JP2003217441A - Sheet dielectric material and method of manufacturing plasma display panel using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To stably and precisely form a dielectric layer of a plasma display panel with a solid structure in an efficiently workable manner. <P>SOLUTION: A sheet dielectric material 21 is prepared which comprises a photosensitive dielectric forming material layer 23 containing a glass powder, a binding resin and a photosensitive resin, formed on a supporting film 22, and a dielectric forming material layer 24 containing a glass powder and a binding resin, formed on the photosensitive dielectric forming material layer. The dielectric constant of the glass powder of the photosensitive dielectric forming material layer 23 is lower than that of the glass powder of the dielectric forming material layer 24. The sheet dielectric material 21 is used to form the dielectric layer of the plasma display panel. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a sheet-shaped dielectric material and a method for manufacturing a plasma display panel using the same.

[0002]

2. Description of the Related Art In recent years, expectations for large screens and wall-mounted televisions as interactive information terminals are increasing. As display devices therefor, there are many liquid crystal display panels, field emission displays, electroluminescence displays, and the like, some of which are commercially available and some of which are under development. Among these display devices, plasma display panel (hereinafter referred to as PDP)
Is a self-luminous type that can display beautiful images, and it is easy to increase the screen size.
It has attracted attention as a thin display device with excellent visibility, and high definition and large screen are being promoted.

This PDP is roughly classified into A drive type.
There are C type and DC type, and there are two types of discharge type, a surface discharge type and a counter discharge type, but at present, due to high definition, large screen and ease of manufacturing, AC type and surface discharge type PDPs are currently available. Are becoming mainstream.

FIG. 3 shows an example of the panel structure of the PDP. As shown in FIG. 3, the PDP is composed of a front panel 1 and a rear panel 2.

The front panel 1 is formed by arranging a plurality of pairs of stripe-shaped display electrodes 4 on a transparent front substrate 3 such as a glass substrate made of sodium borosilicate glass by the float method. A dielectric layer 5 is formed so as to cover the display electrode group 4, and a protective film 6 made of MgO is formed on the dielectric layer 5. The display electrode 4 includes the transparent electrode 4a and the transparent electrode 4a.
The bus electrode 4b is made of Cr / Cu / Cr or Ag or the like and is electrically connected to a. Although not shown, a plurality of black stripes as a light shielding film are formed between the display electrodes 4 in parallel with the display electrodes 4.

The rear panel 2 has an address electrode 8 made of Cr / Cu / Cr or Ag or the like in a direction orthogonal to the display electrodes 4 on a rear substrate 7 arranged to face the front substrate 3. And a dielectric layer 9 is formed so as to cover the address electrodes 8, and a plurality of stripe-shaped partition walls 10 are formed in parallel with the address electrodes 8 on the dielectric layer 9 between the address electrodes 8. The phosphor layer 11 is formed on the side surfaces between the partition walls 10 and on the surface of the dielectric layer 9. For the color display, the phosphor layer 11 is usually arranged in order of three colors of red, green and blue.

The front panel 1 and the rear panel 2 are arranged so that the display electrodes 4 and the address electrodes 8 are orthogonal to each other with the substrates 3 and 7 facing each other with a minute discharge space interposed therebetween. A panel is constructed by sealing with a sealing member, and then filling a discharge gas, which is a mixture of neon and xenon, in the discharge space at a pressure of about 66500 Pa (500 Torr).

The discharge space of this panel is divided into a plurality of sections by partition walls 10, and the display electrodes 4 are provided so that a plurality of discharge cells to be light emitting pixel regions are formed between the partition walls 10. The display electrodes 4 and the address electrodes 8 are arranged orthogonal to each other. Then, in this PDP, discharge is generated by a periodic voltage applied to the display electrode 4 and the address electrode 8, and ultraviolet rays generated by this discharge are applied to the phosphor layer to be converted into visible light, thereby displaying an image. Done.

In such a PDP, the address electrode 8 and the bus electrode 4b of the display electrode 4 are made of Ag or C.
r-Cu-Cr or the like is used. Among them, as a method of manufacturing an electrode using Ag, as in the screen printing method, Ag,
There are a method of using an Ag paste containing a resin, a solvent and the like, and a method of using a film containing Ag, a resin and the like such as a laminating method. In any case, heating at 500 ° C. or higher for the purpose of removing the resin or for the purpose of fusing Ag with each other to increase the conductivity,
It is necessary to perform a firing process.

Further, the dielectric layer covering these electrodes is an essential material for generating plasma, and has a function of higher discharge efficiency and well passing the light emitted from the phosphor of the back plate. It is an important component needed.

The dielectric layer is conventionally formed by a method such as screen printing or die coating of a glass paste composition containing powder such as low melting point lead glass and a binder resin (organic substance forming the film forming material layer). Coating, 500 ℃
It was formed by heating and firing as described above.

The thickness of the film forming material layer formed on the glass substrate is 1.3 of the film thickness of the dielectric layer to be formed in consideration of the reduction in the film thickness due to the removal of the organic substance in the firing process. ~
It is necessary to double the thickness, and for example, in order to set the thickness of the dielectric layer to 5 to 40 μm, it is necessary to form a film forming material layer having a thickness of about 7 to 80 μm.

