JP2003223963A - Socket for electric parts - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a socket for electric parts wherein reuse can be made by exchanging a small number of parts without exchanging the whole socket in the case that a contact part or the like of a contact pin is deteriorated. <P>SOLUTION: This socket has a contact base 14 that is removably mounted on a circuit board P and a latch base 15 arranged and installed at the upper side of this contact base 14. At one side, a contact part 17e contacts a terminal of an IC package and a contact pin 17 having a reed part 17c electrically connected with the circuit board P is arranged and installed, and on the other hand, at the latch base 15, a latch member 19 pressing the IC package downward is arranged and installed. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric component socket for detachably accommodating an electric component such as a semiconductor device (hereinafter referred to as "IC package").

[0002]

2. Description of the Related Art Conventionally, an IC socket of this type has been previously arranged on a circuit board, and an IC package is housed in this IC socket so that the IC package and the circuit board are electrically connected. I have to.

As the IC package, for example, there is a so-called gull wing type in which a crank-shaped terminal is extended laterally from a peripheral portion of a rectangular plate-shaped package body.

As the IC socket, there is a so-called open top type socket. In this socket, a contact pin having a contact portion and an elastic portion that can be connected to and detached from a terminal of an electric component is press-fitted into the socket body, and in order to electrically connect the terminal of the electric component and the contact portion of the contact pin. A latch member that presses the electric component body or the terminal is rotatably provided on the socket body, and further, a pressing position where the latch member presses the electric component body or the terminal and a position where the electric component can be attached to the socket body are retracted. An operating member for operating the latch member so as to move between the retracted position and the retracted position is provided so as to be vertically movable with respect to the socket body.

To accommodate the IC package in this IC socket, first, the operating member is pressed and lowered to retract the latch member to the retracted position, and the electrical component is accommodated in the predetermined position on the socket body. Then, when the pressing force on the operating member is released, the operating member rises, the latch member presses the main body or the terminal of the electric component, and the terminal of the electric component and the contact portion of the contact pin are electrically connected. In this state, a test such as a burn-in test is performed.

After the test is completed, the operating member is pressed downward again, so that the latch member is retracted to the retracted position, and the electric component can be taken out from the socket body. After this, the test can be repeated by accommodating the electrical parts to be tested next in the socket body and repeating the same procedure as above.

Here, when the test is repeated, the contact pin arranged in the socket body deteriorates (solder transfer to the contact portion or the elastic portion is dented or damaged), and the contact pin needs to be replaced. was there.

[0008]

However, in the above-mentioned conventional socket, the contact pin is press-fitted into the socket body, and the latch member and the operating member are also provided in the socket body. To replace the socket body, the socket body must be replaced even though the latch member and the operating member are still usable.

Therefore, according to the present invention, when a contact pin deteriorates during use and the contact pin must be replaced, the contact pin can be replaced without replacing the entire socket. The challenge is to provide.

[0010]

In order to achieve the above object, the present invention according to claim 1 provides a contact base which is detachably attached to a circuit board, and is arranged at a predetermined position with respect to the contact base. An accommodating portion for accommodating an electric component is formed in the contact base, and a contact pin having a contact portion that comes into contact with a terminal of the electric component is disposed on the contact base. Is a socket for electric parts in which a latch member for pressing the electric parts downward is provided.

According to a second aspect of the present invention, in addition to the structure of the first aspect, the contact pin has the contact portion which comes into contact with the lower surface of the terminal of the electric component from below, and the contact portion is provided. It is characterized in that it has a spring portion that is supported so as to be able to move up and down and that biases upward.

The invention according to claim 3 is the invention according to claim 1 or 2.
In addition to the configuration described in (1), the latch member is rotatably provided on the latch base and has a suppressing portion that presses the main body or the terminal of the electric component from above.

According to a fourth aspect of the present invention, in addition to the structure according to the third aspect, the latch member is provided with a pressed portion, and the pressing portion is pressed by pressing the pressed portion. It is characterized in that it is configured to be retracted from a position where the electric component is pressed.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below.

[Embodiment of the Invention] FIGS. 1 to 10 show an embodiment of the present invention.

First, the configuration will be described. In the figure, reference numeral 11 is an IC socket as an "electrical component socket", and this IC socket 11 is used for performing a performance test of the IC package 12, and a terminal 12b of this IC package 12 is used. When,
The electrical connection with the circuit board P is intended.

