JP2003218141A - Apparatus and method for manufacturing semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for manufacturing semiconductor devices with high productivity, which are capable of cutting a semiconductor device aggregate where semiconductor packages are formed into the separate semiconductor devices with high accuracy in size and shape even if the semiconductor devices are reduced in size. <P>SOLUTION: An apparatus 10 for manufacturing semiconductor devices 1 is equipped with a support means 10t where suction holes 10t2 communicating with a vacuuming pump are provided to suck up a semiconductor device aggregate 1St placed on it, a cutting means 10b which cuts the semiconductor device aggregate 1St along boundary lines s1 and s2 between regions corresponding to the semiconductor devices, a plurality of through-holes 10p1 which are provided as they are corresponding to the cutting lines (boundary lines) s1 and s2 of the semiconductor device aggregate 1St and where the cutting edges of the cutting means 10b are inserted, and a pressing means 10p which presses down the non-cutting part of the semiconductor device aggregate 1St. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing apparatus and manufacturing method for cutting a semiconductor device assembly having a semiconductor package into individual semiconductor devices.

[0002]

2. Description of the Related Art Conventionally, semiconductor devices have been manufactured by the following manufacturing method for the purpose of improving productivity, improving yield, and the like.

That is, each semiconductor element is mounted corresponding to a circuit for each of a plurality of semiconductor devices formed in a matrix on a common circuit board, and each semiconductor element and the corresponding circuit are bonded by a bonding wire or a Philip chip. Connect electrically by connecting.

Then, a semiconductor element for each semiconductor device on the circuit board and a circuit corresponding thereto are resin-sealed, and then the resin-sealed circuit board is cut using a blade and divided into each semiconductor device, Each semiconductor device is manufactured.

The cutting into each semiconductor device is performed by vacuum-evacuating a resin-sealed circuit board in a manufacturing apparatus to fix the circuit board on a supporting table and cutting it with a blade to divide into semiconductor devices. There is.

[0006]

By the way, with the recent trend toward miniaturization of semiconductor devices, resin-sealed circuit boards have been cut out into small semiconductor devices.

Therefore, even if the resin-sealed circuit board is fixed on the support table by suction of vacuum suction,
The fixing force is not sufficient for the cutting force when cutting into individual semiconductor devices using a blade, and the cutting force during cutting affects the fixed state of the circuit board and it is displaced diagonally and cut out. In addition, there are problems that the shape of the semiconductor device becomes defective and the size changes.

In order to avoid the above problem, for example, a method of slowing the cutting speed of the blade can be considered. However, if the cutting speed of the blade is slow, another problem occurs that the cutting process takes time and productivity decreases. To do.

In view of the above situation, the present invention accurately and uniformly cuts the semiconductor device in shape and size even if the region corresponding to each semiconductor device in the semiconductor device assembly in which the semiconductor package is formed is miniaturized. It is also an object of the present invention to provide a semiconductor device manufacturing apparatus and manufacturing method that can be manufactured with high productivity.

[0010]

In order to achieve the above object, a semiconductor device manufacturing apparatus according to claim 1 of the present invention is an individual semiconductor device in which a semiconductor device assembly having a plurality of semiconductor packages is cut. A semiconductor device manufacturing apparatus that divides into two parts, which is provided with an intake hole connected to a vacuuming mechanism and corresponds to a supporting unit that sucks a mounted semiconductor device assembly and each semiconductor device in the semiconductor device assembly. Cutting means for cutting along the boundary line of the region, and a plurality of through holes which are provided corresponding to the cutting points of the semiconductor device assembly and through which the cutting edges of the cutting means are inserted, and non-cutting points of the semiconductor device assembly And a pressing means for pressing.

A semiconductor device manufacturing apparatus according to a second aspect of the present invention is a semiconductor device manufacturing apparatus for cutting a semiconductor device assembly having a semiconductor package formed into individual semiconductor devices, and vacuuming the semiconductor devices. Supporting means provided with an air intake hole connected to the mechanism for adsorbing the mounted semiconductor device assembly, cutting means for cutting along the boundary line of regions corresponding to the respective semiconductor devices in the semiconductor device assembly, and semiconductor A pressing unit that has a plurality of through holes that are provided corresponding to the cutting positions of the device assembly and through which the cutting edge of the cutting unit is inserted, and that presses the non-cutting positions of the semiconductor device assembly and the pressing load of the pressing unit are adjusted. And a load adjusting means for controlling the load.

A semiconductor device manufacturing apparatus according to a third aspect of the present invention is the semiconductor device manufacturing apparatus according to any one of the first to second aspects, wherein the supporting means is at least a surface vicinity region. Is composed of an elastic material.

A method of manufacturing a semiconductor device according to a fourth aspect of the present invention is a method of manufacturing a semiconductor device in which a semiconductor device assembly having a plurality of semiconductor packages is cut and divided into individual semiconductor devices. A step of placing the device assembly on a support means connected to a vacuuming mechanism, and a semiconductor device assembly being evacuated by the vacuuming mechanism to be attracted to the support means, and a plurality of penetrating holes provided in the pressing means. A step of aligning the hole with a cutting position along a boundary line of a region corresponding to each semiconductor device in the semiconductor device assembly, pressing the non-cutting part of the semiconductor device assembly by the pressing means, and a blade means of the cutting means. And a step of cutting the cut portion of the semiconductor device assembly by inserting it into the through hole.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below with reference to the drawings showing embodiments.

