JP2003264030A - Connector - Google Patents

Connector

Info

Publication number
JP2003264030A
JP2003264030A JP2002064569A JP2002064569A JP2003264030A JP 2003264030 A JP2003264030 A JP 2003264030A JP 2002064569 A JP2002064569 A JP 2002064569A JP 2002064569 A JP2002064569 A JP 2002064569A JP 2003264030 A JP2003264030 A JP 2003264030A
Authority
JP
Japan
Prior art keywords
pin
connector
substrate
resin mold
case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002064569A
Other languages
Japanese (ja)
Other versions
JP3966745B2 (en
Inventor
Toru Sekiguchi
亨 関口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Electronics Co Ltd
Original Assignee
Citizen Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Electronics Co Ltd filed Critical Citizen Electronics Co Ltd
Priority to JP2002064569A priority Critical patent/JP3966745B2/en
Publication of JP2003264030A publication Critical patent/JP2003264030A/en
Application granted granted Critical
Publication of JP3966745B2 publication Critical patent/JP3966745B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Manufacturing Of Electrical Connectors (AREA)
  • Connector Housings Or Holding Contact Members (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connector wherein a man-hour of a manufacture assembling is reduced by simultaneously and collectively manufacturing numerous numbers of connectors and a cost-down is aimed at. <P>SOLUTION: This is the connector in which a flange part and a spring member of a conductor pin are housed in a case consisting of an adhered laminated body of a resin mold body having a hollow and a substrate, and in which the tip of the pin is made to be exposed to the outside of the case from a pin hole, and the material of the case is composed of a collected resin mold body and a collected substrate of a large area, and numerous flange parts and spring members are all together housed in the case and the collected resin mold body and the collected substrate are adhered by exposing the tip part of the pin to prepare the collective laminated body, and this is the connector comprised that finally the collective laminated body are separated by numerous cutting faces to include a piece or prescribed numbers of pieces of pins. Furthermore, a through hole in which an electroconductive film has been formed beforehand at the inner face is installed at a position to step over the cutting faces of the collective substrate, and this electroconductive film is made as an electrode for mounting. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は電気回路部品である
コネクターに関する。更に詳しくは、回路基板上等に実
装され、他の回路部品とバネ力によって圧接される接点
ピンを備えたコネクターに関する。
TECHNICAL FIELD The present invention relates to a connector which is an electric circuit component. More specifically, the present invention relates to a connector that is mounted on a circuit board or the like and has a contact pin that is pressed against other circuit components by a spring force.

【0002】[0002]

【従来の技術】従来のコネクターの構造および実装の態
様を図6に示す。(a)はコネクターの要部(プローブ
ピンとも称される)の構造を示す断面図で、1aは有底
筒型の金属ケース、2は接点となるピンで、右端は径の
やや大きな鍔部2aとなっている。金属ケース1aはそ
の内部でピン2が摺動可能であるが、開口部が絞られて
鍔部2aの抜け止めとなっている。3はバネ部材であ
り、通常コイルバネが用いられ、ピン2を外側に押して
他の電子部品の電極にピン2の先端を適宜な力で圧接す
る役割を持つ。
2. Description of the Related Art FIG. 6 shows the structure and mounting of a conventional connector. (A) is a cross-sectional view showing the structure of the main part of the connector (also called a probe pin), 1a is a bottomed cylindrical metal case, 2 is a contact pin, and the right end is a flange part with a slightly larger diameter. 2a. The pin 2 is slidable inside the metal case 1a, but the opening is narrowed to prevent the flange 2a from coming off. Reference numeral 3 is a spring member, which is usually a coil spring and has a role of pushing the pin 2 to the outside to press the tip of the pin 2 to an electrode of another electronic component with an appropriate force.

【0003】図6(b)、(c)はそれぞれ従来の完成
コネクターとその実装構造を示す側面図である。完成し
たコネクター1は、金属ケース1aに電極板9aを溶接
などによって接続し、更にブロック状の樹脂製の枠体9
に図5(a)のプローブピンをインサートモールドする
かあるいは圧入して組立てたものである。コネクター1
は他の電子部品(図示せず)と共に適当な向きに回路基
板7に載置され、その表面の導電パターン(図示せず)
と電極板9aとがハンダ8等により接続されかつ固着さ
れる。
FIGS. 6B and 6C are side views showing a conventional completed connector and its mounting structure, respectively. The completed connector 1 has an electrode plate 9a connected to the metal case 1a by welding or the like, and further has a block-shaped resin frame body 9a.
5A is assembled by insert molding or press fitting. Connector 1
Is placed on the circuit board 7 along with other electronic components (not shown) in an appropriate direction, and a conductive pattern (not shown) on the surface thereof.
And the electrode plate 9a are connected and fixed by solder 8 or the like.

