JP2003230030A - Solid-state image pickup apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solid-state image pickup apparatus capable of stably operating the solid-state imaging element at a prescribed temperature even in the case of use of the solid-state imaging element at diversified attitudes and being easily made compact. <P>SOLUTION: The solid-state image pickup apparatus 1 is characterized in to include: a solid-state imaging element for photoelectric converting light; a case 2 provided with an opening to receive light and containing the solid-state imaging element; a thermal conduction member placed between the solid-state imaging element and the inner wall face of the case in a manner of keeping thermal contact between them and for absorbing the heat produced in the solid- state imaging element and delivering the heat toward the case; at least one fluid path 101 formed in an inner area between the inner wall face and the outer wall face of the case, having a suction port H101 for receiving fluid at the outside of the case and a discharge hole H100 discharging the fluid to the outside of the case, and exchanging the heat between the case and the fluid to cool the case; and a fan 90 for producing a fluid flow f101 to move the fluid in the fluid path from the suction port to the discharge hole. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image pickup device using a solid-state image pickup element.

[0002]

2. Description of the Related Art In order to obtain a clear image in a solid-state image pickup device using a solid-state image pickup device such as a CCD (CHARGE COUPLED DEVICE), it is necessary to prevent an increase in dark current due to a temperature rise of the solid-state image pickup device during operation. Is important. For this reason, the solid-state imaging device is provided with a cooling mechanism having a cooling element, a radiator, and the like for cooling the operating solid-state imaging device to prevent its temperature from rising and to maintain the operating temperature at a predetermined level.

In recent years, solid-state image pickup devices have been added various functions in order to improve image quality, and at the same time, investigations have been made to meet the needs of further size reduction and weight reduction, and heat generation per unit volume of the device. The amount tends to increase. Therefore, higher cooling performance and a compact structure are simultaneously required for the mounted cooling mechanism.

In the solid-state image pickup device, when outside air flows into the space in the housing where the solid-state image pickup device is arranged, dew condensation occurs on the surface of the solid-state image pickup device kept at a low temperature. Since the image quality may deteriorate, from the viewpoint of preventing this as much as possible, the airtightness of the space in which the solid-state imaging device is arranged is enhanced.

In order to meet the above-mentioned demand, for example, there is a method of further improving the cooling efficiency while maintaining the compactness of the apparatus by further increasing the airtightness. In this case, it is necessary to improve the accuracy of machining parts. There are problems that the cost of parts is increased, the maintainability is deteriorated, and it is difficult to maintain the airtightness for a long period of time, and this method has a limit.

Therefore, for example, Japanese Patent Laid-Open No. 2001-291
Japanese Unexamined Patent Publication No. 982 proposes a natural air-cooled electronic device in which a metal air passage capable of taking in outside air is provided inside a housing having a closed structure. In this electronic device,
The heat generating portion is cooled by exchanging heat between the heat generating portion and the outside air through the wall of the metal air passage while maintaining the airtightness of the space where the heat generating portion of the device is arranged.

[0007]

However, since the electronic device described in Japanese Patent Laid-Open No. 2001-291982 mentioned above is of the natural air cooling type, the velocity of the air flow in the metal air passage is slow and a sufficient cooling effect is obtained. I couldn't get it. Also,
A space for providing the metal air passage inside the housing is required, the device cannot be easily made compact, and the structure of the housing becomes complicated, resulting in high cost. Furthermore, there is a problem in that the electronic device has a variation in the cooling effect obtained depending on the posture of the device at the installation position, and is difficult to apply when the device is made compact and is used in various postures without being fixed to a specific installation position. there were.

There is also a method for increasing the cooling efficiency by increasing the size of the heat radiation fins formed on the outer wall surface of the housing, but there is a limit to the increase in the size of the heat radiation fins from the viewpoint of making the device compact. It was

That is, a solid-state image pickup device having a structure capable of stably and efficiently cooling the solid-state image pickup element even when used in various postures and at the same time easily made compact has been realized. Didn't.

The present invention has been made in view of the above problems of the prior art, and the solid-state image sensor can be stably operated at a predetermined temperature even when used in various postures.
Moreover, it is an object of the present invention to provide a solid-state imaging device that can be easily made compact.

[0011]

According to the present invention, there is provided a solid-state image sensor for photoelectrically converting light, an opening for collecting light, a case for housing the solid-state image sensor, and a solid-state image sensor. A heat conducting member, which is arranged in a state of maintaining thermal contact with the inner wall surface of the case, absorbs heat generated in the solid-state imaging device and transfers it toward the case, and an inner wall surface and an outer wall surface of the case. Is formed in an inner region between the case and has an inlet for sucking the fluid existing outside the case and an outlet for discharging the fluid to the outside of the case, and allows heat exchange between the case and the fluid. And at least one fluid flow path for cooling the case, and a fan for generating a fluid flow for moving the fluid in the at least one fluid flow path from the suction port toward the discharge port. Solid-state imaging device characterized by To provide.

According to this solid-state image pickup device, since the fluid flow path is formed by utilizing the inside of the case, an external fluid such as air as a cooling medium does not flow into the space in which the solid-state image pickup device is stored. Therefore, the airtightness of the space can be sufficiently maintained, and the occurrence of dew condensation in the solid-state image sensor can be sufficiently prevented. Further, the suction port and the discharge port can be formed at any position in the case in any number, and the flow path connecting the two can be formed in any size and length in the case within the case. However, the fan can be used to forcibly generate the fluid flow in the fluid flow path, and the heat exchange between the case and the fluid can be reliably performed with high conversion efficiency.

Therefore, the solid-state image pickup device of the present invention can always stably and efficiently cool the case even when it is used in various postures, and thus can stably and efficiently cool the solid-state image pickup device. Therefore, the solid-state imaging device can be stably operated at a predetermined temperature.

In the solid-state image pickup device of the present invention,
Since the fluid flow path is formed inside the case, it is not necessary to provide a space for providing the fluid flow path inside the device, and a case having the same outer shape and size as the existing one can be used. In addition, the fan is relatively easy to make compact. Therefore, the solid-state imaging device of the present invention is
It can be easily made compact. Further, forming the fluid flow path inside the case also contributes to weight reduction of the device. Further, since it is technically relatively easy to form the fluid passage inside the case, the manufacturing cost can be kept relatively low.

In the present invention, the "case" for accommodating the solid-state image pickup device means that at least a portion where the fluid flow path is formed is in thermal contact with the heat conducting member and that portion is an external fluid. A material having heat conductivity capable of exchanging heat with is shown.

In the solid-state image pickup device of the present invention,
Radiating fins are preferably formed on the outer wall surface of the case. As a result, the solid-state imaging device can be cooled with higher efficiency.

Further, in the solid-state image pickup device of the present invention,
The fan may be arranged near the outlet of the at least one fluid flow path. By disposing the fan in the vicinity of the discharge port, it is possible to efficiently generate a fluid flow in the fluid flow path by utilizing its power without waste. Here, "to arrange the fan in the vicinity of the discharge port" means to dispose the fan in the fluid flow path in the vicinity of the discharge port, to directly connect the discharge port from the outside to the discharge port, or Shows that the connection member such as a manifold described later is used outside the discharge port. When the fans are arranged and a plurality of fluid passages are provided in this way, it is necessary to match the size of the fans with the size of the cross section of the fluid passages in order to minimize the number of installed fans. Since there is no advantage, the fan is preferably arranged outside the discharge port by using a connecting member such as a manifold described later.

That is, in the solid-state image pickup device of the present invention, a fan is connected to the first connection port opened to the outside, and a discharge port is provided for each of the discharge ports of the at least one fluid flow path. Further provided is a manifold part having an internal passage having a second connection port connected to the outlet, and the fluid discharged from the discharge port is discharged to the outside through the internal passage of the manifold part. It is preferable.

With such a configuration, the number of installed fans can be minimized. Here, the manifold portion can be easily configured to be compact so as not to hinder the downsizing of the device.

In the solid-state image pickup device of the present invention,
The fan may be arranged near the suction port of the at least one fluid flow path. Similar to the case where the fan is arranged near the exhaust port, the fan can be arranged near the intake port so that the power of the fan can be efficiently used to efficiently generate the fluid flow in the fluid passage. You can Here, "to arrange the fan in the vicinity of the suction port" means to dispose the fan inside the fluid flow path in the vicinity of the suction port, or to directly connect the suction port from the outside of the suction port, or Shows that the connecting member such as a manifold described later is used outside the suction port. When the fans are arranged and a plurality of fluid passages are provided in this way, it is necessary to match the size of the fans with the size of the cross section of the fluid passages in order to minimize the number of installed fans. Since there is no advantage, the fan is preferably arranged outside the suction port by using a connecting member such as a manifold described later.

