a plurality of alignment pits 11 rises from the bottom surface of the alignment pits 11. A plurality of alignment pits 11 of the alignment pallet 12 and a plurality of absorption pits 15 which are formed in an absorption head 16 corresponding to the alignment pit 11 and absorb and hold the solder ball 1 respectively are communicated. In the state, impact force is applied to the alignment pallet 12 by means of the pallet stroke device 14 while absorbing an inside of the absorption pit 15 and the solder ball 1 is absorbed and held to the absorption pit 15. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sphere holding device capable of reliably lifting microspheres contained in alignment pits formed on an alignment pallet from the alignment pit, and a microsphere held by the sphere holding device. The present invention relates to a method and an apparatus for transferring microspheres for transferring a sphere onto a transfer target.

[0002]

2. Description of the Related Art In a semiconductor chip mounting operation, when forming bump electrodes such as flip chips, chip size packages, and ball grid arrays, conductive balls typified by solder balls are placed at positions where the bump electrodes should be formed. A method of arranging them and heating them all at once to form bump electrodes is known.

A method of arranging conductive balls at predetermined locations of a semiconductor chip on which bump electrodes are to be formed to form bump electrodes is to form alignment pits in which the conductive balls are housed and to form electrode pads on a wiring board or the like. A technique has been developed and put into practical use in which conductive balls are transferred from an aligned pallet formed in the same array state to a portion that will be an electrode pad such as a wiring board while maintaining the aligned state. More specifically, first, an alignment pallet having alignment pits for accommodating the conductive balls is prepared in the same arrangement as the arrangement of the electrode pads formed on the wiring board, and the conductive balls are placed in the alignment pits of the alignment pallet. To house each. Next, a suction head having suction pits for suction-holding the conductive balls formed in the same arrangement as the alignment pits of the alignment pallet is placed on the alignment pallet to form the alignment pit of the alignment pallet and the suction pit of the suction head. To be in communication with each other. Then, the inside of the suction pit is decompressed to cause the conductive balls accommodated in the alignment pit to be suction-held in the suction pit, and the suction head is moved above the wiring board in this state, and the suction head is moved with respect to the wiring board. Position to release the suction operation in the suction pit. As a result, the conductive balls sucked and held in the suction pits are transferred onto the electrode pads of the wiring board, and they are collectively heated to form bump electrodes.

[0004]

The conductive balls accommodated in the alignment pits of the alignment pallet easily adhere to the bottom surface and inner peripheral wall of the alignment pits, and the suction balls are placed in the suction pits with the suction heads superposed on the alignment pallets. Since the conductive balls may not be separated from the aligned pits even if the suction is performed, conventionally, it was necessary to use a suction device having a suction capacity higher than necessary.

In order to avoid such inconvenience, gas or liquid is supplied into the alignment pits of the alignment pallet when sucking in the suction pits to promote the peeling of the conductive balls from the bottom surface or inner peripheral wall of the alignment pits. Such a technique is proposed in Japanese Patent Laid-Open No. 2001-135660. Similarly, a technology has been proposed in which a piezoelectric element or the like is used to apply vibration to the alignment pallet when sucking the inside of the suction pit to promote separation of the conductive balls from the bottom surface or inner peripheral wall of the alignment pit.

However, Japanese Patent Laid-Open No. 2001-13566
In the technique proposed in Japanese Patent Publication No. 0, it is found that even if the gas is ejected from the alignment pit, the conductive balls do not always separate from the alignment pit and may be pressed against the inner peripheral wall. did. Further, when the liquid is ejected from the alignment pit, there is a possibility that the subsequent process may be adversely affected depending on the property of the liquid.

When the inside of the suction pit is sucked, vibration is applied to the alignment pallet by using a piezoelectric element or the like to accelerate the separation of the conductive balls from the bottom surface or inner peripheral wall of the alignment pit. As a practical matter, it is difficult to attach the piezoelectric element or the like to the alignment pallet without adversely affecting the suction work.

