JP2003257522A - Connector, developer cartridge and image forming device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent damages on a board by making a memory IC board detachable and stabilizing insertion and mounting of the memory IC board. <P>SOLUTION: With the connector provided with a positioning mounting part (60) to be engaged with a tip of the memory IC board (46) and a hook part (61) locking a rear end of the memory IC board, and with terminals (63, 64) of the memory IC board mounted in free detachment and contacts (43b, 44b) in spring contact structured in a plurality of rows, small load contacts in the plurality of the rows of the contacts are arranged at the positioning mounting side. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connector having a built-in memory IC substrate for reading / writing data such as toner consumption, a developing cartridge to which the connector is attached, and an image forming apparatus.

[0002]

2. Description of the Related Art In an image forming apparatus such as a printer,
A memory IC is attached to the developing cartridge and connected to the connector of the main body of the apparatus, the remaining amount information of each color toner, the old and new discrimination information as to whether or not the cartridge has been exchanged, and the mounting for notifying the main body whether or not the cartridge has been mounted. Information, image forming conditions such as developing bias, recycling information about how many times the cartridge has been exchanged and used, etc. are written so that when the developing cartridge is mounted, the history information can be recognized on the apparatus main body side.

In this case, in a cartridge of an ink jet printer or the like, a memory IC substrate on which history information is written is connected to a connector by caulking an electric wire, or the memory IC substrate is soldered to a connector terminal.

[0004]

In the conventional memory IC mounted on the developing cartridge, the contact life of the memory IC is shortened because mechanical force is directly applied to the memory IC by contact with the connector of the apparatus main body when reading / writing data. Since the developing roller is short and a high voltage is applied to the developing roller, electric field noise due to the influence is easily picked up by the contact member side, malfunction occurs due to static electricity or toner contamination, and memory IC protection and contact stability are secured. It wasn't always enough.

Further, in the method of crimping the wire of the terminal of the memory IC board and connecting it to the connector, contact failure such as occurrence of caulking failure and disconnection of the wire occurs, and in the method of soldering the memory IC board to the connector terminal, There is a problem such as contact failure due to defective soldering, and even if the memory IC is to be reused, it must be removed by applying heat. In that case, even if removed, the written information is destroyed by the heat. There is a problem that it will end up.

Further, in particular, the longer the contact member becomes the antenna, the easier it is to pick up electric field noise. Therefore, in this embodiment, the ground terminal 43G is arranged at the farthest position from the developing roller. of course,
It is preferable that long terminals other than the ground terminal are arranged outside.

[0007]

DISCLOSURE OF THE INVENTION The present invention is intended to solve the above problems, and makes the memory IC substrate detachable, stabilizes the insertion and mounting of the memory IC substrate, and prevents damage to the substrate. Therefore, the invention of claim 1 is provided with a positioning attachment portion that engages with the tip of the memory IC substrate and a hook portion that locks the rear end of the memory IC substrate, and the memory IC substrate is detachably attached to the memory IC substrate.
In a connector in which the terminals of the substrate and the contacts in spring contact have a plurality of rows, the low-load contacts of the plurality of rows of contacts are arranged on the side of the positioning attachment portion. The invention of claim 2 is characterized in that, in the contacts of the plurality of rows, the number of contacts in each row is not the same, and the rows of multiple contacts are low load contacts. According to a third aspect of the present invention, the memory IC board is mounted by inserting the leading end of the memory IC board into the positioning attachment portion and locking the rear end of the memory IC board to the hook portion using elasticity. And The invention of claim 4 is
The memory IC substrate is characterized in that a notch for positioning is formed by being displaced from the center of the tip inserted into the positioning attachment portion. A fifth aspect of the invention is characterized in that the connector described above is fixed to an end portion. According to a sixth aspect of the invention, there is provided an image forming apparatus including the developing cartridge described above.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram illustrating an example of the image forming apparatus according to the present exemplary embodiment. After the photoconductor 1 is charged by a charging unit (not shown), an electrostatic latent image is formed by image exposure by the exposure unit 2. This electrostatic latent image is developed by sequentially supplying four colors of toner one by one from the developing rollers of the developing cartridges 31 to 34 mounted on the rotary frame 30 of the rotary developing unit 3. The photoconductor 1 has
The transfer belt 4 driven by the transfer belt driving roller 5 is 1
The toner images of the respective colors face each other at the next transfer position and are primarily transferred to the transfer belt 4 so that the colors are superposed on the belt.

