JP2003272252A - Manufacturing method of stamper - Google Patents
Manufacturing method of stamperInfo
- Publication number
- JP2003272252A JP2003272252A JP2002076160A JP2002076160A JP2003272252A JP 2003272252 A JP2003272252 A JP 2003272252A JP 2002076160 A JP2002076160 A JP 2002076160A JP 2002076160 A JP2002076160 A JP 2002076160A JP 2003272252 A JP2003272252 A JP 2003272252A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- stamper
- base
- nickel
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 75
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 31
- 239000000853 adhesive Substances 0.000 claims abstract description 15
- 230000001070 adhesive effect Effects 0.000 claims abstract description 15
- 230000005291 magnetic effect Effects 0.000 claims abstract description 5
- 238000000576 coating method Methods 0.000 abstract description 4
- 239000011248 coating agent Substances 0.000 abstract description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 72
- 229910052759 nickel Inorganic materials 0.000 description 36
- 238000000034 method Methods 0.000 description 9
- 238000005520 cutting process Methods 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 238000005323 electroforming Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000003302 ferromagnetic material Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
Landscapes
- Manufacturing Optical Record Carriers (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はスタンパの製造方法
に係り、特に光情報記録媒体の製造に適したスタンパの
製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a stamper manufacturing method, and more particularly to a stamper manufacturing method suitable for manufacturing an optical information recording medium.
【０００２】[0002]
【従来の技術】光ディスクの製造に際しては、まず、ガ
ラス基板（原盤）上にフォトレジストを塗布しそれを露
光、現像する。次いで、露光、現像した後の前記ガラス
基板表面にニッケルをスパッタして導電処理を行い、次
いで前記スパッタしたニッケルを一方の電極として電鋳
を行ってスタンパを完成する。次いでこのスタンパを用
いて樹脂を射出成形することにより光ディスクを作製す
る。この方法では、スタンパの製造にニッケルの電鋳プ
ロセス用いるため製作に時間がかかる（例えば、直径２
０ｃｍのガラス基板に０．３ｍｍ厚のニッケル電鋳する
のに約４〜６時間かかる）。2. Description of the Related Art In manufacturing an optical disk, first, a photoresist is coated on a glass substrate (master), and the photoresist is exposed and developed. Next, nickel is sputtered on the surface of the glass substrate after exposure and development for conducting treatment, and then electroforming is performed using the sputtered nickel as one electrode to complete a stamper. Then, a resin is injection-molded using this stamper to manufacture an optical disk. In this method, since the nickel electroforming process is used to manufacture the stamper, it takes time to manufacture (for example, a diameter of 2 mm).
It takes about 4 to 6 hours to electroform 0.3 mm thick nickel on a 0 cm glass substrate).
【０００３】特開昭５９−２２４３２０号公報には、シ
リコン基板上に形成したフォトレジスト膜に対して記録
すべき情報に基づいて光変調したレーザ光ビームを照射
（これをカッテングプロセスという）して前記フォトレ
ジストを現像し、更に該フォトレジストを用いたエッチ
ングプロセスにより前記シリコン基板上に凹凸パターン
を形成し、この凹凸パターンを形成したシリコン基板を
スタンパとする方法が示されている。この方法は前記電
鋳に伴う問題は回避することができる。しかし、基板と
してシリコンを利用する方法は成形時の条件出しが困難
であり、また、シリコン基板は割れやすいため実用的で
はない。In Japanese Patent Laid-Open No. 59-224320, a photoresist film formed on a silicon substrate is irradiated with a laser light beam which is optically modulated based on information to be recorded (this is called a cutting process). A method of developing the photoresist, forming an uneven pattern on the silicon substrate by an etching process using the photoresist, and using the silicon substrate having the uneven pattern as a stamper is disclosed. This method avoids the problems associated with electroforming. However, the method of using silicon as the substrate is not practical because it is difficult to determine conditions during molding and the silicon substrate is easily cracked.
