JP2003240524A - Optical substrate visual inspection apparatus - Google Patents

Optical substrate visual inspection apparatus

Info

Publication number
JP2003240524A
JP2003240524A JP2002037792A JP2002037792A JP2003240524A JP 2003240524 A JP2003240524 A JP 2003240524A JP 2002037792 A JP2002037792 A JP 2002037792A JP 2002037792 A JP2002037792 A JP 2002037792A JP 2003240524 A JP2003240524 A JP 2003240524A
Authority
JP
Japan
Prior art keywords
light
substrate
optical
parallel
irradiating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2002037792A
Other languages
Japanese (ja)
Inventor
Mitsuhiro Kitagawa
光博 北側
Kohei Nishikawa
晃平 西川
Akira Okamoto
陽 岡本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Priority to JP2002037792A priority Critical patent/JP2003240524A/en
Publication of JP2003240524A publication Critical patent/JP2003240524A/en
Abandoned legal-status Critical Current

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  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical substrate visual inspection apparatus by which a flat part and a grade part on a three-dimensional molded MID substrate are visually inspected simultaneously. <P>SOLUTION: The optical substrate visual inspection apparatus is provided with a first light irradiation means 2 by which a substrate 10 is irradiated with parallel light from a direction at right angles to the substrate; a second light irradiation means 3 by which the substrate 10 is irradiated with light from an oblique direction; at least a pair of third light irradiation means 4 in which optical filters used to transmit light in a wavelength band at a low spectral reflectance in the surface of the substrate 10 are interposed, and which are arranged and installed nearly symmetrically with reference to a virtual line parallel to a conveyance direction of the substrate 10 so as to cross an optical axis of the means 2 in order to irradiate the parallel light from the oblique direction at the substrate 10; and a CCD camera imaging means 5 which detects reflected light and scattered light reflected to the direction at right angles to the substrate 10 when beams of light from the first, second and third light irradiation means 2, 3, and 4 are irradiated. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、基板の導体パター
ンや金メッキを施したボンディングパットなどの外観を
検査する光学式基板外観検査装置に関し、より詳しく
は、立体成形されたMID(Molded Inter
connect Device:三次元射出成形回路部
品)基板の外観検査に対して好適な光学式基板外観検査
装置の技術分野に属するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical board appearance inspection apparatus for inspecting the appearance of a conductor pattern of a board or a bonding pad plated with gold, and more particularly to a three-dimensionally molded MID (Molded Inter).
connect device (three-dimensional injection molding circuit component) belongs to the technical field of an optical substrate visual inspection device suitable for visual inspection of a substrate.

【0002】[0002]

【従来の技術】電気製品や電子機器に使用される種々の
基板は光学式の基板外観検査装置によって表面欠陥の有
無を検査し、検査に合格した表面欠陥のない基板が製品
として出荷されている。このような光学式の基板外観検
査装置としては、例えば、特開平5−280952号公
報(従来例1;光学式プリント基板検査装置)や、特開
平7−58500号公報(従来例2;外観検査装置)等
に開示されてなるものが公知である。
2. Description of the Related Art Various substrates used in electric products and electronic equipment are inspected for surface defects by an optical substrate appearance inspection device, and substrates which have passed the inspection and have no surface defects are shipped as products. . Examples of such an optical substrate appearance inspection device include, for example, JP-A-5-280952 (conventional example 1; optical printed circuit board inspection device) and JP-A-7-58500 (conventional example 2: appearance inspection). The device disclosed in (Device) is known.

【0003】上記従来例1に係る光学式プリント基板検
査装置は、検査対象のプリント基板に対して垂直方向か
ら光を照射する垂直照明と、被検査面に対して斜め方向
から光を照射する斜方照明とを備え、両光源からの合成
光をCCDカメラ等の撮像手段で撮像することによりプ
リント基板の被検査面の欠陥を検査する構成になるもの
である。また、上記従来例2に係る外観検査装置は、表
面実装部品を装着した基板を検査するもので、基板の電
極部分(銀色)と電極部(銅箔)との異なる材料の分光
反射率の差異に注目し、照明波長を選定して照明する構
成になるものである。
The optical printed circuit board inspecting apparatus according to the conventional example 1 has a vertical illumination for irradiating a printed circuit board to be inspected with light in a vertical direction and an oblique illumination for irradiating light in an oblique direction with respect to a surface to be inspected. It is provided with a side illumination and inspects defects on the surface to be inspected of the printed circuit board by imaging combined light from both light sources with an imaging means such as a CCD camera. Further, the appearance inspection apparatus according to Conventional Example 2 inspects a substrate on which surface mount components are mounted, and the difference in spectral reflectance between different materials of the electrode portion (silver color) and the electrode portion (copper foil) of the substrate. Paying attention to, the configuration is such that the illumination wavelength is selected and illumination is performed.