On the other hand, the paper taken out from the paper feeding cassette 6 passes through the conveying path 7 and the four color toner images on the transfer belt are collectively transferred at the secondary transfer position of the transfer roller 8 facing the transfer belt driving roller 5. It At this time, the leading edge of the image on the transfer belt 4 is detected by the belt position detection sensor 9,
It is controlled so that the leading edge of the image and the leading edge of the paper match. The sheet that has been secondarily transferred is fixed by the fixing unit 10, and in the case of double-sided printing, returns to the transport path 7 again, and the image is transferred to the back side. The sheet after transfer and fixing is discharged outside the apparatus.

The four-color developing cartridges 31 to 34 of the rotary type developing unit 3 have a memory IC built-in connector 40.
(Details will be described later) are attached respectively, and data can be read / written from the connector 50 on the apparatus main body side. The device main body side connector 50 is driven by a drive unit 51 with a built-in motor to move forward / backward, and when the cartridge is replaced, moves forward to electrically connect to the connector 40 to read / write data in the memory IC.
It is usually retreating. Each developing cartridge can be removed and replaced at the position of the developing cartridge replacement opening 11 provided in the main body of the apparatus. Further, the image forming apparatus is provided with an exhaust duct 12, which sucks scattered toner and the like from a suction port 14 near a developing nip portion where a developing roller and a photoconductor contact each other, and exhausts the toner through a filter 13. In this case, the position where the memory IC built-in connector 40 and the main body apparatus side connector 50 are connected is arranged on the upstream side of the developing nip portion in the rotation direction of the developing unit so that the connector connecting portion is not affected by the scattered toner. To do.

FIG. 2 is a diagram for explaining each position of the rotary type developing unit for replacement of the developing cartridge, reading / writing of data in the memory IC, and developing standby. The home position of the rotary developing unit is detected by detecting the notch position of the position detection plate 37 with the position detection sensor 36.

FIG. 2A is a view for explaining a developing device replacement position (position). As described above, the developing device exchange port 11 is provided on the apparatus main body side, and each of the developing rollers of the rotary developing unit 3 is connected to the developing device exchange port 1.
It is replaceable in position 1. In this position, the connector 40 of each developing cartridge does not face the main assembly side connector 50, and the photoconductor 1 also does not face the developing roller.

FIG. 2B shows a position (position) where the developing roller faces the photoconductor and develops, as well as reading / writing to the memory IC. When a read / write command is issued from the apparatus body side, the apparatus body side connector 50 operates in a positional relationship, and the apparatus body side connector 50 is connected to read / write data.

FIG. 2C shows a position (position) where the development by the rotary developing unit is switched from one color to another color, and the photosensitive member and the developing roller are not opposed to each other.

FIG. 3 is a diagram for explaining the time of connecting the connector and the time of separating. As shown in FIG. 3A, at the time of connection, the device main body side connector 50 is driven forward by a motor, and is guided and fitted by a guide member on the side of the memory IC built-in connector 40 as described later, and the terminals slide with each other. And connect electrically,
At the time of separation, the connector 50 retreats toward the main body of the apparatus and the two are separated. The connector 40 has a connector fixing screw 48.
The connector 50 is fixed to the developing device unit, and the connector 50 is fixed to the apparatus main body by connector fixing pins 53.

FIG. 4 is a diagram for explaining the rotary developing unit. The rotary developing unit 3 is attached to the side plates 20 and 21 made of sheet metal, and the memory IC built-in connector 40 is fixed to the ends of the developing cartridges 31 to 34 attached to the rotary frame 30. In the present embodiment, the side plate 21 is gear-driven, the side plate 20 is the non-driving side, and the connector provided in the housing 22 formed by squeezing the side plate 20 on the non-driving side so as not to be affected by the heat of the driving unit. The memory IC built-in connector 40 is fixed to the cover 39. The accommodating portion 22 surrounds the connector 40 except for the surface on which the apparatus main body side connector 50 separates and abuts, and serves to shield the connector from being affected by the voltage applied to the developing roller. The memory IC built-in connector 40 itself is covered with a connector cover 39, and a memory IC is formed from a metal plate forming a storage portion.
An IC protection member 38 made of a resin ring is provided on the inner surface of the storage unit so as not to be affected by static electricity.

