JP2003225858A - Polishing pad tool and nc grinding machine using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a polishing pad tool and a grinding machine using the same capable of improving quality and reducing cost due to the integration of processes by bringing a polishing process as a post process into a grinding machine. <P>SOLUTION: The polishing pad tool is composed of a pad holder 2 holding a polishing pad 5, a tapered shank part 3b fitting in a main shaft tapered hole 16, a tool holder 3 including a gripping part 3a which an arm of an ATC device grips, and a pull stud 4 as an engaging part in pulling up and jointing a main shaft 24. The pad holder 2 has a pad 5 formed in a disk shape or a donut shape arranged on a holder as one body. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a semiconductor wafer,
The present invention relates to a polishing tool for surface finishing an electronic component such as an aluminum hard disk and a glass hard disk, and an optical component with high quality and ultra precision.

[0002]

2. Description of the Related Art Surface processing of electronic parts and optical parts is performed by polishing. For polishing processing,
High degree of shape accuracy such as flatness, parallelism, and surface roughness is required. Superabrasive grains are used for the polishing process, and a polishing machine having a surface plate formed into a flatter shape is used.

Before describing a polishing machine, an NC grinder 30 with an ATC device which is in charge of pretreatment will be briefly described. FIG. 6 shows a conventional automatic tool change (hereinafter, ATC
It is a schematic diagram showing the left side surface of the NC grinder with a device). As shown in FIG. 6, NC grinder 30 with ATC device
Is composed of a headstock 20, a rotary table device 40 placed on the bed 11, an automatic tool changing device 50, and a tool stocker 60. The headstock 20 has a frame 12 fixed to an upper portion of a bed 11. The headstock 20 is
A Z1 axis headstock lifting mechanism for moving the headstock 20 up and down by driving the lifting motor 21 is provided, and similarly, an X1 axis for moving the headstock 20 in the front-back (right and left in FIG. 6) direction. The moving mechanism is provided. Further, the spindle head 26 has a built-in clamp mechanism for fixing a tool for automatic tool change such as the roughing grindstone tool 23,
A spindle 24 for rotating the tool and a rotating mechanism such as a built-in motor 25 are provided. The finishing grindstone tool 22 is directly fixed to the lower end surface of the spindle 24.

The turntable device 40 is provided on the bed 11 with a semiconductor wafer WH, which is one of electronic components, for example.
A device for fixing and rotating (also called a work W) is provided. The table top surface of the rotary table 41 is a suction surface provided with a porous suction pad, and air is blown through the fine holes so as to prevent lifting during processing and allow processing to a uniform thickness. It is a vacuum chuck for extracting.

The automatic tool changer 50 (hereinafter referred to as the ATC device) has a rear portion of the rotary table 41 (on the left side in FIG. 6).
And an ATC device elevating mechanism for moving the arms 51 and 52 of the ATC device 50 up and down (Z2 axis) by driving the elevating motor, and the ATC device 50 is indexed at an arbitrary angle. A swivel device capable of swiveling, and a tool at the main spindle position, for example, a roughing grindstone tool 23 and a tool stocker 60 that can be expanded and contracted by driving an air cylinder.
A moving mechanism that is movable in the axial direction is provided.

Further, the tool stocker 60 is provided at the rear portion (left side in FIG. 6) of the ATC device 50. The tool stocker 60 is composed of a tool stocker 65 formed in an arc shape around the Z2 axis which is the turning center of the ATC device 50, and can store a plurality of tools.

When the roughing of the semiconductor wafer WH is completed by the roughing-grinding tool 23 in the grinder 30 with the ATC device, the rough-grinding tool 23 and the cover member 1
4 is exchanged. FIG. 7 is a cross-sectional view showing the spindle 24 to which only the cover body portion 14a of the cover member 14 is attached. In the cover member 14 in this case, the cover main body portion 14a having a special taper shank shape and the cover holder portion 14b for the ATC are two pieces, and the cover main body portion 14a is fitted into the main shaft tapered hole 16. When clamped, the cover holder portion 14b is separated and removed. Then, when the final finishing process of the semiconductor wafer WH is performed by the finishing grindstone 22a of the finishing grindstone tool 22 directly attached to the spindle 24, and the semiconductor wafer WH is finished to a predetermined shape accuracy,
The semiconductor wafer WH is removed from the vacuum chuck and transferred to the polishing machine for the next step.