【0004】[0004]

【発明が解決しようとする課題】上記従来例1に係る光
学式プリント基板検査装置または上記従来例2に係る外
観検査装置によれば、基板の欠陥を検査することができ
るので、何れもそれなりに有用であると考えられる。し
かしながら、上記従来例1に係る光学式プリント基板検
査装置の場合には、MID基板のように段差がある被検
査対象物に対して光の照射方向を設定するだけでは、こ
の被検査対象物の平坦部と、勾配部との欠陥を同時に検
査することができない。つまり、被検査対象物の平坦部
と、勾配部との欠陥を個別に検査しなければならないか
ら、平坦部と、勾配部とを持つ被検査対象物の外観検査
に長時間を要し、基板の外観検査作業能率の向上が望め
ないという解決すべき課題がある。
The optical printed circuit board inspecting apparatus according to the conventional example 1 or the appearance inspecting apparatus according to the conventional example 2 can inspect the board for defects. Considered useful. However, in the case of the optical printed circuit board inspecting apparatus according to the above-mentioned conventional example 1, if the irradiation direction of light is set only for an inspected object having a step like the MID board, the inspected object is inspected. It is not possible to inspect defects in the flat portion and the slope portion at the same time. In other words, since the defects of the flat portion and the sloped portion of the inspection target must be individually inspected, it takes a long time to visually inspect the inspection target having the flat portion and the sloped portion. However, there is a problem to be solved that the efficiency of visual inspection work cannot be expected.

【0005】また、上記従来例2に係る外観検査装置の
場合には、基板の電極部分(銀色)と電極部(銅箔)と
の異なる材料の分光反射率の差異を活用して、基板の外
観を検査する構成になるものであるから、MID基板の
ように同一材料で、しかも表面形状が相違する被検査対
象物の外観検査に対して不十分で、高精度の検査ができ
ないという解決すべき課題がある。
Further, in the case of the appearance inspection apparatus according to the conventional example 2, the difference in the spectral reflectance between different materials of the electrode portion (silver color) and the electrode portion (copper foil) of the substrate is utilized to make the substrate Since the configuration is such that the appearance is inspected, it is not possible to perform a high-precision inspection because it is insufficient for the appearance inspection of an object to be inspected that has the same material as the MID substrate and has a different surface shape. There are issues to be solved.

【0006】従って、本発明の目的は、立体成形された
MID基板の平坦部と勾配部との外観を同時に検査する
ことを可能ならしめる光学式基板外観検査装置を提供す
ることである。
SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an optical substrate visual inspection apparatus which enables simultaneous visual inspection of the flat portion and the inclined portion of a three-dimensionally molded MID substrate.

【0007】[0007]

【課題を解決するための手段】本発明は上記実情に鑑み
てなされたものであって、従って上記課題を解決するた
めに、本発明の請求項1に係る光学式基板外観検査装置
が採用した手段は、表面に平坦部と勾配部とを有する基
板に光を照射し、基板からの反射光を検出することによ
り基板のメッキ表面の欠陥を検出する光学式基板外観検
査装置において、前記基板に対して直交する方向から平
行光を照射する第1光照射手段と、前記基板に対して斜
め方向から光を照射する第2光照射手段と、前記基板の
基材部表面での分光反射率が低い波長帯の光を透過する
光学フィルタが介装され前記基板に対してこの基板の勾
配部からの反射光が前記第1光照射手段から照射される
平行光と平行にならない斜め方向から平行光を照射する
ために、前記基板の搬送方向と平行で前記第1光照射手
段の光軸と交わる仮想線に対して略対照的に配設され
た、少なくとも一対の第3光照射手段と、前記第1乃至
第3光照射手段からの光の照射により、前記基板に対し
て直交する方向に反射する反射光および散乱光を検出す
る撮像手段とを備えてなることを特徴とする。
The present invention has been made in view of the above circumstances, and therefore, in order to solve the above problems, the optical substrate visual inspection apparatus according to claim 1 of the present invention is adopted. The means irradiates a substrate having a flat portion and a slope portion on the surface with light, and detects the reflected light from the substrate to detect defects on the plated surface of the substrate, in the optical substrate visual inspection device, The first light irradiating means for irradiating parallel light from a direction orthogonal to the first light irradiating means, the second light irradiating means for irradiating the substrate with light obliquely, and the spectral reflectance on the surface of the substrate portion of the substrate are An optical filter that transmits light in a low wavelength band is interposed, and the reflected light from the gradient part of the substrate is not parallel to the parallel light emitted from the first light irradiating means with respect to the substrate. To irradiate the substrate From at least a pair of third light irradiating means and the first to third light irradiating means, which are arranged substantially in parallel with a virtual line intersecting the optical axis of the first light irradiating means in parallel with the transport direction. Image pickup means for detecting reflected light and scattered light reflected in a direction orthogonal to the substrate by the irradiation of the light.

