JP2003264353A - Portable radio apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To increase a mounting area without increasing the size of a substrate and obtain a connecting between substrates at a low cost which connection is suitable for miniaturization. <P>SOLUTION: In this portable radio apparatus, a substrate unit which is provided with substrate 21, 23 constituted of a plurality of number of sheets and a flexible substrate 3 for electrically connecting a part between the substrates 21, 23 is installed inside a cabinet. A stretched part 34 is formed on an insulating sheet constituting the base of the flexible substrate 3, and used as an insulating means on facing surfaces of the substrates which face and approach each other. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a portable radio apparatus having a substrate unit in which a plurality of substrates are laminated inside a casing and electrically connected between the substrates by a flexible substrate. Is.

[0002]

2. Description of the Related Art In recent years, portable terminal devices have been made smaller, lighter and more multifunctional according to the needs of consumers, while taking into consideration the improvement of operability of keys. Under such circumstances, the number of electronic components and the like provided inside the mobile terminal device is increasing, and accompanying this, the board on which these electronic components are mounted is inevitably increased in size.

Therefore, in order to reduce the size of the housing of the portable terminal device, the number of boards on which electronic components and the like are mounted is not one but two.
Some have been developed that increase the mounting area by configuring with more than one sheet. Thus, in the case of being composed of a plurality of boards, for example, as shown in FIG. 9, the spring connector 103 provided on the main board 101 is used to make a point or line contact with the land 104 of the other key board 102 or the like. For the purpose of electrical continuity, or as shown in FIG.
It is known that the connectors 105 and 106 are attached to the connector 2, and the connectors 105 and 106 are physically fitted and coupled to each other. In addition, these FIG. 9 and FIG.
At 0, a spacer 107 is provided between the substrates to keep the gap between the substrates constant.

However, in such a board-to-board connection, by mounting the spring connector 103 and the connectors 105 and 106, for example, the required board component mounting area is reduced. Therefore, in order to increase the component mounting area, F
A structure in which a PC (Flexible Printed Circuit) board and an FPC connector are used to connect both boards has been studied.

That is, as shown in FIG. 11, the FPC connector 108 is mounted on the main board 101, and the FPC board 109 is mounted on the FPC connector 108.
While one end side terminal of the FPC connector 1 is inserted and fixed, the key board 102 is a surface facing the main board 101 and the FPC connector 1
ACF (anisotropic conductive film) connection is performed in a region other than the region facing 08.

By the way, the substrate and the flexible substrate are
When connecting CF, it is necessary to add heat.
If there is a connecting portion for inter-layer connection that constitutes conduction in the connection region, thermal expansion may cause damage or breakage of the substrate or the connecting portion, and inter-layer connection cannot be performed in the vicinity thereof.
Therefore, as a substrate for this ACF connection, it is important to use a substrate that does not include interlayer connection in the layer in terms of reliability, and at the same time, it is inexpensive, which is convenient.

By the way, in the inter-board connection having such a structure, the mounting area and the mounting volume can be made compact, which is convenient for downsizing of the housing, and there is no problem in that respect.

[0008]

[Problems to be Solved by the Invention] However, the ACF
When the FPC connector is mounted in the area facing the ACF connection area on the opposite surface of the opposite board facing the board to which the connection is made, the ACF connection part and the FPC connector are separated because the boards are close to each other. There is a risk of contact and short circuit. Further, in the ACF-connected substrate, for example, there is a risk that the ACF-connected portion near the ACF-connected portion may come into contact with the FPC connector, electronic component, land, etc. mounted on the other substrate.

Under these circumstances, it is necessary to (1) perform ACF connection in a region other than the facing region of the FPC connector on the other substrate facing the substrate on which the FPC connector is mounted. (2) Further, it is necessary to provide pattern wiring and through holes in a region avoiding the facing region of the FPC connector. As a result, the mounting area is substantially increased. Further, in order to avoid this, for example, attaching an insulator on the exposed pattern wiring has been considered, but this will increase the number of steps and the cost.

In view of the above-mentioned circumstances, the present invention can increase the mounting area without increasing the size of the board, and correspondingly realize an inexpensive board-to-board connection suitable for downsizing. It is an object of the present invention to provide a portable wireless device capable of achieving downsizing and cost reduction of a housing.

[0011]

That is, firstly, the invention according to claim 1 includes a substrate unit comprising a plurality of substrates and a flexible substrate for electrically connecting the substrates. A portable wireless device having a housing inside,
It is characterized in that an extending portion is provided on an insulating sheet which constitutes the base portion of the flexible substrate, and the extending portion is used as an insulating means between the facing surfaces of the substrate which face each other and approach each other.