Polishing with a polishing machine (not shown) is a precision grade surface finishing that is finished with higher precision than lapping, and is a polishing method that finishes the finished surface in the previous step to a flat mirror surface shape precision. Is. As the polishing agent, a polishing liquid in which micron or submicron ultrafine particles are creamy or liquid is used. The semiconductor wafer WH slides on the surface plate while being revolved while being rotated by the planetary gear mechanism by being given a predetermined polishing pressure. In mass production machines, diamond polishing and chemical mechanical polishing (CMP) are performed.

However, the polishing process by the polishing machine, which is the next process, is incorporated in the grinding process,
There was a demand for cost reduction by improving quality and consolidating processes.

[0010]

Therefore, the present invention incorporates the polishing process, which is the next step, into a grinding machine so that the cost can be reduced by improving the quality and consolidating the steps.
An object of the present invention is to provide a polishing pad tool and a grinding machine using the same.

[0011]

The invention according to claim 1 of the present invention which has solved the above-mentioned problems is a silicon wafer,
A polishing pad tool for ultra-precision surface finishing of electronic and optical components such as an aluminum hard disk and a glass hard disk, wherein the polishing pad tool is a pad holder that holds the polishing pad and a taper that fits into a spindle taper hole. Part and a pull stud that is an engaging part when pulling up into the main shaft to be coupled, and the pad holder is disk-shaped or donut-shaped. It is characterized in that the pad formed with is arranged integrally with the holder.

According to the first aspect of the present invention, after the finishing process with the finishing grindstone is completed, the polishing pad tool is mounted to perform the polishing process with the grinder. In addition, after finishing grinding of the semiconductor wafer WH, polishing can be continuously performed by the setup as it is, so that attachment / detachment of the work W is not necessary, and since the chucking can be performed once, the quality can be improved. Cost can be reduced by shortening the in-process period by integrating the processes and eliminating the work of attaching, detaching, and transporting the work.

The invention of a polishing pad tool according to a second aspect is characterized in that polishing pads are dispersedly arranged on the lower surface of the pad holder, and scrapers are arranged between the polishing pads. This is because if the polishing pad slides after dust, chips, or the like attached to the upper surface of the work drop, the upper surface of the work may be deeply scratched by the chips, resulting in regrinding.

According to the second aspect of the present invention, by disposing a plurality of scrapers between the pads,
Before the polishing pad slides, dust and debris attached to the top surface of the work can be swept by the scraper and discharged to the outside of the work, preventing deep scratches from occurring and providing trouble-free polishing. It can be finished by processing.

The invention of a polishing pad tool according to a third aspect is characterized in that a skirt type scraper is arranged on the outer peripheral surface of the pad holder. According to the third aspect of the present invention, the skirt-shaped scraper is arranged on the outer peripheral surface of the pad forming the disk shape or the donut shape, so that the dust and the chips that have adhered to the upper surface of the work are not polished. Since it can be removed, it can be finished in the shortest time without deep scratches.

The invention according to claim 4 is characterized in that the polishing pad tool is automatically changed by an automatic tool changing device.

According to the invention of claim 4, the polishing pad tool has a tool holder having a taper portion fitted to the spindle taper and a grip groove gripped by an arm of an automatic tool changer (ATC) device, and the inside of the spindle. Since it has a pull stud that is an engaging part when pulling it up and joining it, and it is configured to be able to automatically change tools, after finishing the grinding process with the NC grinder with ATC, the polishing pad tool continues. And automatic tool change is done by ATC device,
Can be polished.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings. (First Embodiment) FIG. 1A is a vertical sectional view showing a polishing pad tool 1 according to the first embodiment, which is a vertical sectional view of a rotary table device 40 for a semiconductor wafer WH. As shown in FIG. 1A, the polishing pad tool 1 includes a pad holder 2 that holds a polishing pad 5 and a taper shank portion 3 that fits into a spindle taper hole 16.
a and a gripping portion 3b gripped by the arm of the ATC device, and a restraining surface 3c that abuts an end surface of the spindle 24 when mounted on the spindle 24.
And a pull stud 4 that is an engaging portion when pulling up into the main shaft 24 via the balls 18, 18 of the clamp mechanism. The pad holder 2 has a disk shape. Molded and centered hole 2d
The boss 3d of the tool holder 3 is fitted to the
They are fixed together at.

The left view of FIG. 1A is a sectional view of the rotary table device 40 for the semiconductor wafer WH. A spindle 42 is fixed to the center of the rotary table 41, and the spindle 42 is rotatably supported by the upper and lower bearings 44 with respect to the bed about a vertical axis. Figure 1
(B) is a bottom view of the polishing pad tool 1 as viewed in the direction of arrow A. As shown in FIG. 1B, the pad holder 2
A donut-shaped polishing pad 5 is attached to the lower surface of the. The polishing pad 5 has a thickness of 2 to 3 mm and can be easily molded. Within this thickness, micron and sub-micron ultrafine particles for polishing are arranged, and polishing is performed by rubbing the surface of the workpiece, and mirror finishing is possible.

