JP2003266318A - Grinding wheel, grinding method and grinder for organic elastic body - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a grinding wheel for grinding an organic elastic body which has high finishing face accuracy and dimensional accuracy and can suppress clogging and to provide a grinding method and a grinder for the organic elastic body with excellent productivity and machining accuracy. <P>SOLUTION: This grinding wheel 1 on which a spiral abrasive grain layer is formed projecting outward in the radial direction in the outer circumferential face of a disk or a cylindrical body is characterized by that an angle θ between a grinding wheel spindle and an abrasive grain layer is 65 to 85 degrees and a distance L between the abrasive grain layer 1a along the circumferential direction on the outer circumferential face is 20 mm or more. A second abrasive grain layer with the abrasive grain density smaller than that of the abrasive grain layer can be provided between the abrasive grain layers. This grinding wheel is provided with a rotating mechanism of the grinding wheel and a mechanism for relative movement of the organic elastic body 5 to be ground and the grinding wheel, and the grinding wheel is brought into contact with the organic elastic body while being rotated. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a grindstone for an organic elastic body, a grinder, and a grinding method, and more particularly, to an organic elastic body which is excellent in dimensional accuracy and finishing surface accuracy, and which suppresses clogging of the grindstone for a long time. The present invention relates to a grinding wheel and a grinding method that enable stable grinding.

[0002]

2. Description of the Related Art Among machine parts using various organic elastic materials such as rubber, those used for rotary rollers of OA equipment require high dimensional accuracy and surface accuracy, and therefore finish grinding after molding. Is generally performed. In the grinding process, generally, as shown in FIG. 5, while simultaneously rotating a grindstone 1 fixed to a grindstone headstock 3 by a fixing jig 2 and a grinding target roller 5 supported by a bearing stand 6 and a motor 4, So-called cylindrical plunge grinding (FIG. 5 (a)) in which abutting is performed, or one of which is further moved in the axial direction (arrow direction) while rotating the grindstone 1 and the roller 5 to grind the entire surface of the roller. Traverse grinding (Fig. 5
(B)) or the like is adopted, and the abrasive grain density (size and interval) of the grindstone is selected according to the required finishing surface accuracy.
When the organic elastic body is ground by such a method, grinding debris enters the gaps or pores between the abrasive grains, and clogging is likely to occur.Therefore, it is necessary to frequently perform dressing of the grindstone, which results in high productivity. There is a problem of being low. Therefore, various measures for suppressing clogging and improving productivity have been studied. For example, in Japanese Patent Laid-Open No. 2001-71270, a method of forming a groove on the outer peripheral surface of a grindstone and discharging grinding waste along the groove, A method is disclosed in which compressed air is blown during grinding to forcibly discharge grinding debris. By these methods, the clogging of the grindstone can be suppressed for a long period of time, and the grinding productivity of the organic elastic body is greatly improved.

[0003]

However, in the case of a printer, for example, when a higher-definition image such as an increase in pixel density or full color is demanded, the paper feed roller, the toner fixing roller, the photosensitive drum, etc. are also required. Increasingly high finishing surface accuracy and dimensional accuracy are required.
The grinding method disclosed in No. 270 did not always achieve the required accuracy of grinding. That is, since the organic elastic body has a large elastic deformation, when the grindstone is applied to the elastic body, the elastic body escapes, and it is not possible to make a cut as designed and the dimensional accuracy becomes low, and a sawtooth stripe pattern is formed on the surface. It has been found that it is difficult to cope with higher processing accuracy due to the occurrence of surface accuracy. For this reason, a method of cooling the organic elastic body to a low temperature below the glass transition point with liquid nitrogen or the like and performing grinding is also being studied, but although the processing accuracy is improved, the productivity is low and the production cost is increased. There's a problem. Further, by adopting a wet method in which grinding is performed while supplying water or the like, surface accuracy is improved, but slippage occurs between the grindstone and the surface of the organic elastic body, and desired dimensional accuracy cannot be obtained. I also understood. That is, in the conventional grinding method, it was practically difficult to perform highly accurate organic elastic body grinding satisfying both dimensional accuracy and surface accuracy with high productivity.

In view of the above situation, the inventor of the present invention grinds under various conditions using grindstones of various structures and grain sizes in order to develop a grinding method capable of achieving higher processing accuracy. A detailed study was conducted on the relationship between the conditions of 1 and processing accuracy. Among these, the grindstone in which the grindstone layer is formed in a spiral shape not only has the effect of efficiently discharging grinding debris and suppressing clogging, but due to the structure of the spiral grindstone layer,
In particular, it has been found that the dimensional accuracy and surface accuracy greatly change depending on the distance between the grindstone layers and the angle with respect to the spiral axis. Therefore, the present inventor has further studied based on such knowledge, devised a grindstone structure satisfying both high dimensional accuracy and surface accuracy, and completed the present invention. That is, it is an object of the present invention to provide a grinding stone of an organic elastic body having excellent finished surface accuracy and dimensional accuracy. In addition, productivity,
An object of the present invention is to provide a grinding method and a grinding device for an organic elastic body having excellent processing accuracy.

