JP2003218583A - Manufacturing method for translucent electromagnetic shield member - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a translucent electromagnetic shield member having excellent transmittance and the shielding effect of electromagnetic waves. <P>SOLUTION: The manufacturing method includes; a process for developing a specific mesh pattern by a photoresist method on the first copper foil 2 of a laminated copper foil 1 where first copper foil 2 having a thickness of 5 μm or less is formed on second copper foil 4 via a die releasing agent layer 3; a process for removing an undeveloped portion in resist to etch a portion in the first copper foil 2 corresponding to the removed section of the resist by using an etching liquid (A); a process for removing the developed resist; and a process for fixing the first copper foil 2 of the laminated copper foil 1 to a protection layer having adhesiveness and the second copper foil is peeled off for leaving only the first copper foil 2 on the protection layer. The etching liquid (A) contains at least one selected from a group of ammonium persulfate, sodium sulfate, and hydrogen peroxide as a main constituent. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a translucent electromagnetic wave shield member using a photoresist method, which is suitable as an electromagnetic wave shield member for a display, particularly an electromagnetic wave shield member for a plasma display panel. The present invention relates to a method of manufacturing an electromagnetic wave shield member.

[0002]

2. Description of the Related Art In recent years, various reports have been made on the influence of electromagnetic waves generated from electric devices on the human body.
Along with this, in the field of office automation equipment such as personal computers, a technique for cutting off electromagnetic waves is drawing attention.
In order to block electromagnetic waves, a method of making a housing of an electric device a metal body or attaching a metal plate to the housing is usually used. However, in order to block the electromagnetic waves emitted from a display screen such as a CRT or PDP, it is required that the electromagnetic wave shielding effect (blocking effect) is excellent and the light transmitting property is also excellent. It cannot be used as it is.

Conventionally, for the purpose of shielding electromagnetic waves emitted from a display screen of a CRT or the like by covering the display screen, for example, firstly, it is made of a fiber mixed with a highly conductive metal filler. Secondly, a transparent base material in which fibers of a conductive material such as stainless steel or tungsten is embedded is used (Japanese Patent Laid-Open No. 3-35284, Japanese Patent Laid-Open No. 5-327274, Japanese Patent Laid-Open No. 5-26).
No. 9912), and thirdly, a method of using a transparent substrate having a metal or metal oxide vapor deposition film formed on the surface thereof is employed.

[0004]

However, when the first mesh is used, the display screen becomes dark and the contrast and resolution are lowered. Further, since the second transparent base material has fibers embedded therein, there are problems that the manufacturing method becomes complicated, the cost becomes high, and the display screen becomes dark. Further, in the case of the third transparent substrate, if the vapor deposition film is thinned to the extent that sufficient translucency can be maintained, the surface resistance of the vapor deposition film will decrease and the electromagnetic wave attenuation characteristics will also decrease. However, it is not possible to achieve both the translucency and the excellent shielding effect. Besides these examples,
As a member that covers a display screen such as a CRT and shields electromagnetic waves, an ink or paint mixed with highly conductive metal powder is screen-printed to form a grid or striped transparent substrate (JP-A-62-62). -57297, JP-A-9-283977) or a base material formed by screen-printing a mesh pattern made of a conductive paint on the surface of a transparent substrate and baking it in a vacuum (JP-A-2).
No. 52,499) is known, but it is the current situation that a sufficient shielding effect against electromagnetic waves and sufficient translucency cannot be achieved even by using these base materials.

This is because it is necessary to consider the width, thickness, and pitch interval of the conductive pattern in order to achieve both the excellent electromagnetic wave shielding effect and the light-transmitting property. It seems that the consideration was insufficient. That is, in order to achieve both the blocking effect and the translucency, it is necessary to widen the pattern interval and narrow the pattern width as much as possible, but it is difficult to produce a pattern having an extremely fine line width by screen printing or the like. Therefore, it seems that there are problems such as variations in the pattern width and breaks in the pattern.

