JP4455698B2 - Magnetic head - Google Patents

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Publication number
JP4455698B2
JP4455698B2 JP28197699A JP28197699A JP4455698B2 JP 4455698 B2 JP4455698 B2 JP 4455698B2 JP 28197699 A JP28197699 A JP 28197699A JP 28197699 A JP28197699 A JP 28197699A JP 4455698 B2 JP4455698 B2 JP 4455698B2
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wiring conductor
wiring
conductor pattern
flexible substrate
magnetic head
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JP2001101640A (en
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典夫 植村
芳昭 内田
佳伸 石久保
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TDK Corp
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TDK Corp
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Description

【0001】
【発明の属する技術分野】
本発明は、磁気ディスク装置の高記録密度化の為、録再分離型磁気ヘッドの書込信号電流や再生信号電流の高周波化に対応した配線導体パターンを有するフレキシブル基板を固定した磁気ヘッドに関するものである。
【0002】
【従来の技術】
コンピューターの急速な発展により磁気ディスク装置も小型、大容量化が要求されるようになってきた。薄膜コイルを備えた誘導型磁気ヘッドを記録再生兼用とした誘導型薄膜磁気ヘッドが従来主流であったが、前記誘導型薄膜磁気ヘッドを書込専用ヘッドとし、再生感度の高いMR素子やGMR素子等を再生専用ヘッドとし、これらを組合せた記録再生分離型の磁気ヘッドへと変化してきた。
【0003】
磁気ヘッドスライダーと外部回路との接続に関しては、従来、直径数10μm程度の絶縁ワイヤーを用いてきた。超音波ボンディングで磁気ヘッドスライダーの電極パッドと接続部の絶縁物を除去した絶縁ワイヤーを、電気的かつ機械的に接続した後に前記絶縁ワイヤーを所定の向きに曲げる。曲げた部分の絶縁ワイヤーは、ループ状の形状を呈しておりその部分はサービスループと呼ばれている。
【0004】
前述したサービスループを形成する際の微妙な力加減により、絶縁ワイヤーの曲げ剛性による応力が磁気ヘッドスライダーに加わる。磁気ヘッドスライダーは軽量化(寸法の縮小化)が進められてきているため、それに応じてサスペンションの磁気ヘッドスライダーを接着するジンバル部分の剛性も小さくなってきている。このため、絶縁ワイヤーから力を受けることにより磁気ヘッドスライダーは設計で定めた静止時のロールやピッチの規定範囲から逸脱しやすくなっている。
【0005】
そのほか、絶縁ワイヤーに関係するトラブルとして、サスペンションを取り扱う時の不注意で、作業者が自分の指や取り扱いに用いるピンセット等で絶縁ワイヤーを切ってしまったり、サービスループを変形させてしまったりすることが挙げられる。
【0006】
絶縁ワイヤー方式には前述したような問題があるため解決の一つの方法として、ポリイミド等の絶縁ベースフィルム上にメッキ等で配線導体パターンを形成し、更に表面保護用のフィルムを貼るとともに接着剤により一体化したフレキシブル基板が、絶縁ワイヤーに代わり使用されるようになってきた。
【0007】
磁気ディスク装置の更なる高密度記録化に対応するために、書込信号の周波数が高くなってきた。近年では200MHzを越える周波数の書込信号により書込ヘッドを駆動するようになった。また、更に書込周波数は高くなる傾向にある。その結果、周波数が高くなった書込信号による表皮効果が顕著になり、配線導体パターンの実質的な配線抵抗が増加してきた。
【0008】
配線導体パターンの電気抵抗が増加してくると再生信号中の熱雑音の増加につながる。また、書込信号の電流の立ち上がりが悪くなり所定の電流値に達する前に書き込み信号がオフになり、実質的な書き込み電流の低下に繋がる。そのほかの問題として、配線導体パターンとしてポリイミドフィルム等を用いたフレキシブル基板を用いるため、フレキシブル基板の曲げ剛性が磁気ヘッド用サスペンションに影響を与えて磁気ヘッドスライダーに加える荷重の大きさに変動を与えることが挙げられる。
【0009】
ここで前述した表皮効果とは、電流の流れる部位が導体の表面層に限られて内部に入らない現象のことを指している。
【0010】
フレキシブル基板が、サスペンションの縦方向の曲げ剛性に影響を与えないように、サスペンションの可撓性の部分を避けてフレキシブル基板を固定している。しかしながら、サスペンションに固定したフレキシブル基板の一端は、必ず磁気記録装置内の回路基板等に固定するため、サスペンションの縦方向の曲げ剛性に対して完全にフレキシブル基板の影響を無くすのは難しい。
【0011】
そこで、本発明は前述した問題を解決するため、磁気ヘッド用サスペンションに固定するフレキシブル基板の配線導体パターンの形状や本数を工夫して配線導体パターンに流れる電流の方向と直角方向の表皮長を増やし、表皮効果による配線導体パターンの電気抵抗の増加を抑制する。ここで表皮長とは、配線導体パターン断面部の全外周長さを言う。同時にフレキシブル基板の縦方向(面に対して垂直な方向)の曲げ剛性を減らす。
【0012】
すなわち、書込信号の周波数が高くなると共に大きくなる熱雑音を抑制し、配線導体パターンの最大書込信号電流能力を増やし、そしてサスペンションの曲げ剛性に対しの影響を少なくしたフレキシブル基板を備える磁気ヘッドを提供することを目的とする。
【0013】
【課題を解決するための手段】
本願第一の発明は、サスペンションと、複数の配線導体パターンを備えているフレキシブル基板と、磁気ヘッドスライダーとを備えた磁気ヘッドにおいて、
前記サスペンションは、基部と先端部と前記基部と前記先端部との間の中央部とで構成され、前記磁気ヘッドスライダーは前記先端部にて前記サスペンションに支持され、前記フレキシブル基板の一端には前記配線導体パターンに繋がれるスライダー用電極パッドが設けられ、前記フレキシブル基板の他端には前記配線導体パターンに繋がれる外部回路と電気的に接続するための外部用電極パッドが設けられ、
前記フレキシブル基板は、前記スライダー用電極パッドが前記磁気ヘッドスライダーと電気的に接続されるとともに、前記磁気ヘッドスライダー側から前記サスペンションの中央部にかけて前記サスペンションに固定されており、
