JP2003243248A - Method of manufacturing electronic chip component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method by which external electrodes can be formed surely only on end faces of a component body of each electronic chip component by dry-plating. <P>SOLUTION: A holder 21 composed of an elastic material 23 having holes 24 is prepared, and the component bodies 2 of the electronic chip components are respectively inserted into the holding holes 24 with the end faces 5 of the component bodies 2 on opening sides 25 of the holes 24 so that peripheral walls 26 specifying the openings of the holes 24 may cover the peripheral sections of the end faces 5 due to the elasticity of the elastic material 23. In this state, the external electrodes 3 are formed on the end faces 5 directed to the openings 25 of the holes 24 of the component bodies 2 held by the holder 21 by dry- plating. Other external electrodes are also formed on the other end faces 6 of the component bodies 2 of the electronic chip components by also performing the same step on the end faces 6. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a chip-shaped electronic component, and more particularly to a method for forming an external electrode of the chip-shaped electronic component.

[0002]

2. Description of the Related Art A chip-shaped electronic component such as a monolithic ceramic capacitor generally has an appearance as shown in FIG.

Referring to FIG. 3, the chip-shaped electronic component 1 is
A chip-shaped component body 2 is provided, and external electrodes 3 and 4 are formed at each end of the component body 2.

The above-mentioned external electrodes 3 and 4 are usually shown in FIG.
As shown in FIG. 3, the peripheral surface 7 located between the end surfaces 5 and 6 while being formed on each of the end surfaces 5 and 6 of the component body 2.
Has extensions 8 and 9 extending to a part of the.

However, if the chip-shaped electronic component 1 is, for example, a monolithic ceramic capacitor for high voltage,
When used under high voltage, the discharge between the outer electrodes 3 and 4 is due to the presence of the extensions 8 and 9,
More likely to occur. For this reason, as shown in FIG. 3, the chip-shaped electronic component 1 including the external electrodes 3 and 4 having the extension portions 8 and 9 has a problem of poor withstand voltage.

In order to solve the above-mentioned problems, a chip-shaped electronic component 11 having a form as shown in FIG. 4 has been proposed.
In FIG. 4, elements corresponding to those shown in FIG. 3 are designated by the same reference numerals, and redundant description will be omitted.

Referring to FIG. 4, in the chip-shaped electronic component 11, the external electrodes 3 and 4 are the end faces 5 of the component body 2.
And 6 respectively, and has no extension extending to the peripheral surface 7.

According to the chip-shaped electronic component 11 shown in FIG. 4, discharge between the external electrodes 3 and 4 can be made difficult to occur, and therefore the withstand voltage can be improved.

On the other hand, in both the chip-shaped electronic component 1 shown in FIG. 3 and the chip-shaped electronic component 11 shown in FIG. 4, in order to form the external electrodes 3 and 4, dry plating such as vapor deposition or sputtering is performed. Laws may apply. External electrodes 3 and 4 by dry plating
End faces 5 and 6 of the component body 2 are to be formed.
The metal particles are blown toward each of the end surfaces 5 and 6 to form metal films to be the external electrodes 3 and 4 on the end surfaces 5 and 6, respectively.

In this film forming process, the metal particles wrap around not only on the end surfaces 5 and 6 of the component body 2 but also on the peripheral surface 7, so that the external electrodes 3 and 4 shown in FIG.
Also, in any case of forming any of the external electrodes 3 and 4 shown in FIG. 4, a suitable mask is usually used in order to prevent the metal particles from wrapping around at an undesired place.

Japanese Unexamined Patent Publication No. 6-53097 describes a method suitable for forming the external electrodes 3 and 4 as shown in FIG. In this publication, the support plate is provided with an accommodating portion having a size slightly larger than the size of the component main body, and after the component main body is loaded into this accommodating part, the surface of the support plate is slightly smaller than the end face of the component main body. It is described that a mask plate having a mask hole is attached, and then sputtering is performed on the upper surface of the support plate in a state where reciprocating vibration is applied to the support plate.