In addition, there is a method of etching a metal foil by a photoresist method. However, the thickness of a copper foil which is mainly used is limited to about 9 μm, and it is difficult to set the pattern width to 20 μm or less. Further, as a chemical solution used for etching the copper foil, an aqueous solution of cupric chloride and ferric chloride is mainly used, but coloring by the chemical solution occurs when etching with these solutions. In addition, when the copper foil is formed on the transparent film and then etched, the coloring becomes more distinct.

Further, as another method, there is pattern formation by an additive method using plating. After forming a thin metal layer on a resin film or the like, a predetermined pattern is formed by using a photoresist method. After that, there is also a method of growing a pattern on the opening by plating to obtain a predetermined metal pattern, but the number of steps increases and the cost increases.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a method of manufacturing a transparent electromagnetic wave shield member which is excellent in the transparency and the electromagnetic wave shielding effect.

[0009]

To achieve the above object, the present invention provides a laminated copper foil in which a first copper foil having a thickness of 5 μm or less is formed on a second copper foil via a release agent layer. Using the step of developing a predetermined mesh pattern on the first copper foil side of this laminated copper foil by a photoresist method, the undeveloped portion of the resist is removed, and the portion of the first copper foil corresponding to this removed portion is described below. Etching using the etching solution (A), the step of removing the resist which is the developing portion, and the second copper foil after the first copper foil of the laminated copper foil is bonded to the protective layer having adhesiveness. The first gist is a method for producing a translucent electromagnetic wave shielding member, which comprises a step of peeling off the first copper foil and leaving only the first copper foil on the protective layer. The first copper foil having a thickness of 5 μm or less is a release agent layer. The laminated copper foil formed on the second copper foil is used to form a protective layer having adhesiveness. The step of adhering the first copper foil of the laminated copper foil, peeling off the second copper foil and leaving only the first copper foil on the protective layer, and the photoresist method on the side of the first copper foil transferred to the protective layer. A step of developing a predetermined mesh pattern by means of the following steps, a step of removing an undeveloped portion of the resist and a step of etching the portion of the first copper foil corresponding to the removed portion with the following etching solution (A), and a developing portion. The method of manufacturing a transparent electromagnetic wave shield member, which comprises the step of removing the resist as described above, is a second gist. (A) An etching solution containing as a main component at least one selected from the group consisting of ammonium persulfate, sodium sulfate and hydrogen peroxide.

That is, the inventors of the present invention have conducted extensive studies in order to obtain a method of manufacturing a transparent electromagnetic wave shield member having excellent transparency and electromagnetic wave shielding effect. As a result, the first copper having a thickness of 5 μm or less is obtained. A step of developing a predetermined mesh pattern on the first copper foil side of the laminated copper foil by a photoresist method, using a laminated copper foil in which the foil is formed on the second copper foil via a release agent layer; Of the undeveloped portion of the first copper foil and the portion of the first copper foil corresponding to the removed portion are etched using the etching solution (A); the step of removing the resist which is the developed portion; When the first copper foil of the above-mentioned laminated copper foil is attached to the protective layer, and then the second copper foil is peeled off to leave only the first copper foil on the protective layer, the intended purpose is achieved. (That is, excellent in translucency and electromagnetic wave shielding effect) Translucent electromagnetic shielding member, the line width of the pattern is a fine, a simple method and can be produced at low cost) that find, has reached the first method of the present invention. In addition, the present inventors, as a result of the above research,
Using a laminated copper foil in which a first copper foil having a thickness of 5 μm or less is formed on a second copper foil via a release agent layer, the first copper foil of the laminated copper foil is bonded to a protective layer having adhesiveness. After that, a step of peeling off the second copper foil and leaving only the first copper foil on the protective layer, a step of developing a predetermined mesh pattern on the first copper foil side transferred to the protective layer by a photoresist method, and a resist Of the undeveloped portion, the portion of the first copper foil corresponding to the removed portion is etched using the etching solution (A), and the resist which is the developed portion is removed. In such a case, they have found that the intended purpose can be achieved, and have reached the second method of the present invention. As described above, in both the methods of the present invention, an etching solution containing at least one selected from the group consisting of ammonium persulfate, sodium sulfate and hydrogen peroxide as a main component is used as the etching solution used in the etching step. Therefore, the coloration due to the etching liquid does not occur during etching, and the light-transmitting property can be improved. 5 μm
Since the laminated copper foil in which the first copper foil having a thickness equal to or less than the thickness is formed on the second copper foil through the release agent layer is used, it is possible to form a mesh pattern having a line width of 20 μm or less. By transferring the mesh pattern, it becomes possible to easily form the mesh pattern on the protective layer having adhesiveness.

