US7352535B2 - Method and apparatus for reducing crosstalk and signal loss in flexing interconnects of an electrical lead suspension - Google Patents
Method and apparatus for reducing crosstalk and signal loss in flexing interconnects of an electrical lead suspension Download PDFInfo
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- US7352535B2 US7352535B2 US11/035,429 US3542905A US7352535B2 US 7352535 B2 US7352535 B2 US 7352535B2 US 3542905 A US3542905 A US 3542905A US 7352535 B2 US7352535 B2 US 7352535B2
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- 238000012546 transfer Methods 0.000 description 4
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/486—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/484—Integrated arm assemblies, e.g. formed by material deposition or by etching from single piece of metal or by lamination of materials forming a single arm/suspension/head unit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09263—Meander
Definitions
- Embodiments of the present invention relate to the field of electrical interconnect, and more particularly to an apparatus and method for reducing crosstalk and signal loss in flexing interconnects of an integrated lead suspension used in hard disk drives.
- An electrical lead suspension used in a Data Access Storage Device (DASD), e.g., a hard disk drive (HDD), comprises flexing interconnect that is typically formed of a laminate comprised of at least three layers of material. These laminate layers may include a signal-conductor layer from which signal traces are formed, a dielectric layer, e.g., polyimide, for insulation and support for the signal-conductor layer, and a conductive base-metal layer to provide support for the dielectric layer.
- the flexing interconnect spans a hinge area of the ELS where a load beam attaches to a mount plate.
- An ELS may be formed by a subtractive process, such as, e.g.
- an Integrated Lead Suspension ILS
- an additive process such as, e.g., a Circuit Integrated suspension (CIS) or as a Flex-On Suspension (FOS) when the FOS is attached to a base metal layer, or it may be a Flex Gimbal Suspension Assembly (FGSA) that is attached to a base metal layer, or any form of lead suspension used in a DASD.
- CIS Circuit Integrated suspension
- FOS Flex-On Suspension
- FGSA Flex Gimbal Suspension Assembly
- FIG. 1 is a top plan view 100 of a portion of a flexing interconnect having write traces 120 and read traces 130 , formed of the signal-conductor layer of a laminate and supported by dielectric layer 140 and a single serpentine pattern 110 , formed of the base-metal layer of the laminate, according to an embodiment of the conventional art.
- the supporting base-metal layer is, according to conventional art, in the form of serpentine pattern 110 .
- portions of the base-metal layer are removed so as to allow for flexibility in the hinge area to allow the head to fly properly, while providing a necessary amount of mechanical stiffness for supporting the signal traces 120 and 130 that are the read and write traces.
- serpentine pattern 110 can provide the appropriate mechanical stiffness
- the connecting serpentine pattern underneath the write and read traces 120 and 130 results in write-to-read crosstalk that degrades the performance of the read sensor.
- a large write driver voltage produces a large current in the write traces 120 , in turn, write current induces currents in read traces 130 through serpentine base-metal layer 110 resulting in crosstalk between write and read traces.
- the read traces 130 connect to a very voltage-sensitive read sensor.
- Embodiments of the present invention include a method and apparatus for reducing crosstalk and signal loss in an electrical interconnect.
- the electrical interconnect includes a laminate.
- a plurality of signal traces and a subsequent plurality of traces are in a first formed layer of the laminate.
- the subsequent plurality of traces may be signal traces or power traces.
- the laminate has a dielectric layer between the first formed layer and a second formed layer.
- a plurality of serpentine patterns are in the second formed layer of the laminate.
- the plurality of serpentine patterns is separated from subsequent patterns.
- the plurality of serpentine patterns supports the plurality of signal traces and the subsequent plurality of patterns supports the subsequent plurality of traces.
- the supporting of the plurality of signal traces separate from the subsequent plurality of traces reduces write-to-read crosstalk and signal loss.
- FIG. 1 is a top plan view of a portion of a flexing interconnect having read and write traces and a single serpentine pattern electrically separated by an dielectric layer, according to an embodiment of the conventional art.