【0008】本発明の請求項2に係る光学式外観検査装
置が採用した手段は、請求項1に記載の光学式基板検査
装置において、前記光学フィルタは、400nm〜50
0nmの波長の光を透過させる青色フィルタであること
を特徴とする。
According to a second aspect of the present invention, the means adopted by the optical appearance inspection apparatus is the optical substrate inspection apparatus according to the first aspect, wherein the optical filter is 400 nm to 50 nm.
It is characterized in that it is a blue filter that transmits light with a wavelength of 0 nm.

【0009】本発明の請求項3に係る光学式外観検査装
置が採用した手段は、表面に平坦部と勾配部とを有する
基板に光を照射し、基板からの反射光を検出することに
より基板のメッキ表面の欠陥を検出する光学式基板外観
検査装置において、前記基板に対して直交する方向から
平行光を照射する第1光照射手段と、前記基板に対して
斜め方向から光を照射する第2光照射手段と、前記基板
に対してこの基板の勾配部からの反射光が前記第1光照
射手段から照射される平行光と平行にならない斜め方向
から平行光を照射するために、前記基板の搬送方向と平
行で前記第1光照射手段の光軸と交わる仮想線に対して
略対照的に配設された、少なくとも一対の第3光照射手
段と、前記第1乃至第3光照射手段からの光の照射によ
り、前記基板からこの基板に対して直交する方向に反射
する反射光および乱反射光を赤色、緑色、青色に分離
し、赤色または/および青色画像から前記平坦部の欠陥
を検知し、緑色画像から前記勾配部の欠陥を検知する撮
像手段とを備えてなることを特徴とする。
The means adopted by the optical appearance inspection apparatus according to claim 3 of the present invention is to irradiate a substrate having a flat portion and a slope portion on its surface with light, and detect the reflected light from the substrate. In the optical substrate visual inspection apparatus for detecting defects on the plating surface, first light irradiating means for irradiating the substrate with parallel light from a direction orthogonal to the substrate, and first light irradiating means for irradiating the substrate with light in an oblique direction. In order to irradiate the two-light irradiation means and the parallel light from an oblique direction in which the reflected light from the gradient part of the substrate is not parallel to the parallel light emitted from the first light irradiation means, the substrate At least a pair of third light irradiating means, which are arranged substantially in parallel with the imaginary line intersecting the optical axis of the first light irradiating means in parallel with the transport direction of the first light irradiating means. From the substrate by irradiation with light from The reflected light and the diffusely reflected light reflected in the direction orthogonal to the substrate are separated into red, green, and blue, and the defect in the flat portion is detected from the red or / and blue image, and the defect in the gradient portion is detected from the green image. It is characterized by comprising an image pickup means for detecting.

【0010】[0010]

【発明の実施の形態】以下、本発明の実施の形態1に係
る光学式基板外観検査装置を、その模式的側面構成説明
図の図1(a)と、図1(a)のA−A線断面図の図1
(b)と、第2光照射手段から照射される照射光および
第3光照射手段から照射される照射光のCCDカメラ方
向への光散乱成分説明図の図2(a)と、金メッキの欠
陥状態を示す基板の平面図の図2(b)とを順次参照し
ながら説明する。
BEST MODE FOR CARRYING OUT THE INVENTION An optical substrate visual inspection apparatus according to a first embodiment of the present invention will be described below with reference to FIG. 1 (a), which is a schematic side view, and A--A in FIG. 1 (a). Figure 1 of the line cross section
2B of FIG. 2B, which is an explanatory view of light scattering components of the irradiation light emitted from the second light irradiation unit and the irradiation light emitted from the third light irradiation unit toward the CCD camera, and a defect of gold plating. The description will be made with reference to FIG. 2B which is a plan view of the substrate showing the state in order.

【0011】図1(a)に示す符号1は、搬送中のMI
D基板と呼ばれる立体成形されてなる基板10の平坦部
と勾配部との外観、つまり平坦部と勾配部との欠陥を検
査する光学式基板外観検査装置である。この光学式基板
外観検査装置1は、第1光照射手段2と、この第1光照
射手段2の下方に設けられる第2光照射手段3と、この
第2光照射手段3の下方に設けられる第3光照射手段4
と、前記第1光照射手段2の上方に設けられ、前記第1
光照射手段2、第2光照射手段3、および第3光照射手
段4からの光の照射により、基板10からこの基板10
に対して垂直方向に反射する反射光および乱反射光を検
出する撮像手段であるモノクロCCDカメラ5とから構
成されている。
Reference numeral 1 shown in FIG. 1 (a) indicates MI during conveyance.
This is an optical substrate appearance inspection device that inspects the appearance of flat portions and inclined portions of a three-dimensionally formed substrate 10 called a D substrate, that is, the defects of the flat portions and inclined portions. This optical substrate visual inspection device 1 is provided with a first light irradiation means 2, a second light irradiation means 3 provided below the first light irradiation means 2, and below the second light irradiation means 3. Third light irradiation means 4
And is provided above the first light irradiation means 2,
From the substrate 10 to the substrate 10 by the irradiation of light from the light irradiation means 2, the second light irradiation means 3, and the third light irradiation means 4.
It is composed of a monochrome CCD camera 5 which is an image pickup means for detecting the reflected light and the diffusely reflected light which are reflected in the vertical direction.

