JP2000315890A - Manufacture of electromagnetic wave shielding film, the electromagnetic wave shielding film, and electromagnetic wave shield and display using the film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To inexpensive provide an electromagnetic wave shielding film having a high electromagnetic wave shielding property, transparency, and unvisibility. SOLUTION: An electromagnetic wave shielding film is characterized, in that a geometrical etching resist pattern is formed on the conductive metallic layer of a plastic film formed by laminating the conductive metallic layer upon a plastic substrate, so that the film carries a conductive metal, and a geometrical graphic composed of the conductive metal is formed by etching the conductive metallic layer.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a cathode ray tube (CR)
T), a method for producing an electromagnetic wave shielding film having a shielding property for an electromagnetic wave generated from the front surface of a display such as a plasma display panel (PDP), a liquid crystal panel, and an electroluminescence (EL) panel, an electromagnetic wave shielding film, and this electromagnetic wave shielding film. The present invention relates to an electromagnetic wave shield and a display.

[0002]

2. Description of the Related Art As a method of shielding electromagnetic wave noise generated from the front of a display such as a CRT or PDP, a method of forming a thin film conductive layer by depositing a metal or a metal oxide on a transparent substrate (Japanese Patent Laid-Open No. 1-278800). JP-A-5-323101). On the other hand, electromagnetic wave shielding materials in which good conductive fibers are embedded in a transparent base material (Japanese Patent Application Laid-Open Nos. 5-327274 and 5-26)
No. 9912) and an electromagnetic wave shielding material (see JP-A-62-57297 and JP-A-2-52499) in which a conductive resin containing metal powder or the like is directly printed on a transparent substrate. An electromagnetic wave shielding material in which a transparent resin layer is formed on a transparent substrate described above and a copper mesh pattern is formed thereon by electroless plating (see JP-A-5-283889) has been proposed.
Recently, a method using a photolithographic method (see Japanese Patent Application Laid-Open No. H10-41682) has been proposed.

[0003]

As a method for achieving both the electromagnetic wave shielding property and the transparency, Japanese Patent Application Laid-Open No. 1-278800 has been disclosed.
In the method of forming a thin film conductive layer by depositing a metal or metal oxide on a transparent substrate disclosed in Japanese Patent Application Laid-Open No. (100 ° -2,000 °), the surface resistance of the conductive layer becomes too large, so that the shielding effect of 30 dB or more, preferably 40 dB or more required at 30 MHz to 1 GHz, is insufficient at 20 dB or less. An electromagnetic wave shielding material in which a good conductive fiber is embedded in a transparent substrate (JP-A-5-327274, JP-A-5-269912)
In the publication, the electromagnetic wave shielding effect of 30 MHz to 1 GHz is 40 to 50 dB, but when the fiber diameter having no problem in visibility is 25 μm, the pitch required for regularly arranging the conductive fibers becomes 50 μm or less, The aperture ratio was reduced and the transparency was impaired, which was not suitable for display applications.

The same applies to an electromagnetic wave shielding material in which a conductive resin containing a metal powder or the like described in JP-A-62-57297 and JP-A-2-52499 is directly printed on a transparent substrate by a screen printing method or the like. In addition, the line width is about 50 to 100 μm due to the limit of printing accuracy, and the transparency is lowered and the visibility of the conductive mesh is developed. On the other hand, as a patent using the intaglio offset printing method, the registered
There is No. 6, in which a conductive film is directly formed by printing, and a desired electromagnetic wave shielding property cannot be obtained with this method.

Further, in a shield material in which a transparent resin layer is formed on a transparent substrate such as polycarbonate described in JP-A-5-283889 and a copper mesh pattern is formed thereon by an electroless plating method, electroless plating is used. In order to secure the adhesion of the transparent substrate, there is a restriction that a step of roughening the surface of the transparent substrate is required, and the substrate must not be damaged in the electroless plating step. Further, when the transparent substrate is thick, it cannot be brought into close contact with the display, and there has been a problem that leakage of electromagnetic waves from the transparent substrate increases. On the other hand, JP-A-10-416 using the photolithography method
In the method described in Japanese Patent Publication No. 82, the process becomes complicated, and the cost of the manufacturing apparatus is increased due to an increase in the cost of the manufacturing apparatus.

The electromagnetic wave shielding film is required to have an electromagnetic wave shielding function of 30 dB or more, preferably 40 dB or more at 30 MHz to 1 GHz with respect to the shielding property of the electromagnetic wave generated from the front surface of the display, as well as good visible light. Not only is the transparency and the visible light transmittance high, but also the non-visibility, which is a characteristic in which the presence of the shielding material cannot be confirmed with the naked eye, is required. In view of the above, the present invention provides a method for manufacturing an electromagnetic shielding film having electromagnetic shielding properties and transparency / invisibility at low cost, an electromagnetic shielding film obtained by this method, and an electromagnetic wave using the electromagnetic shielding film. A shield and a display are provided.

[0007]

The present invention relates to the following. (1) An etching resist pattern having a geometric pattern is formed by a screen printing method on a conductive metal layer of a plastic film with a conductive metal formed by laminating a conductive metal layer on a plastic support. A method for producing an electromagnetic wave shielding film, wherein a geometrical figure made of a conductive metal is formed by etching a layer. (2) The line width of the conductive metal after etching is 40 μm
The method for producing an electromagnetic wave shielding film according to any one of the following (1). (3) The method for producing an electromagnetic wave shielding film according to (2), wherein the etching of the conductive metal layer is over-etching. (4) The line width of the etching resist pattern is 20 to
The method for producing an electromagnetic wave shielding film according to (3), wherein the thickness is 100 μm. (5) The method for producing an electromagnetic wave shielding film according to any of (3) or (4), wherein the overetching is performed so that the line width of the conductive metal is smaller than the line width of the etching resist pattern by 10 μm or more. (6) The method for producing an electromagnetic wave shielding film according to any one of (1) to (4), wherein the aperture ratio of the conductive metal layer after the etching is 50% or more. (7) The method for producing an electromagnetic wave shielding film according to any one of (1) to (6), wherein the conductive metal is black copper. (8) The method for producing an electromagnetic wave shielding film according to any one of (1) to (7), wherein a blackening treatment is performed on the conductive metal before or after the etching. (9) Metal plating is performed on the conductive metal before or after etching (1).
The method for producing an electromagnetic wave shielding film according to any one of (8) to (8). (10) The method for producing an electromagnetic wave shielding film according to any one of (1) to (9), wherein the plastic support is a surface-treated plastic support. (11) As a surface treatment method for a plastic support,
The method for manufacturing an electromagnetic wave shielding film according to any one of (1) to (10), wherein at least one of a primer treatment, a plasma treatment, and a corona discharge treatment is applied. (12) The method for producing an electromagnetic wave shielding film according to any one of (1) to (11), wherein the plastic support is a polyethylene terephthalate film or a polycarbonate film. (13) An electromagnetic wave shielding film produced by the method according to any one of (1) to (12). (14) An electromagnetic wave shielding structure comprising the electromagnetic wave shielding film and the glass plate or the electromagnetic wave shielding film and the plastic plate according to (13). (15) A display using the electromagnetic wave shielding film according to (13) or the electromagnetic wave shielding body according to (14).