【0004】[0004]

【発明が解決しようとする課題】この従来のコネクター
には幾つかの問題点がある。まずプローブピンは1個づ
つ製造組立をしなければならない。また図6(b)、
(c)のように実装形態が異なると樹脂枠体9の金型を
変更しなければならない。また枠体9にプローブピンを
インサート成形あるいは圧入しなければならない。また
電極板との接続を行わねばならない。これらはいずれも
完成コネクターの製造工数およびコストアップの要因と
なっている。
There are several problems with this conventional connector. First, the probe pins must be manufactured and assembled one by one. In addition, FIG.
If the mounting form is different as shown in (c), the mold of the resin frame 9 must be changed. Also, the probe pin must be insert-molded or press-fitted into the frame 9. Also, the connection with the electrode plate must be made. All of these are factors that increase the manufacturing man-hours and cost of the completed connector.

【0005】本発明の目的は、同時に多数個のコネクタ
ーを集合的に製造することにより製造組立上の工数を一
挙に軽減し、大幅なコストダウンを図ったコネクターを
提供することである。
An object of the present invention is to provide a connector in which a large number of connectors are collectively manufactured at the same time so that the number of manufacturing and assembling steps can be alleviated at once and the cost can be greatly reduced.

【0006】[0006]

【課題を解決するための手段】上記目的を達成するため
本発明のコネクターは次の特徴を備える。 (1)一方に鍔部を有する導体のピンの鍔部と、該ピン
を先端部の方に押圧するバネ部材とがケース内に収容さ
れ、該ケースは有底筒形の空所を有する樹脂モールド体
と比較的薄型の基板との接着積層体より成り、前記樹脂
モールド体と前記基板のいずれかには前記ピンの先端部
を摺動可能に通すピン穴を備えて前記ピンの先端をケー
ス外に露出させたコネクターであって、前記ケースの素
材は前記樹脂モールド体を平面的に配列した集合体であ
る大面積の集合樹脂モールド体と前記基板の集合体であ
る大面積の集合基板とより成り、多数の前記ピン穴のそ
れぞれに前記ピンの先端部を投入し、次いで前記ケース
内に多数の前記ピンの鍔部と前記バネ部材とが一斉に収
容されるように、前記集合樹脂モールド体と前記集合基
板とを接着して集合積層体とし、最後に該集合積層体
を、前記ピンを1個あるいは所定の個数づつ含むように
多数の切断面によって分離して成ること。
To achieve the above object, the connector of the present invention has the following features. (1) A flange portion of a conductor pin having a flange portion on one side and a spring member that presses the pin toward the tip portion are housed in a case, and the case is a resin having a bottomed cylindrical space. It is composed of an adhesive laminated body of a molded body and a relatively thin substrate, and one of the resin molded body and the substrate is provided with a pin hole for slidably passing the distal end portion of the pin, and the distal end of the pin is cased. The connector exposed outside, the material of the case is a large area aggregate resin mold body which is an aggregate of the resin mold bodies arranged in a plane, and a large area aggregate substrate which is an aggregate of the substrates. The collective resin mold is configured so that the tip end portion of the pin is inserted into each of the plurality of pin holes, and then the collar portions of the plurality of pins and the spring member are accommodated in the case at the same time. Gather the body and the assembly board by bonding A laminated body, finally the collection laminate that formed by separating the pins so as to include one or a predetermined number at a time by a number of the cut surface.

