JP2003253476A - Method of producing etched parts - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of inexpensively producing etched parts by pasting both sides of a metallic thin sheet with the etched parts having half- etched parts in a multi-face way without connecting them by a bridge, and performing etching working. <P>SOLUTION: The production method is at least provided with 1) a stage where etching resist patterns 44a and b are formed; 2) a stage where etching is performed from both the sides, and a half-etched part 1 is formed on either side, and a half-etched part 2 of the other side is subjected to etching by the half of a prescribed depth, and a through part 48 is subjected to etching by the half of the depth; a stage 3) where either side is pasted with a back sheet 47; and a stage 4) where etching is performed from the other side, so that the half-etched part 2 is formed, and the through part 48 is formed. <P>COPYRIGHT: (C)2003,JPO

Description

Description: BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a method for manufacturing an etched part, and more particularly, to an inexpensive etched part having half-etched portions on both sides without being connected by a bridge. And a method of manufacturing an etched component to be manufactured. 2. Description of the Related Art Etching parts such as a lead frame and a grid for a fluorescent display tube are subjected to an etching process in a state in which individual etching parts are connected by a bridge and multi-faced. The bridge is subjected to half-etching, and after the etching process, this portion is bent and broken or cut by a mold to release the connection to form individual etched parts. However, there is an etching component in which etching cannot be performed in a state where such an etching component is connected with a bridge, and examples thereof include a component for a variable capacitor. FIGS. 1 (a), 1 (b) and 1 (c) are illustrations of an example of a component for a variable capacitor. FIG. 1 (a)
Is a plan view of the surface of the component for the variable capacitor, (b)
Is a plan view of the back surface, and (c) is a sectional view taken along line XX ′. As shown in FIGS. 1 (a), 1 (b) and 1 (c), the component for the variable capacitor is a disk having a diameter (φ) of about 2 mm and a thickness (t) of about 0.35 mm. . A half-etched portion (1) having a depth (t ₁ ) of approximately 60 μm indicated by oblique lines is formed on the front surface, and a half-etched portion (2) having a depth (t ₂ ) of approximately 0.2 mm also indicated by oblique lines is formed on the rear surface. I have. The positional relationship between the half-etched portion (1) and the half-etched portion (2) is such that a part of each half overlaps as shown in FIG. The width (w) of the left peripheral portion of the half-etched portion (1) on the surface shown in FIG.
The length (a ₁ ) × width (b ₁ ) of the rectangular portion other than the half-etched portion on the right side in the drawing is about 1 mm × 0.3 mm. Further, the vertical (a ₂ ) × width (b ₂ ) of the rectangular portion of the half-etched portion (2) on the back surface shown in FIG. 1B is about 1.5 mm × 0.5 mm, and the diameter of the circular portion (φ ₁ ) is about 0.3 mm. Conventionally, when manufacturing the above-mentioned parts for a variable capacitor by a photo-etching method, etching is often performed with the parts connected by bridges. FIG. 2 is an enlarged view of the vicinity of a bridge connecting the components, and shows a variable capacitor component (21).
The etching process is performed in a state where a, 21b) are connected by a bridge (22). Bridge (22)
The half-etching is applied to the connection between the component and the component (21), and the portion indicated by the dotted line is bent and broken to form one component (21a) for the variable capacitor. In this way, the variable capacitor component (21a) etched in a state of being connected by the bridge (22) has a reduced circularity as an etched component having a circular outer shape. Further, the smooth state of the surface is deteriorated by the influence of the fracture. That is, as shown in FIG. 2, the diameter of the circle formed by the fracture is smaller than the diameter (φ ₂ ) of the circle formed by etching on the circumference of the circular part. (Φ ₃ ) is small and its roundness is reduced, which is not preferable as a component for a variable capacitor requiring roundness. FIG.