[0008]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a sphere holding device capable of reliably peeling microspheres contained in an alignment pit from the bottom surface or inner peripheral wall of the alignment pit.

Another object of the present invention is to provide a microsphere delivery method and apparatus using such a sphere holding device.

[0010]

The first aspect of the present invention is as follows.
An alignment pallet having a plurality of alignment pits opened on the front surface side and accommodating microspheres, a pallet holder for holding the alignment pallets, and microspheres accommodated in the plurality of alignment pits And a shock imparting means for imparting an impact force that lifts up from the bottom surface to the aligned pallet.

According to a second aspect of the present invention, a step of accommodating microspheres in a plurality of alignment pits opened on the surface side of the alignment pallet, the plurality of alignment pits of the alignment pallet, and the alignment pits Correspondingly, a step of communicating with a plurality of suction pits for respectively sucking and holding microspheres formed on the suction head, and sucking the inside of the suction pit in a state where the alignment pit and the suction pit are in communication with each other. At the same time, the step of applying an impact force to the alignment pallets so that the microspheres housed in the alignment pits float up from the bottom surface of the alignment pits to suck and hold the microspheres in the suction pit. There is a microsphere delivery method.

A third aspect of the present invention is a sphere holding device according to the first aspect of the present invention, and a plurality of suction balls for holding microspheres corresponding to the alignment pits of the alignment pallet in the sphere holding device. Suction heads having suction pits, suction means for communicating with the plurality of suction pits so as to hold microspheres in the suction pits, the plurality of alignment pits of the alignment pallet, and the plurality of suction heads. A suction position for allowing the plurality of suction pits to hold the microspheres that are in communication with the suction pits and that are housed in the plurality of alignment pits, and the microspheres that are suction-held in the plurality of suction pits. Microsphere transfer, comprising: a transfer position at which a transfer object for transfer is carried in and a head moving means for moving the suction head. It is in the location.

[0013]

In the present invention, after accommodating the microspheres in each of the plurality of alignment pits opened on the front surface side of the alignment pallet, the head moving means is operated to move the suction head to the suction position, and the alignment pallet is moved. The suction head is superposed on the surface of the alignment pallet so that the alignment pit and the suction pit of the suction head communicate with each other. Then, in this state, the suction means and the impact imparting means are operated to apply an impact force to the alignment pallet so that the microspheres housed in the alignment pit float up from the bottom surface of these alignment pits while sucking the suction pit. Suction and hold the microspheres in the suction pit. Thereafter, the head moving means is operated to move the suction head in the state where the microspheres are suction-held by the suction pit to the transfer position to stop the operation of the suction means to release the suction-holding of the microspheres. These microspheres are transferred to a predetermined position of the transfer target carried in to the transfer position.

In this case, even if the microspheres housed in the alignment pit are not sucked and held in the suction pit only by the suction force in the suction pit by the suction means,
The impact imparting means applies an impact force to the alignment pallets so that the microspheres are lifted from the bottom surface of the alignment pits, so that the microspheres are reliably sucked and held in the suction pits.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION In a sphere holding device according to a first embodiment of the present invention, a mass body, a guide passage for movably accommodating the mass body along a direction opposite to a back surface of an alignment pallet, and this guide The impact applying means may include a mass body driving means for colliding the mass body accommodated in the passage with the rear surface of the alignment pallet. In this case, the mass body driving means may have a source of compressed air to be pumped into the guide passage, and the guide passage may be formed in the pallet pedestal.

Alternatively, the mass body, a guide member for movably holding the mass body in a direction opposite to the rear surface of the alignment pallet, and the guide member are driven so that the mass body collides with the rear surface of the alignment pallet. The impact applying means may have an actuator. In this case, the guide member may have a spring member that is elastically deformable in the direction opposite to the back surface of the alignment pallet.

