JP2003234569A - Preheater for dip unit and preheating unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a preheater for a DIP unit in which possibility of bringing about a damage or a functional decrease in a surface mounting type electronic component is reduced to perform the partial DIP on a board to be mounted with the surface mounting type component and an electronic component with legs in mixture and without bringing about a complication of a work. <P>SOLUTION: The preheater 30 for the DIP unit is used for the DIP unit for partially performing the DIP to solder-clamp the electronic component with the legs at a predetermined position of the board 10 in which the surface mounting type electronic component is mounted. The preheater 30 warms a position to be at least partly performed by the DIP. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a preheater and a preheater for a DIP device, and in particular, after flux is applied to a substrate by a flux applicator, molten solder is supplied only to a predetermined portion of the substrate to form a foot. DIP used in a fixed DIP device for mounting electronic parts
The present invention relates to an apparatus preheater and a preheater that can be attached to a solder coating apparatus.

[0002]

2. Description of the Related Art Conventionally, when mounting electronic parts on a board,
A through hole that penetrates the board in the thickness direction is provided corresponding to the land formed on the surface of the board in advance, and the lead terminal protruding from the electronic component is inserted into the through hole from the back surface of the board to connect the land and the lead terminal. Was fixed by soldering (conventional example 1). However, Conventional Example 1 is an electronic component having a lead terminal (hereinafter referred to as a legged electronic component).
In addition to complicating the mounting process, the soldering accuracy of the lead terminals adjacent to each other is apt to cause a short circuit due to the union of the solders of the adjacent lead terminals, or poor conduction due to insufficient adhesion of the solder to the land and the lead terminals. Has the disadvantage of being low.

Therefore, in recent years, thermosetting cream solder is applied in advance to one or both of the terminal portion of the surface mount type electronic component and the land of the board, and the surface mount type solder is applied by the adhesive force of the cream solder. A method is widely used in which the electronic component is temporarily fixed to the substrate and the cream solder is cured by a heating furnace to mount the surface-mounted electronic component on the substrate (conventional example 2). According to the second conventional example, the mounting process of the electronic component on the substrate can be simplified and good soldering accuracy can be obtained.

By the way, at present, there are legged electronic components such as connectors in which lead terminals protrude from the main body. Therefore, surface mounting type electronic components and legged electronic components are mixed on the substrate. I have no choice but to implement it. in this case,
As mentioned above, the surface mount type electronic components are mounted on the board at the predetermined places in advance, the lead terminals of the electronic components with legs are inserted into the through holes from the back surface of the substrate, and then the electronic components with legs are applied by the flux coater. A part where flux is applied only to the mounting part, and then the operator removes the substrate from the flux applying machine and fixes it to the DIP device, and then supplies the molten solder only to the part where the legged electronic component is mounted by the DIP device. DIP is performed so that surface-mounted electronic components and legged electronic components are mixedly mounted on the substrate (conventional example 3).

Here, the flux applicator and the DIP device have a cylindrical cover portion arranged corresponding to a place where the legged electronic component is mounted. In these flux applicators and DIP devices, the board is placed close to the tip of the cover so that the open ends of the lead terminals are covered, and flux or molten solder is supplied from the tip of the cover to supply a specific area. Only flux coating and partial DIP
Is supposed to do. At this time, the flux and the melted solder leak from the tip of the cover part, and are slightly scattered around the substrate.

A flux applicator such as these and D
In the IP device, the shape and size of the board and the position and the number of the parts where the electronic components with legs are mounted are changed by changing the position and the number of the cover part. In addition, in order to distinguish these flux applicator and DIP device from the line type flux applicator and the line type DIP device which are arranged along the upstream side to the downstream side of the manufacturing process of the substrate, the fixed type flux applicator and It is sometimes called a fixed DIP device.