- FIG. 2 is a schematic top plan view of a hard disk drive, in accordance with one embodiment of the present invention.
- FIG. 3 is a top plan view of an ELS having a flexing interconnect, according to one embodiment of the present invention.
- FIG. 4 is a top view of a portion of a flexing interconnect having read and write traces supported individually by a first serpentine pattern and a second serpentine pattern, respectively, of a dual serpentine pattern flexing interconnect support, in accordance with one embodiment of the present invention.
- FIG. 5 is a bottom plan view of an ELS showing a dual serpentine pattern support as it traverses the hinge area of an ELS, in accordance with an embodiment of the present invention.
- FIG. 6 is a top plan view of an ELS showing read and write traces that are supported by a dual serpentine pattern in at least the hinge area of the ELS, in accordance with an embodiment of the present invention.
- FIG. 7 is a flow diagram of a method for obtaining low crosstalk and signal loss in a flexing interconnect, in accordance with one embodiment of the present invention.
- FIG. 8 is a top view of signal traces over a section of the dual serpentine base metal layer separated by a dielectric layer, in accordance with one embodiment of the present invention.
- FIGS. 9 is a physical-electrical schematic of the ELS with the read and write electrical connections, in accordance with one embodiment of the present invention.
- FIG. 10 is a graphical representation of the crosstalk improvement from the prior art single serpentine designs, in accordance with one embodiment of the present invention.
- FIG. 11 is a graphical representation of voltage transfer differences between the dual serpentine ELS of the present embodiment and an ELS with no air gaps, in accordance with one embodiment of the present invention.
- FIG. 2 is a schematic drawing of one embodiment of an information storage system comprising a magnetic hard disk file or drive 111 for a computer system is shown.
- Drive 111 has an outer housing or base 113 containing a disk pack having at least one media or magnetic disk 115 .
- the disk or disks 115 are rotated by a spindle motor assembly having a central drive hub 117 .
- An actuator 121 comprises a plurality of parallel actuator arms 125 (one shown) in the form of a comb that is movably or pivotally mounted to base 113 about a pivot assembly 123 .
- a controller 119 is also mounted to base 113 for selectively moving the comb of arms 125 relative to disk 115 .
- each arm 125 has extending from it at least one cantilevered load beam and electrical lead suspension (ELS) 127 .
- ELS 127 may be, in one embodiment, an integrated lead suspension (ILS) that is formed by a subtractive process.
- ELS 127 may be formed by an additive process, such as a Circuit Integrated Suspension (CIS).
- CIS Circuit Integrated Suspension
- ELS 127 may be a Flex-On Suspension (FOS) attached to base metal or it may be a Flex Gimbal Suspension Assembly (FGSA) that is attached to a base metal layer.
- the ELS may be any form of lead suspension that can be used in a Data Access Storage Device, such as a HDD.
- a magnetic read/write transducer or head is mounted on a slider 129 and secured to a flexure that is flexibly mounted to each ELS 127 .
- the read/write heads magnetically read data from and/or magnetically write data to disk 115 .
- the level of integration called the head gimbal assembly is the head and the slider 129 , which are mounted on ELS 127 .
- the slider 129 is usually bonded to the end of ELS 127 .
- ELS 127 has a spring-like quality, which biases or presses the air-bearing surface of the slider 129 against the disk 115 to cause the slider 129 to fly at a precise distance from the disk.
- ELS 127 has a hinge area that provides for the spring-like quality, and a flexing interconnect (or flexing interconnect) that supports read and write traces through the hinge area.
- a voice coil 133 free to move within a conventional voice coil motor magnet assembly 134 (top pole not shown), is also mounted to arms 125 opposite the head gimbal assemblies.
- Movement of the actuator 121 (indicated by arrow 135 ) by controller 119 causes the head gimbal assemblies to move along radial arcs across tracks on the disk 115 until the heads settle on their set target tracks.
- the head gimbal assemblies operate in a conventional manner and always move in unison with one another, unless drive 111 uses multiple independent actuators (not shown) wherein the arms can move independently of one another.