When a bending break is performed at the dotted line shown in the figure, the end becomes burr-like and protrudes to the front surface or the back surface of the component for a variable capacitor (21a), the smooth surface is not smooth, and the variable surface requires smoothness. It is not preferable as a component for a capacitor. Therefore, in order to avoid such a reduction in roundness and deterioration in smoothness, when etching the components for the variable capacitor, the etched components are multi-faced without being connected by bridges. In some cases. FIGS. 3 (a) to 3 (f) show etching in a state in which etching parts having half-etched parts of a predetermined depth on both surfaces of a metal thin plate are multi-faced without being connected by a bridge, such as parts for variable capacitors. It is explanatory drawing of an example of the manufacturing method which performs a process. As shown in FIG. 3A, as a plate-like material processed into a component for a variable capacitor, for example, a metal thin plate (30) having a thickness (t) of about 0.35 mm and a size of about 40 cm × 50 cm is used. ) Is used. First, a dry film is used as a photoresist, and the dry film is attached to both surfaces of the thin metal plate (30) to form a front surface photoresist layer (33a) and a back surface photoresist layer (33b). Parts for variable capacitors are those that are etched with a large number of parts multi-faced,
FIG. 3 shows a part of the multiple imposition state. (Φ)
Represents one area of the component for the variable capacitor, and FIG.
The area of the part shown in FIG. Next, a first patterning is performed. FIG.
(B) shows a state in which the first patterning has been performed. As a photomask for exposure having a predetermined pattern, for example, a photomask for surface exposure, a part (31) to be a half-etched part and a part (35) to be a penetrating part
a) is a light-shielding part, and the other part is a light-transmitting part. As a back-side exposure photomask, a part (32) to be a half-etched part and a part (35b) to be a penetrating part are shielded. Then, pattern exposure by irradiation of ultraviolet rays, development and hardening treatment are performed. Thus, a portion (3) to be a half-etched portion on the surface of the metal sheet is provided on the surface side of the metal sheet (30).
1) and a surface etching resist pattern (34a) exposing a part (35a) to be a penetrating part, and a part (32) to be a half-etched part and a part to be a penetrating part (32) on the surface of the thin metal plate on the back side. A back side etching resist pattern (34b) exposing 35b) is formed (FIG. 3B). Next, the first etching is performed on a metal sheet (3
Perform from both sides of 0). On the surface side of the metal thin plate (30), a portion (31) serving as a half-etched portion and a portion (35a) serving as a through portion exposed from the surface etching resist pattern (34a) are etched to a predetermined depth (t _1). Forming a half-etched portion (1) having
On the back side of the thin metal plate (30), a portion (32) serving as a half-etched portion and a portion (35) serving as a penetrating portion exposed from the back surface etching resist pattern (34b).
b) is etched to form a half-etched portion (2) having a predetermined depth (t ₂ ). FIG. 3C shows a state in which the first etching has been performed. Next, a second patterning and a second etching are performed. FIG. 3D shows a state in which the second etching has been performed. As shown in FIGS. 3C and 3D, the second patterning is performed by the surface etching resist pattern (34a) after the first etching.
Then, the back side etching resist pattern (34b) is removed, and a dry film is newly attached to both sides to form a front side etching resist pattern (36a) and a back side etching resist pattern (36b) exposing a portion to be a penetrating part (38). Is what you do. The half-etched portion having a predetermined depth (t ₁ ) on the front surface side of the thin metal plate (30) is formed by the front surface etching resist pattern (36a) and the back surface etching resist pattern (36b) formed by the second patterning. (1) and the half-etched portion (2) having a predetermined depth (t ₂ ) on the back side are protected from the second etching. Next, the second etching is performed from both sides of the thin metal plate (30), and the penetration portion (3
8) It is assumed that the thickness of the metal sheet at the portion to be set is further reduced (FIG. 3 (d)). Next, as shown in FIG. 3E, a back sheet (37) is attached to the front side of the thin metal plate (30). Since the back sheet (37) is attached without a bridge connecting the etched parts in this method,
This is performed in advance to keep the etched components in a multi-faced state even after the third etching. Next, a third etching is performed from the back surface side of the thin metal plate (30), and the penetrating portion (38) is formed between the multi-faced etched parts.
