JP2003248436A - Large-screen plane display device, and method and apparatus for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To decrease the weight of a display device and to lower the price by making it possible to use an inexpensive and lightweight plastic substrate which is too weak for a manufacturing process at a high temperature wherein glass is usable as a substrate of the display device. <P>SOLUTION: Many fine crystal silicon integrated circuits, etc., are used as fine electronic devices which are installed nearby respective pixels and control on-off states and densities of the pixels, and stuck on a printed original plate like printing ink; and they are copied to necessary places on a display and fixed by printing technique, etc. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a new manufacturing method for a large screen flat panel display used in a large screen flat panel television, a manufacturing apparatus for embodying the new manufacturing method, and a flat panel manufactured by such means. It is about the display itself.

[0002]

2. Description of the Related Art Flat panel displays (FPDs) typified by liquid crystal displays are currently used for chemical vapor deposition (CVD) on glass substrates.
ition) method, etc., an insulating film, a semiconductor film, etc. are sequentially deposited,
Through the same process as manufacturing a semiconductor integrated circuit, a thin film transistor (TFT = Thin Fil
A display image is configured by forming a microelectronic device such as an m transistor, and controlling the ON / OFF of each pixel and the shading by this. That is, the active electronic device is manufactured on the spot on the device substrate actually used for the display. Therefore, as the display area expands, CVD that deposits a film on the glass substrate
The equipment will become huge, and the cost will rise dramatically. Furthermore, since electronic devices are manufactured on the glass substrate in situ in this way, the glass substrate can withstand 300 ° C.
Amorphous silicon (a-Si) films that can be used to make active electronic devices even with thin films deposited at low temperatures are used as semiconductor films, so their operating functions are inferior to ordinary semiconductor electronic devices that use crystalline silicon. It is normal.
Therefore, for example, in order to improve the mobility of the TFT and improve its operation function, the deposited a-Si film is melted by laser irradiation to form poly-silicon (poly-Si), and the poly-Si film is formed. It is also considered to make a TFT with high mobility by using. In particular, it is generally considered that the operation function of a-Si TFT is not sufficient for displays such as organic EL that emit light by passing individually controlled current to each pixel. Molten poly-S
Expectations for i-film are expanding.

However, the production of the laser-melted poly-Si film raises the cost and is expected to be used only in a limited range. Further, the diagonal size of the screen of the conventional a-Si TFT is also large. Expanding to more than 40 inches will increase the difficulty and process cost of a-Si film deposition and the subsequent pattern transfer process, making it impossible to realize a large screen flat display with liquid crystal etc. at a realistic price. It has been believed to be close.

On the other hand, a microelectronic device for controlling each pixel, such as a TFT, is formed on a display device substrate based on thin film deposition as in the conventional case. A large number of microcrystalline silicon integrated circuits are manufactured in advance at other places, and they are placed by pouring them together with a liquid into a preformed mold in the display device substrate. "Fluidic Sel"
A method called "f Assembling (FSA)" has also been proposed. This technology was developed by Alien Technology and has been attracting attention as an unprecedented novel idea. However, this method also has a problem in the ratio of the minute silicon integrated circuits that can well fit into the mold on the substrate, and in reality, it is not at the level of practical application. Furthermore, in this method, since the connection between the minute silicon integrated circuits fitted in the mold must be performed independently of the work of fitting them into the mold, precise alignment is required, and the work process is complicated. Get expensive.

Further, in the FSA technology of Alien Technology Co., a large number of minute silicon integrated circuits are directly poured into the display substrate, so that the substrate may be damaged by the minute silicon integrated circuits, and the minute silicon integrated circuits are displayed. After the film is placed on the substrate, it is necessary to laminate a film on the film to prevent the film from falling, and it is necessary to make holes for wiring in the laminated film, which is frequent and expensive.

Further, in a display using a glass plate as a substrate, when the screen size becomes 40 inches to 100 inches, the plate thickness may increase in order to have glass strength. Will increase, the structure for installation will become full-scale, and the cost will increase.

[0007]

As described above, as described above,
Large screen flat displays such as liquid crystal displays with large screens of 40 to 100 inches, organic EL displays, etc., which were considered impossible to supply to the world at a reasonable price, are equivalent to other display systems or We will be able to supply the world at a much cheaper price. For example, a calculated value based on the prices of various parts in 2002, a high-definition LCD with a diagonal size of 70 inches
Enable factory shipment for a price of 150,000 yen or less.

Further, in order to control each pixel, if an attempt is made to dispose a highly functional microelectronic device having high mobility in the vicinity of each pixel, an expensive means such as a laser melting technique is required. , It becomes possible to arrange an electronic device having a high function exceeding that of the conventional method in the vicinity of each pixel by a much cheaper method. This also improves the controllability of a current control type display such as an organic EL display.