The alignment pallet may further have a plurality of communication holes opened on the bottom surface and the back surface side of the alignment pits, and the pallet pedestal may have a void facing these plurality of communication holes.

In the method for transferring microspheres according to the second aspect of the present invention, the impact force applied to the alignment pallet may be a hit applied to the back surface of the alignment pallet.

In the microsphere transfer device according to the third aspect of the present invention, the microspheres may be solder balls.

[0020]

FIG. 1 shows an example in which the microsphere transfer device according to the present invention is applied to a solder ball for forming electrode bumps at a predetermined position on a circuit board (hereinafter referred to as a solder ball). ~ Detailed description will be given with reference to Fig. 5, but the present invention is not limited to such embodiments only, and all changes and modifications included in the concept of the present invention described in the claims of this specification are described. Of course, and thus of course can be applied to any other technique that is within the spirit of the invention.

FIG. 1 shows a cross-sectional structure of a main part before suction of solder balls by the suction head of this embodiment, and FIG. 2 shows a state during suction of solder balls by the suction head. That is, the solder ball delivery device in this embodiment is
An alignment pallet 12 in which alignment pits 11 for accommodating the solder balls 1 are formed at predetermined intervals, a frame-shaped pallet pedestal 13 for holding the alignment pallet 12, and a pallet pedestal 13
Solder ball supply means (not shown) for supplying the solder balls 1 to the alignment pits 11 of the alignment pallet 12 placed on the above, and the solder balls 1 housed in the alignment pits 11 of the alignment pallet 12 are these alignment pits. A pallet striking device 14 as an impact imparting means of the present invention for imparting an impact force to the aligned pallet 12 such that the impact force rises from the bottom surface of 11.
The suction pit 15 for sucking and holding the solder balls 1 housed in the alignment pit 11 of the alignment pallet 12 is the alignment pit 1.
1, and a manipulator (not shown) that grips the suction head 16 and moves it between the alignment pallet 12 and the semiconductor chip 2 (see FIG. 5). In this case, the sphere holding device according to the present invention includes the alignment pallet 12 and the pallet pedestal 13.
And a pallet striking device 14.

The alignment pits 11 opening on the upper surface of the alignment pallet 12 are formed so as to match the arrangement pattern of the electrode pads 3 formed on the semiconductor chip 2 shown in FIG. , Corresponding to the diameter of the solder ball 1 and set slightly larger than this. The bottom of each alignment pit 11 is formed with a communication hole 17 that opens to the back surface of the alignment pallet 12, and the inner diameter of these communication holes 17 is set to be smaller than the diameter of the solder ball 1 to align the solder ball 1. It is determined so as not to hinder the accommodation in the bottom of the pit 11.

Inside the pallet pedestal 13, a space 18 is formed.
And the alignment pallet 12 is formed on the pallet cradle 1
In the state of being placed on No. 3, the communication hole 17 of the alignment pallet 12 is in communication with the void portion 18. The pallet striking device 1 described later is provided on the back side of the pallet receiving base 13.
In addition to No. 4, a cap member (not shown) that covers the void 18 in a hermetically sealed state can be mounted, and the cap member is depressurized to hold the solder ball 1 in the alignment pit 11. A suction pump (not shown) is connected.

Pallet striking device 14 in this embodiment
Is a passage forming member 19, a plurality of guide cylinders 20 standing on the upper surface of the passage forming member 19 at predetermined intervals, and a striking ball 21 housed in each of the guide cylinders 20 and formed of resin or the like. And a compressor (not shown) that communicates with a connection port 22 that is open to the side end surface of the passage forming member 19 via a pipe (not shown). The passage forming member 19 has a manifold 23 whose one end communicates with the connection port 22, and a plurality of branches whose base end communicates with the other end of the manifold 23 in a collective state and whose upper end opens to the lower end of the guide cylinder 20. A passage 24 is formed. Guide tube 2
The inner diameter of 0 is set to be slightly larger than the outer diameter of the striking ball 21 so that the striking ball 21 can move up and down in the guide cylinder 20.