[0007]

By the way, in recent years, as electronic devices have become smaller and thinner, various electronic parts have been densely mounted on a substrate. However, in the conventional example 3, when various electronic components are densely mounted in the partial DIP process by the DIP device, the molten solder scattered from the tip of the cover portion comes into contact with the adjacent surface-mounted electronic component, which causes The hardened cream solder may soften again and the surface mount electronic component may drop off the board, or the surface mount electronic component may be defective in soldering. In order to avoid this problem, it is conceivable to downsize the cover part, but it is necessary to cover only the lead terminal of the target legged electronic component without contacting such a cover part with the surface mount type electronic component. Is difficult to position.

For this reason, in recent years, a cover portion has been formed in advance so as to cover even a surface mounting type electronic component adjacent to a desired electronic component with legs, and the electronic component with legs and the surface mounting adjacent thereto. A method has been proposed in which partial electronic dipping is simultaneously performed with the formula electronic component (conventional example 4). However, in Conventional Example 4, the surface-mounting electronic component adjacent to the legged electronic component is exposed to the molten high-temperature solder, which may cause the surface-mounting electronic component to be damaged or deteriorate in function. .

In order to avoid this problem, a method of heating the substrate to a predetermined temperature by a preheating device arranged between the flux applicator and the DIP device can be considered. However, an operator moves the substrate from the preheating device to the DIP device. Therefore, there is a problem that the work becomes complicated because it is necessary to move the work to

The present invention has been made to solve the above-mentioned problems, and an object thereof is to provide a partial DIP on a board on which surface-mounted electronic components and legged electronic components are mixedly mounted.
In doing so, it is an object of the present invention to provide a preheater and a preheater for a DIP device that are less likely to be damaged or have a reduced function in the surface-mounted electronic component and do not complicate the work.

[0011]

In order to achieve the above-mentioned object, a preheater for a DIP device according to the present invention comprises:
As described above, in order to solder the legged electronic component to a predetermined position of the board on which the surface mount type electronic component is mounted, in correspondence with the mounting position of the legged electronic component on the flux-coated surface of the substrate. Having a cylindrical cover portion arranged, while penetrating a lead terminal of the legged electronic component into a through hole of the substrate, an open end portion of the lead terminal,
The substrate is disposed close to the tip of the cover so that the mounting electronic component adjacent to the legged electronic component is covered, and molten D solder is supplied from the cover to form the partial DIP on the substrate. A preheater for a DIP device used for a DIP device to be performed, characterized in that at least a portion where the partial DIP is performed can be heated.

Here, as a means for heating the portion where the partial DIP is performed, for example, warm air may be blown from a predetermined heat source to one side or both sides of the substrate, and an arbitrary heat source such as a nichrome wire may be fed to the substrate. May be faced on one side or both sides. When the hot air is blown to one side or both sides of the substrate, the hot air may be blown intensively to the place where the partial DIP is performed by a duct or the like. In addition, as the heating temperature, a temperature at which the mounted electronic component is not damaged or its function is not deteriorated even when the molten solder comes into contact with the soldering liquid may be appropriately selected.

In the preheater for a DIP device constructed as described above, at least a portion of the substrate where the DIP is performed can be heated. Therefore, the heating temperature is appropriately selected according to the melting temperature of the solder. , Partial DIP
If the area where the partial DIP is performed is heated prior to the above, even if the surface-mounted electronic component adjacent to the legged electronic component is exposed to the molten high temperature solder, the surface-mounted electronic component is damaged or its function deteriorates. It is possible to avoid the conventional problem that occurs.
In addition, in this DIP device preheater,
Since it is used in the apparatus, it is possible to avoid the problem that the work becomes complicated as in the case of separately adopting the preheating apparatus. By these, the above-mentioned object is achieved.

Further, in the DIP device preheater of the present invention, as described in claim 2, since it is possible to heat the entire one surface of the substrate, the heating is not concentrated on a specific portion, and thus the partial heating is performed. The flatness of the substrate is less likely to be lost as compared with the case where only the portion where DIP is performed is heated.