As one means for accomplishing the technical idea of the present invention, there is the above-mentioned prior invention by Alien Technology Co., Ltd. In the method presented by the above-mentioned prior invention, a microelectronic device for controlling each pixel is provided. There is a problem that the work cost increases because the arrangement and the formation of the wiring connecting them can be performed only as an independent process, but the present invention solves the problem. Further, the present invention can solve the deterioration of the production efficiency due to the formation of the laminated film for preventing the drop of the minute silicon integrated circuit. That is, the series of techniques presented by the present invention is a flat panel display such as a liquid crystal display or an organic EL display at a price equal to or less than that of a large high-definition television using a conventional cathode ray tube, and several times that price. The basic issue to be solved is to expand the screen size so that it can be marketed.

As a substrate of a display device, an inexpensive and lightweight plastic substrate that cannot withstand a manufacturing process at a high temperature where glass can be used can be used so that the weight of the device and the price can be reduced.

[0011]

The present invention uses a large number of minute crystalline silicon integrated circuits or the like as a minute electronic device which is installed in the vicinity of each pixel and controls ON / OFF and shading of each pixel. The main idea is to attach it to a printing original plate like printing ink, and then copy and fix it onto a required place on the display by a printing technique or the like. In this method, since the print transfer area can be easily expanded, it is possible to inexpensively manufacture a large screen having a screen diagonal dimension of 40 inches to 100 inches. In addition, this method makes it possible to arrange an electronic device having higher performance than each other in the vicinity of each pixel without using an expensive technique such as laser melting. Further, since the wiring circuit for connecting the pixels to each other can be printed at the same time when the microcrystalline silicon integrated circuit is arranged on the display, mask alignment becomes unnecessary and the display can be manufactured at a further lower cost. Further, in this method, since there is no step of directly raising the temperature of the substrate, inexpensive and lightweight plastic can be used. in this way,
According to the present invention, all the main problems of the large screen flat panel display can be solved at the same time.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below.
The description will be given with reference to the drawings. 1 to 14 show an example of a procedure for producing a large-screen liquid crystal display having a screen diagonal dimension of 70 inches according to the present invention. The procedure is the same whether the screen size is larger or smaller. Further, although the liquid crystal display is shown here as an example, even if the organic EL is used as a screen constituent element instead of the liquid crystal, only a part is changed, and the process steps that are the core of the present invention are shown in FIGS. Is the same as.

First, the thickness of the display substrate is 3 mm
A plastic substrate A such as a transparent acrylic plate having a thickness of 5 mm is used. Of course, the substrate material is not limited to the plastic substrate as long as it conforms to the manufacturing procedure according to the present invention shown below. Red, green, and blue color filters are sequentially printed on this. The color filter may be formed by a method other than printing. For example, there is a method of attaching a color filter using an inkjet. Since a large screen display is handled here, the demand for the color filter pattern accuracy is not so severe, and an inexpensive printing method is used. Although there are concerns about the printing method such as color unevenness and bleeding at the edge of the pattern, this is also a large screen, so the size of each pixel is large and it is easy to adjust the printing pressure, so it seems that when producing a high-definition screen of 20 inches or less. It doesn't matter. That is, here, it is possible to adopt a method in which pressure printing that tends to cause color unevenness or edge bleeding is not performed, and the gap between the printing original plate and the substrate is controlled and the surface tension of the printing ink is used to transfer to the substrate. . An explanation of this step is shown in FIG. Also, without the color filter, the back light source is red,
This step is unnecessary when using the field-sequential method in which green, blue, and time-sequential blinking are performed to display a color screen.

A transparent electrode film is attached to the entire surface of this substrate. For this, the same method as the usual method used when forming the transparent electrode on the color filter may be used. An explanation of this step is shown in FIG. Although the color filter is installed on the substrate for mounting the microelectronic device for controlling each pixel here, the color filter can be installed on the counter substrate like most liquid crystal displays. In that case, the above-described color filter installation is a subsequent step, and the transparent electrode pattern formation described below is a separate step, which is disadvantageous in terms of cost.

A photoresist is applied on this. An explanation of this step is shown in FIG. Next, using a color filter as a mask pattern, ultraviolet rays are irradiated from the back surface of the transparent substrate A to expose the photoresist. As a result, only the portion without the color filter is exposed, and the pattern is transferred to the transparent electrode in a self-aligned manner with the color filter. An explanation of this step is shown in FIG. This is immersed in a developing solution to remove all but the photoresist on the color filter. This developing solution is preferably a material such as acrylic that does not damage the transparent substrate A, but since the part requiring transparency is already protected by a color filter or the like, the developing process becomes an essential problem. Don't An explanation of this step is shown in FIG.