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail.
Examples of the conductive metal used in the present invention include copper, aluminum, nickel, iron, gold, silver, platinum, tungsten, chromium, titanium, tin, lead, palladium, and the like. Alloys such as stainless steel and solder that are included in combination can also be used. Conductivity,
Silver, copper, nickel, or aluminum is suitable from the viewpoint of price. Among them, copper is excellent in conductivity and price, and particularly excellent in fine circuit workability. On the other hand, when iron, nickel, or cobalt, which is a paramagnetic metal, is used as the conductive metal, it is possible to improve the shielding property of a magnetic field in addition to an electric field. The thickness of the conductive metal layer is 0.5
４０40 μm is preferred. If the thickness exceeds 40 μm, it is difficult to form a fine line width or the viewing angle becomes narrow. If the thickness is less than 0.5 μm, the surface resistance tends to be large, and the electromagnetic wave shielding effect tends to be poor.

The conductive metal, especially when it is copper,
It is preferable that the surface is blackened because the contrast is increased. In addition, it is possible to prevent the conductive metal from being oxidized with time and discolored. The blackening treatment is to blacken the surface of the conductive metal. This blackening treatment may be performed before or after the formation of the geometrical figure, but is usually performed in the printed wiring board field after the formation. This can be done using known methods. As a method of the blackening treatment, a method of oxidizing the surface of the conductive metal to obtain copper oxide, for example, sodium chlorite (31 g / l), sodium hydroxide (15 g / l), trisodium phosphate (12 g / l)
g / l) in an aqueous solution at 95 ° C for 2 minutes. As a method of the blackening treatment, there is a method of performing electroless nickel plating on a conductive metal. Preferably, the conductive metal is blackened copper.

It is preferable that the conductive metal is a paramagnetic metal because of its excellent magnetic field shielding property. Examples of the paramagnetic metal include nickel, iron, stainless steel, and titanium. Further, by applying plating on the conductive metal, the electromagnetic wave shielding property can be further improved. Either electrolytic plating or electroless plating can be used as a method for applying metal plating. The type of plating metal can be gold, silver, copper, nickel, aluminum, etc.
Copper or nickel is most suitable in terms of conductivity and price. The range of the plating thickness is preferably from 0.1 to 100 μm, and if it is less than 0.1 μm, the conductivity is insufficient, so that sufficient shielding properties may not be exhibited. If the plating thickness exceeds 100 μm, the viewing angle becomes narrow, which is not preferable. 0.5-50 μm is more preferred.

[0011] The conductive metal forms a layer on the entire surface or almost the entire surface of one side of the plastic support, and then,
Generally, it is processed into a desired geometrical figure. The simplest method of adhering the conductive metal layer to the plastic film is to bond the plastic support and the conductive metal film or foil via an adhesive.

The adhesive has a refractive index of 1.40 to
It is preferable to use those having a range of 1.70. This is because the visible light transmittance decreases when the refractive index of the plastic support and the adhesive layer used in the present invention are different, and when the refractive index is 1.40 to 1.70, the visible light transmittance decreases. Good with little diffuse reflection. Typical examples of the material of the adhesive include a thermoplastic resin or a thermosetting resin shown below. For example, natural rubber (n = 1.5
2: n indicates a refractive index; the same applies hereinafter), polyisoprene (n = 1.521), poly-1,2-butadiene (n = 1.5
0), polyisobutene (n = 1.505 to 1.51), polybutene (n = 1.513), poly-2-heptyl-1,3-butadiene (n = 1.50), poly-2-t-butyl-1,3-butadiene ( n = 1.506), poly-1,3-butadiene (n =
(Di) enes such as 1.515), polyoxyethylene (n =
1.456), polyoxypropylene (n = 1.450), polyvinyl ethyl ether (n = 1.454), polyvinyl hexyl ether (n = 1.459), polyvinyl butyl ether (n
= 1.456), polyvinyl acetate (n = 1.467), polyvinyl propionate (n = 1.467)
Such as polyesters and polyvinyl butyral resin (n
1.52), EVA resin (n = 1.48 to 1.49), polyvinyl acetate resin (n = 1.5), polyurethane (n = 1.5 to 1.6) and polyester polyurethane (n = 1.5 to 1.6), ethyl cellulose (n = 1.479), Polyvinyl chloride (n = 1.54 to 1.5
5), polyacrylonitrile (n = 1.52), polymethacrylonitrile (n = 1.52), polysulfone (n = 1.633),
Polysulfide (n = 1.6), phenoxy resin (n = 1.5 ~
1.6), polyethyl acrylate (n = 1.469), polybutyl acrylate (n = 1.466), poly-2-ethylhexyl acrylate (n = 1.463), poly-t-butyl acrylate (n = 1.464), poly-3-ethoxy Propyl acrylate (n = 1.465), polyoxycarbonyl tetramethacrylate (n = 1.465), polymethyl acrylate (n = 1.472 to 1.480), polyisopropyl methacrylate (n = 1.473), polydodecyl methacrylate (n = 1.4)
74), polytetradecyl methacrylate (n = 1.475),
Poly-n-propyl methacrylate (n = 1.484), poly-3,3,5-trimethylcyclohexyl methacrylate (n = 1.484), polyethyl methacrylate (n = 1.48)
5) Poly (meth) acryl such as poly-2-nitro-2-methylpropyl methacrylate (n = 1.487), poly-1,1-diethylpropyl methacrylate (n = 1.489), polymethyl methacrylate (n = 1.489) Acid esters can be used. If necessary, two or more of these acrylic polymers may be copolymerized, or two or more of them may be used as a blend.