Further, as described in claim 3, the preheater for a DIP device of the present invention is characterized in that at least the side of the substrate on which the flux is applied can be heated. Here, as a structure for heating the flux coated surface side of the substrate, for example, a frame body that circulates so as to face each end surface of the substrate, and a duct that can blow hot air inside the frame body are provided. A structure in which the substrate is arranged so as to close the opening of the frame can be exemplified. Such a DIP
In the device preheater, since the side of the substrate on which the flux is applied can be heated, the surface-mounted electronic component adjacent to the legged electronic component is reliably heated.

The DIP device preheater of the present invention is characterized in that, as described in claim 4, both sides of the substrate can be heated. Here, as a structure for heating both sides of the substrate, for example, a frame body that circulates so as to face each end surface of the substrate, a lid portion that closes the opening of the frame body, and a warming inside the frame body. A structure that includes a duct that can blow air and that accommodates and arranges the substrate inside the frame can be exemplified. In such a DIP device preheater,
Since both sides of the board can be heated, the surface-mounted electronic component adjacent to the legged electronic component is reliably heated. Therefore,
Good heating efficiency can be obtained, and the DIP process can be shortened.

Further, as described in claim 5, the preheater for a DIP device of the present invention is supplied from a heat source into a frame body that circulates so as to face each end face of the substrate, and inside the frame body. It is characterized by having a blower port capable of blowing warm air and a control unit for controlling the temperature and blowing time of the warm air. In the DIP device preheater configured as described above, since hot air whose temperature and time are controlled by the control unit is blown into the inside of the frame, the substrate may be arranged so as to close the opening of the frame. Alternatively, if the substrate is housed inside the frame and the frame is closed, it is possible to uniformly heat the entire area of both sides of the substrate, and it is possible to shorten the heating time because it is difficult for hot air to leak to the outside of the frame. The DIP process can be further shortened.

On the other hand, the preheating device of the present invention is, as described in claim 6, a substrate preheating device attachable to a solder coating device, the frame body surrounding a side surface of the solder coating device, and the solder. Heat is emitted to heat the substrate placed on the coating device, and a heat generation unit for generating heat connected to the heating unit and a heating unit attached to the frame. And a control unit that controls the heating time and the heating temperature.

Further, in the preheating device of the present invention, as described in claim 7, the heating unit heats the space between the substrate and the solder coating device. Further, in the preheating device of the present invention, as described in claim 8, the control unit measures a setting switch for setting the heating time and the heating temperature, and the heating temperature. It is characterized by having a timer of.

In the preheater of the present invention, the heat generating section has a blower fan for discharging warm air, and the warming section has a duct for discharging the warm air to the substrate. A moving mechanism for moving the blower port of the duct in the horizontal direction according to the size of the substrate.

Further, as described in claim 10, the preheating device of the present invention is provided with a lid portion which forms a space including the substrate together with the frame on the upper surface of the solder coating device, and the lid portion is opened and closed. The feature is that it is provided.

[0022]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a diagram showing a first embodiment to which the present invention is applied, FIG. 2 is a diagram viewed from an arrow A in FIG.
FIG. 3 is a view showing a second embodiment to which the present invention is applied, and FIG. 4 is a view on arrow B in FIG.

As shown in FIG. 1, in the first embodiment of the present invention, in order to densely mount the surface mount type electronic components and the legged electronic components on the substrate 10 having a flat rectangular shape in a dense manner, the process upstream side. A fixed flux applicator 20 is arranged in the above, and a fixed DIP device 30 is arranged in the downstream side of the process. The board 10 has surface-mounted electronic components mounted in advance at predetermined positions on the board 10, and then the lead terminals of the legged electronic parts are inserted into the through holes from the back surface of the board 10, and then the operator applies the flux coating machine. Fixed at 20.