That is, in the solid-state image pickup device of the present invention, a fan is connected to the first connection port opened to the outside, and a suction port is provided for each suction port of the at least one fluid flow path. A manifold part having an internal passage having a second connection port connected to the port is further provided, and the fluid sucked from the suction port is supplied through the internal passage of the manifold part. It is preferably allowed to flow into the fluid flow path.

With such a structure, the number of installed fans can be minimized. Here, the manifold portion can be easily configured to be compact so as not to hinder the downsizing of the device.

Further, in the solid-state image pickup device of the present invention,
The case has a substantially rectangular parallelepiped shape, a front panel provided with an opening, a back panel arranged to face the front panel, a bottom panel on which each solid-state imaging device is mounted,
It is composed of a top panel that is arranged to face the bottom panel and two side panels that face each other. Between the front panel and the back panel, the inside of the case is the first area on the front panel side and the back panel side. A partition panel that bisects the second area is defined, and a manifold portion that defines the second area as an internal passage is defined. A solid-state image sensor and a heat conduction member are arranged in the first area. At least one of the side panels is formed with at least one fluid flow path extending from the front panel side to the back panel side, and the suction port of the fluid flow path is an outer wall surface of the side panel on the front panel side. The discharge port of the fluid flow path is provided on the inner wall surface of the side panel on the second region side, and the rear panel is
The manifold portion may be provided with a first connection port, and a fan may be disposed on the second region side of the first connection port.

By thus forming the case into a substantially rectangular parallelepiped shape, the components can be efficiently arranged inside the case, the handling of the apparatus is improved, and the apparatus can be stored in a predetermined place when not in use. It is possible to make effective use of the storage space when storing it with little waste. Further, by constructing the case with four panels, the case including the formation of the fluid flow path can be easily manufactured, and the device can be more easily made compact.

Further, the partition panel is used to divide the inside of the case into two regions, a first region and a second region, so that the airtightness of the first region in which the solid-state image pickup device is arranged is kept at a predetermined level. However, it is possible to more easily form the manifold portion on the second region side. Further, by providing a fluid flow path on at least one of the side panels so as to extend from the side of the first region toward the side of the second region, solid-state imaging is performed through the inner wall defining the first region of the case. The fluid that has exchanged heat with the element can be quickly moved to the manifold portion and discharged, and the fluid that moves in the fluid passage can be cooled by efficiently utilizing the outer wall of the entire case. .

When the side panel is provided with the fluid passage as described above, at least one fluid passage extending from the front panel side to the rear panel side is formed on the upper panel, and the fluid passage is formed. It is preferable that the suction port is provided on the outer wall surface of the top panel on the front panel side, and the discharge port of the fluid channel is provided on the inner wall surface of the side panel on the second region side. Accordingly, the fluid that has exchanged heat with the solid-state imaging device via the inner wall that defines the first region of the case can be cooled by using the outer wall of the entire case in a more efficient state.

Further, in the solid-state image pickup device of the present invention,
The case includes a case body and a case cover that is detachably attached to the case body. The case body has a front panel, a back panel, and a bottom panel, and the case cover is It may be characterized in that the two side panels and the top panel arranged opposite to the bottom panel are integrally formed.

By adopting the case cover having the above structure, it is possible to more easily attach the components of the apparatus such as the solid-state image pickup device into the case, and to assemble the apparatus more efficiently. Becomes In particular, when a color separation prism having a plurality of solid-state image pickup devices mounted thereon is mounted as described later, it is possible to sufficiently reduce the mechanical stress on each solid-state image pickup device and at the same time achieve an optical resolution of 3 to the color separation prism. It is possible to mount the solid-state imaging devices, which have been subjected to the dimensional position adjustment, with high mounting position accuracy without shifting the relative positions thereof.

In the present invention, when the case is composed of the case main body and the case cover detachably attached to the case main body, the case cover has a rear surface instead of the top panel in addition to the above-mentioned structure. You may employ | adopt what has the structure which integrated the panel.

Further, the solid-state image pickup device of the present invention has a light receiving surface for receiving the light collected from the opening of the case,
The light-receiving surface is further provided with a color-separating prism that decomposes the light incident on the light-receiving surface into light of a plurality of color components and emits the light from the light-emitting surface provided for each light of each color component. A solid-state image sensor for photoelectrically converting light of each color component may be provided for each light emitting surface. As a result, a good color image can be obtained. In this case, it is preferable that the heat conducting member is also provided for each solid-state image sensor.

Further, the solid-state image pickup device of the present invention may be characterized in that the cooling element is further arranged between the solid-state image pickup element and the heat conducting member. As described above, by further including the cooling element, the solid-state image sensor during operation can be accurately cooled at a lower temperature, and fluctuations in temperature of each solid-state image sensor and an increase in dark current can be sufficiently suppressed. be able to.

In this case, the cooling element is preferably a Peltier element. By using the Peltier device as the cooling device, it is possible to easily and efficiently cool the solid-state imaging device to a predetermined temperature equal to or lower than the external environment temperature. Further, since the Peltier device can be constructed in a lightweight and compact form and requires a small installation space, the solid-state imaging device can be constructed in a lightweight and compact form.

Further, the solid-state image pickup device of the present invention controls the output of the electrolysis cell for promoting the electrochemical oxidative decomposition reaction of water vapor in the case and the output of the cooling element to control the operating temperature of the solid-state image pickup element to the external environment. The temperature of the solid-state image sensor, the cooling element, and the electrolysis cell are controlled so that the water vapor pressure in the case satisfies the condition that the water vapor pressure in the case becomes a predetermined value less than the saturated water vapor pressure at the operating temperature. It may be characterized by having a control device which controls timing respectively independently.

When the solid-state image pickup device is operated at a predetermined temperature equal to or lower than the external environment temperature by using the cooling element,
Condensation in the solid-state imaging device is particularly likely to occur when the solid-state imaging device is started and stopped, but the solid-state imaging device, the cooling element, and the electrolysis cell are staggered at different start and stop timings in the case. By adjusting the partial pressure of water vapor so as to satisfy the above condition, it is possible to prevent the occurrence of dew condensation and obtain a good captured image.

Here, the "external environment temperature" refers to the temperature of the external environment of the case that houses at least the solid-state image sensor and the cooling element.

In the present invention, the operating temperature of the solid-state imaging device is preferably set to a predetermined value lower than the external environment temperature from the viewpoint of sufficiently suppressing the increase of dark current in the solid-state imaging device. It is more preferable to adjust the temperature to be 20 ° C. or more lower than the temperature. More specifically, the operating temperature of the solid-state imaging device is preferably set to 0 ° C. or lower.

Further, in the present invention, from the viewpoint of sufficiently preventing the occurrence of dew condensation, it is preferable that the water vapor pressure in the case is set to a predetermined value lower than the saturated water vapor pressure at the above-mentioned operating temperature. It is more preferably adjusted to 10% or less when converted into relative humidity (expressed as a percentage) at temperature, and further preferably adjusted to 5% or less.

In the above case, at the time of activation, the control device activates the solid-state image pickup element and the electrolysis cell earlier than the cooling element, and then activates the cooling element after a lapse of a predetermined time when the above conditions are satisfied. Is preferred. As described above, by delaying the activation timing of the cooling element with respect to the activation timing of the solid-state imaging device and the electrolysis cell, it is possible to more reliably prevent the occurrence of dew condensation. In this case, the solid-state imaging device and the electrolysis cell may be activated at the same timing, or either one may be activated first.

Further, in the above-mentioned case, at the time of stop, the control device stops the solid-state image pickup element and the cooling element before the electrolysis cell, and then stops the electrolysis cell after a predetermined time when the above conditions are satisfied. It is preferable.

As described above, by delaying the stop timing of the electrolysis cell with respect to the stop timing of the solid-state image pickup element and the cooling element, it is possible to more reliably prevent the occurrence of dew condensation, and the solid-state image pickup apparatus is again provided. It can be started promptly when it is started. In this case, the solid-state image sensor and the cooling element may be stopped at the same time, or either one may be stopped first, but it is preferable to stop the cooling element before the solid-state image sensor.

Further, in the solid-state image pickup device of the present invention,
A humidity sensor that detects the water vapor pressure in the case is further provided, and the control device controls the start and stop timings of the solid-state imaging device, the cooling element, and the electrolysis cell based on the water vapor pressure detected by the humidity sensor. May be controlled independently. By using the humidity sensor, it is possible to more reliably prevent the occurrence of dew condensation.

The optimum value of the time from the activation of the solid-state imaging device and the electrolysis cell to the activation of the cooling element and the optimum time from the stop of the solid-state imaging device and the cooling element to the termination of the electrolysis cell are previously determined by experimental data and the like. Keep in mind that a timer or the like is connected instead of the humidity sensor to automatically start the cooling element in response to the activation of the solid-state imaging element and the electrolysis cell, and stop the electrolysis cell for the solid-state imaging element and the cooling element. It may be set.