Further, epoxy acrylate (n = 1.48 to 1.6) is used as a copolymer resin of acrylic resin and other than acrylic resin.
0), urethane acrylate (n = 1.5 to 1.6), polyether acrylate (n = 1.48 to 1.49), polyester acrylate (n = 1.48 to 1.54) and the like can also be used. In particular, urethane acrylate, epoxy acrylate, and polyether acrylate are excellent from the viewpoint of adhesiveness. Examples of epoxy acrylate include 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, allyl alcohol diglycidyl ether, and resorcinol. (Meth) acrylic such as diglycidyl ether, diglycidyl adipate, diglycidyl phthalate, polyethylene glycol diglycidyl ether, trimethylolpropane triglycidyl ether, glycerin triglycidyl ether, pentaerythritol tetraglycidyl ether, sorbitol tetraglycidyl ether Acid adducts. Polymers having a hydroxyl group in the molecule, such as epoxy acrylate, which reacts or is originally in the molecule are effective for improving the adhesiveness. These copolymer resins can be used in combination of two or more as necessary. The adhesive resin composition used in the present invention, if necessary, a diluent, a plasticizer,
Additives such as an antioxidant, an ultraviolet absorber, an infrared absorber, a filler, a tackifier, and a crosslinking agent may be blended.

These polymers can be dissolved in a general-purpose solvent or used without solvent. The adhesive composition used in the present invention may contain, if necessary, a dispersant, a thixotropic agent, a defoaming agent, a leveling agent, a diluent, a plasticizer, an antioxidant, a metal Activators, additives such as coupling agents and fillers may be added. The adhesive is preferably applied to a thickness of

As another method for bringing the conductive metal layer into close contact with the plastic film, a thin film such as a vacuum evaporation method, a sputtering method, an ion plate method, a chemical vapor deposition method, and an electroless / electroplating method is applied to the plastic film. There is a method of forming a layer of a conductive metal by one of the forming techniques or by combining two or more methods. These methods are particularly effective when it is necessary to reduce the thickness of the conductive layer of the conductive metal. In these cases, a conductive thin film is previously formed on a plastic support using indium oxide, tin oxide, and a mixture thereof (hereinafter, ITO), titanium oxide, stannic oxide, cadmium oxide, and a mixture thereof. A layer may be formed.

The thickness of the conductive metal is preferably 40 μm or less, and the thinner the thickness, the wider the viewing angle of the display is, which is preferable as an electromagnetic wave shielding material, and more preferably, 18 μm or less.

Examples of the plastic support used in the present invention include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate, polyolefins such as polyethylene, polypropylene, polystyrene and EVA, and vinyl such as polyvinyl chloride and polyvinylidene chloride. It is preferable that the film is made of a plastic such as a base resin, polysulfone, polyethersulfone, polycarbonate, polyamide, polyimide, and acrylic resin, and has a total visible light transmittance of 70% or more including colorless or colored and a thickness of 1 mm or less. These can be used as a single layer, or may be used as a multilayer film in which two or more layers are combined. Among them, a polyethylene terephthalate film or a polycarbonate film is preferable in terms of transparency, heat resistance, ease of handling, and price.
The thickness of the plastic film is more preferably from 5 to 500 μm. If it is less than 5 μm, the handleability tends to deteriorate, and if it exceeds 500 μm, the transmittance of visible light tends to decrease. 10 to 200 μm is more preferred.

In order to improve the adhesion between the conductive metal and the plastic support, various surface treatments can be applied to the plastic support. As the method, a treatment by applying a primer to a plastic support, a plasma treatment, a corona discharge treatment and the like are effective. With these treatments, the critical surface tension of the plastic support after treatment is 35 dy.
It is necessary to be at least n / cm, more preferably at least 40 dyn / cm. If the critical surface tension is less than 35 dyn / cm, the adhesion to the conductive metal decreases, so that when forming a line width of 40 μm or less by etching, lines or bleeding are likely to occur.

Further, an anti-reflection layer, a near-infrared shielding layer may be formed or included on the outermost layer of the electromagnetic wave shielding film or on the transparent plastic support. In addition, an adhesive layer may be provided at an arbitrary position, and an electromagnetic wave shielding film may be attached thereto or may be laminated with another layer.

In the present invention, it is preferable to use a method of forming an etching resist pattern by a screen printing method as a method of forming a geometric figure of a conductive metal. More specifically, an etching resist ink is printed on a conductive metal layer of a plastic film with a conductive metal (MCF) and cured, and then a geometric pattern of the conductive metal is formed by an etching process. There is a method of peeling off. The above-mentioned method is easy to increase the size of the manufacturing equipment, cheap in the manufacturing equipment, and inexpensive in running costs, as compared with the method using the intaglio offset printing method or the lithographic offset printing method. In screen printing, a mesh plate made by adding an emulsion to a mesh and forming the desired pattern holes in the emulsion, a meshless metal made by applying an emulsion to a meshless metal plate and forming the desired pattern holes in the emulsion. Generally, a pattern is printed using a squeegee on the conductive metal layer through a plate such as a plate.

As the etching resist ink, any one can be used as long as the cured product has resistance to the etching treatment of the conductive metal, and commonly used ones can be used. Examples of the etching resist ink include a negative photoresist composition, a photosensitive resin composition, and a thermosetting resin composition.

Negative photoresist compositions include those containing an aqueous alkali solution-soluble resin, an amino resin and an acid generator. After printing and drying, the activity of ultraviolet rays, far ultraviolet rays, X-rays, electron beams, etc. Irradiation,
Further, if necessary, the composition can be cured by heating. The resin soluble in an aqueous alkali solution is not particularly limited as long as it is a resin soluble in an aqueous alkali solution, but a novolak resin obtained by condensing phenols and aldehydes is preferable. Examples of the acid generator include a halogen-containing compound, a quinonediazide compound, a sulfonic acid ester compound, and an onium salt.

In these formulations, the acid generator is preferably contained in an amount of 5 to 40 parts by weight, and the amino resin is preferably contained in an amount of 3 to 50 parts by weight, based on 100 parts by weight of the aqueous alkali-soluble resin. The solvent is usually 200 to 20 parts by weight per 100 parts by weight of the alkali aqueous solution-soluble resin.
It is used in the range of 00 parts by weight. Examples of the solvent include ketone solvents such as acetone, diethyl ketone, methyl amyl ketone and cyclohexanone; aromatic solvents such as toluene and xylene; cellosolve solvents such as methyl cellosolve, methyl cellosolve acetate and ethyl cellosolve acetate; and ethyl lactate. Ester solvents such as butyl acetate, isoamyl acetate, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, methyl pyruvate, ethyl pyruvate, propyl pyruvate, methanol, ethanol, propanol, propylene glycol methyl ether, propylene glycol ethyl Alcohol solvents such as ether and propylene glycol propyl ether can be used alone or in combination of two or more.

