JP2003218512A - Electronic-part exchanger - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic-part exchanger capable of exchanging an electronic-part secured to a printed-wiring board, inhibiting the warp of the printed-wiring board by partial heating. <P>SOLUTION: The electronic-part exchanger has a first heater 20 partially heating the loading region 44 of the electronic part 42 on the surface of the printed-wiring board 40, a second heater 22 partially heating an opposed region 46 opposed to the loading region 44 on the rear of the printed-wiring board 40, a sensor 32 detecting the quantity of warp the printed-wiring board 40 generated by the partial heating and a controller 34 adjusting at least either of outputs from the first heater 20 and the second heater 22 in the direction that the quantity of the warp is reduced in response to the quantity of the warp detected by the sensor 32. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component exchanging device for exchanging electronic components such as LSIs mounted on a printed wiring board.

[0002]

2. Description of the Related Art Due to the development of semiconductor integrated circuit technology, LS
Electronic components such as I have been miniaturized and highly functionalized. Along with this, the number of pins of electronic parts is increasing, and PGA
(PinGrid Array), BGA (Ball
Multi-pin packages such as Grid Array) have been developed.

Generally, when a defect occurs in an electronic component mounted on a printed wiring board, the electronic component needs to be replaced. At this time, by locally heating the defective electronic component, only the defective electronic component is removed and a new electronic component is attached.

[0004]

However, the local heating when replacing a defective electronic component causes the printed wiring board to warp. In addition, the printed wiring board is cooled after local heating and returns to the shape before warping. Therefore, when a new electronic component is soldered while the printed wiring board is warped, the soldered part of the electronic component
After the printed wiring board is cooled, distortion always occurs. When the printed wiring board is repeatedly subjected to vibration or heat stress in this state, cracks may occur in the soldered portion.

The present invention has been made to solve the above-mentioned conventional problems, and an electronic component mounted on the printed wiring board can be replaced while suppressing the warp of the printed wiring board caused by local heating. An object is to provide a switching device. Another object of the present invention is to provide an electronic component exchanging device capable of exchanging electronic components without causing distortion in the soldered portions between the electronic components and the printed wiring board.

[0006]

According to another aspect of the present invention, there is provided an electronic component exchanging device, comprising: a first heater for locally heating a mounting area of an electronic component on a front surface of a printed wiring board; and a mounting area on a back surface of the printed wiring board. A second heater that locally heats the opposing area, a sensor that detects the amount of warp of the printed wiring board caused by the local heating, and a direction that reduces the amount of warp according to the amount of warp detected by the sensor. And a controller that adjusts at least one of the outputs of the first and second heaters.

According to another aspect of the present invention, there is provided an electronic component exchanging device, wherein a first heater and a first fan for sending heat generated by the first heater to a mounting area of an electronic component on a surface of a printed wiring board to locally heat the mounting area. And a second heater, a second fan that sends heat generated by the second heater to a facing area that faces the mounting area on the back surface of the printed wiring board, and locally heats the facing area; A sensor that detects the amount of warpage of the printed wiring board, and, in accordance with the amount of warpage detected by the sensor, adjusts at least one of the air volumes of the first and second fans in a direction that reduces the amount of warpage. And a controller.

An electronic component exchanging device according to a third aspect is the second aspect.
In the electronic component replacement device described, the controller, according to the amount of warp detected by the sensor,
At least one of the outputs of the first and second heaters is further adjusted in the direction of reducing the amount of warpage. The electronic component exchanging device according to claim 4, wherein a first heater, a first fan that sends heat generated by the first heater to a mounting area of an electronic component on a surface of a printed wiring board to locally heat the mounting area, and A first cover member having a shape that covers the mounting area and preventing heat from being dissipated into the mounting area, a second heater, and heat generated by the second heater to the mounting area on the back surface of the printed wiring board. A second fan that feeds into the facing area and locally heats the facing area, and a shape that covers the facing area,
A second cover member for preventing heat from being dissipated into the facing area, a sensor for detecting a warp amount of the printed wiring board caused by the local heating, and a warp amount according to the warp amount detected by the sensor. A controller that adjusts at least one of a distance between the first cover member and the printed wiring board and a distance between the second cover member and the printed wiring board in a direction of decreasing the amount. To do.

According to a fifth aspect of the present invention, there is provided an electronic component exchanging device.
In the electronic component replacement device described, the controller, according to the amount of warp detected by the sensor,
At least one of the outputs of the first and second heaters is further adjusted in the direction of reducing the amount of warpage. An electronic component exchanging device according to a sixth aspect is the electronic component exchanging device according to the fourth aspect, wherein, in accordance with the amount of warpage detected by the sensor, the controller reduces the amount of warpage in the first and second directions. It is characterized in that at least one of the air volumes of the second fans is further adjusted.

An electronic component exchanging device according to a seventh aspect is the electronic component exchanging device according to any one of the first, second and fourth aspects, wherein the electronic component exchanging device has a heat capacity corresponding to the heat capacity of the electronic component. It is characterized by comprising a dummy member that comes into contact with the facing area. An electronic component exchanging device according to claim 8 is the electronic component exchanging device according to any one of claims 1, 2, and 4, wherein the sensor has a contact whose one end is in contact with the back surface of the printed wiring board. A member and a restricting member that prevents the contact member from moving by a predetermined amount or more when the contact member moves to a side opposite to the printed wiring board by a predetermined amount due to warpage of the printed wiring board, And a detection unit that is connected to the contact member and that detects the amount of movement of the contact member as the amount of warpage.

An electronic component exchanging device according to a ninth aspect is the eighth aspect.
In the electronic component exchanging device described above, the contact member is formed in a long shape extending in a direction orthogonal to the printed wiring board, and the restriction member has an insertion portion that inserts the other end of the contact member. The contact member has a protrusion that comes into contact with the periphery of the insertion portion when the contact member moves by the predetermined amount.

(Operation) In the electronic component exchanging device according to the first aspect, when the defective electronic component soldered on the printed wiring board is removed, the first heater mounts the electronic component on the surface of the printed wiring board. Locally heat the area. Similarly, the second heater locally heats a facing area that faces the mounting area on the back surface of the printed wiring board. The sensor detects the amount of warpage of the printed wiring board caused by local heating and transmits it to the controller. The controller adjusts at least one of the outputs of the first and second heaters so as to reduce the warp amount. Therefore, it is possible to prevent the printed wiring board from being warped, and to prevent distortion from being generated in a soldered portion of another electronic component or the like on the printed wiring board. Then, after the solder that fixes the electronic component to the printed wiring board is melted, the electronic component is removed from the printed wiring board.

Next, a new electronic component is placed in the mounting area, and the mounting area and the opposing area are locally heated, as in the case of removing the electronic component. The controller is the first and second
Adjust at least one of the heater outputs. Therefore, it is possible to solder the electronic component to the mounting area while suppressing the warp of the printed wiring board. Therefore, after the printed wiring board is cooled, no distortion occurs in the soldered portion between the electronic component and the printed wiring board. As a result, even when vibration or heat stress is repeatedly applied to the printed wiring board,
It is possible to prevent cracks from occurring in the soldered portion of the electronic component.

In the electronic component exchanging device of the second aspect, when the defective electronic component soldered on the printed wiring board is removed, the first fan applies the heat generated by the first heater to the surface of the printed wiring board. To the mounting area of electronic components in. As a result, the mounting area is locally heated. Similarly, the second fan sends the heat generated by the second heater to the facing area on the back surface of the printed wiring board that faces the mounting area. As a result, the facing area is locally heated. The sensor detects the amount of warpage of the printed wiring board caused by local heating and transmits it to the controller. The controller adjusts at least one of the air volumes of the first and second fans in the direction of reducing the warp amount. Then, after the solder that fixes the electronic component to the printed wiring board is melted, the electronic component is removed from the printed wiring board. Therefore, similarly to the electronic component exchanging device according to the first aspect, the electronic component can be removed without causing a distortion in a soldered portion of another electronic component or the like on the printed wiring board. The heat generated by the first and second heaters is sent to the mounting area and the facing area by the first and second fans, respectively. Therefore, it is not necessary to make the first and second heaters face the mounting area and the facing area of the printed wiring board, respectively. As a result, the electronic component exchanging device can be designed regardless of the size and installation position of the first and second heaters.