In the solid-state image pickup device of the present invention,
A temperature sensor for detecting the temperature of the solid-state image sensor is further provided, and the control device starts and stops the solid-state image sensor, the cooling element, and the electrolysis cell based on the temperature of the solid-state image sensor detected by the temperature sensor. May be controlled independently of each other, and the output of the cooling element after activation may be controlled.

As a result, it is possible to reduce fluctuations in the temperature of the solid-state image sensor during operation. In addition, when stopping the solid-state imaging device, first stop the solid-state imaging device and the cooling element, and then when stopping the electrolysis cell, stop the solid-state imaging device and the cooling element, and then use the temperature sensor to perform the solid-state imaging. If the temperature of the device is monitored and the electrolysis cell is stopped after the temperature of the solid-state imaging device has risen sufficiently,
Condensation can be prevented more effectively.

Further, in the solid-state image pickup device of the present invention,
The electrolysis cell applies an anode that is a gas diffusion electrode, a cathode that is a gas diffusion electrode, a polymer electrolyte membrane arranged between the anode and the cathode, and a predetermined voltage between the anode and the cathode. It may be characterized by having a voltage application part.

As described above, an electrolysis cell having a structure in which a voltage application section serving as an external power source is connected to a gas diffusion electrode used in a so-called polymer electrolyte fuel cell (PEFC) or the like can be easily reduced in size and weight. Therefore, the solid-state imaging device can be configured compactly. Further, the electrolysis cell having this configuration has high energy efficiency and extremely rapidly oxidizes and decomposes water vapor even at a very low temperature (eg, −20 ° C.) to obtain a desired humidity (eg, a relative humidity at an operating temperature of 5%). % Or less) can be easily dehumidified.

In this case, from the viewpoint of efficiently oxidizing and decomposing the water vapor in the case, the electrolysis cell provided in the case is such that the surface of the anode which is not in contact with the polymer electrolyte membrane faces the inside of the case. It is preferable that the cathode is arranged so that the surface of the cathode that is not in contact with the polymer electrolyte membrane is exposed to the outside of the case.

When the partition panel is provided, it is preferable that the partition panel is an electrolysis cell. here,
When arranging the electrolysis cell as a partition panel, arrange so that the surface on the anode side is exposed on the side of the first region,
It is arranged so that the surface on the cathode side is exposed on the second region side. By arranging the electrolysis cell as a partition panel in this way, the installation space for the electrolysis cell and the partition panel and the piping for discharging the decomposition products from the electrolysis cell to the outside are not separately provided Therefore, the device can be made compact, and the manufacturing cost can be reduced.

Further, with such a configuration,
The electrolysis cell can maintain the airtightness of the first region at a predetermined level and at the same time the vapor-steam partial pressure of the first region at a predetermined level. That is, the water vapor component present in the first region in the anode of the electrolysis cell is instantly decomposed and removed by the reaction shown in the following formula (1), and the cathode of the electrolysis cell is represented by the following formula (2) or (3). The steam or hydrogen generated by the reaction shown can be discharged to the second region and can be instantaneously discharged to the outside of the device by the fan together with the external fluid. Therefore, if the electrolysis cell is operated, the condensation can be effectively prevented. As a result, the airtightness of the first region does not need to be very high.

Although the electrolysis cell itself may be used as a partition panel as described above, the electrolysis cell may be mounted as a part of the partition panel.

[0051]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. The same or corresponding parts in the drawings will be denoted by the same reference numerals.

[First Embodiment] FIG. 1 is a perspective view showing a first embodiment of a solid-state image pickup device according to the present invention. FIG. 2 is a front view of the solid-state imaging device shown in FIG. FIG. 3 shows FIG.
It is a rear view of the solid-state imaging device shown in FIG. FIG. 4 corresponds to FIG.
FIG. 4 is a cross-sectional view showing a schematic basic configuration of a solid-state imaging device taken along line IV-IV. FIG. 5 is a cross-sectional view showing a schematic configuration of a portion near a discharge port of a fluid flow path of the solid-state imaging device as viewed along the line VV in FIG. FIG. 6 is an exploded perspective view for schematically explaining the fluid flow generated in the fluid flow path when the solid-state imaging device shown in FIG. 1 is operated.

The solid-state image pickup device 1 of this embodiment is shown in FIGS.
As shown in FIG. 7, mainly, the color separation prism 10 and the solid-state image pickup elements 21, 22, 23 arranged on the light emission surfaces F11, F12, F13 of the color separation prism 10, respectively.
And the back surfaces F21, F22, F2 of these solid-state imaging devices
Peltier elements 31, 32, 3 respectively arranged on 3
3, cooling blocks 41, 42, 43 respectively arranged on the back surfaces of these Peltier elements, an image processing unit 7 for processing electric signals sent from each solid-state image sensor, and each of the above-mentioned image capturing units. It comprises a case 2 for accommodating components, an electrolysis cell 8 serving as a partition panel that divides the case 2 into the first region and the second region described above, and a fan 90.

In the solid-state imaging device 1, one end of each cooling block 41, 42, 43 is connected to each cooling block, and the other end is connected to the inner wall surface of the case cover 4. A heat conduction pipe (not shown) is provided to cool these cooling blocks 41, 42, 4
3 and each heat transfer pipe constitute the heat transfer member described above. The image processing unit 7 is also stored in a case (not shown).

Further, as shown in FIG. 4, the inside of the case 2 has a high airtightness by the electrolysis cell 8 serving as a partition panel, the case of the image processing section 7, and the bottom panel 3c. It is divided into a region and a second region. The electrolysis cell 8, the back panel 3b, the side panel, and the bottom panel 3c define the above-mentioned manifold portion, and the second region serves as an internal passage of the manifold portion.

As shown in FIGS. 1 to 3, a case 2 having a substantially rectangular parallelepiped shape has a case body 3 having a U-shaped cross section.
The case cover 4 has a U-shaped cross section and is detachably attached to the case body.

The case 3 main body has a front panel 3a having an opening H2 formed therein, a rear panel 3b arranged to face the front panel 3a, and the above-described components for image pickup placed on the upper surface. And a bottom panel 3 in which a front panel 3a and a rear panel 3b are erected on opposite edges of the upper surface.
and c.

On the other hand, the case cover 4 has a front panel 3a and a rear panel 3b when the case 2 having a substantially rectangular parallelepiped shape is formed.
Two side panels forming a side surface between the top panel and the bottom panel are integrated. When the solid-state imaging device 1 is assembled, the case cover 4 is preliminarily integrally connected with the cooling blocks 41, 42, 43 and the heat conduction pipes that support the cooling blocks. As a result, each solid-state image sensor 21,
The work for mounting the color separation prism 10 having the 22 and 23 mounted therein in the case 2 is facilitated.

The case cover 4 functions as a heat radiating plate, and the heat radiating fins formed on the outer surface of each panel constituting the case cover 4 are substantially parallel to the normal direction of the front panel 3a. Are formed in stripes at predetermined intervals. By forming the heat radiation fins in this way, the heat radiation efficiency of the case cover 4 can be improved.

Further, as shown in FIGS. 1 to 6, in the inner region between the inner wall surface and the outer wall surface of each side panel of the case cover 4, the fluid flow paths 101 and 1 having a substantially rectangular cross section.
02 is formed. The fluid flow paths 101 and 102
Is for cooling the case 2 by utilizing heat exchange between the case 2 and a fluid such as air existing outside the case 2.

As shown in FIGS. 1 and 2, the suction port H101 of the fluid passage 101 for sucking the fluid existing outside the case 2 is formed on the side surface of the side panel on the side of the front panel 3a. . Similarly, the suction port H of the fluid flow path 102
102 is also formed on the side surface of the side panel on the front panel 3a side. In addition, the fluid channel 101 and the fluid channel 102
Is formed such that the inner region of the side panel extends from the side of the front panel 3a to the side of the rear panel in a direction substantially parallel to the normal direction of the front panel 3a.

As shown in FIG. 5, the fluid channel 101 is bent in a substantially L-shape toward the inside of the second region at the side panel portion defining the manifold portion. A discharge port H101A for discharging the fluid to the second region is formed on the inner wall surface of the side panel that is in contact with the two regions (internal passages of the manifold portion). Similarly, the fluid channel 1
Also, 02 is bent in a substantially L shape toward the inside of the second region in the side panel portion that defines the manifold part, and the fluid is secondly applied to the inner wall surface of the side panel that is in contact with the second region. A discharge port H102A for discharging to the area is formed.

Further, as shown in FIGS. 3 to 6, on the second region side of the rear panel 3b which defines the manifold portion, the fan 90 has its suction side surface directed toward the second region side and its side. The discharge side surface is arranged so as to face the rear panel 3b side. A discharge hole H10 that penetrates the rear panel 3b from the second region to the outside is provided in the portion of the rear panel 3b that contacts the discharge side surface of the fan 90.
0 is formed. Further, the fan 90 is electrically connected to the central control unit 71 (see FIG. 9) of the image processing unit 7.

