JP2003229383A - Dicing device and dicing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a dicing device and a dicing method which do not cause inconveniences in alignment or processing accuracy upon inclined trench processing or inclined cutting processing, nor increases the processing time. <P>SOLUTION: A dicing device has a spindle 22 for rotating by holding a blade 21 at a top end and a work table 23 for mounting horizontally a workpiece W. In the dicing device, the spindle 22 and the work table 23 relatively carry out a notching feed in a Z direction as a vertical direction, a grinding feed in an X direction as a horizontal direction and an indexing feed in a Y direction perpendicular to the X direction and the Z direction. The spindle 22 is provided so that the axis thereof is inclined in a YZ plane. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dicing apparatus for grooving or cutting a work such as a semiconductor or an electronic component material, and more particularly to a dicing apparatus for dicing a groove or cutting a work. It is about the method.

[0002]

2. Description of the Related Art In a dicing device for grooving or cutting a work such as a semiconductor or electronic component material, a work is processed by applying a grinding water or a cooling water with a thin grindstone called a blade rotating at a high speed. In this dicing device, the spindle holding the blade is index-feeded in the Y-axis direction and cut-feeded in the Z-axis direction, and the work table on which the work is placed is ground-feeded in the X-direction. Also, in this dicing device,
The spindle holding the blade is provided horizontally in the Y-axis direction, and the blade is rotated in a vertical plane to process the workpiece.

However, not all of the grooving and cutting of the work are performed vertically, and some of them are wafers and planars which are one type of image sensor and cut at an angle of 2 to 5 degrees with respect to a vertical plane. There is a work that is tilted with respect to a vertical surface, such as a process of forming an inclined groove in a die transistor wafer.

In the case of processing such a work, in the conventional dicing apparatus, as shown in FIG. 6, for example, as shown in FIG. 6, a blade 121 mounted on a horizontally provided spindle 122 and rotating in a vertical plane has a special shape. Tilt table 1
The work W was placed on No. 26, and the work W was inclined and processed. The tilt table 126 is configured such that the work table 123 and the θ rotation table 124 are tilted by a tilt mechanism.

[0005]

Therefore, when the work W is aligned, the work table 123 is kept horizontal, and when the alignment is completed, the work table 123 is tilted by a required angle or the alignment microscope is moved up and down. While doing the alignment,
In addition to being complicated, the alignment accuracy and the positioning accuracy of the processing position are low, which is a problem. Further, the depth of cut must be corrected for each machining line, which leads to a decrease in precision of cutting and an increase in machining time, which is also a problem.

The present invention has been made in view of such circumstances, and in performing inclined groove processing and inclined cutting processing,
An object of the present invention is to provide a dicing apparatus and a dicing method that do not cause inconvenience in alignment and processing accuracy and do not increase processing time.

[0007]

In order to achieve the above-mentioned object, the present invention provides a dicing apparatus for carrying out groove processing or cutting processing on a work by a rotating blade, wherein the blade is And a work table on which the work is placed horizontally. The spindle and the work table are relatively relative to each other in the Z direction, which is a vertical direction, and the feed is horizontal. In the dicing device in which the grinding feed in the X direction, which is the direction, and the index feed in the Y direction orthogonal to the X and Z directions are performed, the axis of the spindle is provided to be inclined in the YZ plane. It has a feature. According to this invention, since the spindle to which the blade is attached is provided in an inclined manner, it is possible to perform the inclination groove processing and the inclination cutting while holding the work horizontally.

According to a second aspect of the present invention, there is provided a dicing method in which the dicing apparatus according to the first aspect is used to perform a slant groove machining or a slant cutting process on a work. The blade is characterized in that the tip position of the blade is position-corrected in the Y direction by the amount of displacement in the Y direction corresponding to the cutting depth. According to the present invention, the tip position of the blade is corrected in the Y direction according to the cutting depth, so that the inclined groove can be formed at the correct position.