When the pallet striking device 14 is in use, the upper end of the guide cylinder 20 has a space 18 in the pallet support 13.
It is located inside and is close to the back surface of the alignment pallet 12. Compressed air from the compressor is the manifold 23
In a state in which the striking ball 21 is not supplied inside, the striking ball 21 is positioned at the lower end of the guide cylinder 20 by its own weight and closes the upper end of the branch passage 24. When compressed air is supplied into the manifold 23 from this state, the striking ball 21 is accelerated and rapidly rises in the guide cylinder 20, and the alignment pallet 12
The solder balls 1 housed in the alignment pits 11 when they collide with the back surface of the alignment pits 11 are applied to the alignment pallets 12 with an impact force such that they are lifted from the bottom surface of the alignment pits 11. Therefore, it is desirable to set the number and arrangement state of the guide cylinders 20 so that the impact force of the striking ball 21 is evenly transmitted to all the solder balls 1 accommodated in the alignment pits 11 of the alignment pallet 12. It is possible to arrange them at equal intervals on the circumference of a predetermined diameter or to arrange them concentrically. Further, the strength of the impact force on the alignment pallet 12 is changed by changing the weight of the striking ball 21, that is, the material, the outer diameter, or the like, changing the pressure of the compressed air or the pulse-like supply time, or the number of the guide tubes 20. It can be changed as appropriate.

It is desirable that the compressed air is supplied into the manifold 23 intermittently for a predetermined time so that the striking ball 21 collides with the back surface of the alignment pallet 12 one or more times. Further, by stopping the supply of the compressed air into the manifold 23, the impact ball 21 falls to the bottom surface of the guide cylinder 20 due to its own weight and returns to the original stationary state shown in FIG.

On the other hand, the suction head 16 facing the aligning pallet 12 is also basically the same in structure as the aligning pallet 12, and a head plate in which a plurality of suction pits 15 for sucking and holding the solder balls 1 are opened on the lower surface. 25
And a head main body 27 to which the head plate 25 is attached and a suction passage 26 communicating with the suction pit 15 is formed. The head main body 27 is evacuated to reduce the pressure in the suction passage 26. A suction pump (not shown) for suction-holding the solder balls 1 is connected to the suction ball 26 via a connection port 28 formed at the end of the suction passage 26. The suction pits 15 opening on the head plate 25 are aligned with the alignment pits 11 opening on the alignment pallet 12.
The solder balls 1 are formed so as to match the arrangement pattern of No. 1 and the diameter thereof is set smaller than that of the solder balls 1.

A fine suction pit 1 is formed on the head plate 25.
In the case of forming No. 5, the head plate 25 itself must be formed thin due to the restriction of the processing method. Therefore, when the suction pump is operated to reduce the pressure in the suction passage 26, the head plate 25 is flexibly deformed and the adhesion with the alignment pallet 12 is lowered, so that the solder ball 1 can be reliably sucked. It may disappear. In order to avoid such a problem, it is effective to incorporate into the suction passage 26 a reinforcing member that abuts against the back surface of the head plate 25 so as not to block the suction pit 15 and prevents the bending deformation thereof.

The alignment pallet 12 and the head plate 25 described above are formed of a material such as silicon, metal, glass, ceramics or resin, and are precisely processed by a known processing method such as electroforming or etching. .