FIG. 6 shows the case of operating the fan 90.
Using the flow channel 101 as an example, the fan 90
To activate the fluid flow f in the fluid flow path 101.
101 is generated and the fluid outside the solid-state imaging device 1 is sucked into the suction port H.
101 is forcibly introduced into the fluid flow path 101, and heat is exchanged with the case 2 to cool the case 2 and the exhaust port H10.
Moved to 1A. Then, the exhaust port H101
The fluid discharged from A to the second region is exhaust port H102A.
Is discharged to the second region together with the reaction products such as water and hydrogen discharged from the electrolysis cell 8, and is discharged to the outside through the discharge hole H100 of the rear panel 3b. In addition, the flow of the fluid in the fluid flow path 102 when operating the fan 90 is the same as above.

By arranging the fluid flow paths 101 and 102 so as to satisfy the above-mentioned arrangement conditions, the solid-state image pickup device 21 can be operated regardless of the posture of the solid-state image pickup device 1.
Can always be cooled efficiently. That is, the normal direction of the surface of the suction ports H101 and H102 of the fluid flow paths 101 and 102 and the normal direction of the front panel 3a are substantially parallel to each other, and the suction ports H101 and H102 are located at the positions shown in FIG. By providing the suction port H regardless of the posture of the solid-state imaging device 1, the suction port H faces the same direction as the surface of the opening H2 of the front panel 3a facing the subject.
This is because 101 and H102 are not blocked and can always suck the external fluid.

The case body 3 and the case cover 4 are connected by, for example, screwing. In addition, the respective panels constituting the case body 3 and the case cover 4 are
For example, it is formed as a constituent material having thermal conductivity such as aluminum.

Opening H of the front panel 3a of the case 3 body
Reference numeral 2 is for collecting incident light to be incident on the color separation prism 10 described later, and has a substantially circular shape.
Further, a lens attachment portion 5 for detachably attaching a photographing optical system (not shown) to the solid-state imaging device 1 is provided outside the opening H2 of the front panel 3a. This photographing optical system is composed of various types of lenses and the like according to the application of the solid-state imaging device 1.

Further, the lens attachment portion 5 is formed with a substantially circular opening coaxial with the opening H2 of the front panel 3a. Further, a groove or the like for detachably mounting the photographing optical system is formed in the opening of the lens attachment section 5. Then, the opening H2 of the front panel 3a
A cover glass 6 made of optical glass is arranged in the solid-state imaging device 1 so as to prevent dust and the like from entering the solid-state imaging device 1.

The rear panel 3b is provided with an exhaust hole H100 for exhausting gases such as water vapor and hydrogen exhausted from the electrolysis cell 8 described later to the outside of the case 2. Further, inside the back panel 3b of the case 2, an electrolysis cell 8 for arranging an electrochemical oxidative decomposition reaction of water vapor in the case 2 is arranged.

The electrolysis cell 8 will be described below.
FIG. 7 is a cross-sectional view schematically showing an example of the basic configuration of the electrolysis cell provided in the solid-state imaging device shown in FIG.

As shown in FIG. 7, the electrolysis cell 8 includes an anode 81 which is a gas diffusion electrode, a cathode 82 which is a gas diffusion electrode, and a polymer electrolyte membrane which is arranged between the anode 81 and the cathode 82. 83 and a voltage applying section 84 for applying a predetermined voltage between the anode 81 and the cathode 82.
And have

The electrolysis cell 8 has an anode 81.
The surface F81 on the side not in contact with the polymer electrolyte membrane 83 is disposed so as to face the inside of the case 2, and the surface F82 on the side of the cathode 82 not in contact with the polymer electrolyte membrane 83 is exposed to the side of the second region. It is arranged to be done.

The polymer electrolyte membrane 83 is not particularly limited as long as it is an ion exchange membrane which exhibits good ion conductivity in a wet state. Examples of the solid polymer material forming the polymer electrolyte membrane include a perfluorocarbon polymer having a sulfonic acid group (hereinafter referred to as a sulfonic acid type perfluorocarbon polymer), a polysulfone resin, a phosphonic acid group or a carboxylic acid group. A perfluorocarbon polymer or the like can be used. Of these, a sulfonic acid type perfluorocarbon polymer is preferable.

The anode 81 and the cathode 82 may be gas diffusion electrodes, and their structures are not particularly limited. For example, each of the anode 81 and the cathode 82 may have a configuration including a gas diffusion layer and a catalyst layer formed on these gas diffusion layers. As a constituent material of the gas diffusion layer, for example, a porous body having electron conductivity (for example, carbon cloth or carbon paper) is used. Further, the catalyst layer may have a structure mainly containing a fluorine-containing ion exchange resin and an aggregate of the catalyst coated with this fluorine-containing ion exchange resin. In this case, the catalyst used (catalyst in which metal is supported on carbon) is not particularly limited, but the metal supported on carbon is preferably a platinum group metal such as platinum or an alloy thereof. The carbon as the carrier is not particularly limited.

Further, the on-exchange resin contained in the catalyst layer is
It is preferably a sulfonic acid type perfluorocarbon polymer. The sulfonic acid-type perfluorocarbon polymer enables chemically stable and rapid proton conduction in the catalyst layer for a long period of time. And this anode 8
The ion exchange resin contained in 1 and the cathode 82 may be made of the same resin as the ion exchange resin constituting the polymer electrolyte membrane, or may be made of a different resin.

The voltage applying section 84 has a power source (not shown).
And a voltage control circuit (not shown) for controlling the applied voltage supplied from the power supply between the anode 81 and the cathode 82. Further, the voltage applying unit 84 is the image processing unit 7.
It is electrically connected to the central control unit 71 (see FIG. 9).

In the case of this electrolysis cell 8, the voltage applying section 8
By adjusting the applied voltage applied between the anode 81 and the cathode 82 from No. 4, the oxidation reaction of water represented by the following formula (1) is advanced in the anode, and the hydrogen ion represented by the following formula (2) is formed in the cathode. Promotes the reduction reaction of oxygen with oxygen. ^{_{2H 2 O → 4H + + O}} 2 ++ 4e - ... (1) 4H + + O 2 + 4e - → 2H 2 O ... (2)

It should be noted that the hydrogen ion reduction reaction represented by the following formula (3) may proceed at the cathode by adjusting the applied voltage, but from the viewpoint of operating the electrolysis cell 8 under the condition of lower power consumption. Therefore, it is preferable to allow the reaction represented by the formula (2) to proceed at the cathode. 2H ⁺ + 2e ⁻ → H ₂ (3)

The magnitude of the applied voltage applied by the voltage applying section 84 for advancing the electrode reactions represented by the above formulas (1) and (2) is, for example, the electrodes of the anode 81 and the cathode 82. In addition to the overvoltage of each electrode reaction, thermodynamic data such as the redox potential of the reaction, the constituent materials of the anode 81 and the cathode 82, the constituent material of the polymer electrolyte membrane 83 and its water content, the temperature of the operating environment, It is appropriately determined theoretically or experimentally in consideration of humidity and the like.

This electrolysis cell 8 is arranged on the inner side of the apparatus 1 than the electrolysis cell 8 and a fixing member 81 made of a continuous annular body and on the outer side of the apparatus 1 than the electrolysis cell 8. It is sandwiched between a fixed member 83 made of a continuous annular body. The fixing members 81 and 83 are integrated by screwing the respective outer edge portions with screws 83. The fixing member 81 is fixed to the bottom panel 3c.

The color separation prism 10 shown in FIG. 4 has a light receiving surface F10 facing the opening H2 of the front panel 3a, and the incident light L10 incident from the light receiving surface F10 is divided into, for example, three color components. The light L1 (for example, green light), L2 (for example, blue light), and L3 (for example, red light) are decomposed. The color separation prism 10 is made of, for example, an aluminum die cast material having high thermal conductivity.

The color separation prism 10 includes three compound prisms (dichroic prisms) assembled with a dichroic film (not shown) that reflects light of a specific wavelength interposed therebetween.
Of the color component optical paths 11, 12 and 13. For example, the dichroic film used in the color separation prism 10 shown in FIG. 4 includes one for red reflection that reflects a light component of a wavelength in the red region and one for blue reflection that reflects a light component of a wavelength in the blue region. Also transmits light components of wavelengths in the green region.

Therefore, the green light L1 goes straight in the color component optical path 11 in a direction parallel to the incident light L10, and the blue light L2 and the red light L3 are incident on the incident light L10 according to the angle of the installation surface of the corresponding dichroic film. It travels in a direction different from the parallel direction. In the case of the color separation prism 10 shown in FIG. 4, the red light L3 travels in the color component optical path 13 toward the bottom panel 3c side, and the blue light L2 travels in the color component optical path 12 of the case cover 4. It is set to proceed toward the side.