【0012】前記第1光照射手段2は、発散光を水平方
向に照射する第1光源21と、この第1光源21から照
射される発散光を平行光にするコリメータレンズ22
と、水平線に対して反射面が45度に配設され、前記コ
リメータレンズ22により平行にされた平行光を、基板
10に対して直交する方向、つまり垂直下方向に方向変
換するハーフミラー23とから構成されている。このよ
うに、コリメータレンズ22で発散光を平行光にするこ
とにより、基板10平坦部11の位置の如何にかかわら
ず同一の照明効果を得ることが可能になる。
The first light irradiating means 2 emits a divergent light in a horizontal direction, and a collimator lens 22 which makes the divergent light emitted from the first light source 21 parallel light.
And a half mirror 23 having a reflecting surface arranged at 45 degrees with respect to the horizontal line and converting the parallel light parallelized by the collimator lens 22 into a direction orthogonal to the substrate 10, that is, a vertically downward direction. It consists of In this way, by making the divergent light parallel light by the collimator lens 22, it is possible to obtain the same illumination effect regardless of the position of the flat portion 11 of the substrate 10.

【0013】前記第2光照射手段3は、ハーフミラー2
3と基板10との間に配設され、このハーフミラー23
により垂直下方向に方向変換された平行光を通過させる
通路を有する光源支持部材31と、基板10の搬送方向
の上流側、下流側に対応する前記光源支持部材31の端
部のそれぞれに設けられ、発散光を照射する第2光源3
2、32とから構成されている。
The second light irradiation means 3 is a half mirror 2.
This half mirror 23 is arranged between the substrate 3 and the substrate 10.
The light source support member 31 having a passage for passing the parallel light that has been vertically converted downward by the light source support member 31 and the end portions of the light source support member 31 corresponding to the upstream side and the downstream side in the transport direction of the substrate 10, respectively. , A second light source 3 for emitting divergent light
2 and 32.

【0014】前記第3光照射手段4は、第2光照射手段
3と基板10との間に一対設けられており、基板10の
搬送方向と平行で第1光照射手段2の光軸と交わる仮想
線に対して軸対称であり、基板10の上流側となる左右
位置に配設されている。そして、第3光照射手段4は、
基板10の基材部表面での分光反射率が低い波長帯の光
を透過させる光学フィルタ(図示省略)を介して、勾配
部12のそれぞれに向かって平行光を照射し得るように
構成されている。この場合、光学フィルタは、基材部の
材料に依存し、勾配部12への金メッキのはみだしによ
る短絡欠陥を検査することが目的であるため、透過波長
帯が400nm〜500nmの青色フィルタが採用され
る。
A pair of the third light irradiating means 4 is provided between the second light irradiating means 3 and the substrate 10, and the third light irradiating means 4 intersects with the optical axis of the first light irradiating means 2 in parallel with the conveying direction of the substrate 10. It is axially symmetric with respect to the imaginary line and is arranged at the left and right positions on the upstream side of the substrate 10. Then, the third light irradiation means 4
It is configured such that parallel light can be irradiated toward each of the gradient portions 12 via an optical filter (not shown) that transmits light in a wavelength band having a low spectral reflectance on the surface of the base material portion of the substrate 10. There is. In this case, since the optical filter depends on the material of the base material and the purpose is to inspect for short-circuit defects due to the protrusion of gold plating on the gradient portion 12, a blue filter having a transmission wavelength band of 400 nm to 500 nm is adopted. It

【0015】より詳しくは、これら一対の第3光照射手
段4、4から照射される照射光の光軸の向きは、斜め下
方、かつ図1(b)に示すように、光軸と基板10の中
心をとおる搬送方向と直交する横中心線とのなす角度が
20〜40度(光軸同士のなす角度は100〜140度
である。)になるように設定されており、斜め下向き方
向に光を照射する第3光源41と、この第3光源41か
ら照射された発散光を平行光にするコリメータレンズ4
2とから構成されている。コリメータレンズ42で照射
光を平行光にすることにより、勾配部12の位置の如何
にかかわらず同一の照明効果が得られる。
More specifically, the direction of the optical axis of the irradiation light emitted from the pair of third light irradiation means 4, 4 is obliquely downward, and as shown in FIG. It is set so that the angle formed by the horizontal center line orthogonal to the transport direction passing through the center of the axis is 20 to 40 degrees (the angle formed by the optical axes is 100 to 140 degrees), and the angle is downward. A third light source 41 for irradiating light and a collimator lens 4 for collimating divergent light emitted from the third light source 41
2 and. By making the irradiation light parallel light by the collimator lens 42, the same illumination effect can be obtained regardless of the position of the gradient portion 12.