A black matrix material B that fills the gaps between the color filters and prevents light leakage is applied over the entire surface of this substrate. An explanation of this step is shown in FIG. Here, when the photoresist is removed by the lift-off method, red,
A substrate having a structure in which a transparent electrode is attached directly on the green and blue color filters and the other parts are all filled with a black matrix material can be formed. The photoresist removing solution used for this lift-off is selected so as not to damage the black matrix material B and the transparent electrode material. An explanation of this step is shown in FIG.

Up to this point, the conventionally known techniques have been combined so as to be compatible with the present invention, and the following are the new steps forming the basis of the present invention. First, an organic film (imprint resist) C is applied on the entire surface of a substrate or attached by laminating a thin film sheet.
The coating may be performed by using an inkjet, but may be simpler spray coating. The thickness of the organic film is from 1 μm to 10
There is an optionality that matches the cost and workability of about μm. An explanation of this step is shown in FIG.

A printing original plate having a structure as shown in FIG. 15 is pressed against this. A large number of microcrystalline silicon integrated circuits for controlling each pixel are fixed to the printing original plate at a position corresponding to a predetermined position near each pixel, and a wiring pattern connected thereto is also patterned as an uneven pattern. The height of the unevenness of the mold for transferring the wiring pattern, the height of the unevenness of the transparent electrode portion, and the like can be adjusted to different values according to the height of the unevenness already existing on the target substrate. Microcrystalline silicon integrated circuits are substrates such as acrylic plates.
Since it is embedded in A and fixed, it usually has the highest height in the original printing plate. In addition, in order to facilitate this embedding work and imprinting of other wiring parts (stamp printing in which the uneven pattern is transferred to the organic film by pressing the uneven pattern template) method pattern transfer,
The temperature of the entire substrate is raised within a range that does not damage existing materials such as color filters, transparent electrodes, and black matrix B.
An explanation of this step is shown in FIG. Further, FIG. 10 shows an explanation of the substrate shape after this printing process is completed.

In this printing, the imprint method is adopted, but since the transparent electrode and the like are not damaged, the concave and convex mold of the wiring pattern is set to a low portion, and the organic film C remains thin on the transparent electrode. I will let you. On the other hand, the concavo-convex mold of the pattern corresponding to the so-called gate line and data line (= signal line) connecting each pixel is so high that it penetrates the organic film C and the black matrix member B and bites into the substrate A. Is set to. The organic film C slightly left on the transparent electrode is removed by wet treatment after irradiating the entire surface with ultraviolet rays to enhance the chemical resistance of the entire organic film, and exposing the necessary portion of the transparent electrode. An explanation of this step is shown in FIG.

Copper for wiring is deposited on the entire surface of this substrate by a sputtering method. An explanation of this step is shown in FIG. Then, unnecessary portions of copper are removed together with the organic film C by a lift-off method, and a large number of microcrystalline silicon integrated circuits for controlling each pixel are arranged at predetermined positions, and electrode pads and transparent electrodes on the integrated circuits are arranged. A display board having a structure in which copper is wired in the required places is completed. A completed drawing of the steps up to this point is shown in FIG.

After that, a step of installing a microcrystalline silicon integrated circuit and a step of repairing a defective portion of the wiring line are actually carried out by an inspection step, but the subsequent steps will be described here. That is, the alignment film is attached and rubbed on the substrate in the same manner as in a normal liquid crystal display manufacturing process. A transparent electrode such as an acrylic substrate and a substrate rubbed with a transparent electrode and an alignment film are opposed to each other, and liquid crystal is injected to complete a liquid crystal display. An explanation of this step is shown in FIGS.

In the present invention, the process for producing the printing original plate shown in FIG. 15 is also an important part of the invention. Next, the process will be described. First, many integrated circuits in which a pixel control circuit is incorporated in a crystalline silicon wafer are manufactured. In the case of the example of this embodiment, the size of one crystalline silicon integrated circuit chip is about 80 μm × 100 μm. Considering the cutting margin, about 1.5 million microcrystalline silicon integrated circuit chips can be obtained from one 8-inch silicon wafer. Here, as the function required for this microcrystalline silicon integrated circuit, 3 × 4 = 12 peripheral pixels including the red, green, and blue colors of each of the four pixels adjacent to the installation position of the integrated circuit are eventually provided. It has a built-in control circuit. A schematic diagram of this integrated circuit is shown in FIG. Of course, it is possible to correspond to one micro silicon integrated circuit chip for every pixel including red, green and blue, but this will increase the cost of manufacturing the integrated circuit, so some peripheral pixels will be combined. It is more efficient and economical to control with a single crystalline silicon integrated circuit. FIG. 18 shows a circuit incorporated in this micro silicon integrated circuit chip. The adjustment capacitor in this circuit may not be necessary. In this example, 12 pixels in total
Since it is controlled by individual micro silicon integrated circuit chips, many gate lines and signal lines (= data lines) must be wired. In order to reduce the number of wirings, for pixel selection, for example, if the number 1 wiring and the number 2 wiring are on, pixel 1 is selected, and if the number 1 wiring is on and the number 2 wiring is off, pixel 2 is selected and the data is transmitted. Such a logic circuit can be incorporated in an integrated circuit. It is also one of the aspects of the present invention that by developing this, the number of pixels handled by one micro silicon integrated circuit chip is significantly increased, and the number of micro silicon integrated circuit chips mounted and fixed on the display substrate is greatly reduced. It is how it is used.