5A and 5B are views for explaining the memory IC built-in connector of this embodiment. FIG. 5A is a plan view, FIG. 5B is a front view, and FIG. 5C is a view of FIG. 5A. It is an AA sectional view. In the connector 40 with a built-in memory IC, two guide members 42 are provided upright on both side portions near the outer edge of one surface of the substrate 41 (a surface to be connected to the main body apparatus side connector) which is a member for receiving an impact at the time of connection. On the other surface (rear surface) of the board 41, a contact protection member 45 including a memory IC board 46 is provided, and these are integrally formed as a housing 47. Further, the contact members 43 and 44 are provided inside the guide member 42 integrally with the guide member 42, respectively.
It is installed upright in parallel with 2. The guide member 42 is arranged outside the contact member in order to stabilize the contact state of the contact by surrounding the guide member and ensuring insertion stability when the main body side connector is fitted.

In this embodiment, four contact members 43 are arranged on the front side (the side far from the developing roller end) of the housing 47, and three contact members 44 are arranged in two rows on the back side (the side closer to the developing roller end). It is provided as a whole and is designed to be compact as a whole. Of course, the contact members are not limited to two rows, one row or three rows.
You can make a line. As shown in FIG. 6, for each terminal of these contact members, four terminals on the front side are a data terminal, a mounting detection terminal, a ground (GND) terminal, a data read / write terminal, and three terminals on the back side are clock terminals. These are terminals, power supply terminals, and chip select (CS) terminals.

These contact members 43 and 44 are shown in FIG.
As shown in FIG. 5, contact terminals 43a and 44a which the main body side connector terminal slides into contact with at the time of connection are configured. The contact members 43 and 44 are provided with spring-like contact terminals 43b and 44b which extend through the through holes of the substrate 41 to the back side thereof and elastically contact with the terminals of the memory IC substrate 46. Then, when the memory IC substrate 46 is attached to the contact protection member 45, the spring-shaped contact terminals 43b and 44b are connected to the memory I.
The memory IC substrate 4 is elastically contacted with the terminals of the C substrate 46,
6 is pressed against the mounting surface of the contact protection member 45 by the spring force from the contact terminals 43b and 44b, and is held in a floating state separated from the substrate 41. Therefore, even if the main body side connector 50 moves forward and comes into contact with the connector 40 by the motor drive, the terminals 43a and 44a of the contact members 43 and 44 only slide and come into contact with the main body side connector terminal, and the impact of the contact is generated. Is received by the substrate 41, and the memory IC substrate 46 is the substrate 4
The memory IC substrate 4 is supported separately from the memory IC substrate 1.
No impact is directly transmitted to the contact portion between the terminal 6 and the contacts 43b and 44b.

As described above, the connector 40 has a sliding contact with the main body side connector on one surface of the substrate 41 which is an impact receiving member, and a memory IC substrate which is supported on the back side of the substrate 41 by floating from the substrate. Since the fixed contact is provided, the impact at the time of connection with the main body side connector is not received by the substrate 41 and transmitted to the memory IC substrate side, and the contact with the memory IC substrate is stably formed. Further, in order to protect the memory IC substrate attached to the connector from contact failure due to toner stains and data destruction due to the influence of static electricity, it is desirable to provide the contact at a place not directly exposed to the front side. In the present embodiment, the IC memory substrate is covered with the contact protection member 45, and that portion is supported by the spring contact.

Of the seven contact members shown in FIG. 5, the guide members 42 on both sides and the four contact members provided in one row are
As can be seen from FIG. 4, the remaining three contact members are located outside the developing roller and are arranged on the developing roller side. Of the four contact members on the front side, the ground terminal 43G is formed to have the longest length so that the first contact is made when connecting to the main body side connector.

By the way, at the timing of developing, a voltage of 2 KVp-p is applied to the developing roller, and electric field noise due to the influence is easily picked up by the contact member side. In particular, the longest contact member serves as an antenna and is more likely to pick up electric field noise. Therefore, in the present embodiment, the ground terminal 4
3G is arranged at the farthest position from the developing roller. Of course, it is preferable to dispose long terminals other than the ground terminal on the outside.

FIG. 7 is a diagram for explaining the mounting of the memory IC board on the connector body. FIG. 7A is a diagram showing a mounted state of the memory IC substrate as viewed from the back surface side of the connector. The memory IC substrate 46 is provided with a notch 46a at a position displaced from the center thereof, and the substrate tip is provided on both sides of the notch. The lengths are different. Positioning / mounting portion 60 having a recess on the connector body side so as to match the tip of the board.
Are formed, and the depth of this recess is different on both sides of the notch. Therefore, even if the left and right sides are reversed and the tip end of the substrate is inserted into the positioning attachment portion 60, it is not successful and erroneous insertion can be prevented. On the other hand, the rear end of the board is configured to engage with the hook 61 of the connector body.

