JP2003224325A - Package for housing optical semiconductor element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that, when a fixing member is brazed to a main body of a package for housing optical semiconductor element, the adhesive strength of the joint becomes weaker. <P>SOLUTION: The package for housing optical semiconductor element comprises the main body 1 having a recessed section A on its top surface to house an optical semiconductor element 2 and a through hole 1a made through its side section to reach the recessed section A; the fixing member 5 which is inserted into and fixed in the hole 1a, is fixed to the external peripheral surface of the hole 1a, and has a lens member 6 attached to the end section of the member 5 on the recessed section A side through a sealing glass material 7; and a cap body 8 which is attached to the top surface of the main body 1 so as to cover the recessed section A. The sealing glass material 7 is composed of borosilicate glass containing a silicon oxide in an amount of 63-70 wt.%, boron oxide in an amount of 17-28 wt.%, aluminum oxide in an amount of 6-10 wt.%, potassium oxide in an amount of 0.2-5 wt.%, sodium oxide in an amount of 0.2-3 wt.%, and barium oxide in an amount of 0.2-2 wt.%. <P>COPYRIGHT: (C)2003,JPO

Description

Description: BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to an optical semiconductor for hermetically sealing and housing optical semiconductor elements such as LD (semiconductor laser) and PD (photodiode). More particularly, the present invention relates to an optical semiconductor element housing package for fixing a lens member by melting a sealing material mainly composed of glass. 2. Description of the Related Art Conventionally, as shown in a perspective view of FIG. 1 (a) and a sectional view of FIG. 1 (b), an optical semiconductor element housing package for fixing a lens member by melting a sealing material. Is used.
This package for storing an optical semiconductor element is made of iron-nickel-
A box-shaped container main body 1 made of a metal material such as a cobalt alloy and having an opening (recess) for forming a space for accommodating the optical semiconductor element 2 such as an LD or a PD in a substantially central portion of the upper surface thereof;
It is made of a metal material such as an alloy (iron 50% by weight-nickel 50% by weight alloy) or the like, and is attached to the through hole 1a of the side wall of the container body 1 through a brazing metal. And a lid 8 attached to the upper surface of the container body 1 and hermetically sealing the optical semiconductor element 2. [0003] An outer surface of the container body 1 is provided with an iron-based wire for making an electrical connection between the optical semiconductor element 2 and an external electric circuit.
A lead terminal 3 made of a metal material such as a nickel-cobalt alloy is welded through a lead terminal sealing material 4, and a lens member 6 fixed by a glass sealing material 7 inside a fixing member 5.
Is attached. The lens member 6 is usually spherical or hemispherical in shape. The outer surface of the container body 1 and the fixing member 5 are sequentially coated with a Ni plating layer and an Au plating layer for preventing oxidation corrosion and improving the wettability with a brazing material for joining various parts. The fixing member 5 is attached to the inside of the through hole 1a of the container body 1 with a low melting point brazing metal such as an Au-Sn alloy. The lens member 6 is made of borosilicate glass and generally has a coefficient of linear thermal expansion of about 9 ppm.degree. The glass sealing material 7 for fixing the lens member 6 inside the fixing member 5 is composed of 56 to 66% by weight of lead oxide and 4 to 1% of boron oxide.
5-10% by weight of a glass component containing 4% by weight, 4-14% by weight of silicon oxide and 0.5-3% by weight of zinc oxide as a filler, and 5-10% by weight of a tin titanate compound as an external additive. What is added is 10% by weight. Note that the linear thermal expansion coefficient of the sealing material 7 is about 9 ppm / ° C. However, in the conventional package for housing an optical semiconductor element, the fixing member 5 is required.