However, when the glass paste composition is applied by the screen printing method, 1
The thickness of the coating film formed by the single coating process is 5 to 25
It is about μm. When the screen printing method is used, multiple printing is required for a plurality of times, resulting in a decrease in work efficiency due to the complexity of steps, a decrease in film thickness distribution, a decrease in smoothness, an increase in the probability of occurrence of defects, etc. I can't avoid it. Further, even in the case of the die coat coating method, the film thickness distribution at the start and end portions of the coat is poor, which causes variations in the dielectric properties and causes a reduction in the drive voltage margin.

To solve these problems, for example, Japanese Patent Laid-Open No.
As disclosed in Japanese Patent No. 2991834, a sheet-shaped dielectric material having a glass paste composition formed on a supporting film is applied by a method such as a laminating method, and then heated and baked at 500 ° C. or higher. A method of forming a dielectric layer by doing so has been proposed.

This sheet-shaped dielectric material will be described with reference to FIG. 4. FIG. 4 (a) is a schematic configuration diagram showing the sheet-shaped dielectric material 12 wound in a roll shape, and FIG. )
FIG. 4 is a cross-sectional view showing the layer structure of the sheet-shaped dielectric material 12 in the X portion of FIG. The sheet-shaped dielectric material 12 shown in FIG. 4 includes a support film 13 and the support film 13
And a cover film 15 formed on the surface of the film forming material layer 14 so as to be easily peeled off.

By using the sheet-shaped dielectric material 12 in which the film forming material is prepared in advance, it is possible to efficiently form a dielectric layer having a large film thickness, for example, a dielectric layer having a thickness of 5 to 40 μm. Therefore, the process in the process of forming the dielectric layer can be improved, and the manufacturing efficiency of the PDP can be improved. Moreover, it is possible to form a dielectric layer which is excellent in film thickness uniformity and surface smoothness and has no defects such as pinholes and cracks.

On the other hand, in response to the demand for higher definition and higher brightness of the PDP, as disclosed in, for example, Japanese Patent Application Laid-Open No. 8-250029, the discharge is controlled and the discharge in the shielded portion is suppressed as much as possible. In order to achieve this, a dielectric layer having a new structure in which the dielectric layer is three-dimensionally configured has been proposed.

In order to produce a three-dimensionally structured dielectric layer,
It is necessary to pattern the sheet dielectric material,
The technique is disclosed in, for example, Japanese Patent Application Laid-Open No. 11-231525. The contents are shown in FIGS.
Is shown in.

As shown in FIGS. 5A to 5C, a sheet-shaped dielectric material 12 having a film forming material layer 14 formed of an inorganic powder-dispersed paste on a support film 13 is transferred onto a glass substrate 16. Then, a resist layer 17 is formed thereon as shown in FIG. 5D, and then, as shown in FIGS. 5E and 5F, an exposure mask 18 is put together to form the resist layer 17.
Is exposed to light and developed to form a resist layer 17 having a predetermined pattern, and the resist layer 17 having the predetermined pattern is used as a mask, as shown in FIGS.
As shown in FIG.
Is etched into a predetermined pattern shape, the resist layer 17 is removed, and then the inorganic pattern 19 is produced by baking at a predetermined temperature as shown in FIG.

[0020]

However, using the conventional sheet-shaped dielectric material and patterning process,
The method of producing the three-dimensional structure of the dielectric layer of the PDP has the following problems.

That is, in the three-dimensional structure of the dielectric layer of the PDP, when the concave portion 20 is provided in the dielectric layer 5 of the front panel 1 for each light emitting pixel area unit, as shown in FIGS. 6A and 6B, for example, It is required that the thick portion 5a and the thin portion 5b be formed in the dielectric layer 5 in a predetermined pattern without variation. Note that FIG. 6B is a diagram showing a cross section taken along the line AA of FIG.

In the conventional patterning method described above, for example, it is necessary to stop the etching in the middle of FIG. 5 (g) and leave the thin portion 5b in the dielectric layer 5, but if the etching is stopped in the middle of this, the PDP As described above, in the case of a large-area panel, the etching variation of the entire panel directly becomes the dimension variation of the shape and the depth, and the three-dimensional structure of the dielectric layer cannot be obtained accurately over the entire panel.

Therefore, after the first dielectric layer is fired and formed by the sheet-shaped dielectric material corresponding to the thickness in the thin portion, the sheet-shaped dielectric material adjusted to the thickness in the thick portion is used. It is possible to obtain a three-dimensional structure by forming the second dielectric layer by the conventional patterning method described above. In this case, it is necessary to accurately transfer the sheet-shaped dielectric material to the substrate twice. Becomes complicated.
From the viewpoint of the discharge start voltage in the PDP,
Even in the lower first dielectric layer, the film thickness has a distribution,
The discharge voltage can be further reduced by using the portion with the smallest film thickness as the seed discharge, but after forming the lower layer as described above by firing, a dielectric is applied on top of it and patterned. The method could not deform the shape of the lower layer.