- embodiments of the present invention are described in the context of an ELS in an information storage system, it should be understood that embodiments may apply to any device utilizing an electrical interconnect that might experience signal loss and crosstalk between signal traces.
- embodiments of the present invention may apply to rigid printed circuit boards. More specifically, embodiments of the present invention may be used in printed circuit boards that are used for high speed signal processing.
- Embodiments of the present invention are also suitable for use in flexing circuits, e.g., flexing circuits for digital cameras and digital camcorders.
- the signal traces may also be replaced with power traces according to one embodiment.
- FIG. 3 is a top plan view of an ELS 127 having a flexing interconnect 300 , according to one embodiment of the present invention.
- the read and write traces, 120 and 130 pass through the hinge center 370 of ELS 127 , where loadbeam 340 connects, via hinge plate 350 , to mount plate 360 , according to one embodiment of the present invention.
- Slider 129 resides toward the end of ELS 127 , and contains the read/write head. Slider 129 is bonded to read and write traces 120 and 130 , where read and write signals are carried to and from the read/write head.
- Flexing interconnect 300 of ELS 127 can be formed of a laminate that is, according to one embodiment, of at least three layers of materials.
- a signal-conductor layer may be a highly conductive metal, e.g., copper, from which the read and write traces 120 and 130 are formed.
- a middle layer 320 can be an insulating dielectric layer, e.g., polyimide, separating the top layer from which write and read traces 120 and 130 are formed of a base metal layer 310 , such as stainless steel, from which serpentine patterns are formed.
- FIG. 4 is a top view of a portion 400 of a flexing interconnect, e.g. flexing interconnect 300 of FIG. 3 , having write traces 120 and read traces 130 formed of the signal-conductor layer supported individually by dielectric layer 140 , and then a first serpentine pattern 410 a and a second serpentine pattern 410 b , respectively, of a dual serpentine pattern of the flexing interconnect support formed of a base-metal layer, in accordance with one embodiment of the present invention.
- a flexing interconnect e.g. flexing interconnect 300 of FIG. 3
- first serpentine pattern 410 a and a second serpentine pattern 410 b respectively, of a dual serpentine pattern of the flexing interconnect support formed of a base-metal layer, in accordance with one embodiment of the present invention.
- the portion 400 of flexing interconnect of FIG. 4 comprises a laminate for supporting attached devices, according to one embodiment of the present invention.
- a plurality of read traces 130 are formed of the signal-conductor layer, according to one embodiment, as are a plurality of write traces 120 .
- Dual serpentine patterns 40 a and 410 b are formed of a layer, e.g., base-metal layer 310 of FIG. 3 , of the laminate.
- a first dual serpentine pattern 410 a is separated from a second dual serpentine pattern 410 b .
- the first dual serpentine pattern 410 a supports the plurality of write traces 120 and the second dual serpentine pattern supports the plurality of read traces 130 above at least a hinge area, e.g., hinge area 370 of ELS 127 .
- the dual serpentine pattern supporting the plurality of write traces 120 separate from the plurality of read traces 130 reduces write-to-read crosstalk and signal loss.
- the layered laminate from which the flexing interconnect 300 is formed comprises at least a signal-conductor layer, e.g. copper alloy, a dielectric layer, e.g. polyimide, and a base-metal layer, e.g. stainless steel.
- the dielectric layer is sandwiched between the signal-conductor layer and the base-metal layer to form a laminate.
- the plurality of read traces 130 and the plurality of write traces 120 can be formed of the layer of signal-conductor layer.
- copper alloy is specified herein, it should be understood that any material having high electrical conductivity, from which write traces 120 and read traces 130 can be formed, may be substituted for the copper alloy.
- the dielectric layer can be any dielectric that would be appropriate for insulating the read and write traces from the supporting base-metal layer.
- the dual serpentine patterns 410 a and 410 b are formed of the base-metal layer, according to one embodiment.
- This layer may be stainless steel, or it may be any base metal that would have the appropriate mechanical stiffness, electrical characteristics and manufacturability needed. Refer to FIG. 8 for further details of the electrical characteristics.
