JP2003218266A - Module substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To increase the number of terminals in a module, and to reduce height. <P>SOLUTION: In the module substrate having an external connection electrode formed on the outer-periphery surface of a multilayer laminate, at least one opening is provided on the module substrate, an end face electrode is formed on a sidewall at the opening, electric connection is made to the end face electrode, and a second external electrode is formed on the surface of the multilayer laminate, thus increasing the number of terminals in the module, and reducing height. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount module substrate to be reflow soldered, and more particularly to a terminal structure thereof.

[0002]

2. Description of the Related Art A conventional module board has a structure shown in FIGS. FIG. 6 is a perspective view seen from the back surface of the module, and FIG. 7 is an enlarged view of a main part of the back surface of the module. Hereinafter, description will be given with reference to the drawings. Reference numeral 1 denotes a resin-based module substrate on the surface of which a high-frequency circuit used for a module is formed, and an end face electrode 2 formed by dividing a through hole in the periphery thereof, and an end face electrode 2 on the back face 3 of the module substrate.
The external terminals 4 for module mounting connected to the external terminals 4 are formed, and the solder bumps 18 are formed inward of the external terminals 4. On the surface of the module substrate 1, electronic parts constituting a high-frequency circuit are mounted, and a metal cover 5 for electromagnetic shielding is mounted.
Is attached.

[0003]

However, in such a conventional structure, the number of terminal electrodes on the module substrate has a great influence on the size of the module substrate. That is, as the size of the module substrate decreases, the number of terminal electrodes that can be formed decreases. As a result, when the size of the module substrate is reduced, the required number of terminal electrodes cannot be formed and the required circuit cannot be configured.

The height of the module having electronic components mounted on the surface of the module substrate is the sum of the thickness of the module substrate and the height of the electronic components. Therefore, when an electronic component having a large height is used, there is a drawback in that a module having a required height cannot be manufactured.

The present invention solves such a problem, and it is an object of the present invention to provide a module substrate having a structure in which the number of terminal electrodes is increased and the height dimension of the module is reduced while maintaining the size of the module substrate. It is intended.

[0006]

In order to achieve this object, the present invention provides a module substrate having external connection electrodes formed on the outer peripheral surface of a multilayer laminate, wherein the module substrate is provided with at least one opening. A second external electrode is formed on the surface of the multi-layer laminate by being electrically connected to the end face electrode with a module substrate having an end face electrode formed on the side wall of the opening.

As a result, the number of terminals of the module can be increased and the height of the module can be reduced.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION In the invention of claim 1 of the present invention, the first external connection electrode formed on the outer peripheral surface of the multilayer laminate and at least one opening are provided in the multilayer laminate,
A module substrate having an end surface electrode formed on a side wall of the opening and electrically connected to the end surface electrode to form a second external electrode on the surface of the multilayer laminate. As a result, it is possible to increase the number of terminal electrodes while maintaining the size of the module substrate, and by arranging an electronic component having a large height in the opening, the height of the module substrate and the height of the electronic component are added. The size can be reduced.

The invention according to claim 2 of the present invention is the module substrate according to claim 1 in which a terminal electrode capable of disposing an electronic component is formed around the opening, and the terminal electrode is formed around the opening. Therefore, the wiring from the terminal of the electronic component to the end face electrode of the multilayer laminate can be shortened, and the electronic component can be arranged so as to cover the opening, so the space in the center of the package of the electronic component is effective. Can be used for.

The invention according to claim 3 of the present invention is the module substrate according to claim 1 in which all the end face electrodes formed in the openings form ground electrodes, and an electronic device having a ground electrode on the bottom surface of the package. By electrically connecting the ground electrode of the component to the end surface electrode, it is possible to enhance the grounding and heat dissipation effects.

The invention according to claim 4 of the present invention is the module substrate according to claim 1 in which the multilayer laminate is formed of a ceramic member which is an inorganic material, and has a planar flatness. Good soldering can be done when mounting on the motherboard.