【0007】本発明のコネクターは更に以下の特徴を備
えることがある。 (2)前記集合樹脂モールド体と前記集合基板には、そ
れらが最後に切断分離される切断面を跨ぐ位置に多数の
貫通穴が設けられており、前記集合樹脂モールド体の前
記空所の内面とその近傍の特定の前記貫通穴の内面とは
連結された導体膜で覆われており、その結果として切断
分離された完成コネクターにおける特定の前記ピンと特
定の前記貫通穴の内面の切断された導体膜とが電気的に
接続していること。
The connector of the present invention may further have the following features. (2) The collective resin mold body and the collective substrate are provided with a large number of through holes at positions that straddle the cut surface where they are finally cut and separated, and the inner surface of the cavity of the collective resin mold body is provided. And the inner surface of the specific through hole in the vicinity thereof are covered with a conductive film that is connected, and as a result, the specific conductor of the pin and the specific inner surface of the specific through hole of the completed connector separated by cutting. Being electrically connected to the membrane.

【0008】(3)前記集合積層体を切断する切断面を
間引くことによって、切断分離された完成コネクターに
含まれるピンの数を異ならせたこと。
(3) The number of pins included in the cut and separated completed connector is made different by thinning out the cut surface for cutting the aggregated laminate.

【0009】[0009]

【発明の実施の形態】図1は本発明の実施の形態の一例
である、完成した単体のコネクターを示し、(a)は中
央断面図、(b)はピン側面である表面図、(c)は裏
面図である。なお従来例と共通な要素には同じ記号を当
てている。以下の各図についても同様である。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a completed single connector, which is an example of an embodiment of the present invention, in which (a) is a central sectional view, (b) is a pin side surface view, and (c) is a front view. ) Is a back view. The same symbols are applied to the elements common to the conventional example. The same applies to the following figures.

【0010】図1において、完成コネクター1のケース
は、樹脂モールド体4と基板5とが積層・固着されたも
のであり、樹脂モールド体4のピン穴4bはピン2の先
端部のみを摺動可能に露出させ、ピン穴4bの続く同軸
で径大の円筒形の空所4cはピン2の鍔部2a、および
ピン2を先端側に向かって押圧するためのバネ部材3で
あるコイルバネを収容しており、比較的薄い板材である
基板5がこれらを封入している。なおピン2に設けた深
穴2bはバネ部材3の一部が挿入されており、長いコイ
ルバネを使用可能としてピン2に長いストロークを与
え、しかも圧力の変化を緩やかにしている。
In FIG. 1, the case of the completed connector 1 is formed by laminating and fixing a resin mold body 4 and a substrate 5, and the pin hole 4b of the resin mold body 4 slides only on the tip end portion of the pin 2. A coaxial and large-diameter cylindrical space 4c which is exposed as much as possible and which follows the pin hole 4b accommodates the flange portion 2a of the pin 2 and the coil spring which is the spring member 3 for pressing the pin 2 toward the tip side. The substrate 5, which is a relatively thin plate member, encapsulates these. A part of the spring member 3 is inserted into the deep hole 2b provided in the pin 2 so that a long coil spring can be used to give the pin 2 a long stroke, and the pressure change is moderated.

【0011】図1表面図(b)、裏面図(c)に示すよ
うに、樹脂モールド体4の四隅にはスルーホール4a、
基板5の四隅にはスルーホール5aの一部(円周の約4
分の1弱)が現れている。各スルーホールの内面に形成
された導電膜の全部あるいはその一部は樹脂ケース4や
基板5の表面に形成された導電パターンを経由してバネ
部材3およびピン2と接触することにより電気的に接続
している。また基板5の裏面には裏パターン5cがあり
スルーホール5aの導電膜と接続している。
As shown in the front view (b) and the back view (c) of FIG. 1, through holes 4 a, are formed at the four corners of the resin mold body 4.
A part of the through hole 5a is provided at the four corners of the substrate 5 (about 4 of the circumference).
A little less). All or part of the conductive film formed on the inner surface of each through hole is electrically contacted with the spring member 3 and the pin 2 via the conductive pattern formed on the surface of the resin case 4 or the substrate 5. Connected. A back pattern 5c is provided on the back surface of the substrate 5 and is connected to the conductive film in the through hole 5a.