前記配線導体パターンは、前記スライダー用電極パッド側から外部用電極パッド側にかけて、単線配線が前記フレキシブル基板の幅方向に2本又は2本以上で分岐した複数配線導体パターンで形成され、前記スライダー用電極パッド側の一部分又は前記外部用電極パッド側の一部分の少なくとも前記スライダー用電極パッド側の一部分が前記単線配線で形成され、前記磁気ヘッドスライダーが支持される前記サスペンションの先端部近辺にて前記単線配線から前記複数配線導電パターンに分岐する分岐部が設けられており、前記複数配線導体パターンは、前記サスペンションの中央部に固定される前記フレキシブル基板の全体に設けられ、
前記複数配線導体パターンの厚みは全て、単線配線部を形成する配線導体パターンの厚みよりも薄く形成され、前記複数配線導体パターンの各パターン幅は、前記単線配線部を形成する配線導体パターンのパターン幅に等しく、前記複数配線導体パターンの全断面積は、前記単線配線部を形成する配線導体パターンの断面積に等しく、前記複数配線導体パターンが形成された部分でのフレキシブル基板の曲げ剛性が、前記単線配線部が形成された部分でのフレキシブル基板の曲げ剛性よりも小さくされていることを特徴とする磁気ヘッドである。
【0014】
本願第一の発明について図1と図3を用いて説明する。図1は本発明の磁気ヘッド用サスペンションを用いた磁気ヘッド組立て体(以下、HGAと言う)101の外観図であり、図3は本発明の配線導体パターン備えているフレキシブル基板106の外観図及びa−a’、b−b’を切断線としたときのフレキシブル基板の断面の模式図である。以下、HGAを示す図面において共通の部分は同じ参照符号を用いている。
【0015】
図1に本発明の配線導体パターンを有するフレキシブル基板106を固定したHGA101を示す。HGA101は、サスペンション103とフレキシブル基板106、磁気ヘッドスライダー105の主要部品からなっている。HGAサスペンション103は、磁気ディスク装置に備えられシーク動作に用いるアクチュエーター装置の一部分(図示せず)と機械的に接続する部分である基部102と、磁気ヘッドスライダー105に適切な荷重を付与して磁気ヘッドスライダーの浮上量を調整し、かつシーク動作時の横方向への加速度によるサスペンション103の変形を最小限に留めるために必要な剛性を備えた剛性部108と、可撓性を有し板バネとして適切な荷重を発生させる可撓部109と、磁気ヘッドスライダーのロールやピッチを一定に保つジンバル(磁気ヘッドスライダー105の下部に位置するため図示せず)104から構成されている。
【0016】
そしてサスペンション103には、メッキ技術やエッチング技術等により形成した配線導体パターンを備えたフレキシブル基板106が樹脂等により固定されている。フレキシブル基板106の一端には配線導体パターンに繋がれた電極パッド部があり、磁気ヘッドスライダー105の電極パッドと電気的に接続している。また、フレキシブル基板106の他端は外部回路と電気的に接続するための外部用電極パッド部107を有している。
【0017】
図3は、図1に示したフレキシブル基板106の外観を示し、ジンバル104近辺(a−a’切断線)のフレキシブル基板106の断面の模式図とサスペンション中央付近(b−b’切断線)のフレキシブル基板106の断面の模式図を表している。
【0018】
図3の断面の模式図から、フレキシブル基板は絶縁ベースフィルム310と一対の再生信号用導体パターン(311、312)や一対の書込信号用導体パターン(313、314)のような配線用導体パターン及び絶縁カバーフィルム320が接着層321で積層された構造になっている。説明上、再生信号用と書込信号用の導体パターンを符号で特定しているが、磁気ヘッドスライダーの電極パッドの配置によって変わっても良いものである。
【0019】
そしてジンバル付近のa−a’を切断線としたときの断面の模式図を見て明らかなように、再生信号用や書込信号用の配線用導体パターンは単線配線になっている。断面の模式図中では再生信号用導体パターン311と書込信号用導体パターン313の断面が2個ずつ見えている。
【0020】
図3で示したフレキシブル基板の断面構造は、絶縁フィルムで配線導体パターンをサンドイッチにする構造になっているが、配線導体パターンの電気的絶縁と傷や腐食に対する保護が可能であり、フレキシブル基板自体が薄く柔軟であるような構造であれば、別の構造であっても問題ない。例えば、絶縁フィルム上に形成した配線導体パターン上に極薄く絶縁樹脂を塗布するような構造や、絶縁フィルム形成時に配線導体パターンを埋め込んで一体成形してしまう構造等であってもさしつかえない。
【0021】
配線導体パターンはサスペンション103のジンバル側近辺で配線導体パターン分岐部322にさしかかり、1本の配線導体パターンは2本に枝分かれし、かつ2本に枝分かれした配線導体パターンの厚みは半分になっている。このためロードビーム103中央付近のb−b’切断線での断面模式図でも、各配線導体パターンが2本に枝分かれしているため、複線部の再生信号用導体パターン312及び複線部の書込信号用導体パターン314の断面切り口が4個見える。
【0022】
なお、図1と図3で例示したフレキシブル基板は導体パターン分岐部322で各々の配線導体パターンが2本に分岐している。分岐数は2本に限定する必要はなく2本以上でもさしつかえない。その場合、分岐された配線用導体パターンの厚みは、単線配線部分の配線導体パターンの厚みの大きさを分岐した数で割った厚さにして、全断面積は一定にしておく。また、例示したフレキシブル基板の配線導体パターンは、ジンバル近辺のみを単線配線としたが、それだけに限定せず、外部用電極パッド側についても単線配線にしてさしつかえない。
【0023】
高周波電流の表皮効果により配線導体パターンの表面から数μm以内の部分を集中的に流れることにより配線導体パターンの実質的な配線抵抗が大きくなるのであるから、配線導体パターンの表皮長を増やすことによって配線導体パターン表面近傍の電流密度を緩和し、実質的な配線抵抗の増大を抑制する事が出来る。配線導体パターンの表皮長を増やす方法としていくつかの方法が考えられる。
【0024】
考えられる方法として、一本の配線導体パターンの断面積を変えずに、幅と厚みを変えることである。しかしながら、幅と厚みを変えるだけでは、表皮長の増加には限度があるため、より表皮長を増大させるため、一本の配線導体パターンの厚みを薄くした上で、何本かに分岐する方法を考案したものである。
【0025】
例えば、縦横20μmの表皮長は80μmであるが、縦方向に2分割した時の表皮長は120μmと1.5倍となる。この様に分割することにより断面積は変えずに表皮長を大きく増加させることができる。しかし、縦方向に分割したのでは厚みは分割前と同じであるので曲げ剛性は同じとなってしまう。そこで、横方向に分割し並列配置することで表皮長は大きくでき、厚みを薄くすることにより曲げ剛性も小さくできる。
【0026】