The invention according to claim 5 of the present invention is the module substrate according to claim 1 in which the multilayer substrate is formed of an epoxy resin which is an organic material. it can.

Embodiments of the present invention will be described below with reference to the drawings.

(First Embodiment) FIG. 1 shows a part of the back surface of a module substrate 1 according to the first embodiment. As shown in FIG. 1, the module substrate 1 is composed of a multilayer laminate 9, and an opening 19 is formed in the multilayer laminate 9.
The end face electrode 7 is formed on the side wall of the opening 19, and the external electrode 6 is provided so as to be electrically connected to the end face electrode 7.
The multilayer laminate 9 is formed of a ceramic member which is an inorganic material or an epoxy resin which is an organic material.

FIG. 2 shows a part of the surface of the module substrate 1 mounted on the mother board, and its sectional view is shown in FIG. As shown in FIG. 2, the size of the opening 19 is set to be larger than that of the electronic component 10, and the electronic component 10 and the multilayer laminate 9 are electrically connected to the land 11 of the mother board 17 and the solder 25. The end surface electrode 7 is an electronic component 1
0 may be used to electrically connect the multi-layer stack 9 and the signal line and the ground line of the multi-layer stack 9 and the mother board 17 to each other.

(Second Embodiment) FIG. 4 shows a part of the surface of a module substrate 1 mounted on a mother board according to the second embodiment, and a sectional view thereof is shown in FIG. In this module substrate 1, a terminal electrode 16 on which the electronic component 13 can be arranged is formed around the opening 19. The end surface electrodes 15 formed in the openings 19 are all ground electrodes,
The land 11 of the motherboard 17 corresponding to the opening 19 also serves as a ground electrode. The electronic component 13 having the terminal electrode 14 on the bottom surface is mounted so as to cover the opening 19, the solder bump of the terminal electrode 14 of the electronic component 13 flows into the opening 19, and the opening 19 is filled with the solder 25. As the solder 25, a solder having a melting point that melts when the module is reflow-soldered is used.

[0017]

As described above, according to the present invention, at least one opening is provided in the module substrate, the end face electrode is formed on the side wall of the opening, and the end face electrode is electrically connected to the module substrate surface. By forming the second external electrode on the substrate, the number of terminal electrodes can be increased and the height dimension of the module can be reduced while maintaining the size of the module substrate.

[Brief description of drawings]

FIG. 1 is a perspective view showing a module substrate according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a module substrate according to an embodiment of the present invention.

FIG. 3 is a cross-sectional view showing a module substrate according to an embodiment of the present invention.

FIG. 4 is a perspective view showing a module substrate according to another embodiment of the present invention.

FIG. 5 is a perspective view showing a module substrate according to another embodiment of the present invention.

FIG. 6 is a perspective view showing a conventional module substrate.

FIG. 7 is a perspective view showing a conventional module substrate.

[Explanation of symbols]

1 module board 2 End surface electrode 3 Module board back side 4 First external electrode 5 metal cover 6 Second external electrode 7 Edge electrode 9 Multi-layer laminate 10 electronic components 11 lands 13 Electronic components 14 terminal electrodes 15 Edge electrode 16 terminal electrode 17 Motherboard 18 Solder bump 19 opening 25 solder

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Daisuke Nishimura             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd.

Claims (5)

[Claims] 1. A first layer formed on the outer peripheral surface of a multi-layer laminate.
At least one opening is provided in the external connection electrode and the multilayer laminate, and a module substrate having an end face electrode formed on a side wall of the opening is electrically connected to the end face electrode, and is electrically connected to the surface of the multilayer laminate. A module substrate having external electrodes formed thereon. 2. The module substrate according to claim 1, wherein a terminal electrode on which an electronic component can be arranged is formed around the opening. 3. The module substrate according to claim 1, wherein all the end face electrodes formed in the openings are ground electrodes. 4. The module substrate according to claim 1, wherein the multilayer laminate is formed of a ceramic member which is an inorganic material. 5. The module substrate according to claim 1, wherein the multilayer substrate is formed of an epoxy resin which is an organic material.