Then, the lights L1, L2 and L3 of the respective color components
Are emitted from the light emission surfaces F11, F12, and F13 provided in the color component optical paths 11, 12 and 13, respectively for each of these color component lights.

As shown in FIG. 4, on the light emitting surfaces F11, F12 and F13 of the color separation prism 10, for example, CC
Solid-state image pickup devices 21, 22, and 23 such as D are arranged adjacent to each other. Solid-state imaging devices 21, 22 and 23
Are light L1 and L1 of the respective color components incident on the respective light receiving surfaces.
This is for converting the intensities of 2 and L3 into an electric signal and outputting the electric signal to the image processing unit 7, which will be described later. This makes it possible to capture a one-dimensional or two-dimensional optical image. The respective solid-state image pickup devices 21, 22 and 23 are adhered such that their light-receiving surfaces are in close contact with the light emission surfaces F11, F12 and F13 of the color separation prism 10.

Further, as shown in FIG. 4, temperature sensors 91, 92 and 93 for detecting respective operating temperatures are connected to the solid-state image pickup devices 21, 22 and 23, respectively. The sensor is electrically connected to the central control unit 71 (see FIG. 9) of the image processing unit 7. Further, as shown in FIG. 4, a humidity sensor 9 for detecting the water vapor pressure (or relative humidity) in the case 2 is connected in the first region of the case 2, and this humidity sensor 9 also It is electrically connected to the central control unit 71 of the image processing unit 7.

Further, as shown in FIG. 4, Peltier elements 31, 32 and 33 as cooling elements are provided on the back surfaces F21, F22 and F23 of the solid-state image pickup elements 21, 22 and 23, respectively.
Are arranged adjacent to each other. It should be noted that each solid-state image pickup device 21, 22 and 23 and each Peltier device 31, 32
A rubber block (not shown) is arranged between the solid-state image pickup device 21 and the solid-state image pickup device 23.
A metal plate (not shown) such as copper may be further arranged between the rubber block and each rubber block. In this case, the rubber blocks and the Peltier elements 31, 32 and 33 may be fixed by, for example, applying grease to the contact surfaces between them. Further, each rubber block and each metal plate may be fixed by, for example, applying grease to the contact surface between them.

FIG. 8 is a system diagram schematically showing an example of the basic structure of the Peltier device shown in FIG. As shown in FIG. 8, in these Peltier elements 31, 32 and 33, a P-type semiconductor 36 is arranged between a metal plate 34 and a metal plate 37a, and an N-type semiconductor 36 is arranged between the metal plate 34 and the metal plate 37b. Semiconductor 3
It has a basic configuration in which 5 are arranged. Furthermore, the metal plate 3
7a and 37b are electrically connected by a conducting wire 38, and a constant current source 39 is electrically arranged in series on the conducting wire 38 between the metal plates 37a and 37b.

The Peltier elements 31, 32 shown in FIG.
In accordance with the required cooling performance, 33 and 33 are a unit structure composed of the above-mentioned metal plate, P-type semiconductor, and N-type semiconductor, in which the P-type semiconductor and the N-type semiconductor are electrically connected in series, Specifically, it is configured by connecting a plurality of units in parallel.

Then, each Peltier element 31, 32 and 3
The constant current source 39 causes a direct current to flow from the metal plate 37b to the metal plate 37a through the metal plate 34, so that the metal plate 34 is interposed between the metal plate 34 and the metal plates 37a and 37b. A temperature difference that causes the metal plates 37a and 37b to have a low temperature can be generated. That is,
The Peltier elements 31, 32, and 33 are the solid-state image sensor 2
Heat h21 is pumped from 1, 22, and 23, and the metal plate 37
Each cooling block 41, 42 described later from the surface of a, 37b
And 43 to act as a heat pump that releases heat h41.

In addition, each Peltier element 31, 32 and 33
Are electrically connected to the central control unit (see FIG. 9) of the image processing unit 7, and the output of each constant current source 39 is controlled. Furthermore, each solid-state image sensor 21,
Grease is applied between the back surfaces F21, F22, F23 of 22 and 23 and the surfaces of the metal plates 37a, 37b of the Peltier elements 31, 32, 33, respectively.
2 and 23 and the respective Peltier elements 31, 32 and 33 are in close contact with each other.

As shown in FIG. 4, each Peltier element 31,
Cooling blocks 41, 42, and 43 are arranged adjacent to each other on the back surfaces of 32 and 33, respectively. In addition, each Peltier element 31, 32 and 33 and each cooling block 41, 4
Thermally conductive double-sided tapes (not shown) are respectively arranged between 2 and 43, by which the respective Peltier elements 31, 32 and 33 and the respective cooling blocks 41, 42 and 43 are fixed respectively. . Further, inside the cooling block 41, a plastically deformable heat conduction pipe (not shown) extending from one side panel of the case cover 4 is connected. The heat conduction pipes are arranged substantially parallel to the normal direction of the side panel to be connected, and the portion on the side connected to the cooling block 41 is inserted into the cooling block 41 while maintaining thermal contact. ing.

Further, a plastically deformable heat conduction pipe (not shown) is also inserted inside the cooling block 42 in a state of maintaining thermal contact, and a heat conduction pipe (not shown) also inside the cooling block 43. Are inserted while maintaining thermal contact.

Here, "plastically deformable heat conduction pipe"
Is when mounting the solid-state image sensor on the cooling block,
A member that is easily plastically deformed by a pressure (for example, 98 × 10 ^{3 to} 980 × 10 ³ Pa) applied to the contact surface between the solid-state image sensor and the cooling block without applying mechanical stress to the solid-state image sensor. In the operating temperature range (for example, −30 to 80 ° C.) of the imaging device, the plastically deformed state is maintained, and the connected cooling block can be supported to maintain its position in the case.

The cooling block 4 will be described below with reference to FIG.
1, 42 and 43, each heat conduction pipe will be described.
First, the structure of each heat transfer pipe will be described. The heat conduction pipes connect the cooling blocks 41, 42 and 43 to the case cover 4 serving as a heat radiating plate to fix the positions of the solid-state image pickup devices 21, 22 and 23 in the case 2 and the cooling blocks 41. , 42 and 43 are plastically deformable columnar members provided with a heat transfer mechanism that transfers the heat of the case 42, and 43 toward the case cover 4.

As such a heat conduction pipe, for example, a pipe formed of copper or the like as a constituent material and having a substantially circular cross section, and a working fluid (for example, water) enclosed in the pipe. It may be a so-called heat pipe composed of, or a metal pipe such as copper or a metal rod.

Next, each cooling block 41, 42 and 43
The configuration of will be described. The cooling block 41 is for absorbing the heat emitted from the Peltier element 31 and radiating the heat to the heat conduction pipe. In addition, the cooling block 42
Is for absorbing the heat emitted from the Peltier element 32 and radiating it to the heat conducting pipe. Further, the cooling block 43 is for absorbing the heat emitted from the Peltier element 33 and radiating the heat to the heat conduction pipe. Less than,
The cooling block 41 will be described as a representative.

As shown in FIG. 4, the cooling block 41 is
It is a substantially rectangular parallelepiped block, and one smooth surface of the block is in close contact with the back surface of the Peltier element 31. In addition, the cooling block 41 is formed with an insertion hole (not shown) for inserting the heat conduction pipe.

These insertion holes are substantially columnar cavities that penetrate from one surface perpendicular to the surface of the Peltier element 31 of the cooling block 41 that is in close contact with the back surface to the surface facing this surface. The insertion holes are formed so as to be substantially parallel to each other. Further, the cooling block 4 in which the insertion hole is formed
The pair of surfaces of the case cover 4 facing each other face the inner wall surfaces of the side panels of the case cover 4 facing each other.

The heat conducting pipe is attached to the case cover 4
One end is connected to at least one of the surfaces facing each other so as to allow thermal contact, and the other end is inserted into the cooling block 41. The heat conduction pipe and the side panel of the case cover 4 are connected by, for example, a fixed member (not shown) such as a screw.

Here, the size and shape of the cross section of the insertion hole are
It is set so that it can make thermal contact with the heat conduction pipe to be inserted, and it is preferable that the relationship between the size and the shape of the cross section of these insertion holes and the heat conduction pipe be so-called "fitting" between the hole and the shaft. It is set so as to be in the state of "shrink fit" in "method".

Since the heat conducting pipe can be plastically deformed, the heat conducting pipe which is plastically deformed when the color separation prism 10 is attached maintains the shape thereof during the operation of the apparatus 1 and applies a pressure to the solid-state image pickup device 21. Since it is not applied, the solid-state image sensor can be operated stably.

Here, as shown in FIG. 4, the cooling blocks 42 and 43 are different in shape from each other.
Is a prismatic block having a pentagonal cross section, and the cooling block 42 is a prismatic block having a trapezoidal cross section.
It has the same configuration as the cooling block 41 described above. Further, the cooling blocks 42 and 43 are also provided with insertion holes having the same shape as the above-mentioned insertion holes under the same arrangement condition.

