JP2003243117A - Ic socket - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC socket having an adjustment mechanism for adjusting the height of the IC package, that is, the depressing force corresponding to the thickness, by turning by nearly 90 degrees the spacer even while the printed- circuit board is mounted. <P>SOLUTION: The IC socket comprises a socket body adhered to the printed- circuit board, a contact pin provided on the socket body, and a depressing plate mounted on the socket body. The IC socket has a spacer which is provided at the above depressing plate capable of vertical movement and rotating movement so as to depress the IC package installed on the contact pin, a lock mechanism for fitting the depressing plate on the socket body detachably, and an adjustment mechanism for adjusting the depressing force of the spacer. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package for electronic parts as an electric part, and more particularly to an IC socket in which an IC package or the like is mounted, and more particularly to a height, that is, a thickness of the IC package. The present invention relates to an IC socket having an adjusting mechanism capable of adjusting the pressing force by pressing.

[0002]

2. Description of the Related Art Conventionally, as an IC socket in which an IC package as an electric component is mounted, there is known an IC socket in which an IC package mounted on a contact pin of a socket body fixed to a printed circuit board is held by a holding plate. Has been.

[0003]

Conventionally, such an IC has been used.
In the socket, the height of the pressing surface that presses the IC package must be removed by removing the screws that fix the spacer, and the work is difficult and complicated. There was a problem that it took time and money.

Therefore, in order to solve such a conventional problem, an object of the present invention is to rotate the spacer by approximately 90 ° even when the printed circuit board is mounted, so that the height, that is, the thickness of the IC package is increased. An object of the present invention is to provide an IC socket having an adjusting mechanism capable of adjusting the pressing force corresponding to the height.

[0005]

In order to achieve the above-mentioned object, an IC socket of the present invention has a socket body fixed to a printed circuit board, a contact pin provided on the socket body, and the socket body. In an IC socket having a pressing plate to be placed, a spacer provided on the pressing plate so as to be vertically movable and rotatable so as to press the IC package mounted on the contact pin, and the pressing plate. It is characterized in that it has a locking mechanism that is detachably attached to the socket body and an adjusting mechanism that adjusts the pressing force of the spacer.

Further, the IC socket of the present invention is characterized in that the spacer is attached to the pressing plate via a spring member so as to be elastically displaceable.

Further, the IC socket of the present invention is characterized in that the adjusting mechanism has an adjusting cam for stepwise adjusting the pressing force.

Furthermore, the IC socket of the present invention is characterized in that the adjusting cams are arranged on the plane of the spacer at intervals of approximately 90 °.

The IC socket of the present invention is characterized in that the locking mechanism is locked to the socket body via a locking claw of a locking arm.

Other objects, features and advantages of the present invention will be apparent from the following detailed description of the embodiments of the present invention shown in the accompanying drawings.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (Embodiment) FIGS. 1 and 2 are a central longitudinal sectional view and a plan view showing an IC socket for illustrating and explaining an embodiment of an IC socket according to the present invention.

As shown in FIGS. 1 and 2, an IC socket 1 according to the present invention includes a socket body 3 fixed to a printed circuit board 2, a plurality of contact pins 4 provided on the socket body 3. A pressing plate 5 placed on the socket body 3, a spacer 6 for pressing the IC package 10 mounted on the contact pin 4, and a spacer 6 attached to the pressing plate 5 so as to be vertically movable and rotatable, and pressing force is applied. It has an adjusting mechanism 7 for adjusting stepwisely and a locking mechanism 8 for removably attaching the holding plate 5 to the socket body 3 and locking it, and the IC package 10 is placed on the contact pin 4. It is configured to be held by the spacer 6 and the pressing plate 5. In the present invention, the IC package 10 applied is a ball grid array type IC package, but the present invention is not limited to this, and other similar IC packages can be used. Of course.

In the illustrated IC socket 1 of the present invention,
In this embodiment, the socket body 3 is attached to the printed circuit board 2 together with the reinforcing plate 12 by the screws 14, and the upper cover member 15 is provided on the upper portion of the socket body 3 so as to be integrated with the socket body 3 by the screws 16. Are firmly fixed together, and these socket body 3 and upper cover member 15
A plurality of contact pins 4 are planted upright with respect to and.

The contact pin 4 is arranged such that the end face of the upper end thereof is substantially flush with the upper face of the upper cover member 15, and the external terminal 11 such as a spherical or hemispherical solder ball terminal of the IC package 10. The end face of the lower end portion is formed so as to be in contact with and electrically connected to the terminal of the printed circuit of the printed circuit board 2. The IC package 10 is placed on the upper cover member 15 of the socket body 3 provided with a plurality of such contact pins 4.
Is placed, and the holding plate 5 is placed on the
It is formed so as to be pressed by.