The above-mentioned publication also discloses a method as shown in FIG. 5 as a conventional method suitable for forming the external electrodes 3 and 4 as shown in FIG.

Referring to FIG. 5, a holder 1 made of an elastic body.
3 is prepared. The holder 13 is provided with a holding hole 14 that receives the component body 2 and is in close contact with the peripheral surface 7 of the component body 2.

Next, the component body 2 is inserted into the holding hole 14. At this time, the component body 2 is held by the holder 13 because the holding hole 14 is brought into close contact with the peripheral surface 7 of the component body 2 based on the elasticity of the elastic body forming the holder 13. Further, the component body 2 is positioned so that one end surface thereof, for example, the end surface 5 is flush with the upper surface of the holder 13.

Next, the upper surface of the holder 13 is the target 15
And a sputtering process is performed. As a result, as shown by the arrow 16, the metal particles are blown toward the end surface 5 of the component body 2 and the upper surface of the holder 13 to form the metal film 17, and the metal film formed on the end surface 5 of the component body 2 is deposited. The outer electrode 3 is provided by the membrane 17.

The same process is performed by the other end surface 6 of the component body 2.
Will also be implemented.

According to the method shown in FIG. 5, the holder 13
Not only for holding the component body 2,
It can also function as a mask for preventing the metal film 17 from being formed on the peripheral surface 7 of the component body 2.

[0018]

However, both the method described in JP-A-6-53097 and the method shown in FIG. 5 have problems to be solved.

First, in the method disclosed in Japanese Patent Laid-Open No. 6-53097, reciprocating vibration is applied to the support plate in which the component main body is loaded in the storage portion. Therefore, a mechanism for giving such a reciprocating vibration is required, which causes an increase in the cost of the device. In addition, when reciprocating vibration is applied, the component body will be repeatedly moved within the storage part, which will cause wear of the component body and damage such as cracking or chipping of the component body due to repeated collisions. Cause the problem of.

Next, in the method shown in FIG. 5, the holder 13
The upper surface and the end surface 5 of the component body 2 are positioned so as to be flush with each other and the external electrode 3 is formed only on the end surface 5, but this often causes the inconvenience as shown in FIG. That is, the peripheral wall portion defining the opening of the holding hole 14 may be slightly separated from the peripheral surface 7 of the component body 2, and the gap 18 may be formed there. Such inconvenience is 1
While being arranged in the row and column directions in the individual holders 13,
This tends to occur when a large number of holding holes 14 are provided. The cause is considered to be as follows.

That is, the insertion of the component main body 2 into the holding hole 14 is carried out against the elasticity of the elastic body forming the holder 13, so that the holder 13 is deformed around the holding hole 14. If a large number of holding holes 14 are provided in the holder 13, such deformation is accumulated, and the accumulation of this deformation forms a gap 18 as shown in FIG.

It should be noted that the degree of accumulation of the above-mentioned deformation differs depending on the position of the holding hole 14 in the holder 13, and normally, in the holding hole 14 located at a specific position of the holder 13, a gap 18 as shown in FIG. Often occurs.
Further, the gap 18 is rather rare to be formed over the entire circumference of the holding hole 14, and normally, the gap 18 is often formed in a part of the periphery of the holding hole 14. Such a gap 18 is more often formed due to variations in the dimensions and positions of the holding holes 14 of the holder 13.

In general, the component body 2 is chamfered in order to reduce damage such as cracks and chips.
When the chamfered component body 2 is inserted into the holding hole 14 of the holder 13, as shown in FIG.
A gap 18a is formed at the corner of No. 4.

When the gap 18 or 18a is formed as shown in FIG. 6 or 7, the metal particles also enter the gap 18 or 18a in the sputtering process, so that the metal film 17 is formed on the component body 2 as shown in FIG. Is formed even on a part of the peripheral surface 7. As a result, in the chip-shaped electronic component 11 shown in FIG. 4, it may be difficult to stably form the external electrodes 3 and 4 only on the end surfaces 5 and 6 of the component body 2.