- the mechanical stiffness of flexing interconnect 300 , and portion 400 thereof of FIG. 4 is also affected by the period and the geometry of the serpentine patterns 410 a and 410 b .
- the geometries of at least one pattern 410 a or 410 b of dual serpentine patterns 410 a and 410 b are alterable to achieve a predefined mechanical stiffness. A compromise may be reached to achieve both an acceptable mechanical stiffness and characteristic impedance for signal traces.
- FIG. 5 is a bottom plan view 500 of an ELS 127 showing dual serpentine pattern supports 410 a and 410 b as they traverse the center of hinge area 370 and onto hinge plate 350 of ELS 127 , in accordance with an embodiment of the present invention.
- FIG. 6 is a top plan view of an ELS 127 showing flexing interconnect 300 with read traces 130 and write traces 120 , that have a base-metal layer with dual serpentine patterns 410 a and 410 b of FIG. 5 , in at least the hinge area B 1 -B 2 of the ILS 127 , in accordance with an embodiment of the present invention.
- write traces 120 and read traces 130 may be supported by dual serpentine patterns 410 a and 410 b anywhere along the flexing interconnect 300 of ELS 127 , e.g., A 1 -A 2 .
- FIG. 7 is a flow diagram of a method 700 for obtaining low crosstalk and signal loss in a flexing interconnect (e.g. flexing interconnect 300 of FIG. 3 ), in accordance with one embodiment of the present invention.
- a laminate is provided in the flexing interconnect for an ELS (e.g., ELS 127 of FIG. 2 ).
- the laminate according to one embodiment, has at least a signal-conductor layer, a dielectric layer and a base-metal layer. The dielectric layer resides between the signal-conductor layer and the base-metal layer.
- a plurality of read traces are supported above a first serpentine pattern of dual serpentine patterns above at least a hinged area of an ILS, the first serpentine pattern being formed of the base-metal layer of the laminate in accordance with defined air gap to base metal dimension ratio, K.
- the plurality of read traces are, according to one embodiment, formed of a signal-conductor layer.
- a plurality of write traces are supported above a second serpentine pattern of the dual serpentine patterns above said at least the hinged area of the ELS.
- the second serpentine pattern is formed of the base-metal layer of the laminate in accordance with defined air gap to base metal dimension ratio, K.
- the plurality of write traces are, according to one embodiment, formed of a signal-conductor layer.
- the second serpentine pattern is separated from the first serpentine pattern, thus separating the plurality of read traces from the plurality of write traces. The separated nature of the plurality of write traces and the plurality of read traces reduces write-to-read crosstalk.
- FIG. 8 is a top view 800 of signal traces 801 (e.g. read or write traces), in accordance with an embodiment of the present invention, where x1 is the periodic width of the air gaps 803 and 804 , and x2 is the periodic width of the base-metal layer 802 .
- the characteristic impedance of the signal traces is determined by the ratio K, the signal trace widths, and the cross-section dimensions of the laminate layers. Therefore, the required characteristic impedance can be achieved by proper design of K, signal trace width(s), and the cross-section geometry.
- FIG. 9 is a physical-electrical schematic 900 of the read and write traces 901 (read 1, 2 and write 3, 4) over the dual serpentine base metal 902 , in accordance with an embodiment of the present invention.
- the crosstalk source is the write driver, 906 , and the write signals propagate to the write element 910 through the ELS 907 .
- the read amplifier, 905 receives the signal from the read element 909 .
- the crosstalk injection voltage (Vw) is measured across at 904
- far-end crosstalk voltage (Vr) is measured across at 903 .
- the physical separation of the dual serpentine, for the read and write traces reduces the mutual couple terms 911 (C m and L m ).
- FIG. 10 is a graphical representation of the crosstalk improvement from the prior art single serpentine designs, according to one embodiment.
- Dotted line 1020 represents the read-to-write crosstalk in dB in the prior art as a function of frequency and solid line 1010 represents the read-to-write crosstalk in dB in the present embodiment of a dual serpentine ELS 907 as a function of the same frequencies.