The flux applicator 20 has a box-shaped main body 21 for storing flux, a plate-shaped nozzle mask 22 arranged on the upper surface of the main body 21 to cover the liquid surface of the flux, and formed at a predetermined position on the nozzle mask 22. It has a cylindrical cover portion 23 provided upright corresponding to the formed through-hole, and a substrate supporting means (not shown). The cover portion 23 is arranged in advance corresponding to a place on the board 10 where the legged electronic component is mounted. Further, the substrate supporting means is provided with support pins which are inserted into the supporting holes provided at the corners of the flat surface of the substrate 10 so as to cover each cover portion 23.
The substrate 10 is supported with the flux-applied surface 10A (lower surface in FIG. 1) of the substrate 10 slightly separated from the open end surface of the substrate 10.

In the flux applicator 20 as described above, the control section 26 including the setting switch 24 and the timer 25 supplies the flux from the respective cover sections 23 toward the flux application surface 10A of the substrate 10 for a certain period of time. Flux is applied only to the parts on which the electronic components with legs are mounted on the flux applying surface 10A of 10. At this time, since the flux applying surface 10A of the substrate 10 is slightly separated from the open end surface of each cover portion 23, the substrate supporting means supports the substrate 10,
Flux is slightly scattered from the open end surface of each cover portion 23.

Next, the operator applies the substrate 10 to the flux coating machine.
Remove from 20 and fix to DIP device 30, then DI
The P device 30 performs the part DIP for supplying the melted solder only to the place where the legged electronic component is mounted. DIP device 30
Is a box-shaped main body 31 for storing the molten solder, a plate-shaped nozzle mask 32 arranged on the upper surface of the main body 31 to cover the liquid surface of the molten solder flux, and formed at a predetermined position in the nozzle mask 32. It has a cylindrical cover portion 33 provided upright corresponding to the through hole, and a substrate supporting means (not shown).

The cover portion 33 is arranged in advance corresponding to the portion of the board 10 where the legged electronic components are mounted, and the basic structure is substantially the same as that of the cover portion 23 of the flux applicator 20. The opening dimension is such that the surface-mounted electronic components adjacent to the electronic components with legs and the electronic components with legs are collectively covered. Further, the substrate supporting means also has a structure similar to that of the substrate supporting means in the flux applicator 20, and the flux applying surface is attached to the open end surface of each cover portion 33.
The substrate 10 is supported with 10A (the lower surface in FIG. 1) slightly separated.

The DIP device 30 as described above includes the respective cover portions 33.
The melted solder is supplied to the flux coating surface 10A from the above for a certain period of time, whereby the flux coating surface 10A of the substrate 10 is supplied.
Partial DIP is performed collectively for the legged electronic components in A and the surface-mounted electronic components adjacent to the legged electronic components.

Here, the DIP device 30 is provided with a DIP device preheater 40 constructed according to the present invention. As shown in FIG. 2, the preheater 40 for the DIP device
Is a frame body 41 that circulates so as to face each end surface of the substrate 10.
And a prismatic duct 42 which is a heating portion arranged so as to circulate along the inner surface of the frame 41, a hot / cold air generating means 43 adjacent to the DIP device 30, and a hot / cold air generating means 43. A connection pipe 44 that sends hot and cold air supplied from the duct 42 to the duct 42, a blower port 45 that is provided in each duct 42 to blow hot and cold air inside the frame 41, and slides that are provided above each duct 42. A plate 46 and a control unit 47 that controls the temperature of hot and cold air and the blowing time are provided.

The hot and cold air generating means 43 has a heat source such as a nichrome wire, a refrigerant, and a blower fan inside, and the temperature of the hot and cold air supplied to each duct 42 through the connecting pipe 44,
The control unit 47 controls the blowing speed, the blowing start, the blowing time, and the blowing stop. The control unit 47 includes a setting switch 34 and a timer 35 used when supplying the molten solder.
Also control. The setting switch 34 can set the heating time and the heating temperature, and the timer 35 can measure the heating temperature.

Each blower port 45 is provided so as to blow warm and cool air from the central portion of each side of the substrate 10 along the flux coating surface 10A. Therefore, the hot and cold air blown from the air blow ports 45 joins at the center of the plane of the flux application surface 10A of the substrate 10 and thereby the flux application surface 10A.
Is uniformly heated to a predetermined temperature.

