JP2003231093A - Machining method for printed wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a slit and/or an external shape machining method producing no crack for a printed wiring board using a metal mold. <P>SOLUTION: Parts where an upper die a and a lower die b abut on the slit and/or the external shape β line of the printed wiring board are preliminarily cut by edge parts of the upper die and the lower die when clamped between the upper and lower dies, then the slit and/or the external shape is cut by a shear blade 6. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a slit and / or contour processing method for a printed wiring board using a mold.

[0002]

2. Description of the Related Art In manufacturing a printed wiring board, when punching a slit and an outer shape using a die, the printed wiring board is sandwiched under pressure by a punching die which is attached to a press and comprises a pair of upper and lower die. Then, the printed wiring board is punched along the punching pattern formed on the punching die by the shearing blade.

A processing method for performing a slit and / or an outer shape processing according to the prior art will be described with reference to FIG. Figure 3
In the printed wiring board 1 of (a), the wiring pattern 2 made of copper foil or the like is provided on the surface with a certain thickness, and the solder resist 3 and character printing (not shown) are further formed. When the printed wiring board 1 is held by a conventional punching die, a step 5 is formed between the pressing surface 4 of the punching die printed wiring board and the slits and outlines of the printed wiring board, and the upper die a Therefore, it is impossible to completely press down the printed wiring board 1 held by the lower mold b. Figure 3
There is a problem that when the slits and the outer shape processing of the printed wiring board 1 of (b) are broken, the printed wiring board 1 is bent 7 or the like and cracks are easily generated.

In order to solve the above problems, the slits of the upper and lower molds and the portions to be subjected to the outer shape machining are carved with the edges of the molds left with a certain width, so that the printed wiring board is pressed and the bending is eliminated. It is known to suppress the occurrence of cracks.

However, regarding recent build-up multilayer printed wiring boards, particularly, those using aramid fiber or aramid non-woven fabric whose surface is hard, and resin-coated copper foil (glass fiber) in which small diameter holes are easily formed by laser processing The number of materials having a large plate thickness is increasing due to the increase in the number of layers (10 layers or more). As described above, even if the mold is carved while leaving the edge of the mold with a constant width, a firm insulating layer that does not include material hardness or glass fiber, etc.
Cracks occur without being broken properly. Also,
The same can be said for the high multilayer printed wiring board.
Further, since the pressing margin with a constant width is left on the edge of the mold, there is a problem that a mark pressed by the mold remains on the slit and the outer shape portion of the printed wiring board.

[0006]

SUMMARY OF THE INVENTION In view of the above problems, the present inventors have found that the printed wiring board is not cracked even if slits and outer shapes are processed by using a mold, and the high-multilayer structure which is currently the mainstream. For printed wiring boards (10 layers or more) or build-up multilayer printed wiring boards, regardless of the hardness or thickness of the material,
It is an object to provide a processing method capable of punching a slit and / or an outer shape.

[0007]

DISCLOSURE OF THE INVENTION The present invention is a processing method for performing slitting and / or contouring of a printed wiring board using a mold, wherein the upper die and the lower die are slits and / or contour lines of the printed wiring board. Achieving the above object by preliminarily cutting the edge part of the upper mold and the lower mold when holding the part corresponding to the upper mold and the lower mold, and then cutting the slit and / or the outer shape with a shearing blade. Is.

[0008]

DETAILED DESCRIPTION OF THE INVENTION The method of the present invention will be described with reference to FIGS. FIG. 1 is a partial plan view of a printed wiring board 1 processed by the method of the present invention, in which α indicates a slit and β indicates an outer shape portion.

FIG. 2A is a sectional view of the printed wiring board 1 in which at least the front and back surfaces are provided with the wiring pattern 2 and the solder resist 3 is further formed. Is clamped by the upper mold a and the lower mold b, and at the same time, preliminary cutting is performed at the edge portions of the upper and lower molds.

A sharp protruding blade 8 is provided on the slits of the upper and lower molds of the mold and the edge portion corresponding to the outer shape. The thickness of the protruding blade 8 at the edge portion is 0.02 to
0.10 mm, particularly 0.05 mm is desirable. 0.
If it is less than 02 mm, the processing accuracy is difficult, and the protruding blade 8 is easily broken, and it becomes difficult to continuously perform preliminary cutting. On the other hand, if it is 0.10 mm or more, the protruding blade 8 may be too thick to be precut.

In FIG. 2B, the slit and / or the outer shape is completely processed by using the shearing blade 6. As for the type of printed wiring board, any printed wiring board with circuit formation on both front and back sides is applicable, and especially, build-up multilayer printed wiring board, aramid woven fabric, aramid nonwoven fabric,
This is effective for processing hard surface materials, glass fiber-free insulating layers that use copper foil with resin for laser drilling of small diameter, and high-thickness multilayer printed wiring boards.

[0012]

According to the method of the present invention, when the slit and / or the outer shape of the printed wiring board is processed by the die, preliminary cutting is performed at the edge portions of the upper die and the lower die of the die, and especially the protruding blade 8 is formed. When provided, by pressing with the wire at the tip, a high multilayer printed wiring board (10 layers or more) having a thick board thickness or a build-up multilayer printed wiring board having a hard surface material such as aramid woven cloth or aramid nonwoven cloth, It has become possible to cut the insulating layer that does not contain glass fibers using a resin-coated copper foil that is subjected to laser drilling with a small diameter so that cracks do not occur.

[Brief description of drawings]

FIG. 1 is a partial plan view of a slit and an outer shape processed by the method of the present invention.

FIG. 2 is a schematic sectional explanatory view showing a processing step according to the method of the present invention.

FIG. 3 is a schematic cross-sectional explanatory view showing a processing step by a conventional method.

[Explanation of symbols]

1: Printed wiring board 2: Wiring pattern 3: Solder resist 4: Pressing surface 5: Step 6: Shearing blade 7: Deflection 8: Mold edge protruding blade (slit and external processing portion) a: Upper die b: Lower Type α: Slit β: Outline

Claims (2)

[Claims] 1. In a processing method for performing slitting and / or contouring of a printed wiring board using a die, the upper die and the lower die are the portions where the upper die and the lower die correspond to the slits and / or the contour lines of the printed wiring board. A method for processing a printed wiring board, comprising preliminarily cutting the edges of the upper mold and the lower mold when holding the mold, and then cutting the slit and / or the outer shape with a shearing blade. 2. The method for processing a printed wiring board according to claim 1, wherein preliminary cutting is performed with sharp protruding blades provided on the edge portions of the upper die and the lower die.