The present invention has been made in view of the above problems, and an object of the present invention is to enable a dielectric layer having a three-dimensional structure to be stably and accurately formed with high work efficiency. .

[0025]

In order to achieve this object, the present invention provides a photosensitive dielectric forming material layer containing glass powder, a binder resin and a photosensitive resin, and a photosensitive dielectric forming material layer on the photosensitive dielectric forming material layer. And a dielectric forming material layer containing glass powder and a binder resin, wherein the dielectric constant of the glass powder of the photosensitive dielectric forming material layer is less than that of the glass powder of the dielectric forming material layer. Sheet dielectric material is also used, and the dielectric forming material layer and the photosensitive dielectric forming material layer are transferred to the substrate by stacking them on the substrate so that the dielectric forming material layer is on the substrate side. By exposing and developing the dielectric forming material layer using a mask having a predetermined pattern, a dielectric layer having a predetermined pattern is formed.

With such a structure, when a three-dimensional structure of the dielectric layer is manufactured, one kind of sheet-shaped dielectric material is used, and the dielectric layer having a thick portion and a thin portion can be uniformly worked. It is possible to manufacture well, and it is possible to suppress dimensional variations in shape and depth within a large-area panel.

[0027]

BEST MODE FOR CARRYING OUT THE INVENTION That is, the invention according to claim 1 of the present invention is a photosensitive dielectric forming material layer formed on a supporting film and containing glass powder, a binder resin and a photosensitive resin. A dielectric forming material layer formed on the photosensitive dielectric forming material layer and containing glass powder and a binder resin, wherein the dielectric constant of the glass powder of the photosensitive dielectric forming material layer is the dielectric forming material. It is a sheet-shaped dielectric material characterized by being lower than the dielectric constant of the glass powder of the layer.

Further, the invention according to claim 2 is characterized in that the photosensitive dielectric forming material layer and the dielectric forming material layer contain a solvent. Further, claim 3
In the invention described in, the decomposition temperature or combustion temperature or volatilization temperature of the binder resin contained in the photosensitive dielectric forming material layer is equal to or lower than the decomposition temperature or combustion temperature or volatilization temperature of the binder resin of the dielectric forming material layer. In the invention according to claim 4, the decomposition temperature or combustion temperature or volatilization temperature of the solvent contained in the photosensitive dielectric material layer is
It is characterized in that the temperature is not higher than the decomposition temperature or combustion temperature or volatilization temperature of the solvent of the dielectric material layer.

Further, in the invention according to claim 5 of the present invention, a photosensitive dielectric forming material layer containing glass powder, a binder resin and a photosensitive resin is formed, and the photosensitive dielectric forming material layer is formed on the photosensitive dielectric forming material layer. And a dielectric-forming material layer containing glass powder and a binder resin, wherein the dielectric constant of the glass powder of the photosensitive dielectric-forming material layer is lower than the dielectric constant of the glass powder of the dielectric-forming material layer A dielectric material is prepared, the sheet-shaped dielectric material is superposed on a substrate so that the dielectric forming material layer is on the substrate side, and the dielectric forming material layer and the photosensitive dielectric forming material layer are transferred to the substrate. A transfer step, a pattern forming step in which the transferred photosensitive dielectric forming material layer is exposed using a mask having a predetermined pattern and developed, and then the photosensitive dielectric forming material layer and the dielectric forming material layer are baked. A method of manufacturing a plasma display panel; and a firing step of forming the dielectric layer by.

In the invention according to claim 6, the photosensitive dielectric forming material layer is exposed and developed in the pattern forming step, whereby at least one concave portion is formed in the dielectric layer for each light emitting pixel region of the plasma display panel. Is formed, and the film thickness of the dielectric layer on the bottom surface of the recess is reduced.

Further, in the invention according to claim 7, in the method for manufacturing a plasma display panel, the photosensitive dielectric material forming material layer and the dielectric material forming material layer contain a solvent. In the invention of item 8, the decomposition temperature or the combustion temperature or the volatilization temperature of the binder resin contained in the photosensitive dielectric forming material layer is the decomposition temperature or the combustion temperature or the volatilization temperature of the binder resin of the dielectric forming material layer. In the invention according to claim 9, the decomposition temperature or the combustion temperature or the volatilization temperature of the solvent contained in the photosensitive dielectric forming material layer is equal to or lower than the temperature. It is characterized in that the temperature is lower than the combustion temperature or the volatilization temperature.

An embodiment of the present invention will be described below with reference to the drawings of FIGS. 1 and 2.

First, a sheet-shaped dielectric material according to an embodiment of the present invention will be described with reference to FIG.
1A is a schematic configuration diagram showing a sheet-shaped dielectric material 21 wound in a roll shape, and FIG. 1B is a cross-sectional view showing a layer configuration of the sheet-shaped dielectric material 21 in the X portion of FIG. 1A. Is. As shown in FIG. 1, the sheet-shaped dielectric material 21 is formed on a support film 22, a photosensitive dielectric material forming material layer 23 formed on the support film 22, and a photosensitive dielectric material forming material layer 23. The dielectric forming material layer 24 and the cover film 25 arranged on the dielectric forming material layer 24 are laminated.