【０００４】一方、前記基板としてニッケル基板を使用
する場合には、ニッケル板をスタンパの厚みである０．
３ｍｍ厚に加工してニッケル基板とする。この場合、ニ
ッケル基板には通常反りが発生し、この反りによりフォ
トレジスト塗布時にその膜厚にばらつきが発生する。フ
ォトレジストの膜厚にばらつきがあると、カッティング
時にレーザのフォーカス外れ、あるいはカッティングむ
らが発生することになる。このため、加工に際して基板
を平坦な状態に保持固定することが必要となる。On the other hand, when a nickel substrate is used as the substrate, a nickel plate having a thickness of 0.
The nickel substrate is processed into a thickness of 3 mm. In this case, the nickel substrate usually warps, and this warping causes variations in the film thickness when the photoresist is applied. If the photoresist film thickness varies, the laser defocuses or uneven cutting occurs during cutting. Therefore, it is necessary to hold and fix the substrate in a flat state during processing.
【０００５】図３は、基板を保持固定する固定治具の従
来例を示す図である。基板にフォトレジスト塗布すると
きあるいは前記フォトレジストを露光するときに前記基
板を固定治具１０１に固定する。この固定治具１０１の
表面は平滑に研磨されており、また、その表面には吸着
溝１０２を形成し、該吸着溝１０２の中には複数個の吸
着孔１０３を設ける。FIG. 3 is a view showing a conventional example of a fixing jig for holding and fixing a substrate. The substrate is fixed to the fixing jig 101 when applying the photoresist to the substrate or exposing the photoresist. The surface of the fixing jig 101 is polished smoothly, and a suction groove 102 is formed on the surface thereof, and a plurality of suction holes 103 are provided in the suction groove 102.
【０００６】この固定治具１０１は、その上面に載置し
た基板を前記吸着孔を介して真空吸着することにより保
持固定することができる。この状態で基板に対するフォ
トレジスト塗布工程、あるいはカッティング工程を施す
ことができる。しかしながら、前記ニッケル基板を固定
治具１０１により吸着すると、基板は前述のように０．
３ｍｍ程度と薄いため、基板表面に吸着溝の凹部が現れ
ることがある（ニッケル基板の表面の吸着溝１０２に対
応する部分に凹みが現れる）。この状態でフォトレジス
トを塗布するとその凹部でレジスト膜厚が厚くなり、処
理不良が発生する。また、基板１０１の反りが大きいも
のは固定治具１０１に真空吸着することができずに不良
品となることがある。The fixing jig 101 can hold and fix the substrate placed on its upper surface by vacuum suction through the suction holes. In this state, a photoresist coating process or a cutting process can be performed on the substrate. However, when the nickel substrate is adsorbed by the fixing jig 101, the substrate becomes 0.
Since it is as thin as about 3 mm, a concave portion of the adsorption groove may appear on the surface of the substrate (a concave portion appears on a portion of the nickel substrate surface corresponding to the adsorption groove 102). If the photoresist is applied in this state, the resist film becomes thicker in the concave portion, resulting in defective processing. In addition, if the substrate 101 has a large warp, it may not be vacuum-adsorbed to the fixing jig 101 and may become a defective product.
【０００７】図４は、反りを矯正する他の方法を説明す
る図である。図に示すように、ニッケル基板２０２を接
着剤２０３を介して基板２０４に接着固定し、次いで前
記ニッケル基板２０２の表面に平滑な面を有する治具２
０１を押し付けて反りを矯正する（図４ａ）。次いでこ
の状態をしばらく保持して接着剤を硬化さる（図４
ｂ）。これにより、フォトレジスト塗布あるいはカッテ
ィング等の工程を、反りが矯正された基板２０５に対し
て施すことができる。FIG. 4 is a diagram for explaining another method of correcting the warp. As shown in the figure, a nickel substrate 202 is bonded and fixed to a substrate 204 with an adhesive 203, and then the jig 2 having a smooth surface on the surface of the nickel substrate 202.
Press 01 to correct the warp (Fig. 4a). Then, this state is maintained for a while to cure the adhesive (see FIG. 4).
b). Thus, a process such as photoresist coating or cutting can be performed on the substrate 205 whose warpage has been corrected.