The IC package 12 is shown in FIG. 9 and FIG.
As shown in FIG. 0, which is a so-called gull-wing type, crank-shaped terminals 12b are extended from four sides of the peripheral edge of the rectangular plate-shaped package body 12a toward the sides.

On the other hand, the IC socket 11 is roughly
The contact base 14 is detachably attached to the circuit board P such as a burn-in board, and the latch base 15 is detachably disposed around the contact base 14.

The contact base 14 is provided with a large number of contact pins 17 that are in contact with the terminals 12b of the IC package 12 and are electrically connected to the circuit board P (see FIG. 2).

The contact pins 17 are formed into a so-called horseshoe shape by pressing a conductive plate-shaped member. That is, this contact pin 17
As shown in FIG. 3, has a long plate-shaped fixing portion 17a, and from this fixing portion 17a, a pair of press-fitting portions 17b and an inserting portion 17f are extended downward with a predetermined gap, and these press-fitting portions are inserted. The portion 17b and the insertion portion 17f are the contact base 14.
1 is press-fitted and inserted into the through-hole 14a formed in the upper part, and the lead part 17c is extended further downward from the press-fit part 17b. As shown in FIG.
The circuit board P is inserted through 6 to be electrically connected. Further, a spring portion 17d is formed in a horseshoe shape above the fixed portion 17a, and a contact portion 17e protruding upward is formed at the tip of the spring portion 17d, so that the contact portion 17e is a spring. It is supported by the portion 17d so as to be movable up and down.

As shown in FIGS. 2 and 3, the contact portion 17e is inserted into the opening 14c formed in the peripheral portion of the mounting surface portion 14b on which the IC package 12 of the contact base 14 is mounted, The contact portion 17e contacts the lower surface of the terminal 12b of the IC package 12 to be electrically connected (see FIG. 8). Further, guide portions 14d that guide the respective corners of the package body 12a are formed at the four corners of the mounting surface portion 14b so as to project upward.

Further, the contact base 14 includes
Screws 18 for attaching to the circuit board P at four locations around
Is formed with an insertion hole 14e.

The mother socket 26 has a quadrangular plate shape, and a round pin 26a is arranged in the central portion in accordance with the arrangement of the contact pins 17. The round pin 26a is arranged so as to vertically pass through the mother socket 26, and a fitting recess 26b into which the lead portion 17c of the contact pin 17 is fitted is formed on the upper portion, and the lower insertion portion 26c is formed on the mother pin 26a. The socket 26 projects downward from the lower surface of the socket 26, and the insertion portion 26c is inserted into the circuit board P and electrically connected thereto.

The mother socket 26 has an insertion hole (not shown) formed at a position corresponding to the insertion hole 14e of the contact base 14.

On the other hand, the latch base 15 is shown in FIGS.
As shown in FIG. 4, a total of four latch members 19 are rotatably arranged by a shaft 20, and are attached in a direction (closing direction) in which a terminal 21b of the IC package 12 is pressed by a spring 21 as a "biasing member". It is energized.

The latch member 19 is used for the IC package 1
The pressing portion 19a that presses the two terminals 12b from above.
Is formed, and a pressed portion 19b that is pressed by a latch opening jig 24, which will be described later, is formed, and the latch member 19 receives the biasing force of the spring 21 by pressing the pressed portion 19b. It is designed to be rotated in the direction of opening against.

As shown in FIG. 4, an insertion hole 15a is formed in the latch base 15 at a position corresponding to the insertion hole 14e of the contact base 14.
The latch base 15 and the contact base 14 are attached to the circuit board P via the mother socket 26 by inserting the screw 18 into the nuts 22 through the screws 4e, 15a and the insertion holes.

The IC package 12 is structured so that the IC package 12 is conveyed and accommodated in the IC socket 11 having such a structure by the automatic machine 23. This automatic machine 23 has a suction device 25
Is provided, and the IC package 12 is sucked by the suction device 25 as shown in FIG. Further, the automatic machine 23 is provided with a latch opening jig 24 for rotating and opening the latch member 19.

The latch opening jig 24 has a "pressing portion".
As a cam portion 24a is protruded downwardly and formed at four places, the taper surface 24b of the cam portion 24a causes the pressed portion of the latch member 19 to be depressed by lowering the automatic machine 23 from the state shown in FIG. 19b is pressed and the spring 21
The latch member 19 is rotated in the opening direction against the biasing force of the latch member 19.

