JP2003282522A - Resist-peeling device and method of controlling the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resist-peeling device in which the consumption of resist- peeling liquid due to evaporation is reduced and wasteful power consumption can be reduced, and to provide the controlling method of the resist-peeling device. <P>SOLUTION: In the resist-peeling device 1, a peeling liquid soaking part 11 having a peeling liquid tank 22 filled with peeling liquid 21, a circulation pump 23 circulating the peeling liquid, a temperature sensor 24, a heater 25 heating the peeling liquid tank, a temperature controller 26 and a temperature control circuit 27 is used, the temperature of the peeling liquid tank filled with the peeling liquid is set to be a resist peeling temperature when peeling is performed and it is set to be a standby temperature when the peeling is on standby. Since the temperature of the peeling liquid tank can be controlled at the resist-peeling and on the standby of the peeling, the consumption of resist-peeling liquid due to evaporation can be reduced, and wasteful power consumption at the standby can be reduced. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resist stripping apparatus and a method for controlling a resist stripping apparatus, and more particularly to a resist stripping apparatus and a resist stripping apparatus for adjusting the temperature of stripping solution during resist stripping processing and standby of stripping processing. Regarding control method.

[0002]

2. Description of the Related Art Generally, when manufacturing a semiconductor device such as an IC, there is a step of peeling a resist film applied on the surface of a semiconductor wafer constituting the semiconductor device in the manufacturing process. This resist stripping process includes, for example, a resist stripping liquid dipping process, a rinse liquid dipping process, an alcohol dipping process, and a pure water cleaning process.

According to the stripping treatment of the resist coating thus constructed, the semiconductor wafer having the resist coating applied on its surface is immersed in a stripping solution tank filled with the resist stripping solution for a predetermined period of time to form the resist coating. Can be peeled off.

However, if the stripping solution tank contains water at this time, the aluminum wiring pattern on the semiconductor wafer deteriorates and deteriorates due to the change of the stripping solution to acidic or alkaline. There are problems such as disconnection and corrosion.

Therefore, normally, in the resist stripping apparatus,
The temperature of the stripping solution is maintained at a temperature (100 ° C. or higher) sufficient to evaporate the water, so that the stripping solution tank does not contain water. Further, in general, the stripping solution has a solution temperature of 10
When the temperature is raised to 0 ° C or higher, the peeling force increases, and the temperature is maintained and used at 120 ° C or lower according to the risk of the flammability of the peeling liquid.

[0006]

However, the conventional stripper is kept at the same set temperature during treatment and untreated, and the set temperature of the liquid temperature in the stripper tank is increased to increase the stripping force. Since it is kept at that high temperature even after the treatment,
There is a problem in that the evaporation of the stripping solution is promoted, and the degree of consumption of the untreated stripping solution increases before and after the temperature is set. In addition, since there is a processing time difference between the series of resist processing steps, there is a predetermined interval before moving to the next semiconductor wafer stripping process, and wasteful power consumption and stripping solution consumption due to maintaining the liquid temperature during that period are avoided. I couldn't do it.

Therefore, the present invention has been made in view of the above-described problems, and a resist stripping apparatus and a resist stripping apparatus that can reduce the consumption of the resist stripping solution due to evaporation and the wasteful power consumption. An object is to provide a method of controlling a device.

[0008]

In order to achieve the above object, a resist stripping apparatus according to the present invention is a resist stripping apparatus for stripping a resist coating of a semiconductor wafer coated with a resist coating with a stripping solution. A stripping solution tank filled with the stripping solution, a temperature control means for controlling the temperature of the stripping solution, and a temperature control means for setting the temperature of the stripping solution tank to the resist stripping processing temperature during stripping processing and to the standby temperature during standby for stripping processing. Is equipped with.

In such a resist stripping apparatus, the temperature of the stripping solution tank is adjusted during stripping processing and standby of stripping processing to reduce evaporation of stripping solution and power consumption during standby.

The peeling treatment temperature is 100 ° C. to 12 ° C.
It is preferably 0 ° C.

In order to achieve the above-mentioned object, a method of controlling a resist stripping apparatus according to the present invention is a method of controlling a resist stripping apparatus for stripping a resist coating on a semiconductor wafer with a stripping solution. The method has a temperature control step in which the temperature of the stripping solution tank filled with the stripping solution is the resist stripping temperature during the stripping step of stripping and the standby temperature during the standby of stripping.

According to this control method, since the temperature of the stripping solution tank is adjusted during the stripping process and when the stripping process is on standby, the evaporation of the stripping solution is reduced and the power consumption during standby is reduced.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, specific examples of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a diagram for explaining a resist stripping apparatus as a specific example of the present invention. Resist stripping device 1
Is composed of a stripping solution immersion section 11, a rinse solution immersion section 12, an alcohol immersion section 13, and a pure water cleaning section 14. According to this resist stripping apparatus 1, the semiconductor wafer 10 having the surface coated with the resist film is removed by the stripping solution immersion section 1
In No. 1, the resist film on the surface of the semiconductor wafer is peeled off by immersing it in the peeling liquid in the peeling liquid tank for a certain time.