The semiconductor device 1 of the first embodiment manufactured by using the semiconductor device manufacturing apparatus and manufacturing method according to the present invention has a flat rectangular parallelepiped shape as shown in FIG. A semiconductor chip 9 corresponding to the circuit pattern 2 such as a copper foil formed on the surface of the base material 5 is mounted on the insulating base material 5 with an adhesive 9s or the like, and an electrode 9d of the semiconductor chip 9 is connected via a bonding wire 7 to a circuit. It is electrically connected to the pattern 2.

Further, the entire surface of the insulating base material 5 on which the semiconductor chip 9 is mounted is resin-sealed with the sealing resin 4, and the ball-shaped solder balls 3 fill the through holes 5t to electrically connect the circuit patterns 2 to each other. Are connected to each other and projectingly provided on the back surface side of the insulating base material 5 to be formed as external connection terminals.

In the method of manufacturing the semiconductor device 1 described above, first, the insulating base material 5 shown in FIG. 2 is manufactured by molding an insulating resin such as polyimide into a strip-shaped or strip-shaped thin plate.

Then, a copper foil, which is a good conductor, is attached to the surface of the insulating base material 5 by using an adhesive or the like, and punching is performed at a predetermined position of the insulating base material 5 to which the copper foil is attached by a press machine. , Etc., and a circuit pattern assembly in which a plurality of circuit patterns of each semiconductor device are assembled.
Separation slits 5s, ... Are punched at the boundary (described later).

Guide holes 5g, ... Used for positioning in the manufacturing process of the semiconductor device are bored at predetermined positions in the side regions of the insulating base material 5.

Next, the copper foil attached to the insulating base material 5 is etched to obtain a circuit pattern assembly (not shown) in which circuit patterns for each semiconductor device are formed adjacent to each other in a matrix.

Here, a plurality of circuit pattern assemblies are formed on the surface of the insulating base material 5 along the longitudinal direction.

Then, as shown in FIG. 1 (b), the semiconductor chip 9 is attached to the surface of the insulating substrate 5 corresponding to the circuit pattern 2 of each semiconductor device by an adhesive 9s such as silver paste or an adhesive tape. It is mounted on the circuit pattern formation surface of the insulating base material 5 via 9s, and the electrode 9d of the semiconductor chip 9 and the circuit pattern 2 are connected via the bonding wire 7 to be electrically connected.

The electrical connection between the semiconductor chip 9 and the circuit pattern 2 may be flip chip connection instead of wire bonding using the bonding wire 7.

Then, as shown in FIG.
A plurality of semiconductor chips 9 mounted in a matrix corresponding to the circuit pattern 2 of each semiconductor device and the corresponding circuit pattern 2 are collectively formed by a sealing resin 4 such as epoxy, or the semiconductor devices are collectively formed. Each semiconductor device is resin-sealed to form a plurality of semiconductor packages 4t, ...
The semiconductor device assembly 1S is manufactured.

Here, as shown in FIG. 2, in the semiconductor device assembly 1S, a unit semiconductor device assembly 1St in which a plurality of semiconductor packages 4t corresponding to each semiconductor device 1 are formed in a matrix is formed as separation slits 5s ,. It is divided and arranged by each.

Incidentally, FIG. 2A shows the semiconductor device assembly 1S.
In reality, the resin encapsulation in the unit semiconductor device aggregate 1St is collectively performed on the plurality of semiconductor devices 1, and the resin encapsulation surface is an integral surface. 1 is illustrated so that 1 can be seen.
(Similarly in FIG. 4A) Further, if necessary, on the back surface of the region corresponding to each semiconductor device in the semiconductor device assembly 1S, as shown in FIG. , And the through holes 5t, ... Are buried and electrically connected to the circuit pattern 2 to form external connection terminals.

The semiconductor device assembly 1S has a separation slit 5
is separated into unit semiconductor device assemblies 1St along s,
The cutting process is performed by using the manufacturing apparatus 10 shown in FIG. 3 to separate the individual semiconductor devices 1.

The manufacturing apparatus 10 is the semiconductor device assembly 1
A supporting table (supporting means) 10t on which S is mounted, a circular blade (cutting means) 10b which is a rotary blade rotatably supported by a supporting shaft 10s, and a blade for advancing and retracting the blade 10b toward the cut side. The advancing / retreating device 10c and a load adjusting device (load adjusting means) 10l for adjusting the pressing load during cutting.
And a pressing plate (pressing means) 10p.

When the unit semiconductor device assembly 1St is cut using the manufacturing apparatus 10 and divided into the respective semiconductor devices 1,
The unit semiconductor device assembly 1 is formed by the pressing plate 10p.
The cutting process is performed by pressing St.

The support table 10t is formed with a plurality of escape grooves 10t1, ... Of the blade 10b which is rotated during cutting, and the unit semiconductor device assembly 1S.
At the time of cutting t, suction holes 10t2, ... For adsorbing and fixing by suction by vacuuming are drilled, and the suction holes 10t are
2, is connected to a vacuuming mechanism (not shown).

Further, the support table 10t is made of rigid structural steel, tool steel, etc., and at least the unit semiconductor device assembly 1St at the time of cutting is more completely attracted by vacuuming. It is preferable to provide an elastic material such as rubber or a flexible synthetic resin in the area near the surface.