In the method shown in FIG. 5, the metal film 17 is used.
Are continuously formed from the end surface 5 or 6 of the component body 2 to the upper surface of the holder 13, so that when the component body 2 is taken out from the holding hole 14 of the holder 13, the external electrode 3 or 4 in the metal film 17 is removed. The portion to be formed is likely to be separated from the component main body 2 due to the portion of the metal film 17 formed on the holder 13.

From the above, although the method shown in FIG. 5 is adopted, the mask 19 as shown by an imaginary line in FIG. 6 is often used eventually. Mask 19
Has an opening 20 of substantially the same size as or slightly smaller than each of the end faces 5 and 6 of the component body 2.

The above-mentioned problems are not limited to sputtering, but are similarly encountered when the external electrodes 3 and 4 are formed by another dry plating method such as vapor deposition.

Therefore, an object of the present invention is to provide a method for manufacturing a chip-shaped electronic component, and more specifically a method for forming an external electrode of the chip-shaped electronic component, which can solve the above problems. That is.

[0029]

SUMMARY OF THE INVENTION The present invention comprises a chip-shaped electronic component including a step of producing a chip-shaped component body and a step of forming an external electrode on each end face of the component body by a dry plating method. The present invention is directed to a manufacturing method of, and is characterized by having the following configuration.

That is, the method for manufacturing a chip-shaped electronic component according to the present invention comprises an elastic body, and the elastic body receives a component body and holds a holding hole which is in close contact with the peripheral surface located between the end faces of the component body. In the step of preparing the holder, in which at least one end surface of the component body faces the opening side of the holding hole, the peripheral wall portion defining the opening of the holding hole is a component based on the elasticity of the elastic body. The method further comprises the step of inserting the component body into the holding hole so that the peripheral portion of the end surface of the body is covered, and thereby the holder holds the component body. Then, the step of forming the external electrode described above is performed on the end surface of the component body held by the holder, which is facing the opening side of the holding hole.

In the present invention, the step of holding the component main body by the holder is such that both end faces of the component main body face the respective opening sides of the holding holes, and A step of inserting the component body into the holding hole may be provided so that the defining peripheral wall portion is in a state of covering the peripheral edge portions of the respective end faces of the component body based on the elasticity of the elastic body.

In the above case, the step of forming the external electrode is
It is preferably carried out simultaneously on both end faces of the component body held by the holder.

[0033]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a diagram corresponding to FIG. 5 for explaining a first embodiment of the present invention. In this embodiment, as shown in FIG. 4, the chip-shaped electronic component 11 in which the external electrodes 3 and 4 are formed only on the end faces 5 and 6 of the component body 2 is manufactured. In FIG. 1, the elements corresponding to the elements shown in FIG. 4 described above are denoted by the same reference numerals, and duplicated description may be omitted.

First, the component body 2 is manufactured.

When the chip-shaped electronic component 11 to be obtained is a laminated ceramic capacitor, the component body 2 is
It has a laminated structure composed of a plurality of laminated dielectric ceramic layers and a plurality of internal electrodes formed along a specific interface between these dielectric ceramic layers. The internal electrodes are
The component main body 2 is provided with a first internal electrode drawn out to one end surface 5 and a second internal electrode drawn to the other end surface 6, and these first and second internal electrodes provide a capacitance. As formed, they are interleaved with dielectric ceramic layers. One external electrode 3 is connected to the first internal electrode, the other external electrode 4 is connected to the second internal electrode, and the above-mentioned capacitance is taken out by these external electrodes 3 and 4.

A holder 21 as shown in FIG. 1 is prepared. The holder 21 has a plate shape as a whole, and is, for example, a reinforcing member 2 made of a metal plate provided with a plurality of through holes.
2 and an elastic body 2 formed so as to cover the reinforcing member 22 and made of, for example, silicone-based or fluorine-based rubber
3 and 3.