【0012】図2は本発明のコネクターの一例を回路基
板上にハンダ実装した形態を示す側面図である。コネク
ター1のスルーホール4a、5aの導電膜は回路基板7
上の回路導電パターン(図示せず)にハンダ8によりハ
ンダ付けされ(スルーホール内面の導電膜がハンダの濡
れ上がりを確実にする側面電極として作用する)、ピン
2は回路基板7の回路パターンの末端の接点となる。コ
ネクター1はまた、基板5を下にして回路基板7上に立
てて(ピン2が上向きになる)実装することも可能であ
る。この場合スルーホール5aの導電膜および裏パター
ン5c(これもコネクターの向きによっては側面電極と
なる)も回路基板7上の回路パターンと接続される。
FIG. 2 is a side view showing an example of the connector of the present invention, which is mounted on a circuit board by soldering. The conductive film of the through holes 4a and 5a of the connector 1 is the circuit board 7
The upper circuit conductive pattern (not shown) is soldered by the solder 8 (the conductive film on the inner surface of the through hole acts as a side electrode that ensures the wet up of the solder), and the pin 2 is a circuit pattern of the circuit board 7. It becomes the terminal contact. The connector 1 can also be mounted upright on the circuit board 7 with the board 5 facing down (pins 2 facing up). In this case, the conductive film of the through hole 5a and the back pattern 5c (also a side electrode depending on the orientation of the connector) are also connected to the circuit pattern on the circuit board 7.

【0013】本発明のコネクター1はいわゆる多数個取
りの製法によって多数個が同時に製造され、最後に分離
される。図3、図4はその製造方法の要点をも説明する
ために、本発明の実施の形態の一例であるコネクターの
ケースを構成している樹脂モールド体および基板(材質
は回路基板同様に絶縁性であるものとして述べる)を、
個々のコネクターに切断・分離する前の大型(大面積)
の集合素材の状態で、その一部の形状や加工を示すもの
である。
A large number of connectors 1 of the present invention are simultaneously manufactured by a so-called multi-cavity manufacturing method, and finally separated. 3 and 4, in order to explain the main points of the manufacturing method, the resin mold body and the substrate (the material is an insulating material similar to that of the circuit board) forming the case of the connector which is an example of the embodiment of the present invention. Is described as)
Large size (large area) before cutting / separating into individual connectors
In the state of the aggregate material, the shape and processing of a part thereof are shown.

【0014】図3は樹脂モールド体4の切断・分離前の
素材である集合樹脂モールド体40の一部分を示し、
(a)は前面図(前面とはピンの先端側の面とする)、
(b)はA−A断面図、(c)は裏面図である。集合樹
脂モールド体40には成形時にスルーホール4a用の穴
と、ピン穴4bおよび空所4cが多数設けてあり、スル
ーホール4aの内面を含めた表面には導電膜(打点した
面で示す)が形成されている。
FIG. 3 shows a part of the collective resin mold body 40 which is a material before the resin mold body 4 is cut and separated.
(A) is a front view (the front is the surface on the tip side of the pin),
(B) is a sectional view taken along the line AA, and (c) is a rear view. At the time of molding, the aggregate resin molded body 40 is provided with a large number of holes for the through holes 4a, pin holes 4b, and cavities 4c, and a conductive film (shown as a dotted surface) is formed on the surface including the inner surface of the through holes 4a. Are formed.

【0015】10は集合樹脂モールド体40を最終的に
縦横に切断することになる切断面の位置をあらわす(切
断はコネクターの組立後に行う)。各スルーホール4a
は交差する切断面のそれぞれを跨ぐ位置にあるので、切
断後は図1(b)、(c)あるいは図2のようにスルー
ホールの内面の導電膜がコネクター1の側面電極膜とし
て外部の四隅の稜の部位に外向きであらわれる。この側
面電極膜は集合樹脂ケース40の裏面の導電膜や空所4
cの内面の導電膜やバネ部材3を経由してピン2と電気
的に接続している。
Reference numeral 10 indicates a position of a cut surface at which the aggregate resin molded body 40 is finally cut vertically and horizontally (cutting is performed after the connector is assembled). Each through hole 4a
Is located at the position where it crosses each of the intersecting cut surfaces. Therefore, after cutting, the conductive film on the inner surface of the through hole is used as the side surface electrode film of the connector 1 as shown in FIG. 1 (b), (c) or FIG. Appears outward at the edge of the ridge. The side surface electrode film is a conductive film on the back surface of the collective resin case 40 or the space 4
It is electrically connected to the pin 2 via the conductive film on the inner surface of c and the spring member 3.