The image processing section 7 shown in FIG.
The solid-state image pickup devices 21, 22 and 23, the Peltier devices 31, 32 and 33, and the electrolysis cell 8 based on the detection signals sent from the sensors 1, 92 and 93 and the detection signal sent from the humidity sensor 9. Central controller 7 for controlling output
1 (see FIG. 9). Further, the central control device 71 also activates and deactivates the fan 90 by using the temperature sensors 91, 92 and 93, the humidity sensor 9, the solid-state image pickup devices 21, 22 and 23, the Peltier devices 31, 32 and 33, respectively. It is controlled independently of the electrolysis cell 8.

Further, the image processing section 7 shown in FIG. 4 is provided with an integrating circuit (not shown) which integrates the current signals output from the solid-state image pickup devices 21, 22 and 23 and converts them into voltage values. ing. As a result, in the solid-state imaging device 1,
A current signal having a value corresponding to the incident light intensity is applied to each solid-state image sensor 2
1, 22 and 23 respectively, the voltage value corresponding to the integrated value of this current signal is output from the integrating circuit, and the incident light intensity distribution is obtained and imaged based on this voltage value.

Further, the image processing unit 7 includes the solid-state image pickup device 1
Even if the main power source (not shown) is turned off, a backup power source such as a secondary battery for performing a stop operation described later to prevent the occurrence of dew condensation is provided. The secondary battery is connected to a charge / discharge switching means (not shown) that is charged while the solid-state imaging device 1 is operating and discharges when the solid-state imaging device 1 is stopped. Is controlled by.

Further, the image processing section 7 may be provided with an A / D conversion circuit for converting the voltage value (analog value) output from the integration circuit into a digital value. In this case, the incident light intensity is obtained as a digital value, and it becomes possible to perform image processing by a computer or the like.

The central control unit 71 has a CPU, a ROM, and a RAM (none of which are shown). The CPU is composed of a microprocessor or the like and performs various kinds of arithmetic processing. A program for control / arithmetic processing is stored in the ROM in advance, and a RAM is used for reading / writing various data during the control / arithmetic processing.

Further, the central control unit 71 uses, for example, CP
It has an input / output port (not shown) connected to U. The solid-state imaging devices 21, 22, and 23 are connected to the input / output port.

The electrolysis cell 8 is connected to the input / output port via a control circuit for controlling the voltage applied to the electrolysis cell 8. Further, the Peltier elements 31, 32, and 33 are connected to the input / output port via a control circuit that controls the current flowing through these Peltier elements. Therefore, each of the solid-state image pickup devices 21, 22 and 23, the electrolysis cell 8, and each of the Peltier devices 31, 32 and 33 are given various signals generated by the arithmetic processing of the CPU via the input / output ports.

Further, at the input / output port of the central control unit 71, the temperature sensors 91, 92 and 93 provided in the respective solid-state image pickup devices 21, 22 and 23 and the humidity sensor 9 provided in the case 2 are provided. For example, they are connected via an A / D conversion circuit. Then, the detection signals generated by these temperature sensor and humidity sensor are given to the CPU.

Further, the central controller 71 has a storage device (not shown), and this storage device is connected to the CPU through an input / output port. Then, the CPU controls the operation of the solid-state imaging device 1 by accessing the storage device and using the following data stored in the storage device as needed.

In this storage device, the solid-state image pickup devices 21, 22 and 23, the Peltier devices 31, 32 and 33, and the electrolysis cell 8 are arranged with respect to the water vapor pressure in the case 2.
Data for independently controlling the start and stop timings of the are stored. In addition, the solid state image pickup devices 21, 22 and 23 and the Peltier devices 3 are included in the storage device.
After all 1, 32 and 33, and the electrolysis cell 8 are activated, data for activating them all steadily is stored.

That is, in the storage device, the condition that the water vapor pressure X1 in the case 2 is a predetermined value X0 which is equal to or lower than the saturated water vapor pressure (preferably less than the saturated water vapor pressure) at the operating temperature of each of the solid-state image pickup devices 21, 22 and 23. In order to satisfy the above, at the time of startup, the solid-state image pickup devices 21, 22 and 23 and the electrolysis cell 8 are started up before the respective Peltier devices 31, 32 and 33, and then a predetermined time has elapsed for the above conditions to be satisfied. Data for later activating each Peltier element 31, 32 and 33 is stored.

Further, in the storage device, each solid-state image pickup device 21, 22 and 23 is stored in the storage device more than the electrolysis cell 8 when stopped.
Data for stopping the Peltier elements 31, 32, and 33 first and then stopping the electrolysis cell 8 after a predetermined time when the above-described conditions are satisfied are stored.

Further, the storage device includes each Peltier element 3
By controlling the outputs of 1, 32 and 33, each solid-state image sensor 2
Data is stored for adjusting the operating temperatures of 1, 22, and 23 to a predetermined temperature equal to or lower than the external environment temperature (preferably lower than the external environment temperature).

Further, the central control unit 71 has a timer (not shown), and this timer is connected to the CPU through an input / output port.

Then, the CPU uses the temperature sensors 91, 9
Based on the temperature detection signals of 2 and 93 and the humidity detection signal of the humidity sensor 9, the respective solid-state image pickup devices 21, 22 and 2
3, electrolysis cell 8, and each Peltier element 31, 3
The control signals to be sent to 2 and 33 are generated.

By the central control unit 71 and the like configured as described above, the electrolysis cell 8, the Peltier devices 31, 32 and 33, and the solid-state image pickup devices 21, 22 and 23.
Is reliably and accurately controlled so that dew condensation does not occur in the case 2.

Next, the operation of the solid-state image pickup device 1 will be described with reference to the flow charts shown in FIGS.

First, the case where the main power source (not shown) of the solid-state image pickup device 1 is turned on to operate the image processing section 7 to start the solid-state image pickup device 1 will be described. In this case, the CPU of the central control unit 71 outputs a drive signal to each of the solid-state image pickup devices 21, 22 and 23, and also the electrolysis cell 8
The drive signal is output to (S1). In addition, this step S
At 1, the CPU of the central control unit 71 also sends a drive signal to the fan 90. In this case, each solid-state image sensor 2
The output timings of the drive signals to 1, 22 and 23 and the electrolysis cell 8 may be the same or different. Furthermore, the timing of outputting the drive signal to the fan 90 may be the same or different for each solid-state imaging device or the electrolysis cell 8.

Next, the CPU inputs the detection signal of the water vapor pressure X1 in the case 2 transmitted from the humidity sensor 9 (S2). And the data of this water vapor pressure X1,
Each solid-state image pickup device 21, 22 and 23 set in advance
And a predetermined value X0 equal to or lower than the saturated water vapor pressure at the operating temperature are compared (S3). The predetermined value X0 is not particularly limited as long as it is equal to or lower than the saturated water vapor pressure at the operating temperature of each of the solid-state imaging devices 21, 22 and 23. For example, when the operating temperature is 0 ° C., the predetermined value X0 is 61P.
It is preferably a or less (10% or less when expressed in relative humidity).

Here, when the water vapor pressure X1 in the case 2 is larger than the above-mentioned predetermined value X0, the water vapor pressure X1 in the case 2 is not yet sufficiently reduced, and each Peltier element 31,
When it is determined that dew condensation may occur when 32 and 33 are activated, each Peltier element 31, 32 and 33 is not activated, and the electrolysis cell 8 and each Peltier element 31,
The operation state of 32 and 33 is maintained as it is, and step S2 and step S3 are repeated again.

On the other hand, when the water vapor pressure X1 in the case 2 is equal to or less than the above-mentioned predetermined value X0, each Peltier element 31,
It is determined that there is no risk of dew condensation even if 32 and 33 are activated, and the CPU sends a drive signal to each Peltier element 31, 32 and 33 (S4). As a result, the respective Peltier elements 31, 32 and 33 cool the respective solid-state image pickup elements 21, 22 and 23 and gradually adjust them to desired operating temperatures.

When each of the solid-state image pickup elements 21, 22 and 23 has reached a desired operating temperature, it is determined that the steady-state operating state has been reached, and the CPU responds to the load request and the whole solid-state image pickup device responds. Based on the data for steadily operating the solid-state image pickup device, new drive signals are sent to the solid-state image pickup devices 21, 22 and 2 respectively.
3, the Peltier elements 31, 32 and 33, and the electrolysis cell 8 are transmitted to start balanced control of the entire solid-state imaging device 1 (S5).

Next, a case where the main power source (not shown) of the solid-state image pickup device 1 is turned off to stop the solid-state image pickup device 1 will be described. In this case, the central controller 71 is operated by the backup power source such as the secondary battery described above.
Then, the CPU of the central control unit 71 controls the solid-state image sensor 2
1, 22 and 23, each Peltier element 31, 32 and 3
3 and the stop signal is output to the fan 90 to stop these operations (S6).

