JP2003272119A - Wiring member, suspension, and head gimbal assembly - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring member, a suspension and a head gimbal assembly (HGA) capable of employing a high frequency for a read frequency and not deteriorating a write characteristic. <P>SOLUTION: The wiring member is provided with: at least a couple of write side trace conductor layers one-side ends of which electrically connected to a write head element of a thin film magnetic head when mounted; a couple of read side trace conductor layers one-side ends of which electrically connected to a read head element of the thin film magnetic head when mounted; and a resin layer on the upper surface of which a couple of the write side trace conductors and a couple of the read side trace conductors are formed and the lower surface of which is in contact with a ground conductor face when mounted, and a gap SR between a couple of the read side trace conductors is at least partly greater than a gap SW of a couple of the write side trace conductors. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring member electrically connected to a write head element and a read head element of a thin film magnetic head used in, for example, a magnetic disk device (HDD), and a suspension provided with the wiring member. And a head gimbal assembly (HGA) including a thin film magnetic head and a suspension.

[0002]

2. Description of the Related Art In an HDD, a magnetic head slider attached to the tip of an HGA suspension is levitated from the surface of a rotating magnetic disk, and in that state, a write magnetic head element mounted on this magnetic head slider is used. Recording is performed on the magnetic disk, and reproduction is also performed from the magnetic disk by the read magnetic head element that is also mounted.

One end of the signal line is electrically connected to the terminal electrodes for the write magnetic head element and the read magnetic head element provided on the magnetic head slider, respectively.
The other ends of these signal lines pass through the suspension and are electrically connected to external connection terminals provided at the rear end or outside thereof.

In recent years, a structure in which a lead wire is not used as a signal line to such a magnetic head slider, that is, a wiring member, has become widespread. This is a structure using a wireless suspension and a flexible printed circuit (FPC).

The wireless suspension is constructed by directly forming a pattern in which a resin layer, a trace conductor layer and a resin layer are sequentially laminated on the suspension as a wiring member, or by forming a resin layer on a stainless thin plate separate from the suspension. , A trace conductor layer and a resin layer are sequentially laminated, and this is laser-welded on the suspension.

In a structure using an FPC as a wiring member, a trace conductor layer is formed on a resin layer, a resin coating layer is formed on the trace conductor layer to form an FPC, and the FPC is bonded onto an ordinary suspension. Used.

In the structure using such a wireless suspension and FPC, a pair of trace conductor layers connected to the two terminal electrodes of the write magnetic head element and one terminal connected to the two terminal electrodes of the read magnetic head element.
The conventional conductor patterns forming the pair of trace conductor layers are formed as a pair of parallel line patterns that are adjacent to each other at the same interval and have the same line width on both the writing side and the reading side. In particular, in the structure using the FPC, in order not to have high mechanical rigidity, the line width has been made thinner and the spacing has been made narrower on both the writing side and the reading side.

[0008]

With the recent increase in the capacity and recording density of HDDs, the frequency of recording signals is increasing, and the capacitance (capacitance) component and the induction (inductance) component of the wiring member. Can no longer be ignored.

When the tunnel head giant magnetoresistive effect (TGMR) element or the like is used for the read head element in the future with further increase in capacity, the element resistance will increase further due to its structure. Therefore, the read frequency will be increased. In order to achieve this, it is an important issue to further reduce the capacitance component of the wiring member. However, reducing the capacitance component of the wiring member leads to an increase in the inductive component, which delays the rise time of the current and causes deterioration of the write characteristic.

Therefore, the present invention is intended to solve this problem of the prior art, and an object of the present invention is to provide a wiring member and a suspension that can increase the read frequency and do not deteriorate the write characteristics. And HGA.

[0011]

According to the present invention, a pair of write side trace conductor layers, one end of which is electrically connected to a write head element of a thin film magnetic head when mounted,
A pair of read side trace conductor layers, one end of which is electrically connected to the read head element of the thin film magnetic head when mounted, a pair of write side trace conductor layers and a pair of read side trace conductor layers. A wiring member, which is laminated on the upper surface and has at least a resin layer whose lower surface is brought into contact with the ground conductor surface when mounted, that is, at least in part, that is, the write side trace conductor layer. And a wiring member in which the gap S _R between the pair of read side trace conductor layers is larger than the gap S _W between the pair of write side trace conductor layers in the main part of the read side trace conductor layer.