In the present invention, when at least one surface of the first copper foil on which the mesh pattern is formed is subjected to black treatment, reflection from at least one surface of the first copper foil can be reduced.

Next, the present invention will be described in detail.

Regarding the laminated copper foil used in the method for producing a transparent electromagnetic wave shield member of the present invention, the first copper foil having a thickness of 5 μm or less is formed on the second copper foil via the release agent layer, Although not particularly limited, a first copper foil having a thickness of 5 μm or less is formed on the second copper foil by electrolytic or electroless plating, vapor deposition, sputter vapor deposition, or ion plating via a release agent layer. It is possible to use, for example, a first copper foil having a thickness of 5 μm or less attached to the second copper foil via a release agent layer. Further, a dissimilar metal may be adhered to one surface of the second copper foil on the release agent layer side. As the second copper foil, one having a thickness of 18 μm or more is preferably used. When this thickness is less than 18 μm, there is a problem that it becomes difficult to handle.

Next is a step of developing a predetermined mesh pattern by a photoresist method. In this step, for example, a resist film is attached to the first copper foil side of the laminated copper foil to form a predetermined mesh pattern. A resist pattern is formed using a mask. At this time, the mesh pattern is not particularly limited as long as the aperture ratio is 85% or more, but specifically,
Various shapes such as a lattice shape (see FIG. 1), a round lattice (see FIG. 2), a hexagonal lattice (see FIG. 3), and other shapes (see, eg, FIG. 4) can be cited.

After that, etching is carried out. An etching solution containing at least one selected from the group consisting of ammonium persulfate, sodium sulfate and hydrogen peroxide as a main component is used. The composition is not particularly limited as long as it can etch copper, but in the case of ammonium persulfate, it is 10 to 200 g /
L, preferably 50 to 150 g / L dissolved in pure water or 1 to 10 wt% sulfuric acid is used. In the case of sodium sulfate, 10-200 g /
L, preferably 50 to 150 g / L dissolved in pure water or 1 to 10 wt% sulfuric acid is used. In the case of hydrogen peroxide, 10 to 200 g / L, preferably 50 to 150 g / L dissolved in pure water or 1 to 10 wt% sulfuric acid is used. In this way, a mesh pattern having a line width of 20 μm or less can be formed on the first copper foil having a thickness of 5 μm or less formed on the second copper foil.

In the step of forming this into a protective layer having adhesiveness, for example, a press and a laminator are used, and the above-mentioned etched laminated copper foil is attached to the above-mentioned adhesive layer of the resin film on which the adhesive layer is formed. The one side of the first copper foil is attached, the second copper foil is peeled off, and only the first copper foil is left on the adhesive layer. A foil) can be formed on the adhesive layer of the resin film. For example, the pressure, temperature, and speed of a laminator vary depending on the type of adhesive in the adhesive layer. As a typical example, when an acrylic pressure-sensitive adhesive is used, the pressure is 0.1 ~ 1.
0 MPa, temperature 18 to 80 ° C., speed 0.1 to 10 m / m
In is preferable.