Further, the latch opening jig 24 is provided with a tapered positioning projection 24c which projects downward.
The positioning protrusion 24c is fitted into the positioning hole 15b of the latch base 15 for positioning.

Next, the operation will be described.

First, in order to house the IC package 12 in the IC socket 11, the IC package 12 is sucked by the automatic machine 23 and moved to a predetermined IC socket 11 and conveyed. Then, the automatic machine 23 is lowered from the state shown in FIG. 7, and the cam portion 24 a of the latch opening jig 24 is moved.
Then, the latch member 19 is rotated against the biasing force of the spring 21 to retract the restraining portion 19a from the insertion range of the IC package 12. At the same time, the latch opening jig 24
The latching jig 24 is set in a predetermined positional relationship with respect to the IC socket 11 by fitting the positioning protrusion 24c into the positioning hole 15b of the latch base 15.

From this state, the IC package 12 is released from the automatic machine 23 side and placed on the placing surface portion 14b of the contact base 14. In this case, the IC package 12 is guided by the guide portion 14d of the contact base 14 and placed at a predetermined position. At this time, I
The lower surface of the terminal 12b of the C package 12 and the contact portion 17e of the contact pin 17 are not in contact with each other.

Then, when the automatic machine 23 is raised, the latch member 19 returns to its original position by the urging force of the spring 21, and as shown in FIG.
The holding portion 19a of 9 is the terminal 12b of the IC package 12.
Abut on the upper surface of and press.

As a result, the terminal 1 of the IC package 12 is
2b and the contact portion 17e of the contact pin 17 are brought into contact with each other with a predetermined contact pressure to make a reliable electrical connection. In this state, a burn-in test or the like is performed.

After the test, to take out the IC package 12, the automatic machine is lowered and the latch 19 is opened by the latch opening jig 24 in the same manner as when the IC package 12 is housed.
The suction device 25 from the IC package insertion range.
After sucking the IC package 12, the automatic machine 23 may be raised.

When such a test is repeated, the contact portion 17e of the contact pin 17 is contacted with and separated from the terminal 12b of the IC package 12 each time the test is performed, and the spring of the contact pin 17 is removed. The portion 17d is elastically deformed at each test. As a result, in the contact portion 17e of the contact pin 17, the IC package 1
In some cases, the solder plating of the second terminal 12b may be transferred to cause a solder transfer to be attached, and the spring portion 17d may be settled or the spring portion 17d may be damaged. Requires the contact pin 17 to be replaced.

Therefore, in the present invention, the screw 18 is removed, the contact base 14 and the latch base 15 are disassembled, and only the contact base 14 provided with the contact pin 17 can be replaced. Therefore, it is not necessary to replace the latch base 15 side, which has higher durability than the contact pin 17, so that the cost can be kept lower than when replacing the entire IC socket as in the conventional case.

Further, the spring portion 17d of the contact pin 17
Has a so-called horseshoe shape, and the contact portion 17e is in contact with the lower surface of the terminal 12b of the IC package 12. Therefore, the elastic deformation amount of the spring portion 17d is small. The durability can be improved as compared with a contact pin having a large elastic deformation amount such as the contact pin.

Incidentally, the IC socket 11 of the above embodiment.
Is configured to accommodate the gull wing type IC package 12, and the spring portion 17d of the contact pin 17 that contacts the IC package 12 has a horseshoe shape, but is not limited to this, and as shown in FIG. , BGA (B
It can also be applied to the one that accommodates the all grid array type IC package 32. That is, this IC package 3
2 has a large number of solder balls 32b as "terminals" provided on the lower surface of the package body 32a, and the contact pins 37 connected to the solder balls 32b have solder balls 32b at the upper end of a curved spring portion 37a. A contact portion 37b that is in contact with the. The upper surface of the peripheral edge of the package body 32a is pressed by the latch member 19.

Further, in the above-described embodiment, the contact base 14 and the latch base 1 are provided by the common screw 18.
5 is fastened together with the circuit board P at the same screw fastening position, but not limited to this, if the contact base 14 and the latch base 15 are attached to the circuit board P at different screw fastening positions, the latch base 5 Without removing 15.
The contact base 14 can also be replaced, and the replacement workability can be further improved.