本願第二の発明は、第一の発明の磁気ヘッド用サスペンションにおいて、前記複数本配線部分の配線導体パターンの厚みが単線配線部分の配線導体パターンの厚みを分岐数で除した厚さである磁気ヘッド用サスペンションである。
【0027】
高周波領域で電気抵抗を考える場合は、配線導体パターンの配線抵抗を下げるためには前述したように表皮長を増やす必要はあるが、断面積を増やす必要はない。表皮長を増やすために配線導体パターンの厚みを大きくすることはフレキシブル基板全体の曲げ剛性(厚みの三乗に比例する)を大きくするので適当でない。フレキシブル基板の曲げ剛性を増加させずに表皮長だけを増やす方法として、単線配線部の配線導体パターンの厚みの大きさを分岐数で除した厚みを持つ複数本配線路を成した配線導体パターンを形成する方法に到った。
【0028】
配線導体パターンの分割数を増やして配線導体パターンの表皮長を増やし高周波領域での電気抵抗を下げる方法を提案したが、表皮長を増やすことにより配線導体パターンの周囲に分布する浮遊容量も導体配線パターンの表面積の広さに応じて増加してしまう。配線導体パターンを含めた磁気ヘッドスライダーの共振周波数は少なくとも書込周波数の2倍以上にすることが望ましいため、配線導体パターンの分岐数や、分岐された導体間隔も考慮する必要がある。また、分岐数を増やすと分岐点での厚み差が大きくなり過ぎるため、分岐数は5以下にすることが望ましい。
【0030】
【発明の実施の形態】
本発明の実施の形態について説明する。図1は本発明の一実施例を表した外観図である。サスペンション103上に配線導体パターンを備えたフレキシブル基板106を樹脂等で固定している。ジンバル104(図示せず)近辺に固定した部分の各配線導体パターンは単線配線であり、サスペンション103部分に固定した各配線導体パターンは複線に分岐された複数配線であり、複数配線部分の配線導体パターンの厚みは単線配線部分の配線導体パターンの厚みより小さくし、かつ複数配線部分の配線導体パターンの断面積の合計は単線配線部分の導体パターンの断面積と略等しくした。
【0031】
比較のために図2と図4に例示した従来構造を有するフレキシブル基板206を備えた磁気ヘッド用スライダーサスペンション201について、図1と図3に示した発明例との構造の違いを説明する。
【0032】
図2で示した従来構造のフレキシブル基板206と本発明実施例で挙げたフレキシブル基板106とを、比較して異なる部分を挙げると、従来構造のフレキシブル基板206には図1に示した配線導体パターン分岐部322に相当する部分がなく、各再生、書込信号用配線は単線配線になっており配線導体パターンの全長にわたり厚みが一定である。
【0033】
表皮効果の大きさは、導体のμ(透磁率)とρ(比抵抗)及び導体を流れる高周波電流の周波数fにより決まってくる。表皮効果により高周波電流は導体表面に集中して流れるようになる。
【0034】
導体を電流の流れる方向に対して直角方向の断面での電流分布を見ると深さ方向(中心方向)に向かって電流密度が指数関数的に減る分布になっている。導体表面での電流密度の大きさの1/e(約0.368)倍になるところの深さを表皮深さSと呼び、第1式より表皮深さSは求められる。
S=1/(2πfμ/ρ)1/2 ・・・・・・第1式
【0035】
導体として無酸素電気銅(比抵抗ρ=1.673μΩ・cm)を用いたときに、導体に流す電流の周波数fにより表皮深さSがどのように変化するかを計算した結果のグラフを図5に示す。図5から判るように電流の周波数が約60Mhz以上になると表皮深さSが1μm以下になる。周波数60MHz以上の時の表皮深さSが1μm以下という数字は、一般的なフレキシブル基板の配線導体の厚さ数10μmと比較してかなり小さい。この場合、電流はパターンの中心部はほとんど流れず、導体表面付近を流れるようになるため、表皮効果による配線導体パターンの電気抵抗の増加が顕著に現れることになる。
【0036】
図2および図4に示した従来例の磁気ヘッド用スライダーサスペンション201は、図1および図3に示した本発明の配線パターンよりも表皮長が小さいため表皮効果により実質的な抵抗が大きくなっている。配線導体パターンを流れる書込信号電流の周波数を100MHzとし、配線導体パターンの材料を無酸素電気銅とし前述した第1式を用いて計算すると、その表皮深さは0.7μm程度にすぎないので、本発明の如く配線導体パターンの厚みを薄くし、分岐することで表皮長を大きくすることは、高周波領域での電気抵抗低下に有効である。
【0037】
図1および図3に示した本発明の実施例では、配線導体パターンの断面積を変えずに厚みを薄くして配線導体パターンの複数化を行うことにより、配線導体パターンの表皮長を増やす事が出来る。このため、表皮効果による高周波領域での実質的な配線抵抗の増加を抑制する事が出来る。また、配線導体パターンの表面積も増加するので、配線導体パターンの放熱性が向上し温度上昇による抵抗増加も抑制することができる。
【0038】
また、複数化した配線導体パターンの厚みは、単線部分の配線導体パターン部分よりも薄くするので、配線導体パターンの厚みの減少分だけ配線導体パターンを含むフレキシブル基板の曲げ剛性を小さくすることが出来る。曲げ剛性は厚みの三乗に比例して大きくなるので、配線導体パターンの厚みを少しでも薄くすることにより、配線導体パターンを含むフレキシブル基板全体の曲げ剛性は大きく減少させることができる。
【0039】
表1に示した諸寸法を持つ、本発明の配線構造を有する実施例1から4のフレキシブル基板を作製した。
実施例1から4は、配線導体パターンの断面積を変えずに配線導体パターンの分岐数を一つずつ増やしたフレキシブル基板を固定した磁気ヘッド用サスペンションである。実施例1では分岐数は2本、実施例2では3本、以下実施例3は4本、実施例4は5本である。比較例として、分岐しないものを載せている。
【0040】
比較例の表皮長に対し、分岐数を一つ増やす毎にサスペンション剛性部の合計表皮長は約20〜50%増加している。比較例に対し2分岐では70%の増加に過ぎないが4分岐では約3倍の表皮長にすることができた。
【0041】
【表1】

Figure 0004455698
【0042】
そして実施例及び比較例のフレキシブル基板について、周波数100MHzにおける配線導体パターン(スライダー側電極パッドを短絡した状態)の高周波領域での電気抵抗(以下、インピーダンスと言う)を、インピーダンス測定器を用い測定した結果を表2に示す。
【0043】
【表2】
Figure 0004455698
【0044】
周波数100MHzの高周波電流における比較例の配線導体パターンのインピーダンスは46Ωであり、実施例1では38Ω、実施例2では34Ω、実施例3では33Ωであり実施例4では32Ωであった。配線導体パターンの一部を2分岐することでフレキシブル基板のインピーダンスを約17%下げることができた。配線導体パターンの分岐数を増やして表皮長を大きくすることにより、インピーダンスが減少することが確認された。
【0045】