As described above, one silicon wafer incorporates about 1.5 million micro silicon integrated circuits as shown in FIG. For micro integrated circuit chips,
As shown in FIG. 19, a part of the surface is coated with an organic film for the next step, and particularly when magnetic force is used as a method for arranging the micro integrated circuit chip at a predetermined position of the printing original plate, In some cases, magnetically sensitive nickel metal is attached to a portion of the back surface. Similar to the case of manufacturing a micromachine, this is transferred to the back surface in accordance with the position of the micro integrated circuit on the front surface, and then cut by dry or wet etching into each micro integrated circuit.
A means such as a laser scribing method may be used for this cutting. At this time, in order to facilitate the cutting and handling of the micro integrated circuit chip in the subsequent steps, the back surface of the silicon wafer itself may be etched to thin the silicon wafer.

First, the method of the present invention for arranging the micro integrated circuit chip at a predetermined position on the printing original plate by using magnetic force will be described. A large number of micro integrated circuit chips are placed in the chip array machine shown in FIG. In this, a large number of pin-shaped magnets are arranged at positions corresponding to predetermined positions of the printing original plate. As an example, this can also be realized by arranging a large number of nickel microneedles and attaching a strong magnet behind them, as shown in FIG. This plate with a large number of pin-shaped magnets is installed on the upper part, and nitrogen gas or dry air is made to flow from the bottom with a certain amount of air to make the minute integrated circuit chips float and move up and down, and the pin-shaped magnets on the upper part. Then, the nickel-attached portion of the micro integrated circuit is adsorbed as shown in FIG. In this state, since the suction points are points, the micro integrated circuit chip has a degree of freedom of rotation. When the micro integrated circuit is sufficiently attracted to each pin-shaped magnet in a one-to-one correspondence, it is carried to the printing original plate, and there, through an aperture as shown in FIG. 23 for aligning the directions of the micro integrated circuit, The micro integrated circuit chip is placed at a predetermined position on the printing original plate in a proper direction. As shown in FIG. 24, the printing original plate is vacuum-sucked from the back surface and is brought into close contact with the printing original plate by its force.
By repeating such an operation, the micro integrated circuit chips are arranged at all the necessary places on the entire surface of the printing original plate.

The placement of the micro integrated circuit chip on the printing original plate can be performed by another method, which will be described. Further, a schematic configuration diagram of the chip array machine is shown in FIG. First, as shown in FIG. 26, a mold is prepared on the display substrate in which a hole for inserting the micro integrated circuit chip is formed at a position having the same positional relationship as the position where the micro integrated circuit chip is required on the display substrate. A large amount of micro integrated circuit chips are poured into the mold, and the micro integrated circuit chips are fitted into the mold by mechanical vibration, gas flow, magnetic force, or a combination thereof. (Figure 27)

At this time, the shape of the micro integrated circuit chip is preferably rectangular, and the lower part is preferably pyramidal or trapezoidal in order to orient the pixel control element. Further, a magnetic material such as nickel is vapor-deposited on the surface of the micro integrated circuit chip in order to arrange it on the printing original plate in the next step. Further, the mold has a concave hole, which is the opposite of the hole, so that the hole and the micro integrated circuit chip are aligned with each other (FIG. 15).

As described above, the fine integrated circuit chips are fitted into the mold, but a large amount of the fine integrated circuit chips which are not fitted are removed from the mold surface by gas flow, magnetic force, brush, or a combination thereof. , Collect and reuse in the next lot. (FIG. 29) The chip fitting in the above mold may be performed several times.

After fitting the micro integrated circuit chip into the mold, it is surely inspected whether the micro integrated circuit chip fits into a predetermined portion of the mold. The inspection is performed using surface observation, an optical sensor, a contact sensor, or the like. When the inspection is performed and the micro integrated circuit chip is not located at a predetermined location, the micro integrated circuit chip is embedded in the location so that the micro integrated circuit chip is embedded in all the micro integrated circuit chip placement locations of the mold. (Figure 30)

After confirming the fitting of the micro integrated circuit chip into the mold, the printing original plate is brought into close contact with the mold. (FIG. 31) The printing original plate has an electromagnet built therein, and when the electromagnet is turned on after being brought into close contact with the mold, the micro integrated circuit chip to which the magnetic substance is attached is attracted to the printing original plate by the magnetic force. (FIG. 32) The above is another method for disposing the micro integrated circuit chip on the printing original plate.