Here, the dielectric forming material layer 24 and the photosensitive dielectric forming material layer 23 contain glass powder and a binder resin as essential components, and the photosensitive dielectric forming material layer 23 contains a photosensitive resin. It is contained.

The support film 22 constituting the sheet-shaped dielectric material is preferably a resin film having heat resistance, solvent resistance and flexibility. Since the support film 22 has flexibility, a film forming material layer having a uniform film thickness can be formed by a roll coater or the like, and the film forming material layer can be stored in a rolled state. You can Examples of the resin forming the support film 22 include polyethylene terephthalate, polyester, polyethylene, polypropylene,
Examples thereof include polystyrene, polyimide, polyvinyl alcohol, polyvinyl chloride, fluorine-containing resins such as polyfluoroethylene, nylon, and cellulose.

Photosensitive dielectric constituting the sheet-shaped dielectric material
The body forming material layer 23 and the dielectric forming material layer 24 are baked.
It becomes a glass sintered body (dielectric layer)
Therefore, the glass powder contained in the dielectric forming material layer 24.
As the powder, for example, ZnO-B₂O₃-SiO₂Mixture of systems
Thing, PbO-B₂O₃-SiO₂System mixture, PbO-B ₂
O₃-SiO₂-Al₂O₃System mixture, PbO-ZnO-
B₂O₃-SiO₂Can include a mixture of systems, etc.
It

[0037] Here, as the dielectric constant of glass used, the ZnO-B ₂ O ₃ -SiO ₂ based glass is lowest, followed by PbO-B ₂ O ₃ -SiO ₂ system, Bi ₂ O ₃ -B ₂
O ₃ -SiO ₂ system to continue. The present invention is characterized by effectively using dielectrics having different dielectric constants,
Details will be described later.

The photosensitive resin contained in the photosensitive dielectric material layer 23 contains at least an alkali developing type binder resin, a reactive monomer and a photopolymerization initiator, and as an additive, a sensitizer, A polymerization terminator, a chain transfer agent, a leveling agent, a dispersant, a plasticizer, a stabilizer, an antifoaming agent and the like can be contained as necessary.

Representative examples of the binder resin of the present invention include acrylic resins and cellulose resins. In this case, as the resin used for the photosensitive dielectric forming material layer and the dielectric forming material layer, for example, butyl (meth) acrylate, ethylhexyl (meth) acrylate, lauryl (meth) acrylate, isodecyl (meth) acrylate and 2
-Ethoxyethyl (meth) acrylate can be mentioned, but it is not limited thereto.

As the binder resin contained in the dielectric forming material layer 24, the binder resin of the photosensitive dielectric forming material layer 23 is decomposed or burnt or the binder resin of the dielectric forming material layer 24 is decomposed or burned. It is characterized by being lower than the volatilization temperature. Most preferably, it is desirable to use an acrylic resin for the photosensitive dielectric material and a cellulose resin for the dielectric material layer.

As a result, two layers having different functions can be formed at the same time, and the number of steps can be greatly reduced. Further, when two layers are produced by using two kinds of separate sheets, two support films are required for each, but according to the present invention, the support film which becomes a huge amount as waste is halved. Therefore, the load on the environment can be reduced.

In the production of a PDP, the sheet-shaped dielectric material is transferred onto a glass substrate, and the layers formed above the glass substrate when the dielectric forming material layer 24 is dried or fired. The binder resin can be volatilized, burned or decomposed, and the binder resin in the lower layer is gasified after the binder resin in the upper layer is completely removed, so that the binder resin can easily pass through the upper layer. Therefore, the two layers can be fired at the same time, and the number of steps can be reduced. In addition, the reduction in the number of firings can reduce energy consumption and the load on the environment. These will be described in detail in the PDP manufacturing method described later.

Furthermore, the dielectric forming material layer 24 and the photosensitive dielectric forming material layer 23 contain glass powder and a binder resin as essential components, and the photosensitive dielectric forming material layer 23 contains a photosensitive resin. And a solvent may be contained in both of the two layers.

In this case, as the solvent used for the photosensitive dielectric forming material layer 23 and the dielectric forming material layer 24, the dielectric forming material layer 24 and the photosensitive dielectric forming material layer 23 have an appropriate viscosity (for example, 500). To 10,000 cp) and can be easily removed by evaporation by drying. For example, methyl isobutyl ketone, propylene glycol monomethyl ether, turpentine oil, ethyl cellosolve, methyl cellosolve, terpineol, butyl. Carbitol acetate,
Examples thereof include butyl carbitol, benzyl alcohol, methyl lactate, ethyl lactate, butyl cellosolve acetate, ethyl-3-ethoxypropionate, and butyl cellosolve.

The solvent is characterized in that the dielectric forming material layer 24 and the photosensitive dielectric forming material layer 23 have different decomposition or combustion or volatilization temperatures. Preferably, the solvent of the photosensitive dielectric material layer 23 formed on the support film 22 has a lower decomposition, combustion or volatilization temperature than the solvent of the dielectric material layer 24.