【０００８】[0008]
【発明が解決しようとする課題】前述のニッケル基板２
０２の表面に平滑な面を有する治具２０１で押し付けて
反りを矯正する方法は、ニッケル基板にダメージを与え
ることがある。すなわち、反りにより膨出した部分に治
具２０１が押し付けられる際、治具２０１の表面とニッ
ケル基板２０２表面が擦れるため、図４（ｃ）に示すよ
うにキズ２０５が発生する。このようなキズが発生する
と、その部分に形成するピットは欠陥ピットとなる。The above-mentioned nickel substrate 2
The method of pressing the jig No. 02 with a jig 201 having a smooth surface to correct the warp may damage the nickel substrate. That is, when the jig 201 is pressed against the portion that is swollen by the warp, the surface of the jig 201 and the surface of the nickel substrate 202 rub against each other, so that a flaw 205 is generated as shown in FIG. 4C. When such a scratch occurs, the pit formed in that portion becomes a defective pit.
【０００９】本発明は、これらの問題点に鑑みてなされ
たもので、基板表面に触れることなく基板の反りを矯正
することのできるスタンパの製造方法を提供する。The present invention has been made in view of these problems, and provides a method of manufacturing a stamper capable of correcting the warp of a substrate without touching the surface of the substrate.
【００１０】[0010]
【課題を解決するための手段】本発明は、上記の課題を
解決するために次のような手段を採用した。The present invention adopts the following means in order to solve the above problems.
【００１１】基板にフォトレジストを塗布し、塗布した
フォトレジストを露光、現像した後、前記基板をエッチ
ングしてスタンパを製造するスタンパの製造方法におい
て、前記フォトレジスト塗布前の工程として、表面が平
坦な基台上に接着剤を塗布する工程と、前記接着剤を塗
布した基台上に前記基板を載置する工程と、前記基台及
び基板に磁界を印加して前記基板を基台側に吸引する工
程を備えた。In a stamper manufacturing method in which a photoresist is applied to a substrate, the applied photoresist is exposed and developed, and then the substrate is etched to produce a stamper, the surface is flat before the photoresist is applied. A step of applying an adhesive on the base, a step of placing the substrate on the base coated with the adhesive, and applying a magnetic field to the base and the substrate to bring the substrate to the base side. A suction step was provided.
【００１２】[0012]
【発明の実施の形態】以下、本発明の実施例を図面を参
照しながら説明する。図１は、本発明の実施形態に係る
スタンパの製造方法を説明する図である。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram illustrating a stamper manufacturing method according to an embodiment of the present invention.
【００１３】まず、平坦度１０μｍ以下、表面粗さＲｍ
ａｘ０．０５μｍ以下、板厚５ｍｍ、直径２００ｍｍ
の、表面が平滑な基台３０３上に接着剤（例えば、酢酸
水溶液に浸漬しすることにより接着力が低下するエポキ
シ樹脂等の接着剤）３０２をロールコーティングし、そ
の上に平坦度２００μｍ、表面粗さＲｍａｘ０．０２μ
ｍ以下、板厚０．３ｍｍ、直径２００ｍｍのニッケル基
板３０１を載置した。次いで前記基台３０３の裏面から
直径２００ｍｍ、高さ１００ｍｍの円筒状電磁石３０４
あてがい、該電磁石３０４を励磁して磁束密度を５００
０ガウスに維持した。これによりニッケル基板３０１を
基台３０３側に吸着してニッケル基板３０１の反りは矯
正された（図１ａ）。この状態を略２時間保ち、接着剤
３０２を硬化させた（図１ｂ）。次いで前記電磁石の励
磁を解除し、基台３０３に接着して反りが矯正されたニ
ッケル基板３０１を前記電磁石３０４から取り外した
（図１ｃ）。このときニッケル基板３０１の表面の平坦
度は３０μｍ以下になっていた。なお、本実施形態では
基板材料としてニッケルを用いたが、他の強磁性体を用
いることができる。また、前記基板３０３は強磁性体を
用いるのが好ましい。First, the flatness is 10 μm or less and the surface roughness Rm.
ax 0.05 μm or less, plate thickness 5 mm, diameter 200 mm
, A base 303 having a smooth surface is roll-coated with an adhesive (for example, an adhesive such as an epoxy resin whose adhesive strength is reduced by being immersed in an acetic acid aqueous solution) 302, and a flatness of 200 μm and a surface Roughness Rmax 0.02μ
A nickel substrate 301 having a thickness of 0.3 m or less, a plate thickness of 0.3 mm, and a diameter of 200 mm was placed. Next, from the back surface of the base 303, a cylindrical electromagnet 304 having a diameter of 200 mm and a height of 100 mm
The magnetic flux density is set to 500 by exciting the electromagnet 304.