Further, in the above embodiment, the latch opening jig 24 for opening the latch member 19 is the automatic machine 23.
However, the present invention is not limited to this, and for example, the latch opening jig 24 is provided on the latch base 15 so as to be vertically movable, and the automatic opening machine 23 presses the latch opening jig 24 to lower it. As a result, the latch member 19 is formed by the cam portion 24a.
It is also possible to press and rotate. However,
In this case, the latch opening jig 24 must be provided for each IC socket 11, but one latch opening jig 24 is provided on the automatic machine 23 side as in the above embodiment. By setting it, it is not necessary to dispose each IC socket 11, and the structure of the IC socket 11 itself can be simplified.

Furthermore, in the above embodiment, the contact base 14 and the circuit board P were connected via the mother socket 26, but a probe pin type or surface pressure contact type contact pin was used for the contact pin 17. In this case, the contact base 14 can be directly connected to the circuit board P without using the mother socket 26.

[0044]

As described above, according to the first aspect of the invention, the contact base in which the contact pin is arranged and the latch base in which the latch member is arranged are of a split type, and the contact is formed. Since only the contact base provided with pins can be replaced, it is not necessary to replace the latch base provided with a latch member having higher durability than contact pins. Also, it can be reused by replacing a few parts.

According to the second aspect of the present invention, in addition to the above effects, the contact portion of the contact pin abuts the lower surface of the terminal of the IC package, so that the elastic deformation amount of the spring portion of the contact pin is reduced. Since the size is small, the durability can be improved as compared with a conventional so-called open top type IC socket having a large elastic deformation amount such as a contact pin.

[Brief description of drawings]

FIG. 1 is an exploded partial sectional view of an IC socket and a circuit board according to an embodiment of the present invention.

FIG. 2 is a plan view of a contact base of the IC socket according to the same embodiment.

FIG. 3 is a cross-sectional view of the contact base of the IC socket according to the same embodiment taken along the line AA of FIG.

FIG. 4 is a plan view of a latch base of the IC socket according to the same embodiment.

FIG. 5 is a front view in which a half of the latch base of the IC socket according to the same embodiment is sectioned.

FIG. 6 is a plan view showing an assembled state of the contact base and the latch base of the IC socket according to the same embodiment.

FIG. 7 is a partial cross-sectional view of the IC socket, the automatic machine and the like showing a state before the IC package is housed in the IC socket according to the same embodiment.

FIG. 8 is a cross-sectional view showing an IC package, a contact pin, a latch member and the like in a state where the IC package is housed in the IC socket according to the same embodiment.

FIG. 9 is a plan view showing an IC package housed in the IC socket according to the same embodiment.

FIG. 10 is a front view showing an IC package housed in the IC socket according to the same embodiment.

FIG. 11 is a diagram showing an IC package, a contact pin, a latch member and the like corresponding to FIG. 8 showing a modified example.

[Explanation of symbols]

11 IC socket (socket for electric parts) 12,32 IC package (electrical parts) 12a, 32a Package body 12b terminal 32b Solder ball (terminal) 14 Contact base 14b Mounting surface 15 latch base 17,37 contact pins 17d, 37a Spring part 17e, 37b Contact part 18 screws 19 Latch member 19a Suppression section 19b Pressed part 20 axes 21 Spring (biasing member) 23 Automatic machine 24 Latch opening jig 24a Cam part (pressing part) P circuit board

Claims (4)

[Claims] 1. A housing which has a contact base removably attached to a circuit board and a latch base which is arranged at a predetermined position with respect to the contact base, wherein the contact base houses electrical parts. A contact pin having a contact portion that is in contact with a terminal of the electric component is disposed, and a latch member that presses the electric component downward is disposed on the latch base. A socket for electrical components. 2. The contact pin includes the contact portion that comes into contact with a lower surface of a terminal of the electric component from below, and a spring portion that supports the contact portion so as to be movable up and down and urges the contact portion upward. The socket for electrical parts according to claim 1, wherein. 3. The latch member is rotatably provided on the latch base and has a restraining portion that pushes a main body or a terminal of the electric component from above. Socket for electrical parts of. 4. The latch member is provided with a pressed portion, and when the pressed portion is pressed, the holding portion retracts from a position where the pressing portion presses the electric component. The socket for electrical parts according to claim 3.