Next, a new electronic component is placed in the mounting area, and the mounting area and the opposing area are locally heated, as in the case of removing the electronic component. The controller is the first and second
Adjust at least one of the fan air volumes. Therefore, the warp of the printed wiring board is suppressed. Therefore, similarly to the electronic component exchanging device according to the first aspect, the electronic component can be soldered to the mounting area while suppressing the warp of the printed wiring board. As a result, after the printed wiring board is cooled, it is possible to prevent cracks from occurring in the soldered portion of the electronic component.

According to another aspect of the electronic component exchanging device of the present invention, when the electronic component on the printed wiring board is removed and the electronic component is soldered on the printed wiring board, the controller is
In order to suppress the warp of the printed wiring board, the first and second
At least one of the heater outputs is adjusted and at least one of the air volumes of the first and second fans is adjusted.

Therefore, similarly to the electronic component exchanging device according to the second aspect, the electronic component can be exchanged without causing a distortion in a soldered portion of another electronic component or the like on the printed wiring board. Furthermore, by adjusting not only the air flow rates of the first and second fans but also the outputs of the first and second heaters, it is possible to shorten the time required to locally heat the printed wiring board and the time required to replace electronic components.

According to another aspect of the electronic component exchanging device of the present invention, the first cover member is arranged at a position covering the mounting area of the electronic component on the surface of the printed wiring board. The first cover member is movable in the direction orthogonal to the printed wiring board. Similarly, the second cover member is arranged at a position that covers a facing area facing the mounting area on the back surface of the printed wiring board. The second cover member is movable in the direction orthogonal to the printed wiring board.

When the defective electronic component soldered on the printed wiring board is removed, the first fan sends the heat generated by the first heater to the mounting area. As a result, the mounting area is locally heated. Similarly, the second fan sends the heat generated by the second heater to the facing area. As a result, the facing area is locally heated. At this time, the heat sent from the first heater slightly leaks from the gap between the first cover member and the printed wiring board. Similarly, the heat sent from the second heater slightly leaks from the gap between the second cover member and the printed wiring board. In addition, the sensor detects the amount of warpage of the printed wiring board caused by local heating and transmits it to the controller.

The controller reduces the amount of warpage by reducing the distance between the first cover member and the printed wiring board and the second distance.
At least one of the distances between the cover member and the printed wiring board is adjusted. Thereby, at least one of the amount of heat leaked from the gap between the first cover member and the printed wiring board and the amount of heat leaked from the gap between the second cover member and the printed wiring board is adjusted, and the temperatures of the mounting region and the facing region are adjusted. Adjusted. Then, after the solder that fixes the electronic component to the printed wiring board is melted, the electronic component is removed from the printed wiring board.

Therefore, similarly to the electronic component exchanging device according to the first aspect, the electronic component can be removed without causing a distortion in a soldered portion of another electronic component or the like on the printed wiring board. Next, a new electronic component is placed in the mounting area, and the mounting area and the facing area are locally heated, as in the case of removing the electronic component. And the controller is the first
At least one of the distance between the cover member and the printed wiring board and the distance between the second cover member and the printed wiring board is adjusted. As a result, warpage of the printed wiring board is suppressed.

Therefore, similarly to the electronic component exchanging device according to the first aspect, the electronic component can be soldered to the mounting area while suppressing the warp of the printed wiring board. As a result, after the printed wiring board is cooled, it is possible to prevent cracks from occurring in the soldered portion of the electronic component. Further, the first and second cover members prevent the heat that is sent to a predetermined area of the printed wiring board from being dissipated. Therefore, the printed wiring board can be locally heated more efficiently.

According to another aspect of the electronic component exchanging device of the present invention, when the electronic component on the printed wiring board is removed and the electronic component is soldered on the printed wiring board, the controller is
In order to suppress the warp of the printed wiring board, at least one of the distance between the first cover member and the printed wiring board and the distance between the second cover member and the printed wiring board is adjusted, and at the same time, the first and second heaters are adjusted. Adjust at least one of the outputs.

Therefore, similarly to the electronic component exchanging device according to the fourth aspect, the electronic component can be exchanged without causing a distortion in a soldered portion of another electronic component or the like on the printed wiring board. Further, by adjusting not only the position adjustment of the first and second cover members but also the outputs of the first and second heaters, it is possible to shorten the time required to locally heat the printed wiring board and the time required to replace electronic components.

In the electronic component exchanging device according to the sixth aspect, the controller is configured to remove the electronic component on the printed wiring board and solder the electronic component onto the printed wiring board.
In order to suppress the warp of the printed wiring board, at least one of the distance between the first cover member and the printed wiring board and the distance between the second cover member and the printed wiring board is adjusted, and the first and second fans are adjusted. Adjust at least one of the air volume.

Therefore, similarly to the electronic component exchanging device according to the fourth aspect, the electronic component can be exchanged without causing a distortion in a soldered portion of another electronic component or the like on the printed wiring board. Further, the warp of the printed wiring board can be controlled more finely by adjusting not only the position adjustment of the first and second cover members but also the air flow rates of the first and second fans. Claim 7
In the electronic component exchanging device, the dummy member is brought into contact with the facing region when removing the electronic component on the printed wiring board and when soldering the electronic component onto the printed wiring board. After that, the mounting area of the electronic component and the facing area are locally heated. At this time, since the dummy member and the electronic component have the same heat capacity, the temperature change rates in the mounting region and the facing region are substantially equal. Therefore, it is possible to easily control the controller for suppressing the warp of the printed wiring board.

In the electronic component exchanging device according to the eighth and ninth aspects, when the printed wiring board is warped on the back surface side (the direction of pressing the contact member) by a predetermined amount during local heating, the contact member hits the regulating member. The subsequent movement of the contact member to the back surface side is prevented. Therefore, the amount of warp of the printed wiring board toward the back side can be limited to within the predetermined amount. For example, the contact member has an elongated shape, and the regulation member has an insertion portion that inserts the rear end side of the contact member. Further, the printed wiring board is warped to the back surface side, and the contact member is integrally formed with a protruding portion that abuts around the insertion portion when the warp reaches a predetermined amount. Therefore, when the printed wiring board warps to the back surface by a predetermined amount during local heating, the protruding portion comes into contact with the periphery of the insertion portion of the regulation member. Therefore, the contact member cannot move further to the back surface side, and the printed wiring board is supported from the back surface side by the contact member. As a result, it is possible to prevent the printed wiring board from warping toward the back surface by a predetermined amount or more.

[0028]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a first embodiment of the present invention (corresponding to claim 1, claim 7, claim 8 and claim 9). In the figure, the electronic component exchange apparatus includes a first heater 20, a second heater 22, a first fan 24, a second fan 26, a first cover member 28, a second cover member 30, a sensor 32, a controller 34, and a suction nozzle 36. , And a dummy member 38.

The printed wiring board 40 is fixed between the first cover member 28 and the second cover member 30 in the electronic component exchanging device with the surface on which the electronic component 42 is mounted facing the first cover member 28. To be done. The electronic component 42 is an LSI B
It is formed by mounting on a GA package. An inert gas such as nitrogen is supplied to the first fan 24 from a cylinder (not shown). The first fan 24 uses the inert gas as the first gas.
The heater 20 is supplied at a constant flow rate. First heater 20
Heats the inert gas sent from the first fan 24. The inert gas (heating gas) heated by the first heater 20 is used as the electronic component 4 on the surface of the printed wiring board 40.
It is supplied to the second mounting area 44 at a constant flow rate.

The first cover member 28 has an opening having a square cross section and a shape covering the mounting region 44, and the opening is arranged so as to face the printed wiring board 40 side. On the side of the first cover member 28 opposite to the opening, the first heater 20
An intake port for the heated gas sent from is provided. The first cover member 28 is positioned so as to cover the mounting area 44,
The printed wiring board 40 is fixed at a predetermined distance. That is, a gap is formed between the end of the opening of the first cover member 28 and the printed wiring board 40, and the heating gas sent from the first heater 20 slightly leaks from the gap.

The suction nozzle 36 is connected to, for example, a vacuum pump (not shown), and sucks the electronic component 42 when the electronic component 42 soldered to the printed wiring board 40 is replaced. The electronic component 42 is placed at a predetermined position on the printed wiring board 40 by the suction nozzle. Second fan 26
An inert gas such as nitrogen is supplied from a cylinder (not shown). The second fan 26 supplies the inert gas to the second heater 22 at a constant flow rate. The second heater 22 heats the inert gas sent from the second fan 26. Second
The inert gas (heating gas) heated by the heater 22 is supplied at a constant flow rate to the facing area 46 facing the mounting area 44 on the back surface of the printed wiring board 40.