【0016】第3光照射手段4、4を、基板10の勾配
部12からの正反射光が第1光照射手段2から照射され
る垂直な平行光と平行にならないような向きに配設した
のは、第1光照射手段2および第2光照射手段3から照
射され、基板10の平坦部11から垂直上方向に反射す
る反射光や乱反射光に悪影響を及ぼさないようにするた
めである。また、第3光照射手段4に光学フィルタとし
て、透過波長帯が400nm〜500nmの青色フィル
タを介装したのは、勾配部12で反射する垂直上向き方
向の乱反射光の光量を抑制し得ると共に、後述のとお
り、勾配部12における金メッキ短絡欠陥の検出に好都
合であるからである。
The third light irradiation means 4 and 4 are arranged in such an orientation that the specularly reflected light from the gradient portion 12 of the substrate 10 is not parallel to the vertical parallel light emitted from the first light irradiation means 2. This is to prevent adverse effects on the reflected light or the diffused reflected light that is emitted from the first light emitting means 2 and the second light emitting means 3 and is reflected vertically upward from the flat portion 11 of the substrate 10. Further, a blue filter having a transmission wavelength band of 400 nm to 500 nm is interposed as an optical filter in the third light irradiating means 4 in order to suppress the light amount of vertically upward diffused reflection light reflected by the gradient portion 12, and This is because, as will be described later, it is convenient for detecting a gold plating short circuit defect in the gradient portion 12.

【0017】そして、前記第1光照射手段2、第2光照
射手段3、および第3光照射手段4、4から照射光が基
板10に向かって照射されると共に、基板10により垂
直方向の上方に反射された反射光や乱反射光がハーフミ
ラー23を透過すると共に、このハーフミラー23の上
方に設けられてなるモノクロCCDカメラ5に入射する
ように構成されている。
Irradiation light is emitted from the first light irradiating means 2, the second light irradiating means 3, and the third light irradiating means 4, 4 toward the substrate 10, and the substrate 10 vertically upwards. The reflected light and the diffused reflected light are transmitted through the half mirror 23 and are incident on the monochrome CCD camera 5 provided above the half mirror 23.

【0018】以下、図2(a)を参照しながら、本実施
の形態1に係る光学式基板外観検査装置1の作用態様を
説明すると、第2光照射手段3の第2光源32、32か
ら斜め下方に照射され、基板10の正常な平坦部11に
反射してモノクロCCDカメラ5に入射する乱反射光、
および第3光照射手段4、4それぞれの第3光源41、
41から斜め下方に照射され、基板10の正常な勾配部
12に反射してモノクロCCDカメラ5に入射する乱反
射光は極く僅かである。
The operation mode of the optical substrate visual inspection apparatus 1 according to the first embodiment will be described below with reference to FIG. 2A. From the second light sources 32, 32 of the second light irradiation means 3, Diffuse reflected light that is emitted obliquely downward, is reflected by the normal flat portion 11 of the substrate 10 and is incident on the monochrome CCD camera 5,
And the third light source 41 of each of the third light irradiation means 4 and 4,
The diffusely reflected light that is emitted obliquely downward from 41, is reflected by the normal gradient portion 12 of the substrate 10 and is incident on the monochrome CCD camera 5, is extremely small.

【0019】従って、本実施の形態1に係る光学式基板
外観検査装置1によれば、第1光照射手段2から照射さ
れ、基板10の平坦部11に反射してモノクロCCDカ
メラ5に入射する反射光、および第2光照射手段3から
照射され基板10から反射してきた乱反射光の光濃度
は、平坦部11の正常部から反射する場合と、欠陥部か
ら反射する場合とによって相違する。つまり、欠陥部か
らの反射光濃度は正常部の平均反射光濃度に比較して高
濃度で明るいか、低濃度で暗いかの何れか一方であるか
ら、反射光濃度差によって平坦部11の金メッキ欠け、
傷、メッキ不良等の欠陥の有無を検査することができ
る。
Therefore, according to the optical substrate visual inspection apparatus 1 according to the first embodiment, the light is emitted from the first light emitting means 2, is reflected by the flat portion 11 of the substrate 10 and is incident on the monochrome CCD camera 5. The light densities of the reflected light and the diffusely reflected light emitted from the second light irradiating means 3 and reflected from the substrate 10 differ depending on whether the light is reflected from the normal portion of the flat portion 11 or from the defective portion. That is, the density of the reflected light from the defective portion is either brighter at a higher density or darker at a lower density as compared with the average reflected light density of the normal portion. Lack,
It is possible to inspect for defects such as scratches and defective plating.