According to the present invention, there is further provided a suspension including a metal supporting member and a wiring member laminated on the metal supporting member, wherein the wiring member is mounted on the thin film magnetic head when the wiring member is mounted. A pair of write side trace conductor layers whose one end is electrically connected to the write head element, and a pair of read side traces whose one end is electrically connected to the read head element of the thin film magnetic head when mounted. A conductor layer,
A pair of write side trace conductor layers and a pair of read side trace conductor layers are laminated on the upper surface, and the lower surface has at least a resin layer in contact with the metal supporting member, and at least In a part, that is, in the main part of the write-side trace conductor layer and the read-side trace conductor layer, the gap S _R between the pair of read-side trace conductor layers is 1
Gap S _W greater than the suspension of pairs of write side trace conductor layers are provided.

Further, according to the present invention, a metal supporting member, a magnetic head slider mounted on the metal supporting member and having a write head element and a read head element, and laminated on the metal supporting member. An HGA comprising a wiring member, the wiring member comprising a pair of write-side trace conductor layers, one end of which is electrically connected to a write head element, and one end of which is electrically connected to a read head element. A pair of read-side trace conductor layers, a pair of write-side trace conductor layers and a pair of read-side trace conductor layers are laminated on the upper surface, and the lower surface is in contact with the metal supporting member. And a resin layer, and at least a part thereof, that is, a main portion of the write-side trace conductor layer and the read-side trace conductor layer, has a pair of read-side trace conductors. Gap S _R interlayer gap S _W greater than HGA pair of write side trace conductor layers are provided.

The width W _{R of} each read side trace conductor layer is smaller than the width W _{W of} each write side trace conductor layer in at least a part of the write side trace conductor layer and the read side trace conductor layer. Is preferred.

FIG. 1 is a cross-sectional view of a part of the suspension taken perpendicularly to the running direction of the wiring member. 10 is a metal supporting member (ground conductor), 11 is a wiring member laminated and formed thereon. Shown respectively. Wiring member 11
Is a resin layer 12 and a pair of write-side or read-side trace conductor layers 13a and 13b patterned on the resin layer 12.
And a coating layer 14 that covers these trace conductor layers 13a and 13b.

The thickness D of the resin layer 12 and the trace conductor layer 13
It is very difficult to make the thicknesses T _W or T _R of a and 13b different between the writing side and the reading side due to the manufacturing method of the suspension and the wiring member. Therefore, usually, the resin layer and the trace conductor layer having the same thickness are used on both the write side and the read side.

The capacitance component is composed of a capacitance component C _G to the ground and a capacitance component C _L between the lines, but in the case of reducing the capacitance component of the wiring on the read side, especially in the tunnel type GMR element, the capacitance component to the ground is used. It has been found from the simulation results by the inventors of the present application that a better frequency characteristic can be obtained by reducing the line capacitance component C _L than by reducing the capacitance component C _G. Therefore, it is desirable to increase the gap S _R in order to reduce the line capacitance component C _L of the read side trace conductor layer. In the write side, thus increasing the gap S _W trace conductor layer,
This is undesirable because it increases the induction component. Therefore, at least in part, the gap S between the read side trace conductor layers is
Only _R, which is spread so as to be larger than the gap S _W of the pair of write side trace conductor layers, and further reduced the capacitive component of the read-side wiring.

In addition to this, the capacitance component C to the ground
Reducing _G also reduces the capacitance component of the wiring on the read side. For this purpose, it is desirable to further reduce the width W _R of the read-side trace conductor layer.
On the write side, the width W _W of the trace conductor layer is thus
If the value is small, heat generation due to the write current becomes a problem, which is not desirable. Therefore, at least in part, it is more preferable to narrow only the width W _R of the read side trace conductor layer so that it is smaller than the width W _{W of} each write side trace conductor layer.

According to the present invention, further, a pair of write side trace conductor layers, one end of which is electrically connected to the write head element of the thin film magnetic head when mounted, and the thin film when mounted. A pair of read side trace conductor layers, one end of which is electrically connected to the read head element of the magnetic head;
A pair of write-side trace conductor layers and a pair of read-side trace conductor layers are laminated on the upper surface, and at least include a resin layer whose lower surface is brought into contact with the ground conductor surface when mounted. In the wiring member, assuming that the width and thickness of each read side trace conductor layer are W _R and T _R , the gap between the pair of read side trace conductor layers is S _R, and the thickness of the resin layer is D, in the main part of the reading-side trace conductor _layer, it is _{(W R / D) / (} T R / S R), 5.
A wiring member having a number of 7 or more is provided.