The second cover member 30 has an opening having a rectangular cross section and a shape covering the facing area 46, and is arranged with the opening facing the printed wiring board 40 side. The second heater 22 is provided on the opposite side of the second cover member 30 from the opening.
An intake port for the heated gas sent from is provided. The second cover member 30 is positioned so as to cover the facing area 46,
The printed wiring board 40 is fixed at a predetermined distance. That is, a gap is formed between the end of the opening of the second cover member 30 and the printed wiring board 40, and the heating gas sent from the second heater 22 slightly leaks from the gap. Further, four springs 47 for supporting the dummy member 38 are fixed in the second cover member 30.

The dummy member 38 has a rectangular plate-shaped main body 56 having the same shape as the electronic component 42, and four rod-shaped legs for mounting the main body 56 on the spring 47 in the second cover member 30. And 58. The main body 56 is
It is brought into contact with the facing area 46. The sensor 32 has a pin 48
The contact member, the spring 50, the detection unit 52, and the regulation member 54 are used to measure the amount of warpage of the printed wiring board 40.

The controller 34 adjusts the temperature of the heating gas supplied by the first heater 20 and the second heater 22 in accordance with the warp amount of the printed wiring board 40 detected by the sensor 32. FIG. 2 shows the details of the sensor 32.
The pin 48 is rod-shaped, has a rounded tip, and extends in the vertical direction (vertical direction) in the drawing. A protrusion 64 having a circular cross section is integrally formed at substantially the center of the pin 48 in the axial direction. The rear end side of the pin 48 is connected to the detection unit 52 via the spring 50.
Connected with. The detection unit 52 is fixed to a lower side in the vertical direction (lower side in FIG. 2) than the rear end of the pin 48. The tip of the pin 48 is pressed upward in the drawing by the elastic force of the spring 50, so that the printed wiring board 4 in FIG.
The contact area 46 of 0 is abutted. Therefore, when the facing area 46 of the printed wiring board 40 is warped to the side opposite to the pin 48, the pin 48 moves in the vertical direction (upward in FIG. 2) with the tip end contacting the facing area 46. . When the facing region 46 of the printed wiring board 40 warps in the direction of pressing the pin 48, the pin 48 moves in the vertical direction (downward in FIG. 2) while contracting the spring 50.

The detecting section 52 detects the load applied to the spring 50 to measure the movement amount of the pin 48 as the warp amount of the printed wiring board 40. The regulation member 54 is configured by a square plate-shaped first plate 66 and a plate-shaped second plate 68 that fixes the first plate 66 to the detection unit 52. The first plate 66 has a circular insertion portion 70 (through hole) through which the rear end side of the pin 48 is inserted. Insertion part 70
Since the inner diameter of is smaller than the outer diameter of the protruding portion 64 of the pin 48, the protruding portion 64 is not inserted into the insertion portion 70. Therefore, the pin 48 can move to the detection unit 52 side only until the protruding portion 64 contacts the periphery of the insertion portion 70 in the first plate 66.

FIG. 3 shows the details of the dummy member 38. An annular flange 74 having an outer diameter larger than the outer diameter of the spring 47 in FIG. 1 is integrally formed on the leg portion 58 on the side opposite to the body portion 56. A circular insertion port 76 (through hole) for inserting the tip of the pin 48 shown in FIG. 1 is provided at the center of the main body 56. The electronic component 42 is provided on the surface of the main body 56 opposite to the leg 58.
Protrusions 7 of the same number and shape as the balls (solder bumps)
8 is formed at a position facing the ball. Further, the main body portion 56 has the same heat capacity as the electronic component 42.

As shown in FIG. 1, in the leg portion 58 of the dummy member 38, when the dummy member 38 is arranged in the second cover member 30, the spring 47 always presses the flange 74 to the printed wiring board 40 side. It is formed to the length.
Therefore, the protrusion 78 of the dummy member 38 is brought into contact with the facing region 46. The printed wiring board 40 warps and the dummy member 3
8 is pressed, the dummy member 38 moves the spring 47
While shrinking, move to the side opposite to the printed wiring board 40.
When the printed wiring board 40 is warped on the side opposite to the dummy member 38, the dummy member 38 moves to the printed wiring board 40 side while being in contact with the printed wiring board 40 while being pressed by the spring 47.

In the above-described electronic component exchanging device, defective electronic components 42 soldered on the printed wiring board 40 are exchanged by the following procedure. As shown in FIG. 4, the first fan 24 supplies an inert gas to the first heater 20,
The first heater 20 heats the supplied inert gas. The heated inert gas (heating gas) is used as the first cover member 2
It is supplied to the mounting area 44 of the electronic component 42 on the surface of the printed wiring board 40 through the intake port 8. As a result, the mounting area 44 is locally heated. The first cover member 28 is fixed at a position covering the mounting area 44, and thus prevents the heated gas sent into the mounting area 44 from diverging.

Similarly, the second fan 26 is connected to the second heater 22.
And the second heater 22 heats the supplied inert gas. The heated inert gas (heating gas) is supplied to the facing region 46 through the intake port of the second cover member 30. As a result, the facing region 46 is locally heated. The second cover member 30 is fixed at a position that covers the facing region 46, and thus prevents the heating gas sent into the facing region 46 from diverging.

In the initial state before heating, the distance between the protruding portion 64 of the pin 48 and the first plate 66 of the regulating member 54 is "L". That is, the pin 48 can move to the lower side of the figure by the distance "L". The printed wiring board 40 begins to warp slightly due to the above-mentioned local heating. The sensor 32 is the printed wiring board 4 generated by local heating.
A warp amount of 0 is detected from the load applied to the spring 50, and is transmitted to the controller 34. The controller 34 adjusts the temperature of the heating gas supplied by the first heater 20 and the second heater 22 as follows in the direction of reducing the warp amount.

As shown in FIG. 5, when the temperature of the mounting region 44 is higher than the temperature of the facing region 46, the mounting region 44 thermally expands more than the facing region 46, and the center of the mounting region 44 is at the upper side (vertical direction) in the figure. Slightly warps toward the upper side). At this time, the controller 34 lowers the temperature of the heating gas supplied from the first heater 20 and raises the temperature of the heating gas supplied from the second heater 22. This adjustment by the controller 34 is performed until the temperature of the facing area 46 and the temperature of the mounting area 44 become substantially equal. Therefore, the coefficients of thermal expansion in the facing area 46 and the mounting area 44 are substantially equal. Therefore,
The printed wiring board 40 returns to the warped state.

The controller 34 uses the first heater 2
0 may be adjusted and the temperature of the heating gas supplied from the first heater 20 may be lowered, or only the second heater 22 may be adjusted and the temperature of the heating gas supplied from the second heater 22 may be raised. . On the other hand, as shown in FIG. 6, when the temperature of the facing area 46 is higher than the temperature of the mounting area 44,
The opposing area 46 is more thermally expanded than the mounting area 44, and the center of the mounting area 44 is slightly warped to the lower side of the figure (lower side in the vertical direction). At this time, the controller 34 raises the temperature of the heating gas supplied from the first heater 20 and lowers the temperature of the heating gas supplied from the second heater 22. Controller 3
This adjustment by 4 is performed by adjusting the temperature of the facing area 46 and the mounting area 4
This is done until the temperatures of 4 are almost equal. Therefore, the coefficients of thermal expansion in the facing area 46 and the mounting area 44 are substantially equal. Therefore, the printed wiring board 40 returns to the warped state.

The controller 34 uses the first heater 2
0 may be adjusted and the temperature of the heating gas supplied from the first heater 20 may be increased, or only the second heater 22 may be adjusted and the temperature of the heating gas supplied from the second heater 22 may be decreased. . As a result, the printed wiring board 40
The solder that fixes the electronic component 42 to the printed wiring board 40 is melted while the warpage of the solder is suppressed. After this,
The tip of the suction nozzle 36 is applied to the electronic component 42, and the electronic component 42 is sucked. As a result, the electronic component 42 is removed from the printed wiring board 40.