Here, when an elastic material is used for the support table 10t, the unit semiconductor device assembly 1St is pressed against the support table 10t when the unit semiconductor device assembly 1St is sucked by the vacuuming mechanism at the time of cutting. By applying pressure, the support table 10t is elastically deformed along the outer shape of the unit semiconductor device assembly 1St, and the support table 10t and the unit semiconductor device assembly 1St are brought into closer contact with each other.
Adsorption of the unit semiconductor device assembly 1St onto the support table 10t is effectively performed.

The unit semiconductor device assembly 1St is inserted into the guide holes 5g and 5g of the unit semiconductor device assembly 1St on the support table 10t.
Positioning with respect to
Pressing plate 10 is inserted through the 0p positioning hole (described later).
p is the support table 10t and the unit semiconductor device assembly 1
Positioning pin 10t2 for positioning with respect to St
(10t21, 10t21, 10t22, 10t22) (See Fig. 5)
There are several plants.

At least one of the support table 10t and the blade 10b is supported so as to be rotatable and adjustable in the horizontal direction.

The load adjusting device 10l is used in the unit semiconductor device assembly 1 during the cutting process of the unit semiconductor device assembly 1St.
St is pressed on the support table 10t through the pressing plate 10p with an appropriate load.

The load adjusting device 10l includes a compression spring,
The unit semiconductor device assembly 1St is configured by using a spring such as a leaf spring, a pneumatic cylinder, a hydraulic cylinder, or the like, and when the spring is configured, an appropriate displacement obtained in advance according to Hooke's law is applied to the spring.
Add an appropriate load to.

Alternatively, when the load adjusting device 10l is constituted by a pneumatic cylinder or a hydraulic cylinder, an appropriate load introduced by Pascal's law by setting an appropriate pneumatic pressure or hydraulic pressure is added to the unit semiconductor device assembly 1St. To do.

As shown in FIG. 4D, the pressing plate 10p has a unit semiconductor device assembly 1St (see FIG. 4) inside.
An accommodating recess 10p2 for accommodating (a) and (b) is formed (see FIG. 3).

As shown in FIGS. 4 (c) and 4 (a), the horizontal dimension lp1 and the vertical dimension lp2 of the storage recess 10p2 in the pressing plate 10p are larger than the horizontal dimension l1 and the vertical dimension l2 of the unit semiconductor device assembly 1St. Setting (lp1, lp2> l1, l2)
Further, as shown in FIGS. 4D and 4B, the depth dimension lp3 of the storage recess 10p2 is equal to the unit semiconductor device assembly 1
The thickness of St is set to l3 or less (lp3 <= l3).

The pressing plate 10p is shown in FIG. 4 (c).
, The plurality of through holes 10p1, ...
i, has a length lp4, and is perforated with a width lp5 having a dimension larger than the blade edge thickness of the blade, and the blade edge of the blade is inserted through the through hole 10p1 during the cutting process.
Unit semiconductor device assembly 1St that moves back and forth in the length direction of 0p1
Disconnect.

The pitch pi of the through holes 10p1 is as shown in FIG.
As shown in FIG. 5, a vertical boundary line (cutting point) s1, ... Or a horizontal boundary line between the semiconductor packages 4t corresponding to the individual semiconductor devices in the unit semiconductor device assembly 1St.
(Cut point) s2, ... Pitch pi between them is set to be equal.

The length lp4 of the through hole 10p1 is set longer than the length l4 of the cutting line for dividing the unit semiconductor device assembly 1St into each semiconductor device 1, and the blade 10b is used during the cutting process. The unit semiconductor device aggregate 1St is configured so that it can be reasonably cut into the respective semiconductor devices 1.

Further, as shown in FIG. 4C, the positioning plate 10p has four positioning holes 10p3 (10p31, 1p1).
0p31, 10p32, 10p32) and the positioning hole 10p3 is a positioning pin on the support table 10t when the unit semiconductor device assembly 1St is placed on the support table 10t of the manufacturing apparatus 10 in the cutting process. 10t
By inserting the pressing plate 10p into the supporting table 10t of the manufacturing apparatus 10 and the mounted unit semiconductor device assembly 1St, the pressing plate 10p is positioned.

Next, a cutting step of cutting the unit semiconductor device assembly 1St by using the manufacturing apparatus 10 having the above-described structure to divide the unit semiconductor device assembly 1St into each semiconductor device 1 will be described.

First, as shown in FIG. 5A, the manufacturing apparatus 1
The unit semiconductor device assembly 1St on the support table 10t at position 0 is positioned so that the side of the insulating base material 5 is located above and the surface on which the semiconductor packages 4t are formed is located below.
At t21 and 10t21, the guide holes 5g and 5g of the semiconductor device assembly 1St are inserted and positioned and placed.

Subsequently, as shown in FIG. 5B, the unit semiconductor device assembly 1St on the support table 10t is accommodated from above in the accommodating recess 10p2 of the pressing plate 10p and the positioning hole 10p3 of the pressing plate 10p.
Positioning pin 10 of support table 10t on 1, 10p31
Inserting t21, 10t21 and positioning holes 10p32, 10
Positioning pins 10t22, 1 of support table 10t on p32.
The pressing plate 10p is positioned and mounted on the unit semiconductor device assembly 1St through 0t22.

Here, the cutting line which is the vertical boundary line s1 between the semiconductor packages 4t corresponding to each semiconductor device in the unit semiconductor device aggregate 1St (see FIG. 4A) is shown in FIG. 5B. ), It is located along the through holes 10p1, ... Of the pressing plate 10p.