To form Subsequently, the front surface etching resist pattern (36a) and the back surface etching resist pattern (36)
b) and the back sheet (37) are peeled off to obtain an etching component (39) for a variable capacitor. [0015] As shown in the above example, an etching component having a half-etched portion of a predetermined depth on both surfaces of a thin metal plate, such as an etching component for a variable capacitor, is multi-faced without being connected by a bridge. The method of performing the etching process requires a total of two times of patterning and three times of etching, which is troublesome, increases the manufacturing cost, and is expensive as an etched part. SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and is directed to a half-etched portion having a predetermined depth on both surfaces of a thin metal plate, such as an etched part for a variable capacitor. When etching parts that require roundness and smoothness are manufactured by etching without connecting them with a bridge, they are simplified and the etching parts are manufactured at low cost. It is an object of the present invention to provide a method for manufacturing an etched component that can be performed. According to the present invention, there is provided an etching method in which an etching component having a half-etched portion having a predetermined depth on both surfaces of a thin metal plate is etched in a multi-faced state without being connected by a bridge. 1) A method of manufacturing a component, comprising: 1) forming a surface etching resist pattern on one surface side of a metal thin plate, exposing a portion to be a half-etched portion and a portion to be a through portion on the surface of an etched component; A patterning step of forming a backside etching resist pattern that has a dummy pattern for adjusting the etching rate at a portion to be a half-etched portion on the back surface of the etched component and exposes a portion to be a penetrating portion; Etching is performed from both sides of the thin plate to form a half-etched part and a penetration part on one side The part is etched to a predetermined depth to form a half-etched portion on the front surface of the etched component on one surface side, and at the same time, on the other surface side, a portion to be a half-etched portion on the back surface of the etched component and a penetrating portion. 3) a first etching step of etching a portion of the sheet metal to the middle of each predetermined depth; 3) a back for holding an etched part in a multi-faced state on one surface side of the metal sheet after the second etching; 4) Etching is performed from the other surface side of the metal thin plate, and a portion to be a half-etched portion on the back surface of the etching component on the other surface side of the metal thin plate is etched to a predetermined depth. At the same time, a second etching step of forming a through portion by etching a portion to be a through portion exposed from the back surface etching resist pattern is reduced. A method for manufacturing an etching component, comprising: DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a method for manufacturing an etched part according to the present invention will be described in detail. FIG.
(A) to (E) are explanatory views showing in cross section one embodiment of a method for manufacturing an etched component according to the present invention. The parts for the variable capacitor are to be etched in a state where a large number of parts are multi-faced, and FIG. 4 shows a part of the multi-faced state. (Φ) represents one region of the component for the variable capacitor, and represents the region of the component shown in FIG. The component for the variable condenser is described as an embodiment. As shown in FIG. 4A, as a plate material to be processed, for example, a plate thickness (t) of about 0.35 mm and a size of 4 are used.
A thin metal plate (40) of about 0 cm × 50 cm is used. Using PVA photosensitive solution as a photoresist, first, PVA
A photosensitive liquid is applied to both sides of the thin metal plate (40), and a photoresist layer (43a) for the front surface and a photoresist layer (43) for the back surface are applied.
b) is formed. Next, patterning is performed. FIG. 4B shows a state in which patterning has been performed. Using an exposure photomask having a predetermined pattern, pattern exposure by ultraviolet irradiation, development and hardening are performed to form an etching resist pattern. On one surface side of the thin metal plate (40), a portion (41) serving as a half-etched portion and a portion (45a) serving as a penetrating portion on the surface of the etched component
Etching resist pattern (44a) that exposes
To form Further, on the other surface side, a back surface etching resist pattern (44b) exposing a portion (42) to be a half-etched portion and a portion (45b) to be a penetrating portion on the back surface of the etched component is formed. Here, in the present invention, a dummy pattern (44c) for adjusting the etching rate is formed with an etching resist at a portion (42) to be a half-etched portion (FIG. 4B). FIGS. 5A and 5B are explanatory diagrams of the dummy pattern (44c) in the portion indicated by (P) in FIG. FIG. 5A is a plan view, and FIG. 5B is a cross-sectional view. FIG.