A spacer 6 is arranged at the center of the inside of the holding plate 5, and lock mechanisms 8 are provided on both left and right sides. As shown in FIG. 2, such a holding plate 5 has a substantially rectangular shape corresponding to the shape of the IC package 10 to be applied, and the shaft portion 18 of the spacer 6 is passed through the central hole. A spring member 20 such as a coil spring is provided around the shaft portion 18 so that the spacer 6 can be attached. Further, the locking members 22 of the pair of locking mechanisms 8 are provided on the left and right sides of the holding plate 5. Each of them is pivotally supported by a pin 28 so that the pressing plate 5 can be locked and attached to the socket body 3.

Further, the spacer 6 is the IC package 1
It has a substantially quadrangular shape corresponding to the shape of 0, a pressing portion 17 protruding downward is formed in the lower center portion, and a shaft portion 18 is provided upright in the center of the upper portion, and the upper end portion of the shaft portion 18 is provided. The operating knob 19 is attached to the shaft portion 1
8, a spring member 20 is arranged around the surface of the spacer 8, and a plurality of flat cams, four in this embodiment, having different heights at intervals of about 90 ° about the shaft 18 on the upper surface of the spacer 6. An adjusting cam 21 such as the above is provided, and the adjusting mechanism 7 is configured by the shaft portion 18, the spring member 20, and the adjusting cam 21.

Therefore, the spacer 6 is provided so as to be movable up and down and rotatable with respect to the pressing plate 5 by the shaft portion 18, and has the operation knob 19 and is rotated by about 90 ° about the shaft portion 18. By rotating, the adjustment cam 21 of the adjustment mechanism 7 applies a required pressing force to the IC package 1
It is configured so that 0 can be pressed.

In particular, as clearly shown in FIGS. 3 and 4, the upper surface of the spacer 6 is divided into four parts with the shaft portion 18 as the center, and the four cam surfaces 21a, 21b, 21.
c, 21d are provided, and these cam surfaces 21a, 2d
1b, 21c and 21d have different heights, and are provided with four stages of cam surfaces 21a, 21b, 21c and 21d.

Therefore, by holding the operation knob 19 attached to the upper end of the shaft portion 18 of the spacer 6, the adjustment cam 21 of the adjustment mechanism 7 is rotated by about 90 ° and the adjustment cams 21 of the adjustment mechanism 7 have different heights from the cam surfaces 21a. 21d, the pressing force can be adjusted by changing each time, so that the spacer 6 can be adjusted according to the size such as the height of the mounted IC package 10. It is formed so that a pressing force can be obtained and four types of IC packages 10 having different thicknesses can be mounted.

In addition, the spacer 6 is replaced by providing only a plurality of types of spacers 6 themselves, and further,
It can be configured so that a required pressing force can be obtained corresponding to various types of IC packages 10. Furthermore, although the adjusting cam 21 is formed to have a circular planar shape in the illustrated embodiment, the shape of the adjusting cam 21 is not limited to such a circular shape and may be a triangle or a quadrangle. Alternatively, the adjustment cam 21 can be manufactured in any other shape such as a polygon or an ellipse.

A pair of locking mechanisms 8 for detachably attaching the holding plate 5 to the socket body 3 and locking the holding plate 5 are provided on the left and right sides of the holding plate 5. Such a locking mechanism 8
Has a locking member 22 rotatably supported by a pin 29 on the pressing plate 5, and the locking member 22 has a locking arm 23 and a pressing arm 24 protruding in three directions.
And an operating arm 25 are formed, and a pressing spring member 26 is provided between the upper surface of the pressing plate 5 and the pressing arm 24.

Furthermore, a locking claw 27 is provided at the tip of the locking arm 23, and this locking claw 27 engages with a protrusion 28 provided on the socket body 3 with respect to the socket body 3. It is formed so that the pressing plate 5 can be locked. Therefore, the socket main body 3 is formed with locking projections 28 on the left and right corresponding to the locking members 22 on the left and right of the pressing plate 5, respectively.

As described above, in the IC socket 1 to which the present invention is applied, the IC package 10 is mounted on the upper cover member 15 fixed to the socket body 3 attached to the printed circuit board 2 reinforced by the reinforcing plate 12. This I
The C package 10 is pressed by the spacer 6 of the holding plate 5, and the holding plate 5 is locked by the locking mechanism 8 into the socket body 4
It can be removably attached to.