The elastic body 23 is provided with a holding hole 24 for receiving the component body 2 in the longitudinal direction, for example. Holding hole 2
The inner size of 4 is smaller than the cross-sectional size of the component body 2 and is designed to be in close contact with the peripheral surface 7 of the component body 2 inserted therein. Usually, one holder 21 is provided with a large number of holding holes 24 arranged in rows and columns.

Next, as shown in FIG. 1, the component body 2 is inserted into each holding hole 24, whereby the holder 21 holds the component body 2. When inserting the component body 2 into the holding hole 24, the degree of insertion is adjusted so that the following state is realized.

That is, when one end surface of the component body 2, for example, the end surface 5 faces the one opening 25 side of the holding hole 24, the peripheral wall portion 26 defining the opening 25 of the holding hole 24.
However, based on the elasticity of the elastic body 23, the degree of insertion of the component body 2 into the holding hole 24 is adjusted so that the peripheral edge portion of the end surface 5 of the component body 2 is covered.

Next, the component body 2 is formed by dry plating.
The step of forming the external electrode 3 on the end surface 5 of is performed.
As a dry plating method, for example, when sputtering is applied, the holder 2 is placed so as to face the target 27.
As shown by the arrow 28, metal particles are blown toward the end surface 5 of the component body 2 in which the holder 1 is held and which is held by the holder 21 toward the opening 25 side of the holding hole 24. The external electrode 3 is formed by forming a film. At this time, the metal film 29 is also formed on the surface of the holder 21 facing the target 27 side.

As the dry plating method, for example, vapor deposition or the like can be applied in addition to the above-described sputtering.

In such a dry plating process, the holder 21 not only functions to hold the component body 2 but also functions as a mask for preventing the external electrodes 3 from being formed in undesired locations. . That is, the holder 21 includes the peripheral wall portion 26 that defines the opening 25 of the holding hole 24.
Is deformed based on the elasticity of the elastic body 23 so as to cover the peripheral portion of the end surface 5 of the component body 2, so that the holding state of the holding hole 24 to the peripheral surface 27 of the component body 2 can be more reliably obtained. As a result, even if the proper close contact state is not achieved in part, it is possible to advantageously prevent metal particles from reaching the peripheral surface 7 of the component body 2. In this way, the external electrode 3 can be reliably formed only on the end surface 5 of the component body 2.

After completing such a dry plating process, the component body 2 is taken out from the holding hole 24 of the holder 21.
At this time, at the position of the peripheral wall portion 26 of the opening 25 of the holding hole 24, the continuity between the metal film that provides the external electrode 3 on the end surface 5 of the component body 2 and the metal film 29 on the holder 21 is broken. Therefore, it is possible to advantageously prevent at least a part of the external electrode 3 from peeling from the end surface 5.

A step similar to the step of forming the external electrode 3 on the end surface 5 as described above is performed on the other end surface 6 as well, whereby the other external electrode 4 is formed on the end surface 6.

When the above steps are completed, the chip-shaped electronic component 11 as shown in FIG. 4 is obtained.

FIG. 2 is a diagram corresponding to FIG. 1 for explaining the second embodiment of the present invention. In FIG. 2, elements corresponding to those shown in FIG. 1 are designated by the same reference numerals, and redundant description will be omitted.

In the embodiment shown in FIG. 2, the holder 31 whose thickness is thicker than the longitudinal dimension of the component body 2 by a predetermined dimension is used. And the holder 31
In the state where the component body 2 is held by the component body 2, both end surfaces 5 and 6 of the component body 2 face the openings 25 and 32 of the holding hole 24, respectively. The peripheral wall portions 26 and 3 which define the
3 is made to be in a state of covering the peripheral portions of the end surfaces 5 and 6 of the component body 2 based on the elasticity of the elastic body 23.