It was maintained at 0 gauss. As a result, the nickel substrate 301 was adsorbed to the base 303 side and the warpage of the nickel substrate 301 was corrected (FIG. 1a). This state was maintained for about 2 hours to cure the adhesive 302 (FIG. 1b). Then, the excitation of the electromagnet was released, and the nickel substrate 301 which was adhered to the base 303 and whose warp was corrected was removed from the electromagnet 304 (FIG. 1c). At this time, the flatness of the surface of the nickel substrate 301 was 30 μm or less. Although nickel is used as the substrate material in this embodiment, other ferromagnetic materials can be used. Further, it is preferable that the substrate 303 is made of a ferromagnetic material.
【００１４】図２は、反りを矯正したニッケル基板３０
１を用いてスタンパを製造する方法を説明する図であ
る。FIG. 2 shows a nickel substrate 30 whose warpage is corrected.
It is a figure explaining the method of manufacturing a stamper using 1.
【００１５】まず、基台３０３上に接着された前記ニッ
ケル基板３０１上にネガ型フォトレジスト溶液をスピン
コートし、次いで８０℃で一時間ベイクして、膜厚２０
０ｎｍのネガ型フォトレジスト膜３０４を成膜した（図
２ａ）。前記成膜したフォトレジストには厚みむらはな
く均一な厚さに成膜されていた。次に、Ａｒイオンレー
ザを備えたカッティング装置に前記基台３０３に接着し
たニッケル基板３０１を取り付け、記録情報に応じて変
調したレ−ザ光をネガ型フォトレジスト膜３０４に照射
し、該ネガ型フォトレジスト膜３０４にトラックピッチ
１．６μｍのＣＤ（コンパクトディスク）デジタル信号
記録情報の潜像（露光部分）３０５を形成した。このと
き、ニッケル基板３０１の表面に凹凸がある場合は、フ
ォーカスが外れカッティングエラーになったりピット形
状にむらができたりするが、本実施例ではそれらは発生
しなかった（図２ｂ）。次に、前記基台３０３に接着し
たニッケル基板３０１を１１０℃に加熱したオーブンに
入れ、略５分間リバーサルベイクを行った。このとき、
前記レーザを照射して露光した部分のネガ型フォトレジ
スト膜には酸触媒が発生し、リバーサルベイクの熱によ
りレジス卜組成物であるノボラック樹脂が酸硬化し、現
像液に対する溶解性は著しく低下する。次いで、ネガ型
フォトレジスト膜３０４を紫外線により全面露光し、前
記レーザによる未露光部を現像液に対して溶解性を有す
るようにした。次いで現像液（現像液濃度を０．５％）
を用いて略１分間現像処理を行ない、前記酸硬化した部
分以外のネガ型フォトレジスト膜を除去し凹凸パターン
を形成した（図４ｃ）。次いで、前記基台３０３に接着
したニッケル基板３０１を１００℃で３０分間ポストベ
ークを行い、更にＡｒイオンを用いたイオンミリングに
より、ニッケル基板３０１のネガ型フォトレジスト膜３
０４から露出している部分をエッチングした。エッチン
グ条件は、Ａｒ圧力略３×１０−２Ｐａ、加速電圧略６
００Ｖであった。このときのニッケル基板３０１のエッ
チング速度は略０．０５μｍ／分であり、ニッケル基板
３０１を０．１２μｍの深さに削るためには２分２４秒
を要した。次いで、エッチングに用いた前記ネガ型フォ
トレジスト膜を酸素アッシングにより除去し、ピット高
さ０．１２μｍの凹凸パターンを形成したニッケル基板
３０１を得た（図４ｄ）。First, a negative photoresist solution was spin-coated on the nickel substrate 301 adhered on the base 303 and then baked at 80 ° C. for 1 hour to obtain a film thickness of 20.