【0020】また、基板10の勾配部12の場合には、
主として短絡欠陥の有無が検査されるが、第3光照射手
段4から照射され、基板10から反射する散乱光によっ
て勾配部12の短絡欠陥14を検することができる。こ
の場合には、勾配部12の基材部は、散乱光がモノクロ
CCDカメラに入射するため、明部となり、また金メッ
キ部は正反射によりモノクロCCDに光が入射しないた
め、暗部となる。このため、図2(b)に示すように、
基材部13に金メッキが突き出た短絡欠陥14が暗部と
して検出される。そして、第3光照射手段4の照射光の
照射方向と光学フィルタとにより、基板10からモノク
ロCCDカメラ5に入射する入射光の光量が抑制される
から、基板10の平坦部11と勾配部12との欠陥を同
時に検査することができる。
Further, in the case of the sloped portion 12 of the substrate 10,
Although the presence or absence of the short-circuit defect is mainly inspected, the short-circuit defect 14 of the gradient portion 12 can be detected by the scattered light emitted from the third light irradiation unit 4 and reflected from the substrate 10. In this case, the base material portion of the gradient portion 12 becomes a bright portion because scattered light enters the monochrome CCD camera, and the gold plating portion becomes a dark portion because light does not enter the monochrome CCD due to specular reflection. Therefore, as shown in FIG.
The short-circuit defect 14 in which the gold plating is projected on the base material portion 13 is detected as a dark portion. The irradiation direction of the irradiation light of the third light irradiation unit 4 and the optical filter suppress the light amount of the incident light incident on the monochrome CCD camera 5 from the substrate 10, so that the flat portion 11 and the gradient portion 12 of the substrate 10 are suppressed. And defects can be inspected at the same time.

【0021】従って、本実施の形態1に係る光学式基板
外観検査装置1によれば、従来例1に比較して逼かに短
時間のうちに基板10の外観検査作業を終了することが
できるから、基板10の生産性の向上に大いに寄与する
ことができる。また、従来例2のように、異なる材料の
分光反射率の差異を活用して基板の外観を検査するもの
でないから、MID基板のように同一材料で、表面形状
が相違する被検査対象物の外観検査に対して大いに寄与
することができる。
Therefore, according to the optical substrate appearance inspection apparatus 1 according to the first embodiment, the appearance inspection work of the substrate 10 can be completed within a relatively short time as compared with the conventional example 1. Therefore, it can greatly contribute to the improvement of the productivity of the substrate 10. In addition, unlike the conventional example 2, since the appearance of the substrate is not inspected by utilizing the difference in the spectral reflectance of different materials, an object to be inspected having the same material but different surface shape, such as the MID substrate. It can greatly contribute to visual inspection.

【0022】次に、本発明の実施の形態2に係る光学式
基板外観検査装置を説明する。但し、本実施の形態2が
上記実施の形態1と相違するところは、第3光照射手段
に光学フィルタが介装されていないことと、CCDカメ
ラに付与されてなる機能の相違にあり、これ以外は全く
同構成であるから、CCDカメラに付与された機能に係
る説明に止める。
Next, an optical substrate visual inspection apparatus according to the second embodiment of the present invention will be described. However, the difference between the second embodiment and the first embodiment is that an optical filter is not provided in the third light irradiating means and the function provided to the CCD camera is different. Other than that, the configuration is exactly the same, so the explanation will be limited to the functions given to the CCD camera.

【0023】前記CCDカメラは、前記第1乃至第3光
照射手段から照射され、基板により反射される反射光の
うち、CCDカメラに入射した光を赤色、緑色、青色に
分離する光学フィルタを備えた、市販のカラーCCDカ
メラである。そして、撮像された赤色画像、緑色画像、
青色画像のうち、赤色画像または/および青色画像から
基板の平坦部の欠陥を検知する一方、緑色画像から基板
の勾配部の欠陥を検知するようにしたものである。
The CCD camera is provided with an optical filter for separating the light incident on the CCD camera among the reflected light emitted from the first to third light emitting means and reflected by the substrate into red, green and blue. It is also a commercially available color CCD camera. Then, the captured red image, green image,
Among the blue images, the red image and / or the blue image detects defects in the flat portion of the substrate, while the green image detects defects in the inclined portion of the substrate.

【0024】つまり、白色光による撮像画像をもとに、
第1、第2光照射手段の画像をR波長、B波長成分から
作成することにより基板の平坦部の欠陥を検知する一
方、第3光照射手段の画像をG波長成分から作成するこ
とにより基板の勾配部の欠陥を検知するもので、基板の
平坦部と勾配部の欠陥を同時に検出することができるか
ら、本実施の形態2は上記実施の形態1と同効である。
但し、本実施の形態2にあっては、上記のとおり、第3
光照射手段に光学フィルタが介装されていない。そのた
め、光学式基板外観検査装置の光学系の簡素化が可能に
なるから、光学式基板外観検査装置のコンパクト化に寄
与することができる。
That is, based on the captured image of white light,
The image of the first and second light irradiating means is created from the R wavelength and B wavelength components to detect defects in the flat portion of the substrate, while the image of the third light irradiating means is created from the G wavelength component. The defect of the gradient part is detected, and the defects of the flat part and the gradient part of the substrate can be detected at the same time. Therefore, the second embodiment has the same effect as the first embodiment.
However, in the second embodiment, as described above, the third
No optical filter is interposed in the light irradiation means. Therefore, the optical system of the optical substrate visual inspection device can be simplified, which can contribute to the compactness of the optical substrate visual inspection device.