表1の比較例と実施例3の磁気ヘッド用サスペンションに、トラック幅1μmのGMR型磁気ヘッドスライダーを取付け、0.24x10(A/m)の保磁力を持つ磁気ディスクを用い、熱雑音の測定を行った。熱雑音と他の雑音とを区別することが難しいため、数値で表わす事は本明細書では避けるが、各々50個のヘッドの雑音を測定し統計的な処理を行い、実施例3の方が比較例に比べ熱により発生する雑音が少ない事は確認できた。
【0046】
配線導体パターンの分岐数を、増やすほどインピーダンスは減少するが、分岐数が6以上となるとフレキシブル基板の幅方向の寸法が大きくなり、サスペンションからはみ出すため好ましくない。また、フレキシブル基板の幅の増加を少なくするため、配線導体パターン間隔を詰めるとパターン間の絶縁不良の発生、線間容量の増加と好ましくない事項が増えるため、配線導体パターンの分岐数は5以下とすることが好ましいものである。
【0047】
【発明の効果】
各配線導体パターンの断面積を変えずに各配線導体パターンを分割し、かつ配線導体パターンの厚みを薄くした場合において、配線導体パターンの表皮長が増加し、表皮効果に伴う抵抗の増加を抑えることができる。また、配線導体パターンの放熱性が向上するため温度上昇による抵抗増加が抑えられ、配線導体パターンで発生する熱雑音の低減を図ることができた。また、フレキシブル基板の曲げ剛性が減少するため、サスペンションの縦方向に対する曲げ剛性に与える影響を少なくすることができた。
【図面の簡単な説明】
【図1】本願発明の一実施例の磁気ヘッド用サスペンション外観図
【図2】従来のフレキシブル基板を使用した磁気ヘッド用サスペンション外観図
【図3】本願発明のフレキシブル基板の模式断面図
【図4】従来のフレキシブル基板の模式断面図
【図5】表皮深さの周波数依存性のグラフ
【符号の説明】
101 本発明のHGA、102 サスペンション基部、
103 サスペンション、104 ジンバル、105 磁気ヘッドスライダー、
106 本発明のフレキシブル基板、107 外部用電極パッド、
108 サスペンションの剛性部、109 サスペンションの可撓性部、
201 従来の磁気ヘッド用スライダーサスペンション、
206 従来構造のフレキシブル基板、310 絶縁ベースフィルム、
311 411 再生信号用単線配線導体パターン、
312 再生信号用複数配線導体パターン、
313 413 書込信号用単線配線導体パターン、
314 書込信号用複数本配線導体パターン、
320 絶縁カバーフィルム、321 接着層、322 導体パターン分岐部[0001]
BACKGROUND OF THE INVENTION
The present invention, because of the high recording density of a magnetic disk device, the magnetic heads of fixing the flexible substrate having a wiring conductor pattern corresponding to the frequency of the write signal current and the reproduction signal current recording and reproducing separation type magnetic head It is related.
[0002]
[Prior art]
Due to the rapid development of computers, magnetic disk devices have been required to be smaller and have larger capacities. Inductive thin-film magnetic heads that use an inductive magnetic head with a thin-film coil for both recording and reproduction have been mainstream. However, the inductive thin-film magnetic head is used as a write-only head, and an MR element or GMR element with high reproduction sensitivity. Etc. have been changed to a recording / reproducing separated type magnetic head combining these.
[0003]
Conventionally, an insulating wire having a diameter of about several tens of μm has been used for connection between the magnetic head slider and an external circuit. After electrically and mechanically connecting the insulating wire from which the electrode pad of the magnetic head slider and the insulating material of the connecting portion are removed by ultrasonic bonding, the insulating wire is bent in a predetermined direction. The bent portion of the insulated wire has a loop shape, and the portion is called a service loop.
[0004]
Due to the delicate force applied when forming the above-described service loop, stress due to the bending rigidity of the insulating wire is applied to the magnetic head slider. Since the magnetic head slider has been reduced in weight (reduced in size), the rigidity of the gimbal portion to which the magnetic head slider of the suspension is bonded has been reduced accordingly. For this reason, the magnetic head slider easily deviates from the specified range of the roll and pitch at rest determined by the design by receiving a force from the insulating wire.