A 0 nm negative photoresist film 304 was formed (FIG. 2a). The photoresist thus formed had a uniform thickness without uneven thickness. Next, the nickel substrate 301 adhered to the base 303 is attached to a cutting device equipped with an Ar ion laser, and laser light modulated according to recorded information is irradiated on the negative photoresist film 304, and the negative photoresist film 304 is irradiated. A latent image (exposed portion) 305 of CD (compact disc) digital signal recorded information having a track pitch of 1.6 μm was formed on the photoresist film 304. At this time, if the surface of the nickel substrate 301 is uneven, the focus may be lost and a cutting error may occur or the pit shape may be uneven, but they did not occur in this embodiment (FIG. 2B). Next, the nickel substrate 301 adhered to the base 303 was placed in an oven heated to 110 ° C. and reversal baked for about 5 minutes. At this time,
An acid catalyst is generated in the negative photoresist film in the exposed portion by irradiating the laser, and the novolak resin, which is a resist composition, is acid-cured by the heat of reversal baking, and the solubility in a developer is significantly reduced. . Next, the negative photoresist film 304 was entirely exposed to ultraviolet rays so that the unexposed portion by the laser had solubility in a developing solution. Then developer (concentration of developer is 0.5%)
Was used for development for about 1 minute to remove the negative photoresist film other than the acid-cured portion to form an uneven pattern (FIG. 4c). Then, the nickel substrate 301 adhered to the base 303 is post-baked at 100 ° C. for 30 minutes, and ion milling using Ar ions is performed to perform the negative photoresist film 3 on the nickel substrate 301.
The part exposed from 04 was etched. The etching conditions are Ar pressure of about 3 × 10 −2 Pa and acceleration voltage of about 6.
It was 00V. The etching rate of the nickel substrate 301 at this time was about 0.05 μm / min, and it took 2 minutes and 24 seconds to grind the nickel substrate 301 to a depth of 0.12 μm. Then, the negative photoresist film used for etching was removed by oxygen ashing to obtain a nickel substrate 301 having a concavo-convex pattern with a pit height of 0.12 μm (FIG. 4d).
【００１６】次いで、前記基台３０３を接着したニッケ
ル基板３０１を２０％酢酸水溶液に２時間浸漬し、接着
剤３０２を膨潤させて基台３０３からニッケル基板３０
１を剥離した（図４ｅ）。このようにして作製したニッ
ケル基板３０１（スタンパ）を射出成形機に取り付けて
射出成形を行い、ＣＤ用のディスク３０６を成形した
（図４ｆ）。次いで該ディスク３０６にアルミニウムを
７０ｎｍ厚にスパッタして反射膜３０７を成膜し、更に
その上に紫外線硬化樹脂を塗布し、次いで該紫外線硬化
樹脂に紫外線を照射して保護膜３０８成膜してＣＤ用の
ディスクを得た。このディスクは外観的にも電気的にも
良好なものであった（図４ｇ）。Next, the nickel substrate 301 to which the base 303 is adhered is immersed in a 20% acetic acid aqueous solution for 2 hours to swell the adhesive 302, and the nickel substrate 30 is removed from the base 303.
1 was peeled off (FIG. 4e). The nickel substrate 301 (stamper) thus manufactured was mounted on an injection molding machine and injection molding was performed to mold a disk 306 for CD (FIG. 4f). Next, aluminum is sputtered on the disk 306 to a thickness of 70 nm to form a reflection film 307, and an ultraviolet curable resin is further applied thereon, and then the ultraviolet curable resin is irradiated with ultraviolet rays to form a protective film 308. A disc for a CD was obtained. This disk was good both in appearance and electrically (Fig. 4g).
【００１７】[0017]
【発明の効果】以上説明したように本発明によれば、基
板表面に触れることなく基板の反りを矯正することので
きるスタンパの製造方法を提供することができる。As described above, according to the present invention, it is possible to provide a method of manufacturing a stamper that can correct the warp of the substrate without touching the surface of the substrate.
【図１】本発明の実施形態に係るスタンパの製造方法を
説明する図である。FIG. 1 is a diagram illustrating a stamper manufacturing method according to an embodiment of the present invention.
【図２】反りを矯正したニッケル基板を用いてスタンパ
を製造する方法を説明する図である。FIG. 2 is a diagram illustrating a method of manufacturing a stamper using a nickel substrate whose warpage is corrected.