As shown in (a) and (b), a dummy pattern (44c) for adjusting an etching rate is provided in a portion (42) serving as a half-etched portion on the back surface of the etching component on the other surface side of the thin metal plate (40). Is formed. In the method for manufacturing an etched component according to the present invention, the penetration portion is formed mainly by etching from the other surface side of the metal sheet, and the portion (4) to be a half-etched portion is formed.
2) Even if the part (45b) serving as the penetrating part is etched at the same time, the part (42) serving as the half-etched part does not penetrate, and the etching rate is adjusted so as to be etched to a predetermined depth ( 44c) is provided. That is, due to the presence of the dummy pattern (44c), the amount of contact of the etching solution with the portion (42) decreases, and the amount of etching of the portion (42) decreases. The dummy pattern (44c) has a planar shape such as a dot shape or a grid shape. In the case of an etched part having a diameter (φ) of about 2 mm, the pitch of points and lattices is 0.1
The dot diameter and line width are about 40 to 50 μm, and are appropriately selected and used. Note that, for example, a portion (52) in which a point-like dummy pattern (44c) is not formed in a portion (42) to be a half-etched portion
Is in a state where the surface of the thin metal plate (40) is exposed, and the etching is started from this portion, and at the time of etching to a predetermined depth at the time of the second etching described later, the dummy pattern (44c) The lower metal sheet portion is removed by being etched from both sides. For this reason, at the end of the second etching, there is no point-like thing at the bottom of the half-etched part (2), and the state is smooth. Surface etching resist pattern (44)
After the formation of the resist pattern (a) and the back surface etching (44b), the first etching is performed from both sides of the thin metal plate (40). The half-etched part (41) and the penetrated part (45a) exposed from the surface etching resist pattern (44a) on one surface side are etched to a predetermined depth (t ₁ ). A half-etched portion (1) of the surface of the etching component is formed on the surface side. At the same time, a portion (42) of the other surface, which is to be a half-etched portion on the back surface of the etched component, is etched (12) at a predetermined depth (t ₃ ), and a back surface etching resist pattern (44b) The part (45b) that becomes a penetrating part exposed from the center of the penetrating depth (t ₄ )
Is etched. Since the dummy pattern (44c) is provided in the portion (42) to be the half-etched portion, the etching depth (t ₃ ) in the portion (42) to be the half-etched portion and the portion (45b) to be the penetrating portion etch depth (t ₄₎ have a relationship of t ₃ <t _4. still,
FIG. 4C shows a state after the first etching. Next, as shown in FIG. 4D, a back sheet (47) is attached to one surface of the thin metal plate (40). In the present invention, since there is no bridge connecting the etching components in the present invention, the back sheet (47) is attached in advance in order to hold the etching components in a multi-faced state even after the second etching. Next, second etching is performed from the other surface side of the metal thin plate (40), and a portion (42) on the other surface side of the metal thin plate (40) which is to be a half-etched portion on the back surface of the etching component is formed. Etching to a predetermined depth (t ₂ )
A half-etched portion (2) on the back surface of the etched component is formed. At the same time, a portion (45b) to be a through portion exposed from the back surface etching resist pattern is etched to form a through portion (48). Subsequently, the front surface etching resist pattern (44a), the back surface etching resist pattern (44b), and the back sheet (47) are peeled off to obtain an etching component (49) for a variable capacitor. As described above, in the method of manufacturing an etched component according to the present invention, an etched component, such as an etched component for a variable capacitor, having a half-etched portion of a predetermined depth on both surfaces of a thin metal plate is connected by a bridge. When the etching process is performed in a multi-faced state, the patterning is performed once and the etching is performed twice, so that the manufacturing process is greatly shortened. Therefore, the materials used are also reduced, and such etched parts can be manufactured at low cost. According to the present invention, 1) a surface etching resist pattern is formed on one surface side of a metal thin plate, and a half etching portion is formed on the other surface side for adjusting an etching rate. A patterning step of forming a backside etching resist pattern having a dummy pattern, 2) etching from both sides of the metal sheet, forming a half-etched portion on one side, and forming a half-etched portion on the other side;