[0005]
In addition, as a trouble related to the insulation wire, carelessness when handling the suspension may cause the operator to cut the insulation wire with his fingers or tweezers used for handling, or to deform the service loop. Is mentioned.
[0006]
Insulation wire method has the above-mentioned problems, so one solution is to form a wiring conductor pattern by plating etc. on an insulating base film such as polyimide, and paste a surface protection film and use an adhesive. Integrated flexible substrates have come to be used in place of insulated wires.
[0007]
In order to cope with higher density recording of magnetic disk devices, the frequency of the write signal has increased. In recent years, the write head has been driven by a write signal having a frequency exceeding 200 MHz. Further, the writing frequency tends to be higher. As a result, the skin effect due to the write signal having an increased frequency becomes remarkable, and the substantial wiring resistance of the wiring conductor pattern has increased.
[0008]
An increase in the electrical resistance of the wiring conductor pattern leads to an increase in thermal noise in the reproduction signal. In addition, the rise of the current of the write signal becomes worse and the write signal is turned off before reaching the predetermined current value, which leads to a substantial decrease in the write current. As another problem, since a flexible substrate using polyimide film or the like is used as a wiring conductor pattern, the flexural rigidity of the flexible substrate affects the suspension for the magnetic head, and the load applied to the magnetic head slider varies. Is mentioned.
[0009]
Here, the skin effect mentioned above refers to a phenomenon in which a portion where current flows is limited to the surface layer of the conductor and does not enter the inside.
[0010]
The flexible substrate is fixed by avoiding the flexible portion of the suspension so that the flexible substrate does not affect the bending rigidity in the vertical direction of the suspension. However, since one end of the flexible substrate fixed to the suspension is always fixed to a circuit substrate or the like in the magnetic recording apparatus, it is difficult to completely eliminate the influence of the flexible substrate on the vertical bending rigidity of the suspension.
[0011]
Therefore, in order to solve the above-mentioned problems, the present invention increases the skin length in the direction perpendicular to the direction of the current flowing through the wiring conductor pattern by devising the shape and number of wiring conductor patterns of the flexible substrate fixed to the magnetic head suspension. In addition, the increase in the electrical resistance of the wiring conductor pattern due to the skin effect is suppressed. Here, the skin length refers to the entire outer peripheral length of the cross section of the wiring conductor pattern. At the same time, the bending rigidity in the vertical direction (direction perpendicular to the surface) of the flexible substrate is reduced.
[0012]
That is, the thermal noise that increases as the frequency of the write signal increases, suppresses the maximum write signal current capability of the wiring conductor pattern, and reduces the influence on the bending rigidity of the suspension. The purpose is to provide a password .
[0013]
[Means for Solving the Problems]
A first invention of the present application is a magnetic head including a suspension, a flexible substrate including a plurality of wiring conductor patterns, and a magnetic head slider.
The suspension includes a base portion, a tip portion, and a central portion between the base portion and the tip portion, and the magnetic head slider is supported by the suspension at the tip portion, and one end of the flexible substrate is attached to the one end of the flexible substrate. An electrode pad for a slider connected to the wiring conductor pattern is provided, and an external electrode pad for electrically connecting to an external circuit connected to the wiring conductor pattern is provided at the other end of the flexible substrate,
The flexible substrate is fixed to the suspension from the magnetic head slider side to the central portion of the suspension while the electrode pad for the slider is electrically connected to the magnetic head slider.
The wiring conductor pattern is formed of a plurality of wiring conductor patterns in which two or more single-wire wiring branches in the width direction of the flexible substrate from the slider electrode pad side to the external electrode pad side, A part on the electrode pad side or a part on the external electrode pad side at least a part on the slider electrode pad side is formed by the single line wiring, and the single line is near the tip of the suspension where the magnetic head slider is supported. A branch portion is provided that branches from the wiring into the plurality of wiring conductive patterns, and the plurality of wiring conductor patterns are provided on the entire flexible substrate fixed to a central portion of the suspension,
All the thicknesses of the plurality of wiring conductor patterns are formed thinner than the thickness of the wiring conductor pattern forming the single wire wiring portion, and each pattern width of the plurality of wiring conductor patterns is the pattern of the wiring conductor pattern forming the single wire wiring portion. Equal to the width, the total cross-sectional area of the plurality of wiring conductor patterns is equal to the cross-sectional area of the wiring conductor pattern forming the single-wire wiring portion, the flexural rigidity of the flexible substrate at the portion where the plurality of wiring conductor patterns are formed, The magnetic head is characterized in that it is smaller than the bending rigidity of the flexible substrate at the portion where the single wire wiring portion is formed.
[0014]
The first invention of the present application will be described with reference to FIGS. FIG. 1 is an external view of a magnetic head assembly (hereinafter referred to as HGA) 101 using a suspension for a magnetic head according to the present invention. FIG. 3 is an external view of a flexible substrate 106 having a wiring conductor pattern according to the present invention. It is a schematic diagram of the cross section of a flexible substrate when aa 'and bb' are made into a cutting line. Hereinafter, the same reference numerals are used for common parts in the drawings showing the HGA.
[0015]
FIG. 1 shows an HGA 101 to which a flexible substrate 106 having a wiring conductor pattern of the present invention is fixed. The HGA 101 includes main components such as a suspension 103, a flexible substrate 106, and a magnetic head slider 105. The HGA suspension 103 is provided with an appropriate load on a base 102 which is a part mechanically connected to a part (not shown) of an actuator device used for a seek operation provided in the magnetic disk device, and a magnetic head slider 105 to apply magnetic force. A rigid portion 108 having rigidity necessary for adjusting the flying height of the head slider and minimizing deformation of the suspension 103 due to lateral acceleration during a seek operation, and a flexible leaf spring And a gimbal (not shown to be positioned below the magnetic head slider 105) 104 that keeps the roll and pitch of the magnetic head slider constant.
