JP2003268530A - Tool for sputtering - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a tool for sputtering which can surely hold a glass substrate even when the magnets of a base plate exist in the corresponding positions of the apertures of a pattern mask and which can prevent the appearance of the traces of the magnets on an ITO film deposited on the glass substrate. <P>SOLUTION: The tool 10 for sputtering has the base plate 12 which holds the glass substrate 16 formed with color patterns 15 in-between and is buried with a plurality of magnets therein, a magnetism-proof mask 14 which is installed on the base plate 12 and is formed with slits 13 at several points, more preferably two points, and a pattern mask 18 which has apertures 17 so as to face the color patterns 15 of the glass substrate 16 and holds the glass substrate 16 in-between cooperatively with the base plate 12. The tool 10 for sputtering positions the pattern mask 18 onto the glass substrate 16 installed on the magnetism-proof mask 14 of the mask plate 12 in such a manner that its apertures 17 face the color patterns 15 on the glass substrate 16. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sputtering jig, and more particularly to a sputtering jig for forming a transparent electrode on a color pattern of a glass substrate for manufacturing a liquid crystal display device or the like.

[0002]

2. Description of the Related Art A liquid crystal display device includes a transparent rectangular glass substrate, a color pattern formed on the glass substrate, and a transparent electrode formed on the color pattern.

Such a liquid crystal display device is manufactured through the following manufacturing steps.

That is, after forming a chromium film on a transparent and rectangular glass substrate by a vacuum film forming method or the like, a photoresist is applied, and then exposed through a photomask, followed by development, chromium etching, and photolithography. The resist is stripped off to form a patterned black light shielding layer.

Next, from the top of the black light shielding layer, the first color,
For example, apply the red water-soluble coloring layer sensitive material,
After exposure through a photomask, development is performed to form a red pattern layer. Similarly, after the second color, for example, a green pattern layer or a blue pattern layer is formed using a green or blue water-soluble coloring layer sensitive material.

After that, a synthetic resin protective film layer is formed on the color pattern, and then an indium tin oxide (ITO) film is formed as a transparent electrode film on the protective film layer. An electrode pattern is processed by an etching method or the like to form a transparent electrode layer.

As a method of forming the transparent electrode film,
There are various methods such as vapor deposition, ion plating, and sputtering, but since the protective film layer made of synthetic resin has poor heat resistance,
A sputtering method that can form a film at a relatively low temperature is widely used.

In the sputtering method, an ITO film is formed on the color pattern 61 of the glass substrate 60 by using the sputtering jig 50 shown in FIG.

In FIG. 3, a sputtering jig 50 has a base plate 5 having a plurality of magnets 51 embedded therein.
2 and a holding plate 55 that is connected to the base plate 52 by a hinge 53 and has an opening 54 formed therein.
A pattern mask 56 that has an opening 57 so as to face the color pattern 61 of the glass substrate 60 and that holds the glass substrate 60 in cooperation with the base plate 52.
With.

A glass substrate 60 to be sputtered by the main sputtering jig 50 is made of glass having a color pattern 61 formed thereon.

In the sputtering jig 50, the pattern mask 56 is positioned on the glass substrate 60 placed on the base plate 52 so that the opening 57 of the pattern mask 56 faces the color pattern 61 on the glass substrate 60. As a result, the horizontal magnetic field of the magnet 51 in the base plate 52 attracts the pattern mask 56 and holds the glass substrate 60 with a uniform force. Further, the glass substrate 60 and the pattern mask 56 are pressed against the base plate 52 by the pressing plate 55.

[0012]

However, when the magnet 51 of the base plate 52 is located at the corresponding position of the opening 57 of the pattern mask 56 as shown in FIG. 4, the magnetic lines of force 21 from the magnet 51 cause the glass substrate 60 to move. A magnet trace is formed on the ITO film on the color pattern 61 of the glass substrate 60 due to the spatter discharge abnormality 22 at the time of sputtering caused by the magnetic force line 21 penetrating the magnet.

These problems can be avoided by creating and replacing a new base plate 52 in which the magnet 51 is embedded at a position matching the shape of the opening 57 each time the shape of the opening 57 of the pattern mask 56 is changed. I can, but
In recent years, when it is desired to produce a small amount and a large variety of color patterns 61, cost increase is inevitable.

An object of the present invention is to securely hold the glass substrate even when the magnet of the base plate is at the corresponding position of the opening of the pattern mask and to form a film on the glass substrate.
It is an object of the present invention to provide a sputtering jig capable of preventing a magnet trace from appearing on the TO film.

[0015]

In order to achieve the above object, a sputtering jig according to claim 1 is a sputtering jig for sandwiching a glass substrate having a color pattern formed thereon, and a plurality of magnets. In a jig for sputtering having a base plate having an opening so as to face the color pattern, and a pattern mask for sandwiching the glass substrate in cooperation with the base plate, wherein the sandwiched glass substrate and the A magnetic shielding mask made of a magnetic material is interposed between the base plate and the base plate.