In the embodiment shown in FIG. 2, the targets 27 and 34 are arranged so as to sandwich the holder 31 in carrying out the sputtering, and as shown by the arrows 28 and 35, the metal particles are separated from the component body. The outer electrodes 3 and 4 are simultaneously formed by being simultaneously blown toward both end surfaces 5 and 6 of the second electrode 2.

As a modified example of the second embodiment shown in FIG. 2, the holder 31 as shown in FIG. 2 is used, and the external electrode 3 is held while the component body 2 is held by the holder 31. The forming steps of 4 and 4 may not be simultaneously performed, but may be performed at different stages.

Next, experimental examples carried out according to the present invention will be described. This experimental example was performed according to the embodiment shown in FIG.

First, as the component body 2, 4.5 mm ×
A component body for a monolithic ceramic capacitor having dimensions of 2.0 mm × 1.5 mm was used. On the other hand, holder 3
1, the inner size is 4.5 m of the component body 2 described above.
4.3 mm x 1.8 m smaller than m x 2.0 mm
A holding hole 24 having a rectangular cross section, which is m, was used.

Next, the component body 2 was inserted into each holding hole 24 so that the state shown in FIG. 2 was obtained, and the holder 31 held the component body 2.

Next, the holder 21 holding the component body 2
Was placed in a sputtering apparatus and heated to a temperature of 100 ° C. in a vacuum of 10 ⁻² Pa, and then sputtering was performed to form Ni on the end faces 5 and 6 of the component body 2.
-0.5 μm thick film made of Ti alloy (containing Ti: 7.5% by weight) and 0.5 μm thick made of Cu on the film.
And a film of Sn having a thickness of 0.5 μm were sequentially formed thereon to form external electrodes 3 and 4.

Next, when the component body 2 is taken out from the holding hole 24 and the external electrodes 3 and 4 formed on the component body 2 are visually observed, both of the end surfaces 5 and 6 of the component body 2 are observed.
It was formed only on the top. Further, the external electrodes 3 and 4 were not peeled off.

For the chip-shaped electronic component 11 thus obtained, the pulse breakdown voltage (pulse BDV) was measured with a pulse rise time of 1.2 μsec. A relatively high value of 8.2 kV was obtained. Was given.

The Ni used in the above-mentioned experimental example
-Ti, Mo, W, V, Cr, N instead of Ti alloy
With i, Fe, Zn or Al or their alloys, Au and A instead of Cu and Sn are also used.
It has been confirmed that the same effect can be obtained by using g.

Although the present invention has been described above with reference to a specific embodiment, various other modifications are possible within the scope of the present invention.

For example, the chip-shaped electronic component to which the present invention is applied is not limited to the monolithic ceramic capacitor.
In short, it can be applied to any chip-shaped electronic component as long as it is a chip-shaped electronic component in which external electrodes are formed on each end face of the component main body. For example, the component main body has a laminated structure. Alternatively, the component body may not be made of ceramic.
Further, the shape of the component body is not limited to a hexahedron shape such as a rectangular parallelepiped, but may be a cylindrical shape, for example.

The orientation of the component body inserted into the holding hole of the holder is selected so that the end surface on which the external electrode is to be formed faces the opening side of the holding hole. As shown, the longitudinal direction of the component body 2 is the holding hole 2
It is not limited to the case of being oriented in the axial direction of No. 4, but may be inserted into the holding hole in a state in which the longitudinal direction of the component body is oriented in the radial direction of the holding hole as in the experimental example described above.

[0060]

As described above, according to the present invention, when the component body is inserted into the holding hole provided in the holder,
Since the peripheral wall portion that defines the opening of the holding hole is configured to cover the peripheral edge portion of the end surface of the component body based on the elasticity of the elastic body, the close contact state of the holding hole with the peripheral surface of the component body is more reliably achieved. In addition, in the dry plating, the metal particles are surely prevented from wrapping around so as to reach the peripheral surface of the component body. Therefore, with high reliability,
The holder can function as a mask for preventing the external electrodes from being formed in undesired locations, and the external electrodes can be reliably formed only on the end faces of the component body.