According to the present invention, a suspension comprising a metal supporting member and a wiring member laminated on the metal supporting member, wherein the wiring member is mounted on the thin film magnetic head. Pair of write-side trace conductor layers, one end of which is electrically connected to the write head element, and a pair of read-sides, one end of which is electrically connected to the read head element of the thin-film magnetic head when mounted. At least a trace conductor layer, a pair of write side trace conductor layers and a pair of read side trace conductor layers are laminated on the upper surface, and the lower surface is a resin layer in contact with the metal supporting member. Assuming that the width and thickness of each read side trace conductor layer is W _R and T _R, and the gap between the pair of read side trace conductor layers is S _R, and the thickness of the resin layer is D, the read side is Trace conductor layer In principal _{part, (W} R / D) /
_{(T R} / _S R) is provided a suspension is 5.7 or more.

According to the present invention, further, a metal supporting member, a magnetic head slider mounted on the metal supporting member and having a write head element and a read head element, and a wiring laminated on the metal supporting member. And a wiring member having a pair of write side trace conductor layers electrically connected at one end to the write head element and one end electrically connected to the read head element. A resin in which a pair of read side trace conductor layers, a pair of write side trace conductor layers and a pair of read side trace conductor layers are laminated on the upper surface, and the lower surface is in contact with the metal supporting member. and a layer which at least has the width and thickness of each read-side trace conductor layer and W _R and T _R,
A gap of a pair of read-side trace conductor layers and S _R, and the thickness of the resin layer is D, the main part of the reading-side trace conductor _{layer, (W R / D) /} (T R / S R) But,
An HGA that is 5.7 or higher is provided.

[0022] Given a trace conductor layer 13a and 13b has a unit length, as shown in FIG. 1, the area of the surface facing the ground conductor face of each trace conductor layer on the read side is W _R represented, the area of the wiring interval direction of the surface of each trace conductor layer on the read side is represented by T _R. Therefore, the capacitance component C _G to the ground of the wiring member on the read side corresponds to W _R / D, and the line capacitance component C _L of the wiring member on the read side.
Corresponds to the _{T R} / _S R is. In other _{words, (W} R / D) /
_{(T R} / _S R) is a read-side trace conductor layer _C G / _{C L}
Will be represented. In the main part of the read side trace conductor layer, _CG /
C _{L, i.e.,} (W R _/ D) / if _{(T R} / _S R) 5.7 or more, 0.5 pF measured values of line-to-line capacitance of the read-side trace conductor layer in the frequency region above 100MHz
It is known from the experimental results of the inventors of the present application that the following can be suppressed.

The metal supporting member supports the flexure having elasticity for stabilizing the flying posture of the thin film magnetic head, that is, the magnetic head slider, and the flexure, and applies a load to the thin film magnetic head, that is, the magnetic head slider. And a load beam.

The read head element has a magnetoresistive effect (M
It is also preferable that the magnetic head element has an R) film.

[0025]

FIG. 2 shows an embodiment of the HGA of the present invention, (A) is a plan view of the entire HGA,
3B is a perspective view of the magnetic head slider, and FIG.
FIG. 3 is an enlarged plan view showing in detail the suspension and the tip of the wiring member.

As shown in these figures, H of the present embodiment
GA is a wiring member on the suspension 20 and FPC.
21 is fixed to the suspension 20 and the FPC 21.
The magnetic head slider 22 having at least one thin film magnetic head element is fixed to the tip of the magnetic head slider 22. Although not shown, an IC chip for head drive and read signal amplification may be mounted in the middle of the FPC 21.

The suspension 20 has an elastic flexure 23 for carrying the magnetic head slider 22 at one end, a load beam 24 which also supports and secures the flexure 23, and a flexure 23 at the base of the load beam 24. It is mainly composed of a base plate 25 provided.

The magnetic head slider 22, the write head element and an MR read head and at least one thin-film magnetic head element 22a by element, the write head element 2 which is electrically connected to the terminal electrodes 22b ₁ and 22
and b _2, are formed electrically connected to 2 are two terminal electrodes 22b ₃ and 22b ₄ in the MR read head element. The size of the magnetic head slider 22, which is merely an example, is 1.25 mm × 1.0 mm × 0.3 mm. The MR read head element is, for example, a tunnel type GMR.
It is an element.

The flexure 23 has a soft tongue portion (not shown) centering on the dimple provided on the load beam 24, and the tongue portion elastically supports the magnetic head slider 22 flexibly and stabilizes the flying posture. have. The flexure 23 has a thickness of about 2 in this embodiment.
It is made of a 5 μm stainless steel plate (for example, SUS304TA).