The photosensitive resin composition includes a binder resin containing a polymerizable monomer and a photoinitiator. Examples of the binder resin include the following. Natural rubber, polyisoprene, poly-1,2-butadiene, polyisobutene, polybutene, poly-2-heptyl-1,3-butadiene, poly-2-t-butyl-
(Di) enes such as 1,3-butadiene, poly-1,3-butadiene, polyethers such as polyoxyethylene, polyoxypropylene, polyvinyl ethyl ether, polyvinyl hexyl ether, and polyvinyl butyl ether; polyvinyl acetate; Polyesters such as pionate, polyurethane, ethyl cellulose, polyvinyl chloride, polyacrylonitrile, polymethacrylonitrile, polysulfone, polysulfide, polyethyl acrylate, polybutyl acrylate, poly-2-ethylhexyl acrylate, poly-t-butyl acrylate, poly -3-ethoxypropyl acrylate, polyoxycarbonyl tetramethacrylate, polymethyl acrylate, polyisopropyl methacrylate, polydodecylmethacrylate Acrylate, poly tetradecyl methacrylate, poly -n- propyl methacrylate, poly-3,3,5-trimethyl cyclohexyl methacrylate, polyethyl methacrylate, poly-2-nitro -
Poly (meth) acrylates such as 2-methylpropyl methacrylate, poly-1,1-diethylpropyl methacrylate, and polymethyl methacrylate, or copolymers thereof can be used.

As the polymerizable monomer, acrylic monomers, epoxy acrylates, urethane acrylates, polyether acrylates, polyester acrylates and the like can also be used. In particular, urethane acrylate, epoxy acrylate, and polyether acrylate are excellent from the viewpoint of adhesion to a support. Examples of epoxy acrylate include 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, and allyl alcohol diacrylate. Glycidyl ether, resorcinol diglycidyl ether, diglycidyl adipate, diglycidyl phthalate, polyethylene glycol diglycidyl ether, trimethylolpropane triglycidyl ether, glycerin triglycidyl ether, pentaerythritol tetraglycidyl ether, sorbitol tetraglycidyl ether, etc. (Meth) acrylic acid adducts. Polymers having a hydroxyl group in the molecule, such as epoxy acrylate, are effective for improving the adhesion to the support. These can be used by dissolving them in a general-purpose solvent or stirring and mixing with a metal dispersant or the like without using any solvent.

As the thermosetting resin, a phenol resin,
Melamine resin, epoxy resin, xylene resin and the like can be applied.
More than one kind may be copolymerized, and two or more kinds may be blended and used. These can be used usually by dissolving them in a general-purpose solvent or stirring and mixing with a metal dispersant or the like without a solvent.

These compositions used in the present invention may optionally contain a thixotropic agent, in addition to a dispersant.
Additives such as an antifoaming agent, a leveling agent, a diluent, a plasticizer, an antioxidant, a metal deactivator, a coupling agent and a filler may be blended.

In order to form a high-precision geometric figure of a conductor using a screen printing method, a so-called over-etching method, in which the line width after etching is smaller than the line width of a printed etching resist pattern, is effective. is there. The printing line width of the screen printing method, from the viewpoint of facilitating the formation of a good pattern or a good pattern,
It is preferably at least 20 μm. If you try to directly form a finer line width than this, blurring and blurring of the line,
This is because disconnection and the like tend to occur easily. In this respect, for safety, the line width of the etching resist pattern may be 30 μm or more, or may be 40 μm or more. Therefore, by performing over-etching, it is possible to form a favorable finer conductive metal pattern without disconnection. If the line width of the etching resist pattern is too large, the degree of over-etching becomes too large. Therefore, the line width is preferably 100 μm or less, particularly preferably 50 μm or less. When the line width exceeds 100 μm, the line width of the conductor after over-etching is 40 μm
It tends to be difficult to:

The line width of a geometric figure drawn with a conductive metal is preferably less than 40 μm. The line pitch is 100
It is preferable that the wire thickness is in the range of not less than μm and the wire thickness is not more than 40 μm. In addition, from the viewpoint of the invisibility of the geometric figure, the line width is 3
It is more preferably less than 0 μm, further preferably 25 μm or less. From the viewpoint of the visible light transmittance, the line pitch is more preferably 120 μm or more and the line thickness is 18 μm or less. The line width is preferably narrower from the viewpoint of visible light transmittance as long as the line is electrically conductive. If the thickness is too small, the production tends to be difficult, so that the thickness is preferably 10 μm or more. The wire thickness is preferably set to 1 μm or more from the viewpoint of electromagnetic wave shielding properties. The larger the line pitch, the higher the aperture ratio and the higher the visible light transmittance, but the lower the electromagnetic wave shielding property. Therefore, the line pitch is preferably 1 mm or less. In addition,
If the line pitch is complicated by the combination of geometric figures,
Based on the repeating unit, the area is converted to the area of a square, and the length of one side is defined as the line pitch. It is preferable that overetching is performed so that the line width of the geometrical figure drawn by the conductive metal is 10 μm or less smaller than the line width of the etching resist because a good figure can be drawn stably, and it becomes smaller by 15 μm or more. It is preferable to do so.

The contrast of the electromagnetic wave shielding film can be improved by using black copper as the conductive metal used in the present invention or by subjecting the conductive metal before or after etching to a blackening treatment. Also, by plating on conductive metal,
Further, the electromagnetic wave shielding property can be improved. Either electrolytic plating or electroless plating can be used as a method for applying metal plating. The type of plating metal can be gold, silver, copper, nickel, aluminum, etc., but copper or nickel is most suitable in terms of conductivity and price. The range of the plating thickness is preferably from 0.1 to 100 μm, and if it is less than 0.1 μm, the conductivity is insufficient, so that sufficient shielding properties may not be exhibited. If the plating thickness exceeds 100 μm, the viewing angle becomes narrow, which is not preferable. 0.5-50 μm is more preferred.

