JP2003273316A - Semiconductor manufacturing system and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a low-cost thin semiconductor device and its manufacturing method without performing polishing by which much time may be wasted and an unnecessary residual stress may be applied to the semiconductor chip. <P>SOLUTION: Several band members which are composed of tape, several semiconductor chips arranged lengthwise and crosswise on its surface, and several electrode terminals protruding from its underside, are vertically stacked into a multilayer structure and are resin sealed. The multilayer resin sealed member 13 which is resin sealed and shaped into a block is cut by a blade 18 by chipping off the inactive surface of several semiconductor chips which are resin sealed in one plane for dividing the member 13 into individual single- layer resin sealed members 17. Individual semiconductor devices are further obtained by the blade 18. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin encapsulation formed by stacking a plurality of flexible substrates on which a plurality of semiconductor chips are mounted and encapsulating with a resin, and dividing the resin encapsulation into regions each of which includes one semiconductor chip. The present invention relates to a semiconductor device obtained by the above method, a method for manufacturing the same, a stack type semiconductor device in which a plurality of the obtained semiconductor devices are stacked in multiple stages, and a method for manufacturing the same.

[0002]

2. Description of the Related Art In recent years, semiconductor devices have been required to be able to form a thin package as the electronic devices have been downsized. Further, a demand for a semiconductor device having a high density and a small stack module structure has been demanded.

An example of this thin semiconductor device is disclosed in, for example, Japanese Patent Laid-Open No. 2001-57404. In this semiconductor device, a plurality of semiconductor chips are bonded to a substrate by face-down and molded into a resin molded body obtained by resin sealing. Then, a plurality of semiconductor chip surfaces on the non-active surface side containing the resin are polished to a predetermined thickness, and the thinned resin molded body is divided and separated into regions including the semiconductor chip to fabricate a plurality of semiconductor devices. It is characterized by that.

On the other hand, as a stack type semiconductor device,
For example, it is disclosed in JP-A-8-236694. In this semiconductor device, a semiconductor chip structure in which an LSI chip is mounted on a ceramic carrier substrate or a flexible substrate on which wiring conductors are formed via minute bumps is resin-sealed to obtain a resin molded body including one LSI chip. ing.

Then, the non-active surface side of the LSI chip is polished to obtain a semiconductor device including one thin LSI chip, and a plurality of these semiconductor devices are stacked with an adhesive material and connected by a wiring conductor of a substrate to form a stack. It is characterized by being assembled into a semiconductor device.

[0006]

However, in the above-described semiconductor device, the semiconductor chip must be polished in order to reduce the thickness. There is a problem that this polishing man-hour takes a very long time. Moreover, since one surface is polished, there is a problem that residual stress is generated and the semiconductor chip is warped to cause separation between the semiconductor chip and the resin.

Therefore, an object of the present invention is to provide a semiconductor device which can be obtained at a low cost without spending a lot of time and polishing which gives unnecessary residual stress to a semiconductor chip, and a manufacturing method thereof.

[0008]

The first feature of the present invention is to:
A plurality of semiconductor chips are vertically and horizontally mounted on a tape and are connected to the tape wiring and electrode pads corresponding to the wiring, and have a plurality of electrode terminals protruding from the back surface of the tape. A plurality of members are prepared, and a laminated resin encapsulating member formed by stacking the strip-shaped constituent members vertically and encapsulating the resin to obtain a laminated resin encapsulating member. The resin member interposed between the blades is rotated by a blade, and the blade is moved in the horizontal direction so as to scrape off the inactive surface of the semiconductor chip on one plane, and the laminated resin is sealed. The member is separated into a single-layer resin sealing member including a plurality of thinly cut semiconductor chips arranged in one plane, and thereafter, the single-layer resin sealing member is divided into boundaries between the semiconductor chips adjacent to each other. Off Cut and separated by means of a semiconductor device obtained by separating a resin sealing member comprising individual one of said semiconductor chip.

A second feature of the present invention is that a plurality of semiconductor chips are mounted vertically and horizontally on a tape and are connected to the wiring of the tape and an electrode pad corresponding to the wiring, and the tape is also connected to the tape. A plurality of other strip-shaped components having a plurality of electrode terminals projecting on the back surface of the tape and having electrical connection terminals projecting from the wiring on the back surface of the tape around the semiconductor chip. Another laminated resin sealing member formed by stacking the band-shaped components vertically and joining the electrical connection terminals to the wiring of the other tape located below and then resin-sealing the laminated resin sealing member Another resin encapsulation member in which another blade is vertically cut into the laminated resin encapsulation member and the electric connection terminals are provided between the tapes, and the semiconductor chips are vertically aligned and resin-encapsulated. Stacked semi-conductor made by cutting and separating It is a device.