The load beam 24 has elasticity for pressing the magnetic head slider 22 toward the magnetic disk to stabilize the flying height. This load beam 24
Is approximately 60 to 65 μm in a shape in which the width becomes narrower toward the tip.
The flexure 23 is fixedly supported over its entire length and is made of a thick stainless steel plate. The fixation between the flexure 23 and the load beam 24 is made by spot welding such as laser welding. As in the present embodiment, the flexure 23 and the load beam 24
In a three-piece structure suspension in which and are independent components, the rigidity of the load beam 24 is higher than the rigidity of the flexure 23.

The base plate 25 is a load beam 24.
It is made of thicker stainless steel or iron and is fixed to the base of the load beam 24 by spot welding using a laser or the like. Mounting part 2 of this base plate 25
The HGA is attached to the support arm by fixing 5a to the support arm (not shown) by mechanical caulking.

On the surfaces of the flexure 23 and the load beam 24, a part of the FPC 21 is adhered and fixed by an adhesive. However, the FPC 21 has a structure that floats in the space between the load beam 24 and the base plate 25, and further has a long tail structure that extends long behind the base plate 25.

The FPC 21 has a pair of write side trace conductor layers 26a ₁ and 26a ₂ as a signal line for the write head element and a pair of read side trace conductor layers 26a ₃ and 26a as a signal line for the MR read head element. _{And 4} are provided. Connection pads 26b ₁ and 26b ₂ for the write head element and connection pads 26b ₃ and 26b ₄ for the read head element are provided at the front end of the FPC 21, and a connection for external connection is provided at the rear end. Pad 26c
₁ , 26c ₂ , 26c ₃ and 26c ₄ are provided.

Write side trace conductor layers 26a ₁ and 26
a _{2 and} read side trace conductor layers 26a ₃ and 26a
₄ move toward both ends of the slider 22 toward the tip of the FPC 21 and are separated from each other, and their tips are connected to the connection pad 2
6b ₁ and 26b ₂ and connection pads 26b ₃ and 26
It is connected to the b _4. Further, the rear ends of the write side trace conductor layers 26a ₁ and 26a ₂ and the read side trace conductor layers 26a ₃ and 26a ₄ are connected to external connection pads 26c ₁ , 26c ₂ , 26c ₃ and 26c ₄ , respectively. There is.

FIG. 4 is a cross-sectional view of the FPC 21 of the embodiment shown in FIG. 2 taken perpendicularly to the running direction thereof. FIG. 4A shows the trace conductor layers 26a ₁ and 26a ₂ on the write side.
Part, read side trace conductor layers 26a ₃ and 26a ₄
Are shown respectively.

As shown in the figure, the FPC 21 includes a thin resin layer (base film layer) 2 made of, for example, polyimide.
7, the write side trace conductor layers 26a ₁ and 26a ₂ and the read side trace conductor layers 26a ₃ and 26a ₄ are formed of, for example, Cu on the conductor layer _7, and these conductor patterns are covered with, for example, polyimide (overcoat layer). It is formed by covering with 28. The base film layer 27 and the flexure 23 or the load beam 24 are fixed to each other with a UV resin-based or epoxy resin-based adhesive, for example.

At the portion fixed on the tip of the suspension, the FPC 21 has a thin base film layer 27 made of, for example, polyimide, and a writing formed by plating Cu formed on the thin base film layer 27 with Au for corrosion prevention. It is composed of only the side trace conductor layers 26a ₁ and 26a ₂ and the read side trace conductor layers 26a ₃ and 26a _4, and there is no overcoat layer. The base film layer 27 and the flexure 23 are fixed to each other with, for example, a UV resin-based or epoxy resin-based adhesive. By not providing the overcoat layer on this portion of the FPC 21 that greatly affects the spring constant, it is possible to promote the reduction in stiffness.

As is apparent from FIG. 4, in this embodiment, the read side trace conductor layers 26a ₃ and 26a _{4 are included.}
Of the conductor layer gap S _R of the write side trace conductor layer 26a ₁
It is set larger than the conductor layer gap _{S W} of and 26a _2. Furthermore, the read side trace conductor layers 26a ₃ and 26
The width W _{R of} a ₄ is set smaller than the width W _{W of} the write-side trace conductor layers 26a ₁ and 26a ₂ .

Thickness D of base film layer 27, read side
Trace conductor layer 26a_ThreeAnd 26a _FourThickness T_RAnd calligraphy
Embedded side trace conductor layer 26a₁And 26a_TwoThickness T_W
Is it due to the manufacturing method of the suspension and wiring members?
It is not possible to make the write side and read side different from each other.
Since it is always difficult, the write side and the read side are the same.
The thing of thickness is used.

