JP2003240728A5 - - Google Patents

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Publication number
JP2003240728A5
JP2003240728A5 JP2002044187A JP2002044187A JP2003240728A5 JP 2003240728 A5 JP2003240728 A5 JP 2003240728A5 JP 2002044187 A JP2002044187 A JP 2002044187A JP 2002044187 A JP2002044187 A JP 2002044187A JP 2003240728 A5 JP2003240728 A5 JP 2003240728A5
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JP
Japan
Prior art keywords
ccd camera
lens
image
mirror surface
inspection object
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Application number
JP2002044187A
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English (en)
Japanese (ja)
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JP2003240728A (ja
JP3789097B2 (ja
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Priority to JP2002044187A priority Critical patent/JP3789097B2/ja
Priority claimed from JP2002044187A external-priority patent/JP3789097B2/ja
Publication of JP2003240728A publication Critical patent/JP2003240728A/ja
Publication of JP2003240728A5 publication Critical patent/JP2003240728A5/ja
Application granted granted Critical
Publication of JP3789097B2 publication Critical patent/JP3789097B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2002044187A 2002-02-21 2002-02-21 被検査物の外周検査方法および外周検査装置 Expired - Fee Related JP3789097B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002044187A JP3789097B2 (ja) 2002-02-21 2002-02-21 被検査物の外周検査方法および外周検査装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002044187A JP3789097B2 (ja) 2002-02-21 2002-02-21 被検査物の外周検査方法および外周検査装置

Publications (3)

Publication Number Publication Date
JP2003240728A JP2003240728A (ja) 2003-08-27
JP2003240728A5 true JP2003240728A5 (enExample) 2004-12-09
JP3789097B2 JP3789097B2 (ja) 2006-06-21

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ID=27783672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002044187A Expired - Fee Related JP3789097B2 (ja) 2002-02-21 2002-02-21 被検査物の外周検査方法および外周検査装置

Country Status (1)

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JP (1) JP3789097B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG157977A1 (en) * 2008-06-23 2010-01-29 Semiconductor Tech & Instr Inc System and method for inspection of semiconductor packages
JP6489540B2 (ja) * 2014-02-27 2019-03-27 株式会社ＮｅｊｉＬａｗ 撮像システム、照明手段
US9759670B2 (en) * 2014-12-23 2017-09-12 Mitutoyo Corporation Bore imaging system
JP2017009542A (ja) * 2015-06-25 2017-01-12 株式会社ＮｅｊｉＬａｗ 撮像システム
JP6834174B2 (ja) * 2016-05-13 2021-02-24 株式会社ジェイテクト 外観検査方法および外観検査装置
JP2019117139A (ja) * 2017-12-27 2019-07-18 株式会社ケージェーケー ベアリングの検査方法と検査装置
CN114061481A (zh) * 2020-08-04 2022-02-18 广东博智林机器人有限公司 一种光源组件及检测装置

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