The solder ball 1 is actually used to transfer the solder ball 1 to the electrode pad 3 of the semiconductor chip 2 by using such a solder ball transfer device.
In the case of transferring to the substrate 1, the solder balls 1 are housed one by one in the alignment pits 11 of the alignment pallet 12 by a well-known method or device not shown, and then the suction head 16 in a standby state is placed on the alignment pallet 12. By operating a manipulator (not shown), the head plate 25 of the suction head 16 is superposed on the alignment pallet 12 and the alignment pit 1
The suction head 16 is placed on the alignment pallet 12 so that the 1 and the suction pit 15 face each other. As a result, FIG.
As shown in, the upper surface of the alignment pallet 12 and the lower surface of the head plate 25 are in close contact with each other, and the individual alignment pits 11 and the suction pits 15 are in communication with each other.

In this state, the suction pump (not shown) connected to the suction passage 26 of the suction head 16 is operated to reduce the pressure in the suction passage 26, so that the inside of the void portion 18 passes from the communication hole 17 through the alignment pit 11. The air is sucked into the suction pits 15, the solder balls 1 housed in the alignment pits 11 are pulled up to the suction pits 15 side, and sucked and held in the suction pits 15, respectively. At this time, compressed air in the compressor is simultaneously supplied into the manifold 23 so that the striking ball 21 collides with the rear surface of the alignment pallet 12 and the solder balls 1 housed in the alignment pits 11 float up from the bottom surfaces of these alignment pits 11. By imparting such an impact force to the alignment pallet 12, the distance between the solder ball 1 and the suction pit 15 is instantaneously narrowed, and the alignment pit 1 is not required even if the suction force by the suction pump is set to be not so large.
It is possible to reliably suck and hold the solder ball 1 that is in an adhesive state on the inner wall of the suction nozzle 1 in the suction pit 15.

Since a part of the compressed air that accelerates the striking ball 21 is jetted from the guide cylinder 20 into the alignment pit 11 of the alignment pallet 12, this also adheres to the inner wall of the alignment pit 11. It acts as an impact force on the solder balls 1, and all the solder balls 1 in the alignment pit 11 can be reliably sucked and held in the suction pit 15.

In this manner, the suction head 16 holding the solder balls 1 by suction is pulled up from the alignment pallet 12,
The manipulator is operated so that the solder balls 1 are transferred to the electrode pads 3 of the semiconductor chip 2 shown in FIG. 3, and in this state, the suction pump is stopped to hold the solder balls 1 by suction. After that, the solder ball 1 is transferred onto the electrode pad 3 of the semiconductor chip 2.

This embodiment can also be used when the solder balls 1 are transferred to a printed wiring board or the like instead of the semiconductor chip 2 described above. Further, instead of the guide cylinder 20 of the pallet striking device 14, a guide passage may be formed in the pallet receiving base 13 to simplify the structure.

FIG. 4 shows a cross-sectional structure of one embodiment of the sphere holding device according to the present invention. Elements having the same functions as those of the previous embodiment are designated by the same reference numerals, and duplicate description will be omitted. It shall be omitted. That is, the alignment palette 12
Guide passages 29 for accommodating the striking balls 21 are formed at predetermined intervals in the pallet pedestal 13 having a void portion 18 formed on the upper surface portion thereof facing the communication holes 17 of the aligned pallet 12. It is in a state of facing the bottom surface. Therefore, in this embodiment, the pallet receiving base 13 also serves as a part of the pallet striking device 14, and the number of parts can be reduced as compared with the previous embodiment. Further, the pallet pedestal 13 is placed on the passage forming member 19 so that the lower end of the guide passage 29 communicates with the open end of the upper end of the branch passage 24 formed in the passage forming member 19.

Therefore, when compressed air from a compressor (not shown) is supplied into the manifold 23, the striking ball 21 is accelerated and rapidly rises in the guide passage 29, collides with the rear surface of the alignment pallet 12 and in the alignment pit 11. It is possible to apply an impact force to the alignment pallet 12 such that the solder balls 1 accommodated in the above float up from the bottom surface of the alignment pits 11.

In the two embodiments described above, the hit ball 2
Although compressed air was used as means for accelerating 1, the impact ball 21 can be accelerated by using an actuator such as a solenoid or an air cylinder to collide with the alignment pallet 4 to give an impact force. .