At this time, the CPU sends a drive signal to the timer to activate the timer, and the CPU of the central control unit 71 causes the solid-state image pickup elements 21, 22 and 23, and the CPU.
The elapsed time from immediately after the stop of each of the Peltier elements 31, 32 and 33 is counted. In this case, the respective solid-state image pickup devices 21, 22 and 23 and the respective Peltier devices 31, 32 and 33 may be stopped at the same timing, or any of them may be stopped first. Furthermore, the timing of stopping the fan 90 may be the same or different for each solid-state imaging device or each Peltier device.

Next, when it is confirmed by the timer that a predetermined time has passed and the temperature of each of the solid-state image pickup devices 21, 22, and 23 is sufficiently raised to prevent dew condensation, the CPU of the central control unit 71 Sends a stop signal to the electrolysis cell 8 (S7). The fan 90 may not be stopped in step S6, but the fan 90 may be stopped in step S7. Also in this case, the timing of stopping the fan 90 may be the same or different for the electrolysis cell 8.

Here, each solid-state image pickup device 21, 22 and 2
Since 3 is operating at a predetermined temperature below the external environment temperature,
After the execution of step S6, the solid-state imaging devices 21 and 22 are
The temperature of 23 and 23 usually rises to the same value as the external environment temperature. Therefore, although the dew condensation is unlikely to occur, the dew condensation can be reliably prevented by delaying the stop timing of the electrolysis cell in step S7.

It should be noted that execution of step S6 to step 7
The time until the execution of is a time determined in advance by experiments or the like. The data of this time is stored in the storage device of the central control unit 71, and the CPU accesses the storage device to read and use it when executing steps 6 and 7.

In addition, each solid-state image pickup device 21, 22 and 23
Is monitored by the temperature sensors 91, 92 and 93, and from the execution of step S6, the solid-state imaging devices 21, 22
Further, a step of confirming whether or not the temperatures of 23 and 23 have risen to a predetermined temperature is further provided between the execution of step S6 and the execution of step 7, and the temperature of each solid-state image pickup device 21, 22 and 23 is set to a predetermined value. It may be set to execute step 7 when the temperature rises. In this case, the timer may be used to count the time, or the timer may not be used to count the time and the CPU may be configured to determine whether or not to execute step 7 based only on the temperature change.

Further, the water vapor pressure in the case after execution of S6 is monitored by the humidity sensor 9, and the water vapor pressure in the case 2 is equal to or lower than the saturated vapor pressure at the external environment temperature (preferably less than the saturated vapor pressure at the external environment temperature). Is further provided between the execution of step S6 and the execution of step 7, and the water vapor pressure in case 2 is equal to or lower than the saturated vapor pressure of the external environment temperature (preferably saturated vapor of the external environment temperature). The setting may be such that step 7 is executed only when the pressure is less than the pressure. Also in this case, the timer may count the time, or the timer may not count the time and the CPU may determine whether or not to execute step 7 based only on the temperature change. Good.

[Second Embodiment] Hereinafter, FIGS. 12 and 13 will be described.
A second embodiment of the solid-state imaging device of the present invention will be described with reference to FIG. The same elements as those described in the above-described first embodiment are designated by the same reference numerals, and overlapping description will be omitted. FIG. 12 is a front view showing a second embodiment of the solid-state imaging device of the present invention. FIG.
FIG. 13 is an exploded perspective view for schematically explaining a fluid flow generated in a fluid flow path when the solid-state imaging device shown in FIG. 12 is operated.

The solid-state image pickup device 1A shown in FIG. 12 has the same structure as the solid-state image pickup device 1 shown in FIG. 1 except that the number of fluid channels formed in the side panel and the sectional shape are different.

As shown in FIG. 12, in the inner region between the inner wall surface and the outer wall surface of one side panel of the case cover 4, the fluid passages 103, 104, 105 having a substantially circular cross section are formed.
Are formed at predetermined intervals. Also, the case cover 4
In the inner region between the inner wall surface and the outer wall surface of the other side panel of the above, the fluid channels 106, 107, 1 having the same cross-sectional shape and size as the above-described fluid channels 103, 104, 105.
08 is formed.

As shown in FIG. 12, a suction port H of the fluid flow path 103 for sucking the fluid existing outside the case 2.
103 is formed on the side surface of the side panel on the front panel 3a side. Moreover, the fluid flow path 103 is formed so as to extend in the direction substantially parallel to the normal direction of the front panel 3a from the front panel 3a side to the back panel side in the inner region of the side panel. Further, the fluid channel 103
Is bent in a substantially L shape toward the inside of the second region at the side panel portion that defines the manifold portion, and the inside of the side panel that contacts the second region (internal passage of the manifold portion) A discharge port H101A for discharging the fluid to the second region is formed on the wall surface. The description of the other fluid flow paths 104 to 108 is omitted because it is the same as that of the fluid flow path 103.

FIG. 1 shows the case of operating the fan 90.
3, the fluid channel 103 will be described as an example.
By operating 0, a fluid flow f103 is generated in the fluid channel 103, the fluid outside the solid-state imaging device 1 is forcibly introduced into the fluid channel 101 from the suction port H101, and heat exchange with the case 2 is performed. Exhaust port H1 while cooling case 2
03A (not shown). And
The fluid discharged from the exhaust port H103A to the second region is electrolyzed with the fluid discharged from the exhaust port H104A to the exhaust port H108A (none of them are shown) of the other fluid flow paths 104 to 108 to the second region. The reaction product such as water and hydrogen discharged from the cell 8 is sucked into the fan 90, and the rear panel 3
It is discharged to the outside from the discharge hole H100 of b. Also, another fluid flow path 104 in the case of operating the fan 90
The flow of the fluid in 108 is the same as above.

[Third Embodiment] The third embodiment of the solid-state imaging device of the present invention will be described below with reference to FIG. The same elements as those described in the above-described first embodiment are designated by the same reference numerals, and overlapping description will be omitted. FIG. 14 is a front view showing a third embodiment of the solid-state imaging device of the present invention.

The solid-state image pickup device 1B shown in FIG. 14 is the same as the solid-state image pickup device 1 shown in FIG. 1 except that a fluid passage similar to that of the side panel is formed on the top panel as well as the side panel. Have a configuration.

By providing the fluid passages 109 in the top panel in addition to the fluid passages 101 and 102 formed in the side panel, the case 2 can be cooled more efficiently.

Although the preferred embodiments of the present invention have been described in detail above, the present invention is not limited to the above embodiments.

For example, in the present invention, the formation position of the fluid flow path is not particularly limited as long as it is an internal region between the inner wall surface and the outer wall surface of the case. Further, in the present invention, the cross-sectional shape and size of the fluid channel are not particularly limited. Further, a switch that allows the user to freely select and start only the fan during the operation of the solid-state imaging device may be provided. In addition, in the above-described embodiment, the cooling blocks 41, 42, and 43 are fixed to the case 2 by the heat conduction pipes, but the cooling blocks 41, 42, and 43 are not used. Case 2 (for example, case cover 4) by screwing
It may be fixed to.

Further, for example, when the above-mentioned solid-state image pickup device 1 is started, after the execution of step S1, the time until the water vapor pressure X1 in the case 2 becomes equal to or less than the above-mentioned predetermined value X0 is grasped in advance. , In step S1, the CPU activates a timer so that the solid-state image pickup devices 21, 22 and 2 are activated.
It is also possible to set the time after the start of both 3 and the electrolysis cell 8 to be counted, and to execute step S4 after a predetermined time has elapsed.

Further, in the above embodiment, the case where the Peltier element is used as the cooling element has been described, but the cooling element used in the solid-state imaging device and the method for operating the solid-state imaging device of the present invention is not particularly limited to this. Not something. For example, a Stirling cycle engine may be used.

As the cooling element, for example, a heat-conductive container containing a cooling medium such as water or liquid nitrogen, and a cooling medium whose temperature has risen in the container are taken out of the container and have a low temperature. And a cooling medium circulating means for supplying the cooling medium into the container, and cooling the container by directly contacting the container with the solid-state imaging device or indirectly contacting the container with a predetermined thermally conductive member. May be adopted.

[0146]

As described above, according to the solid-state image pickup device of the present invention, the solid-state image pickup element can be stably operated at a predetermined temperature even when it is used in various postures, and it is easily compact. Can be realized.

[Brief description of drawings]

FIG. 1 is a perspective view showing a first embodiment of a solid-state imaging device of the present invention.

FIG. 2 is a front view of the solid-state imaging device shown in FIG.

FIG. 3 is a rear view of the solid-state imaging device shown in FIG.

4 is a cross-sectional view showing an example of a schematic basic configuration of a solid-state imaging device taken along line IV-IV in FIG.

5 is a cross-sectional view showing a schematic configuration of a portion near a discharge port of a fluid channel of the solid-state imaging device, taken along line VV in FIG.