The adhesive of the adhesive layer in the protective layer is not particularly limited, but may be one that exhibits adhesiveness by heating, pressure sensitivity, etc., or a thermosetting adhesive may be used.

There is no particular limitation on what exhibits adhesiveness by heating, but it is preferable to use at least one of acrylic, polyolefin, polyester, polyimide, aromatic polyester, polyether sulfone and epoxy as a main component. Plastic adhesives can be used. Further, if necessary, additives such as a cross-linking agent, a tackifying resin, a plasticizer, a filler and an antiaging agent may be appropriately used.

The polymer of the pressure-sensitive adhesive and the monomer component forming the polymer are not particularly limited. Any of the monomer components used in the preparation of known pressure-sensitive adhesives such as acrylic pressure-sensitive adhesives, rubber-based pressure-sensitive adhesives, styrene / conjugated diene block copolymer-based pressure-sensitive adhesives can be used. Specific examples thereof include methyl group, ethyl group, propyl group, butyl group, 2
-Ethylhexyl group, isooctyl group, isononyl group,
Isodecyl group, dodecyl group, lauryl group, tridecyl group, pentadecyl group, octadecyl group, nonadecyl group,
Acrylic acid having an alkyl group having 20 or less carbon atoms such as eicosyl group, or acrylic acid type alkyl ester such as methacryl group, acrylic acid, methacrylic acid, itaconic acid, hydroxyethyl acrylate, hydroxyethyl methacrylate, Examples thereof include hydroxypropyl acrylate, N-methylol acrylamide, acrylonitrile, methacrylonitrile, glycidyl acrylate, glycidyl methacrylate, vinyl acetate, styrene, isoprene, butadiene, isobutylene, vinyl ether and the like. Further, natural rubber, recycled rubber, etc. can also be used. If necessary, a cross-linking agent,
Appropriate additives such as tackifying resins, plasticizers, fillers and antiaging agents may be used in combination.

The thermosetting adhesive layer is not particularly limited, but a thermoplastic adhesive containing at least one of acrylic resin, polyolefin resin, polyimide resin and epoxy resin as a main component can be used. ..

The resin film used as the protective layer includes
Although it is not particularly limited as long as it has a light-transmitting property, polyethylene resin represented by polyethylene terephthalate and polybutylene terephthalate, polyolefin resin represented by polyethylene, perfluoroalkyl ether, ethylene-polytetrafluoroethylene copolymer Fluorine resin represented by polymer, aromatic polyester, polyether sulfone, polyether ketone, polyether ether ketone, acrylic resin, vinyl chloride, etc. are used, and polyethylene terephthalate is preferably used from the viewpoint of transparency and cost. .

The blackening treatment is not particularly limited as long as it can be visually recognized from the display screen and the reflection by the first copper foil can be reduced, but the application of black ink or the like, copper, nickel, cobalt. It is suitable to use one or a combination of two or more metal oxides such as palladium, platinum, indium, tin, titanium and chromium. These treatments may be performed before transferring to the protective layer or after transferring to the protective layer.

After that, another protective layer is attached,
A structure in which a copper mesh pattern is embedded in the adhesive layer of the protective layer is formed (see FIG. 13). In this way, the translucent electromagnetic wave shield member is manufactured.

[0024]

BEST MODE FOR CARRYING OUT THE INVENTION Next, embodiments of the present invention will be described in detail.