A cross-sectional structure of another embodiment of the sphere holding device according to the present invention is shown in FIG. 5. Elements having the same functions as those of the previous embodiment are designated by the same reference numerals, and redundant description will be repeated. Shall be omitted. That is, the pallet striking device 14 according to the present embodiment includes a frame-shaped pallet pedestal base 13.
Of the striking balls 21 held in the voids 18, the leaf springs 30 having the striking balls 21 connected to the tips thereof, and the stoppers 31 to which the base ends of the leaf springs 30 are fixed,
A sliding shaft 32 having the stopper 31 fixed to the upper end, a guide bush 33 that slidably holds the sliding shaft 32 in a direction opposite to the alignment pallet 12, and a slide protruding from the lower end of the guide bush 33. A hammer 34 facing the lower end surface of the shaft 32
And a solenoid 35 for raising and lowering the hammer 34 in a direction parallel to the sliding direction of the sliding shaft 32.

The above-mentioned leaf springs 30 are radially attached to the stopper 31 that defines the descending end of the sliding shaft 32 with respect to the guide bush 33, and the striking ball 21 connected to the tip of these is the sliding ball. When 32 is in the lower end position, the relative position between the pallet holder 13 and the guide bush 33 is set so as to face the back surface of the alignment pallet 12 with a predetermined gap. Solenoid 35
Can instantaneously switch the hammer 34 connected to the plunger 36 of the solenoid 35 between the standby position shown by the solid line and the striking position shown by the chain double-dashed line in the figure. When the hammer 34 connected to the plunger 36 is switched to the striking position, the sliding shaft 32 suddenly rises while being guided by the guide bush 33, so that the striking ball 21 collides with the aligning pallet 12 with inertial movement, and the aligning pallet 12 moves. It is possible to give an impact force to the alignment pallet 12 such that the solder balls 1 housed in the alignment pits 11 float up from the bottom surface of these alignment pits 11. In this case, for the rising stroke of the sliding shaft 32,
It is not necessary to set the distance between the striking ball 21 and the rear surface of the alignment pallet 12 to be the same, and even if the distance between the striking ball 21 and the rear surface of the alignment pallet 12 is narrower than the rising stroke of the sliding shaft 32, the leaf spring 30 Does not cause any particular inconvenience because it is elastically deformed. That is, by using the leaf spring 30 having an appropriate elastic coefficient, the alignment pallet 1
The impact force given to 2 can be set appropriately.

As described above, the solenoid 35 is used in this embodiment.
Since the displacement of the plunger 36 is transmitted to the striking ball 21 via the leaf spring 30,
The impact force can be relaxed as compared with the case where the displacement of No. 1 is directly transmitted to the aligned pallet 12, and the relative position between the solenoid 35 and the pallet pedestal 13 need not be adjusted so strictly.

[0041]

According to the sphere holding device of the present invention, an alignment pallet having a plurality of alignment pits opened on the front surface side and accommodating microspheres respectively, a pallet pedestal for holding the alignment pallet, and a plurality of pallets. Since the microspheres accommodated in the alignment pits are provided with impact imparting means for imparting an impact force to the alignment pallets so that the microspheres are lifted from the bottom surface of these alignment pits, the microspheres accommodated in the alignment pits of the alignment pallet are aligned pits Even if the microspheres are attached to the bottom surface or the inner wall of the alignment pit, the microspheres can be reliably separated from the bottom surface or the inner wall of the alignment pit by applying an impact force to the alignment pallet.

The impact imparting means accommodates the mass body, a guide passage for movably accommodating the mass body in a direction opposite to the rear surface of the alignment pallet, and the mass body accommodated in the guide passage for the rear surface of the alignment pallet. When the mass body driving means is made to collide with, the mass body driving means can be operated to move the mass body along the guide passage so as to collide with the rear surface of the alignment pallet.