Further, a third feature of the present invention is that a plurality of semiconductor chips are mounted on a tape side by side vertically and horizontally, and are connected to the wiring of the tape and an electrode pad corresponding to the wiring, and the tape is also connected to the tape. A plurality of other strip-shaped component members having a plurality of electrode terminals protruding on the back surface of the tape and having electric connection terminals protruding from the wiring on the back surface and the surface of the tape around the semiconductor chip, Another laminated resin sealing member formed by stacking another strip-shaped component member vertically and resin-sealing is obtained. Between the tapes adjacent to each other with respect to the side surface of the other laminated resin sealing member. A notch is formed by a blade that rotates between the electric connection terminals that are interposed, and the blade is moved in a horizontal direction so as to scrape off the inactive surface of the semiconductor chip lying on a plane, and the laminated resin encapsulation is performed. Stop member It is divided into another single-layer resin sealing member including the plurality of thinly cut semiconductor chips arranged in a plane, and the single-layer resin sealing member is divided for each region including one semiconductor chip. It is a stack-type semiconductor device in which a plurality of semiconductor devices are vertically stacked and assembled.

Further, in the semiconductor device having the first characteristic, the second characteristic and the third characteristic, the electrode terminal may be a solder ball.

A fourth feature of the present invention is that the band-shaped component of the semiconductor device of the first feature, the semiconductor device of the second feature, or the semiconductor of the third feature is provided in the cavity between the upper mold and the lower mold. A first step including a step of accommodating a plurality of other strip-shaped component members in the apparatus by stacking them vertically and evacuating the cavity while pumping the melted resin into the cavity to seal the strip-shaped component member with resin; The method is a method for manufacturing a semiconductor device according to the feature, the second feature, or the third feature.

It is desirable that a release film is inserted between the strip-shaped component member or the other strip-shaped component member and the inner wall of the upper die. Further, it is desirable to insert a frame member that maintains the interval between the tapes extending outward from the strip-shaped component member or the other strip-shaped component member housed in the cavity.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.

1 (a) and 1 (b) are cross-sectional views for explaining a band-shaped component member before resin sealing in one embodiment of the present invention. As shown in FIG. 1A, the band-shaped component 15a in a state where the semiconductor chip 1 before resin sealing is mounted on the tape 2 by face-down mounting a plurality of semiconductor chips 1 arranged vertically and horizontally. The tape 2 and the electrode terminal 4 protruding from the back surface of the tape.

The tape 2 is made of, for example, a polyimide film or the like, and a hole 2 is formed in the tape 2 between the adjacent semiconductor chips 1 so that the molten resin can easily enter when the resin is filled in as described later.
It is desirable to provide a. Further, the inner lead, which is a wiring formed on the surface of the tape 2, is connected to the electrode pad of the semiconductor chip, or the electrode pad on the lower surface of the semiconductor chip 1 and the electrode on the tape surface are connected. BGA (Ball G) having an electrode terminal 4 which is flip-chip bonded and connected to the internal wiring of the tape 2 and protrudes from the back surface of the tape 2.
It is desirable to have a rid-array structure.

On the other hand, another strip-shaped component 15b of the present invention.
As shown in FIG. 1 (b), a structure in which a solder ball 3 is attached instead of the electrode terminal 4 can also be used.

FIGS. 2 (a) and 2 (b) are views for explaining the step of resin-sealing the stacked band-shaped components in the first embodiment of the present invention. As mentioned above,
In the state where a plurality of strip-shaped component members 15a are stacked, FIG.
As shown in (a), it is stored in the cavity 11 of the mold. At this time, it is desirable to attach a release film 10 to the inner wall of the cavity 11 of the upper mold 5 as a release material for protecting the semiconductor chip 1. A gap may be provided instead of the release film 10. Further, the strip-shaped component member 15a located at the bottom is in a state where the electrode terminal 4 is placed on the inner wall of the cavity 11 of the lower mold 6.