The slide plate 46 is in the form of a strip having a predetermined width and is supported along the longitudinal direction of each duct 42. These slide plates 46 are provided on the upper surface 10B of the substrate 10 (see FIG.
It is possible to move individually along the direction orthogonal to the longitudinal direction of each duct 42 without contacting each of the ducts 42). Therefore, each slide plate 46 can be moved by appropriately moving the substrate 10 after the substrate 10 is supported by the substrate supporting means.
The gap between 10 and each duct 42 can be closed.

In such a DIP device 30, after the substrate 10 is supported by the substrate supporting means with the flux coating surface 10A slightly separated from the open end surface of each cover portion 33, each slide plate 46 is appropriately moved. Let the substrate 10 and each duct 42
After closing the gap between them, warm air of a predetermined temperature is blown inside the frame body 41 that constitutes the DIP device preheater 40. Therefore, the space between the substrate 10 and the DIP device 30 is heated. At this time, the gaps between the board 10 and the ducts 42 are closed by the slide plates 46, so that the board 10 and the ducts are closed.
The warm air does not leak from the gap between the 42, so that the inside of the frame 41 reaches the desired temperature in a short time.

The preheater 40 for the DIP device may be provided with a moving mechanism for moving the blower ports 45 in the horizontal direction according to the size of the substrate 10. Further, since the blower ports 45 are provided so that the warm air merges from the ducts 42 toward the central portion of the flux application surface 10A,
The flux application surface 10A side of the substrate 10 is uniformly heated over the entire area in a short time.

The hot air inside the frame 41 causes a portion D.
Continue blowing air until the surface mounting type electronic component at the location where IP is heated to a predetermined temperature, then stop blowing hot air and supply the molten solder from the cover portion 23 toward the flux coating surface 10A. The partial DIP is performed by. On this occasion,
Since the surface-mounted electronic components in the area where the partial DIP is performed have risen to a predetermined temperature, even if the surface-mounted electronic components are exposed to the molten high-temperature solder, the surface-mounted electronic components will be damaged or deteriorate in function. There is no danger of this occurring.

Next, the control unit 47 cools the substrate 10 by blowing cold air of a predetermined temperature to the inside of the frame 41, and then each slide plate 46 is moved so as to return to the initial position. After that, the worker removes the substrate 10 from the DIP device 30, and obtains the substrate 10 on which the surface-mounted electronic components and the legged electronic components are mixed and mounted.

According to the first embodiment described above, DI
Since the P device preheater 40 can heat at least a portion of the substrate 10 where the partial DIP is performed, the heating temperature is appropriately selected according to the melting temperature of the solder.
By heating the portion where the partial DIP is performed prior to the partial DIP, even if the surface-mounted electronic component adjacent to the legged electronic component is exposed to the high-temperature molten solder, the surface-mounted electronic component may be damaged or damaged. There is little risk of functional deterioration.

Particularly, according to the preheater 40 for the DIP device, since it is used by being attached to the DIP device 30, the work of attaching and detaching the substrate 10 to and from the device by an operator is increased as in the case where a preheating device is separately adopted. Does not cause the problem of being complicated.

Further, according to the preheater 40 for the DIP device, since it is possible to heat the entire one side of the substrate 10, the substrate 10
Part of DI is not heated because it is concentrated
The flatness of the substrate 10 is less likely to be lost as compared with the case where only the portion where P is performed is heated.

In particular, the preheater 40 for the DIP device described above
According to this, at least the side of the substrate 10 on which the flux is applied 10A is heated, so that the surface-mounted electronic component at the location where the partial DIP is performed can be heated reliably and in a short time.

Moreover, according to the preheater 40 for the DIP device of the first embodiment, the hot air whose temperature, time and the like are controlled by the control unit is blown into the inside of the frame body 41 and the frame body 41.
Due to the substrate 10 closing the opening, the warm air is unlikely to leak to the outside of the frame body 41, so that the heating time can be shortened and the DIP process can be further shortened.