Further, another method for arranging the micro integrated circuit chips on the printing original plate will be described. First, the cut micro integrated circuit chips are arranged in the groove by mechanical vibration. (FIG. 33) The grooves are arranged at intervals where the micro integrated circuit chips should be arranged on the display. The fine integrated circuit chips are arranged on the printing original plate by adsorbing the aligned fine integrated circuit chips on the printing original plate. (FIG. 34) As a method of attracting the micro integrated circuit chip to the printing original plate, vacuum chuck adsorption may be used, or a magnetic material may be attached to the micro integrated circuit chip in advance and a magnet may be built in the printing original plate. Alternatively, the micro integrated circuit chip may be attracted by magnetic force. The pickup of the micro integrated circuit chip onto the printing original plate is highly productive when a plurality of micro chips are adsorbed at the same time.

As described above, after arranging the micro integrated circuit chip on the printing original plate, the micro integrated circuit chip may be embedded in the display substrate as in the above-mentioned method. Regarding the embedding of the micro integrated circuit chip in the display substrate, Capture and explain. In order to embed the micro integrated circuit chip arranged on the printing original plate in the substrate, the substrate material is preferably a polymer material such as acrylic resin or polycarbonate resin. At this time, the thickness of about 1 μm was sputtered on this one side.
A m2 SiO2 film is attached to protect the surface of the acrylic plate.
This step may be performed last, and there is no problem functionally even if this protective film is not applied. Although the sputtering method is exemplified here as the method of attaching the protective film, the surface of the acrylic plate may be protected by simply attaching thin glass. Also in this case, the formation of the surface protective film may be at the end of all steps. (Fig. 35)

Alternatively, a glass substrate may be used as the display substrate, and a polymer film may be laminated on the surface thereof, or may be formed by spin coating or roll coating. As the polymer film that can be used at that time,
Polyethylene, polypropylene, polyvinyl chloride, polystyrene, etc. are preferable.

Further, when the micro integrated circuit chip is embedded in the display substrate or the polymer film formed on the display substrate by the printing original plate, the display substrate or the polymer film formed on the display substrate in advance. It is preferable that a hole into which the micro integrated circuit chip fits is formed at a predetermined location of the micro integrated circuit chip, because the micro integrated circuit chip can be easily embedded (FIG. 36). The holes can be made by thermoforming. When a polymer film is laminated on a display substrate, holes may be punched in the polymer film before laminating on the substrate.

The fine integrated circuit chip previously picked up by the printing original plate containing the electromagnet is fitted into the hole into which the fine integrated circuit chip formed on the display substrate or the polymer film formed on the display substrate fits. . (FIG. 37) At that time, the electromagnet is turned off and the fine integrated circuit chip is fitted into the hole.

Further, in order to securely fix the micro integrated circuit chip to the display substrate or the polymer film formed on the display substrate, a heating press is performed during or after the micro integrated circuit chip is fitted in the printing original plate. This secures the embedding of the micro integrated circuit chip. (FIG. 38) After that, the magnetic substance attached to the surface of the micro integrated circuit chip is removed. When nickel is used as the magnetic substance, its removal can be performed by immersing it in a hydrochloric acid solution. (FIG. 39) However, at that time, it is necessary to use a material whose wiring material can withstand the solution so as not to damage the wiring of the micro integrated circuit chip. An example of a wiring material that can withstand hydrochloric acid is copper. Alternatively, as will be described later, a magnetic material may be removed by removing the organic protective film by forming a magnetic material on the organic protective film that is resistant to the wiring material solution. As described above, the micro integrated circuit chip is embedded in the display substrate or the polymer film formed on the display substrate (FIG. 40), and then wiring is formed to complete the display substrate.

Next, a method of processing the micro integrated circuit chip will be described. First, by a conventional semiconductor device manufacturing process on a small substrate (for example, an 8-inch wafer),
A pixel control element is formed. (FIG. 41) The substrate material used at that time becomes the material of the micro integrated circuit chip, and when the crystalline silicon substrate is used,
High-performance devices can be manufactured. Alternatively,
When the workability of the micro integrated circuit chip is important, a ceramic substrate may be used. This is because the ceramic substrate before sintering has low hardness and can be easily cut.

After forming the pixel control element on the substrate, an organic protective film is formed on the surface of the substrate on which the pixel control element is formed. On top of that, a magnetic material such as nickel is deposited by sputtering. (FIG. 42) In the case of picking up the micro integrated circuit chip with the needle of the magnet, after polishing the back surface of the substrate thereafter,
Deposit nickel. Then, the back surface is polished to reduce the thickness of the substrate to about 30 to 300 μm. (FIG. 43) This step is not necessary if the substrate is originally thin.