FIG. 6 is an exploded perspective view for schematically explaining a fluid flow generated in a fluid flow path when the solid-state imaging device shown in FIG. 1 is operated.

7 is a cross-sectional view schematically showing an example of a basic configuration of an electrolysis cell provided in the solid-state imaging device shown in FIG.

8 is a system diagram schematically showing an example of a basic configuration of the Peltier device shown in FIG.

9 is a control block diagram of the solid-state imaging device shown in FIG.

10 is a flow chart for explaining an example of a control procedure of the solid-state imaging device shown in FIG.

11 is another flowchart for explaining an example of a control procedure of the solid-state imaging device shown in FIG.

FIG. 12 is a front view showing a second embodiment of the solid-state imaging device of the present invention.

13 is an exploded perspective view for schematically explaining a fluid flow generated in a fluid channel when the solid-state imaging device shown in FIG. 12 is operated.

FIG. 14 is a front view showing a third embodiment of the solid-state imaging device of the present invention.

[Description of Reference Signs] 1, 1A, 1B ... Solid-state imaging device, 2 ... Case, 3 ...
Case body, 3a ... front panel, 3b ... rear panel,
3c ... bottom panel, 4 ... case cover, 5 ... lens attachment part, 6 ... cover glass, 7 ... image processing part, 8 ... electrolysis cell, 9 ... humidity Sensor, 10 ... Color separation prism, 11, 12, 13 ... Color component optical path, 2
1, 22, 23 ... Solid-state image sensor, 31, 32, 33 ...
Peltier element, 34 ... Metal plate, 35 ... N-type semiconductor, 3
6 ... p-type semiconductor, 37a, 37b ... metal plate, 38 ...
Closed circuit, 39 ... Constant current power source, 41, 42, 43 ... Cooling block, 71 ... Central control unit, 81 ... Anode, 8
2 ... Cathode, 83 ... Polymer electrolyte membrane, 84 ... Power supply part, 85, 86 ... Outer frame member, 87 ... Screw, 90 ... Fan, 101, 102, 103, 104, 105, 10
6, 107, 108, 109 ... Fluid flow path, F10 ... Light receiving surface of color separation prism, F11, F12, F13 ... Light emitting surface of color separation prism, F21, F22, F23 ...
The back surface of the solid-state image sensor, f101, f102, f103,
f104, f105, f106, f107, f108 ...
.Fluid flow, H101, H102, H103, H104,
H105, H106, H107, H108, H109 ...
・ Suction port, H101A, H102A ... Discharge port, H100
... Exhaust hole, L10 ... Incident light, L1, L2, L3 ... Color component optical path, H2 ... Opening part, h3, h21, h41 ... Heat.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05K 7/20 H05K 7/20 HS SF term (reference) 3L044 AA04 BA06 CA13 HA01 HA02 JA01 JA02 KA02 KA03 KA04 KA06 5C022 AB39 AB40 AC51 AC69 AC73 5C065 BB48 CC01 DD02 EE01 FF10 GG32 5E322 AA01 AB10 BA01 BA03 BB03 DB08 DC01 FA04

Claims (17)

[Claims] 1. A solid-state image sensor for photoelectrically converting light, an opening for collecting the light, and a case for accommodating the solid-state image sensor, the solid-state image sensor and an inner wall surface of the case. Between the inner wall surface and the outer wall surface of the case, the heat conducting member being arranged in a state of maintaining thermal contact between the case and the heat absorbing member that absorbs heat generated in the solid-state imaging device and transfers the heat toward the case. Is formed in an inner region between the case and has an inlet for sucking a fluid existing outside the case and an outlet for discharging the fluid to the outside of the case, and between the case and the fluid. At least one fluid flow path for cooling the case by heat exchange, and a fluid for moving the fluid in the at least one fluid flow path from the suction port toward the discharge port Generate a flow The solid-state imaging device, characterized in that it comprises a fan, a. 2. The solid-state imaging device according to claim 1, wherein a radiation fin is formed on the outer wall surface of the case. 3. The solid-state imaging device according to claim 1, wherein the fan is arranged in the vicinity of the discharge port of the at least one fluid flow path. 4. A first connection port connected to the fan and opened to the outside, and a first connection port provided for each of the discharge ports of the at least one fluid flow path and connected to the discharge port. A manifold portion having an internal passage having two connection ports is formed, and the fluid discharged from the discharge port is discharged to the outside through the internal passage of the manifold portion. The solid-state imaging device according to claim 3, which is characterized in that. 5. The solid-state imaging device according to claim 1, wherein the fan is arranged in the vicinity of the suction port of the at least one fluid flow path. 6. A first connection port to which the fan is connected and open to the outside, and a first connection port which is provided for each of the suction ports of the at least one fluid flow path and is connected to the suction port. A manifold part having an internal passage having two connection ports is further provided, and the fluid sucked from the suction port flows through the internal passage of the manifold part to the at least one fluid flow. The solid-state imaging device according to claim 5, wherein the solid-state imaging device is allowed to flow into the road. 7. The case has a substantially rectangular parallelepiped shape, and mounts a front panel provided with the opening, a rear panel arranged to face the front panel, and the solid-state imaging devices. A bottom panel to be placed, a top panel arranged to face the bottom panel, and two side panels facing each other. The inside of the case is located between the front panel and the back panel. A partition panel that divides the area into a first area on the front panel side and a second area on the back panel side is disposed, and the manifold section that defines the second area as the internal passage is defined. In the region, the solid-state image sensor and the heat conducting member are arranged, and at least one of the side panels has a small number of the fluid flow paths extending from the front panel side toward the back panel side. One of them is formed, the suction port of the fluid channel is provided on the outer wall surface of the side panel on the front panel side, and the discharge port of the fluid channel is the second panel of the side panel. It is provided on the inner wall surface on the region side, the first connection port of the manifold section is provided on the back panel, and the fan is provided on the second region side of the first connection port. The solid-state imaging device according to claim 4, wherein the solid-state imaging device is arranged. 8. The at least one fluid passage extending from the front panel side toward the back panel side is formed in the upper panel, and an inlet port of the fluid passage is formed in the upper panel. 8. The outer wall surface on the front panel side is provided, and the discharge port of the fluid flow path is provided on an inner wall surface on the second region side of the side panel. Solid-state imaging device. 9. The case comprises a case body and a case cover detachably attached to the case body, wherein the case body includes the front panel, the back panel, and the bottom panel. 9. The case cover is configured such that the two side panels and an upper panel that faces the bottom panel are integrated with each other in the case cover. Solid-state imaging device. 10. A light receiving surface for receiving the light collected from the opening of the case, wherein the light incident from the light receiving surface is decomposed into light of a plurality of color components and the light of each color component is separated. Further provided is a color separation prism that emits light from the light emitting surface, and the solid-state imaging device for photoelectrically converting the light of each color component emitted from each light emitting surface is the light emitting surface. The solid-state imaging device according to claim 1, wherein the solid-state imaging device is provided for each. 11. The solid-state imaging device according to claim 1, wherein a cooling element is further arranged between the solid-state imaging element and the heat conducting member. 12. An electrolysis cell for promoting an electrochemical oxidative decomposition reaction of water vapor in the case, and an operating temperature of the solid-state image sensor by controlling an output of the cooling element to a predetermined temperature equal to or lower than an external environmental temperature. And to satisfy the condition that the water vapor pressure in the case is a predetermined value equal to or lower than the saturated water vapor pressure at the operating temperature, the start and stop of the solid-state imaging device, the cooling element and the electrolysis cell The solid-state imaging device according to claim 11, further comprising: a control device that controls timings independently. 13. The control device, when stopped, stops the solid-state imaging device and the cooling element before the electrolysis cell, and then stops the electrolysis cell after a predetermined time when the condition is satisfied. The solid-state imaging device according to claim 12, wherein 14. A humidity sensor for detecting the water vapor pressure in the case is further provided, and the controller controls the solid-state imaging device and the cooling device based on the water vapor pressure detected by the humidity sensor. 13. The start and stop timings of the element and the electrolysis cell are controlled independently of each other.
3. The solid-state imaging device according to item 3. 15. A temperature sensor for detecting the temperature of the solid-state image sensor is further provided, and the control device, based on the temperature of the solid-state image sensor detected by the temperature sensor, the solid-state image sensor, 13. The start and stop timings of the cooling element and the electrolysis cell are independently controlled, and the output of the cooling element after startup is controlled.
15. The solid-state imaging device according to any one of 14 to 14. 16. The electrolysis cell includes an anode that is a gas diffusion electrode, a cathode that is a gas diffusion electrode, a polymer electrolyte membrane disposed between the anode and the cathode, the anode and the cathode. The solid-state imaging device according to any one of claims 12 to 15, further comprising: a voltage applying unit that applies a predetermined voltage between and. 17. The solid-state imaging device according to claim 12, wherein the partition panel is the electrolysis cell.