Subsequently, the vacuum evacuation mechanism is operated to suck the unit semiconductor device assembly 1St and the pressing plate 10p onto the support table 10t, and at the same time, as shown in FIG. By pressing the pressing plate 10p downward, the unit semiconductor device assembly 1
St is pressed against the support table 10t.

The supporting table 10 for the unit semiconductor device assembly 1St by the load adjusting device 10l of the manufacturing apparatus 10.
The pressing load on t is appropriately adjusted depending on the cutting location, the thickness of the semiconductor device to be cut, or the start or end of cutting.

Then, as shown in FIG.
Blade 10b is rotated to be inserted into the through hole 10p1 of the pressing plate 10p, and is advanced in the length direction of the through hole 10p1 as shown by an arrow a shown in FIG. The boundary lines s1, ... Between the semiconductor packages 4t are cut into straight lines to form notches c1, c2, ..., C9 as shown in FIG. 6 (a).

Subsequently, the operation of the vacuum evacuation mechanism is stopped, the load adjusting device 10l pressing the pressing plate 10p is loosened, and the load adjusting device 10l is moved from above the pressing plate 10p.

Next, the positioning holes 10p31, 10p31 of the pressing plate 10p are removed from the positioning pins 10t21, 10t21 of the support table 10t, and the positioning holes 10p32, 10p32 are removed from the positioning pins 10t22, 10t22 of the support table 10t and pressed. The plate 10p is removed from the unit semiconductor device assembly 1St.

Subsequently, the pressing plate 10p is rotated by 90 degrees, and as shown in FIG. 6 (b), the supporting table 10t is rotated.
The unit semiconductor device assembly 1St placed on the top is housed from above in the housing recess 10p2 of the holding plate 10p, and the positioning hole 10p31 of the holding plate 10p,
Locating pin 10t2 of support table 10t on 10p31
2, 10t22 inserted, and positioning holes 10p32, 10
Positioning pins 10t21, 1 of the support table 10t on p32.
0t21 is inserted, and the pressing plate 10p is positioned and placed on the unit semiconductor device assembly 1St.

Here, the cutting line which is the horizontal boundary line s2 between the semiconductor packages 4t corresponding to each semiconductor device in the unit semiconductor device aggregate 1St (see FIG. 4A) is shown in FIG. 6B. ), It is located along the through holes 10p1, ... Of the pressing plate 10p.

Then, the vacuum evacuation mechanism is operated to suck the unit semiconductor device assembly 1St and the pressing plate 10p onto the support table 10t, and at the same time, as shown in FIG. By pressing the pressing plate 10p downward, the unit semiconductor device assembly 1
Press St on the support table 10t.

Here, the load adjusting device 10 of the manufacturing apparatus 10
The pressing load applied to the support table 10t with respect to the unit semiconductor device assembly 1St by l is appropriately adjusted as described above. For example, the unit semiconductor device assembly 1St to be cut in the last region of the cutting line is cut off. At this time, since the unit semiconductor device assembly 1St easily moves in the horizontal direction, a relatively large pressing load is applied to the unit semiconductor device assembly 1St.

While pressing, the blade 10b of the manufacturing apparatus 10 is rotated and inserted into the through hole 10p1 of the pressing plate 10p as shown in FIG. 3, and as shown by the arrow b in FIG. 6 (b). By advancing in the longitudinal direction of the through hole 10p1 and cutting the boundary lines s2, ... Between the semiconductor packages 4t of the unit semiconductor device assembly 1St into straight lines,
As shown in FIG. 7, notches d1, d2, ..., D9 are formed to divide each semiconductor device 1.

Subsequently, the operation of the evacuation mechanism is stopped, the pressing of the unit semiconductor device assembly 1St by the load adjusting device 10l is stopped, and the pressing plate 10 is stopped.
p is removed and the plurality of divided semiconductor devices 1 are collected.

In the cutting step, the magnitude of the load applied from the load adjusting device 10l to the unit semiconductor device assembly 1St partially overlaps with the above, but the unit semiconductor device assembly 1St.
It is appropriately set appropriately according to the material of the insulating base material 5 in St, the material of the sealing resin 4 or the like, or the transition of the cutting process.

As described above, the unit semiconductor device assembly 1
When cutting St along the boundary line and finally cutting off,
Since the unit semiconductor device assembly 1St during the cutting is apt to move, the unit semiconductor device assembly 1St having a certain size or more is easily moved.
A pressing load against is required.

In this embodiment, the manufacturing apparatus 10
The positioning of the unit semiconductor device assembly 1St and the holding plate 10p with respect to the support table 10t in
A plurality of positioning pins 10t2 are implanted on the support table 10t, and the positioning pins 10t2 are inserted through the guide holes 5g and 5g of the unit semiconductor device assembly 1St to position and position the unit semiconductor device assembly 1St. Holding pin 10t2, positioning hole 10p3 for plate 10p
Although the pressing plate 10p is positioned by inserting the pressing plate 10p into the supporting table 1t of the manufacturing apparatus 10, the supporting table 10t of the manufacturing apparatus 10 is formed by forming a positioning hole in the supporting table 10t and locating the positioning pin in the pressing plate 10p.
After mounting the unit semiconductor device assembly 1St on 0t, the positioning holes of the support table 10t and the unit semiconductor device assembly 1S are placed.
Pressing plate 10p to guide hole 5g, 5g of t
The unitary semiconductor device assembly 1St and the pressing plate 10p may be positioned with respect to the support table 10t of the manufacturing apparatus 10 by inserting the positioning pins of the above.