【0016】図4は基板5の集合素材である集合基板5
0の一部分を示し、(a)は前面図、(b)はC−C断
面図、(c)は裏面図である。集合基板50はスルーホ
ール5a、ケースの内面にあってバネ部材の後端と接触
導通する表パターン5b、およびコネクター1の裏面に
露出することになる裏パターン5cを有する。表パター
ン5bの所定のもの、および裏パターン5cの全部は、
スルーホール5aの内面に形成された導電膜に接続して
いる。集合基板50が切断面10で分離されると図1
(c)に示すような基板5の外観が現れる。
FIG. 4 shows a collective substrate 5 which is a collective material of the substrates 5.
0 shows a part of 0, (a) is a front view, (b) is a CC cross-sectional view, (c) is a rear view. The collective substrate 50 has a through hole 5a, a front pattern 5b on the inner surface of the case, which is in contact with the rear end of the spring member, and a back pattern 5c which is exposed on the back surface of the connector 1. The predetermined pattern of the front pattern 5b and all of the back pattern 5c are
It is connected to a conductive film formed on the inner surface of the through hole 5a. When the collective substrate 50 is separated at the cutting surface 10, FIG.
The appearance of the substrate 5 as shown in (c) appears.

【0017】本発明の実施の形態であるコネクター1の
多数個取り製造・組立方法について説明する。図5
(a)は本発明の実施の形態の一例における集合積層体
の組立工程の要部を示す断面図である。まず図3および
図4に示したように所定の加工を施した、大型の集合樹
脂モールド体40と集合基板50を準備する。次に集合
樹脂モールド体40の前面を下側にして水平に置き、全
ての空所4c内に下向きにしたピン2を、次いでピン2
にバネ部材3を投入する。更にその上面に集合基板50
を矢印70で示す方向に加圧し接着してピン機構を封入
する。接着剤には耐熱性の接着シートが用いられる。最
後にこの積層された接合体(集合積層体)を切断面10
に沿ってダイサーまたはスライシングマシンを用いて縦
横に切断すると、多数(例えば数100個)の完成コネ
クターを一挙に得ることができる。
A method for producing and assembling a multi-piece connector 1 according to the embodiment of the present invention will be described. Figure 5
(A) is a sectional view showing an important part of an assembly process of an aggregate layered product in an example of an embodiment of the invention. First, as shown in FIGS. 3 and 4, a large aggregate resin mold body 40 and an aggregate substrate 50, which have been subjected to predetermined processing, are prepared. Next, the front surface of the aggregate resin molded body 40 is placed horizontally with the front side facing downward, and the pins 2 facing downward in all the cavities 4c, and then the pins 2
The spring member 3 is put in. Further, the collective substrate 50 is provided on the upper surface.
Is pressed in the direction indicated by the arrow 70 and adhered to encapsulate the pin mechanism. A heat resistant adhesive sheet is used as the adhesive. Finally, a cut surface 10 is obtained by cutting the laminated joined body (collective laminated body).
Along the way, using a dicer or a slicing machine, it is possible to obtain a large number (for example, several hundreds) of completed connectors all at once.

【0018】図5(b)は本発明の実施の形態の他の例
における集合積層体の組立工程の要部を示す断面図であ
る。本例においてはピン穴を前例と異なり集合樹脂モー
ルド体40側にではなく集合基板50側に設ける。下側
にした集合基板50のピン穴5dに多数のピン2とバネ
部材3を投入し、この上から集合樹脂モールド体40を
被せて加圧し接着して集合積層体とし、これを切断分離
する。
FIG. 5B is a sectional view showing an essential part of a process for assembling the aggregated laminate in another example of the embodiment of the present invention. In this example, unlike the previous example, the pin hole is provided not on the collective resin mold body 40 side but on the collective substrate 50 side. A large number of pins 2 and spring members 3 are put into the pin holes 5d of the lower collective substrate 50, and the collective resin mold body 40 is covered and pressed onto and bonded to form a collective laminate, which is cut and separated. .