Is bonded to the through hole 1a of the container body 1 with an Au-Sn brazing material, the softening point of the glass sealing material 7 is set to 350 ° C. in order to prevent the optical axis from shifting due to re-melting of the glass sealing material 7. As a result, the melting temperature of the glass sealing material 7 becomes as high as 400 ° C. or more, and the fixing member 5 with the Ni plating layer and the Au plating layer applied thereto in advance through the sealing material 7 When the lens member 6 is adhered by the heating, there is a problem that the gold plating layer on the exterior of the fixing member 5 is deteriorated by the diffusion of the underlying Ni plating layer due to the heat for heating and melting the glass sealing material 7. Was. Since the outer gold plating layer is deteriorated, the fixing member 5 is moved to the through hole 1 of the container body 1.
When the brazing material is joined to a, the bonding strength of the joining portion is reduced, and as a result, the hermetic sealing inside the optical semiconductor device housing package is broken, and the optical semiconductor device 2 housed therein is prolonged. For a long period of time, it has been impossible to operate normally and stably. When the surface of the fixing member 5 is plated after joining the lens member 6 to the fixing member 5, a lead oxide glass is used for the glass sealing material 7 for sealing the lens member 6. Therefore, the lead component of the glass sealing material 7 dissolves in the plating solution, and a problem has occurred in that the bonding characteristics such as solder wettability of the Au plating layer are reduced. For this reason, it was difficult to join the lens member 6 to the fixing member 5 by the glass sealing material 7 before forming the exterior plating layer. For this reason, when the lens member 6 is joined to the fixing member 5, the wettability between the glass encapsulant 7 and the Au plating layer may be poor. First, an exterior plating layer is formed on the entire surface of the fixing member 5. After that, the Au plating layer at the joint portion of the lens member 6 was polished and removed, and then the lens member 6 had to be joined with the glass sealing material 7. Therefore, the manufacturing process becomes complicated and productivity is reduced. [0009] In the recent movement of global environmental protection, lead oxide is designated as an environmentally harmful substance, and lead oxide-based low-temperature sealing glass is not used for electronic parts such as packages for housing optical semiconductor elements. The movement has begun. The present invention has been devised in view of the problems of the prior art described above, and has as its object to hermetically seal an optical semiconductor element inside a metal container so that the optical semiconductor element can be normally used for a long period of time. An object of the present invention is to provide an optical semiconductor element storage package that can be operated stably. According to the present invention, there is provided a package for housing an optical semiconductor device, wherein a concave portion for housing the optical semiconductor device is formed on an upper surface, and a through hole penetrating to the concave portion is provided on a side portion. A container body and fixed to be inserted into and fixed to the through hole, or fixed to an outer surface around the through hole of the container body, and a lens member attached to an end of the concave side via a glass sealing material. An optical semiconductor element storage package comprising a member and a lid attached to the upper surface of the container body so as to cover the concave portion, wherein the glass sealing material contains silicon oxide in an amount of 63 to 70% by weight, Boron containing 17 to 28% by weight of boron oxide, 6 to 10% by weight of aluminum oxide, 0.2 to 5% by weight of potassium oxide, 0.2 to 3% by weight of sodium oxide and 0.2 to 2% by weight of barium oxide. Specially made of silicate glass It is an. According to the package for storing an optical semiconductor element of the present invention, the glass sealing material is 63 to 70% by weight of silicon oxide, 17 to 28% by weight of boron oxide, 6 to 10% by weight of aluminum oxide, and potassium oxide. 0.2-5% by weight of sodium oxide
Since the borosilicate glass contains 0.2 to 3% by weight and barium oxide in the range of 0.2 to 2% by weight, the softening and melting temperature of the glass sealing material becomes a high melting point of 680 ° C. or more. Even if the fixing member to which the lens member is joined by using is bonded to the through hole of the container body with the Au-Sn brazing material, the glass sealing material does not re-melt, and as a result, the glass sealing material re-melts. Can prevent the optical axis from being shifted. In addition, since the glass sealing material does not contain lead oxide, even if the fixing member is bonded to the plating solution after the lens member is joined to the fixing member via the glass sealing material, the plating solution is not removed. The components of the glass sealing material do not dissolve, and as a result, the joining properties such as the solder wettability of the Au plating layer are not impaired. Further, since the bonding of the lens member to the fixing member can be performed before the formation of the exterior plating layer, the manufacturing process can be simplified and an optical semiconductor element housing package that can be efficiently produced can be obtained. Next, a package for storing an optical semiconductor device according to the present invention will be described with reference to the accompanying drawings.