After reducing the thickness of the substrate, the micro integrated circuit chip is cut, but laser scribing may be used as in the above method, but in this example, a method using an inexpensive chemical solution is used. explain. A pattern is transferred to the shape of a micro integrated circuit chip on the back surface (FIG. 44), and the resist is used as a mask to perform wet etching on the substrate to cut the substrate. (FIG. 45) When the micro integrated circuit chip is cut by wet etching, it is processed into a pyramid shape or a trapezoidal shape as shown in FIG. 46 by anisotropic etching.
As described above, the micro integrated circuit chip has a rectangular shape for orientation in the chip arrangement.

[0039]

As described above, when a large-screen flat display is manufactured as described above, a high temperature, vacuum process such as CVD is applied to a small substrate of silicon wafer size in forming a pixel control element which is a main part of the display substrate. Since it can be performed above, it can be manufactured with a manufacturing facility of a fraction or less, so that the manufacturing cost can be significantly reduced. Furthermore, since these facilities are already owned by many semiconductor manufacturers, new device development and technological development are unnecessary. Furthermore, since a high-temperature process is not used, a lightweight polymer material can be used as a display substrate, which facilitates transportation and enhances productivity, and is also used as a wall-mounted TV. Therefore, it is easy to install and the product performance is improved.
Further, in this method, compared to the method of arranging the micro integrated circuit chip on the display substrate in advance in order to surely arrange the micro integrated circuit chip at another place, the display substrate is not damaged and further Yield improvement is expected due to the chip arrangement. Also,
By embedding the micro integrated circuit chip on the display substrate and transferring the wiring pattern at the same time, further improvement in productivity is expected.

[Brief description of drawings]

FIG. 1 is a diagram showing a procedure for manufacturing a liquid crystal display. (GF printing)

FIG. 2 is a diagram showing a procedure for manufacturing a liquid crystal display. (Transparent electrode film formation)

FIG. 3 is a diagram showing a procedure for manufacturing a liquid crystal display. (Photoresist application)

FIG. 4 is a diagram showing a procedure for manufacturing a liquid crystal display. (Exposure using CF as a mask)

FIG. 5 is a diagram showing a procedure for manufacturing a liquid crystal display. (After removing photoresist)

FIG. 6 is a diagram showing a procedure for manufacturing a liquid crystal display. (Black matrix coating)

FIG. 7 is a diagram showing a procedure for manufacturing a liquid crystal display. (Black matrix pattern formation)

FIG. 8 is a diagram showing a procedure for manufacturing a liquid crystal display. (After applying resist for imprint)

FIG. 9 is a diagram showing a procedure for manufacturing a liquid crystal display. (Substrate heating during imprint)

FIG. 10 is a diagram showing a procedure for manufacturing a liquid crystal display. (After imprinting the wiring pattern)

FIG. 11 is a diagram showing a procedure for manufacturing a liquid crystal display. (After transferring the wiring pattern)

FIG. 12 is a diagram showing a procedure for manufacturing a liquid crystal display. (After copper spatter)

FIG. 13 is a diagram showing a procedure for manufacturing a liquid crystal display. (After forming the rubbing film)

FIG. 14 is a diagram showing a procedure for manufacturing a liquid crystal display. (Completion of LCD display)

FIG. 15 is a diagram showing a printing original plate of the present invention.

FIG. 16 is a completed view of a display substrate of the present invention.

FIG. 17 is a schematic diagram of an integrated circuit of the present invention. (Small pixel control chip)

FIG. 18 is a circuit diagram of a minute pixel control chip of the present invention.

FIG. 19 is a schematic diagram of a minute pixel control chip of the present invention.

FIG. 20 is a diagram showing a chip array machine of the present invention.

FIG. 21 is a diagram showing a pickup portion of the chip of the present invention.

FIG. 22 is a diagram showing a state where the chip of the present invention is picked up.

FIG. 23 is a diagram showing an aperture of the present invention.

FIG. 24 is a diagram showing vacuum drawing of the printing original plate of the present invention.

FIG. 25 is a diagram showing a schematic configuration of a chip arranging machine of the present invention.

FIG. 26 is a view showing a mold of the substrate of the present invention.

FIG. 27 is a diagram showing an arrangement of a micro integrated circuit chip of the present invention in a mold.

FIG. 28 is a diagram showing the shape of a micro integrated circuit chip of the present invention and the shape of holes in a mold.

FIG. 29 is a diagram showing the recovery of the non-embedded micro integrated circuit chip of the present invention.

FIG. 30 is a diagram showing repair of the micro integrated circuit chip of the present invention.

FIG. 31 is a diagram showing the close contact of the printing original plate of the present invention with a mold.

FIG. 32 is a view showing a state in which the micro integrated circuit chip of the present invention is adsorbed on a printing original plate.

FIG. 33 is a diagram showing an array of micro integrated circuit chips of the present invention.

FIG. 34 is a diagram showing pickup of a micro integrated circuit chip of the present invention onto a printing original plate.

FIG. 35 is a diagram showing the attachment of the SIO 2 film to the acrylic plate of the present invention.