On the other hand, an O-ring 9 is provided on the mating surface of the mold so that the upper mold 5 and the lower mold 6 are airtightly closed. Further, an exhaust hole 12 is provided so that the air in the cavity 11 pushed out by the molten resin can be easily exhausted, and the exhaust hole 12 is connected to a vacuum pump through an opening / closing valve (not shown). Next, as shown in FIG. 2 (b), the upper mold 5 and the lower mold sandwich and hold the ends of the tape 2 of the band-shaped component to clamp the mold, and the plunger 7 rises and the tablet 8 It is heated and becomes molten resin 9a, which is injected into the cavity 11.

The molten resin that has entered the cavity 11 is
The semiconductor chip 1 of the belt-shaped component 15a is wrapped and filled in the peripheral gap. Gas is generated from the molten resin as the molten resin is filled. Then, a vacuum pump (not shown) attached to the mold is operated, and the gas filled in the cavity 11 is discharged to the outside of the mold through the exhaust hole 12. By this vacuum evacuation, the gas remaining in the details of the belt-shaped component 15a is discharged to the outside of the mold and does not remain as bubbles after the resin is cured. After a lapse of a predetermined time, the molten resin is crosslinked, and the molten resin is cured as the degree of crosslinking progresses.

FIGS. 3A to 3C are views for explaining the manufacturing process of the semiconductor device according to the first embodiment of the present invention. Laminated resin sealing member 13 taken out from the mold of FIG.
As shown in FIG. 3, is a laminated resin sealing member 13 which is an integrated resin body in which a plurality of strip-shaped component members 15a on which a plurality of semiconductor chips 1 are mounted are resin-sealed.

Next, the outer peripheral portion of the circular blade 14 is cut by a cutting device incorporated in the frame 16 to form the laminated resin sealing member 1.
Blade 1 with cutting blade inside to rotate 3 horizontally
Move 4 and disconnect. This cutting device is a blade 14
Is inside and the blade 16 is rotated by rotating the frame 16.
It is characterized by being able to cut straight without horizontal runout of No. 4.

First, for this cutting, the laminated resin sealing member 13 is put inside the blade 14 and fixed to the table of the cutting device. The table is moved so that the blade of the blade 14 cuts the blade edge into the resin portion on the flat side surface of the laminated resin sealing member 13, and as shown in FIG.
While rotating 4 in the horizontal direction from the bottom to the top of the paper, the back surface which is the inactive surface of the semiconductor chip 1 is scraped off. As a result, the lowermost single-layer resin sealing member 17 is separated from the laminated resin sealing member 13. In this way, the single-layer resin sealing member 1 is sequentially stacked from the laminated resin sealing member 13.
Cut into 7 and separate. Just the top semiconductor chip 1
In order to make the thickness of the semiconductor chip 1 thinner, it is desirable to cut the blade 14 by cutting it into a portion that is half or more of the thickness of the semiconductor chip 1.

Next, as shown in FIG. 3B, unnecessary members around the single-layer resin sealing member 17 are cut off and finished into a rectangular resin body, and each region including one semiconductor chip (shown by a dotted line). ) And is cut by a blade 18 to obtain the semiconductor device shown in FIG. The blade 18 may be a blade of an ordinary dicing device. Further, it is possible to use a water jet cutting device that sprays and cuts high-pressure water mixed with an abrasive along a cutting line.

FIG. 4 is a view showing a modified example of the resin sealing mold shown in FIG. In this mold, as shown in FIG. 4, a tape 2 extending outside the band-shaped component 15a has a cavity 1 of the mold.
A frame member 19 having a hollow shape is provided in order to keep the space between the tapes 2 short by cutting the tapes so that the tapes can fit inside 1. Before being put in the mold, a frame member 19 is inserted between the tapes and the tape 2 and the frame member are temporarily adhered to each other to form an assembly in which a plurality of strip-shaped constituent members 15a are stacked. Easy to incorporate.
Further, the inner hole of the frame member 19 is made as large as the strength allows so that the molten resin can easily flow. In this way, the frame member 19
By providing the above, there is an advantage that if the resin is sealed along the inner side of the frame member 19, the finish after the resin sealing becomes simple.