Next, a new electronic component 42 is placed on the mounting area 44 by the suction nozzle 36. Then, similarly to the above, the mounting region 44 and the facing region 46 are locally heated. At this time, the sensor 32 detects the amount of warpage of the printed wiring board 40 caused by local heating, and the controller 3
Tell 4. The controller 34 adjusts the temperature of the heating gas supplied by the first heater 20 and the second heater 22 in the direction of reducing the warp amount, as in the case of removing the electronic component 42. Therefore, the electronic component 42 is soldered to the mounting region 44 in a state where the warp of the printed wiring board 40 is suppressed.

Then, the printed wiring board 40 is cooled,
It is taken out from the electronic component exchanging device. Since the electronic component 42 is soldered in a state where the warp of the printed wiring board 40 is suppressed, distortion may occur in the soldered portion between the printed wiring board 40 and the electronic component 42 after the printed wiring board 40 is cooled. There is no. When the controller 34 controls the warp of the printed wiring board 40, the mounting area 4
4, an electronic component 42 is arranged, and a dummy member 38 having the same heat capacity as the electronic component 42 is brought into contact with the facing area 46. Therefore, the mounting area 44 and the facing area 4
The rate of change in temperature at 6 is almost equal. Therefore, the control of the controller 34 becomes easier than the case where the dummy member 38 is not used.

Further, as shown in FIG. 6, when the downward warp of the printed wiring board 40 reaches a predetermined amount "L", the pin 48 is pressed and moves to the detecting portion 52 side, The protruding portion 64 abuts around the insertion portion 70 of the regulation member 54.
Therefore, the pins 48 are prevented from further moving to the detection section 52 side, and the printed wiring board 40 is supported by the pins 48 from the lower side in the vertical direction. Therefore, the printed wiring board 4
0 does not warp downward in the vertical direction by more than a predetermined amount "L".
It should be noted that the protrusion 64 does not actually hit the periphery of the insertion portion 70 of the regulation member 54 under the control of the controller 34.

As described above, in the electronic component exchanging device of this embodiment, it is possible to suppress the warp of the printed wiring board 40 when the printed wiring board 40 is locally heated. Therefore, the electronic component 42 can be removed without causing distortion in the soldered portion of the other electronic components or the like on the printed wiring board 40.
Further, a new electronic component 42 can be soldered to the mounting area 44 while suppressing the warp of the printed wiring board 40. Therefore, after the printed wiring board 40 has cooled, the electronic component 42 can be replaced without causing distortion in the soldered portions of the electronic component 42 and the printed wiring board 40. As a result, even when the printed wiring board 40 is repeatedly subjected to vibration or heat stress, it is possible to prevent cracks from occurring in the soldered portion of the electronic component.

Further, by bringing the dummy member 38 having the same heat capacity as that of the electronic component 42 into contact with the facing region 46, the rate of change in temperature between the mounting region 44 and the facing region 46 can be made substantially equal. Therefore, the control of the controller 34 for suppressing the warp of the printed wiring board 40 can be facilitated. Then, when the printed wiring board 40 is locally heated, the regulating member 54 can prevent the printed wiring board 40 from warping by a predetermined amount “L” or more in the direction of pressing the pin 48.

FIG. 7 shows a second embodiment of the present invention (corresponding to claim 2, claim 7, claim 8 and claim 9). The same members as those in the first embodiment are designated by the same reference numerals, and detailed description of these members will be omitted. The electronic component exchanging device according to the present embodiment includes the first heater 20b and the second heater 20b.
Heater 22b, first fan 24b, second fan 26b,
First cover member 28, second cover member 30, sensor 3
2, the controller 34b, the suction nozzle 36, and the dummy member 38.

An inert gas such as nitrogen is supplied to the first fan 24b from a cylinder (not shown). The first fan 24b supplies an inert gas to the first heater 20b.
The first heater 20b heats the inert gas sent from the first fan 24b. The inert gas (heating gas) heated by the first heater 20b is sent to the mounting area 44 by the wind pressure of the inert gas sent from the first fan 24b. Therefore, the amount of heating gas supplied from the first heater 20b to the mounting area 44 is equal to that of the first fan 24b.
It is proportional to the amount of the inert gas supplied to the heater 20b, that is, the air volume of the first fan 24b.

Similarly, the second fan 26b is supplied with an inert gas such as nitrogen from a cylinder (not shown). The second fan 26b supplies an inert gas to the second heater 22b. The second heater 22b heats the inert gas sent from the second fan 26b. The inert gas (heating gas) heated by the second heater 22b is opposed to the opposing region 46 by the wind pressure of the inert gas sent from the second fan 26b.
Sent to. Therefore, the amount of the heating gas supplied from the second heater 22b to the facing area 46 is equal to that of the second fan 26b.
Is proportional to the amount of the inert gas supplied to the second heater 22b, that is, the air volume of the second fan 26b.

In this embodiment, the controller 34b is
The air flow rates of the first fan 24b and the second fan 26b are adjusted according to the warp amount of the printed wiring board 40 detected by the sensor 32. In the electronic component exchanging device described above, the defective electronic component 42 soldered on the printed wiring board 40 is exchanged by the following procedure.

Similar to the first embodiment, first, in the printed wiring board 40, with the surface on which the electronic component 42 is mounted facing the first cover member 28, the first component in the electronic component exchanging device is arranged.
It is fixed between the cover member 28 and the second cover member 30. Next, the dummy member 38 is placed on the spring 47 of the second cover member 30, and the protrusion 78 is brought into contact with the facing area 46 of the printed wiring board 40.

Then, the mounting region 44 and the facing region 46 are locally heated, and the printed wiring board 40 begins to warp slightly. The sensor 32 detects the amount of warp of the printed wiring board 40 caused by local heating, and notifies the controller 34b. The controller 34b adjusts the air flow rates of the first fan 24b and the second fan 26b as follows in the direction of reducing the warp amount.

As shown in FIG. 8, when the center of the mounting area 44 slightly warps to the upper side of the drawing (upper side in the vertical direction) due to the temperature difference between the mounting area 44 and the facing area 46, the controller 34b causes the first fan to operate. The air volume of 24b is reduced and the air volume of the second fan 26b is increased. As a result, the amount of heating gas sent to the mounting region 44 decreases and the amount of heating gas sent to the facing region 46 increases. Controller 34b
This adjustment by adjusting the temperature of the facing area 46 and the mounting area 44
Until the temperatures are almost equal. Therefore, the coefficient of thermal expansion in the facing region 46 and the mounting region 44 are substantially equal. As a result, the printed wiring board 40 returns to a warp-free state.

The controller 34b may adjust only the first fan 24b and reduce the air volume of the first fan 24b, or may adjust only the second fan 26b and increase the air volume of the second fan 26b. . On the other hand, as shown in FIG. 9, when the center of the mounting area 44 slightly warps to the lower side of the drawing (downward in the vertical direction) due to the temperature difference between the mounting area 44 and the facing area 46, the controller 34b causes the first The air volume of the fan 24b is increased and the air volume of the second fan 26b is decreased. As a result, the amount of heating gas sent to the mounting region 44 increases and the amount of heating gas sent to the facing region 46 decreases. This adjustment by the controller 34b
The process is performed until the temperature of the facing area 46 and the temperature of the mounting area 44 become substantially equal. Therefore, the facing area 46 and the mounting area 4
The coefficient of thermal expansion in 4 is almost equal. As a result, the printed wiring board 40 returns to a warp-free state.

The controller 34b may adjust only the first fan 24b and increase the air volume of the first fan 24b, or may adjust only the second fan 26b and decrease the air volume of the second fan 26b. . Electronic component 42
After the solder that fixes the components to the printed wiring board 40 is melted, the electronic component 42 is removed from the printed wiring board 40, and a new electronic component 42 is placed in the mounting area 44, as in the first embodiment. It

Then, as in the case of removing the electronic component 42, the mounting region 44 and the facing region 46 are locally heated.
The sensor 32 detects the amount of warp of the printed wiring board 40 caused by local heating, and notifies the controller 34b.
The controller 34b, in the same way as when removing the electronic component 42, moves the first fan 24b in a direction to reduce the warp amount.
And the air volume of the second fan 26b is adjusted. Therefore, the electronic component 42 is soldered to the mounting area 44 of the printed wiring board 40 in a state where the warp of the printed wiring board 40 is suppressed. Then, the printed wiring board 40 is cooled and taken out from the electronic component exchanging device. Since the electronic component 42 is soldered in a state where the warp of the printed wiring board 40 is suppressed, distortion may occur in the soldered portion between the printed wiring board 40 and the electronic component 42 after the printed wiring board 40 is cooled. There is no.