Then, the semiconductor wafer 10 is dipped in the rinse liquid in the rinse liquid immersion unit 12, further immersed in the alcohol liquid in the alcohol immersion unit 13, and finally purified water is cleaned in the pure water cleaning unit 14. As a result, the semiconductor wafer 10 is in a state where the resist coating on the surface is completely peeled off.

FIG. 2 shows a specific structure of the stripping solution immersion section 11 in the resist stripping apparatus 1 of this specific example. The stripping solution immersion section 11 includes a stripping solution tank 22 filled with the stripping solution 21, a circulation pump 23 for circulating the stripping solution,
A temperature sensor 24 and a heater 25 for heating the stripping solution tank,
A temperature controller 26 and a temperature control circuit 27 are provided.
As the stripping solution 21, a dehydrated amine-based stripping solution is used.

The temperature control circuit 27 controls the temperature controller 26 to set the temperature of the stripping solution in the stripping solution tank 22 to the resist stripping processing temperature during the stripping processing step of resist stripping processing, and to the standby temperature during the stripping processing standby. Is adjusted to. Further, the temperature control circuit 27 adjusts the stripping processing temperature and the standby temperature depending on the unprocessed time.

The peeling treatment temperature at this time is from 100 ° C to
120 ° C. is preferred. When the temperature is 100 ° C. or lower, moisture may be mixed in the stripping solution, and the aluminum wiring pattern on the semiconductor wafer 10 may deteriorate and deteriorate due to the change in the liquidity of the stripping solution to alkaline, which may cause disconnection or corrosion. Because there is. Further, when the temperature of the stripping solution exceeds 120 ° C., the evaporation amount of the stripping solution increases and the flammability of the stripping solution increases.

In this example, the stripping temperature is set to 120 ° C., and the standby temperature is set to 100 ° C., considering the efficiency of the resist stripping process. In addition, the unprocessed time is set to, for example, 10 minutes, and the main power of the peeling device 1 is turned off.
After 10 minutes, the standby temperature is set to 100 ° C., the main power of the peeling apparatus 1 is turned on, and then the peeling processing temperature is set to 120 ° C. Thus, by adjusting the liquid temperature of the stripping solution during the resist stripping process and during the stripping process standby, the stripping solution and power consumption during the stripping process standby can be reduced.

The present invention is not limited to the above-described embodiments, and it goes without saying that various modifications can be made without departing from the gist of the present invention.
For example, the stripping solution immersion section, the rinse solution immersion section, the alcohol immersion section, and the pure water cleaning section are not limited to one tank, but may be a plurality of tanks. In this case, the resist film is reliably peeled off.

[0021]

As described above in detail, according to the resist stripping apparatus according to the present invention, the temperature of the stripping solution tank can be adjusted during the resist stripping process and during the stripping process standby. It is possible to reduce consumption due to evaporation of the liquid and reduce unnecessary power consumption during standby.

Further, according to the method of controlling the resist stripping apparatus according to the present invention, the temperature of the stripping solution tank can be adjusted during the stripping process and during the stripping process standby, so that the consumption of the resist stripping solution due to evaporation can be reduced. It is possible to reduce unnecessary power consumption during standby.

[Brief description of drawings]

FIG. 1 is a schematic diagram illustrating a resist stripping process by a resist stripping apparatus shown as a specific example of the present invention.

FIG. 2 is a schematic diagram illustrating a stripping solution immersion section in a resist stripping apparatus as a specific example of the present invention.

[Explanation of symbols]

1 Resist stripping device 10 Semiconductor wafer 11 Stripping solution immersion part 12 Rinse solution immersion part 13 Alcohol immersion part 14 Pure water cleaning section 21 Stripper 22 Stripping liquid tank 23 Circulation pump 24 Temperature sensor 25 heater 26 Temperature controller 27 Temperature control circuit

Claims (3)

[Claims] 1. A resist stripping apparatus for stripping a resist coating of a semiconductor wafer coated with a resist coating with a stripping solution, comprising: a stripping solution tank filled with the stripping solution; and temperature control for adjusting the temperature of the stripping solution. A resist stripping apparatus comprising: means for controlling the temperature of the stripping solution tank to be a resist stripping processing temperature during stripping processing; and a temperature control means for maintaining a standby temperature during stripping processing standby. 2. The peeling treatment temperature is 100 ° C. to 120 ° C.
The resist stripping apparatus according to claim 1, wherein the resist stripping apparatus has a temperature of ° C. 3. A method of controlling a resist stripping apparatus for stripping a resist coating of a semiconductor wafer coated with a resist coating with a stripping solution, wherein the temperature of a stripping solution tank filled with the stripping solution is set to the stripping processing. A method of controlling a resist stripping apparatus, comprising a temperature control step of setting a resist stripping processing temperature during a stripping processing step and a standby temperature during a stripping processing standby state.