(Second Embodiment) FIG. 2A is a front view of the polishing pad tool 11, and FIG.
It is a bottom view. The pads 5, 5, ... Are scattered on the lower surface of the pad holder 2 at regular intervals, and the scrapers 7, 7 ,.
It is inserted and arranged in a groove formed with a gradient of degrees. As shown in FIG. 2B, the scraper 7 is fixed by machine screws 7a, 7a provided from the outer peripheral portion. The scraper 7 protrudes from the upper surface of the pad 5 by 2 to 3 mm, and also 5 in the outer peripheral direction.
By making the protrusion about 10 mm, the surface can be cleaned by the scraper 7 before the polishing pad 5 contacts the work W, which is convenient.

(Third Embodiment) FIG. 3A is a front view of the polishing pad tool 13, and FIG.
It is a bottom view. As shown in FIG. 3A, a screw portion 2a is formed on the outer periphery of the pad holder 2, and the skirt scraper 8 is fixed by a nut-shaped clamper 2b. The skirt scraper 8 has a screw relief portion 2c of the screw portion 2a.
It is molded in the shape of, and can be positioned by providing a protrusion at one end, and also prevents it from coming off during mounting and processing. Further, it is convenient to make the skirt-shaped scraper 8 clean the surface by making it protrude from the lower surface of the pad 5 by a dimension b. The material of the skirt-shaped scraper 8 is synthetic rubber such as nitrile rubber or viton rubber or a brush, and a belt-shaped one may be wound around the outer peripheral surface, or a ring-shaped one may be attached. By arranging the skirt-shaped scraper, it is possible to remove dust adhering to the upper surface of the work and chips that have fallen before the polishing process, so that no deep scratches occur and the surface can be mirror finished.

(Fourth Embodiment) FIG. 4 is a schematic view showing how the polishing pad tool 13 is automatically attached to a spindle by an ATC device of an NC grinder. As will be described later in the description of the operation, by using the polishing pad tool shown in the first to third embodiments for the NC grinder with the ATC device, the polishing process which is the next step is incorporated into the program and the same. Finishing with a grinding machine can further improve quality and reduce costs by consolidating processes.

Next, the operation will be described. Figure 4
For example, the polishing pad tool 13 of the NC grinder 10 with the ATC device is moved to the NC grinder 10 by the ATC device 50.
It is a schematic diagram which shows a mode that it is attached to the main shaft 24 of. Figure 4
6 are the same as those in FIG. 6 except for the tools, and therefore, duplicate description will be given the same reference numerals and omitted. The semiconductor wafer WH, which is the work W, is placed on the table upper surface of the rotary table 41, which is made of the porous suction pad 43 (see FIG. 1), and the work clamp button is pressed. Then, the semiconductor wafer WH is fixed to the rotary table 41 by a vacuum chuck connected to a negative pressure source of a vacuum pump (not shown).

Then, the door 80 is closed and the start button is pushed.
Each unit operates according to the procedure of the program in which the NC program is input in advance. That is, the arm 51 of the ATC device 50 grips the polishing pad tool 13 stored in the tool stocker 65, and the arm holder 52 of the cover member 14 that composes the cover member 14 is gripped by one arm 52. Then, the cover body portion 14a
The plurality of protrusions 14d of the cover holder portion 14b are attached to the plurality of recesses 14c provided on the lower surface of the cover holder portion 14b (see FIG. 7), and when combined together, the clamp mechanism in the spindle 24 is released,
The integrated cover member 14 is pulled out from the spindle tapered hole 16.

FIG. 5 shows the polishing pad tool 13
FIG. 3 is a schematic diagram showing a state in which the main unit 24 of the NC grinder 10 is mounted by the TC device 50. Next, the arms 51, 5
2 rotates 180 degrees and the arm 51 and the arm 52 are exchanged, and the polishing pad tool 13 held by the arm 51 is inserted into the main shaft 24 and mounted on the main shaft 24 by a clamp mechanism in the main shaft 24. One arm 52
The cover member 14 is stored in the tool stocker 60.

Then, the spindle 24 rotates, and the headstock 20 is moved downward by driving the lifting motor 21 of the headstock lifting mechanism.