In this embodiment, as in the first embodiment, the dummy member 38 is arranged inside the second cover member 30, so that the control by the controller 34b becomes easy.
Further, as in the first embodiment, the restriction member 54 is formed on the sensor 32, so that the printed wiring board 40 is prevented from warping downward by a predetermined amount or more. As described above, also in this embodiment, the same effect as that of the above-described first embodiment can be obtained. The heating gas supplied by the first heater 20b and the second heater 22b is the same as the first fan 2
It is sent to the mounting area 44 and the facing area 46 by the 4b and the second fan 26b, respectively. Therefore, it is not necessary to make the first heater 20b and the second heater 22b face the mounting area 44 and the facing area 46 of the printed wiring board, respectively. As a result, the first heater 20b and the second heater 2
The electronic component exchanging device can be designed regardless of the size and installation position of 2b.

FIG. 10 shows a third embodiment of the present invention (corresponding to claim 3, claim 7, claim 8 and claim 9). The same members as those in the first and second embodiments are designated by the same reference numerals, and detailed description of these members will be omitted. The electronic component exchanging device according to the present embodiment includes the first heater 20.
b, the second heater 22b, the first fan 24b, the second fan 26b, the first cover member 28, the second cover member 30, the sensor 32, the controller 34c, the suction nozzle 36, and the dummy member 38.

In this embodiment, the controller 34c is
The outputs of the first heater 20b and the second heater 22b and the air volumes of the first fan 24b and the second fan 26b are adjusted according to the warp amount of the printed wiring board 40 detected by the sensor 32. In the electronic component exchanging device described above, the defective electronic component 42 soldered on the printed wiring board 40 is exchanged by the following procedure.

As in the second embodiment, the mounting area 44 and the facing area 46 are locally heated, and the printed wiring board 40 is
It begins to warp slightly. The sensor 32 detects the amount of warpage of the printed wiring board 40 caused by local heating and notifies the controller 34c. The controller 34c moves the first heater 20b and the second heater 2 in a direction to reduce the warp amount.
2b output, first fan 24b and second fan 26b
Adjust the air flow rate of and as follows.

As shown in FIG. 11, when the center of the mounting area 44 is slightly warped to the upper side of the drawing (upper side in the vertical direction) due to the temperature difference between the mounting area 44 and the facing area 46, the controller 34c causes the first heater. The temperature of the heating gas supplied from 20 is lowered, and the temperature of the heating gas supplied from the second heater 22 is raised. At the same time, the controller 34c lowers the air volume of the first fan 24 and raises the air volume of the second fan 26, so that the amount of heating gas sent to the mounting area 44 decreases and the amount of heating gas sent to the facing area 46 decreases. To increase. This adjustment by the controller 34c is performed in the facing area 4
This is performed until the temperature of 6 and the temperature of the mounting area 44 become substantially equal. Therefore, the coefficient of thermal expansion in the facing region 46 and the mounting region 44 are substantially equal. As a result, the printed wiring board 40 returns to a warp-free state.

The controller 34c may adjust only the first heater 20b and lower the temperature of the heating gas supplied from the first heater 20b.
It suffices to adjust only b and raise the temperature of the heating gas supplied from the second heater 22b, adjust only the first fan 24b and lower the air volume of the first fan 24b, and only the second fan 26b. Adjust the second fan 26
All that is required is to increase the air volume of b.

On the other hand, as shown in FIG. 12, the mounting area 44
When the center of the mounting region 44 slightly warps to the lower side of the drawing (downward in the vertical direction) due to the temperature difference between the opposing region 46 and the opposing region 46, the controller 34c raises the temperature of the heating gas supplied from the first heater 20. , The temperature of the heating gas supplied from the second heater 22 is lowered. At the same time, the controller 34c increases the air volume of the first fan 24 and lowers the air volume of the second fan 26, so that the amount of heating gas sent to the mounting region 44 increases and the amount of heating gas sent to the facing region 46 increases. Decrease. This adjustment by the controller 34c is performed until the temperature of the facing area 46 and the temperature of the mounting area 44 become substantially equal. Therefore, the coefficient of thermal expansion in the facing region 46 and the mounting region 44 are substantially equal. As a result, the printed wiring board 40 returns to a warp-free state.

The adjustment by the controller 34c is as follows.
It suffices to adjust only the first heater 20b and raise the temperature of the heating gas supplied from the first heater 20b.
Only the heater 22b may be adjusted and the temperature of the heating gas supplied from the second heater 22b may be lowered, or only the first fan 24b may be adjusted and the air volume of the first fan 24b may be increased. Adjust only the second
It is also possible to simply reduce the air volume of the fan 26b.

After the solder fixing the electronic component 42 to the printed wiring board 40 is melted, the electronic component 42 is removed from the printed wiring board 40 as in the first embodiment.
The new electronic component 42 is placed in the mounting area 44. Then, as in the case of removing the electronic component 42, the mounting area 4
4 and the facing area 46 are locally heated. The sensor 32 detects the amount of warpage of the printed wiring board 40 caused by local heating and notifies the controller 34c. Controller 34
Similarly to the case where the electronic component 42 is removed, c is the first heater 20b and the second heater 2 in the direction of reducing the warp amount.
2b output, first fan 24b and second fan 26b
Adjust the air volume and. Therefore, the electronic component 42 is soldered to the mounting area 44 of the printed wiring board 40 in a state where the warp of the printed wiring board 40 is suppressed. Then, the printed wiring board 40 is cooled and taken out from the electronic component exchanging device. Since the electronic component 42 is soldered in a state where the warp of the printed wiring board 40 is suppressed, distortion may occur in the soldered portion between the printed wiring board 40 and the electronic component 42 after the printed wiring board 40 is cooled. There is no.

In the present embodiment, as in the first embodiment, the dummy member 38 is arranged inside the second cover member 30, so that the control by the controller 34c becomes easy.
Further, as in the first embodiment, the restriction member 54 is formed on the sensor 32, so that the printed wiring board 40 is prevented from warping downward by a predetermined amount or more. As described above, also in this embodiment, the same effect as that of the above-described second embodiment can be obtained. Furthermore, in the present embodiment, when controlling the warp of the printed wiring board 40, the controller 34
c adjusts not only the air flow rates of the first fan 24b and the second fan 26b, but also the outputs of the first heater 20b and the second heater 22b. Therefore, the time required to locally heat the printed wiring board 40 and the time required to replace the electronic component 42 can be shortened.

FIG. 13 shows a fourth embodiment of the present invention (corresponding to claim 4, claim 7, claim 8 and claim 9). The same members as those in the first embodiment are designated by the same reference numerals, and detailed description of these members will be omitted. The electronic component exchanging device according to this embodiment includes a first heater 20, a second heater 22, a first fan 24, a second fan 26, a first cover member 28b, a second cover member 30b, a sensor 32b, and a sensor 32b.
Controller 34d, suction nozzle 36, dummy member 38
b.

The printed wiring board 40 is fixed between the first cover member 28b and the second cover member 30b in the electronic component exchanging device with the surface on which the electronic component 42 is mounted facing the first cover member 28b. To be done. First cover member 28b
Has an opening with a rectangular cross section that covers the mounting area 44, and is arranged with the opening facing the printed wiring board 40 side. An inlet for the heating gas fed from the first heater 20 is provided on the side of the first cover member 28b opposite to the opening. The first cover member 28b is fixed to the position covering the mounting area 44 with a predetermined distance from the printed wiring board 40. That is, a gap is formed between the end of the opening of the first cover member 28b and the printed wiring board 40, and the heating gas sent from the first heater 20 slightly leaks from the gap. In the present embodiment, the position of the first cover member 28b can be adjusted by the controller 34d in the vertical direction (vertical direction) in the figure via a stepping motor or the like (not shown).

The second cover member 30b has an opening having a rectangular cross section and a shape covering the facing region 46, and is arranged with the opening facing the printed wiring board 40 side. An intake port for the heating gas sent from the second heater 22 is provided on the side of the second cover member 30b opposite to the opening. The second cover member 30b is fixed at a position covering the facing region 46 with a predetermined distance from the printed wiring board 40. That is, a gap is formed between the end of the opening of the second cover member 30b and the printed wiring board 40, and the heating gas sent from the second heater 22 slightly leaks from the gap. In this embodiment, the position of the second cover member 30b is set by the controller 34d.
It can be adjusted in the vertical direction (vertical direction) in the figure via a stepping motor or the like (not shown).