The geometric figures drawn with the conductive metal of the present invention include triangles such as equilateral triangles, isosceles triangles, right triangles, squares, rectangles, rhombuses, parallelograms, trapezoids, etc., and (positive). It is a pattern combining (regular) n-gons such as hexagon, (regular) octagon, (regular) dodecagon, (regular) icosagon, circle, ellipse, star, etc., and these units alone , Or a combination of two or more. From the viewpoint of electromagnetic wave shielding, a triangle is most effective, but from the viewpoint of visible light transmission, the aperture ratio increases as the number of (positive) n-gons increases for the same line width. From the viewpoint, the aperture ratio needs to be 50% or more, and more preferably 60% or more. The aperture ratio is a percentage of the ratio of the area obtained by subtracting the area of the conductive metal in the geometric figure drawn with the conductive metal from the effective area to the effective area of the electromagnetic wave shielding film. When the area of the display screen is defined as the effective area of the electromagnetic wave shielding film, the display screen is a ratio that can be seen.

The film having a conductive metal geometric pattern obtained in this way usually has insufficient transparency, and in order to improve this, a new surface is formed on the conductive metal geometric pattern. The transparency can be improved by forming a resin layer or smoothing this surface by pressing.
As the resin layer, the same adhesive as described above can be used. The adhesive is preferably applied to a thickness of 1 to 50 μm. The adhesive layer may be covered with a peelable film made of polyethylene terephthalate or the like.

The electromagnetic wave shielding film of the present invention can be adhered to a substrate or the like to form an electromagnetic wave shielding body. Examples of the substrate include a glass plate and a plastic plate. As the glass plate, tempered glass can be used in addition to ordinary soda lime glass, but soda lime glass is suitable in terms of cost. A plastic plate is a plate made of plastic, and specifically,
Polystyrene resin, acrylic resin, polymethyl methacrylate resin, polycarbonate resin, polyvinyl chloride resin, polyvinylidene chloride resin, polyethylene resin, polypropylene resin, polyamide resin, polyamideimide resin, polyetherimide resin, polyetheretherketone resin, polyarylate Resin, polyacetal resin,
Thermoplastic polyester resin such as polybutylene terephthalate resin / polyethylene terephthalate resin, thermoplastic resin such as cellulose acetate resin, fluorine resin, polysulfone resin, polyether sulfone resin, polymethylpentene resin, polyurethane resin, diallyl phthalate resin and thermosetting Resin. Among these, a polystyrene resin, an acrylic resin, a polymethyl methacrylate resin, a polycarbonate resin, and a polyvinyl chloride resin having excellent transparency are preferably used. The thickness of the glass plate or the plastic plate used in the present invention is preferably 0.5 mm to 5 mm from the viewpoint of protection of the display, strength and handling.

On either surface of the electromagnetic wave shielding film or the electromagnetic wave shielding structure, a layer having an infrared shielding property, a layer having an anti-reflection treatment, a layer having an anti-glare treatment, and having abrasion resistance having a high surface hardness. Layers can be formed. These are examples and can be used in other forms.

The above-mentioned electromagnetic wave shielding film or electromagnetic wave shielding structure is used by attaching it to the front of a display. As displays, CRT, PDP,
There are an EL panel, a liquid crystal panel, and the like.

[0036]

EXAMPLES Next, the present invention will be described specifically with reference to Examples, but the present invention is not limited thereto. Example 1 A 100 μm-thick polyethylene terephthalate (PET) film (manufactured by Toyobo Co., Ltd., trade name: A-4100) was used, and a primer (HP-1 trade name, manufactured by Hitachi Chemical Co., Ltd.) was applied to the surface of the film. 1 μm thick). After that, 500 on the film by vapor deposition.
A copper thin film layer of 0 mm is formed, and a screen printing machine [LS, with alignment device, manufactured by Neurong Seimitsu Co., Ltd.]
-34GX), a nickel alloy meshless metal plate (manufactured by Mesh Kogyo Co., Ltd., thickness 50 μm, pattern size 8 mm × 8 mm) and a Permalex metal squeegee (imported by Tomoe Kogyo Co., Ltd.)] Etching resist (trade name, manufactured by Hitachi Chemical Co., Ltd., R
AYCAST) in the form of a lattice pattern (line width: 40 μm, line pitch: 250 μm), and after complete baking at 90 ° C. for 10 minutes, ultraviolet rays were irradiated with a high-pressure mercury lamp at 70 mJ / cm 2.
Irradiated. Then, an electromagnetic wave shielding film was produced through steps of copper etching and resist peeling. The line width of the conductor on the film after etching was 20 μm on average, and the aperture ratio was 85%.

Example 2 A polyethylene terephthalate (PET) film (trade name: A-4100, manufactured by Toyobo Co., Ltd.) having a thickness of 50 μm was used and its primer (trade name: HP-1, manufactured by Hitachi Chemical Co., Ltd.) Coating thickness 1μ
m) was applied. Thereafter, a thin film layer of 3000 mm of aluminum is formed on the film by a sputtering method, and an etching resist (manufactured by Taiyo Ink Co., Ltd., product name: PHOTO FINER) is formed on the thin film by screen printing using a grid pattern (line width 50 μm, (Line pitch 286 μm)
After baking at 80 ° C. for 15 minutes, ultraviolet rays were irradiated at 70 mJ / cm 2 using a high-pressure mercury lamp. Thereafter, an electromagnetic wave shielding film was produced through an aluminum etching process. A copper plating layer having a thickness of 3 μm was formed on the completed aluminum grid pattern by electrolytic copper plating according to a conventional method (electrolytic copper plating: for example, printed circuit technology handbook,
(Edited by The Printed Circuit Industry Association of Japan, published by Nikkan Kogyo Shimbun, February 28, 1987, p. 470). The line width of the conductor on the film after etching was 30 μm on average, and the aperture ratio was 80%.

