JP2003243502A5 - - Google Patents

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Publication number
JP2003243502A5
JP2003243502A5 JP2002040057A JP2002040057A JP2003243502A5 JP 2003243502 A5 JP2003243502 A5 JP 2003243502A5 JP 2002040057 A JP2002040057 A JP 2002040057A JP 2002040057 A JP2002040057 A JP 2002040057A JP 2003243502 A5 JP2003243502 A5 JP 2003243502A5
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JP
Japan
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JP2002040057A
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JP4355836B2 (ja
JP2003243502A (ja
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Priority to JP2002040057A priority Critical patent/JP4355836B2/ja
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Publication of JP2003243502A5 publication Critical patent/JP2003243502A5/ja
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Publication of JP4355836B2 publication Critical patent/JP4355836B2/ja
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JP2002040057A 2002-02-18 2002-02-18 Ｃｕ膜とＣｕバンプの接続方法、Ｃｕ膜とＣｕバンプの接続装置 Expired - Lifetime JP4355836B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002040057A JP4355836B2 (ja) 2002-02-18 2002-02-18 Ｃｕ膜とＣｕバンプの接続方法、Ｃｕ膜とＣｕバンプの接続装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002040057A JP4355836B2 (ja) 2002-02-18 2002-02-18 Ｃｕ膜とＣｕバンプの接続方法、Ｃｕ膜とＣｕバンプの接続装置

Publications (3)

Publication Number Publication Date
JP2003243502A JP2003243502A (ja) 2003-08-29
JP2003243502A5 true JP2003243502A5 (ja) 2005-07-14
JP4355836B2 JP4355836B2 (ja) 2009-11-04

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ID=27780909

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002040057A Expired - Lifetime JP4355836B2 (ja) 2002-02-18 2002-02-18 Ｃｕ膜とＣｕバンプの接続方法、Ｃｕ膜とＣｕバンプの接続装置

Country Status (1)

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JP (1) JP4355836B2 (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006216937A (ja) * 2005-01-06 2006-08-17 Ebara Corp 基板処理方法及び装置
WO2006073140A1 (en) * 2005-01-06 2006-07-13 Ebara Corporation Substrate processing method and apparatus
JP4747691B2 (ja) * 2005-06-24 2011-08-17 東京エレクトロン株式会社 半導体装置の製造方法
JP4956963B2 (ja) 2005-11-02 2012-06-20 富士通セミコンダクター株式会社 リフロー装置、リフロー方法、および半導体装置の製造方法
US20090087995A1 (en) * 2006-03-27 2009-04-02 Tokyo Electron Limited Method of substrate treatment, process for producing semiconductor device, substrate treating apparatus, and recording medium
JP5210496B2 (ja) * 2006-03-27 2013-06-12 神港精機株式会社 半導体装置の製造方法
CN101410953B (zh) * 2006-03-27 2011-04-13 东京毅力科创株式会社 基板处理方法和装置、半导体装置的制造方法
JP2008034736A (ja) * 2006-07-31 2008-02-14 Tokyo Electron Ltd 熱処理方法および熱処理装置
JP5259125B2 (ja) * 2006-08-24 2013-08-07 富士通セミコンダクター株式会社 基板処理方法、半導体装置の製造方法、基板処理装置および記録媒体
US20100089978A1 (en) * 2008-06-11 2010-04-15 Suss Microtec Inc Method and apparatus for wafer bonding
JP5984044B2 (ja) * 2012-04-16 2016-09-06 須賀　唯知 金属触媒下及び不活性ガス雰囲気下で有機酸ガスを用いた表面酸化物除去方法及び接合装置
CN111613542A (zh) * 2019-02-22 2020-09-01 中科院微电子研究所昆山分所 一种铜-铜键合的方法

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