FIGS. 5A and 5B are views for explaining a stack type semiconductor device obtained from a laminated resin sealing member formed by resin sealing in the second embodiment of the present invention. Is. First, the strip-shaped component 15 of FIG.
a. Electrical connection terminals 2 extending downward from the wiring pads of the tape 2 around each semiconductor chip 1 of a.
Join 0. Next, when these strip-shaped components 15a are stacked, the electrical connection terminal 2 extending downward from the tape 2 is formed.
The other end of 0 is connected to the wiring pad of the lower tape 2.

Next, a plurality of stacked belt-shaped components are resin-sealed using the mold of FIG. 2 to obtain a laminated resin sealing member 13 shown in FIG. 5 (a). Then, for each region where a plurality of semiconductor chips 1 are arranged in the vertical direction (shown by a dotted line)
The blade 18 is cut, and the blade 18 is rotated and moved downward to cut and separate the stack type semiconductor device shown in FIG. 5B.

FIGS. 6A to 6E are views for explaining a stack type semiconductor device obtained from a laminated resin sealing member formed by resin sealing in the third embodiment of the present invention. Is. In the stack type semiconductor device shown in FIG. 5, the thickness of the semiconductor chip 1 is not so thin because it has the thickness when it is resin-sealed.

Therefore, the strip-shaped component 15a shown in FIG.
The short electrical connection terminals 21 are attached to the wiring pads on the front and back of the tape 2 around the semiconductor chip 1. After that,
A stack of a plurality of strip-shaped constituent members 15a to which the electric connection terminals 21 are attached is prepared and housed in the cavity 11 of the mold shown in FIG. At this time, the frame member 19 was attached so that the intervals between the strip-shaped constituent members 15a were constant.

Next, the molten resin is injected into the mold and vacuum evacuation is performed to obtain the laminated resin sealing member 13a shown in FIG. 6 (a). Next, as described with reference to FIG. 3A, blades are cut between the electric connection terminals 21 above and below the tape 2 which is resin-sealed in the laminated resin sealing member 13a to cool the water. Supply and move while rotating the blade horizontally. As a result, the single-layer resin member 17a whose back surface is scraped off and which is thin is obtained. The resin layer 22 at the bottom of FIG. 6A is first shaved off with a blade. Finally, the uppermost resin layer and the back surface of the semiconductor chip 1 are scraped off.

Next, as shown in FIG. 6C, the blade 18 is cut at the boundary of the single-layer resin sealing member 17a, and the region containing one semiconductor chip 1 is separated and divided. Figure 6
As shown in (d), a thinner semiconductor device is obtained.
Then, as shown in FIG. 6 (e), the semiconductor devices of FIG. 6 (d) are stacked in multiple stages, the electric connection terminals 21 are solder-connected, and the other resin surface is attached with an adhesive to form a stack type semiconductor. Get the device.

The strip-shaped component has been described above by using the strip-shaped component 15a shown in FIG. 1 (a).
The band-shaped component 15b having the solder ball 3 as shown in FIG.

[0033]

As described above, according to the present invention, there is provided a strip-shaped member constituted by a tape having a plurality of semiconductor chips mounted vertically and horizontally on the front surface and having a plurality of electrode terminals protruding from the back surface. Stacking multiple sheets vertically in multiple stages and sealing them with resin, and separating the resin-sealed block-shaped laminated resin sealing members into individual resin-sealed strip-shaped components It is possible to thin the semiconductor chip in a short time without polishing to generate residual stress by cutting and cutting the blade so as to scrape the inactive surface of the plurality of semiconductor chips sealed with the resin. This is possible and has the effect of improving the quality.

Further, a resin sealing member having a plurality of semiconductor chips which are resin-sealed on one plane which is cut and separated,
Since a plurality of semiconductor devices can be obtained by cutting and separating for each region including one semiconductor chip, a large number of semiconductor devices can be obtained by one resin encapsulation and the productivity is improved.

Furthermore, by stacking and assembling thin semiconductor devices in multiple stages, a high-density and small-sized stack type semiconductor device can be obtained, and the total cost can be reduced.

[Brief description of drawings]

FIG. 1 is a cross-sectional view for explaining a belt-shaped component member before resin sealing according to an embodiment of the present invention.

FIG. 2 is a diagram for explaining a step of resin-sealing the stacked band-shaped component members according to the first embodiment of the present invention.

FIG. 3 is a diagram illustrating a manufacturing process of the semiconductor device according to the first embodiment of the invention.

FIG. 4 is a diagram showing a modified example of the resin sealing mold of FIG.