As described above, various methods are appropriately applied to the method of positioning the support table 10t, the unit semiconductor device assembly 1St, and the pressing plate 10p of the manufacturing apparatus 10.

According to the above structure, in the step of cutting the unit semiconductor device assembly 1St by the manufacturing apparatus 10, the unit semiconductor device assembly 1S placed on the support table 10t.
The t is attracted by vacuuming, and further, the cut plate of the unit semiconductor device assembly 1St is pressed by the pressing plate 10p using the load adjusting device 101, and the blade 10 inserted through the through hole 10p1 of the pressing plate 10p.
It is cut by b.

Therefore, since the unit semiconductor device assembly 1St to be cut is securely fixed, the semiconductor device 1 can be accurately cut without being displaced when it is individually cut, and the dimensions can be improved. It has excellent accuracy and is separated.

Further, since the unit semiconductor device assembly 1St is pressed by the pressing plate 10p with a sufficient fixing force as described above, the displacement of the unit semiconductor device assembly 1St is prevented even with a large cutting force, and the cutting work is performed. It is possible to speed up the process and improve productivity.

Furthermore, if at least the surface vicinity region of the support table 10t is made of an elastic material such as rubber or a flexible synthetic resin, the unit semiconductor device assembly 1St is placed on the support table 10t by a vacuuming mechanism during a cutting operation. The support table 10t is deformed along the outer shape of the unit semiconductor device assembly 1St when the unit semiconductor device assembly 1St and the support table 10t are more closely attached to each other. The assembly 1St is evacuated more strongly, the unit semiconductor device assembly 1St is more reliably fixed during the cutting operation, and the cutting operation can be performed more smoothly and at higher speed.

Further, in the cutting operation, the load adjusting device 10 which holds the unit semiconductor device assembly 1St with an appropriate load.
Since l is provided, it is possible to adjust to an appropriate pressing load according to the material such as the insulating base material 5 and the sealing resin 4 in the unit semiconductor device assembly 1St, or the cut position of the unit semiconductor device assembly 1St, and to further smoothen In addition, accurate cutting work can be performed.

Next, the second embodiment will be described.

In the second embodiment, in the cutting step of dividing the semiconductor device assembly 1S into the respective semiconductor devices 1, the semiconductor device assembly 1S is not divided into the unit semiconductor device assembly 1St but is replaced with the pressing plate 10p. Then, the pressing plate (pressing means) 20p (see FIG. 8) and the pressing plate (pressing means) 30p (see FIG. 9) are used to perform a cutting operation, and each semiconductor device 1 is manufactured.

The plurality of positioning pins (not shown) on the support table 10t in the manufacturing apparatus 10 are different from those in the first embodiment in that the guide holes 5g of the semiconductor device assembly 1S,
It has been planted in response to ...

The configuration other than the above is the same as that of the first embodiment, and therefore the same reference numerals are given and the description thereof is omitted.

The pressing plate 20p is shown in FIG.
As shown in (b), the semiconductor device assembly 1S (see FIG.
An accommodating recess 20p2 for accommodating (a) and (b) is formed.

The pressing plate 20p is shown in FIG. 8 (a).
, The plurality of through holes 20p1, ...
i, and a length lp24, which has a width lp25 larger than the blade edge thickness of the blade, and the blade edge of the blade is inserted through the through hole 20p1 during the cutting process to advance or retreat in the length direction of the through hole 20p1. To do.

The pitch pi of the through holes 20p1 is as shown in FIG.
As shown in, the pitch pi between the cutting lines, which are vertical boundary lines s1 between the semiconductor packages 4t corresponding to the individual semiconductor devices, is set to be equal.

Further, the length lp24 of the through hole 20p1 is set longer than the length l4 of the cutting line for dividing the semiconductor device assembly 1S into each semiconductor device 1, and is determined by the blade 10b during the cutting process. Semiconductor device assembly 1S
The cutting operation to each semiconductor device 1 can be performed without difficulty.

Further, as shown in FIG. 8A, in order to position the support table 10t of the manufacturing apparatus 10 and the semiconductor device assembly 1S mounted on the support table 10t on the pressing plate 20p. Multiple positioning holes 20p
, ... are guide holes 5g of the semiconductor device assembly 1S, which are positioned with respect to the pressing plate 20p during the cutting process.
It is perforated to be in the same position as.

The positioning hole 20p3 is inserted into the positioning pin on the support table 10t when the semiconductor device assembly 1S is placed on the support table 10t of the manufacturing apparatus 10 in the cutting process, so that the pressing plate 20p is inserted. The manufacturing apparatus 10 is positioned with respect to the support table 10t and the semiconductor device assembly 1S.

The pressing plate 30p is shown in FIG.
As shown in (b), the semiconductor device assembly 1S (see FIG.
An accommodating recess 30p2 for accommodating (a) and (b) is formed.

The pressing plate 30p is shown in FIG. 9 (a).
, The plurality of through holes 30p1, ...
i, and has a length lp34, and is perforated with a width lp35 having a dimension larger than the blade edge thickness of the blade, and the blade edge of the blade is inserted through the through hole 30p1 during the cutting process. Move forward and backward.

The pitch pi of the through holes 30p1 is as shown in FIG.
As shown in, the pitch is set to be equal to the pitch pi between the cutting lines that are the horizontal boundary lines s2 between the semiconductor packages 4t corresponding to the individual semiconductor devices.