Read side trace conductor layers 26a ₃ and 26
Assuming that a ₄ has a unit length, the area of the surface of each trace conductor layer on the read side facing the ground conductor surface is W.
Represented by _R, the area of the wiring interval direction of the surface of each trace conductor layer on the read side is represented by T _R. Therefore, the line capacitance component C _L of the wiring member on the read side corresponds to T _R / S _R , and the capacitance component C _G to the ground of the wiring member on the read side is W.
It corresponds to _R / D.

[0041] As a result, if D and _{T R} are constant, S
_The larger _R is, the smaller the line capacitance component C _L on the read side is, and the smaller the _{R R} is, the smaller the capacitance component C _G to ground of the wiring member on the read side is. Increases inducing component and to increase the conductive layer gap _{S W} of the trace conductor layer 26a ₁ and 26a ₂ of the write side, also, heat generation due to the write current Reducing the width _{W W} of the write-side trace conductor layer 26a ₁ and 26a ₂ is It becomes a problem. Therefore, _{S W} can not be increased, _{W W} can not be reduced. Therefore, in this embodiment, S _R is set to be larger than S _W and W _R is set to be smaller than W _W.

FIGS. 5 and 6 show the frequency characteristics of the capacitance component and the induction component of the wiring members having different line intervals, respectively. In these figures, A is a base film layer having a thickness of 35 μm, a line spacing is 50 μm, and a line width is 35 μm, and B is a base film layer having a thickness of 35 μm, a line spacing is 200 μm, and a line width is 35 μm. . B having a wider line spacing has a smaller capacitance component in all frequency bands. On the contrary, in the case where the line spacing is the same as in the conventional case, the induction component is smaller than this. Therefore, the conductor layer gap S _W of the write side trace conductor layers 26a ₁ and 26a ₂ is set as in the conventional manner as A, and the conductor layer gap S _R of the read side trace conductor layers 26a ₃ and 26a ₄ is set to B. With such a large value, the line capacitance component C _L on the read side only is reduced, and good frequency characteristics can be obtained.

FIG. 7 is a characteristic diagram showing a result of simulating the line capacitance dependency of the frequency characteristic of the tunnel type GMR element, and FIG. 7B is an enlarged view of the main part of FIG. Further, FIG. 8 is a characteristic diagram showing a result of simulating the dependency of the frequency characteristic of the tunnel type GMR element on the ground capacitance, and FIG. 8B is an enlarged view of the main part of FIG.

As is clear from these figures, the line capacitance
Ingredient is C_L= 1.0 (pF) to C _L= 0.5 (pF)
The frequency characteristic is drastically improved when the voltage drops to. one
However, for the capacitance component to ground, C_G= 6.0 (p
F) to C_GWhen the frequency drops to 3.0 (pF), the frequency characteristic
Is slightly improved, but not as much as the line capacitance.
Yes. Therefore, when reducing the capacitance component of the wiring on the read side,
In particular, in a tunnel type GMR element,
Capacity component C_GLine capacitance component C rather than reducing _LLow
It can be seen that better frequency characteristics can be obtained by reducing the frequency.
Light Therefore, in the wiring on the read side, the line capacitance component C_L
To reduce the gap S_RIt is better to make
It is desirable in terms of obtaining good frequency characteristics.

For the read side wiring member, the thickness T _R of the trace conductor layers 26a ₃ and 26a ₄ is constant (T _R = 18).
μm), the thickness D of the base film layer 27, the gap S _R and the width W _R of the trace conductor layers 26a ₃ and 26a ₄ were actually prepared, and the capacitance to ground and line capacitance were measured. did. The measurement results are shown in Table 1. In Table _1, the _{C G / C L, (W} R / D)
Is a calculated value calculated from _{/ (T R / S R)} .

[0046]

[Table 1]

In Table 1, Sample 1 is the size of the current wiring member. In order to suppress the line-to-line capacitance value below 0.5pF is, _C G / _{C L} of the read-side trace conductor layer as in Sample 7-11, _{i.e., (W R / D) /} (T R / S R) 7
It is necessary to be above. However, in reality, 10
Since the capacitance value in the high frequency band exceeding 0 MHz becomes a problem, it is sufficient if C _G / C _L is 5.7 or more.

[0048] Thus, according to this embodiment, the gap S _R of the read-side trace conductor layer is set larger than the write-side trace conductor layer gap S _W, further, the width W _R of the read-side trace conductor layer Is set to be smaller than the width W _W of the write side trace conductor layer. As a result, it is possible to reduce the capacitive component only on the read side without increasing the inductive component on the write side and the increase in heat generation, and it is possible to significantly improve the read frequency characteristic. Moreover, the reading side _{C G}
Since / _CL is 5.7 or more, the line capacitance in the high frequency region can be reduced and the read frequency characteristic can be improved.