The basic configuration of the package for storing an optical semiconductor element of the present invention is
Same as 1 (a) and (b). In FIG. 1, 1 is a container body, 2 is a semiconductor element, 3 is a lead terminal, 4 is a lead terminal sealing material, 5 is a fixing member, 6 is a lens member, 7 is a glass sealing material, and 8 is a lid. The package for storing an optical semiconductor element of the present invention is mainly composed of the container body 1, the fixing member 5, the lens member 6, and the lid 7. In this embodiment, an example is shown in which the fixing member 5 is inserted and fixed in the through hole 1a. The container body 1 is made of an inorganic insulating material such as a metal material or ceramics, or an organic material such as a resin, and has a concave portion A for accommodating an optical semiconductor element 2 such as an LD or PD at a substantially central portion of an upper surface thereof. Portion is provided with a through hole 1a penetrating to the concave portion A, and the container body 1 is made of, for example, Fe
-When made of a metal material such as a Ni-Co alloy, the base material of the Fe-Ni-Co alloy to be the container body 1 is formed by a conventionally known cutting or press working, or a metal injection molding method (MIM).
It is formed by performing unevenness processing and punching with the use of the like. Further, the through hole 1a is also formed by processing at the same time as the container body 1. The optical semiconductor element 2 is bonded and fixed to the bottom surface of the concave portion A of the container body 1 via an adhesive such as glass. A lead terminal 3 made of a metal material such as an Fe-Ni-Co alloy for making an electrical connection between the optical semiconductor element 2 and an external electric circuit (not shown) is provided on the container body 1. Normally, a lead terminal sealing material 4 made of borosilicate glass or the like is provided so that one end thereof extends to the inside and the other end extends to the outside.
And one end of the lead terminal 3 is electrically connected to the electrode of the optical semiconductor element 2 by opening an electrical connection member 9 such as a bonding wire, and the other end is electrically connected to an external electric circuit. By optical connection, the optical semiconductor element 2 and the external electric circuit are electrically connected. A cylindrical fixing member 5 is inserted and fixed in the through hole 1a of the container body 1. The fixing member 5 has a function of fixing an optical fiber (not shown) to the package for housing an optical semiconductor element, and is made of an inorganic insulating material such as a metal material or ceramics, or an organic material such as a resin. When the fixing member 5 is made of, for example, a metal material, a 50 alloy (Fe50 wt% -N
metal material such as i50 wt% alloy), and the fixing member 5
Is formed by subjecting a 50-alloy base material to a concavo-convex process and punching by a conventionally known cutting process, a press process, a metal injection molding method (MIM), or the like. The container body 1 and the fixing member 5 are 30
The same metal material having a linear thermal expansion coefficient of 4 to 6 ppm / ° C. at −300 ° C. is preferable. When the coefficient of linear thermal expansion is less than 4 ppm / ° C., the difference in the coefficient of linear thermal expansion from the lens member 6 tends to be large, so that the hermetic sealing with the glass sealing material 7 tends to be difficult, and the coefficient of linear thermal expansion is 6 ppm / ° C. Is exceeded, the difference between the linear thermal expansion coefficient of the lead terminal sealing material 4 (about 4 ppm / ° C.) and the container body 1 becomes large, and the hermetic sealing between the container body 1 and the lead terminal 3 by the lead terminal sealing material 4 becomes large. Tends to be difficult. Therefore, the container body 1 and the fixing member 5 are 30 to 300
The same metal material having a linear thermal expansion coefficient at 4 ° C. of 4 to 6 ppm / ° C. is preferable. When the container body 1 and the fixing member 5 are made of a metal material, the surfaces thereof are prevented from being oxidized and corroded, and the wettability with the brazing material for joining the members is improved.