【0019】なお、いずれの実施の形態においても、集
合積層体までの形状構造を同じく(共通に)しておき、
これを切断分離するときに、図3や図4の状態から縦あ
るいは横の切断面10を間引いて1個おきとすれば、完
成コネクターには2本づつのピンが含まれる。また図
3、図4から、3個1組の切断面から隣合う切断面2個
づつを間引けば、ピンを3本づつ含む完成コネクターが
得られる。またこれらの場合に、1個の完成コネクター
に含まれる複数のピンは相互に電気的に絶縁され、かつ
それぞれのピンはその外部電極端子となる特定のスルー
ホールの内面の導電膜とのみ接続していることが望まし
いが、これは集合樹脂モールド体40の表面電極パター
ン、および集合基板50の表パターンまたは裏パターン
の形状を適宜変更すれば容易に達成できることである。
In any of the embodiments, the shape structure up to the aggregated laminated body is the same (common),
When this is cut and separated, if the vertical or horizontal cut surface 10 is thinned out from the state of FIG. 3 or FIG. 4 to leave every other one, the completed connector includes two pins. Further, from FIG. 3 and FIG. 4, a completed connector including three pins can be obtained by thinning out two adjacent cutting faces from a set of three cutting faces. Further, in these cases, the plurality of pins included in one completed connector are electrically insulated from each other, and each pin is connected only to the conductive film on the inner surface of the specific through hole which becomes the external electrode terminal. However, this can be easily achieved by appropriately changing the shapes of the surface electrode pattern of the collective resin mold body 40 and the front pattern or the back pattern of the collective substrate 50.

【0020】以上に本発明の実施の形態の一例について
述べたが、本発明の実施の形態はもとよりこれに限定さ
れない。例えばピンの形状、バネ部材の一部が挿入され
る深穴の有無、他の形状のバネ部材(例えば板バネやゴ
ム材)、樹脂ケースや基板の形状、パターンの形状、ス
ルーホールの位置(例えば1個の切断面のみを跨がせれ
ば半円形に近い導電面が得られる)、接着の方法、切断
分離の方法等は自由に変更可能である。また切断面の間
隔を適宜に選ぶことにより、1個の完成コネクターに含
まれる接点ピンの数を任意の複数とすることができる。
また基板5の材料を金属板で置換してもよい。その他種
々な付加、変更、削除が可能である。
Although one example of the embodiment of the present invention has been described above, the embodiment of the present invention is not limited to this. For example, the shape of the pin, the presence or absence of a deep hole into which a part of the spring member is inserted, the spring member of another shape (for example, a leaf spring or a rubber material), the shape of the resin case or the board, the shape of the pattern, the position of the through hole ( For example, a conductive surface close to a semicircle can be obtained by straddling only one cut surface), a bonding method, a cutting separation method, and the like can be freely changed. In addition, the number of contact pins included in one completed connector can be arbitrarily set by appropriately selecting the intervals between the cut surfaces.
Further, the material of the substrate 5 may be replaced with a metal plate. Various other additions, changes, and deletions are possible.

【0021】[0021]

【発明の効果】本発明においては、集合状態で一斉に多
数のコネクターの製造組立を行い、その後に個々のコネ
クターに一挙に切断分離するので、コネクター1個あた
りの工数が従来より激減し、製品コストが大幅に削減で
きる。また切断面を変更することで、コネクター1個あ
たりのピン数を任意に調整できる。またピンケースを更
に枠体にインサートモールドしたり圧入する必要もな
く、そのための金型も不要であり、また電極板を付加す
る必要もないのでそれらによるコスト削減効果もある。
また回路基板に対して縦・横いずれの方向に実装するこ
とも可能である等、種々の優れた効果が発揮される。
According to the present invention, since a large number of connectors are manufactured and assembled all at once in a collective state, and then the individual connectors are cut and separated at once, the number of steps per connector is drastically reduced from the conventional product. The cost can be reduced significantly. In addition, by changing the cut surface, the number of pins per connector can be arbitrarily adjusted. Further, since it is not necessary to insert-mold or press-fit the pin case into the frame, a mold for that is not necessary, and it is not necessary to add an electrode plate, so that there is a cost reduction effect.
In addition, various excellent effects are exhibited, such as mounting in a vertical or horizontal direction on a circuit board.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施の形態である完成したコネクター
の一例を示し、(a)は中央断面図、(b)はピン側面
である表面図、(c)は裏面図である。
1A and 1B show an example of a completed connector according to an embodiment of the present invention, in which FIG. 1A is a central cross-sectional view, FIG. 1B is a surface view of a pin side surface, and FIG.

【図2】本発明のコネクターの一例を回路基板上にハン
ダ実装した形態を示す側面図である。
FIG. 2 is a side view showing an example of a connector of the present invention mounted on a circuit board by soldering.