FIG. 9 shows an FPC 9 according to another embodiment of the present invention.
1 is a cross-sectional view taken along the line 1 perpendicular to the running direction,
FIG. 3A shows the trace-side conductor layers 96a ₁ and 96 on the write side.
a ₂ part, read side trace conductor layers 96a ₃ and 96
respectively show parts of a _4. The configuration other than the FPC in this embodiment is exactly the same as that in the embodiment of FIG.

As shown in the figure, the FPC 91 is made of, for example, Cu formed on a resin layer (base film layer) 97, which is thicker than that in the embodiment of FIG.
And the like by the write side trace conductor layers 96a ₁ and 96a ₂
Further, the read side trace conductor layers 96a ₃ and 96a ₄ are formed, and these conductor patterns are covered with a coating layer (overcoat layer) 98 made of, for example, polyimide. Base film layer 97 and flexure 2
3 or the load beam 24 is fixed by, for example, a UV resin-based or epoxy resin-based adhesive.

In the portion fixed on the tip of the suspension, the FPC 91 has a thin base film layer 97 made of, for example, polyimide, and a writing formed by plating Cu formed on the thin base film layer 97 with Au for corrosion prevention. It is composed of only the side trace conductor layers 96a ₁ and 96a ₂ and the read side trace conductor layers 96a ₃ and 96a _4, and there is no overcoat layer. The base film layer 97 and the flexure 23 are fixed to each other with, for example, a UV resin-based or epoxy resin-based adhesive. By not providing the overcoat layer on this portion of the FPC 91 that greatly affects the spring constant, it is possible to promote the reduction in stiffness.

As is apparent from FIG. 9, in this embodiment, the read side trace conductor layers 96a ₃ and 96a _{4 are provided.}
Of the conductor layer gap S _R of the write side trace conductor layer 96a ₁
And it has largely been set from the conductive layer gap _{S W} of 96a _2. Further, the read side trace conductor layers 96a ₃ and 96
The width W _{R of} a ₄ is set smaller than the width W _{W of} the write-side trace conductor layers 96a ₁ and 96a ₂ . Particularly, in this embodiment, the thickness D of the base film layer 97 is thicker than that shown in FIG. Increasing the thickness of the base film layer 97 in this way can be easily realized by a structure using an FPC.

Thickness D of base film layer 97, read side
Trace conductor layer 96a_ThreeAnd 96a _FourThickness T_RAnd calligraphy
Embedded side trace conductor layer 96a₁And 96a_TwoThickness T_W
Is it due to the manufacturing method of the suspension and wiring members?
It is not possible to make the write side and read side different from each other.
Since it is always difficult, the write side and the read side are the same.
The thing of thickness is used.

FIG. 10 shows the frequency characteristics of the capacitance component of wiring members having different thicknesses of the base film layer, line spacings and line widths of the trace conductor layers. In the figure, a is a base film layer having a thickness of 18 μm, a line spacing is 40 μm, and a line width is 40 μm, and b is a base film layer having a thickness of 50 μm, a line spacing is 200 μm, and a line width is 35 μm.
μm. The capacitance component of b in which the line spacing is widened and the thickness of the base film layer is increased is smaller than that of a in all frequency bands. Moreover, the capacitance component of b in FIG. 10 is smaller than that of B shown in FIG. 5 in all frequency bands. Therefore, it can be seen that better frequency characteristics can be obtained by increasing the thickness of the base film layer.

Other configurations, modifications, effects and the like in this embodiment are almost the same as those in the embodiment of FIG.

The above-described embodiment has a structure in which the FPC is used as the wiring member. However, as the wiring member, a structure in which a resin layer, a trace conductor layer and a resin layer are sequentially laminated is formed directly on the suspension, or The present invention is similarly applicable to a wireless suspension having a structure in which a resin layer, a trace conductor layer, and a resin layer are sequentially laminated on a stainless steel thin plate separate from the suspension, and this is laser-welded on the suspension. it is obvious.

The embodiments described above are merely illustrative and not limitative of the present invention, and the present invention can be implemented in various other modified modes and modified modes. Therefore, the scope of the present invention is defined only by the claims and their equivalents.

[0058]

As described in detail above, according to the present invention,
A pair of read side trace conductors, at least in part
Gap S between layers_RBetween a pair of write-side trace conductor layers
Gap S_WGreater than The capacitance component is the capacitance component C to ground.
_GAnd line capacitance C_LIt consists of and
When reducing the capacitance component of the wiring, especially tunnel type GM
In the R element, capacitance component C to ground_GTo reduce
Line capacitance component C _LIt is better to reduce
Frequency characteristics can be obtained. Therefore, the read side trace conductor
Capacitance component C between layers of layers_LTo reduce the gap S_RYo
It is desirable to make it larger. On the writing side, this
So that the space S between the trace conductor layers_WTo make
This is undesirable because it increases the induction component. Therefore, less
In some of them, the gap S between the read side trace conductor layers is
_RThe gap S between the pair of write-side trace conductor layers_WGreater than
The capacitance component of only the wiring on the read side can be further reduced.
is doing.