【図３】基板を固定する固定治具の従来例を示す図であ
る。FIG. 3 is a diagram showing a conventional example of a fixing jig for fixing a substrate.
【図４】反りを矯正する従来の方法を説明する図であ
る。FIG. 4 is a diagram illustrating a conventional method for correcting a warp.
３０１ ニッケル基板 ３０２ 接着剤 ３０３ 基台 ３０４ 電磁石 301 Nickel substrate 302 Adhesive 303 base 304 electromagnet
Claims (2)
たフォトレジストを露光、現像した後、前記基板をエッ
チングしてスタンパを製造するスタンパの製造方法にお
いて、 前記フォトレジスト塗布前の工程として、 表面が平坦な基台上に接着剤を塗布する工程と、 前記接着剤を塗布した基台上に前記基板を載置する工程
と、 前記基台及び基板に磁界を印加して前記基板を基台側に
吸引する工程を備えたことを特徴とするスタンパの製造
方法。1. A method of manufacturing a stamper, wherein a photoresist is applied to a substrate, the applied photoresist is exposed and developed, and then the substrate is etched to produce a stamper. A step of applying an adhesive on a flat base, a step of placing the substrate on the base on which the adhesive is applied, and applying a magnetic field to the base and the substrate to attach the substrate to the base. A method of manufacturing a stamper, comprising a step of suctioning to a side.
に除去することを特徴とするスタンパの製造方法。2. The stamper manufacturing method according to claim 1, wherein the magnetic field applied to the base and the substrate is removed after the adhesive is cured.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002076160A JP2003272252A (en) | 2002-03-19 | 2002-03-19 | Manufacturing method of stamper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002076160A JP2003272252A (en) | 2002-03-19 | 2002-03-19 | Manufacturing method of stamper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003272252A true JP2003272252A (en) | 2003-09-26 |
Family
ID=29205023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002076160A Pending JP2003272252A (en) | 2002-03-19 | 2002-03-19 | Manufacturing method of stamper |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003272252A (en) |
-
2002
- 2002-03-19 JP JP2002076160A patent/JP2003272252A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100248442B1 (en) | Process for producing optical disks | |
| US4619804A (en) | Fabricating optical record media | |
| JPS6126952A (en) | Production of information carrier | |
| TW410336B (en) | Optical disk and its production methods | |
| JPH1158401A (en) | Manufacture of mold for producing resin plate and production of resin plate | |
| JP2004013973A (en) | Manufacturing method of photoresist master disk, manufacturing method of stamper for producing optical recording medium, stamper, photoresist master disk, stamper intermediate body and optical recording medium | |
| JPS6295749A (en) | Manufacture of stamper for optical memory | |
| JP2003272252A (en) | Manufacturing method of stamper | |
| JP4366193B2 (en) | Stamper master manufacturing method and stamper manufacturing method | |
| JP2001338445A (en) | Methods for manufacturing stamper and optical recording medium, and supporting plate | |
| JPWO2003088235A6 (en) | Stamper master and manufacturing method thereof, stamper and manufacturing method thereof, and optical disc | |
| JPH11102541A (en) | Production method of matrix of optical disk | |
| JP2001325753A (en) | Method for manufacturing stamper and method for manufacturing optical recording medium | |
| JPH01264644A (en) | Production of optical disk substrate | |
| JPH04259937A (en) | Production of stamper for producing information recording medium | |
| JP4139129B2 (en) | Method for manufacturing polarization separating element, bonding apparatus, and optical pickup apparatus | |
| JPS61163342A (en) | Method for removing photoresist | |
| JP2003272254A (en) | Method of manufacturing stamper | |
| JP2001220692A (en) | Method for manufacturing stamper and method for manufacturing optical recording medium | |
| JPS61113142A (en) | Producing method of stamper for optical disk | |
| JPH09262733A (en) | Holding device for stamper | |
| JP2001307386A (en) | Method for manufacturing stamper and optical recording medium | |
| JPH10312584A (en) | Production of stamper for disc | |
| JPH06231492A (en) | Production of stamper for optical disk | |
| US20060147843A1 (en) | Fabrication process for ultra high density optical disc |