【図3】本発明の実施の形態の一例であるコネクターの
ケースを構成する樹脂モールド体の素材となる集合樹脂
モールド体の一部分を示し、(a)は前面図、(b)は
A−A断面図、(c)は裏面図である。
3A and 3B show a part of an aggregated resin mold body that is a material of a resin mold body that constitutes a case of a connector that is an example of an embodiment of the present invention, (a) is a front view, and (b) is AA. A sectional view, (c) is a rear view.

【図4】同じくコネクターのケースを構成する基板の素
材となる集合基板の一部分を示し、(a)は前面図、
(b)はB−B断面図、(c)は裏面図である。
FIG. 4 also shows a part of a collective board which is a material of a board which constitutes a connector case, (a) is a front view,
(B) is a BB sectional view, and (c) is a rear view.

【図5】(a)は本発明の実施の形態の一例における集
合積層体の組立工程の要部を示す断面図、(b)は本発
明の実施の形態の他の例における集合積層体の組立工程
の要部を示す断面図である。
5A is a cross-sectional view showing a main part of an assembly process of assembling the aggregated laminate according to an example of the embodiment of the present invention, and FIG. 5B is a sectional view of the aggregated laminate according to another example of the embodiment of the present invention. It is sectional drawing which shows the principal part of an assembly process.

【図6】従来のコネクターを示し、(a)は要部構造を
示す断面図、(b)および(c)は回路基板上の実装状
態を示す側面図である。
FIG. 6 shows a conventional connector, (a) is a cross-sectional view showing a main structure, and (b) and (c) are side views showing a mounted state on a circuit board.

【符号の説明】[Explanation of symbols]

1 コネクター 1a 金属ケース 2 ピン 2a 鍔部 2b 深穴 3 バネ部材 4 樹脂モールド体 4a スルーホール 4b ピン穴 4c 空所 5 基板 5a スルーホール 5b 表パターン 5c 裏パターン 7 回路基板 8 ハンダ 9 枠体 9a 電極板 10 切断面 40 集合樹脂ケース 50 集合基板 70 加圧方向 1 connector 1a metal case 2 pin 2a Tsuba part 2b deep hole 3 spring members 4 resin molded body 4a through hole 4b pin hole 4c void 5 substrates 5a through hole 5b table pattern 5c back pattern 7 circuit board 8 solder 9 frame 9a electrode plate 10 cut surface 40 aggregate resin case 50 Assembly board 70 Pressing direction