【0025】[0025]

【発明の効果】以上詳述したように、本発明の請求項1
または2に係る光学式基板外観検査装置によれば、立体
成形されたMID基板の平坦部と勾配部との欠陥を同時
に検査することができる。従って、従来例1に比較して
逼かに短時間のうちに検査作業を終了することができる
から、基板の生産性の向上に大いに寄与することがで
き、また従来例2のように、異なる材料の分光反射率の
差異を活用して基板の外観を検査するものでないから、
MID基板のように同一材料で、表面形状が相違する被
検査対象物の外観検査に対して大いに寄与することがで
きるという優れた効果がある。
As described in detail above, the first aspect of the present invention
According to the optical substrate visual inspection apparatus of the second or second aspect, it is possible to simultaneously inspect for defects in the flat portion and the gradient portion of the three-dimensionally molded MID substrate. Therefore, the inspection work can be completed within a relatively short time as compared with the conventional example 1, which can greatly contribute to the improvement of the productivity of the substrate, and unlike the conventional example 2, it is different. Because it does not inspect the appearance of the substrate by utilizing the difference in the spectral reflectance of the material,
There is an excellent effect that it can greatly contribute to the appearance inspection of the inspection object having the different surface shape with the same material such as the MID substrate.

【0026】また、本発明の請求項3に係る光学式基板
外観検査装置によれば、第3光照射手段に光学フィルタ
を介装する必要がなく、光学式基板外観検査装置の光学
系の簡素化が可能になるから、光学式基板外観検査装置
のコンパクト化に寄与することができる。
Further, according to the optical substrate visual inspection device of the third aspect of the present invention, it is not necessary to interpose an optical filter in the third light irradiation means, and the optical system of the optical substrate visual inspection device is simple. Since it can be realized, it can contribute to downsizing of the optical substrate visual inspection apparatus.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施の形態1に係り、図1(a)は光
学式基板外観検査装置の模式的側面構成説明図、図1
(b)は図1(a)のA−A線断面図である。
1A and 1B relate to a first embodiment of the present invention, and FIG. 1A is a schematic side surface configuration explanatory diagram of an optical substrate visual inspection apparatus;
1B is a sectional view taken along the line AA of FIG.

【図2】本発明の実施の形態1に係り、図2(a)は第
2光照射手段から照射される照射光および第3光照射手
段から照射される照射光のCCDカメラ方向への光散乱
成分説明図、図2(b)は金メッキの欠陥状態を示す基
板の平面図である。
FIG. 2 relates to the first embodiment of the present invention, and FIG. 2 (a) is a diagram showing the irradiation light emitted from the second light irradiation means and the irradiation light emitted from the third light irradiation means toward the CCD camera. FIG. 2B is a plan view of the substrate showing a defect state of gold plating.

【符号の説明】[Explanation of symbols]

1 光学式基板外観検査装置 2 第1光照射手段 3 第2光照射手段 4 第3光照射手段 5 CCDカメラ 10 基板 11 平坦部 12 勾配部 13 基材部 14 短絡欠陥 21 第1光源 22 コリメータレンズ 23 ハーフミラー 31 光源支持部材 32 第2光源 41 第3光源 42 コリメーターレンズ 1 Optical substrate visual inspection device 2 First light irradiation means 3 Second light irradiation means 4 Third light irradiation means 5 CCD camera 10 substrates 11 Flat part 12 slope 13 Base material 14 Short circuit defect 21 First light source 22 Collimator lens 23 Half mirror 31 Light source support member 32 Second light source 41 Third light source 42 Collimator lens

フロントページの続き (72)発明者 岡本 陽 兵庫県神戸市西区高塚台1丁目5番5号 株式会社神戸製鋼所神戸総合技術研究所内 Fターム(参考) 2F065 AA56 BB02 CC01 DD06 FF04 HH03 HH14 JJ03 JJ26 LL21 UU01 2G051 AA65 AB20 BA01 BA08 BB01 BB07 CA04 CA06 CB01 CB05Continued front page    (72) Inventor Yo Okamoto             1-5-5 Takatsukadai, Nishi-ku, Kobe City, Hyogo Prefecture             Kobe Steel Co., Ltd.Kobe Research Institute F term (reference) 2F065 AA56 BB02 CC01 DD06 FF04                       HH03 HH14 JJ03 JJ26 LL21                       UU01                 2G051 AA65 AB20 BA01 BA08 BB01                       BB07 CA04 CA06 CB01 CB05