The sensor 32b is a pin 48b (contact member).
The spring 50, the detector 52, and the regulating member 54 are used to measure the amount of warpage of the printed wiring board 40. The controller 34d controls the first cover member 28b according to the warp amount of the printed wiring board 40 detected by the sensor 32b.
Between the printed wiring board 40 and the second cover member 30
The distance between b and the printed wiring board 40 is adjusted.

FIG. 14 shows details of the sensor 32b and the dummy member 38b used in this embodiment. In the present embodiment, a support portion 82 having a circular cross section is integrally formed on the tip side of the pin 48b, and the dummy member 38b is placed on the support portion 82. The dummy member 38b has the same shape as the main body portion 56 of the dummy member 38 of the first embodiment. That is, on the surface of the dummy member 38b opposite to the sensor 32b, the projections 78b having the same number and the same shape as the balls (solder bumps) of the electronic component 42 are formed at positions facing the balls. Dummy member 38
A circular insertion port 76b (through hole) for inserting the tip of the pin 48b is provided at the center of b. Insertion hole 7
The inner diameter of 6b is smaller than the outer diameter of the support portion 82.

The pin 48b is rod-shaped, has a rounded tip, and extends in the vertical direction (vertical direction) in the drawing. A protrusion 64b having a circular cross section is integrally formed at substantially the center of the pin 48b in the axial direction. The spring 50 is provided on the rear end side of the pin 48b.
It is connected to the detection unit 52 via. The detection unit 52
Vertically lower side than the rear end of the pin 48b (lower side in FIG. 14)
It is fixed to. Further, the tip of the pin 48b is attached to the spring 5
13 is pressed by the elastic force of 0 toward the upper side of FIG.
Is abutted on the facing area 46 of the printed wiring board 40. As shown in FIG. 13, the dummy member 38b is placed on the support portion 82 with the protrusion 78b facing the printed wiring board 40 and the tip of the pin 48b being inserted into the insertion opening 76b. The support portion 82 is formed at a position where the tips of the protrusions 78b and the tips of the pins 48b have the same height in the vertical direction when the dummy member 38b is placed on the support portion 82. Therefore, the tip of the pin 48b and the tip of the protrusion 78b are also brought into contact with the facing area 46.

As in the first embodiment, the detecting section 52
By detecting the load applied to the spring 50, the pin 48
The movement amount of b is measured as the warp amount of the printed wiring board 40. In the electronic component exchanging device described above, the defective electronic component 42 soldered on the printed wiring board 40 is exchanged by the following procedure. First, the printed wiring board 40
The surface on which the electronic component 42 is mounted is attached to the first cover member 2
8b toward the first cover member 2 in the electronic component exchanging device
It is fixed in a horizontal state between 8b and the second cover member 30b. Next, the dummy member 38b is placed on the supporting portion 82, and the tips of the protrusions 78b and the pins 48b are brought into contact with the facing area 46 of the printed wiring board 40.

Then, as in the first embodiment, the mounting region 44 and the facing region 46 are locally heated, and the printed wiring board 40 begins to warp slightly. The sensor 32b detects the amount of warpage of the printed wiring board 40 caused by local heating and notifies the controller 34d. Controller 34d
The first cover member 28b in a direction to reduce the warp amount.
Between the printed wiring board 40 and the second cover member 30
The distance between b and the printed wiring board 40 is adjusted as follows.

As shown in FIG. 15, when the center of the mounting area 44 slightly warps to the upper side of the drawing (upper side in the vertical direction) due to the temperature difference between the mounting area 44 and the facing area 46, the controller 34d causes the first cover The member 28b is attached to the printed wiring board 4
The gap between the first cover member 28b and the printed wiring board 40 is increased by moving the second cover member 30b close to the printed wiring board 40, and the gap between the second cover member 30b and the printed wiring board 40 is increased. Make it smaller. As a result, the amount of heating gas that leaks from the gap between the first cover member 28b and the mounting region 44 increases. In other words, the heating gas in the first cover member 28b is likely to be diffused. Further, the amount of heating gas leaking from the gap between the second cover member 30b and the facing region 46 is reduced. Controller 34d
This adjustment by adjusting the temperature of the facing area 46 and the mounting area 44
Until the temperatures are almost equal. Therefore, the coefficient of thermal expansion in the facing region 46 and the mounting region 44 are substantially equal. As a result, the printed wiring board 40 returns to a warp-free state.

The controller 34d may control only the first cover member 28b and move the first cover member 28b away from the printed wiring board 40, and may control only the second cover member 30b and the second cover member 30b. May be brought close to the printed wiring board 40. On the other hand, FIG.
As shown in, due to the temperature difference between the mounting area 44 and the facing area 46, the center of the mounting area 44 is at the bottom of the figure (upper side in the vertical direction)
When slightly warped, the controller 34d brings the first cover member 28b closer to the printed wiring board 40 and
The gap between the cover member 28b and the printed wiring board 40 is reduced, the second cover member 30b is moved away from the printed wiring board 40, and the second cover member 30b and the printed wiring board 40 are separated.
Increase the gap between and. Thereby, the first cover member 2
The amount of heating gas leaking from the gap between 8b and the mounting area 44 is reduced. In addition, the second cover member 30b and the facing region 4
The amount of heating gas that leaks from the gap with 6 increases. In other words, the heated gas in the second cover member 30b is likely to diffuse. This adjustment by the controller 34d is performed until the temperature of the facing area 46 and the temperature of the mounting area 44 become substantially equal. Therefore, the coefficient of thermal expansion in the facing region 46 and the mounting region 44 are substantially equal. As a result, the printed wiring board 40 returns to a warp-free state.

The controller 34d may control only the first cover member 28b and bring the first cover member 28b closer to the printed wiring board 40, and may control only the second cover member 30b and the second cover member 30b. May be simply moved away from the printed wiring board 40. Electronic component 42
After the solder that fixes the components to the printed wiring board 40 is melted, the electronic component 42 is removed from the printed wiring board 40, and a new electronic component 42 is placed in the mounting area 44, as in the first embodiment. It

Then, as in the case of removing the electronic component 42, the mounting region 44 and the facing region 46 are locally heated.
The sensor 32b detects the amount of warpage of the printed wiring board 40 caused by local heating and notifies the controller 34d. Similarly to when removing the electronic component 42, the controller 34d reduces the distance between the first cover member 28b and the printed wiring board 40 and the distance between the second cover member 30b and the printed wiring board 40 in the direction of reducing the warp amount. adjust.
Therefore, the electronic component 42 is mounted on the mounting area 44 of the printed wiring board 40 in a state where the warp of the printed wiring board 40 is suppressed.
Be soldered to. Then, the printed wiring board 40 is cooled and taken out from the electronic component exchanging device. Since the electronic component 42 is soldered in a state where the warp of the printed wiring board 40 is suppressed, distortion may occur in the soldered portion between the printed wiring board 40 and the electronic component 42 after the printed wiring board 40 is cooled. There is no.

In this embodiment, as in the first embodiment, the dummy member 38b is brought into contact with the facing area 46, so that the control by the controller 34d becomes easy. Further, as in the first embodiment, the regulating member 54 is formed on the sensor 32b, so that the printed wiring board 40 is prevented from warping downward by a predetermined amount or more. As described above, also in this embodiment, the same effect as that of the above-described first embodiment can be obtained. Also, the first cover member 28b
With the second cover member 30b, the printed wiring board 40
Dispersion of heat that is sent to a predetermined area of is prevented. Therefore, the printed wiring board 40 can be locally heated more efficiently.

FIG. 17 shows a fifth embodiment of the present invention (corresponding to claim 5, claim 6, claim 7, claim 8 and claim 9). The same members as those in the second and fourth embodiments are designated by the same reference numerals, and detailed description of these members will be omitted. The electronic component exchanging device according to the present embodiment includes a first heater 20b, a second heater 22b, a first fan 24b, a second fan 26b, a first cover member 28b, a second cover member 30b, a sensor 32b, a controller 34e, and a suction nozzle. 36 and a dummy member 38b.

In this embodiment, the controller 34e is
According to the warp amount of the printed wiring board 40 detected by the sensor 32b, the first heater 20b and the second heater 22b.
Output, the air volumes of the first fan 24b and the second fan 26b, the distance between the first cover member 28b and the printed wiring board 40, and the distance between the second cover member 30b and the printed wiring board 40.