Further, the invention described in claim 3 is the same as claim 2
In the invention, the inclined groove processing and the inclined cutting processing are divided into a plurality of steps, and when the first step is processed, the tip position of the blade is position-corrected in the Y direction according to the cutting depth of the first step, and the blade is processed. At the time of machining the second step, the position is corrected according to the cutting depth of the second step, and the position correction is carried out in the same manner until the final step. The feature is that the work is performed and the work is inclined. According to this invention, when the multi-step grinding is performed by dividing the inclined groove processing or the inclined cutting processing into a plurality of steps, the tip position of the blade is corrected each time according to the remarkable cutting depth, so that the multi-step grinding can be performed accurately. You can do it well.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of a dicing apparatus and a dicing method according to the present invention will be described below in detail with reference to the accompanying drawings. In each drawing, the same members are given the same numbers or reference numerals.

First, the structure of the dicing apparatus according to the present invention will be described. FIG. 1 is a perspective view showing a processing portion of a dicing apparatus according to the present invention. Dicing machine 1
In addition to the processing unit shown in FIG. 1, 0 is composed of a spin cleaning device, a transfer device, a load port, a microscope, an alignment device, a monitor TV, an operation / display unit, an indicator lamp, a controller and the like, which are not shown. The processing portion is a portion that performs groove processing and cutting processing on the work. The spin cleaning device is a device for cleaning the processed work, and sprays cleaning water while rotating the work to remove contaminants adhering to the work. The transfer device is a device that transfers a work to each part of the dicing device, and the load port is a part that transfers a cassette containing a large number of works to the outside of the dicing device.

The microscope is a member for observing the surface of the work in order to evaluate the alignment and the processing state of the work, and the observed image can be observed on the screen of the monitor television via the CCD camera. The alignment device processes the pattern image on the surface of the work to automatically align the work. The operation / display unit is provided with switches and display means for operating each unit of the dicing device 10. The controller is a part that controls each operation of the dicing device 10, and is composed of a microprocessor, a memory, an input / output circuit and the like, and is stored inside a pedestal (not shown) of the dicing device 10. The indicator light is for displaying the operation of the dicing device 10, the end of processing, the standby, an alarm, etc., and is provided at a high position so that it can be seen from a distance.

As shown in FIG. 1, in the processing section of the dicing apparatus 10, rotary blades 21 for performing groove processing and cutting processing of a work are arranged opposite to each other, and two air bearing spindles 22 with built-in high frequency motors are provided. , 22 respectively, 30,000rpm-60,000r
It is rotated at a high speed of pm. The rotary blade 21 has a thin disk shape, and an electrodeposition blade in which diamond abrasive grains or CBN abrasive grains are electrodeposited with nickel or a resin blade in which resin is bonded is used. Further, grinding water is supplied to the rotary blade 21 from a grinding nozzle (not shown) to a processing point.

Further, the Y guide base 31 is provided in this processing portion.
There is a Y guide rail 32 on the Y guide base 31,
32 is provided, and the two Y tables 33, 33 are guided in the Y direction by the common Y guide rails 32, 32, and are independently index-fed in the Y direction by a drive mechanism (not shown). There is. Further, each Y table 33, 33 is provided with a Z table 42 guided by Z guide rails 41, 41 and cut and fed in the Z direction by a drive mechanism (not shown). The spindles 22 are attached to the respective Z tables 42 so as to face each other via the tilting mechanism 26. The tilting mechanism 26 is capable of tilting the spindle 22 at an arbitrary angle with respect to the horizontal direction. With such a mechanism, the blades 21 attached to the respective spindles 22 are independently rotated, indexed in the Y direction, and indexed in the Z direction.

Below the spindles 22, 22, an X table 25 is ground and fed in the X direction by a mechanism (not shown).
Is provided, the θ table 24 that rotates in the θ direction in the drawing is placed on the X table 25, and the work table 23 is connected to the θ table 24. The workpiece to be processed is adsorbed and fixed on the upper surface of the work table 23, is rotated by θ by the θ table 24, and is rotated by the X table 25.
By means of grinding feed in the direction of arrow X in the figure.