- the alternating air gap and base metal for the required characteristic impedance, reduces the signal loss through the ELS 907 with a lossy (low conductive) base-metal layer.
- Solid line 1110 represents the voltage transfer loss in dB in the dual serpentine ELS as a function of frequency and the dotted line 1120 represents the voltage transfer loss in the prior art. Also, by altering the geometry of at least one of the dual serpentine patterns, a predefined mechanical stiffness can be achieved.
- the present invention provides, in various embodiments, a method and apparatus reducing crosstalk and signal loss in flexing interconnects in an ELS.
- embodiments of the present invention are described in the context of an ELS in an information storage system, it should be understood that embodiments may apply to any device utilizing an electrical interconnect that might experience signal loss and crosstalk between signal traces.
- embodiments of the present invention may apply to rigid printed circuit boards. More specifically, embodiments of the present invention may be used in printed circuit boards that are used for high speed signal processing.
- Embodiments of the present invention are also suitable for use in flexing circuits, e.g., flexing circuits for digital cameras and digital camcorders.
- the signal traces may be replaced with power traces.
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Priority Applications (2)
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US11/035,429 US7352535B2 (en) | 2005-01-13 | 2005-01-13 | Method and apparatus for reducing crosstalk and signal loss in flexing interconnects of an electrical lead suspension |
CN2005101361987A CN1838250B (en) | 2005-01-13 | 2005-12-20 | Method and apparatus for reducing crosstalk and signal loss in flexing interconnects of an electrical lead suspension |
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US11/035,429 US7352535B2 (en) | 2005-01-13 | 2005-01-13 | Method and apparatus for reducing crosstalk and signal loss in flexing interconnects of an electrical lead suspension |
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US7352535B2 true US7352535B2 (en) | 2008-04-01 |
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US11/035,429 Active 2026-05-08 US7352535B2 (en) | 2005-01-13 | 2005-01-13 | Method and apparatus for reducing crosstalk and signal loss in flexing interconnects of an electrical lead suspension |
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US20090230117A1 (en) * | 2008-03-14 | 2009-09-17 | Philip Morris Usa Inc. | Electrically heated aerosol generating system and method |
US20100007993A1 (en) * | 2008-07-14 | 2010-01-14 | Hitachi Global Storage Technologies Netherlands B.V. | Integrated lead suspension with multiple crossover coplanar connection of the electrically conductive traces |
US20100155457A1 (en) * | 2008-12-23 | 2010-06-24 | Edgar Rothenberg | Reducing a generation of contaminants during a solder reflow process |
US20110141626A1 (en) * | 2009-12-10 | 2011-06-16 | Hitachi Global Storage Technologies Netherlands B.V. | Magnetic recording disk drive with integrated lead suspension having multiple segments for optimal characteristic impedance |
US20110149441A1 (en) * | 2009-12-18 | 2011-06-23 | Hitachi Global Storage Technologies Netherlands B.V. | Magnetic recording disk drive with write driver to write head transmission line having non-uniform sections for optimal write current pulse overshoot |
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Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5687479A (en) | 1994-04-15 | 1997-11-18 | Hutchinson Technology Incorporated | Electrical trace interconnect assembly |
US5699212A (en) | 1996-05-01 | 1997-12-16 | International Business Machines Corporation | Method of electrostatic discharge protection of magnetic heads in a magnetic storage system |