Then, as shown in FIG. 3 (b), when the polishing pad tool 13 starts the feed drive for polishing, the skirt-shaped scraper 8 first comes into contact with the work W and comes into contact with the surface. To clean. Then, with a slight delay, the polishing process by the polishing pad 5 is performed. The polishing pad 5 makes contact,
Polishing is done while abrading to obtain a mirror finished surface of ultra-precision grade. As a result, the polishing machine can be eliminated.

[0028]

As described above, according to the first aspect of the present invention, the polishing process can be performed by the grinder by mounting the polishing pad tool after the finishing process by the finishing grindstone is completed. In addition, the semiconductor wafer W
After finishing grinding of H, it is possible to improve the quality by chucking once because the polishing process can be continued by the setup as it is. In addition, shortening the in-process period by integrating the process and attaching and detaching the work, Costs can be reduced by eliminating the need for transportation work.

According to the invention of claim 2, by disposing a plurality of scrapers between the pads,
Before the polishing pad slides, dust and debris attached to the top surface of the work can be swept by the scraper and discharged to the outside of the work, preventing deep scratches from occurring and providing trouble-free polishing. It can be finished by processing.

According to the third aspect of the present invention, the skirt scraper is arranged on the outer peripheral surface of the pad forming the disk shape or the donut shape, so that the dust and the chips that have adhered to the upper surface of the work are polished. Since it can be removed before entering, it does not cause deep scratches and can be finished in the shortest time.

According to the fourth aspect of the present invention, the polishing pad tool has an AT and a taper portion fitted to the main shaft taper.
By having a tool holder having a gripping groove to be gripped by the arm of the C device and a pull stud that is an engaging portion when pulling up and coupling the main shaft, automatic tool change is possible. , After finishing the grinding process with the NC grinder with ATC, continue with the polishing pad tool A
Polishing can be performed by automatically changing tools with a TC device.

[Brief description of drawings]

FIG. 1A is a vertical cross-sectional view of a spindle showing a polishing pad tool according to a first embodiment of the present invention, which is a vertical cross-sectional view of a rotary table device for a semiconductor wafer WH.
(B) is a bottom view shown in the direction of arrow A.

FIG. 2 (a) is a front view of a polishing pad tool, and FIG. 2 (b) is a bottom view thereof.

FIG. 3 (a) is a front view of a polishing pad tool, and FIG. 3 (b) is a bottom view thereof.

FIG. 4 is a schematic view showing how a polishing pad tool is attached to a spindle of an NC grinder by an ATC device.

FIG. 5 is a schematic view showing a state in which a polishing pad tool is attached to a spindle of an NC grinder by an ATC device.

FIG. 6 is a schematic view showing a left side surface of a conventional grinding machine with an automatic tool changer (ATC).

FIG. 7 is a cross-sectional view showing a spindle in which a cover body of a cover member is mounted in a spindle taper hole.

[Explanation of symbols]

1, 11, 13 Polishing pad tool 2 Pad holder 2a screw part 2b Nut clamper 2c Screw relief part 2d hole 3 Tool holder 3a Taper shank 3b grip 3d boss 4 pull studs 5 Polishing pad 6 bolts 7 scraper 7a machine screw 8 Skirt scraper 10 NC grinder with ATC device

Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01L 21/304 622 H01L 21/304 622F (72) Inventor Shiro Murai No. 1 Shinmeicho, Yokosuka City, Kanagawa Hihira Toyama Technical Center Co., Ltd. (72) Inventor Kunihiro Saida 1 Shinmei-cho, Yokosuka City, Kanagawa F-Term (reference) inside Hihei Toyama Technical Center Co., Ltd. (reference) 3C034 AA07 BB56 BB66 DD10 3C043 BA11 CC07 CC13 3C058 AA07 AA09 CB05 DA12 DA17

Claims (4)

[Claims] 1. A polishing pad tool for ultra-precisely finishing the surfaces of electronic and optical components such as semiconductor wafers, aluminum hard disks, and glass hard disks, wherein the polishing pad tool includes a pad holder for holding the polishing pad, The pad holder comprises a tool holder having a taper portion that fits into the spindle taper hole and a grip groove that is gripped by the arm of the ATC device, and a pull stud that is an engagement portion when pulling up and coupling the spindle into the spindle. Is a polishing pad tool characterized in that a disc-shaped or donut-shaped pad is arranged integrally with a holder. 2. The polishing pad tool according to claim 1, wherein polishing pads are dispersedly arranged on the lower surface of the pad holder, and scrapers are arranged between the polishing pads. 3. The polishing pad tool according to claim 1, wherein a skirt scraper is arranged on the outer peripheral surface of the pad holder. 4. The NC grinding machine using a polishing pad tool according to claim 1, wherein the polishing pad tool is automatically changed by an automatic tool changing device.