If the mass body driving means has a source of compressed air to be pumped into the guide passage, the structure of the mass body driving means can be simplified.

When the guide passage is formed on the pallet pedestal,
The number of parts for forming the guide passage can be reduced.

The impact imparting means includes a mass body, a guide member for movably holding the mass body in a direction opposite to the rear surface of the alignment pallet, and a guide member for causing the mass body to collide with the rear surface of the alignment pallet. In the case of having an actuator to be driven, the actuator can be operated to move the mass body by the guide member along the direction opposite to the back surface of the alignment pallet and collide with the back surface of the alignment pallet.

When the guide member has a spring member that is elastically deformable in the direction opposite to the rear surface of the alignment pallet, it is not necessary to set the stroke of the actuator and the movement amount of the mass body to be the same, and the damage of the alignment pallet is prevented. Can be prevented.

When the alignment pallet further has a plurality of communication holes opened on the bottom surface and the back surface side of the alignment pits, and the pallet pedestal has a space facing the plurality of communication holes, the suction pit is formed by the suction means. By sucking the inside of the pallet, an air flow that flows from the gap of the pallet cradle to the suction pit through the communication hole and the alignment pit is formed, and this air flow smoothly moves the microspheres from the alignment pit to the suction pit. It can be held by suction.

According to the microsphere transfer method of the present invention,
Microspheres are respectively housed in a plurality of alignment pits that open on the surface side of the alignment pallet, and a plurality of alignment pits of the alignment pallet and a suction head corresponding to these alignment pits are formed on the microspheres to hold the microspheres by suction A plurality of suction pits for communicating with each other, and the impact that the microspheres housed in the alignment pits float from the bottom surface of these alignment pits while sucking the suction pits with the alignment pits and the suction pits communicating with each other. Since the force is applied to the alignment pallet to suck and hold the microspheres in the suction pit, it is possible that the microspheres contained in the alignment pit of the alignment pallet adhere to the bottom surface or inner wall of the alignment pit. Even if the impact force is applied to the alignment pallet, the microspheres are separated from the bottom and inner walls of the alignment pit, and this is reliably sucked into the suction pit. It can be lifting. Moreover,
It is also possible to set the suction force to the inside of the suction pit to be smaller than the conventional one.

When the impact force applied to the aligned pallet is due to the impact applied to the back surface of the aligned pallet,
The configuration for that can be simplified.

According to the microsphere transfer device of the present invention,
The sphere holding device of the present invention, a suction head in which a plurality of suction pits for respectively sucking and holding microspheres are formed corresponding to the alignment pits of the alignment pallet in the sphere holding device, and the plurality of suction pits communicate with each other. The suction means for sucking and holding the microspheres in these suction pits, the plurality of alignment pits of the alignment pallet, and the plurality of suction pits of the suction head communicate with each other to form a plurality of microspheres housed in the plurality of alignment pits. Head movement for moving the suction head to a suction position for suction-holding in the suction pit and a transfer position for transferring a transfer target for transferring the microspheres suction-held in the plurality of suction pits Since it is equipped with means, even if the microspheres housed in the alignment pits of the alignment pallet are attached to the bottom surface or the inner wall of the alignment pits, Is peeled microspheres from the bottom and inner walls of the aligned pits by providing an impact force to the pallet,
This can be reliably suction-held in the suction pit. Moreover, since the suction force in the suction pit by the suction means can be set to be smaller than that of the conventional one, it is not necessary to use the suction means having high ability.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing the internal structure of an embodiment of a microsphere transfer device according to the present invention.

FIG. 2 is a cross-sectional view showing a state in which the suction head is at a suction position in the embodiment shown in FIG.

FIG. 3 is a cross-sectional view showing a state in which the suction head is in a transfer position in the embodiment shown in FIG.

FIG. 4 is a sectional view showing a schematic structure of another embodiment of the sphere holding device according to the present invention.