Example 3 Using a polycarbonate film (trade name, Lexan, manufactured by Asahi Glass Co., Ltd.) having a thickness of 50 μm, a copper thin film of 10,000 ° was sprayed on the corona-treated surface (critical surface tension: 54 dyn / cm) by a spray method. A layer is formed and the following photosensitive resin is formed on a copper thin film by screen printing using a grid pattern (line width: 40 μm, line pitch: 12 μm).
7 μm), and a high pressure mercury lamp
Irradiation was performed at 0 mJ / cm 2, and the mixture was cured by heating at 120 ° C. for 5 minutes. Then, after the copper etching, the copper was blackened, and the electromagnetic wave shielding film was manufactured through the resist stripping process. The line width of the conductor on the film after etching was 18 μm on average, and the aperture ratio was 74%. (Composition of photosensitive resin) 1,4-butanediol dimethacrylate 20 parts by weight A bisphenol A type epoxy resin having an epoxy equivalent of 500 was reacted with 1 equivalent of tetrahydrophthalic anhydride at 150 ° C. for 10 hours in a nitrogen atmosphere for 10 hours. Acid-modified epoxy resin 55 parts by weight Acrylonitrile butadiene rubber (PNR-1H, trade name of Nippon Synthetic Rubber Co., Ltd.) 20 parts by weight Benzophenone 5 parts by weight Aluminum hydroxide 10 parts by weight cyclohexanone / methyl ethyl ketone (1/1 weight ratio)
Was dispersed in a 45% by weight varnish so as to have a volume ratio of 30% by volume.

Example 4 A 100 μm-thick PET film (trade name, A-4100, manufactured by Toyobo Co., Ltd.) was used and its primer (trade name, H, manufactured by Hitachi Chemical Co., Ltd.)
P-1, coating thickness 1 μm). Thereafter, a thin film of nickel of 3000 mm is formed on the film by a CVD method, and an etching resist (trade name: CIR707, manufactured by Nippon Synthetic Rubber Co., Ltd.) is formed on the nickel thin film by a screen printing method. 55 μm, line pitch 250 μm), and after baking at 80 ° C. for 5 minutes, ultraviolet rays were irradiated at 100 mJ / cm by a high pressure mercury lamp.
Two irradiations were performed. Thereafter, an electromagnetic wave shielding film was produced through a nickel etching process. The line width of the conductor on the film after etching was 35 μm on average, and the aperture ratio of the film was 74%.

Example 5 A 100 μm-thick PET film (trade name, A-4100, manufactured by Toyobo Co., Ltd.) was used and its primer (trade name, manufactured by Hitachi Chemical Co., Ltd., H
P-1, coating thickness 1 μm). Thereafter, a thin copper film layer of 3,000 mm is formed on the film by a sputtering method, and an etching resist (trade name, manufactured by Hitachi Chemical Co., Ltd., RAYCAST) is grid-patterned (line width 40 μm, line pitch 250 μm) by screen printing. Then, after baking at 90 ° C. for 15 minutes, ultraviolet rays were irradiated by a high-pressure mercury lamp at 90 mJ / cm 2. Thereafter, an electromagnetic wave shielding film was produced through a copper etching process. The line width of the conductor on the film after etching was 20 μm on average, and the aperture ratio was 85%.

(Example 6) A commercially available acrylic plate (commercial glass manufactured by Kuraray Co., Ltd., thickness: 3 mm) was applied to the electromagnetic wave shielding film obtained in Example 1 using a hot press machine.
And a commercially available soda lime glass having a thickness of 3 mm and an adhesive film (trade name, manufactured by Sekisui Chemical Co., Ltd.,
110 ° C., 20 kgf / cm through a thickness of 250 μm)
Heat and pressure bonding was performed for 2 and 15 minutes to obtain an electromagnetic wave shielding structure.

The average line width, aperture ratio, electromagnetic wave shielding property (300 MHz), visible light transmittance, invisibility, and the like of the geometrical figure drawn with the conductive metal of the electromagnetic wave shielding film obtained as described above. The contrast, the average line width of the print pattern before etching, and the presence or absence of an abnormality in the print pattern were measured. The results are shown in Table 1.

The line width of the printed pattern and the line width and the aperture ratio of the geometric figure drawn with the conductive metal were actually measured based on a micrograph. The electromagnetic wave shielding property was measured by inserting a sample between flanges of a coaxial waveguide converter (trade name, TWC-S-024, manufactured by Japan High Frequency Corporation) and using a spectrum analyzer (trade name, 8510B vector network analyzer, manufactured by YHP). At a frequency of 300 MHz.
The visible light transmittance was measured using a double beam spectrophotometer (trade name, manufactured by Hitachi, Ltd., Model 200-10).
The average value of the transmittance from 400 to 700 nm was used. The presence / absence, invisibility and contrast of the printed pattern were determined by visual observation. The non-visibility was evaluated by observing the electromagnetic wave shielding film from a place 0.5 m away, and NG when the geometric figure formed of the conductive material could not be recognized, and NG when the geometric figure could be recognized. Regarding the contrast, the electromagnetic wave shielding film was closely attached to the screen of the plasma display device, and the contrast was observed. Those having excellent contrast were evaluated as good, and those not being evaluated as NG.

[0044]

[Table 1]

As shown in the embodiments of the present invention, an etching resist having a geometric pattern is formed on a conductive metal of a plastic film with a conductive metal comprising a conductive metal and a plastic support by a screen printing method. ,
The electromagnetic shielding film obtained by forming a geometric figure by over-etching the conductive metal has no bleeding, no blur, no disconnection, and the electromagnetic shielding property should be 40 dB or more in spite of its high aperture ratio and brightness. it can. Further, as shown in Embodiment 2, the shielding property can be further improved by performing electrolytic plating.
Further, as shown in the third embodiment, the contrast is further improved by the blackening process, so that a clear image can be viewed. In Examples 1 to 6, the line width of the geometric figure of the conductive metal was changed in the range of 35 to 18 μm.

Example 7 A 100 μm-thick polyethylene terephthalate (PET) film (manufactured by Toyobo Co., Ltd., trade name: A-4100) was used and a primer (trade name, manufactured by Hitachi Chemical Co., Ltd., HP- 1, a coating thickness of 1 μm), and further as an adhesive layer thereon,
Polyvinyl butyral resin (trade name, # 6000PE, manufactured by Denki Kagaku Kogyo KK, softening point 72 ° C, molecular weight 2,40
0, n = 1.52) so as to have a dry coating thickness of 20 μm. A roughened surface of electrolytic copper foil (manufactured by Japan Energy Co., Ltd., trade name: JTC) having a blackened one surface having a thickness of 18 μm was bonded to the adhesive surface. Thereafter, a printing ink resist (trade name, manufactured by Hitachi Chemical Co., Ltd., RAY) was applied to the glossy surface of the copper foil using the same screen printing method as in Example 1.
CAST) with a grid pattern (line width 40 μm, line pitch 2)
50 μm), pre-baked at 90 ° C. for 10 minutes, and then irradiated with ultraviolet rays at 70 mJ / cm 2 using a high-pressure mercury lamp. Thereafter, an electromagnetic wave shielding adhesive film was produced through steps of copper foil etching and resist peeling. Conductor line width on this film after etching is 20μm on average
And the opening ratio was 85%.