5 to 13 show an embodiment of a method of manufacturing a translucent electromagnetic wave shield member of the present invention. In this embodiment, first, a thin copper foil (first copper foil) 2 having a thickness of 5 μm or less is formed on a thick copper foil (second copper foil) 4 having a thickness of 18 μm or more via a release agent layer 3. The laminated copper foil 1 is prepared (see FIG. 5). Then, a predetermined mesh pattern is developed on the thin copper foil 2 of the laminated copper foil 1 by a photoresist method (see FIG. 6. In FIG. 6, 5 is a dry film resist and 6 is a mask having a predetermined mesh pattern. is there). Next, the undeveloped portion of the dry film resist 5 is removed (see FIG. 7), and the portion of the thin copper foil 2 corresponding to this removed portion is etched (see FIG. 8). At this time,
At least one selected from the group consisting of ammonium persulfate, sodium sulfate, and hydrogen peroxide as the etching liquid.
The one that contains two as the main component is used. Next, the dry film resist 5 which is the developing portion is removed (see FIG. 9).
reference). Next, the thin copper foil 2 of the laminated copper foil 1 is attached to the resin film (protective layer) 7 having the adhesive layer 8 (see FIGS. 10 and 11), and then the thick copper foil 4 is peeled off and thinned. Only the copper foil 2 is left on the adhesive layer 8 (see FIG. 12). After that, another resin film 7 having the adhesive layer 8 is attached onto the adhesive layer 8 on which the thin copper foil 2 remains. As a result, a transparent electromagnetic wave shield member 9 (see FIG. 13) in which a copper mesh pattern (that is, the thin copper foil 2 having the shape of the mesh pattern) is embedded in the adhesive layer 8 between the resin films 7 is produced. can do.

14 to 19 show another embodiment of the method for manufacturing a translucent electromagnetic wave shield member of the present invention.
In this embodiment, first, a thin copper foil (first copper foil) 12 having a thickness of 5 μm or less is formed on a thick copper foil (second copper foil) 14 having a thickness of 18 μm or more via a release agent layer 13. The laminated copper foil 11 is prepared (see FIG. 14), and the thin copper foil 12 of the laminated copper foil 11 is prepared.
A resin film (protective layer) 17 having an adhesive layer 18
(See FIGS. 14 and 15). Then,
The thick copper foil 14 is peeled off and only the thin copper foil 12 is left on the adhesive layer 18 (see FIG. 16). Next, a predetermined mesh pattern is developed on the thin copper foil 12 transferred onto the adhesive layer 18 of the resin film 17 by a photoresist method (FIG. 17).
reference. In FIG. 17, 15 is a dry film resist, and 16 is a mask having a predetermined mesh pattern).
Next, the undeveloped portion of the dry film resist 15 is removed (see FIG. 18), and the portion of the thin copper foil 12 corresponding to this removed portion is etched (see FIG. 19). At this time, an etching solution containing at least one selected from the group consisting of ammonium persulfate, sodium sulfate and hydrogen peroxide as a main component is used. Next, the dry film resist 15 which is the developing portion is removed (not shown, see FIG. 12). After that, another resin film (not shown) having an adhesive layer is attached onto the adhesive layer 18 from which the dry film resist 15 has been removed, and a copper mesh is formed in the adhesive layer 18 between both resin films 17. A transparent electromagnetic wave shield member (not shown; see FIG. 13) in which a pattern (that is, a thin copper foil 12 in the shape of a mesh pattern) is embedded can be manufactured.

Next, examples will be described together with comparative examples.

[0028]

Example 1 A laminated copper foil 1 with a carrier in which a thin copper foil 2 having a thickness of 3 μm is laminated on a thick copper foil 4 having a thickness of 35 μm via a release agent layer 3 (MT-35 manufactured by Mitsui Mining & Smelting Co., Ltd.) ( After the dry film resist 5 (SPG102 manufactured by Asahi Kasei Corp.) is thermally laminated on the thin copper foil 2 (see FIG. 5), exposed and developed to form a grid pattern having a line width of 20 μm and a pitch of 300 μm (see FIG. 6 and FIG. 7), the thin copper foil 2 is etched with an aqueous solution of ammonium persulfate 150 g / L, 5% sulfuric acid (see FIG. 8), the dry film resist 5 is removed, and the thin copper foil 4 is thinly copper-coated. A grid pattern made of foil 2 was formed (see FIG. 9).