Further, the socket body 3 and the upper cover member 1
5, a plurality of contact pins 4 are arranged as shown in the figure, the IC package 10 is arranged on these contact pins 4, and the holding plate 5 is placed on the IC pin 10 to fix the locking mechanism. By locking the locking claw 27 of the locking arm 23 of No. 8 to the protrusion 28 of the socket body 3, the socket body 3 of the IC socket 1 and the holding plate 5 can be integrally assembled.

In the IC socket 1 of the present invention constructed as described above, a required pressing force adjusted in four steps is obtained by the turning of the operating knob 19 through the adjusting cam 21 of the adjusting mechanism 7, and by this, Since the pressing force of the pressing portion 17 of the spacer 6 can be adjusted, the conventional fixing of the operating knob with the screw to the spacer is eliminated to reduce the number of adjustment work steps, and the pressing portion of the spacer 6 against the IC package 10 is reduced. The height of the pressing surface at 17 can be easily adjusted within the range of the maximum thickness Smax (FIG. 5) to the minimum thickness Smin (FIG. 6) of the IC package 10.

[0026]

As described above, according to the first aspect of the present invention.
The described IC socket is an IC socket having a socket body fixed to a printed circuit board, a contact pin provided on the socket body, and a holding plate mounted on the socket body, and mounted on the contact pin. A spacer provided on the holding plate so as to be vertically movable and rotatable so as to press the formed IC package, a locking mechanism for detachably attaching the holding plate to the socket body, and a pressing force of the spacer is adjusted. Since it has an adjusting mechanism for adjusting the pressing force, the pressing force can be appropriately adjusted according to the height of the mounted IC package, that is, the thickness.
The adjustment work can be simplified and the man-hours can be reduced to reduce the work time and cost.

The IC socket according to claim 2 of the present invention is
Since the spacer is attached to the pressing plate via a spring member so as to be elastically displaceable, the pressing force of the spacer can be easily adjusted, and the operation and the configuration can be simplified.

The IC socket according to claim 3 of the present invention is
Since the adjusting mechanism has an adjusting cam for adjusting the pressing force in a stepwise manner, the height of the mounted IC package,
That is, the pressing force can be appropriately adjusted according to the thickness.

The IC socket according to claim 4 of the present invention is
The adjusting cam is approximately 90 ° on the plane of the spacer.
Since each of them is arranged, the required pressing force can be obtained by the operation every 90 °, and the adjusting operation can be appropriately performed.

The IC socket according to claim 5 of the present invention is
Since the locking mechanism is locked to the socket main body via the locking claw of the locking arm, it can be easily and firmly engaged and locked.

[Brief description of drawings]

FIG. 1 is a central vertical sectional view of an IC socket of the present invention.

FIG. 2 is a plan view of the IC socket of the present invention in FIG.

FIG. 3 is a plan view of a spacer in the IC socket of the present invention.

FIG. 4 is an elevation view of a spacer in the IC socket of the present invention in FIG.

5 is the thickest IC in the IC socket of the present invention in FIG.
It is a central longitudinal cross-sectional view at the time of packaging.

6 is the thinnest IC in the IC socket of the present invention in FIG.
It is a central longitudinal cross-sectional view at the time of packaging.

[Explanation of symbols]

1 IC socket 2 printed circuit boards 3 socket body 4 contact pins 5 Presser plate 6 spacers 7 Adjustment mechanism 8 locking mechanism 10 IC package 11 External terminal 12 Reinforcement plate 14 screws 15 Upper cover member 16 screws 17 Pressing part 18 Shaft 19 Operation knob 20 Spring member 21 Adjustment cam 22 Locking member 23 Locking Arm 24 pressing arm 25 Operation arm 26 Spring member 27 lock nails 28 Protrusion 29 pin

Claims (5)

[Claims] 1. An IC socket having a socket body fixed to a printed board, a contact pin provided on the socket body, and a holding plate mounted on the socket body, the IC socket being mounted on the contact pin. A spacer provided on the holding plate so as to be vertically movable and rotatable so as to press the IC package, a locking mechanism for detachably attaching the holding plate to the socket body, and a pressing force of the spacer is adjusted. I having an adjusting mechanism
C socket. 2. The IC socket according to claim 1, wherein the spacer is attached to the pressing plate via a spring member so as to be elastically displaceable. 3. The adjusting mechanism has an adjusting cam for adjusting the pressing force in a stepwise manner.
The described IC socket. 4. The IC socket according to claim 3, wherein the adjusting cams are arranged on the flat surface of the spacer at intervals of approximately 90 °. 5. The IC socket according to claim 1, wherein the locking mechanism is locked to the socket body via a locking claw of a locking arm.