FIG. 36 is a view showing a chip hole on the display substrate of the present invention.

FIG. 37 is a diagram showing fitting of a chip onto the display substrate of the present invention.

FIG. 38 is a diagram showing thermocompression bonding of a chip onto the display substrate of the present invention.

FIG. 39 is a diagram showing the removal of nickel on the chip of the present invention.

FIG. 40 is a view showing a state of being fitted into the polymer film formed on the display substrate of the present invention.

FIG. 41 is a diagram showing a pixel control element formed on a substrate of the present invention.

FIG. 42 is a diagram showing the formation of an organic protective film and the formation of a nickel film on the pixel control element formation surface of the substrate of the present invention.

FIG. 43 is a diagram showing back surface polishing of the substrate of the present invention.

FIG. 44 is a diagram showing patterning of the back surface of the substrate of the present invention.

FIG. 45 is a diagram showing fabrication of a micro integrated circuit chip by wet etching of the present invention.

FIG. 46 is a diagram showing the completion of the micro integrated circuit chip of the present invention.

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Claims (19)

[Claims] 1. In a large screen flat panel display such as a liquid crystal display (LCD), an organic electroluminescence (organic EL) display, a field emission display (FED), etc., ON / OFF of each pixel constituting the screen,
A number of minute transistors, diodes, and metal / insulator / metal (Metal / Insulat)
or / Metal = MIM) with a structure controlled by electronic devices such as elements,
A large number of electronic devices such as diodes and MIM elements are manufactured in places other than the display device, and are fixed by sticking to a predetermined position in the vicinity of each pixel in the display device constituent substrate by means such as printing technology. And a large-screen flat display device characterized by being formed by connecting a large number of such microelectronic devices by circuit wiring formed by a printing technique or the like, and the above-mentioned manufacturing method for forming the same. Manufacturing equipment that realizes that. 2. A large number of microelectronic devices such as transistors according to claim 1 are manufactured in a large amount in a place other than the display device, and the microelectronic devices are formed in the vicinity of each pixel in the display device constituting substrate. A method of pasting and fixing at a predetermined position by means such as a printing technique is to arrange a large number of microelectronic devices in advance on a printing original plate,
A large screen flat display device characterized by a method of transferring it to a predetermined position near each pixel in a display device constituting substrate at the time of printing, the above-mentioned manufacturing method for forming the same, and manufacturing for realizing the same apparatus. 3. A printing technique for fixing a large number of electronic devices such as microtransistors in a predetermined position by a printing technique or the like according to claims 1 and 2 and / or a large number of microdevices. Manufacturing method and manufacturing of large-screen flat display, characterized in that the printing method of wiring for connecting the electronic device by a printing technique is a means of printing a resist or the like in an imprinting method or an ordinary printing method. apparatus. 4. A plurality of microelectronic devices produced in large quantity in a place other than the display device according to claims 1 to 3 are placed at predetermined positions on a display device constituting substrate by means of printing technology or the like. A large-screen flat display device and a large-screen flat-panel display device, characterized in that the work of sticking and fixing and the work of connecting these microelectronic devices by circuit wiring formed by printing technology or the like are performed simultaneously by means of printing technology or the like. The above-mentioned manufacturing method and manufacturing apparatus for realizing the same. 5. A large screen flat display according to claim 1, wherein a large number of minute pixels arranged near each pixel for controlling ON, OFF and shading of each pixel constituting the screen. Transistor, diode, electronic device such as metal / insulator / metal (Metal / Insulator / Metal = MIM) element, etc. are manufactured in many places other than the display device.
Alternatively, a polycrystalline silicon integrated circuit, an amorphous silicon integrated circuit, a metal / insulator / metal (MIM) element, and other functions may be independently provided before they are installed at a predetermined position on a display device substrate by the printing method or the like. A large-screen flat display device characterized by being an established electronic device, the above-mentioned manufacturing method for forming the same, and a manufacturing apparatus for realizing the same. 6. A pixel control element is manufactured from a large number of electronic devices (microelectronic devices) such as microtransistors according to claims 1 to 5 on a crystalline silicon substrate or a ceramic substrate. A large-screen flat display device, which is manufactured by cutting into a desired size for arranging in the vicinity of each pixel on a display substrate, the above-mentioned manufacturing method for forming the same, and a manufacturing apparatus for realizing the same. 7. A plurality of pixels are formed in one microelectronic device by forming a pixel control element for controlling a plurality of pixels in the microelectronic device according to claims 1 to 6. A large screen flat display device characterized in that the surface shape on which the pixel control elements of the microelectronic device are formed is a rectangle in order to properly arrange the microelectronic device on the display substrate. The above manufacturing method for forming the same and the manufacturing apparatus for realizing the same. 8. The microelectronic device according to claims 1 to 7, wherein the microelectronic device is arranged on a printing original plate, or when the microelectronic device is arranged on a mold in