Here, for example, as the combination of the above-mentioned solvents, one having a lower decomposition, combustion or volatilization temperature than the dielectric formation material layer 24 is selected as the photosensitive dielectric formation material layer 23. Preferably, the photosensitive dielectric forming material layer 23 has turpentine (boiling point of 155 to 165 ° C.), and the dielectric forming material layer 24 has terpineol (boiling point of about 18).
0 ° C) is selected. As a result, the same effects as those described for the binder resin can be exhibited.

Sheet-like dielectric material 21 used here
As a manufacturing method of the above, the photosensitive dielectric forming material layer 23 is formed on the support film 22, the dielectric forming material layer 24 is further formed thereon, and the cover film 25 is formed thereon.
Can be manufactured by crimping.
The dielectric forming material layer 24 is formed by a glass paste composition containing at least glass powder and a binder resin, and preferably containing a solvent.
After applying 4, the coating film may be dried to remove a part or all of the solvent. Examples of the method for applying the dielectric forming material layer 24 made of the glass paste composition include a coating method using a roller coater, a blade coater such as a doctor blade, and a curtain coater.

Next, in the method of manufacturing the PDP according to the present invention, the manufacturing process of the front panel will be described with reference to FIG.

In the first step shown in FIG. 2A, a transparent electrode material film 32 made of ITO, SnO ₂ or the like is uniformly formed on a glass substrate 31 as a front side substrate of a front panel by a sputtering method. This is the step of forming a film. At this time, the film thickness of the transparent electrode material film 32 is about 100 nm.

The second step shown in FIG. 2B is a step of forming the transparent electrode 33 by patterning the transparent electrode material film 32 into a desired shape by using the photolithography method. A positive resist containing a novolac resin as a main component is applied to a film thickness of 1.5 to 2 μm, and ultraviolet rays are exposed through an exposure dry plate having a desired pattern to cure the resist.
The ultraviolet light source at this time is an ultra-high pressure mercury lamp, and the light amount is 300 mJ / cm ² . Next, development is performed with an alkaline aqueous solution to form a resist pattern. After that, the substrate is immersed in a solution containing hydrochloric acid as a main component for etching to remove unnecessary portions, and finally the resist is peeled off to form the transparent electrode 33.

The third step shown in FIG. 2C is the step of applying the black electrode material film 34. Black electrode material film 34
Is a black pigment made of RuO ₂ or the like, a glass frit (P
bO-B ₂ O ₃ -SiO ₂ system or _{Bi 2 O 3 -B 2 O 3} -SiO 2
System, etc.), a polymerization initiator, a photocurable monomer, and a negative photosensitive paste containing an organic solvent as components are uniformly applied to the glass substrate 31 by a screen printing method. After that, the solvent contained in the paste is removed from the coating film by a drying process at 90 ° C. for 10 minutes using an infrared drying furnace.

The fourth step shown in FIG. 2D is a step of forming the metal electrode material film 35 on the black electrode material film 34. In this step, the material used is a conductive material such as Ag,
Glass frit _{(PbO-B 2 O 3 -SiO} 2 system or Bi ₂ O
_3- B ₂ O ₃ —SiO ₂ system, etc.), a polymerization initiator, a photocurable monomer, and a negative photosensitive paste containing an organic solvent as components, and the same as the third step.

The fifth step shown in FIG. 2E is a step of forming the bus electrode 36. The electrode material film including the metal electrode material film 35 and the black electrode material film 34 is irradiated with ultraviolet rays through an exposure dry plate having a desired pattern to cure the exposed portion. The ultraviolet light source at this time is an ultra-high pressure mercury lamp, and the light amount is 300 mJ / cm ² . Then, it is developed with an alkaline developer (0.3 wt% sodium carbonate aqueous solution) to form a pattern, and then baked in air at a temperature equal to or higher than the softening point of the glass material to fix the electrode to the substrate.

In this way, the bus electrode 36 is formed on the transparent electrode 33.
By forming, the display electrode of the front panel can be formed.

In the sixth step shown in FIG. 2F, the dielectric forming material layer 37 is formed by using the above-mentioned sheet-shaped dielectric material 21.
And a photosensitive dielectric forming material layer 38, which is a step of forming a dielectric material layer composed of two layers. Here, the dielectric constant of the glass powder contained in the photosensitive dielectric material layer 38 is
It is different from the dielectric constant of the glass powder contained in the dielectric forming material layer 37. Preferably, the dielectric constant of the glass powder contained in the photosensitive dielectric forming material layer 38 is lower than that of the glass powder contained in the dielectric forming material layer 37.

After the cover film 25 of the sheet-shaped dielectric material 21 is peeled off from the dielectric material layer, the sheet-shaped dielectric material 2 is placed so that the surface of the dielectric material layer contacts the glass substrate 31.
While superimposing 1 on each other, the support film 22 is pressure-bonded to the glass substrate 31 by a heating roller. afterwards,
The support film 22 is peeled off from the dielectric material layer fixed on the glass substrate 31. At this time, as the means used for pressure bonding, a simple roller that does not heat may be used other than the heating roller.