It is preferable to apply a plating layer and an Au plating layer in advance. Further, a lens member 6 is attached to an end of the fixing member 5 on the side of the concave portion A of the container body 1 via a glass sealing material 7. The lens member 6 has a function of condensing external light passing through the optical fiber and guiding the light to the optical semiconductor element 2 or guiding light emitted from the optical semiconductor element 2 to the optical fiber. The lens member 6 is made of borosilicate glass and generally has a linear thermal expansion coefficient of about 9 ppm / ° C. In such a lens member 6, a glass sealing material 7 is applied in advance to a place where the lens member 6 of the fixing member 5 is joined, and the outer periphery of the lens member 6 is placed inside the cylindrical fixing member 5. The sealing member 7 is completely or partially inserted into the fixing member 5 so as to be in contact with the fixing member 5, and then the sealing member 7 is fixed to the inner end of the container body 1 side of the fixing member 5 by heating and melting in a heating furnace. You. The glass sealing material 7 for fixing the lens member 6 to the fixing member 5 is made of a high-melting glass not containing lead, and contains 63 to 70% by weight of silicon oxide, 17 to 28% by weight of boron oxide, and aluminum oxide. 6-10% by weight, potassium oxide 0.2-5
It consists of a borosilicate glass containing 0.2% to 3% by weight of sodium oxide and 0.2% to 2% by weight of barium oxide, and this is important. The glass sealing material 7 has a silicon oxide content of 63.
If it is less than 10% by weight, the softening temperature of the glass becomes too high,
The optical characteristics of the lens member 6 tend to deteriorate,
If it exceeds 70% by weight, the chemical resistance of the glass tends to deteriorate, and the reliability of hermetic sealing tends to decrease. Therefore, the content of silicon oxide is preferably in the range of 63 to 70% by weight. If the content of boron oxide is less than 17% by weight, the softening temperature of the glass becomes too high, and
When the content exceeds 28% by weight, the chemical resistance of the glass tends to deteriorate, and the reliability of hermetic sealing tends to decrease. Therefore, the content of boron oxide is 17 to
A range of 28% by weight is preferred. When the content of aluminum oxide is less than 6% by weight, the softening temperature of the glass tends to be too high, and the optical characteristics of the lens member 6 tend to be deteriorated. Chemical properties tend to deteriorate, and the reliability of hermetic sealing tends to decrease. Therefore, the content of aluminum oxide is preferably in the range of 6 to 10% by weight. When the content of potassium oxide is less than 0.2% by weight, the fluidity of the glass tends to deteriorate, and hermetic sealing tends to be difficult. When the content exceeds 5% by weight, the chemical resistance of the glass deteriorates, The reliability of hermetic sealing tends to decrease. Therefore, the content of potassium oxide is preferably in the range of 0.2 to 5% by weight. If the content of sodium oxide is less than 0.2% by weight, the fluidity of the glass tends to deteriorate and hermetic sealing tends to be difficult. If the content exceeds 3% by weight, the chemical resistance of the glass deteriorates, The reliability of hermetic sealing tends to decrease. Therefore, the content of sodium oxide is preferably in the range of 0.2 to 3% by weight. The barium oxide content is 0.2% by weight.
If the amount is less than the above, the chemical resistance of the glass tends to deteriorate, and the reliability of hermetic sealing tends to decrease. If the amount exceeds 2% by weight, crystallization proceeds at the stage of glass forming, and remelting tends to be difficult. is there. Therefore, the content of barium oxide is 0.2 to 2% by weight.
Is preferable. Such a glass sealing material 7 is made of silicon oxide,
Weigh glass components containing boron oxide, aluminum oxide, potassium oxide, sodium oxide, barium oxide,
After uniformly mixing with an organic binder, pigment, water, solvent, etc. with a V-shaped mixer, the mixed powder (granulated) is pressed and sintered at about 600 to 800 ° C for about 2 to 8 hours in an oxidizing atmosphere. By doing so, a homogeneous solid solution can be obtained. Further, the processing melting temperature of the glass sealing material 7 when joining the glass member 6 to the fixing member 5 is preferably about 700 to 900 ° C., and more preferably 800 to 850 ° C. 85
If the temperature exceeds 0 ° C., the optical characteristics tend to be easily deteriorated due to softening deformation, thermal stress and residual stress of the lens member 6.