[0016]
A flexible substrate 106 having a wiring conductor pattern formed by a plating technique, an etching technique, or the like is fixed to the suspension 103 with a resin or the like. One end of the flexible substrate 106 has an electrode pad portion connected to the wiring conductor pattern, and is electrically connected to the electrode pad of the magnetic head slider 105. The other end of the flexible substrate 106 has an external electrode pad portion 107 for electrical connection with an external circuit.
[0017]
FIG. 3 shows an appearance of the flexible substrate 106 shown in FIG. 1, and is a schematic diagram of a cross section of the flexible substrate 106 near the gimbal 104 (aa ′ cutting line) and a suspension central portion (bb ′ cutting line). The schematic diagram of the cross section of the flexible substrate 106 is represented.
[0018]
From the schematic diagram of the cross section of FIG. 3, the flexible substrate is an insulating base film 310 and a conductor pattern for wiring such as a pair of reproduction signal conductor patterns (311 and 312) and a pair of write signal conductor patterns (313 and 314). In addition, the insulating cover film 320 is laminated with the adhesive layer 321. For the sake of explanation, the conductor patterns for the reproduction signal and the write signal are specified by reference numerals, but may be changed depending on the arrangement of the electrode pads of the magnetic head slider.
[0019]
As is apparent from the schematic diagram of the cross section when aa ′ in the vicinity of the gimbal is taken as a cutting line, the wiring conductor pattern for the reproduction signal and the writing signal is a single line wiring. In the schematic view of the cross section, two cross sections of the reproduction signal conductor pattern 311 and the write signal conductor pattern 313 can be seen.
[0020]
The cross-sectional structure of the flexible substrate shown in FIG. 3 is a structure in which the wiring conductor pattern is sandwiched with an insulating film, but the wiring conductor pattern can be electrically insulated and protected against scratches and corrosion. If the structure is thin and flexible, another structure is not a problem. For example, a structure in which an insulating resin is applied extremely thinly on a wiring conductor pattern formed on an insulating film, or a structure in which the wiring conductor pattern is embedded and integrally formed when the insulating film is formed may be used.
[0021]
The wiring conductor pattern reaches the wiring conductor pattern branching portion 322 near the gimbal side of the suspension 103. One wiring conductor pattern is branched into two, and the thickness of the wiring conductor pattern branched into two is halved. . Therefore, even in the schematic cross-sectional view taken along the line bb ′ near the center of the load beam 103, each wiring conductor pattern is branched into two, so that the reproduction signal conductor pattern 312 in the double line portion and the writing in the double line portion are written. Four sectional cuts of the signal conductor pattern 314 can be seen.
[0022]
In the flexible substrate illustrated in FIGS. 1 and 3, each wiring conductor pattern is branched into two at the conductor pattern branching portion 322. There is no need to limit the number of branches to two, and two or more branches are acceptable. In that case, the thickness of the branched wiring conductor pattern is set to a thickness obtained by dividing the thickness of the wiring conductor pattern of the single-wire wiring portion by the number of branches, and the total cross-sectional area is kept constant. Moreover, although the wiring conductor pattern of the illustrated flexible substrate is a single-wire wiring only in the vicinity of the gimbal, the invention is not limited to this, and the external electrode pad side may be a single-wire wiring.
[0023]
By increasing the skin length of the wiring conductor pattern, the substantial wiring resistance of the wiring conductor pattern is increased by intensively flowing a portion within several μm from the surface of the wiring conductor pattern due to the skin effect of the high-frequency current. The current density in the vicinity of the surface of the wiring conductor pattern can be relaxed, and a substantial increase in wiring resistance can be suppressed. There are several methods for increasing the skin length of the wiring conductor pattern.
[0024]
A possible method is to change the width and thickness without changing the cross-sectional area of one wiring conductor pattern. However, there is a limit to the increase in the skin length only by changing the width and thickness. To increase the skin length further, the method of branching to several wires after reducing the thickness of one wiring conductor pattern. Was devised.
[0025]
For example, the skin length of 20 μm in length and width is 80 μm, but the skin length when divided into two in the vertical direction is 120 μm, which is 1.5 times. By dividing in this way, the skin length can be greatly increased without changing the cross-sectional area. However, when divided in the vertical direction, the thickness is the same as before the division, so the bending rigidity is the same. Therefore, the skin length can be increased by dividing in the horizontal direction and arranged in parallel, and the bending rigidity can be decreased by reducing the thickness.
[0026]
The second invention of the present application is the magnetic head suspension according to the first invention, wherein the thickness of the wiring conductor pattern of the plurality of wiring portions is a thickness obtained by dividing the thickness of the wiring conductor pattern of the single-wire wiring portion by the number of branches. This is a head suspension.
[0027]
When considering electric resistance in a high frequency region, it is necessary to increase the skin length as described above in order to reduce the wiring resistance of the wiring conductor pattern, but it is not necessary to increase the cross-sectional area. Increasing the thickness of the wiring conductor pattern to increase the skin length is not appropriate because it increases the bending rigidity (proportional to the cube of the thickness) of the entire flexible substrate. As a method of increasing only the skin length without increasing the flexural rigidity of the flexible board, a wiring conductor pattern consisting of multiple wiring paths with a thickness obtained by dividing the thickness of the wiring conductor pattern of the single-wire wiring section by the number of branches is used. The method of forming was reached.
[0028]
We proposed a method to increase the skin length of the wiring conductor pattern by increasing the number of divisions of the wiring conductor pattern and lower the electrical resistance in the high frequency region. However, by increasing the skin length, stray capacitance distributed around the wiring conductor pattern is also connected to the conductor wiring. It will increase depending on the surface area of the pattern. Since the resonance frequency of the magnetic head slider including the wiring conductor pattern is desirably at least twice the writing frequency, it is necessary to consider the number of branches of the wiring conductor pattern and the distance between the branched conductors. In addition, when the number of branches is increased, the thickness difference at the branch point becomes too large, so the number of branches is preferably 5 or less.