In the electronic component exchanging apparatus described above, the defective electronic component 42 soldered onto the printed wiring board 40 is exchanged by the following procedure. As in the fourth embodiment, the mounting region 44 and the facing region 46 are locally heated, and the printed wiring board 40 begins to warp slightly. Sensor 32b
Detects the amount of warpage of the printed wiring board 40 caused by local heating and notifies the controller 34e. The controller 34e causes the first heater 2 to reduce the warp amount.
0b and the output of the second heater 22b, and the first fan 24b
And the air volume of the second fan 26b and the first cover member 28b.
Between the printed wiring board 40 and the second cover member 30
The distance between b and the printed wiring board 40 is adjusted as follows.

As shown in FIG. 18, when the center of the mounting area 44 is slightly warped to the upper side of the drawing (upper side in the vertical direction) due to the temperature difference between the mounting area 44 and the facing area 46, the controller 34e causes the first heater The temperature of the heating gas supplied from 20b is lowered, and the temperature of the heating gas supplied from the second heater 22b is raised. At the same time, the controller 34e
By decreasing the air volume of the fan 24b and increasing the air volume of the second fan 26b, the amount of heating gas sent to the mounting area 44 decreases and the amount of heating gas sent to the facing area 46 increases. Further, the controller 34e moves the first cover member 28b away from the printed wiring board 40 to move the first cover member 28b to the first cover member 28b.
The gap between the cover member 28b and the printed wiring board 40 is increased, the second cover member 30b is brought closer to the printed wiring board 40, and the gap between the second cover member 30b and the printed wiring board 40 is reduced. Thereby, the first cover member 28
The amount of heating gas that leaks from the gap between b and the mounting region 44 increases, and the amount of heating gas that leaks from the gap between the second cover member 30b and the facing region 46 decreases. Controller 3
This adjustment by 4e is performed until the temperature of the facing area 46 and the temperature of the mounting area 44 become substantially equal. Therefore, the coefficient of thermal expansion in the facing region 46 and the mounting region 44 are substantially equal. As a result, the printed wiring board 40 returns to a warp-free state.

The controller 34e may adjust only the first heater 20b and lower the temperature of the heating gas supplied from the first heater 20b.
It suffices to adjust only b and raise the temperature of the heating gas supplied from the second heater 22b, adjust only the first fan 24b and lower the air volume of the first fan 24b, and only the second fan 26b. Adjust the second fan 26
It is sufficient to increase the air flow rate of b, and the first cover member 28b
Only the first cover member 28b may be moved away from the printed wiring board 40 by controlling only the second cover member 30b.
It is also possible to control only that and bring the second cover member 30b close to the printed wiring board 40.

On the other hand, as shown in FIG.
When the center of the mounting area 44 slightly warps to the lower side (vertical direction lower side) of the drawing due to the temperature difference between the opposing area 46 and the opposing area 46, the controller 34e raises the temperature of the heating gas supplied from the first heater 20b. , The temperature of the heating gas supplied from the second heater 22b is lowered. At the same time, the controller 34e
By increasing the air volume of the first fan 24b and decreasing the air volume of the second fan 26b, the amount of heating gas sent to the mounting area 44 increases and the amount of heating gas sent to the facing area 46 decreases. Further, the controller 34e brings the first cover member 28b closer to the printed wiring board 40,
The gap between the first cover member 28b and the printed wiring board 40 is reduced, and the second cover member 30b is attached to the printed wiring board 40.
And the distance between the second cover member 30b and the printed wiring board 40 is increased. As a result, the amount of heating gas that leaks from the gap between the first cover member 28b and the mounting region 44 decreases, and the amount of heating gas that diffuses from the gap between the second cover member 30b and the facing region 46 increases. This adjustment by the controller 34e is performed until the temperature of the facing area 46 and the temperature of the mounting area 44 become substantially equal. Therefore, the coefficient of thermal expansion in the facing region 46 and the mounting region 44 are substantially equal. As a result, the printed wiring board 40 returns to a warp-free state.

The controller 34e may adjust only the first heater 20b and raise the temperature of the heating gas supplied from the first heater 20b.
It is sufficient to adjust only b and lower the temperature of the heating gas supplied from the second heater 22b, or to adjust only the first fan 24b and increase the air volume of the first fan 24b, only the second fan 26b. Adjust the second fan 26
It suffices to reduce the air volume of b, and the first cover member 28b
Only the first cover member 28b may be brought closer to the printed wiring board 40, and only the second cover member 30b may be controlled to move the second cover member 30b to the printed wiring board 4.
You can just move it away from zero.

After the solder fixing the electronic component 42 to the printed wiring board 40 is melted, the electronic component 42 is removed from the printed wiring board 40 and a new electronic component 42 is mounted, as in the first embodiment. It is placed in the area 44.
Then, as in the case of removing the electronic component 42, the mounting region 44 and the facing region 46 are locally heated. Sensor 32b
Detects the amount of warpage of the printed wiring board 40 caused by local heating and notifies the controller 34e. The controller 34e, in the same way as when removing the electronic component 42, reduces the amount of warp in the output of the first heater 20b and the second heater 22b, the air volume of the first fan 24b and the second fan 26b, and The distance between the cover member 28b and the printed wiring board 40 and the distance between the second cover member 30b and the printed wiring board 40 are adjusted. Therefore, the electronic component 42 is soldered to the mounting area 44 of the printed wiring board 40 in a state where the warp of the printed wiring board 40 is suppressed.
Then, the printed wiring board 40 is cooled and taken out from the electronic component exchanging device. Soldering the electronic component 42
Since the warping of the printed wiring board 40 is suppressed, the printed wiring board 40 is cooled, and then the printed wiring board 4 is cooled.
No distortion occurs in the soldered portion between 0 and the electronic component 42.

In this embodiment, as in the fourth embodiment, the dummy member 38b is in contact with the facing area 46, so that the control by the controller 34e becomes easy. Further, similarly to the fourth embodiment, the restriction member 54 is formed on the sensor 32b, so that the printed wiring board 40 is prevented from warping downward by a predetermined amount or more. As described above, also in this embodiment, the same effect as that of the above-described fourth embodiment can be obtained. Also, the first cover member 28b
And not only the position adjustment of the second cover member 30b but also the first
By adjusting the outputs of the heater 20b and the second heater 22b, it is possible to shorten the time required to locally heat the printed wiring board 40 and the time required to replace electronic components. Further, the warpage of the printed wiring board 40 can be controlled more finely by adjusting the air volumes of the first fan 24b and the second fan 26b.

In the first embodiment described above, the first
An example in which the fan 24 and the second fan 26 supply an inert gas to the first heater 20 and the second heater 22, and the heated gas is sent from the first heater 20 and the second heater 22 to a predetermined area of the printed wiring board 40. Said. The present invention is not limited to such an embodiment, and the first fan 24 and the second fan 26 may be omitted. In this case, the first heater 20 is installed in the first cover member 28, and
The second heater is attached in the cover member 30. In addition, the first heater 20 and the second heater 22 are the printed wiring board 40.
It is also possible to adopt a form in which a predetermined region of is heated by infrared rays or the like.

[0092]

According to the electronic component exchanging device of the first aspect, it is possible to prevent the printed wiring board from warping when the electronic component soldered on the printed wiring board is removed by local heating. Therefore, it is possible to prevent distortion from occurring in the soldered portion of the other electronic components or the like on the printed wiring board. Further, it is possible to solder the electronic component to the mounting area while suppressing the warp of the printed wiring board. Therefore, after the printed wiring board is cooled, no distortion occurs in the soldered portion between the electronic component and the printed wiring board, so even when vibration or thermal stress is repeatedly applied to the printed wiring board,
It is possible to prevent cracks from occurring in the soldered portion of the electronic component.

In the electronic component exchanging device according to the second aspect, when the electronic component soldered on the printed wiring board is removed by local heating, it is possible to prevent the printed wiring board from warping. Therefore, it is possible to prevent distortion from occurring in the soldered portion of the other electronic components or the like on the printed wiring board. Further, it is possible to solder the electronic component to the mounting area while suppressing the warp of the printed wiring board. Therefore, after the printed wiring board is cooled, distortion does not occur in the soldering part between the electronic component and the printed wiring board, so even when the printed wiring board is repeatedly subjected to vibration or thermal stress, soldering of the electronic component It is possible to prevent a crack from being generated in the part. Further, the electronic component exchanging device can be designed regardless of the size and installation position of the first and second heaters.