Thus, for example, even if a pattern wiring or the like is provided up to the insulating region in the immediate vicinity of the ACF connection portion, the insulation between the pattern wiring and the connector can be secured by the extension portion, so that the size of the board is increased. It is possible to increase the mounting area without performing the above, and accordingly, it is possible to realize board-to-board connection suitable for space saving.

In the invention according to claim 2, the flexible board can be connected to the one board by the ACF connection and can be connected to the other board through a connector.

Thus, by connecting the flexible board to one board by ACF connection, the gap between the boards can be made thinner than in the case where both boards and the flexible board are connected together by the connector. it can.

According to a third aspect of the invention, the one substrate is provided with a pattern wiring portion near the ACF connection portion on the surface facing the other substrate, and the pattern wiring on the one substrate is provided. A flexible board may be attached between the two boards in such a positional relationship that the extension portion of the flexible board is arranged in a gap between the part and the connector on the other board.

With this, the extension portion of the FPC board can be arranged between the pattern wiring portion provided on one substrate and the connector provided on the other substrate at a position opposite to the pattern wiring portion. Even if the wiring portion and the connector are brought close to each other or faced to each other, the insulation between them can be ensured.

According to a fourth aspect of the present invention, the other substrate is provided with a component mounting portion near the FPC connector mounting portion on the surface facing the one substrate, and the other substrate is mounted on the other substrate. A flexible board may be attached between the two boards in a positional relationship in which the extension portion of the flexible board is arranged in a gap between the component mounting portion and the one board.

As a result, the extension portion of the FPC board is arranged between the component mounting portion provided on the other substrate in the vicinity of the connector and the one substrate (pattern wiring portion or the like) at a position facing the component mounting portion. Therefore, even if one board (pattern wiring portion or the like) and the mounted electronic component or the like on the other board are made to approach or face each other, the insulation between them can be secured.

According to a fifth aspect of the present invention, the one substrate is a key substrate in which a key switch is mounted on the surface opposite to the facing surface, and the other substrate is a main board. Further, a spacer for holding a gap may be arranged between the both substrates.

As a result, the key board and the main board are
When connecting with a PC board, the mounting area on these boards can be greatly expanded without using a board whose both board areas are increased.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. [First Embodiment] FIG. 1 shows a mobile phone according to a first embodiment of the present invention. This mobile phone has an upper housing 1 and a lower housing 2 as main components. It is composed of a hinge portion 6 that rotatably connects these casings.

Of these, the upper housing 1 is roughly provided with an upper case 1A and an upper cover 1B, an LCD 11 housed between them, an LCD substrate 12 and the like. On the other hand, the lower case 2 has a general configuration including the lower case 2
It is provided with A and the lower cover 2B, a main board 21 housed between them, a spacer 22, a key board 23, a panel switch 24, a key sheet 25 and the like. The lower housing 2 also includes an antenna 26 and a battery pack 27.

In particular, in this embodiment, as shown in FIGS. 2 and 3, the main substrate 21 and the key substrate 23, which are laminated in two layers via the spacer 22 to form a substrate unit, are the FPC substrate. It is electrically connected via 3.

Although not shown, various electronic components for mobile phones are mounted on the main board 21, and the FP
An FPC board 3 described later in order to connect to the C board 3
The FPC connector 4 into which the tip terminal 33 of FIG. As shown in FIG. 5, the FPC connector 4 includes a connector body 41 and an openable / closable lid body 42 that covers the connector body 41 from above. The tip terminal 33 of the FPC board 3 is sandwiched and fixed between the spring for use and the lid 42.

The spacer 22 secures a constant distance between the main board 21 and the key board 23 and holds both boards in a stationary state while maintaining a required strength. The board is detachably locked by the claw 22A. Further, this spacer 22 has a structure shown in FIG.
As shown in FIG.
In order to reinforce, a pair of leg portions 22B provided by straddling the base end side terminals 32 in the width direction are projected.

A base end side terminal 32 of an FPC board 3 to be described later in FIG. 4 is ACF-connected to the key board 23, and an insulating region β in the immediate vicinity of the ACF connecting portion α is
There are provided pattern wiring 23A, lands (not shown), through holes 23B, etc. for connection with electronic components and key switches mounted on the opposite surface side.