[0030]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described. FIG. 1 is an external view showing an embodiment of the present invention. A flexible substrate 106 having a wiring conductor pattern is fixed on the suspension 103 with resin or the like. Each wiring conductor pattern of the portion fixed in the vicinity of the gimbal 104 (not shown) is a single wire, and each wiring conductor pattern fixed to the suspension 103 is a plurality of wires branched into multiple wires. The thickness of the pattern was made smaller than the thickness of the wiring conductor pattern of the single-wire wiring portion, and the total cross-sectional area of the wiring conductor pattern of the plurality of wiring portions was substantially equal to the cross-sectional area of the conductor pattern of the single-wire wiring portion.
[0031]
For comparison, a difference in structure of the slider suspension 201 for a magnetic head provided with the flexible substrate 206 having the conventional structure illustrated in FIGS. 2 and 4 is different from that of the invention example shown in FIGS.
[0032]
When the flexible substrate 206 having the conventional structure shown in FIG. 2 and the flexible substrate 106 described in the embodiment of the present invention are compared, the wiring substrate pattern shown in FIG. There is no portion corresponding to the branching portion 322, and each reproduction / writing signal wiring is a single wiring, and the thickness is constant over the entire length of the wiring conductor pattern.
[0033]
The magnitude of the skin effect is determined by μ (magnetic permeability) and ρ (specific resistance) of the conductor and the frequency f of the high-frequency current flowing through the conductor. The skin effect causes high-frequency current to flow concentrated on the conductor surface.
[0034]
Looking at the current distribution in the cross section perpendicular to the direction of current flow through the conductor, the current density decreases exponentially in the depth direction (center direction). The depth at which the current density on the conductor surface is 1 / e (about 0.368) times is called the skin depth S, and the skin depth S is obtained from the first equation.
S = 1 / (2πfμ / ρ) 1/2 ... Formula 1
A graph showing the result of calculating how the skin depth S changes depending on the frequency f of the current flowing through the conductor when oxygen-free electrolytic copper (specific resistance ρ = 1.673 μΩ · cm) is used as the conductor. As shown in FIG. As can be seen from FIG. 5, when the current frequency is about 60 Mhz or more, the skin depth S is 1 μm or less. The number that the skin depth S when the frequency is 60 MHz or more is 1 μm or less is considerably smaller than the thickness of several tens of μm of the wiring conductor of a general flexible substrate. In this case, the current hardly flows at the center of the pattern, but flows near the conductor surface, so that an increase in the electrical resistance of the wiring conductor pattern due to the skin effect appears remarkably.
[0036]
The conventional magnetic head slider suspension 201 shown in FIGS. 2 and 4 has a skin length smaller than that of the wiring pattern of the present invention shown in FIGS. Yes. When the frequency of the write signal current flowing through the wiring conductor pattern is 100 MHz, the wiring conductor pattern material is oxygen-free copper, and calculation is performed using the above-described first formula, the skin depth is only about 0.7 μm. Thus, reducing the thickness of the wiring conductor pattern and increasing the skin length by branching as in the present invention is effective in reducing the electrical resistance in the high frequency region.
[0037]
In the embodiment of the present invention shown in FIGS. 1 and 3, the skin length of the wiring conductor pattern is increased by reducing the thickness without changing the cross-sectional area of the wiring conductor pattern and making the wiring conductor patterns plural. I can do it. For this reason, it is possible to suppress a substantial increase in wiring resistance in the high frequency region due to the skin effect. Further, since the surface area of the wiring conductor pattern also increases, the heat dissipation of the wiring conductor pattern is improved, and an increase in resistance due to a temperature rise can be suppressed.
[0038]
Further, since the thickness of the plurality of wiring conductor patterns is made thinner than the wiring conductor pattern portion of the single line portion, the bending rigidity of the flexible substrate including the wiring conductor pattern can be reduced by the reduction in the thickness of the wiring conductor pattern. . Since the bending rigidity increases in proportion to the cube of the thickness, the bending rigidity of the entire flexible substrate including the wiring conductor pattern can be greatly reduced by reducing the thickness of the wiring conductor pattern as much as possible.
[0039]
The flexible substrates of Examples 1 to 4 having the wiring structures of the present invention having various dimensions shown in Table 1 were produced.
Examples 1 to 4 are suspensions for a magnetic head in which a flexible substrate in which the number of branches of a wiring conductor pattern is increased by one without changing the cross-sectional area of the wiring conductor pattern is fixed. In the first embodiment, the number of branches is two, three in the second embodiment, four in the third embodiment, and five in the fourth embodiment. As a comparative example, an unbranched one is shown.
[0040]
With respect to the skin length of the comparative example, the total skin length of the suspension rigid portion increases by about 20 to 50% every time the number of branches is increased by one. In contrast to the comparative example, the increase in the branch length was only 70%, but in the case of the four branch length, the skin length was about three times as long.
[0041]
[Table 1]
Figure 0004455698
[0042]
And about the flexible substrate of an Example and a comparative example, the electrical resistance (henceforth impedance) in the high frequency area | region of the wiring conductor pattern (state which shorted the slider side electrode pad) in frequency 100MHz was measured using the impedance measuring device. The results are shown in Table 2.
[0043]
[Table 2]
Figure 0004455698
[0044]
The impedance of the wiring conductor pattern of the comparative example at a high frequency current of 100 MHz was 46Ω, 38Ω in Example 1, 34Ω in Example 2, 33Ω in Example 3, and 32Ω in Example 4. By branching a part of the wiring conductor pattern into two, the impedance of the flexible substrate could be reduced by about 17%. It was confirmed that the impedance decreased by increasing the number of branches of the wiring conductor pattern and increasing the skin length.
[0045]
A GMR magnetic head slider with a track width of 1 μm is attached to the magnetic head suspension of the comparative example of Table 1 and Example 3, and a magnetic disk having a coercive force of 0.24 × 10 6 (A / m) is used. Measurements were made. Since it is difficult to distinguish between thermal noise and other noises, numerical values are avoided in this specification. However, the noise of 50 heads is measured and statistically processed, and the third embodiment is more effective. It was confirmed that there was less noise generated by heat compared to the comparative example.