[0005]

A grinding wheel for an organic elastic body of the present invention is a grinding wheel in which a spiral abrasive grain layer protruding radially outward is formed on the outer peripheral surface of a disk or a cylindrical body, The angle θ between the main axis of the grindstone and the abrasive layer is 65-85 °,
The distance L on the outer peripheral surface between the abrasive grain layers along the circumferential direction is 2
It is characterized in that it is set to 0 mm or more. By forming an abrasive grain layer in a spiral shape on the outer peripheral surface of the grindstone and setting the distance L between the abrasive grain layers along the circumferential direction to 20 mm or more, the grindstone continuously contacts the organic elastic body, and a stable pressure is applied. Grinding becomes possible, and a sufficiently large cutting depth is obtained because grinding is performed with one abrasive grain layer and then with the next abrasive grain layer, and it is possible to perform grinding to a design value in a short time. Further, by setting the angle θ between the main axis of the grindstone and the abrasive grain layer to be 65 to 85 °, L
Even when the value is as large as 20 mm or more, the force exerted on the organic elastic body is kept uniform, so that vibration is suppressed, uniform grinding is possible, and higher surface accuracy can be obtained. In addition, the grinding wheel of the present invention has a configuration in which a portion in which the abrasive grain layer is formed and a portion in which no abrasive grain is present are alternately arranged in the circumferential direction, and in one abrasive grain layer, the vicinity of one end portion in the circumferential direction is provided. The abrasive grains and the abrasive grains present thereafter up to the other end are divided into the functions of shaving and finishing the organic elastic body, respectively. Since no grinding waste remains in the region (recess) between the abrasive grain layers, the abrasive grains present at one end of the abrasive grain layer do not hinder the cutting of the organic elastic body. Further, the polishing is performed with the abrasive grains to the other end portion on the rear side, and sufficient surface accuracy can be obtained. Even if grinding debris enters this abrasive grain layer, it does not affect the cutting function of the tip abrasive grains,
Also, the surface accuracy is secured. The above-mentioned protruding abrasive grain layer can be formed, for example, by forming an abrasive grain layer on the outer peripheral surface of a disc or a columnar body by an electrodeposition method or by cutting the outer peripheral surface of a grindstone body.

Further, the grinding wheel of the present invention may have a structure in which a second abrasive grain layer having a smaller abrasive grain density than the abrasive grain layer is provided between the abrasive grain layers, and the same effect can be obtained. In the present invention, the spiral abrasive grain layer means that the case where the grindstone layer is divided at the end face of the grindstone also includes the annular shape, and when the grindstone width is narrow, it is possible to use the annular abrasive grain layer. it can.
Further, it is preferable that the sum of the lengths of the protruding abrasive grain layers in the main axis direction of the grindstone is substantially constant over the outer peripheral surface. As a result, more stable grinding is possible and the surface accuracy is further improved.

The grinder for an organic elastic body of the present invention comprises the above-mentioned grindstone of the present invention, a rotating mechanism for the grindstone, and a mechanism for relatively moving the grindstone with the organic elastic body to be ground. Is characterized by. As a result, it is possible to precisely grind organic elastic bodies having various shapes such as a roller and a flat plate shape, and it is possible to realize a grinder having excellent processing accuracy and high productivity.

The method for grinding an organic elastic material of the present invention is
A method of grinding an organic elastic body with a grinding stone, characterized in that the grindstone of the present invention is brought into contact with the organic elastic body while rotating.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic view showing an example of a grinder and a grindstone used for grinding an organic elastic body roller. As shown in the figure, the grinder includes a grindstone headstock 3 that rotatably supports the grindstone 1, a bearing base 6 that rotatably supports an organic elastic body roller 5 that is an object to be ground, and a motor 4. The grindstone 1 is fixed to the grindstone headstock 3 by a fixing jig 2. Further, the grindstone headstock 3 is moved in the horizontal and vertical directions in the figure by a moving mechanism (not shown).