A sputtering jig according to a second aspect of the present invention is the sputtering jig according to the first aspect, wherein the horizontal magnetic field of the magnet after passing through the magnetic shielding mask is 250 gauss or less. The sputter jig described is
The jig for sputtering according to claim 1 or 2, wherein the magnetic shield mask is a ferromagnetic material.

A sputtering jig according to a fourth aspect of the present invention is the sputtering jig according to the third aspect, wherein the magnetic shield is 4
It is characterized by being composed of two alloys.

A sputtering jig according to a fifth aspect is the sputtering jig according to the fourth aspect, characterized in that the magnetic shield has a thickness of 0.2 to 1.0 mm.

A sputtering jig according to a sixth aspect is the sputtering jig according to any one of the first to fifth aspects, wherein the magnet has a diameter of 3 to 5 mmφ and a thickness of 1.5 to 2.
It is characterized by being a 5 mm circular magnet.

A sputtering jig according to a seventh aspect is the sputtering jig according to any one of the first to sixth aspects, wherein each of the magnetic shield mask and the pattern mask is:
The difference in thermal expansion from the glass substrate is small.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a jig for sputtering according to an embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a diagram showing a sputtering jig according to an embodiment of the present invention.

In FIG. 1, a sputtering jig 10 holds a glass substrate 16 on which a color pattern 15 is formed, and a multi-type base plate (hereinafter, simply referred to as " (Referred to as "base plate") 12 and slits 13 installed on the base plate 12 at several places, preferably two places.
And a pattern mask 18 having an opening 17 facing the color pattern 15 of the glass substrate 16 and sandwiching the glass substrate 16 in cooperation with the base plate 12.

The glass substrate 16 to be sputtered by the present sputtering jig 10 is made of glass having a color pattern 15 formed thereon and a thickness of 0.3 to 1.1 mm.

In the sputtering jig 10, the glass substrate 16 placed on the magnetic shield 14 of the base plate 12 is used.
By positioning the pattern mask 18 so that the opening 17 of the pattern mask 18 faces the color pattern 15 on the glass substrate 16.
The horizontal magnetic field of 1 attracts the pattern mask 18 to sandwich the glass substrate 16 with a uniform force. Using such a sputtering jig 10, ITO is formed on the surface of the color pattern 15 of the glass substrate 16 in a sputtering device (not shown).
A film is formed.

The base plate 12 is made of titanium having a thickness of 4 to 6 mm and has a concave portion for burying the magnet 11 formed on the surface thereof.

The pattern mask 18 has a thickness of 0.4-0.
The opening 17 is made of a 6 mm 42 alloy (42% nickel, 58% iron) and faces the color patterns 15 formed on the glass substrate 16. The material is not limited to this, and may be a ferromagnetic material and an alloy having a thermal expansion coefficient substantially equal to that of the glass substrate 16.

Further, the magnet 11 installed on the base plate 12 is a samarium-cobalt-based magnet which is small in reversible or irreversible demagnetization even when used at a high temperature of about 200.degree. Preference is given to using.

Further, the magnet 11 is a circular magnet having a diameter of 3 mm to 5 mm and a thickness of 1.5 to 2.5 mm, preferably a circular having a diameter of 4 mm and a thickness of 2 mm, as compared with a circular magnet having a diameter of 7 mm and a thickness of 2 mm which has been conventionally used. By using the magnets, the array density of the magnets 11 is increased to 4 to 9 pieces / cm ² as compared with the conventional 1 to 3 pieces / cm ² , so that the upper portion of the magnets 11 is provided at the opening of the pattern mask 18. Even when the number becomes 17, the glass substrate 16 can be securely held by the magnet 11.

Further, the glass substrate 16 and the pattern mask 1
If a spacer made of polyimide is sandwiched between the glass substrate 16 and the substrate 8, the glass substrate 16 can be prevented from being scratched.

The magnetic shield 14 has a thickness of 0.2 to 1.0 m.
m, preferably 0.25 mm thick, of 42 alloy.
As a result, even in a high temperature atmosphere during sputtering, the horizontal magnetic field of the magnet 11 of the base plate 12 after passing through the magnetic shield 14 is adjusted to 250 gauss or less, preferably 200 gauss, and as a result, a magnetic force sufficient to attract the pattern mask 18 is obtained. It is possible to prevent the trace of magnets from being left on the glass substrate 16 after the film formation by the action of FIG.

The material of the magnetic shielding mask 14 is not limited to the 42 alloy, and may be made of a ferromagnetic material and having a coefficient of thermal expansion substantially equal to that of the glass substrate 16, like the pattern mask 18.