FIG. 5 is a diagram for explaining a stack type semiconductor device obtained from a laminated resin sealing member formed by resin sealing according to a second embodiment of the present invention.

FIG. 6 is a diagram for explaining a stack type semiconductor device obtained from a laminated resin sealing member formed by resin sealing according to a third embodiment of the present invention.

[Explanation of symbols]

1 semiconductor chip 2 tapes 3 solder balls 4 electrode terminals 5 Upper mold 6 Lower mold 7 Plunger 8 tablets 9 O-ring 10 Release film 11 cavities 12 exhaust holes 13,13a Laminated resin sealing member 15a, 15b band-shaped components 17 Single layer resin sealing member 18 blades 19 Frame member

Claims (7)

[Claims] 1. A plurality of semiconductor chips mounted vertically and horizontally on a tape, connected to wirings of the tape and electrode pads corresponding to the wirings, and a plurality of electrodes protruding to the back surface of the tape. A plurality of strip-shaped constituent members having terminals are prepared, and a laminated resin sealing member formed by vertically stacking the strip-shaped constituent members to obtain a laminated resin sealing member, which are adjacent to each other with respect to the side surface of the laminated resin sealing member. The resin member interposed between the tapes is cut by a blade that rotates, and the blade is moved horizontally so as to scrape off the inactive surface of the semiconductor chip on one plane,
The laminated resin encapsulation member is separated into a single-layer resin encapsulation member including a plurality of thinly cut semiconductor chips arranged in one plane, and then the single-layer resin encapsulation members are adjacent to each other in the semiconductor. A semiconductor device, characterized in that a boundary between chips is cut and separated by a cutting means and separated into a resin sealing member including each one of the semiconductor chips. 2. A plurality of semiconductor chips are vertically and horizontally mounted on a tape and are connected to wirings of the tape and electrode pads corresponding to the wirings, and a plurality of electrode terminals projecting from the back surface of the tape. And a plurality of other strip-shaped components having electrical connection terminals projecting from the wiring on the back surface of the tape around the semiconductor chip are prepared, and the other strip-shaped components are stacked vertically and Another laminated resin sealing member is obtained by joining the electric connection terminal to the wiring of the other tape located below and resin-sealing the same, and is perpendicular to the other laminated resin sealing member. Another blade is cut, the electric connection terminals are provided between the tapes, and the semiconductor chips are arranged in a vertical direction and cut into individual resin-sealed members which are resin-sealed. Stack type semiconductor device. 3. A plurality of semiconductor chips mounted vertically and horizontally on a tape, connected to wirings of the tape and electrode pads corresponding to the wirings, and a plurality of electrode terminals protruding to the back surface of the tape. And a plurality of other strip-shaped components having electrical connection terminals protruding from the back and front wirings of the tape around the semiconductor chip are prepared, and the other strip-shaped components are stacked vertically. To obtain another laminated resin sealing member formed by resin sealing between the electric connection terminals interposed between the tapes adjacent to each other on the side surface of the other laminated resin sealing member. The blade was moved in the horizontal direction so as to make a cut by the rotating blade and scrape off the inactive surface of the semiconductor chip on one plane, and the laminated resin sealing member was arranged on one plane. Multiple thin cuts Separated into another single-layer resin sealing member including the semiconductor chip, the plurality of semiconductor devices formed by dividing the single-layer resin sealing member into each region including one semiconductor chip are stacked vertically. A stack type semiconductor device characterized by being assembled. 4. The semiconductor device according to claim 1, wherein the electrode terminal is a solder ball. 5. The strip-shaped component according to claim 1, or claim 2 or claim 3 in a cavity between the upper mold and the lower mold.
A plurality of other strip-shaped components described above are stacked and housed vertically, and the cavity is evacuated while the molten resin is pumped into the cavity, and the strip-shaped component is sealed with resin. The method for manufacturing a semiconductor device according to claim 1, claim 2, or claim 3. 6. A method of manufacturing a semiconductor device according to claim 5, wherein a release film is inserted between the strip-shaped component member or the other strip-shaped component member and the inner wall of the upper die. 7. A frame member for maintaining an interval between the tapes extending outward from the strip-shaped component member or the other strip-shaped component member housed in the cavity is inserted. 5. The method for manufacturing a semiconductor device according to claim 5 or claim 6.