Further, the length lp34 of the through hole 30p1 is set longer than the length l04 of the cutting line for dividing the semiconductor device assembly 1S shown in FIG. 2A into the semiconductor devices 1. In the cutting process, the blade 10b is configured to cut the semiconductor device assembly 1S into each semiconductor device 1 without difficulty.

As shown in FIG. 9A, the holding plate 30p has a support table 10t of the manufacturing apparatus 10 and the semiconductor device assembly 1 mounted on the support table 10t.
A plurality of positioning holes 30p3 for positioning with S,
Are punched so as to be in the same positions as the guide holes 5g of the semiconductor device assembly 1S, which are positioned with the pressing plate 30p during the cutting process.

The positioning hole 30p3 is inserted into the positioning pin on the support table 10t when the semiconductor device assembly 1S is placed on the support table 10t of the manufacturing apparatus 10 in the cutting process, so that the pressing plate 30p is inserted. The manufacturing apparatus 10 is positioned with respect to the support table 10t and the semiconductor device assembly 1S.

Next, the pressing plate 20p having the above structure,
By the manufacturing apparatus 10 using the pressing plate 30p,
A cutting process of cutting the semiconductor device assembly 1S and dividing it into the semiconductor devices 1 will be described.

First, as shown in FIG. 3, the semiconductor device assembly 1S is mounted on the support table 10t in the manufacturing apparatus 10.
The guide holes 5g, ... Of the semiconductor device assembly 1S are attached to the positioning pins of the support table 10t so that the insulating base material 5 side is located above and the surface side on which the semiconductor packages 4t are formed are located below. Insert, position, and place.

Then, as shown by the arrow C in FIG.
Semiconductor device assembly 1 mounted on the support table 10t
Pressing S from above, storage recess 20p2 of plate 20p
The holding plate 10p is housed inside and the positioning pin of the support table 10t is inserted into the positioning hole 20p3 of the pressing plate 20p.
Position and place on S.

Here, as shown in FIG. 3, a vertical boundary line s1 between the semiconductor packages 4t corresponding to each semiconductor device in the semiconductor device assembly 1S, ... (See FIG. 4A). Is the through hole 20p of the pressing plate 20p.
Located along 1, ...

Then, the vacuuming mechanism is operated to suck the semiconductor device assembly 1S and the pressing plate 20p onto the support table 10t, and at the same time, the load adjusting device 10l of the manufacturing apparatus 10 applies an appropriate load to the pressing plate 20p.
Is pressed downward to press the semiconductor device assembly 1S onto the support table 10t with an appropriate load.

Here, the load adjusting device 10 of the manufacturing apparatus 10
Support table 1 for semiconductor device assembly 1S by l
The pressing load to 0t is appropriately adjusted as described above.

Then, the blade 10b of the manufacturing apparatus 10 is rotated to be inserted into the through hole 20p1 of the pressing plate 20p, and is advanced in the length direction of the through hole 20p1 to be between the semiconductor packages 4t of the semiconductor device assembly 1S. Border s
1, ... Is cut linearly to form a notch.

Subsequently, the operation of the evacuation mechanism is stopped, the load adjusting device 10l pressing the pressing plate 20p is loosened, and the load adjusting device 10l is moved from above the pressing plate 20p.

Next, the positioning holes 20p3, ... Of the pressing plate 20p are removed from the positioning pins of the support table 10t, and the pressing plate 20p is removed from the semiconductor device assembly 1S.

Then, as shown by the arrow D in FIG. 9C,
Semiconductor device assembly 1 mounted on the support table 10t
Pressing S from above, storage recess 30p2 of plate 30p
The positioning pins of the support table 10t are inserted into the positioning holes 30p3, ... Of the pressing plate 30p, and the pressing plate 30p is inserted into the semiconductor device assembly 1.
Position and place on S.

Here, as shown in FIG. 3, a horizontal boundary line s2 between the semiconductor packages 4t corresponding to each semiconductor device in the semiconductor device assembly 1S, ... (See FIG. 4A). Is a through hole 30p of the pressing plate 30p.
Located along 1, ...

Then, the vacuuming mechanism is operated to suck the semiconductor device assembly 1S onto the support table 10t, and at the same time, the load adjusting device 10l of the manufacturing apparatus 10 presses the pressing plate 30p downward with an appropriate load. , The semiconductor device assembly 1S is pressed against the support table 10t with an appropriate pressing load.

Here, the load adjusting device 10 of the manufacturing apparatus 10
Support table 1 for semiconductor device assembly 1S by l
The pressing load to 0t is appropriately adjusted as described above.

Then, as shown in FIG.
Blade 10b of the pressing plate 30p is inserted into the through hole 30p1 of the pressing plate 30p, and is advanced in the length direction of the through hole 30p1 to form the boundary line s2 between the semiconductor packages 4t of the semiconductor device assembly 1S. , 30p1, ...
Is cut along each of the straight lines to divide into the semiconductor devices 1.

Subsequently, the operation of the vacuuming mechanism is stopped, and the load adjusting device 10 for the semiconductor device assembly 1S is stopped.
Stop pressing by l and press plate 30p
And the plurality of divided semiconductor devices 1 are collected.

According to the above structure, the semiconductor device assembly 1S is formed.
Without dividing the semiconductor device assembly 1St into a unit semiconductor device assembly 1St using the manufacturing plate 10 using the pressing plate 20p and the pressing plate 30p.
Since the semiconductor devices 1 can be divided into the respective semiconductor devices 1 by cutting along the boundary between the vertical and horizontal directions between the respective semiconductor packages 4t of S, the productivity is extremely high.