In addition to this, the capacitance component C to the ground
Reducing _G also reduces the capacitance component of the wiring on the read side. For this purpose, it is desirable to further reduce the width W _R of the read-side trace conductor layer.
On the write side, the width W _W of the trace conductor layer is thus
If the value is small, heat generation due to the write current becomes a problem, which is not desirable. Thus, at least in part, has a width W _R of the read-side trace conductor layer smaller than the width W _W of the write-side trace conductor layer.

According to the present invention, further, the width and thickness of each read side trace conductor layer are set to W _R and T _R , the gap between the pair of read side trace conductor layers is set to S _R, and the thickness of the resin layer is set. the When is D, the main part of the reading-side trace conductor _layer, is _{(W R / D) / (} T R / S R), it is 5.7 or more. The _{(W R / D) / (} T R / S R) becomes represent a _C G / _{C L} of the read-side trace conductor layer. In the main part of the reading-side trace conductor layer, _C G / _{C L} of the read-side trace conductor layer, _{i.e., (W} R / D) /
If _{(T R} / _S R) 5.7 or more, it is suppressed measured values of line-to-line capacitance of the read-side trace conductor layer in the above frequency range 100MHz to below 0.5 pF.

[Brief description of drawings]

[1] _{W W, W R, S W} , S R, T W, in order to explain the _{T R} and D, is a cross-sectional view taken in the direction perpendicular which runs a portion of the suspension of the wiring member.

FIG. 2 shows an HG according to an embodiment of the HGA of the present invention.
FIG. 3 is a plan view showing the whole A and a perspective view showing the magnetic head slider.

FIG. 3 is an enlarged plan view showing in detail the distal end portions of the suspension and the wiring member in the embodiment of FIG.

FIG. 4 is a cross-sectional view of the FPC in the embodiment of FIG. 2, taken along a direction perpendicular to its running direction.

FIG. 5 is a characteristic diagram showing frequency characteristics of capacitance components of wiring members having different line intervals.

FIG. 6 is a characteristic diagram showing frequency characteristics of inductive components of wiring members having different line intervals.

FIG. 7 is a characteristic diagram showing a result of simulating the line capacitance dependency of the frequency characteristic of the tunnel type GMR element.

FIG. 8 is a characteristic diagram showing a result of simulating the dependence of the frequency characteristic of the tunnel type GMR element on the capacitance to ground.

FIG. 9 is a cross-sectional view of an FPC according to another embodiment of the present invention, taken along a line perpendicular to its running direction.

FIG. 10 is a characteristic diagram showing frequency characteristics of capacitance components of wiring members having different line spacings and base film layer thicknesses.

[Description of Reference Signs] 20 suspension 21, 91 FPC 22 magnetic head slider 22a thin film magnetic head element 22b ₁ , 22b ₂ , 22b ₃ , 22b ₄ terminal electrode 23 flexure 24 load beam 25 base plate 25a mounting portion 26a ₁ , 26a ₂ , 96a ₁ , 96a ₂ Write-side trace conductor layers 26a ₃ , 26a ₄ , 96a ₃ , 96a ₄ Read-side trace conductor layers 26b ₁ , 26b ₂ Write head element connection pads 26b ₃ , 26b ₄ Readhead element connection pads 26c ₁ , 26c ₂ , 26c ₃ , 26c ₄ Connection pads 27, 97 for external connection Resin layer (base film layer) 28, 98 Coating layer (overcoat layer)

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 5D042 NA02 TA07                 5D059 AA01 BA01 CA30 DA26 DA36                       EA08

Claims (12)