US5805382A (en) | 1996-06-21 | 1998-09-08 | International Business Machines Corporation | Integrated conductor magnetic recording head and suspension having cross-over integrated circuits for noise reduction |
US5933293A (en) * | 1997-06-25 | 1999-08-03 | Hutchinson Technology, Inc. | Head suspension load beam having a low profile integrated flexure |
JP2000231710A (en) | 1998-12-10 | 2000-08-22 | Suncall Corp | Wiring incorporated type flexure and manufacture thereof |
US6125015A (en) | 1998-12-04 | 2000-09-26 | Read-Rite Corporation | Head gimbal assembly with low stiffness flex circuit and ESD Protection |
US6249404B1 (en) | 1999-02-04 | 2001-06-19 | Read-Rite Corporation | Head gimbal assembly with a flexible printed circuit having a serpentine substrate |
US6278585B1 (en) * | 1999-04-19 | 2001-08-21 | International Business Machines Corporation | Transducer suspension termination system |
US6282064B1 (en) | 1994-03-15 | 2001-08-28 | International Business Machines Corporation | Head gimbal assembly with integrated electrical conductors |
JP2002170215A (en) | 2000-11-30 | 2002-06-14 | Nec Corp | Magnetic recording head gimbals assembly |
US20020181156A1 (en) * | 2001-02-27 | 2002-12-05 | Tdk Corporation | Head gimbal assembly |
US6493190B1 (en) * | 2000-08-16 | 2002-12-10 | Magnecomp Corporation | Trace flexure with controlled impedance |
JP2003272119A (en) | 2002-03-15 | 2003-09-26 | Tdk Corp | Wiring member, suspension, and head gimbal assembly |
US20040066585A1 (en) | 2002-10-07 | 2004-04-08 | International Business Machines Corporation | Dual stage suspension with PZT actuators |
US20040070884A1 (en) | 2002-10-09 | 2004-04-15 | Nhk Spring Co., Ltd. | Disc drive suspension |
US6762913B1 (en) * | 2001-04-16 | 2004-07-13 | Hutchinson Technology Inc. | Method for controlling common mode impedance in disk drive head suspensions |
US6785094B2 (en) * | 2002-04-24 | 2004-08-31 | Hitachi Global Storage Technologies | Weld free high performance laminate suspension |
US6801402B1 (en) * | 2002-10-31 | 2004-10-05 | Western Digital Technologies, Inc. | ESD-protected head gimbal assembly for use in a disk drive |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6262868B1 (en) * | 1997-12-30 | 2001-07-17 | International Business Machines Corporation | Method and structures used for connecting recording head signal wires in a microactuator |
-
2005
- 2005-01-13 US US11/035,429 patent/US7352535B2/en active Active
- 2005-12-20 CN CN2005101361987A patent/CN1838250B/en active Active
Patent Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6282064B1 (en) | 1994-03-15 | 2001-08-28 | International Business Machines Corporation | Head gimbal assembly with integrated electrical conductors |
US5687479A (en) | 1994-04-15 | 1997-11-18 | Hutchinson Technology Incorporated | Electrical trace interconnect assembly |
US5699212A (en) | 1996-05-01 | 1997-12-16 | International Business Machines Corporation | Method of electrostatic discharge protection of magnetic heads in a magnetic storage system |
US5805382A (en) | 1996-06-21 | 1998-09-08 | International Business Machines Corporation | Integrated conductor magnetic recording head and suspension having cross-over integrated circuits for noise reduction |
US5933293A (en) * | 1997-06-25 | 1999-08-03 | Hutchinson Technology, Inc. | Head suspension load beam having a low profile integrated flexure |
US6125015A (en) | 1998-12-04 | 2000-09-26 | Read-Rite Corporation | Head gimbal assembly with low stiffness flex circuit and ESD Protection |
JP2000231710A (en) | 1998-12-10 | 2000-08-22 | Suncall Corp | Wiring incorporated type flexure and manufacture thereof |
US6249404B1 (en) | 1999-02-04 | 2001-06-19 | Read-Rite Corporation | Head gimbal assembly with a flexible printed circuit having a serpentine substrate |
US6278585B1 (en) * | 1999-04-19 | 2001-08-21 | International Business Machines Corporation | Transducer suspension termination system |
US6493190B1 (en) * | 2000-08-16 | 2002-12-10 | Magnecomp Corporation | Trace flexure with controlled impedance |