advance before the microelectronic device is arranged on the printing original plate. In order to properly arrange the microelectronic device on the display substrate, the surface shape on which the pixel control element of the microelectronic device is formed is rectangular and the shape below it is pyramidal or trapezoidal. A large-screen flat display device having the characteristics, the above-mentioned manufacturing method for forming the same, and a manufacturing apparatus for realizing the same. 9. The method of preliminarily arranging a large number of microelectronic devices on a printing original plate according to claim 2, wherein a paramagnetic material such as nickel is previously attached to the surface by using a large number of micromagnets or the like. A large screen flat display device, a manufacturing method for forming the large screen flat display device, and a manufacturing apparatus for realizing the same. 10. The method according to claim 2 in which a large number of microelectronic devices are arranged in advance on the printing original plate is a method using mechanical vibration, vacuum suction, action of gas flow, or the like. A large-screen flat display device having the characteristics, the above-mentioned manufacturing method for forming the same, and a manufacturing apparatus for realizing the same. 11. A method of preliminarily arranging a large number of microelectronic devices on a printing original plate according to claim 2, wherein a magnetic material such as nickel is attached to the microelectronic devices in advance, In a mold in which a concave shape that fits the microelectronic device is processed in a position where the microelectronic device should be placed on the display substrate,
The microelectronic device is fitted into the mold by the printing original plate equipped with an electromagnet after sprinkling the microelectronic device, fitting the microelectronic device by mechanical vibration or gas flow and removing the extra microelectronic device that did not fit. A large-screen flat display device characterized by disposing a microelectronic device on a printing original plate by attracting the device by magnetic force, the above-mentioned manufacturing method for forming the same, and a manufacturing apparatus for realizing the same. 12. The method of preliminarily arranging a large number of microelectronic devices on a printing original plate according to claim 2, wherein the microelectronic devices are arranged in a groove by mechanical vibration, and the microelectronic devices are arranged. In advance, a magnetic substance such as nickel is attached to the surface of the microelectronic device in advance, and the microelectronic device is applied to the printing original plate by magnetically adsorbing the microelectronic device or by vacuum adsorption. A large-screen flat display device characterized by being arranged, the above manufacturing method for forming the same, and a manufacturing device for realizing the same. 13. Arrangement of a large number of microelectronic devices on a printing original plate or a mold according to claims 2 and 10 or 11 or 12.
A mold in which a concave shape in which a microelectronic device fits in a printing original plate or a place where the microelectronic device is to be arranged on a display substrate is processed by the method according to claim 10, 11 or 12. After arranging the microelectronic device on the, the surface observation or optical inspection,
Alternatively, stylus inspection is performed to inspect locations where the microelectronic devices are not placed. By placing
A large-screen flat display device characterized by disposing microelectronic devices at predetermined disposition locations of all microelectronic devices, the above-mentioned manufacturing method for forming the same, and a manufacturing apparatus for realizing the same. 14. Before printing the microelectronic device according to claims 1 to 13 on a printing original plate,
The rectangle according to claim 7 or 8 at a predetermined place where a microelectronic device fits in a display substrate to be printed, or an organic film formed on the display substrate by lamination, spin coating, or roll coating. , A rectangular hole with a concave shape that matches the shape of a pyramid-shaped or trapezoidal-shaped microelectronic device, or is punched, and then placed at a predetermined location on the display substrate or film. A large-screen flat display device characterized by printing a microelectronic device, a manufacturing method for forming the same, and a manufacturing apparatus for realizing the same. 15. A large screen plane characterized in that the material of the display substrate on which the microelectronic device according to claim 1 is printed with a printing original plate is acrylic, polystyrene, or polycarbonate. A display device, the above-mentioned manufacturing method for forming the same, and a manufacturing device for realizing the same. 16. A display substrate, which is a target for printing the microelectronic device according to any one of claims 1 to 15 on a printing original plate, is laminated, spin-coated, or roll-coated with polyethylene, polypropylene, or A large-screen flat display device characterized by forming an organic film of polyvinyl chloride or polystyrene and printing a microelectronic device thereon, the above-mentioned manufacturing method for forming the same, and a manufacturing device for realizing the same. 17. A printing original plate for printing a microelectronic device according to any one of claims 1 to 16 is performed by heating a printing original plate on which a microelectronic device is arranged.
A large-screen flat display device characterized by immobilizing a microelectronic device on a substrate or a film, the above-mentioned manufacturing method for forming the same, and a manufacturing apparatus for realizing the same. 18. A large screen flat display device and a large screen flat display device according to claim 1, wherein the large screen flat display is a large screen display having a diagonal of 40 inches or more. The above manufacturing method and a manufacturing apparatus for realizing the same. 19. A manufacturing method and a manufacturing apparatus for a large-screen flat display, wherein the large-screen flat display in claims 1 to 18 is a high-definition (high definition) display.