[Claims] 1. A pair of write side trace conductor layers, one end of which is electrically connected to a write head element of a thin film magnetic head when mounted, and a read head of the thin film magnetic head when mounted. A pair of read side trace conductor layers, one end of which is electrically connected to the device, the pair of write side trace conductor layers and the pair of read side trace conductor layers, are laminated on the upper surface, A wiring member having at least a resin layer whose lower surface is brought into contact with a ground conductor surface when mounted, wherein a gap S _R between the pair of read side trace conductor layers is at least 1
Wiring member being larger than the gap S _W pairs of writing-side trace conductor layers. 2. The wiring member according to claim 1, wherein, at least in part, a width W _{R of} each read side trace conductor layer is smaller than a width W _{W of} each write side trace conductor layer. 3. A pair of write side trace conductor layers, one end of which is electrically connected to a write head element of the thin film magnetic head when mounted, and a read head of the thin film magnetic head when mounted. A pair of read side trace conductor layers, one end of which is electrically connected to the device, the pair of write side trace conductor layers and the pair of read side trace conductor layers, are laminated on the upper surface, when implemented in a wire member having at least a resin layer in which the lower surface is brought into contact with the ground conductor surface, the width and thickness of the respective read-side trace conductor layer and W _R and T _R, wherein a gap of a pair of read-side trace conductor layers and S _R, and the thickness of the resin layer is D, the major part of the read-side trace conductor _{layer, (W R / D) /} (T R / S _R ) is 5.
A wiring member having a number of 7 or more. 4. A suspension comprising a metal supporting member and a wiring member laminated on the metal supporting member, the suspension being a write head element of a thin film magnetic head when the wiring member is mounted. A pair of write side trace conductor layers whose one ends are electrically connected; and a pair of read side trace conductor layers whose one ends are electrically connected to a read head element of the thin film magnetic head when mounted. A pair of write side trace conductor layers and a pair of read side trace conductor layers are laminated on an upper surface, and the lower surface has at least a resin layer in contact with the metal supporting member. And a gap S _R between the pair of read side trace conductor layers is larger than a gap S _W between the pair of write side trace conductor layers at least in part. 5. The suspension according to claim 4, wherein, at least in part, a width W _{R of} each read side trace conductor layer is smaller than a width W _{W of} each write side trace conductor layer. 6. A suspension comprising a metal supporting member and a wiring member laminated on the metal supporting member, the suspension being a write head element of a thin film magnetic head when the wiring member is mounted. A pair of write side trace conductor layers whose one ends are electrically connected; and a pair of read side trace conductor layers whose one ends are electrically connected to the read head element of the thin film magnetic head when mounted. A pair of write side trace conductor layers and a pair of read side trace conductor layers are laminated on an upper surface, and the lower surface has at least a resin layer in contact with the metal supporting member. And the width and thickness of each read side trace conductor layer are set to W _R and T
And _R, when the gap between the pair of read-side trace conductor layers and S _R, the thickness of the resin layer is D, the major part of the read-side trace conductor layer, (W R _{/ D)}
/ _{(T R} / _S R) is a suspension, characterized in that at 5.7 or more. 7. A flexure having elasticity for stabilizing the flying posture of the thin film magnetic head, and a load beam for applying a load to the thin film magnetic head, wherein the metal supporting member supports the flexure. The suspension according to any one of claims 4 to 6, comprising: 8. A metal support member, a magnetic head slider mounted on the metal support member and having a write head element and a read head element, and a wiring member laminated on the metal support member. A pair of write side trace conductor layers, one end of which is electrically connected to the write head element, and one end of which is electrically connected to the read head element. A pair of read-side trace conductor layers, a pair of write-side trace conductor layers, and a pair of read-side trace conductor layers are laminated on an upper surface, and the lower surface contacts the metal supporting member. to which at least and a resin layer are, at least in part, the one gap S _R pairs of read side trace conductor layers the pair of write-side trace conductor layer course of HGA being greater than S _W. 9. The head gimbal assembly according to claim 8, wherein the width W _{R of} each read side trace conductor layer is at least partially smaller than the width W _{W of} each write side trace conductor layer. 10. A metal supporting member, a magnetic head slider mounted on the metal supporting member and having a write head element and a read head element, and a wiring member laminated on the metal supporting member. A pair of write side trace conductor layers, one end of which is electrically connected to the write head element, and one end of which is electrically connected to the read head element. A pair of read-side trace conductor layers, a pair of write-side trace conductor layers, and a pair of read-side trace conductor layers are laminated on an upper surface, and the lower surface contacts the metal supporting member. And the width and thickness of each of the read side trace conductor layers are W _R and T _R, and the gap between the pair of read side trace conductor layers is S _R. Features and then, when the thickness of the resin layer is D, the major part of the read-side trace conductor _layer, that is, is 5.7 or more _{(W R / D) / (} T R / S R) And head gimbal assembly. 11. A flexure having elasticity for stabilizing the flying posture of the magnetic head slider, and a load beam for applying a load to the magnetic head slider, wherein the metal support member supports the flexure. The head gimbal assembly according to claim 8, further comprising: 12. The head gimbal assembly according to claim 8, wherein the read head element is a magnetic head element having a magnetoresistive effect film.