Example 8 A 50 μm thick polyethylene terephthalate (PET) film (manufactured by Toyobo Co., Ltd., trade name: A-4100) was used, and a primer (trade name, manufactured by Hitachi Chemical Co., Ltd .; HP- 1, coating thickness
1 μm), and a polyvinyl acetate resin (trade name, manufactured by Denki Kagaku Kogyo Co., Ltd .; S
N-10, softening point 55 ° C, degree of polymerization 1200-1500,
n = 1.5) so as to have a dry coating thickness of 30 μm. A roughened surface of an electrolytic copper foil having a thickness of 12 μm (trade name: NDGE, manufactured by Nihon Denshi Co., Ltd.) was bonded to the adhesive surface. Thereafter, a printing ink resist (manufactured by Taiyo Ink Co., Ltd., product name: PHOTO FINER) was applied to the glossy surface of the copper foil using the same screen printing method as in Example 1 in a grid pattern (line width: 5).
0 μm, line pitch 286 μm)
After pre-baking for 5 minutes, apply high-
Irradiation was performed at 0 mJ / cm2. Thereafter, an electromagnetic wave shielding adhesive film was produced through a copper foil etching step and a resist peeling step. A 3 μm-thick copper plating layer was formed on the completed copper grid pattern by electrolytic copper plating according to a conventional method (electrolytic copper plating: for example, Handbook of Printed Circuit Technology, edited by Japan Printed Circuit Industry Association, Nikkan Kogyo) Newspaper company, published February 28, 1987, p. 470). The line width of the conductor on this film after etching is 30 μm on average,
The aperture ratio was 80%.

Example 9 A 50 μm-thick polycarbonate film (trade name, Lexan manufactured by Asahi Glass Co., Ltd.) was used, and a polyester polyurethane resin (Toyo) was used as an adhesive layer on the corona-treated surface (critical surface tension: 54 dyn / cm). Spinon Co., Ltd. trade name, Byron UR-1400, softening point 83 ° C., average molecular weight 40,000, n = 1.5) was applied so that the dry coating thickness became 25 μm. A roughened surface of a 12 μm-thick electrolytic copper foil (trade name: SQ-VLP, manufactured by Mitsui Kinzoku Co., Ltd.) was bonded to the adhesive surface. Then, the same photosensitive resin as in Example 3 was applied to the glossy surface of the copper foil using the same screen printing method as in Example 1 in a lattice pattern (line width 3).
0 μm, line pitch 127 μm), and irradiated with ultraviolet rays at 1000 mJ / cm 2 by a high pressure mercury lamp.
The composition was cured by heating at 20 ° C. for 5 minutes. Thereafter, the copper foil was subjected to a blackening treatment by the above-mentioned method through the steps after copper foil etching and resist peeling, thereby producing an electromagnetic wave shielding adhesive film. The line width of the conductor on the film after etching was 18 μm on average, and the aperture ratio was 74%.

Example 10 A PET film (trade name, manufactured by Toyobo Co., Ltd., A-4100) having a thickness of 100 μm was used, and a primer (trade name, HP-1, manufactured by Hitachi Chemical Co., Ltd., HP-1) was coated on the surface. Acrylic resin (trade name, manufactured by Teikoku Chemical Industry Co., Ltd., HTR-811, softening point -43 ° C, average molecular weight 420,000, n = 1.52) is further applied as an adhesive layer by dry coating. 20 μm thick
It was applied so that An 18 μm-thick electrolytic copper foil (trade name JT, manufactured by Japan Energy Co., Ltd.)
The roughened surface of C) was bonded. Then on the glossy surface of the copper foil,
A grid pattern (line width 55 μm, line pitch 250 μm) is formed using the same screen printing method as in Example 1.
After pre-baking at 80 ° C. for 15 minutes, ultraviolet rays were irradiated at 100 mJ / cm 2 by a high-pressure mercury lamp. Then, an electromagnetic wave shielding adhesive film was produced through a copper foil etching process. The line width of the conductor on the film after etching was 35 μm on average, and the aperture ratio of the film was 74%.

Example 11 A 100 μm thick PET film (trade name, A-4100, manufactured by Toyobo Co., Ltd.) was used, and a primer (trade name, HP-1, manufactured by Hitachi Chemical Co., Ltd., HP-1) was applied on the surface. 1 μm), and then a polyvinyl butyral resin (trade name: # 6000EP, manufactured by Denki Kagaku Kogyo Co., Ltd., softening point 72 ° C., molecular weight 2,400, n = 1.52) is applied thereon as an adhesive layer. It was applied to a thickness of 20 μm. A 12 μm-thick electrolytic copper foil (trade name S, manufactured by Mitsui Kinzoku Co., Ltd.)
Q-VLP). Then, a printing ink resist (trade name: R, manufactured by Hitachi Chemical Co., Ltd.) was applied to the glossy surface of the copper foil by using the same screen printing method as in Example 1.
AYCAST) in the form of a lattice pattern (line width: 40 μm, line pitch: 250 μm), pre-baked at 90 ° C. for 15 minutes, and then irradiated with ultraviolet light by a high-pressure mercury lamp at 90 mJ / cm 2.
Irradiated. Then, an electromagnetic wave shielding adhesive film was produced through a copper foil etching process. The line width of the conductor on this film after etching is 20 μm on average, and the aperture ratio is 8
5%.

(Example 12) The electromagnetic wave shielding adhesive film obtained in Example 1 was applied to a commercially available acrylic plate (commercial glass manufactured by Kuraray Co., Ltd., 3 mm in thickness, 3 mm in thickness) and a 3 mm in thickness using a hot press machine. Soda lime glass with an adhesive film (trade name, manufactured by Sekisui Chemical Co., Ltd., ESLEC, thickness 250 μm), and four types without an adhesive film at 110 ° C. and 20 kg
Heat and pressure were applied under conditions of f / cm 2 and 15 minutes to obtain an electromagnetic wave shield (Table 1 shows a case where an adhesive film was used and an acrylic plate was used). In some cases, a line width of 25 μm could not be formed.