A first etching step of etching a half of a predetermined depth of a part to be a half-etched part, and etching a half of the depth of a part to be a penetrating part; 3) a backsheet to one surface side of a thin metal plate 4) etching from the other surface side of the metal thin plate to form a portion to be a half-etched portion on the back surface, and a second etching step of forming a penetrating portion. Since it is a manufacturing method, it has a half-etched part with a predetermined depth on both sides of a thin metal plate, such as an etched part for a variable capacitor, and connects etched parts that require roundness and smoothness with a bridge. Etching parts that can be manufactured at low cost by simplifying the process when manufacturing by etching in a multi-faced state without mounting The manufacturing method.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 (a), (b), (c) are explanatory diagrams of an example of an etching component for a variable capacitor. FIG. 2 is an explanatory diagram in a case where etching is performed in a state where etching components for a variable capacitor are connected by a bridge. FIGS. 3A to 3F are explanatory views of an example of a method of performing an etching process in a state where etching components having half-etched portions on both surfaces of a metal thin plate are multi-faced without being connected by a bridge. FIGS. 4A to 4E are cross-sectional views illustrating one embodiment of a method for manufacturing an etched component according to the present invention. FIGS. 5A and 5B are explanatory diagrams of a dummy pattern. [Description of Symbols] 1 ... Surface half-etched part 2 ... Backside half-etched parts 21a, 21b ... Parts for variable capacitors 22 ... Bridges 30, 40 ... Metal thin plates 31, 41 ... · Parts 32 and 42 serving as half-etched portions on the front surface ··· Parts 33a and 43a serving as half-etched portions on the back surface ··· Photoresist layers 33b and 43b ··· Backside photoresist layers 34a, 36a and 44a ... Surface etching resist patterns 34b, 36b, 44b ... Backside etching resist patterns 35a, 35b, 45a, 45b ... Parts to be penetrated 38, 48 ... Penetrated parts 37, 47 ... Back sheet 39, 49: Etching parts for variable condenser 44c: Dummy pattern 52 for etching rate adjustment .. A portion where no dot-shaped dummy pattern is formed A portion where the front surface half-etched portion and the back surface half-etched portion overlap each other. phi · · · variable component diameter t · · · parts thickness t ₁ · · · surface depth t ₂ · · · depth of the back half-etched portions of the half-etched portions of the variable capacitors for the capacitor

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Claims (1)

Claims: 1. A method for manufacturing an etching part, comprising: etching an etching part having a half-etched part having a predetermined depth on both sides of a thin metal plate in a state where the parts are multi-faced without being connected by a bridge. 1) Forming a surface etching resist pattern on one surface side of the metal sheet to expose a portion to be a half-etched portion and a portion to be a penetrating portion on the surface of the etched component, and, on the other surface side, A patterning step of forming a backside etching resist pattern having a dummy pattern for adjusting an etching rate on a portion to be a half-etched portion on the back surface of the etched component and exposing a portion to be a penetrating portion; 2) from both sides of the thin metal plate Etching is performed, and a portion to be a half-etched portion and a portion to be a penetrating portion on one surface side are etched to a predetermined depth. At the same time, a half-etched portion on the front surface of the etched component is formed on one surface side, and a portion to be a half-etched portion on the back surface of the etched component and a portion to be a penetrated portion on the other surface side are each defined. 3) a first etching step of etching up to the middle of the depth of the metal sheet; 3) a bonding step of bonding a back sheet on one surface side of the metal sheet after the second etching to hold the etched components in a multi-surface state. 4) Etching is performed from the other surface side of the metal thin plate, and a portion to be a half-etched portion on the back surface of the etching component on the other surface side of the metal thin plate is etched to a predetermined depth. A second etching step of etching a portion to be an exposed through portion to also form a through portion. A method of manufacturing an etched component.