A second embodiment of the present invention is shown in FIGS. 3 and 4. In addition, in the second embodiment described below, the members already described in the first embodiment will be denoted by the same or corresponding reference numerals in the drawings to simplify or omit the description.

Preheater 50 for DIP device of the second embodiment
Is a frame 51 that circulates around the substrate 10, a duct 52 that is a heating portion along the inner surface of the frame 51, a warm / cold air generating means 53 adjacent to the DIP device 30, and a warm / cold air generating means 53. A connecting pipe 54 that sends cold air to the ducts 52, an air blowing port 55 that sends hot and cold air from each duct 52, a movable slide plate 56 that is provided at the top of each duct 52, and the temperature and air blowing time of the hot and cold air. A control unit 57 for controlling, a top plate 58 that covers the opening of the frame 51, and a lid unit 60 that opens and closes the opening 59 of the top plate 58 are provided. Each blower port 55 is arranged toward the center of each end face of the substrate 10. Such a DIP device preheater 50 accommodates the substrate 10 through the opening 59 inside the frame 51 and the top plate 58,
In addition, the substrate is sealed by closing the opening 59 with the lid 60 using the hinge 61 as a fulcrum.

According to the second embodiment as described above, DI
The P device preheater 50 can heat at least a portion of the substrate 10 where the partial DIP is performed, and
Since it is used by being attached to the device 30, there is little risk that the surface-mounted electronic components adjacent to the legged electronic components will be damaged or deteriorate in function, and the process will be complicated as if a separate preheating device was adopted. Therefore, the same effect as the first embodiment described above can be obtained.

Moreover, according to this second embodiment, the substrate
Since both sides of 10 are heated, the surface-mounted electronic components adjacent to the legged electronic components are reliably heated. Therefore, good heating efficiency can be obtained and the DIP process can be shortened.

The present invention is not limited to the above-described embodiments, but can be appropriately modified and improved. For example, the substrates exemplified in the above-mentioned embodiments,
Material, shape, size, form of mounting part, cover, DIP device, preheater, frame, duct, air outlet, setting switch, timer, air fan, controller, heat generator, heating unit, lid, etc. The number, the location, etc. are arbitrary and are not limited as long as the present invention can be achieved.

[0047]

As described above, the DIP of the present invention is used.
According to the apparatus preheater, as described in claim 1, it is possible to heat at least a portion of the substrate where the partial DIP is performed. Therefore, the heating temperature is appropriately selected according to the melting temperature of the solder. By heating the area where the partial DIP is performed prior to the partial DIP, even if the surface-mounted electronic component adjacent to the legged electronic component is exposed to the molten high temperature solder, the surface-mounted electronic component is damaged. It is possible to avoid the problem that the work becomes complicated as in the case of separately adopting the preheating device, and there is little possibility that the function is deteriorated.

Further, according to the preheater for a DIP device of the present invention, as described in claim 2, it is possible to heat the entire area of one side of the substrate. The flatness of the substrate is less likely to be lost as compared with the case where only the portion where DIP is performed is heated.

Further, according to the preheater for a DIP device of the present invention, as described in claim 3, it is possible to heat the side of the substrate on which the flux is applied. Parts can be heated reliably.

According to the preheater for a DIP device of the present invention, as described in claim 4, both sides of the substrate can be heated, so that the surface-mounted electronic component adjacent to the legged electronic component is Definitely heated. Therefore, good heating efficiency can be obtained and the DIP process can be shortened.

According to the preheater for a DIP device of the present invention, as described in claim 5, warm air whose temperature and time are controlled by the control unit is blown into the inside of the frame body, so that the frame body If you place the board so as to close the opening of, or if you put the board inside the frame and close the frame,
The board can be heated uniformly on both sides,
The warm air is unlikely to leak to the outside of the frame, so that the heating time can be shortened and the DIP process can be further shortened.