If the temperature is lower than 800 ° C., the melting of the glass sealing material 7 becomes insufficient, and the reliability of hermetic sealing tends to decrease. The thickness of the glass sealing material 7 is 0.15 to 0.35 mm
When the thickness is less than 0.15 mm, the amount of the glass sealing material 7 is insufficient, so that the meniscus of the glass sealing material 7 at the time of melting around the lens member 6 is not sufficiently formed. There is a tendency that the bonding strength to the metal is insufficient. On the other hand, if the thickness exceeds 0.35 mm, the amount of the glass sealing material 7 becomes excessive, and the glass sealing material 7 spreads too much on the lens surface of the lens member 6, and the optical properties such as light transmittance of the lens member 6 deteriorate. There is a tendency. According to the package for housing an optical semiconductor element of the present invention, since the composition of the sealing material 7 is as described above, the softening and melting temperature of the glass sealing material 7 is as high as 680.degree. The fixing member 5 to which the member 6 is joined is Au
-Even if the glass sealing material 7 is joined to the through-hole 1a of the container body 1 with the Sn brazing material, the glass sealing material 7 does not re-melt, and as a result, the optical axis is prevented from shifting due to the re-melting of the glass sealing material 7. be able to. Further, since the glass sealing material 7 does not contain lead oxide, even if the fixing member 5 is joined to the fixing member 5 via the glass sealing material 7 and then the fixing member 5 is coated with the outer plating, The components of the glass sealing material 7 do not dissolve in the plating solution, and as a result, the joining characteristics such as the solder wettability of the Au plating layer are not impaired. Furthermore, since the bonding of the lens member 6 to the fixing member 5 can be performed before the formation of the exterior plating layer, the manufacturing process can be simplified and an optical semiconductor element housing package that can be efficiently produced can be obtained. . The attachment of the cylindrical fixing member 5 to the through hole 1a of the container body 1 is performed by fixing the fixing member 5 with a metal brazing material such as an Au-Sn alloy, and by heating the metal brazing material to about 400 ° C. This is performed by heating and melting at a temperature. Thus, the optical semiconductor element 2 is mounted and fixed on the optical semiconductor element 2 mounting portion of the container body 1 via an adhesive, and each electrode of the optical semiconductor element 2 is electrically connected to the lead terminal 3 by a bonding wire or the like. Then, the lid 7 is joined to the upper surface of the container body 1 via a sealing material, and the optical semiconductor element 2 is placed inside the container composed of the container body 1 and the lid 7. The optical semiconductor device is completed as a product by hermetically housing the semiconductor device. The lid 7 is a flat plate having a thickness of 0.3 to 0.4 mm and is made of a metal material, an inorganic insulating material such as ceramics, or an organic material such as a resin. For example, a metal material such as an Fe-Ni-Co alloy is used. In the case of consisting of
-It is formed by punching a base material of a Co alloy by a conventionally known press working. Example The following experiment was conducted to confirm the effect. Here, the main components are silicon oxide, boron oxide,
The experimental example determined about aluminum oxide is shown. Glass was prepared by changing the weight% of each component, and the airtightness was evaluated. The test and evaluation conditions are based on MIL-STD.
According to the -883 method 1014.9 test condition A1. Experiment 1 The weight percentage of silicon oxide was varied between 59 and 74, and the total weight was 100% by adding other components.