The seventh step shown in FIG. 2G is a step of exposing the photosensitive dielectric forming material layer 38 to light. The exposed portion is cured by irradiating the photosensitive dielectric material forming material layer 38 of the dielectric material layer with ultraviolet rays through an exposure mask 39 having an opening of a desired pattern. The ultraviolet light source at this time is an ultra-high pressure mercury lamp, and the light amount is 600 mJ / cm ² .

The eighth step shown in FIG. 2H is a step of forming a recess in the light emitting pixel region to form a dielectric layer having a three-dimensional structure having a thick portion and a thin portion. The photosensitive dielectric forming material layer 38 of the dielectric material layer is developed using an alkaline developing solution (0.3 wt% sodium carbonate aqueous solution), and the non-exposed portion of the photosensitive dielectric forming material layer 38 is removed.

At this time, the binder resin constituting the dielectric forming material layer 37 is not soluble in the developing solution and therefore is not removed, or the etching rate is the etching rate of the photosensitive dielectric forming material layer 38. Therefore, only a small area near the interface with the first layer dielectric forming material layer 37 is removed. Therefore, a dielectric material layer having a desired three-dimensional structure is formed. At this time, the film thickness of the dielectric material layer in the unexposed area and the exposed area is 30 μm and 2 respectively.
It is preferably 0 μm.

Then, the dielectric layer having a three-dimensional structure is formed by baking in air at a temperature equal to or higher than the softening point of the glass material to fix the glass component.

Here, the present invention is characterized in that the solvent of the photosensitive dielectric material layer 38 has a lower decomposition, combustion or volatilization temperature than the solvent of the dielectric material layer 37 as described above. Therefore, at the time of firing, the solvent of the photosensitive dielectric forming material layer 38 on the upper layer side is first decomposed or burned or volatilized based on the glass substrate 31.
After that, the solvent of the lower dielectric forming material layer 37 is decomposed, burned or volatilized with a delay, so that the solvent can easily slip through the upper layer and simultaneous firing of two layers becomes possible.

Similarly, the binder resin of the photosensitive dielectric forming material layer 38 is characterized in that it has a lower decomposition, combustion, or volatilization temperature than the binder resin of the dielectric forming material layer 37. Of the photosensitive dielectric forming material layer 3
The binder resin of No. 8 is decomposed or burned or volatilized first, and then the binder resin of the lower layer dielectric forming material layer 37 is decomposed, burned or volatilized with a delay, so that the binder resin can easily slip through the upper layer and two layers. Simultaneous firing of is possible. Therefore,
Conventionally, two layers were fired separately, but two layers can be fired at the same time, and the cost can be reduced by reducing the number of steps. Further, since the power consumption can be reduced by reducing the number of firings, the process becomes environmentally friendly.

Further, as an important function of the present invention, by firing the two layers at the same time, the lower layer which becomes the bottom of the recesses which is spontaneously removed by patterning is pulled by the stress when the upper layer dielectric contracts. Thus, the thickness of the bottom surface of the lower layer can be gently changed, and the dielectric layer can be curved so as to have a small thickness, so that the lower layer can be effectively processed.

The ninth step shown in FIG. 2 (i) is the protection film 4
0 film forming process. The protective film 40 is made of MgO and is uniformly formed on the dielectric layer by the electron beam evaporation method. The film thickness of the protective film 40 at this time is about 600 nm.

Through the above steps, a PDP having a dielectric with a desired three-dimensional structure in which the dielectric constant of the upper layer is larger than that of the lower layer
The front panel of is obtained.

Next, in the method of manufacturing the PDP according to the present invention, the method of manufacturing the rear panel will be described. First, the glass substrate as the rear substrate of the rear panel manufactured by the float method is processed in the same manner as the front panel. An address electrode is formed. A dielectric layer is formed thereon in the same manner as the front panel, and partition walls are formed thereon.

As a material used for forming the dielectric layer and the partition wall, a paste-like glass powder-containing composition (glass paste composition) containing glass powder, a binder resin and a solvent was prepared, and the glass paste was prepared. After coating the composition on a supporting film, the coating film is dried to form a film-forming material layer. The film-forming material layer formed on the supporting film is used as a surface of a glass substrate on which an address electrode is formed. Then, a dielectric layer can be formed on the surface of the glass substrate by fixing the film forming material layer by transfer in the same manner as in the above front panel and baking the film forming material layer fixed by this transfer.

After that, as a method of forming the partition wall, a photolithography method or a sandblast method can be used.

Next, phosphors corresponding to R, G and B are applied and baked to form phosphor layers between the partition walls, whereby a back panel can be obtained.

Then, the front panel and the rear panel thus produced are aligned and opposed to each other so that the display electrodes and the address electrodes intersect each other at a substantially right angle, and the peripheral portions thereof are sealed with a sealing material. Sealing and pasting, then exhausting the gas in the space partitioned by the partition wall,
Then, a discharge gas such as Ne or Xe is sealed to seal the gas space, so that the PDP having the structure shown in FIG. 3 can be completed.