FIG. 5 is a sectional view showing a schematic structure of another embodiment of the sphere holding device according to the present invention.

[Explanation of symbols]

1 solder ball 2 semiconductor chips 3 electrode pad 11 aligned pits 12 Alignment palette 13 Pallet stand 14 Pallet striking device 15 Suction pit 16 suction head 17 communication holes 18 Void 19 Passage forming member 20 guide tube 21 hit ball 22 Connection port 23 manifold 24 branch passages 25 head plate 26 Suction passage 27 head body 28 connection ports 29 guidance passage 30 leaf spring 31 Stopper 32 sliding axis 33 Guide bush 34 Hammer 35 solenoid 36 Plunger

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Akio Katahira             Shizuoka Prefecture Hamamatsu City Oshima Town 348 Japan Lee             -In M Co., Ltd.

Claims (11)

[Claims] 1. An alignment pallet having a plurality of alignment pits, each of which is opened on the front surface side and accommodates microspheres, a pallet holder for holding the alignment pallet, and a microscopic pit accommodated in the plurality of alignment pits. A sphere holding device, comprising: a shock imparting means for imparting a shock force to the alignment pallet so that the sphere floats from the bottom surface of these alignment pits. 2. The impact imparting means includes a mass body, a guide passage for movably accommodating the mass body along a facing direction of a rear surface of the alignment pallet, and the mass contained in the guide passage. The sphere holding device according to claim 1, further comprising a mass body driving unit that causes a body to collide with a back surface of the alignment pallet. 3. The sphere holding device according to claim 2, wherein the mass body driving means has a supply source of compressed air that is pressure-fed into the guide passage. 4. The sphere holding device according to claim 2 or 3, wherein the guide passage is formed in the pallet pedestal. 5. The impact applying means includes a mass body, a guide member for movably holding the mass body along a direction facing the back surface of the alignment pallet, and the mass body on the back surface of the alignment pallet. The sphere holding device according to claim 1, further comprising an actuator that drives the guide member so as to collide. 6. The sphere holding device according to claim 5, wherein the guide member includes a spring member that is elastically deformable in a direction facing the back surface of the alignment pallet. 7. The alignment pallet further has a plurality of communication holes that are open to the bottom surface and the back surface side of the alignment pit,
The sphere holder according to any one of claims 1 to 6, wherein the pallet pedestal has a space where the plurality of communication holes face. 8. A step of accommodating microspheres in each of a plurality of alignment pits opening on the surface side of the alignment pallet, the plurality of alignment pits of the alignment pallet, and a suction head corresponding to these alignment pits. And a step of communicating a plurality of suction pits for sucking and holding each of the microspheres, and a state in which the alignment pit and the suction pit are in communication with each other A method for delivering microspheres, which comprises the step of: applying an impact force such that the formed microspheres float from the bottom surface of these alignment pits to the alignment pallet to suck and hold the microspheres in the suction pit. 9. The method for transferring microspheres according to claim 8, wherein the impact force applied to the alignment pallet is a hit applied to the back surface of the alignment pallet. 10. The sphere holding device according to any one of claims 1 to 7, and a plurality of suction pits for respectively sucking and holding microspheres corresponding to the alignment pits of an alignment pallet in the sphere holding device. A suction head having a plurality of suction pits formed therein, a suction means communicating with the plurality of suction pits and capable of sucking and holding microspheres in the suction pits, the plurality of alignment pits of the alignment pallet, and the plurality of suctions of the suction head. A suction position for sucking and holding the microspheres housed in the plurality of alignment pits in communication with the pits and held in the plurality of suction pits, and the microspheres sucked and held in the plurality of suction pits are transferred. And a head moving means for moving the suction head to a transfer position at which a transfer object for carrying out is transferred. 11. The microsphere transfer device according to claim 10, wherein the microspheres are solder balls.