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 一方に鍔部を有する導体のピンの鍔部
と、該ピンを先端部の方に押圧するバネ部材とがケース
内に収容され、該ケースは有底筒形の空所を有する樹脂
モールド体と比較的薄型の基板との接着積層体より成
り、前記樹脂モールド体と前記基板のいずれかには前記
ピンの先端部を摺動可能に通すピン穴を備えて前記ピン
の先端をケース外に露出させたコネクターであって、前
記ケースの素材は前記樹脂モールド体を平面的に配列し
た集合体である大面積の集合樹脂モールド体と前記基板
の集合体である大面積の集合基板とより成り、多数の前
記ピン穴のそれぞれに前記ピンの先端部を投入し、次い
で前記ケース内に多数の前記ピンの鍔部と前記バネ部材
とが一斉に収容されるように、前記集合樹脂モールド体
と前記集合基板とを接着して集合積層体とし、最後に該
集合積層体を、前記ピンを1個あるいは所定の個数づつ
含むように多数の切断面によって分離して成ることを特
徴とするコネクター。
1. A flange part of a conductor pin having a flange part on one side and a spring member for pressing the pin toward the tip part are housed in a case, and the case has a bottomed cylindrical space. It is composed of an adhesive laminated body of a resin mold body and a relatively thin substrate, and the tip of the pin is provided with a pin hole for slidably passing the tip end portion of the pin in either the resin mold body or the substrate. Is a connector exposed to the outside of the case, and the material of the case is a large area aggregate that is an aggregate of the resin mold bodies arranged in a plane and a large area aggregate that is an aggregate of the substrate. The assembly is composed of a substrate, and the tip portions of the pins are inserted into the plurality of pin holes, respectively, and then the flange portions of the pins and the spring member are housed in the case at the same time. Adhesion of resin mold body and the aggregate substrate A connector is characterized in that it is formed into a collective laminated body, and finally, the collective laminated body is separated by a plurality of cut surfaces so as to include one pin or a predetermined number of the pins.
【請求項2】 前記集合樹脂モールド体と前記集合基板
には、それらが最後に切断分離される切断面を跨ぐ位置
に多数の貫通穴が設けられており、前記集合樹脂モール
ド体の前記空所の内面とその近傍の特定の前記貫通穴の
内面とは連結された導体膜で覆われており、その結果と
して切断分離された完成コネクターにおける特定の前記
ピンと特定の前記貫通穴の内面の切断された導体膜とが
電気的に接続していることを特徴とする請求項1のコネ
クター。
2. The aggregate resin mold body and the aggregate substrate are provided with a large number of through holes at positions across the cut surface where they are finally cut and separated, and the voids in the aggregate resin mold body. The inner surface of and the inner surface of the particular through hole in the vicinity thereof are covered with a conductive film connected to each other, and as a result, the inner surface of the particular pin and the inner surface of the particular through hole of the completed separated connector is cut. The connector according to claim 1, wherein the connector is electrically connected to the conductive film.
【請求項3】 前記集合積層体を切断する切断面を間引
くことによって、切断分離された完成コネクターに含ま
れるピンの数を異ならせたことを特徴とする請求項1あ
るいは2のコネクター。
3. The connector according to claim 1 or 2, wherein the number of pins included in the cut and separated completed connector is made different by thinning out a cut surface for cutting the aggregated laminate.
JP2002064569A 2002-03-08 2002-03-08 connector Expired - Fee Related JP3966745B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002064569A JP3966745B2 (en) 2002-03-08 2002-03-08 connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002064569A JP3966745B2 (en) 2002-03-08 2002-03-08 connector

Publications (2)

Publication Number Publication Date
JP2003264030A true JP2003264030A (en) 2003-09-19
JP3966745B2 JP3966745B2 (en) 2007-08-29

Family

ID=29197285

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002064569A Expired - Fee Related JP3966745B2 (en) 2002-03-08 2002-03-08 connector

Country Status (1)

Country Link
JP (1) JP3966745B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005317227A (en) * 2004-04-27 2005-11-10 Shin Etsu Polymer Co Ltd Pressure contact holding connector
KR200447400Y1 (en) 2007-12-21 2010-01-25 주식회사 아이에스시테크놀러지 Test socket for high frequency

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5349091U (en) * 1976-09-30 1978-04-25
JPH06231839A (en) * 1993-02-04 1994-08-19 Seiko Epson Corp Smt connector
JPH0664332U (en) * 1993-02-18 1994-09-09 株式会社シチズン電子 Thin illuminated switch
JPH10312845A (en) * 1997-05-09 1998-11-24 Yokowo Co Ltd Spring connector and device using the same
JPH11260449A (en) * 1998-03-06 1999-09-24 Yazaki Corp Connecting device for feeding to door for vehicle
JPH11289105A (en) * 1998-04-03 1999-10-19 Citizen Electronics Co Ltd Photoreflector and manufacture thereof
JP2003264024A (en) * 2002-03-08 2003-09-19 Citizen Electronics Co Ltd Connector

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5349091U (en) * 1976-09-30 1978-04-25
JPH06231839A (en) * 1993-02-04 1994-08-19 Seiko Epson Corp Smt connector
JPH0664332U (en) * 1993-02-18 1994-09-09 株式会社シチズン電子 Thin illuminated switch
JPH10312845A (en) * 1997-05-09 1998-11-24 Yokowo Co Ltd Spring connector and device using the same
JPH11260449A (en) * 1998-03-06 1999-09-24 Yazaki Corp Connecting device for feeding to door for vehicle
JPH11289105A (en) * 1998-04-03 1999-10-19 Citizen Electronics Co Ltd Photoreflector and manufacture thereof
JP2003264024A (en) * 2002-03-08 2003-09-19 Citizen Electronics Co Ltd Connector

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005317227A (en) * 2004-04-27 2005-11-10 Shin Etsu Polymer Co Ltd Pressure contact holding connector
KR200447400Y1 (en) 2007-12-21 2010-01-25 주식회사 아이에스시테크놀러지 Test socket for high frequency

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