By the way, in the PDP according to the present invention manufactured as described above, the dielectric layer has at least one lower dielectric layer formed on a front substrate such as a glass substrate and at least one light emitting pixel region for each light emitting pixel region. It is characterized in that it has a two-layer structure composed of an upper-layer dielectric which is patterned into a predetermined shape so that one recess is formed. That is, the display electrodes of each row formed on the front substrate are arranged so as to be adjacent to each other with a discharge gap in each line of the matrix display, and the region surrounded by the barrier ribs and the pair of display electrodes is a light emitting pixel. Each of the light emitting pixel regions has a shape in which at least one recess is formed in the dielectric layer.

In order to achieve high efficiency of the PDP, it is essential to control discharge in each light emitting pixel area. In particular, in FIG. 3, when the discharge spreads perpendicularly to the display electrode 4, the bus electrode 4b blocks the emitted light from the fluorescent substance, so it is necessary to suppress the spread of the discharge to the shielded portion. Further, since the partition wall 10 does not exist in this direction, all the ultraviolet rays and the light emission from the fluorescent material leaking from the partition wall 10 are shielded by the black stripe. Further, the spread of the discharge in the direction parallel to the display electrode 4 is
A decrease in electron temperature near 0 causes a decrease in efficiency.

According to the manufacturing method of the present invention, as shown in FIG. 6A, the bus electrode 4 is formed on the dielectric layer 5 of the front substrate 3.
For example, by forming a recess 20 having a depth of 20 μm so as to be located inside b and the partition wall 10, the bottom surface of the recess 20 having a reduced film thickness has a large capacitance due to a decrease in the dielectric film thickness. The wall charges formed in the portion are larger than those in the other portions, and the discharge start voltage is reduced due to the reduction in the film thickness, so that the discharge is mainly generated on the bottom surface of the recess 20.

With such a structure, it is possible to suppress the discharge that spreads horizontally and vertically to the display electrode 4 and improve the efficiency. The shape of the recess 20 may be a polygon, a cylinder, a cone, a rectangular parallelepiped, a trapezoid, or the like, but is not limited thereto.

As shown in FIG. 6B, the side surface of the recess 20 may have a gentle film thickness change. In this case, the spread of VUV generated by the discharge on the bottom surface can be effectively utilized. Further, by curving the bottom surface of the recess 20 so that the dielectric film thickness becomes smaller, the discharge voltage at the location where the film thickness is most reduced is reduced, so that an effect as a pilot fire can be obtained.

As another method of improving efficiency, there is a method of increasing the efficiency of extracting light emitted from the phosphor, that is, increasing the aperture ratio. In this case, it is necessary to separate the bus electrode 4b from the light emitting pixel region as much as possible. However, since the distance between the bus electrode 4b and the display electrode 4 of the adjacent cell running in parallel is narrowed, the movement of charges is facilitated and light emission is not desired. There is a problem that so-called crosstalk occurs, in which cells emit light, and display quality is significantly deteriorated.

In the manufacturing method of the present invention, the position where the wall charges are generated can be controlled by adjusting the shape of the recess 20, and the occurrence of crosstalk can be prevented.

Further, as another method for improving the efficiency of the PDP, there are many reports of increasing the partial pressure of Xe. In this case, however, the discharge starting voltage also increases with the increase of the partial pressure of Xe. Have a relationship. Therefore, X
It is necessary to decrease the discharge start voltage that rises with the e partial pressure by other methods. One possible method is to reduce the thickness of the dielectric layer. However, thinning the dielectric layer raises the problem that the probability of dielectric breakdown due to defects in the dielectric layer due to foreign substances increases and the yield decreases. . In particular, the bus electrode formed for the purpose of lowering the resistance has a large thickness of 4 to 7 μm. Therefore, if the dielectric layer is made thin, the effective film thickness on the bus electrode is reduced, and dielectric breakdown is concentrated near the bus electrode. There is.

According to the manufacturing method of the present invention, since it is possible to easily form a thick dielectric layer on the bus electrode where dielectric breakdown is most likely to occur, dielectric breakdown near the bus electrode can be prevented. In addition, the thin part of the dielectric layer is about 0.1
Since only the μm transparent electrode is present, the effective film thickness hardly changes, and by using the structure in which the concave portion of the dielectric layer is formed and the increase in the partial pressure of Xe, the PDP can be used.
It is possible to achieve both high yield and high efficiency.

From the viewpoint of improving the transmittance of the dielectric layer and limiting the discharge current, the bottom surface of the recess formed in the dielectric layer is
It is preferable that the film thickness has a shape that gently changes, but when a two-layer sheet-shaped dielectric material is used by the manufacturing method of the present invention, the lower layer is pulled to the upper layer due to the stress when the upper layer dielectric contracts. As a result, the film thickness of the bottom surface of the lower layer can be gently changed, whereby a dielectric layer having a recess having a shape in which the film thickness of the bottom surface is gently changed can be easily manufactured.