Next, the operation of the processing portion of the dicing apparatus 10 thus constructed will be described. Since the operation of the entire dicing device 10 is known, the description thereof will be omitted. In the processing section, two spindles 22, 22
Is adjusted to a predetermined inclination angle by the inclination means 26, 26 and fixed to the Z tables 42, 42.
The workpiece to be processed is sucked and placed on the work table 23, and is aligned by an alignment device (not shown) so that the processing line coincides with the X direction. Next, each blade 21, 21 is attached to its respective spindle 22, 22
The Y table 33 is rotated at a high speed and is positioned at the processing position by the index feed of the Y table 33, and is positioned at the required cutting position by the feed feed of the Z table 42.

The work to be processed here is the X table 25.
By the method, the grinding feed is performed in the direction of arrow X in the figure, and two inclined grooves are simultaneously processed. Next, the blades 21 and 21 are index-fed to the next processing position, respectively, and the next two inclined grooves are processed. When all lines are processed in this way, the work is rotated 90 ° by the θ table 24,
A line orthogonal to the above line is processed in the same manner.

FIG. 2 is a diagram conceptually showing this state. The blades 21 and 21 are vertically positioned downward from the position shown in the drawing by a cutting amount t, and the work W is ground and fed in a direction perpendicular to the paper surface, and is inclined. Figure 3
Represents the work W that has been subjected to the inclined cutting in this way. FIG. 3A shows a state in which four surfaces are cut obliquely, and FIG. 3B shows a work W in which two surfaces are cut obliquely and the other two surfaces are cut vertically.

Next, a description will be given of the position correction of the blade 21 in the Y direction when performing the inclination processing using the dicing apparatus 10 according to the present invention. FIG. 4 is a conceptual diagram when the work W is cut obliquely. As shown in FIG. 4, in the groove processing, a cut is made from the central portion A of the street S between the pattern surfaces of the work W. Therefore, in the case of a normal vertical groove, the groove processing may be performed by positioning the tip of the blade 21 at the central portion A of the street S.

However, in the case of the slant processing as shown in FIG. 4, the blade 21 is slanted with respect to the vertical plane and is vertically fed by the slit amount t as it is, and from that position to the work W in the direction perpendicular to the paper surface. Be cut into. Therefore, the blade 21 is positioned at the central portion A of the street S.
The position is corrected by a distance Y from the position.
Let θ be the angle of inclination of the blade 21 from the vertical plane, and work W
Where the thickness (vertical component of the depth of cut) is t, the correction amount Y in the Y direction of the blade 21 is calculated by the following equation (1).

[0021]

[Formula 1] Y = t tan θ (1) Required by.

Next, a case where the work W is divided into a plurality of stages and a multi-stage cut is performed will be described. When performing groove processing or cutting processing on the work W, the grinding groove may be formed in a plurality of stages in order to reduce the grinding load. Further, in order to suppress chipping between the front surface and the back surface of the workpiece W, shallow grooving is performed on the surface, then the middle portion is thickly ground, and finally, the removal side of the blade 21 on the back surface is finished by shallow grinding. Multi-stage cutting is performed by various methods, such as first using a blade of No. 1 to grind a V-shaped groove with a V-shaped blade, and then grinding the inside of the V groove with a thin blade.

The correction of the position of the blade 21 in the Y direction when such a multi-step cut is performed in the inclined groove will be described with reference to FIG. FIG. 5 shows a state in which the work W is cut by the blade 21 into three inclined grooves each having an angle θ. In the processing of the first step, the cutting amount is set to t _1, and the cutting edge of the blade 21 is positioned by being corrected by the distance Y ₁ from the central portion A of the street S, and the groove processing of the first step is performed at this position. Next, the blade 21 is position-corrected to a position distant from this correction position by Y ₂ and the cutting amount t ₂ is given, and the groove processing of the second stage is performed. Further, the blade 21 is Y from this position.
_The position is corrected to a position separated by ₃ and the final ₃ at the cutting amount t 3.
The step is processed. At this time, the Y direction position correction amounts Y ₁ , Y ₂ and Y ₃ of the respective stages of the blade 21 are expressed by the following equations (2), (3),
(4)