[0046]
As the number of branches of the wiring conductor pattern is increased, the impedance is reduced. However, when the number of branches is 6 or more, the dimension in the width direction of the flexible substrate is increased and it is not preferable because it protrudes from the suspension. Further, if the spacing between the wiring conductor patterns is reduced in order to reduce the increase in the width of the flexible substrate, the number of branches of the wiring conductor pattern is 5 or less because the occurrence of defective insulation between the patterns and the increase in the capacitance between the lines increase. Is preferable.
[0047]
【The invention's effect】
When each wiring conductor pattern is divided without changing the cross-sectional area of each wiring conductor pattern and the thickness of the wiring conductor pattern is reduced, the skin length of the wiring conductor pattern increases and the increase in resistance due to the skin effect is suppressed. be able to. Further, since the heat dissipation of the wiring conductor pattern is improved, an increase in resistance due to a temperature rise can be suppressed, and thermal noise generated in the wiring conductor pattern can be reduced. Further, since the bending rigidity of the flexible substrate is reduced, the influence on the bending rigidity in the longitudinal direction of the suspension can be reduced.
[Brief description of the drawings]
1 is an external view of a suspension for a magnetic head according to an embodiment of the present invention. FIG. 2 is an external view of a suspension for a magnetic head using a conventional flexible substrate. FIG. 3 is a schematic cross-sectional view of the flexible substrate of the present invention. ] Schematic cross section of a conventional flexible substrate [Fig. 5] Graph of frequency dependence of skin depth [Explanation of symbols]
101 HGA of the present invention, 102 suspension base,
103 suspension, 104 gimbal, 105 magnetic head slider,
106 flexible substrate of the present invention, 107 external electrode pad,
108 Rigid part of suspension, 109 Flexible part of suspension,
201 A slider suspension for a conventional magnetic head,
206 flexible substrate of conventional structure, 310 insulating base film,
311 411 Reproduction signal single wire wiring conductor pattern,
312 A multiple wiring conductor pattern for reproduction signal,
313 413 Single-line wiring conductor pattern for write signal,
314 Multiple wiring conductor patterns for write signals;
320 Insulating cover film, 321 Adhesive layer, 322 Conductor pattern branch

Claims (1)

サスペンションと、複数の配線導体パターンを備えているフレキシブル基板と、磁気ヘッドスライダーとを備えた磁気ヘッドにおいて、
前記サスペンションは、基部と先端部と前記基部と前記先端部との間の中央部とで構成され、前記磁気ヘッドスライダーは前記先端部にて前記サスペンションに支持され、前記フレキシブル基板の一端には前記配線導体パターンに繋がれるスライダー用電極パッドが設けられ、前記フレキシブル基板の他端には前記配線導体パターンに繋がれる外部回路と電気的に接続するための外部用電極パッドが設けられ、
前記フレキシブル基板は、前記スライダー用電極パッドが前記磁気ヘッドスライダーと電気的に接続されるとともに、前記磁気ヘッドスライダー側から前記サスペンションの中央部にかけて前記サスペンションに固定されており、
前記配線導体パターンは、前記スライダー用電極パッド側から外部用電極パッド側にかけて、単線配線が前記フレキシブル基板の幅方向に2本又は2本以上で分岐した複数配線導体パターンで形成され、前記スライダー用電極パッド側の一部分又は前記外部用電極パッド側の一部分の少なくとも前記スライダー用電極パッド側の一部分が前記単線配線で形成され、前記磁気ヘッドスライダーが支持される前記サスペンションの先端部近辺にて前記単線配線から前記複数配線導電パターンに分岐する分岐部が設けられており、前記複数配線導体パターンは、前記サスペンションの中央部に固定される前記フレキシブル基板の全体に設けられ、
前記複数配線導体パターンの厚みは全て、単線配線部を形成する配線導体パターンの厚みよりも薄く形成され、前記複数配線導体パターンの各パターン幅は、前記単線配線部を形成する配線導体パターンのパターン幅に等しく、前記複数配線導体パターンの全断面積は、前記単線配線部を形成する配線導体パターンの断面積に等しく、前記複数配線導体パターンが形成された部分でのフレキシブル基板の曲げ剛性が、前記単線配線部が形成された部分でのフレキシブル基板の曲げ剛性よりも小さくされていることを特徴とする磁気ヘッド。
In a magnetic head including a suspension, a flexible substrate having a plurality of wiring conductor patterns, and a magnetic head slider,
The suspension includes a base portion, a tip portion, and a central portion between the base portion and the tip portion, the magnetic head slider is supported by the suspension at the tip portion, and one end of the flexible substrate An electrode pad for a slider connected to the wiring conductor pattern is provided, and an external electrode pad for electrically connecting to an external circuit connected to the wiring conductor pattern is provided at the other end of the flexible substrate,
The flexible substrate is fixed to the suspension from the magnetic head slider side to the central portion of the suspension while the electrode pad for the slider is electrically connected to the magnetic head slider.
The wiring conductor pattern is formed of a plurality of wiring conductor patterns in which two or more single-wire wiring branches in the width direction of the flexible substrate from the slider electrode pad side to the external electrode pad side, A part on the electrode pad side or a part on the external electrode pad side at least a part on the slider electrode pad side is formed by the single line wiring, and the single line is near the tip of the suspension where the magnetic head slider is supported. A branching portion that branches from the wiring into the plurality of wiring conductive patterns is provided, and the plurality of wiring conductor patterns are provided on the entire flexible substrate fixed to a central portion of the suspension,
All the thicknesses of the plurality of wiring conductor patterns are formed thinner than the thickness of the wiring conductor pattern forming the single wire wiring portion, and each pattern width of the plurality of wiring conductor patterns is the pattern of the wiring conductor pattern forming the single wire wiring portion. Equal to the width, the total cross-sectional area of the plurality of wiring conductor patterns is equal to the cross-sectional area of the wiring conductor pattern forming the single-wire wiring portion, the flexural rigidity of the flexible substrate at the portion where the plurality of wiring conductor patterns are formed, A magnetic head characterized in that it is smaller than the bending rigidity of a flexible substrate at a portion where the single wire wiring portion is formed.
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