As a result, the reliability of the chip-shaped electronic component obtained by implementing the present invention with respect to high voltage can be enhanced, and more specifically, the withstand voltage can be enhanced.
Further, improvement in moisture resistance can also be expected.

Further, in the metal film formed by the dry plating method, at the position of the peripheral wall of the opening of the holding hole, there is continuity between the portion providing the external electrode on the end face of the component body and the portion on the holder. Since it is cut, at least a part of the external electrode does not peel off from the end surface of the component body when the component body is taken out from the holding hole of the holder.

In the present invention, when the holder holds the component body, both end surfaces of the component body are
Each of them is facing both openings of the holding hole,
The peripheral wall portion defining each opening of the holding hole is in a state of covering the peripheral edge portion of each end surface of the component body based on the elasticity of the elastic body,
By inserting the component body into the holding hole, when the component body is held by the holder, external electrodes can be formed on both end surfaces of the component body in this state. It is possible to improve the efficiency of the external electrode forming process.

In the above-mentioned case, if the step of forming the external electrodes is simultaneously performed on both end surfaces of the component body held by the holder, the step of forming the external electrodes can be further streamlined. .

[Brief description of drawings]

FIG. 1 is a cross-sectional view illustrating a method for manufacturing a chip-shaped electronic component according to a first embodiment of the present invention, showing a state in which a component body 2 is held by a holder 21 and sputtering is performed. Is.

FIG. 2 is a diagram corresponding to FIG. 1 for explaining a method of manufacturing a chip-shaped electronic component according to a second embodiment of the present invention.

FIG. 3 is a perspective view showing an appearance of an example of a conventional typical chip-shaped electronic component.

FIG. 4 is a perspective view showing an appearance of an example of a chip-shaped electronic component to be manufactured according to the present invention.

FIG. 5 is a diagram corresponding to FIG. 1 for explaining a conventional method for manufacturing a chip-shaped electronic component, which is of interest to the present invention.

6 is a cross-sectional view showing an enlarged part of FIG. 5 for explaining a problem that may be encountered in the manufacturing method shown in FIG.

7 is a cross-sectional view showing an enlarged part of FIG. 5 for explaining another problem that may be encountered in the manufacturing method shown in FIG.

[Explanation of symbols]

2 parts body 3,4 External electrode 5, 6 end face 7 circumference 11 Chip-shaped electronic components 21,31 holder 23 Elastic body 24 holding hole 25,32 openings 26,33 Peripheral wall 27,34 targets

Claims (3)

[Claims] 1. A step of producing a chip-shaped component body,
A method of manufacturing a chip-shaped electronic component, comprising the step of forming external electrodes on each end surface of the component body by dry plating, comprising an elastic body, wherein the elastic body receives the component body. And a step of preparing a holder, in which a holding hole is provided that is in close contact with a peripheral surface located between the end faces of the component body, and at least one of the end faces of the component body faces the opening side of the holding hole. In the state, the component main body is placed in the holding hole so that the peripheral wall portion defining the opening of the holding hole covers the peripheral edge portion of the end surface of the component main body based on the elasticity of the elastic body. Further comprising the step of inserting the holder so that the holder holds the component body, and the step of forming the external electrode includes the step of forming the external electrode in the component body held by the holder. Is performed on the end face facing the opening side of the hole, the chip-like electronic component manufacturing method. 2. The step of holding the component main body by the holder is a state in which both the end surfaces of the component main body face the opening sides of both of the holding holes, respectively. A step of inserting the component body into the holding hole so that the peripheral wall portion defining each of the openings is in a state of covering the peripheral edge portion of each end surface of the component body based on the elasticity of the elastic body, The method for manufacturing a chip-shaped electronic component according to claim 1. 3. The method of manufacturing a chip-shaped electronic component according to claim 2, wherein the step of forming the external electrode is performed simultaneously on both of the end faces of the component body held by the holder.