Needless to say, the effects of the first embodiment are also exhibited in the second embodiment.

In the above-described embodiment, in the manufacturing apparatus 10, the pressing plates 10p, 20p, 30p are pressed by using the load adjusting device 101, and the pressing load is applied to the object to be cut such as the unit semiconductor device assembly 1St. However, at least a part of the pressing plates 10p, 20p, 30p is made of a magnetic material, and the pressing plate 10 is used in the cutting process.
It is also possible to apply a pressing load to the object to be cut by sucking p, 20p and 30p to the support table 10t while sandwiching the object to be cut with an electromagnet or the like.

In the first embodiment, after the semiconductor device assembly 1S is cut into each unit semiconductor device assembly 1St, the holding plate 10p corresponding to the unit semiconductor device assembly 1St is used to form each unit semiconductor device. The assembly 1St is cut and divided into each semiconductor device 1, and in the second embodiment, the semiconductor device assembly 1S is formed by using the pressing plate 20p and the pressing plate 30p corresponding to the semiconductor device assembly 1S. The semiconductor device 1 was cut and divided into semiconductor devices 1.
The size of St may be two or three, and the size may be appropriately selected in various ways.

Further, in the above-described embodiment, the through holes of the pressing plate are formed continuously in parallel along the boundary between the semiconductor packages 4t, but every other boundary is formed along the boundary. May be configured or every other two,
The through holes do not necessarily have to be formed continuously in parallel, the through holes may be formed orthogonally along the boundary line, and the through holes may be arranged along the boundary line between the semiconductor packages 4t. Needless to say, it can be configured arbitrarily.

Further, in the above-mentioned embodiment, the constitution in which the storage recess is formed as the pressing plate is exemplified, but the constitution may be such that it has a through hole corresponding to the cut portion of the cutting object and can press the non-cut portion of the cutting object. For example, the pressing plate may have another shape such as a flat plate.

[0105]

As described above in detail, the first aspect of the present invention is as follows.
A semiconductor device manufacturing apparatus relating to the above is provided with an intake hole connected to a vacuuming mechanism, and a boundary between a supporting means for adsorbing a mounted semiconductor device assembly and a region corresponding to each semiconductor device in the semiconductor device assembly. Cutting means for cutting along the line, and a plurality of through holes provided corresponding to the cutting position of the semiconductor device assembly and through which the cutting edge of the cutting means is inserted, and press the non-cutting part of the semiconductor device assembly. And a pressing means.

According to the above structure, when the semiconductor device assembly is cut, the non-cutting portion of the semiconductor device assembly is pressed by the pressing means in addition to the vacuum suction, so that the semiconductor device assembly is securely fixed and the semiconductor device assembly can be cut. Can be done accurately, shape,
It is possible to manufacture a semiconductor device having excellent size accuracy.

A semiconductor device manufacturing apparatus according to claim 2 of the present invention is provided with an intake hole connected to a vacuuming mechanism,
Corresponding to the supporting means for adsorbing the semiconductor device assembly to be mounted, the cutting means for cutting along the boundary line of the region corresponding to each semiconductor device in the semiconductor device assembly, and the cutting location of the semiconductor device assembly. A pressing means that is provided and has a plurality of through holes through which the cutting edges of the cutting means are inserted, and that presses a non-cutting portion of the semiconductor device assembly; and a load adjusting means that is capable of adjusting the pressing load of the pressing means. It is characterized by doing.

According to the above construction, when the semiconductor device assembly is cut, the non-cut portion of the semiconductor device assembly is pressed with an appropriate load by the pressing means using the load adjusting means, so that it is fixed with an appropriate pressing load. It is possible to perform the cutting operation of the semiconductor device assembly more accurately and at a high speed, and to manufacture the semiconductor device having excellent shape and size accuracy with high productivity.

A semiconductor device manufacturing apparatus according to claim 3 of the present invention is the semiconductor device manufacturing apparatus according to any one of claims 1 to 2, wherein the supporting means is at least a surface vicinity region. Is composed of an elastic material.

According to the above structure, at least the surface vicinity region of the supporting means is made of the elastic material, so that when the semiconductor device assembly is evacuated by the supporting means, the surface vicinity region of the supporting means is the semiconductor device assembly. By deforming along the outer shape of the semiconductor device, the adhesion to the semiconductor device assembly is improved, and the semiconductor device assembly can be effectively evacuated to the supporting means.

According to a fourth aspect of the present invention, there is provided a method of manufacturing a semiconductor device, including a step of placing the semiconductor device assembly on a support means connected to a vacuuming mechanism, and a vacuuming mechanism for vacuuming the semiconductor device assembly. While pulling and adsorbing to the supporting means, the plurality of through holes provided in the pressing means are aligned with the cutting points along the boundary line of the region corresponding to each semiconductor device in the semiconductor device assembly, and the semiconductor device assembly is pressed by the pressing means. The method is characterized by including a step of pressing a non-cut portion of the body and a step of inserting a blade tip of the cutting means into a through hole of the pressing means to cut the cut portion of the semiconductor device assembly.

According to the above construction, when the semiconductor device assembly is cut, the non-cutting portion of the semiconductor device assembly is pressed by the pressing means in addition to the vacuum suction, so that the semiconductor device assembly is easily fixed even when the cutting is completed. It is possible to perform the cutting work of the semiconductor device assembly accurately, and manufacture a semiconductor device having an accurate shape and size.