Moreover, in the present invention, the dielectric constant of the upper dielectric layer is lower than that of the lower dielectric layer, and the dielectric is formed in a two-layer structure, and By lowering the dielectric constant of the dielectric layer formed on the discharge space side with respect to the bottom surface, it is possible to reduce the capacity other than the concave portion, and it is possible to suppress the charges formed on the concave portion other than the bottom surface. As a result, the occurrence of crosstalk can be further prevented, and the drive margin of the PDP can be expanded.

[0082]

As described above, according to the present invention, in a PDP, a dielectric layer having a three-dimensional structure effective for lowering the discharge start voltage and expanding the drive margin can be stably and accurately manufactured with high working efficiency. The effect that it can be easily formed in the state is obtained.

[Brief description of drawings]

1A and 1B are a schematic configuration diagram and a cross-sectional view showing a sheet-shaped dielectric material according to an embodiment of the present invention.

2A to 2I are process sectional views showing a method of manufacturing a plasma display panel according to an embodiment of the present invention.

FIG. 3 is a perspective view showing a plasma display panel.

4A and 4B are a schematic configuration diagram and a cross-sectional view showing a conventional sheet-shaped dielectric material.

5A to 5I are process cross-sectional views showing a conventional method for manufacturing a plasma display panel.

6 (a) and 6 (b) are a perspective view and a cross-sectional view showing a main structure of a plasma display panel.

[Explanation of symbols]

1 Front panel 2 Rear panel 3, 7 substrate 4 display electrodes 5, 9 Dielectric layer 8 address electrodes 21 Sheet-shaped dielectric material 22 Support film 23, 38 Photosensitive dielectric forming material layer 24, 37 Dielectric forming material layer 25 cover film 31 glass substrate 33 Transparent electrode 36 bus electrodes

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Hiroyasu Tsuji             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Masanori Suzuki             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor ▲ Ashi ▼ Hideki Ta             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Nobuyuki Kirihara             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. F-term (reference) 5C027 AA05 AA10                 5C040 FA01 FA04 GB03 GD02 GD07                       GD10 JA09 JA15 JA21 KA08                       KA16 KA17 KB04 KB19 MA17                       MA24 MA26

Claims (9)

[Claims] 1. A photosensitive dielectric forming material layer formed on a supporting film and containing glass powder, a binder resin and a photosensitive resin, and a glass powder formed on the photosensitive dielectric forming material layer. A dielectric forming material layer containing a binder resin, wherein the dielectric constant of the glass powder of the photosensitive dielectric forming material layer is lower than the dielectric constant of the glass powder of the dielectric forming material layer. Dielectric material. 2. The sheet-shaped dielectric material according to claim 1, wherein the photosensitive dielectric forming material layer and the dielectric forming material layer contain a solvent. 3. The decomposition temperature or combustion temperature or volatilization temperature of the binder resin contained in the photosensitive dielectric forming material layer is equal to or lower than the decomposition temperature or combustion temperature or volatilization temperature of the binder resin of the dielectric forming material layer. The sheet-shaped dielectric material according to claim 1, wherein the sheet-shaped dielectric material is present. 4. The decomposition temperature or combustion temperature or volatilization temperature of the solvent contained in the photosensitive dielectric forming material layer is equal to or lower than the decomposition temperature or combustion temperature or volatilization temperature of the solvent of the dielectric forming material layer. The sheet-shaped dielectric material according to claim 2. 5. A photosensitive dielectric forming material layer containing glass powder, a binder resin and a photosensitive resin, and a dielectric formed on the photosensitive dielectric forming material layer and containing glass powder and a binder resin. A sheet-shaped dielectric material having a forming material layer and having a dielectric constant of glass powder of the photosensitive dielectric forming material layer lower than that of the glass powder of the dielectric forming material layer is prepared. A transfer step of stacking the material on the substrate so that the dielectric forming material layer is on the substrate side, and transferring the dielectric forming material layer and the photosensitive dielectric forming material layer to the substrate, and the transferred photosensitive dielectric forming material It has a patterning step of exposing and developing the layer using a mask having a predetermined pattern, and then a firing step of firing the photosensitive dielectric forming material layer and the dielectric forming material layer to form a dielectric layer. A method of manufacturing a plasma display panel, comprising: 6. The photosensitive dielectric forming material layer is exposed and developed in a pattern forming step to form at least one concave portion in the dielectric layer for each light emitting pixel region of the plasma display panel, and to form a bottom surface of the concave portion. The method for manufacturing a plasma display panel according to claim 5, wherein the thickness of the dielectric layer is reduced. 7. The method of manufacturing a plasma display panel according to claim 5, wherein the photosensitive dielectric forming material layer and the dielectric forming material layer contain a solvent. 8. The decomposition temperature or combustion temperature or volatilization temperature of the binder resin contained in the photosensitive dielectric material layer is below the decomposition temperature or combustion temperature or volatilization temperature of the binder resin of the dielectric material layer. The method for manufacturing a plasma display panel according to claim 5, wherein the plasma display panel is manufactured. 9. The decomposition temperature or combustion temperature or volatilization temperature of the solvent contained in the photosensitive dielectric forming material layer is equal to or lower than the decomposition temperature or combustion temperature or volatilization temperature of the solvent of the dielectric forming material layer. The method for manufacturing a plasma display panel according to claim 7.