[0024]

(2) Y ₁ = t ₁ tan θ (2) Y ₂ = t ₂ tan θ (3) Y ₃ = t ₃ tan θ (4)

As described above, even in the multi-step processing of the inclined groove, the position of the blade 21 is corrected for each step according to the cutting depth of each step, so that the same groove can be accurately stepped in multiple steps. It can be processed separately. Further, in the present embodiment, since the inclination processing is performed by using the two spindles 22, 22 which are arranged to face each other and are independently fed in the Y and Z directions, the inclination processing is performed in different inclination directions. The groove can be formed without rotating the work W by 180 °. Further, the present invention can be applied to various machining variations such as the proper use of the two spindles 22, 22 when one direction is inclined cutting and the other direction is vertical cutting.

In this embodiment, two spindles 2 are used.
Although the dicing apparatus 10 having 2 and 22 is shown, it may be a conventional single spindle apparatus. Further, the vertical component t of the cut amount is used in the calculation of the Y direction position correction amount Y of the blade 21, but it may be calculated using the cut amount in the tilt direction. In this case, Equations 1 to
In place of tan θ in Equation 4, sin θ is used.

[0027]

As described above, according to the present invention, since the spindle to which the blade of the dicing device is attached is provided in an inclined manner, the inclined groove is machined and inclined while the work is held horizontally. The cutting can be done.
Therefore, there is no inconvenience in alignment and processing accuracy, and processing time is not increased. Further, since the tip position of the blade is corrected in the Y direction according to the cutting depth, the inclined groove can be formed at the correct position. Further, when performing the multi-stage grinding by dividing the inclined groove processing or the inclined cutting processing into a plurality of steps, the tip position of the blade is corrected each time according to the remarkable depth of cut, so that the multi-step grinding can be performed accurately. .

[Brief description of drawings]

FIG. 1 is a perspective view showing a structure of a processing portion of a dicing device according to an embodiment of the present invention.

FIG. 2 is a conceptual diagram illustrating tilt processing.

FIG. 3 is a perspective view showing a work obtained by a slant cutting process.

FIG. 4 is a conceptual diagram illustrating a blade position correction amount during tilt processing.

FIG. 5 is a conceptual diagram for explaining a blade position correction amount at the time of inclined multi-step machining.

FIG. 6 is a side view showing a conventional dicing device.

[Explanation of symbols]

10 ... Dicing apparatus, 21 ... blade, 22 ... spindle, 23 ... work table, the central portion of the A ... Street, S ... _{Street, t · t 1 · t 2} · t 3 ... depth of cut, Y · Y ₁ · Y ₂・ Y ₃ … correction amount, W… work, θ…
Inclination angle

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Takayuki Kaneko             9-7 Shimorenjaku, Mitaka City, Tokyo Stocks             Company Tokyo Seimitsu

Claims (3)

[Claims] 1. A dicing apparatus for performing groove processing and cutting processing on a work with a rotating blade, comprising a spindle which holds the blade at its tip and rotates.
A work table for horizontally mounting the work,
Relative to the spindle and the work table, the Z direction feed is vertical and the X direction is horizontal.
In a dicing device that performs a grinding feed in the X-direction and an index feed in the Y-direction that is orthogonal to the X-direction and the Z-direction, the axis of the spindle is inclined in the YZ plane. apparatus. 2. A dicing method for performing inclined groove processing or inclined cutting processing on a workpiece using the dicing apparatus according to claim 1, wherein the tip position of the blade corresponds to the cutting depth due to the inclination of the spindle. The dicing method is characterized in that the tip position of the blade is position-corrected in the Y direction by the amount deviated in the Y direction. 3. The inclined groove processing or the inclined cutting processing is divided into a plurality of steps, and when the first step is processed, the tip position of the blade is position-corrected in the Y direction according to the cutting depth of the first step. However, at the time of machining the second step, the position correction is performed according to the depth of cut of the second step, and the above steps are similarly performed until the final stage of machining. The dicing method according to claim 2, wherein the work is tilted.