The grindstone 1 is formed with a spiral abrasive grain layer 1a on the outer peripheral surface of a cylindrical member at a predetermined interval and at a predetermined angle (θ) with the main axis of the grindstone. Where θ is 65
˜85 °, and the distance L on the outer peripheral surface between the abrasive grain layers along the circumferential direction is 20 mm or more. By setting L to 20 mm or more, a sufficient cutting depth is secured, and grinding with higher dimensional accuracy can be performed in a short time. On the other hand, when θ is set to 65 ° or more, even when L is set to 20 mm or more, vibration between the organic elastic body and the grindstone is suppressed, and more uniform grinding becomes possible and surface accuracy is improved. Further, by setting the angle to 85 ° or less, the discharge of grinding debris is promptly performed, clogging can be suppressed, and high productivity can be secured. If the width of the abrasive grain layer along the circumferential (rotational) direction is too long, the effect of the groove decreases, and if it is too short, the grinding effect (particularly surface accuracy) decreases, so 0.3L to 3.
It is preferably about 0 L. Further, it is preferable that the total length of the abrasive grain layers in the main axis direction is constant over the entire outer peripheral surface so that the area of the abrasive grain layer in contact with the organic elastic body is always constant.

The height of the protruding abrasive grain layer is preferably about 0.5 mm or more. By forming such irregularities, the contact area between the grindstone and the organic elastic body is reduced, and the force per unit area by which the grindstone presses the organic elastic body is increased. As a result, since the organic elastic body has a shape to bite into the concave portion, the escape of the organic elastic body is further suppressed, a desired cut is made more quickly, and the dimensional accuracy,
The surface accuracy is further improved. Further, the grinding debris is easily discharged through the recess, and stable continuous grinding can be performed for a longer period.

Grinding of the organic elastic roller using the grinder shown in FIG. 1 is performed as follows. First, the organic elastic roller 5 and the grindstone 1 are each rotated at a predetermined number of revolutions, and then the grinding wheel is lowered at a predetermined cutting speed for a stroke corresponding to a predetermined cutting depth. In this case, it is preferable to swing the grindstone in the main axis direction with a predetermined stroke, and the roller surface accuracy and the dimensional accuracy can be further improved. When the grinding is started, the grinding waste is effectively discharged from the space between the abrasive grain layers to the outside. Further, the cutting and finishing of the organic elastic body are respectively performed by the abrasive grains at the tip of the abrasive grain layer in the rotational direction of the outer peripheral surface of the grindstone and the abrasive grains located rearward in the same abrasive grain layer. That is, if grinding continues, grinding debris will clog the inside of the abrasive grain layer, but the abrasive grain at the tip of the abrasive grain layer in the direction of rotation always ensures a predetermined abrasive grain cutting depth hmax, and the organic elastic body Slitting is performed stably. Further, a high surface accuracy can be obtained by the rear abrasive grains. In this way, for example, even if a grindstone of # 100 or more is used, clogging is suppressed and grinding with extremely high finished surface accuracy (Rmax = about 10 μm or less) and dimensional accuracy (about 10 μm or less) becomes possible.

A grindstone according to another embodiment of the present invention is shown in the schematic sectional view of FIG. The grindstone shown in FIG. 2A is formed by cutting the outer peripheral surface of the grindstone to form the groove 1b to form the protruding abrasive grain layer 1a. The depth of the groove is preferably selected to be about 0.5 mm or more, similarly to the height of the abrasive grain layer described above. Further, the same effect can be obtained with the grindstone having the structure shown in FIG. The grindstone of FIG. 2 (b) forms a spiral abrasive grain layer 1a on the outer peripheral surface of the grindstone, and the abrasive grain layer 1
Second abrasive grain layer 1a ′ having a smaller (rougher) abrasive grain density than a
Is formed. For example, the coarse abrasive grain layers 1a 'having a grain size of about # 10 and the fine abrasive grain layers 1a of about # 100 are alternately arranged. In this case,
Since the discharge effect of grinding debris is lower than that of the grindstone of (a), in some cases, continuous grinding of rubber can be performed with stable processing accuracy by performing grinding while blowing compressed air.

The grindstone of the present invention may have a structure in which the whole grindstone is composed of abrasive grains, or a structure in which an abrasive grain layer is formed only on the outer peripheral surface portion. The grindstone shown in FIGS. 1 and 2 (b) is manufactured by, for example, an electrodeposition method.
In the case of the grooved grindstone of FIG. 2A, for example, a method of cutting the outer peripheral surface of the grindstone in a spiral shape can be used.