Separately, 50 parts by weight of ethyl acrylate and 50 parts by weight of 2-ethylhexyl acrylate are mixed with 5 parts by weight of a polyurethane-based crosslinking agent and 100 parts by weight of a base polymer composed of a copolymer, and a polyester film 7 having a thickness of 35 μm is used.
It was applied to the surface of (Lumirror manufactured by Toray Industries, Inc.) in a thickness of 30 μm. After the laminated copper foil 1 with a pattern was laminated (50 ° C. × 0.5 MPa) on the polyester film 7 with the pressure-sensitive adhesive layer 8 produced in this way by lamination (see FIGS. 10 and 11), the thickness The copper foil 4 was peeled off to form a copper pattern (thin copper foil 2 formed in a grid pattern) having a thickness of 3 μm on the pressure-sensitive adhesive layer 8 (see FIG. 12). Next,
After forming a black electroplated nickel on the copper pattern to a thickness of 1 μm, another polyester film 7 with the pressure-sensitive adhesive layer 8 produced as described above is laminated,
A transparent electromagnetic wave shield member 9 having a copper pattern in the pressure-sensitive adhesive layer 8 was produced (see FIG. 13).

When the aperture ratio was measured, it was 87.9%, the line width was 19 μm, and the visible light transmittance was 76%. Also,
When the translucent electromagnetic wave shield member 9 is manufactured in the same manner as described above, when an aqueous solution of 150 g / L of 5% sulfuric acid is used instead of an aqueous solution of 150 g / L of 5% sulfuric acid of ammonium persulfate, The aperture ratio is 88.0%, the line width is 18.8 μm, the visible light transmittance is 77%, and the aperture ratio is 87.5% when an aqueous solution of hydrogen peroxide 150 g / L and 5% sulfuric acid is used. The line width was 19.3 μm, and the visible light transmittance was 75%.

[0031]

Example 2 A copper foil with a carrier 11 (MT-35 manufactured by Mitsui Mining & Smelting Co., Ltd.) in which a thin copper foil 12 having a thickness of 3 μm is laminated on a thick copper foil 14 having a thickness of 35 μm via a release agent layer 13 is used. On a thin copper foil 12, with respect to 100 parts by weight of a base polymer composed of a copolymer of 50 parts by weight of ethyl acrylate and 50 parts by weight of 2-ethylhexyl acrylate, 5 parts by weight of a polyurethane-based cross-linking agent was added to a polyester film 1 having a thickness of 35 μm.
A sheet formed by applying 30 μm in thickness to the surface of No. 7 (Lumirror manufactured by Toray Industries, Inc.) was laminated by lamination (50
(° C. × 0.5 MPa) (see FIGS. 14 and 15). Next, the thick copper foil 14 was peeled off, and only the thin copper foil 12 was left on the pressure-sensitive adhesive layer 18 of the sheet (see FIG. 16). Next, a dry film resist 15 (SPG102 manufactured by Asahi Kasei Corporation) was thermally laminated on the thin copper foil 12, exposed and developed to form a grid pattern having a line width of 20 μm and a pitch of 300 μm (FIGS. 17 and 18). reference). Next,
The thin copper foil 12 is etched with an aqueous solution of ammonium persulfate 150 g / L, 5% sulfuric acid (see FIG. 19), the dry film resist 15 is removed, and on the pressure-sensitive adhesive layer 18,
A grid pattern made of thin copper foil 12 was formed (not shown, see FIG. 12).

Next, black electroless nickel plating is formed on the copper pattern (thin copper foil 12 formed in a grid pattern) to a thickness of 1 μm, and then another pressure-sensitive adhesive layer 18 produced as described above is formed. The attached polyester film 17 was adhered to produce a translucent electromagnetic wave shield member having a copper pattern in the pressure-sensitive adhesive layer 18 (not shown; see FIG. 13).