JP2002170215A (en) | 2000-11-30 | 2002-06-14 | Nec Corp | Magnetic recording head gimbals assembly |
US20020181156A1 (en) * | 2001-02-27 | 2002-12-05 | Tdk Corporation | Head gimbal assembly |
US6762913B1 (en) * | 2001-04-16 | 2004-07-13 | Hutchinson Technology Inc. | Method for controlling common mode impedance in disk drive head suspensions |
JP2003272119A (en) | 2002-03-15 | 2003-09-26 | Tdk Corp | Wiring member, suspension, and head gimbal assembly |
US6785094B2 (en) * | 2002-04-24 | 2004-08-31 | Hitachi Global Storage Technologies | Weld free high performance laminate suspension |
US20040066585A1 (en) | 2002-10-07 | 2004-04-08 | International Business Machines Corporation | Dual stage suspension with PZT actuators |
US20040070884A1 (en) | 2002-10-09 | 2004-04-15 | Nhk Spring Co., Ltd. | Disc drive suspension |
US6801402B1 (en) * | 2002-10-31 | 2004-10-05 | Western Digital Technologies, Inc. | ESD-protected head gimbal assembly for use in a disk drive |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8520342B1 (en) * | 2007-10-09 | 2013-08-27 | Hutchinson Technology Incorporated | Constant impedance and variable bandwidth traces for an integrated lead suspension |
US9439454B2 (en) * | 2008-03-14 | 2016-09-13 | Philip Morris Usa Inc. | Electrically heated aerosol generating system and method |
US20090230117A1 (en) * | 2008-03-14 | 2009-09-17 | Philip Morris Usa Inc. | Electrically heated aerosol generating system and method |
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US20100007993A1 (en) * | 2008-07-14 | 2010-01-14 | Hitachi Global Storage Technologies Netherlands B.V. | Integrated lead suspension with multiple crossover coplanar connection of the electrically conductive traces |
US8154827B2 (en) | 2008-07-14 | 2012-04-10 | Hitachi Global Storage Technologies Netherlands B.V. | Integrated lead suspension with multiple crossover coplanar connection of the electrically conductive traces |
US20100155457A1 (en) * | 2008-12-23 | 2010-06-24 | Edgar Rothenberg | Reducing a generation of contaminants during a solder reflow process |
US8492673B2 (en) * | 2008-12-23 | 2013-07-23 | HGST Netherlands B.V. | Reducing a generation of contaminants during a solder reflow process |
US20110141626A1 (en) * | 2009-12-10 | 2011-06-16 | Hitachi Global Storage Technologies Netherlands B.V. | Magnetic recording disk drive with integrated lead suspension having multiple segments for optimal characteristic impedance |
US8233240B2 (en) | 2009-12-10 | 2012-07-31 | Hitachi Global Storage Technologies Netherlands B.V. | Magnetic recording disk drive with integrated lead suspension having multiple segments for optimal characteristic impedance |
US20110149441A1 (en) * | 2009-12-18 | 2011-06-23 | Hitachi Global Storage Technologies Netherlands B.V. | Magnetic recording disk drive with write driver to write head transmission line having non-uniform sections for optimal write current pulse overshoot |
US8189281B2 (en) | 2009-12-18 | 2012-05-29 | Hitachi Global Storage Technologies Netherlands B.V. | Magnetic recording disk drive with write driver to write head transmission line having non-uniform sections for optimal write current pulse overshoot |
US8363357B2 (en) * | 2010-03-31 | 2013-01-29 | Nhk Spring Co., Ltd. | Disk drive flexure |
US20110242704A1 (en) * | 2010-03-31 | 2011-10-06 | Nhk Spring Co., Ltd. | Disk drive flexure |
US9025282B1 (en) * | 2011-02-10 | 2015-05-05 | Hutchinson Technology Incorporated | Elongated trace tethers for disk drive head suspension flexures |
US9196266B1 (en) * | 2014-07-25 | 2015-11-24 | HGST Netherlands B.V. | Integrated lead suspension (ILS) for two-dimensional magnetic recording (TDMR) disk drive |
Also Published As
Publication number | Publication date |
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CN1838250B (en) | 2010-12-29 |
US20060152854A1 (en) | 2006-07-13 |
CN1838250A (en) | 2006-09-27 |
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