On the other hand, according to the preheating device of the present invention,
As described in claim 6, the frame, the heating part, the heat generating part,
Since it has a control unit, it can be attached to an existing solder coating device, and even if the surface mount type electronic parts adjacent to the legged electronic parts are exposed to the high temperature molten solder, the surface mount type electronic parts are damaged or their function deteriorates. There is little possibility of occurrence of the problem, and it is possible to avoid the problem that the work becomes complicated as in the case where a preheating device is separately installed.

According to the preheating device of the present invention,
As described in claim 7, since the heating portion heats the space between the substrate and the solder coating device, the portion where the partial DIP is performed can be surely heated.

Further, according to the preheating device of the present invention, as described in claim 8, the control unit has the setting switch and the timer, so that the operator can easily operate.

According to the preheating device of the present invention, as described in claim 9, since the heat generating portion has the blower fan, it is not necessary to install the heat source in the vicinity, and the heating portion is the duct. Since it has a moving mechanism and a moving mechanism, it can correspond to the shape and size of the substrate.

According to the preheating device of the present invention,
As described in claim 10, a lid part is provided on the upper surface of the solder coating device to configure a space including the substrate together with a frame body, and the lid part is provided so as to be openable and closable, so that the substrate is housed and hermetically sealed. As a result, good heating efficiency can be obtained.

[Brief description of drawings]

FIG. 1 is an overall side view showing a first embodiment of the present invention.

FIG. 2 is a view on arrow A in FIG.

FIG. 3 is an overall side view showing a second embodiment of the present invention.

FIG. 4 is a view on arrow B in FIG.

[Explanation of symbols]

10 board 10A flux coated surface 30 DIP device 33 Cover 34 Setting switch 35 timer Preheater for 40,50 DIP equipment (preheater) 41,51 frame 42, 52 duct (heating part) 43 Hot / cold air generator (heat generator) 45, 55 air outlet 47, 57 Control unit 60 Lid

Claims (10)

[Claims] 1. In order to solder-fix a legged electronic component to a predetermined portion of a substrate on which a surface-mounting electronic component is mounted, the electronic component is arranged corresponding to the mounting position of the legged electronic component on the flux-coated surface of the substrate. And a mounting portion adjacent to the legged electronic component, with the lead terminal of the legged electronic component penetrating through the through hole of the substrate, and the open end of the lead terminal. A DI used in a DIP device that arranges the board close to the tip of the cover so as to cover electronic parts and supplies molten solder from the cover to perform partial DIP on the board.
A preheater for a PIP device, which is capable of heating at least a portion where the partial DIP is performed. 2. The preheater for a DIP device according to claim 1, wherein the entire surface of one side of the substrate can be heated. 3. The preheater for a DIP device according to claim 1, wherein at least the side of the substrate on which the flux is applied can be heated. 4. The preheater for a DIP device according to claim 1, wherein both sides of the substrate can be heated. 5. A frame body that circulates so as to face each end face of the substrate, a blower port that can blow warm air supplied from a heat source into the frame body, a temperature and a blowing time of the warm air. And a control unit for controlling.
5. The preheater for a DIP device according to claim 4. 6. A substrate preheating device attachable to a solder coating device, comprising: a frame surrounding a side surface of the solder coating device; and heat for heating the substrate mounted on the solder coating device. And a heating unit attached to the frame, and a heat generation unit connected to the heating unit for generating heat, the heat generation unit heating time and heating time. A preheating device comprising: a control unit for controlling temperature. 7. The heating unit heats a space between the substrate and the solder coating device.
The preheating device described in. 8. The control unit has a setting switch for setting the heating time and the heating temperature, and a timer for measuring the heating temperature. The preheating device described in. 9. The heat generating unit has a blower fan for discharging hot air, and the heating unit includes a duct for discharging the warm air to the substrate and a blower port of the duct. The preheating device according to claim 8, further comprising a moving mechanism that moves the substrate in a horizontal direction according to the size of the substrate. 10. The solder coating device according to claim 9, further comprising a lid portion on the upper surface of the solder coating device, the lid portion forming a space including the substrate together with the frame body, and the lid portion being openable and closable. Preheater.