This FPC board 3 is, as shown in FIG.
An insulating sheet, for example, a base portion 31 formed of an insulating resin material such as polyimide (porimido), and the base portion 3
1. A large number of signal lines (not shown) arranged in one, the proximal terminals 32 and the distal terminals 33 for connection provided at both ends (the proximal end side and the distal end) of the signal line, and the base portion 31. In particular, of these terminals, an extension portion 34 provided by further extending from the installation portion of the base end side terminal 32 for connection with the key board 23.
It has and.

As shown in FIG. 5, the base end side terminal 32 has a wide end and a narrow end so that a large number of connection terminals can be surely connected in a constant width W. In addition to being arranged alternately, a small width and a large width are alternately arranged in a zigzag arrangement in the direction slightly closer to the base end from the tip. Further, the base end side terminal 32 is provided with an electrode plate 33A having both ends in the width direction formed in a wide shape at a portion inserted by a length D1 from the distal end. As a guide, you can check the minimum insertion depth. Further, in the base end side terminal 32, at a portion separated from the tip by a length D2,
The electrode plate 33B having a width wider than that of the electrode plate 33A is provided, so that when the electrode plate 33B is pushed to the end of the FPC connector 4, the strength of the contact portion (not shown) can be increased. There is.

The extending portion 34, as shown in FIG.
Pattern wiring 23A of the key board 23, lands (not shown),
Physically covering the through hole 23B from the outside,
Particularly, in this embodiment, an insulating means for insulating the FPC connector 4 mounted on the opposing main board 21 is configured. As shown in FIG. 6B, the extending portion 34 has a structure in which a slight space S is held and separated from a surface 230 of the key board 23 facing the main board 21, It may be fixed to the surface 230.

According to this embodiment, as shown in FIG. 6A, between the pattern wiring 23A on the key substrate 23 and the FPC connector 4 arranged on the main substrate 21 so as to face the pattern wiring 23A. The FPC board 3 is attached between the two boards 21 and 23 in such a state that the extension 34 of the FPC board 3 shields the gap (over the insulating region β). Therefore, even if the pattern wiring 23A, the land (not shown), the through hole 23B, and the like are provided up to the insulating region β in the immediate vicinity of the ACF connection portion α, the insulation between the pattern wiring 23A and the FPC connector 4 is extended. It can be secured at the outlet 34. For this reason, the mounting area can be increased and the inter-board connection can be performed without increasing the size of both boards 21 and 23.
At the same time, since both the substrates 21 and 23 can be insulated by the extension portion 34 arranged in the gap between the substrates 21 and 23 which are close to and face each other, in other words, the volume of the substrate unit inside the lower housing 2 is minimized. Both substrates 21, 23 while holding down to the limit
Insulation between them can be secured.

[Second Embodiment] Next, the second embodiment of the present invention will be described.
A mobile phone according to the embodiment will be described with reference to the drawings. In this embodiment, the same parts as those in the first embodiment are designated by the same reference numerals to avoid redundant description. In the mobile phone according to the second embodiment shown in FIG. 7, the electronic component 5 is mounted on the component mounting portion of the main substrate 21 facing the key substrate 23 and near the mounting portion of the FPC connector 4. ing. On the other hand, on the key board 23,
In the gap facing the electronic component 5 of the main board 21, the FPC
The extending portion 35 of the substrate 3 is arranged so as to be greatly extended.

The extending portion 34 is an F on the main board 21 side.
Do not make contact between the PC connector 4 and the pattern wiring 23A, the land (not shown), and the through hole 23B provided in the insulating region γ which is opposed to the FPC connector 4 and is in the immediate vicinity of the ACF connection portion α of the key substrate 23. To (insulate)
It has a shape extending in the longitudinal direction of the base portion 31 of the PC board 3. Further, the extending portion 35 is provided on the main board 21.
Side electronic component 5 provided in the vicinity of the FPC connector 4 and pattern wiring 23C, lands (not shown), through holes provided in the insulating region δ in the immediate vicinity of the ACF connection portion α of the key substrate 23 facing the electronic component 5. In order to prevent contact with 23D and insulate it, the shape is enlarged in the width direction orthogonal to the longitudinal direction of the base 31 of the FPC board 3.

Therefore, according to this embodiment, the pattern wirings 23A, 23C, lands (not shown), and through holes 23B, 23D are mounted in the insulating region γ and the insulating region δ near the ACF connection portion α of the key substrate 23. In addition to the above, the pattern wirings 23A, 23C, lands (not shown), through holes 23 are formed on the main substrate 21.
Even if the electronic component 5 or the like is mounted in the region facing B and 23D, the insulating property is ensured, so that the mounting region can be further expanded.