FIG. 7B is a sectional view for explaining the mounting of the memory IC substrate. The memory IC board 46 of the present embodiment is made of a resin having elasticity (spring property), the front end of the board is inserted into the positioning attachment portion 60, and the rear end of the board is pressed while being rotated toward the connector body side. Is used to bend and insert, and is locked to the hook 61. At this time, the terminals of the memory IC substrate are spring-like contact terminals 43b, 4
4b is in elastic contact with the memory IC by the spring force of the contact.
The board is pressed against the positioning attachment part 60 and the hook 61, so that the mounting is stable and the contact state is stable.

In the case of reusing the memory IC substrate, if the memory IC substrate is fixed by soldering or the like as in the case of an ink jet printer, the IC itself may be heated to remove it. Therefore, the information in the memory may be destroyed. On the other hand, memory I
If you try to read the information in the memory with the C still attached, in an electrophotographic apparatus that is larger than an ink jet printer or the like, it is necessary to apply a terminal to a memory IC attached to a part of a large apparatus and read the contents. Therefore, only the operation is extremely complicated.

Therefore, the memory IC can be attached and detached by taking the contact point of the terminal with the memory IC substrate by the spring type contact member as in the present embodiment, and even if the connector body itself is fixed, it can be removed. Memory I
C itself can be easily removed and collected, and its contents can be read and used for reuse.

FIG. 8 is a cross-sectional view of the essential parts of a connector for mounting a memory IC board. The contact members 43 and 44 provided on both sides of the housing 47 of the connector 40 extend to the back surface side of the connector main body and are bent to provide spring properties.
b, 44b are formed. As described above, the positioning attachment part 60 and the hook 61 are formed in the connector body, and the memory IC board 46 having the notch in the positioning attachment part 60 enters the recess of the positioning attachment part and pushes down the board to the hook 61. The structure is such that it is locked and mounted by utilizing the spring property of the board. At this time, the terminals 63 and 64 of the memory IC board are connected to the contacts 43b on the connector side.
It contacts with 44b to form a fixed contact.

In this embodiment, the terminals of the memory IC substrate are arranged in two rows 63 and 64 so that the terminals are closer to the positioning attachment portion 60 side than the center, and the spring fulcrums P1 and P2 are hooked to be separated from the terminals 63 and 64 as much as possible. Make it closer to the 61 side. With this configuration,
When the memory IC substrate is mounted, the terminals 63, 64 and the contacts 43b, 44b softly contact with each other by the spring force, and a stable contact force is obtained.

Since the positions of the spring fulcrums P1 and P2 are almost the same, the length from the spring fulcrum to the contact point 43b is longer than that from the spring fulcrum point to the contact point 44b, and since the same spring material is used, the contact point 43b is used. Is smaller than the contact force of the contact point 44b. When mounting the memory IC board, the tips on the side close to the terminals 63 and 64 are inserted into the recesses of the positioning attachment portion 60 to push down the board as shown in the figure, and the other end is pushed into the hook member to be locked. The contacting terminal can be easily mounted as a low spring load contact 43b having a small contact force, the mounting can be stabilized, and since the mounting can be performed with a weak force, the memory IC substrate is less likely to be damaged and can be reused. .

Further, as explained in FIG. 5, the contact member 4
3 is on the 4 contact side, and the contact member 44 is on the 3 contact side. As described above, in the case of contacts having a plurality of rows (two rows in this embodiment) and the number of contacts in each row is not the same, the contact on the large number side (low spring load contact 43b) is set to the positioning attachment portion side. This prevents the force required for wearing from increasing,
In addition to facilitating the mounting, stabilizing the mounting and mounting with a weak force, the memory IC substrate is less likely to be damaged and can be reused.

When the low spring load contacts and the high spring load contacts are not the same number, the number of low spring load contacts is increased as described above. Since the spring load is low, there is no problem even if there are many contacts, and the force of the contacts is determined by the spring pressure. Therefore, even if the number of contacts increases, there is no problem with the terminals.