(2 decimal places are rounded off). Table 1 shows the results. [Table 1] From the experimental results, it was found that silicon oxide was
It was found that good airtightness can be obtained in the range of 70% by weight. Next, regarding boron oxide and silicon oxide,
The following experiment was performed. Experiment 2 The content of silicon oxide was 65-70
The same evaluation as in Experiment 1 was performed by changing the content of boron oxide and aluminum oxide within the range of weight%. Experiment 3
The same evaluation as in Experiment 1 was performed by changing the content of silicon oxide to 63% by weight and changing the content of boron oxide and aluminum oxide. The results are shown in Tables 2 and 3. [Table 2] [Table 3] According to Experiments 2 and 3, boron oxides 17 to 28
It was found that good airtightness was obtained at a weight percentage of 6-10% by weight of aluminum oxide. The same experiment was conducted for trace elements, and the glass sealing material was 63 to 70% by weight of silicon oxide, 17 to 28% by weight of boron oxide, and 6% by weight of aluminum oxide.
Borosilicate glass containing -10% by weight, 0.2-5% by weight of potassium oxide, 0.2-3% by weight of sodium oxide and 0.2-2% by weight of barium oxide,
The effect of the present invention could be confirmed. It should be noted that the present invention is not limited to the above-described embodiment, and various changes may be made without departing from the scope of the present invention. According to the package for housing an optical semiconductor element of the present invention, the glass sealing material contains 63 to 70% by weight of silicon oxide, 17 to 28% by weight of boron oxide, and 6 to 10% of aluminum oxide. Wt%, potassium oxide 0.2-5 wt%, sodium oxide
Since it is made of borosilicate glass containing 0.2 to 3% by weight and barium oxide in the range of 0.2 to 2% by weight, the softening melting temperature of the glass sealing material becomes a high melting point of 680 ° C. or more, and the lens members are joined. Even if the fixing member is joined to the through-hole of the container body with the Au-Sn brazing material, the glass sealing material does not re-melt, and as a result, the deviation of the optical axis due to the re-melting of the glass sealing material 7 is prevented. can do. In addition, since the glass sealing material does not contain lead oxide, even if the fixing member is bonded to the plating solution after the lens member is joined to the fixing member via the glass sealing material, the glass sealing material is not added to the plating solution. The components of the stop material do not dissolve, so that Au
It does not impair the bonding properties such as solder wettability of the plating layer. Further, since the bonding of the lens member to the fixing member can be performed before the formation of the exterior plating layer, the manufacturing process can be simplified and an optical semiconductor element housing package that can be efficiently produced can be obtained.

BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1 (a) and 1 (b) are a perspective view and a sectional view, respectively, showing an optical semiconductor element housing package of the present invention. [Description of Signs] 1..., Container body 2... Optical semiconductor element 3... Lead terminal 4. Sealing member 5 Metal fixing member 6 Lens member 7 Glass sealing member 8 Lid Body 9: Electrical connection member

Continuation of front page    F term (reference) 4G062 AA08 AA09 BB05 DA06 DB03                       DC04 DD01 DE01 DF01 EA01                       EB02 EB03 EC02 EC03 ED01                       EE01 EF01 EG02 EG03 FA01                       FB01 FC01 FD01 FE01 FF01                       FG01 FH01 FJ01 FK01 FL01                       GA01 GA10 GB01 GC01 GD01                       GE01 HH01 HH03 HH05 HH07                       HH09 HH11 HH13 HH15 HH17                       HH20 JJ01 JJ03 JJ05 JJ07                       JJ10 KK01 KK03 KK05 KK07                       KK10 MM08 NN01 NN32 NN34                 5F049 NA09 TA12                 5F073 AB27 EA28 EA29 FA08

Claims (1)

Claims: 1. A container body having an upper surface formed with a recess for accommodating an optical semiconductor element, and a side portion provided with a through hole penetrating to the recess, and being inserted and fixed in the through hole, Or a fixing member fixed to the outer surface around the through hole of the container main body, and a lens member attached to the end on the concave side via a glass sealing material, and the concave portion on the upper surface of the container main body. An optical semiconductor element housing package comprising: a lid attached so as to cover the silicon semiconductor;
3 to 70% by weight, 17 to 28% by weight of boron oxide, 6 to 10% by weight of aluminum oxide, 0.2 to
An optical semiconductor element housing package comprising borosilicate glass containing 5% by weight, sodium oxide in a range of 0.2 to 3% by weight and barium oxide in a range of 0.2 to 2% by weight.