In these embodiments, the foldable mobile phone is used as the portable radio device, but the present invention is not limited to this, and the foldable mobile phone may not be used.

[0035]

As described above, according to the present invention, a portable radio having a board unit provided with a plurality of boards and a flexible board electrically connecting the boards is provided inside the housing. A device, in which an extending portion is provided on an insulating sheet that forms a base portion of a flexible substrate,
The extending portion is used as an insulating means between the facing surfaces of the substrate in a state of facing and approaching each other. Therefore, according to the present invention, it is possible to increase the mounting area without increasing the size of the board when connecting the boards, and the cost and the size can be reduced accordingly. As a result, it is possible to reduce the size and cost of the housing of the mobile wireless device.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing a mobile phone according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing a state in which a main board and a key board of the mobile phone according to the first embodiment of the present invention shown in FIG. 1 are stacked.

FIG. 3 is a perspective view showing a main board of the mobile phone according to the first embodiment of the present invention shown in FIG. 1, a key board, and an FPC board for connecting these boards.

FIG. 4 is a plan view showing a key board of the mobile phone according to the first embodiment of the present invention shown in FIG. 1 and an FPC board that is ACF-connected to the key board.

5 is an enlarged plan view showing a front end portion of the FPC board of the mobile phone according to the first embodiment of the present invention shown in FIG. 4. FIG.

FIG. 6 is a diagram showing a laminated state of a main substrate and a key substrate of the mobile phone according to the first embodiment shown in FIG.
(A) is a schematic side sectional view and (B) is an enlarged sectional view of a main part.

FIG. 7 is a schematic side sectional view showing a laminated state of a main board and a key board of a mobile phone according to a second embodiment of the present invention.

FIG. 8 is an enlarged view of a main part showing a connection state between an FPC board and each board of a mobile phone according to a second embodiment of the present invention.

FIG. 9 is a schematic cross-sectional view showing a conventional inter-substrate connection.

FIG. 10 is a schematic sectional view showing another conventional inter-substrate connection.

FIG. 11 is a schematic cross-sectional view showing still another conventional inter-substrate connection.

[Explanation of symbols]

1 Upper case 2 Lower housing 21 Main board 22 Spacer 23 key board 230 Opposite surface 23A pattern wiring 23B through hole 23C pattern wiring 23D through hole 3 FPC board 31 Base part 32 Base end terminal 33 Tip side terminal 34 Extension 35 Extension 4 FPC connector 5 electronic components 6 Hinge part α ACF connection β insulation region γ insulation area δ Insulation area

Continued front page    (72) Inventor Makoto Tamaru             3-1, Tsunashima-Higashi 4-chome, Kohoku-ku, Yokohama-shi, Kanagawa             Matsushita Communication Industry Co., Ltd. F-term (reference) 5E344 AA02 AA12 AA16 AA19 AA22                       AA26 AA28 BB03 BB04 CC11                       CC25 CD04 CD18 CD38 DD06                       DD07 EE12                 5K023 AA07 BB03 LL01 NN06

Claims (5)

[Claims] 1. A portable wireless device having a substrate unit inside a housing, the substrate unit including a plurality of substrates, and a flexible substrate electrically connecting the substrates, wherein a base portion of the flexible substrate. A portable wireless device, wherein an extending portion is provided on an insulating sheet constituting the above, and the extending portion is used as an insulating means on the facing surfaces of the substrates in a state of facing and approaching each other. 2. The portable wireless device according to claim 1, wherein the flexible substrate is connected to the one substrate by ACF (anisotropic conductive film) connection and is also connected to the other substrate via a connector. apparatus. 3. The one substrate is provided with a pattern wiring portion near the ACF connection portion on the surface facing the other substrate, and the pattern wiring portion on the one substrate and the other substrate are provided. The portable wireless device according to claim 2, wherein a flexible board is attached between the two boards in a positional relationship in which the extension portion of the flexible board is arranged in a gap with the connector. 4. The other board includes a component mounting section near the connector mounting section on a surface facing the one board, and the component mounting section on the other board and the one board. The portable wireless device according to claim 2, wherein the flexible board is attached between the two boards in a positional relationship in which the extension portion of the flexible board is arranged in the gap. 5. The one board is configured by a key board on which a key switch is mounted on a surface opposite to a facing surface of the other board, and the other board is mounted with various electronic components. 5. The portable wireless device according to claim 1, wherein the portable wireless device is composed of a main board, and a spacer that holds a gap is provided between the both boards.