When the aperture ratio was measured, it was 87.1%, the line width was 20 μm, and the visible light transmittance was 74%. Also,
When a transparent electromagnetic wave shield member is produced in the same manner as described above, when an aqueous solution of sodium sulfate 150 g / L and 5% sulfuric acid is used instead of the aqueous solution of ammonium persulfate 150 g / L and 5% sulfuric acid, The aperture ratio is 87.0%, the line width is 20 μm, the visible light transmittance is 73.5%, and when an aqueous solution of hydrogen peroxide 150 g / L and 5% sulfuric acid is used,
The aperture ratio was 87.5%, the line width was 19.5 μm, and the visible light transmittance was 75%.

[0034]

Comparative Example 1 A laminated copper foil 1 with a carrier (MT-35 manufactured by Mitsui Mining & Smelting Co., Ltd.) in which a thin copper foil 2 having a thickness of 3 μm is laminated on a thick copper foil 4 having a thickness of 35 μm via a release agent layer 3 ( Dry film resist 5 (SPG102 manufactured by Asahi Kasei Corp.) is thermally laminated on the thin copper foil 2 (see FIG. 5), exposed and developed to form a grid pattern having a line width of 20 μm and a pitch of 300 μm (see FIG. 6 and FIG. 7), 40%
The thin copper foil 2 was etched with an aqueous solution of ferric chloride (see FIG. 8), the dry film resist 5 was removed, and a grid-like pattern made of the thin copper foil 2 was formed on the thick copper foil 4 (FIG. 9).
reference).

Separately, with respect to 100 parts by weight of a base polymer composed of a copolymer of 50 parts by weight of ethyl acrylate and 50 parts by weight of 2-ethylhexyl acrylate, 5 parts by weight of a polyurethane-based cross-linking agent and a polyester film 7 having a thickness of 35 μm are used.
It was applied to the surface of (Lumirror manufactured by Toray Industries, Inc.) in a thickness of 30 μm. After the laminated copper foil 1 with a pattern was laminated (50 ° C. × 0.5 MPa) on the polyester film 7 with the pressure-sensitive adhesive layer 8 produced in this way by lamination (see FIGS. 10 and 11), the thickness The copper foil 4 was peeled off to form a copper pattern (thin copper foil 2 formed in a grid pattern) having a thickness of 3 μm on the pressure-sensitive adhesive layer 8 (see FIG. 12). After that, black electroless nickel plating was formed on the copper pattern to a thickness of 1 μm, and then another polyester film 7 with the pressure-sensitive adhesive layer 8 produced as described above was bonded to the inside of the pressure-sensitive adhesive layer 8. A light-transmitting electromagnetic wave shield member 9 having a copper pattern on was produced (see FIG. 13).

When the aperture ratio was measured, it was 87.5%, the line width was 19.5 μm, and the visible light transmittance was 50%. It is considered that the visible light transmittance was low due to contamination with ferric chloride.

[0037]

As described above, according to the method for producing a transparent electromagnetic wave shield member of the present invention, since the mesh pattern is formed on the protective layer having adhesiveness by transfer,
It can be easily formed into a mesh pattern. Moreover, since the etching liquid containing at least one selected from the group consisting of ammonium persulfate, sodium sulfate, and hydrogen peroxide as the main component is used, it is excellent in translucency without coloring. By using the first copper foil having a thickness of 5 μm or less, a transparent electromagnetic wave shield member capable of forming a wiring width of 20 μm or less can be manufactured.

In the present invention, when at least one surface of the first copper foil on which the mesh pattern is formed is subjected to black treatment, reflection from at least one surface of the first copper foil can be reduced.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing an example of a shape of a mesh pattern.

FIG. 2 is an explanatory diagram showing another example of the shape of the mesh pattern.

FIG. 3 is an explanatory diagram showing still another example of the shape of the mesh pattern.