Next, the present invention will be described in more detail with reference to examples. The spiral groove shown in FIG. 2A was formed on a grindstone (WA100k8v manufactured by Klenorton Co., Ltd.) having a width of 10 mm and a diameter of 150 mm. Here, the width of the abrasive grain layer was 6.12 mm, the width and depth of the groove were 6.12 mm and 0.5 mm, respectively, and the angle θ of the abrasive grain layer with the main axis of the grindstone was 80 °. At this time, the distance L between the abrasive grain layers along the circumferential direction is 35 mm. As shown in FIG. 3, this grindstone 1 was attached to a grinder (Kuroda Seiko surface grinder GS-BMS type), while 30
A rubber roller (urethane rubber) 5 for OA equipment rotating roller having a diameter of mm and a length of 70 mm was attached to a strut-type two-component force dynamometer 7 and surface grinding was performed. Here, the grinding conditions were a grinding peripheral speed of 10 m / s, a feed speed of 0.3 m / min, a cutting depth of 0.1 mm, and a cutting frequency of 15 times. Also,
For comparison, a grooveless grindstone (Comparative Example 1) and θ = 45 °,
The same grinding was performed using a spiral grooved grindstone with L = 8.7 mm (Comparative Example 2).

Table 1 shows a part of the results obtained for each of the uncut amount and the finished surface accuracy. Further, FIG. 4 shows changes in the grinding resistance in the present example and the comparative example 1. Here, Ft in FIG. 4 is the tangential grinding resistance, Fn
Is the grinding resistance in the vertical direction (see FIG. 3), and W is the grinding width. The grinding resistance of Comparative Example 2 in which the spiral groove is formed is
Since the result is similar to that of the example, it is omitted here.

[0017]

[Table 1]

As is clear from Table 1, the uncut amount in this example is significantly reduced as compared with Comparative Example 1 and Comparative Example 2,
It can be seen that grinding can be performed as designed. Furthermore, it can be seen that the finishing surface accuracy is also greatly improved and extremely high processing accuracy can be obtained even with an elastic body such as rubber. Further, in the present embodiment, as shown in FIG. 4, the grinding resistance is small and hardly changes even if the grinding is repeated, so that it is understood that stable grinding without clogging can be continuously performed. That is, by using a grindstone having an abrasive grain layer with θ of 65 to 85 ° and L of 20 mm or more, dimensional accuracy as designed can be obtained, and grinding with high surface accuracy becomes possible. In addition, this also shortens the grinding time and can further improve the productivity.

Next, for reference, Table 2 shows the results of grinding performed under the same conditions except that the grinding liquid (water) was supplied.

[Table 2] When the wet method is used, the processing accuracy is improved by using the spiral groove grindstone as in the dry method, but the accuracy is lower than that of the dry method. This is because the grinding fluid causes slippage between the abrasive grains and the rubber surface,
It is considered that it is difficult to cut the rubber. That is, when using a grindstone with a spiral groove, it is understood that a higher processing accuracy can be obtained by performing the dry method.

[0020]

As described above, the present invention enables grinding with higher surface accuracy and dimensional accuracy, and
A reduction in grinding time can be achieved. Further, clogging is suppressed, and stable precision grinding can be stably performed for a long period of time.

[Brief description of drawings]

FIG. 1 is a schematic view showing an example of a grinding wheel and a grinder of the present invention.

FIG. 2 is a schematic view showing another example of the grinding wheel of the present invention.

FIG. 3 is a schematic view showing a surface grinding of a rubber roller and a grinding resistance measuring system at that time.

FIG. 4 is a graph showing changes in grinding resistance for the grindstones of Example 1 (a) and Comparative example 1 (b).

FIG. 5 is a schematic view showing a conventional grinding method.

[Explanation of symbols]

1 whetstone, 1a, 1a 'abrasive grain layer, 1b groove, 2 fixed jig, 3 Grindstone headstock, 5 rubber roller, 4 motors, 6 bearing stand, 7 Post type 2 component force dynamometer.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Takeshi Liu             1-23-2-Mudame, Kanazawa-ku, Yokohama-shi, Kanagawa             107 F-term (reference) 3C063 AA02 AB03 BA32 BA35 BB21                       BC02 BG10 CC12 EE15 FF20                       FF23

Claims (4)

[Claims] 1. A grindstone in which a spiral abrasive grain layer protruding radially outward is formed on the outer peripheral surface of a disk or a columnar body, and an angle θ formed between the spindle of the stone and the abrasive grain layer is 65 to 85.
°, the distance L between the abrasive grain layers along the circumferential direction on the outer peripheral surface
Is 20 mm or more, and is an organic elastic body grinding wheel. 2. The grinding stone for an organic elastic body according to claim 1, wherein a second abrasive grain layer having a smaller abrasive grain density than the abrasive grain layer is provided between the abrasive grain layers. 3. An organic material comprising: the grindstone according to claim 1 or 2, a rotating mechanism for the grindstone, and a mechanism for relatively moving the organic elastic body to be ground and the grindstone. An elastic body grinder. 4. A method of grinding an organic elastic body with a grinding stone, wherein the grinding stone according to claim 1 is brought into contact with the organic elastic body while rotating. .