Also, the contacts on the multiple side (low spring load contacts 43
When b) is the side of the positioning attachment part, when the high spring load contact point 44b having a relatively large contact force is located on the center side of the memory IC board, the spring of the center part is mounted when the memory IC board is mounted. The contact pressure can be increased.
By increasing the spring contact pressure in the central part, after mounting the memory IC substrate, the substrate is pushed up from the center and pressure is applied evenly on both the positioning attachment part side and the hook part side, enabling stable attachment. . The mounting condition of the board is stabilized.

[0033]

As described above, according to the present invention, the memory I
By arranging the low load contact of the connector in which the terminals of the C board and the contacts that make spring contact with each other in a plurality of rows are arranged on the side of the positioning attachment portion, the memory IC board can be attached and detached and the memory IC board can be inserted with a weak force. It is possible to stabilize the insertion and prevent the substrate from being damaged. In addition, the insertion of the memory IC substrate can be similarly stabilized by making the row of multiple contacts a low load contact.

[Brief description of drawings]

FIG. 1 is a diagram illustrating an image forming apparatus of the present invention.

FIG. 2 is a diagram illustrating each position of replacement of a developing cartridge, reading / writing of data from / in a memory IC, and development standby.

FIG. 3 is a diagram illustrating connector connection to and separation from a memory IC.

FIG. 4 is a diagram illustrating a rotary developing device unit.

FIG. 5 is a diagram illustrating a connector with a built-in memory IC.

FIG. 6 is a diagram illustrating a connector terminal.

FIG. 7 is a diagram illustrating how the memory IC board is attached to the connector body.

FIG. 8 is a cross-sectional view of a main part of a connector on which a memory IC board is mounted.

[Explanation of symbols]

1 ... Photosensitive member, 2 ... Exposure unit, 3 ... Rotary developing unit, 4 ... Transfer belt, 5 ... Transfer belt drive roller,
6 ... Paper feed cassette, 7 ... Paper transport path, 8 ... Transfer roller,
9 ... Position detection sensor, 10 ... Fixing unit, 11 ... Development cartridge replacement opening, 12 ... Exhaust duct, 13 ... Filter, 14 ... Suction port, 20, 21 ... Side plate, 30 ... Rotary frame, 31-34 ... Development cartridge , 36 ...
Position detection sensor, 37 ... Position detection plate, 38
... IC protection member, 39 ... Connector cover, 40, 50 ...
Connector, 41 ... Board, 42 ... Guide member, 43, 44
... contact member, 45 ... contact protection member, 46 ... memory IC substrate, 46a ... notch, 60 ... positioning attachment part, 6
1 ... Hook, 63, 64 ... Terminal.

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) G03G 21/16 H01R 23/68 301E H01R 12/16 D 13/639 G03G 15/00 554 (72) Inventor Takeshi Aoki 3-3-5 Yamato, Suwa-shi, Nagano Seiko Epson Corporation F-term (reference) 2H027 DA27 DA44 DD02 HB13 HB17 ZA09 2H077 AA02 AD06 BA08 BA09 DA15 GA13 2H171 FA05 FA13 GA13 GA19 JA06 JA15 LA48 JA50 JA51 LA04 LA17 MA02 MA07 MA20 QA06 QA08 QA24 QB34 QB35 QB38 QC03 WA07 5E021 FA05 FA09 FB14 FB18 HB11 HC07 5E023 AA29 BB19 BB21 CC12 CC22 DD28 EE06 EE08

Claims (6)

[Claims] 1. A positioning attachment part that engages with the tip of the memory IC substrate and a hook part that locks the rear end of the memory IC substrate, and the memory IC substrate is detachably attached to the terminals of the memory IC substrate. A connector having a plurality of rows of contacts in spring contact, wherein a low-load contact among the plurality of rows of contacts is arranged on the side of the positioning attachment portion. 2. The connector according to claim 1, wherein the plurality of rows of contacts do not have the same number of contacts in each row, and the rows of multiple contacts are low load contacts. 3. The memory IC board is mounted by inserting the front end of the memory IC board into a positioning attachment portion and locking the rear end of the memory IC board to a hook portion by using elasticity. The connector according to claim 1. 4. The connector according to claim 1, wherein the memory IC substrate is formed with a notch for positioning, which is offset from the center of the tip inserted into the positioning attachment portion. 5. A developing cartridge, wherein the connector according to claim 1 is fixed to an end portion. 6. An image forming apparatus having the developing cartridge according to claim 5.