The mitigation of the influence of the horizontal magnetic field of the magnet 11 by the magnetic shield 14 will be described below with reference to FIG.

FIG. 2 is an explanatory view of mitigating the influence of the horizontal magnetic field of the magnet 11 by the magnetic shield mask 14 in FIG.

As shown in FIG. 2, when the magnetic shielding mask 14 is installed on the base plate 12, the surfaces of all the magnets 11 are covered with the magnetic shielding mask 14. Therefore, even if some of the plurality of magnets 11 installed on the base plate 12 are located at the positions corresponding to the openings 17 of the pattern mask 18, the magnetic field shield 21 causes the magnetic field lines 21 ′ from the magnets 11.
Since the magnetic field lines 21 'penetrating through the magnetic field do not cause spatter discharge abnormality 22 during sputtering (FIG. 4), no magnet trace is formed on the ITO film.

According to the embodiment of the present invention, since the magnetic shield 14 is installed between the glass substrate 16 and the base plate 12, when the magnet 11 of the base plate 12 is in the corresponding position of the opening 17 of the pattern mask 18. However, the glass substrate 16 can be reliably sandwiched and it is possible to prevent the trace of a magnet from appearing on the ITO film formed on the glass substrate 16.

[0037]

As described in detail above, according to the sputtering jig of the first aspect, since the magnetic shielding mask made of a magnetic material is interposed between the glass substrate and the base plate, the magnet of the base plate is Even when the glass substrate is located at the corresponding position of the opening of the pattern mask, the glass substrate can be securely held and it is possible to prevent the magnet trace from appearing on the ITO film formed on the glass substrate.

According to the sputtering jig of the second aspect,
Since the horizontal magnetic field of the magnet of the base plate after passing through the magnetic shielding mask is 250 gauss or less, the effect of the sputtering jig according to the first aspect can be reliably exhibited.

According to the sputtering jig of the third aspect,
Since the magnetic shielding mask is made of a ferromagnetic material, the effect of the sputtering jig according to the first aspect can be efficiently obtained.

According to the sputtering jig of the fourth aspect,
Since the magnetic shielding mask is made of 42 alloy, the magnetic shielding mask can be easily made into a ferromagnetic material and the difference in thermal expansion from the glass substrate can be reduced.

According to the sputtering jig of the fifth aspect,
Since the magnetic shield has a thickness of 0.2 to 1.0 mm, the horizontal magnetic field of the magnet of the base plate after passing through the magnetic shield can be reliably adjusted to 250 Gauss or less.

According to the sputtering jig of the sixth aspect,
The magnet of the base plate has a diameter of 3 to 5 mmφ and a thickness of 1.
Since it is a circular magnet having a diameter of 5 to 2.5 mm, the arrangement density of the magnets can be increased to 4 to 9 magnets / cm ^{2 as} compared with the conventional 1 to 3 magnets / cm ² .

According to the sputtering jig of claim 7,
Since the magnetic shield and the pattern mask have a small difference in thermal expansion from the glass substrate, the glass substrate can be reliably sandwiched even in a high temperature atmosphere during sputtering.

[Brief description of drawings]

FIG. 1 is a diagram showing a sputtering jig according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram for mitigating the influence of the horizontal magnetic field of the magnet 11 by the magnetic shield mask 14 in FIG.

FIG. 3 is a view showing a sputtering jig according to a conventional embodiment.

4 is an explanatory diagram of an influence of a horizontal magnetic field of a magnet 51 in FIG.

[Explanation of symbols]

10 Sputtering jig 11 magnets 12 base plate 13 slits 14 Magnetic shield 16 glass substrate 17 openings 18 pattern masks

Claims (7)

[Claims] 1. A sputtering jig for sandwiching a glass substrate on which a color pattern is formed, which has a base plate having a plurality of magnets, an opening so as to face the color pattern, and cooperates with the base plate. In a sputtering jig including a pattern mask for sandwiching the glass substrate, a magnetic shielding mask made of a magnetic material is interposed between the sandwiched glass substrate and the base plate. jig. 2. The sputtering jig according to claim 1, wherein the horizontal magnetic field of the magnet after passing through the magnetic shielding mask is 250 gauss or less. 3. The sputtering jig according to claim 1, wherein the magnetic shield mask is a ferromagnetic material. 4. The jig for sputtering according to claim 3, wherein the magnetic shield mask is made of 42 alloy. 5. The magnetic shield has a thickness of 0.2 to 1.0.
The jig for sputtering according to claim 4, wherein the jig for sputtering is mm. 6. The jig for sputtering according to any one of claims 1 to 5, wherein the magnet is a circular magnet having a diameter of 3 to 5 mmφ and a thickness of 1.5 to 2.5 mm. 7. The jig for sputtering according to claim 1, wherein each of the magnetic shield mask and the pattern mask has a small difference in thermal expansion from the glass substrate.