In the electronic component exchanging device according to the third aspect, not only the air flow rates of the first and second fans but also the outputs of the first and second heaters are adjusted to locally heat the printed wiring board and the electronic components. It is possible to shorten the time required to replace the. In the electronic component exchanging device according to the fourth aspect, it is possible to prevent the printed wiring board from warping when the electronic component soldered on the printed wiring board is removed by local heating. Therefore, it is possible to prevent distortion from occurring in the soldered portion of the other electronic components or the like on the printed wiring board. Also,
Electronic parts can be soldered to the mounting area while suppressing the warpage of the printed wiring board. Therefore, after the printed wiring board is cooled, distortion does not occur in the soldering part between the electronic component and the printed wiring board, so even when the printed wiring board is repeatedly subjected to vibration or thermal stress, soldering of the electronic component It is possible to prevent a crack from being generated in the part. Further, the first and second cover members prevent the heat transmitted to a predetermined area of the printed wiring board from being dissipated.
The printed wiring board can be locally heated more efficiently.

In the electronic component exchanging device according to the fifth aspect, not only the position adjustment of the first and second cover members but also the first and second cover members are performed.
By adjusting the output of the heater, it is possible to shorten the time required to locally heat the printed wiring board and the time required to replace the electronic component. In the electronic component exchanging device according to claim 6, the first and second
The warp of the printed wiring board can be controlled more finely by adjusting not only the position of the cover member but also the air volumes of the first and second fans.

In the electronic component exchanging device according to the seventh aspect, when exchanging the electronic component soldered to the mounting area of the printed wiring board by local heating, the dummy member is brought into contact with the opposing area, whereby the printed wiring board is mounted. It is possible to easily control the controller for suppressing the warp. In the electronic component exchanging device according to claim 8 or 9, it is possible to prevent the printed wiring board from being locally heated by the restricting member and the contact member so that the printed wiring board is warped on the back surface side (direction pressing the contact member) by a predetermined amount or more. it can.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing a first embodiment of an electronic component exchanging device of the present invention.

2 is a perspective view showing details of the sensor of FIG. 1. FIG.

FIG. 3 is a perspective view showing details of the dummy member in FIG.

FIG. 4 is an explanatory diagram showing control of warpage of a printed wiring board by a controller in the first embodiment.

FIG. 5 is an explanatory diagram showing a state in which the mounting area of the printed wiring board is warped upward in the vertical direction in the first embodiment.

FIG. 6 is an explanatory diagram showing a state in which the mounting area of the printed wiring board is warped downward in the vertical direction in the first embodiment.

FIG. 7 is an explanatory diagram showing a second embodiment of the electronic component exchanging device of the present invention.

FIG. 8 is an explanatory diagram showing a state in which a mounting area of a printed wiring board is warped upward in the vertical direction in the second embodiment.

FIG. 9 is an explanatory diagram showing a state in which the mounting area of the printed wiring board is warped downward in the vertical direction in the second embodiment.

FIG. 10 is an explanatory diagram showing a third embodiment of the electronic component exchanging device of the present invention.

FIG. 11 is an explanatory diagram showing a state in which the mounting area of the printed wiring board is warped upward in the vertical direction in the third embodiment.

FIG. 12 is an explanatory diagram showing a state in which a mounting area of a printed wiring board is warped downward in the vertical direction in the third embodiment.

FIG. 13 is an explanatory diagram showing a fourth embodiment of the electronic component exchanging device of the present invention.

14 is a perspective view showing details of a sensor and a dummy member in FIG.

FIG. 15 is an explanatory diagram showing a state in which the mounting area of the printed wiring board is warped upward in the vertical direction in the fourth embodiment.

FIG. 16 is an explanatory diagram showing a state in which the mounting area of the printed wiring board is warped downward in the vertical direction in the fourth embodiment.

FIG. 17 is an explanatory diagram showing a fifth embodiment of the electronic component exchanging device of the present invention.

FIG. 18 is an explanatory diagram showing a state in which the mounting area of the printed wiring board is warped upward in the vertical direction in the fifth embodiment.

FIG. 19 is an explanatory diagram showing a state in which the mounting area of the printed wiring board is warped downward in the vertical direction in the fifth embodiment.

[Explanation of symbols]

20, 20b First heater 22, 22b Second heater 24, 24b First fan 26, 26b Second fan 28, 28b First cover member 30, 30b Second cover member 32, 32b sensor 34, 34b, 34c, 34d, 34e controller 36 Suction nozzle 38, 38b Dummy member 40 printed wiring board 42 electronic components 44 mounting area 46 Opposing area 47 spring 48, 48b pin (contact member) 50 spring 52 detector 54 Control member 56 Body 58 legs 64, 64b protrusion 66 First Plate 68 Second plate 70 insertion part 74 flange 76, 76b insertion port 78, 78b protrusion 82 Support

Claims (9)

[Claims] 1. A first heater for locally heating a mounting area of an electronic component on a front surface of a printed wiring board, and a second heater for locally heating a facing area of the back surface of the printed wiring board facing the mounting area. A sensor that detects a warp amount of the printed wiring board caused by local heating, and at least one of outputs of the first and second heaters in a direction of reducing the warp amount according to the warp amount detected by the sensor. An electronic component exchanging device, comprising: a controller that adjusts the 2. A first heater, a first fan that sends heat generated by the first heater to a mounting area of an electronic component on a surface of a printed wiring board to locally heat the mounting area, a second heater, and The heat generated by the second heater is sent to the opposite area of the back surface of the printed wiring board that faces the mounting area,
A second fan that locally heats the facing area, a sensor that detects a warp amount of the printed wiring board caused by the local heating, and a direction that reduces the warp amount according to the warp amount detected by the sensor. And a controller that adjusts at least one of the air volumes of the first and second fans. 3. The electronic component exchanging device according to claim 2, wherein the controller is configured to reduce the warp amount according to the warp amount detected by the sensor.
At least one of the output of the second heater and the output of the second heater are further adjusted. 4. A first heater, a first fan that sends heat generated by the first heater to a mounting area of an electronic component on a surface of a printed wiring board to locally heat the mounting area, and a shape that covers the mounting area. A first cover member for preventing heat from being dissipated into the mounting area, a second heater, and heat generated by the second heater in an opposing area on the back surface of the printed wiring board facing the mounting area. Send in,
A second fan that locally heats the facing area, a second cover member that has a shape that covers the facing area and that prevents the heat that is sent to the facing area from diverging, and a warp of the printed wiring board that occurs due to the local heating. A sensor for detecting the amount, and a distance between the first cover member and the printed wiring board, a distance between the first cover member and the printed wiring board, and a distance between the second cover member and the print according to the amount of warp detected by the sensor. An electronic component exchanging device comprising: a controller that adjusts at least one of distances from a wiring board. 5. The electronic component exchanging device according to claim 4, wherein the controller is configured to reduce the warp amount in accordance with the warp amount detected by the sensor.
At least one of the output of the second heater and the output of the second heater are further adjusted. 6. The electronic component exchanging device according to claim 4, wherein the controller is configured to reduce the warp amount in accordance with the warp amount detected by the sensor.
At least one of the air flow rate of the second fan and the air flow rate of the second fan are further adjusted. 7. The electronic component exchanging device according to claim 1, 2, or 4, wherein the dummy member has a heat capacity corresponding to that of the electronic component and is in contact with the facing region. An electronic component exchanging device comprising: 8. The electronic component exchange device according to claim 1, wherein the sensor has a contact member whose one end is in contact with the back surface of the printed wiring board, and the contact. When the member moves a predetermined amount to the side opposite to the printed wiring board due to the warp of the printed wiring board, it hits the contact member and is connected to the contact member and a restricting member that prevents the contact member from moving more than the predetermined amount. And a detection unit configured to detect the movement amount of the contact member as the warp amount. 9. The electronic component exchanging device according to claim 8, wherein the contact member is formed in an elongated shape extending in a direction orthogonal to the printed wiring board, and the regulation member is the other end of the contact member. The electronic component exchanging device according to claim 1, wherein the contact member has a protrusion that comes into contact with the periphery of the insertion portion when the contact member moves by the predetermined amount.