The average line width, aperture ratio, and electromagnetic wave shielding property (300 MH) of the geometrical figure drawn with the conductive metal of the electromagnetic wave shielding adhesive film obtained as described above were used.
z), visible light transmittance, invisibility, contrast, average line width of the printed pattern before etching, and presence / absence of abnormalities in the printed pattern were measured. The results are shown in Table 2. The test method is the same as described above.

[0053]

[Table 2]

As shown in the embodiment of the present invention, a geometric figure is formed by a screen printing method on a conductive metal of a plastic film with a conductive metal comprising a conductive metal and a plastic support via an adhesive layer. The electromagnetic wave shielding adhesive film obtained by forming a geometric pattern by forming an etching resist having a shape and over-etching the conductive metal has no bleeding, blurring, and disconnection, and has a high aperture ratio and a high electromagnetic wave. 40d shielding
B or more. Further, as shown in Embodiment 2, the shielding property can be further improved by performing electrolytic plating. As shown in Example 3,
The contrast is further improved by the blackening processing, and a clear image can be appreciated. In Examples 7 to 12, the line width of the geometric figure of the conductive metal was changed in the range of 35 to 18 μm.

[0055]

According to the first or second aspect of the present invention, since it is manufactured using a screen printing method, it is possible to provide an inexpensive electromagnetic shielding film having excellent electromagnetic shielding properties, transparency and invisibility. It is. According to the method of claim 3 or 4, an electromagnetic wave shielding film having excellent electromagnetic wave shielding properties, transparency and invisibility can be provided stably at low cost. According to the method of claim 5, the electromagnetic wave shielding film can be provided more stably. By setting the aperture ratio after the etching according to claim 6 to 50% or more, it is possible to provide an electromagnetic wave shielding film having excellent transparency. By making the conductive metal according to claim 7 black copper,
An inexpensive electromagnetic wave shielding film having excellent contrast can be provided. By performing the blackening treatment on the conductive metal before or after the etching according to the eighth aspect, an electromagnetic wave shielding film having excellent contrast can be obtained. By applying a metal plating to the conductive metal before or after the etching according to the ninth aspect, an electromagnetic shielding film having excellent electromagnetic shielding properties can be obtained. By using the plastic support thus obtained, an electromagnetic shielding film having excellent electromagnetic shielding properties can be obtained at low cost. An electromagnetic shielding film having excellent electromagnetic shielding properties is inexpensive by using at least one of a primer treatment, a plasma treatment, and a corona discharge treatment as the surface treatment method for a transparent plastic support according to claim 11. Can be obtained. By using a polyethylene terephthalate film or a polycarbonate film as the transparent plastic support according to the twelfth aspect, an electromagnetic wave shielding film having excellent transparency can be provided at low cost. The electromagnetic wave shielding film according to claim 13 has the effects as described in claims 1 to 12 above. Claim 14
By using the electromagnetic wave shielding film composed of the electromagnetic wave shielding film and the glass plate or the plastic plate described in (1), an electromagnetic wave shielding substrate having transparency can be provided. By using the electromagnetic wave shielding film and the electromagnetic wave shielding film having the electromagnetic wave shielding property and the transparency described in claim 15 for the display, a display that is lightweight, compact, has excellent transparency, and has little electromagnetic wave leakage can be provided.

When the electromagnetic wave shielding film obtained by the present invention is used for a display, the visible light transmittance is large and the invisibility is good. And a clear image can be comfortably viewed. The electromagnetic wave shielding film and the electromagnetic wave shielding body of the present invention are excellent in electromagnetic wave shielding property and transparency, so that, in addition to the display, the electromagnetic wave is generated, or the measuring device that protects from the electromagnetic wave, the inside of the measuring device and the manufacturing device. It can be used by providing it in a window or a case, especially in a site such as a window where transparency is required.

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Minoru Tosaka 1500 Oji Ogawa, Shimodate City, Ibaraki Pref.Hitachi Kasei Kogyo Co., Ltd. (72) Inventor Hiroshi Nomura Inventor Hiroshi Nomura 1150 Goshomiya Oaza, Shimodate City, Ibaraki Prefecture F-term in Goshomiya Plant, Hitachi Chemical Co., Ltd.

Claims (15)

[Claims] An etching resist pattern having a geometric pattern is formed by a screen printing method on a conductive metal layer of a plastic film with a conductive metal formed by laminating a conductive metal layer on a plastic support. A method of manufacturing an electromagnetic wave shielding film, wherein a geometrical figure made of a conductive metal is formed by etching a conductive metal layer. 2. The method according to claim 1, wherein the conductive metal has a line width of 4 after etching.
The method for producing an electromagnetic wave shielding film according to claim 1, wherein the thickness is 0 μm or less. 3. The method according to claim 2, wherein the etching of the conductive metal layer is over-etching. 4. The line width of the etching resist pattern is
The method for producing an electromagnetic wave shielding film according to claim 3, wherein the thickness is 20 to 100 µm. 5. The method for producing an electromagnetic wave shielding film according to claim 3, wherein the overetching is performed so that the line width of the conductive metal is smaller than the line width of the etching resist pattern by 10 μm or more. 6. The conductive metal layer having an aperture ratio of 50 after etching.
%. The method for producing an electromagnetic wave shielding film according to claim 1, wherein 7. The method for producing an electromagnetic wave shielding film according to claim 1, wherein the conductive metal is black copper. 8. The method for producing an electromagnetic wave shielding film according to claim 1, wherein a blackening treatment is performed on the conductive metal before or after etching. 9. The method for producing an electromagnetic wave shielding film according to claim 1, wherein a metal plating is applied on the conductive metal before or after the etching. 10. The method according to claim 1, wherein the plastic support is a surface-treated plastic support. 11. A method for surface treatment of a plastic support, wherein at least one of primer treatment, plasma treatment and corona discharge treatment is applied.
The method for producing an electromagnetic wave shielding film according to any one of the above. 12. The method for producing an electromagnetic wave shielding film according to claim 1, wherein the plastic support is a polyethylene terephthalate film or a polycarbonate film. 13. An electromagnetic wave shielding film produced by the method according to claim 1. 14. An electromagnetic wave shielding structure comprising the electromagnetic wave shielding film according to claim 13 and a glass plate or an electromagnetic wave shielding film and a plastic plate. 15. A display using the electromagnetic wave shielding film according to claim 13 or the electromagnetic wave shielding body according to claim 14.