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 表面に平坦部と勾配部とを有する基板に
光を照射し、基板からの反射光を検出することにより基
板のメッキ表面の欠陥を検出する光学式基板外観検査装
置において、前記基板に対して直交する方向から平行光
を照射する第1光照射手段と、前記基板に対して斜め方
向から光を照射する第2光照射手段と、前記基板の基材
部表面での分光反射率が低い波長帯の光を透過させる光
学フィルタが介装され、前記基板に対してこの基板の勾
配部からの反射光が前記第1光照射手段から照射される
平行光と平行にならない斜め方向から平行光を照射する
ために、前記基板の搬送方向と平行で前記第1光照射手
段の光軸と交わる仮想線に対して略対照的に配設され
た、少なくとも一対の第3光照射手段と、前記第1乃至
第3光照射手段からの光の照射により、前記基板に対し
て直交する方向に反射する反射光および散乱光を検出す
る撮像手段とを備えてなることを特徴とする光学式基板
外観検査装置。
1. An optical substrate visual inspection apparatus for detecting a defect on a plated surface of a substrate by irradiating a substrate having a flat portion and a sloped portion with light and detecting reflected light from the substrate, First light irradiating means for irradiating the substrate with parallel light from a direction orthogonal to the substrate, second light irradiating means for irradiating the substrate with light in an oblique direction, and spectral reflection on the surface of the substrate portion of the substrate. An oblique direction in which an optical filter for transmitting light of a wavelength band having a low rate is interposed, and the reflected light from the gradient part of the substrate is not parallel to the parallel light emitted from the first light irradiating means with respect to the substrate. For irradiating parallel light from the at least one pair of third light irradiating means, which are arranged substantially in parallel with a virtual line intersecting the optical axis of the first light irradiating means in parallel with the transport direction of the substrate. From the first to third light irradiation means An optical substrate visual inspection apparatus comprising: an image pickup unit that detects reflected light and scattered light that are reflected in a direction orthogonal to the substrate when irradiated with light.
【請求項2】 前記光学フィルタは、400nm〜50
0nmの波長の光を透過させる青色フィルタであること
を特徴とする請求項1に記載の光学式基板検査装置。
2. The optical filter is 400 nm to 50 nm.
The optical substrate inspection device according to claim 1, wherein the optical substrate inspection device is a blue filter that transmits light having a wavelength of 0 nm.
【請求項3】 表面に平坦部と勾配部とを有する基板に
光を照射し、基板からの反射光を検出することにより基
板のメッキ表面の欠陥を検出する光学式基板外観検査装
置において、前記基板に対して直交する方向から平行光
を照射する第1光照射手段と、前記基板に対して斜め方
向から光を照射する第2光照射手段と、前記基板に対し
て、この基板の勾配部からの反射光が前記第1光照射手
段から照射される平行光と平行にならない斜め方向から
平行光を照射するために、前記基板の搬送方向と平行で
前記第1光照射手段の光軸と交わる仮想線に対して略対
照的に配設された、少なくとも一対の第3光照射手段
と、前記第1乃至第3光照射手段からの光の照射によ
り、前記基板からこの基板に対して直交する方向に反射
する反射光および乱反射光を赤色、緑色、青色に分離
し、赤色または/および青色画像から前記平坦部の欠陥
を検知し、緑色画像から前記勾配部の欠陥を検知する撮
像手段とを備えてなることを特徴とする光学式基板外観
検査装置。
3. An optical substrate visual inspection apparatus for detecting a defect on a plating surface of a substrate by irradiating a substrate having a flat portion and a gradient portion on the surface with light and detecting reflected light from the substrate, First light irradiating means for irradiating the substrate with parallel light from a direction orthogonal to the substrate, second light irradiating means for irradiating the substrate with light in an oblique direction, and a gradient part of the substrate with respect to the substrate. In order to irradiate the parallel light from an oblique direction in which the reflected light from is not parallel to the parallel light emitted from the first light irradiating means, an optical axis of the first light irradiating means is parallel to the transport direction of the substrate. At least one pair of third light irradiation means, which are arranged substantially symmetrically with respect to the intersecting virtual line, and the light emitted from the first to third light irradiation means, are orthogonal to the substrate from the substrate. Reflected light and diffuse reflection It is characterized by comprising an image pickup means for separating light into red, green and blue, detecting a defect in the flat portion from a red or / and blue image, and detecting a defect in the gradient portion from a green image. Optical substrate visual inspection device.
JP2002037792A 2002-02-15 2002-02-15 Optical substrate visual inspection apparatus Abandoned JP2003240524A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002037792A JP2003240524A (en) 2002-02-15 2002-02-15 Optical substrate visual inspection apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002037792A JP2003240524A (en) 2002-02-15 2002-02-15 Optical substrate visual inspection apparatus

Publications (1)

Publication Number Publication Date
JP2003240524A true JP2003240524A (en) 2003-08-27

Family

ID=27779280

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002037792A Abandoned JP2003240524A (en) 2002-02-15 2002-02-15 Optical substrate visual inspection apparatus

Country Status (1)

Country Link
JP (1) JP2003240524A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7441469B2 (en) 2019-05-31 2024-03-01 株式会社昭和電気研究所 Visual inspection equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7441469B2 (en) 2019-05-31 2024-03-01 株式会社昭和電気研究所 Visual inspection equipment

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