FIG. 4 is an explanatory diagram showing still another example of the shape of the mesh pattern.

FIG. 5 is a cross-sectional view showing an embodiment of a method of manufacturing a translucent electromagnetic wave shield member of the present invention.

FIG. 6 is a cross-sectional view showing a method for manufacturing the transparent electromagnetic wave shield member.

FIG. 7 is a cross-sectional view showing a method for manufacturing the transparent electromagnetic wave shield member.

FIG. 8 is a cross-sectional view showing the method of manufacturing the transparent electromagnetic wave shield member.

FIG. 9 is a cross-sectional view showing a method for manufacturing the transparent electromagnetic wave shield member.

FIG. 10 is a cross-sectional view showing the method of manufacturing the transparent electromagnetic wave shield member.

FIG. 11 is a cross-sectional view showing the method of manufacturing the transparent electromagnetic wave shield member.

FIG. 12 is a cross-sectional view showing the method of manufacturing the translucent electromagnetic wave shield member.

FIG. 13 is a cross-sectional view showing the translucent electromagnetic wave shield member.

FIG. 14 is a cross-sectional view showing another embodiment of the method for manufacturing a transparent electromagnetic wave shield member of the present invention.

FIG. 15 is a cross-sectional view showing the method of manufacturing the translucent electromagnetic wave shield member.

FIG. 16 is a cross-sectional view showing the method of manufacturing the transparent electromagnetic wave shield member.

FIG. 17 is a cross-sectional view showing the method of manufacturing the transparent electromagnetic wave shield member.

FIG. 18 is a cross-sectional view showing the method of manufacturing the transparent electromagnetic wave shield member.

FIG. 19 is a cross-sectional view showing the method of manufacturing the transparent electromagnetic wave shield member.

[Explanation of symbols]

1 laminated copper foil 2 First copper foil 3 Release agent layer 4 second copper foil

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Yoshihiro Hieda             1-2 1-2 Shimohozumi, Ibaraki City, Osaka Prefecture Nitto             Electric Works Co., Ltd. F-term (reference) 5C058 AA01 AA11 BA33 BA35                 5E321 AA04 BB21 BB41 CC16 GG05                       GH01

Claims (3)

[Claims] 1. A laminated copper foil in which a first copper foil having a thickness of 5 μm or less is formed on a second copper foil via a release agent layer, and a photoresist method is applied to the first copper foil side of the laminated copper foil. A step of developing a predetermined mesh pattern by means of the following steps, a step of removing an undeveloped portion of the resist and a step of etching the portion of the first copper foil corresponding to the removed portion with the following etching solution (A), and a developing portion. And a step of adhering the first copper foil of the laminated copper foil to the protective layer having adhesiveness, peeling the second copper foil and leaving only the first copper foil on the protective layer. A method of manufacturing a transparent electromagnetic wave shield member, comprising: (A) An etching solution containing as a main component at least one selected from the group consisting of ammonium persulfate, sodium sulfate and hydrogen peroxide. 2. A laminated copper foil in which a first copper foil having a thickness of 5 μm or less is formed on a second copper foil via a release agent layer, and a protective layer having an adhesive property is formed from the first laminated copper foil. After the copper foils are bonded together, the second copper foil is peeled off and only the first copper foil is left on the protective layer, and a predetermined mesh pattern is developed on the first copper foil side transferred to the protective layer by a photoresist method. And a step of removing the undeveloped portion of the resist and etching the portion of the first copper foil corresponding to the removed portion using the following etching solution (A), and a step of removing the resist which is the developed portion. And a method for manufacturing a translucent electromagnetic wave shield member. (A) An etching solution containing as a main component at least one selected from the group consisting of ammonium persulfate, sodium sulfate and hydrogen peroxide. 3. A first device having the mesh pattern formed thereon.
The method for producing a translucent electromagnetic wave shield member according to claim 1, wherein at least one surface of the copper foil is subjected to black treatment.