[Brief description of drawings]

1A and 1B are a perspective view showing a semiconductor device of an embodiment according to the present invention, and a partially cutaway sectional view taken along the line AA of FIG.

2A and 2B are a top view and a side view from a longitudinal direction of a semiconductor device assembly according to an embodiment of the present invention.

FIG. 3 is a cross-sectional view of essential parts showing a step of cutting each semiconductor device using the manufacturing apparatus according to the embodiment of the present invention.

4 (a), (b), (c), and (d) are top views of the unit semiconductor device assembly of the first embodiment, side views of the unit semiconductor device assembly shown in FIG. 4 (a), The top view of the pressing plate of 1st Example, and CC sectional view taken on the line of (c) figure.

5 (a) and 5 (b) are top views showing a state in which a unit semiconductor device assembly is positioned and placed on a support table of the manufacturing apparatus according to the first embodiment of the present invention, and FIG. ) A top view showing a state in which a pressing plate is positioned and placed above the unit semiconductor device assembly shown in the drawing.

6 (a) and 6 (b) are the first cuts made in the unit semiconductor device assembly that is positioned and placed on the support table of the manufacturing apparatus according to the first embodiment of the present invention. FIG. 6 is a top view showing a state after that, and a top view showing a state where a pressing plate is positioned and placed above the unit semiconductor device assembly shown in FIG.

FIG. 7 is a top view showing the unit semiconductor device assembly when the cutting step is completed in the first example of the present invention.

8A, 8B and 8C are a top view of a pressing plate according to a second embodiment of the present invention, a sectional view taken along line AA of FIG. 8A, and FIG. FIG. 6 is a side view showing a process of mounting the pressing plate from above the semiconductor device assembly on the support table.

9 (a), (b) and (c) are a top view of a pressing plate according to a second embodiment of the present invention, a sectional view taken along the line AA of FIG. 9 (a), and FIG. 9 (a). FIG. 6 is a side view showing a process of mounting the pressing plate from above the semiconductor device assembly on the support table.

[Explanation of symbols]

1 ... Semiconductor device, 10 ... Manufacturing device, 1S ... Semiconductor device assembly, 1St ... Unit semiconductor device assembly (semiconductor device assembly), 4t ... semiconductor package, 10b ... blade (cutting means), 10l ... load adjusting device (load adjusting means), 10p, 20p, 30p ... pressing plate (pressing means), 10p1, 20p1, 30p1 ... through hole, 10t ... Support table (support means), 10t2 ... intake hole, s1, s2 ... Boundary line (cutting point).

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Katsumi Amano             2-10-1 Komine, Hachimannishi-ku, Kitakyushu City, Fukuoka Prefecture             Issue Mitsui High-Tech Co., Ltd. (72) Inventor Tadao Hirose             2-10-1 Komine, Hachimannishi-ku, Kitakyushu City, Fukuoka Prefecture             Issue Mitsui High-Tech Co., Ltd. F-term (reference) 5F061 AA01 BA04 CA21 CB13

Claims (4)

[Claims] 1. A semiconductor device manufacturing apparatus for cutting a semiconductor device assembly in which a semiconductor package is formed into individual semiconductor devices, wherein an intake hole connected to a vacuuming mechanism is provided and mounted. Corresponding to the supporting means for adsorbing the semiconductor device assembly, the cutting means for cutting along the boundary line of the region corresponding to each semiconductor device in the semiconductor device assembly, and the cutting location of the semiconductor device assembly. An apparatus for manufacturing a semiconductor device, comprising: a pressing unit that is provided and that has a plurality of through holes through which the cutting edges of the cutting unit are inserted, and that presses a non-cutting portion of the semiconductor device assembly. 2. A semiconductor device manufacturing apparatus for cutting a semiconductor device assembly having a semiconductor package formed therein and dividing the semiconductor device assembly into individual semiconductor devices, wherein an intake hole connected to a vacuuming mechanism is provided and mounted. Corresponding to the supporting means for adsorbing the semiconductor device assembly, the cutting means for cutting along the boundary line of the region corresponding to each semiconductor device in the semiconductor device assembly, and the cutting location of the semiconductor device assembly. Having a plurality of through holes through which the cutting edge of the cutting means is inserted and provided, pressing means for pressing a non-cutting portion of the semiconductor device assembly, and load adjusting means capable of adjusting the pressing load of the pressing means, An apparatus for manufacturing a semiconductor device, comprising: 3. The semiconductor device manufacturing apparatus according to claim 1, wherein at least the surface vicinity region of the supporting means is made of an elastic material. 4. A method of manufacturing a semiconductor device in which a semiconductor device assembly having a semiconductor package formed therein is cut into individual semiconductor devices, and the semiconductor device assembly is connected to a vacuuming mechanism. Placing the semiconductor device assembly on the semiconductor device assembly, and vacuuming the semiconductor device assembly by the vacuuming mechanism to attract the semiconductor device assembly to the supporting means, and forming a plurality of through holes provided in the pressing means on each semiconductor in the semiconductor device assembly. A step of pressing the non-cutting part of the semiconductor device assembly by the pressing means according to the cutting position along the boundary line of the area corresponding to the device, and inserting the cutting edge of the cutting means into the through hole of the pressing means. And a step of cutting the cut portion of the semiconductor device assembly.