JP2003209339A - Method of manufacturing conductive-pattern forming body - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a conductive pattern which forms a highly fine pattern in a simple process and has no waste liquid disposal problems. <P>SOLUTION: The method of forming the conductive pattern comprises the steps of: preparing a substrate for a pattern forming body which has a layer containing a photocatalyst and a binder on a base material, wherein the wettability of an energy-radiated region of the layer containing the photocatalyst varies in a direction to decrease the liquid contact angle; forming a wetting pattern comprising a lyophobic and a lyophilic regions on the layer containing the photocatalyst by radiating energy to a pattern shape on the layer containing the photocatalyst; adhering a metallic colloidal solution only to the lyophilic region by coating the metallic colloidal solution on the layer surface with the wetting pattern formed thereon; and forming the conductive pattern by solidifying the metallic colloidal solution attached to the lyophilic region. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a conductive pattern forming body which can be used for various high definition electric circuits such as printed circuit boards.

[0002]

2. Description of the Related Art Conventionally, a highly precise conductive pattern forming body,
For example, when manufacturing a printed circuit board, in general, a copper clad laminate formed by plating the entire surface of the substrate with copper,
It is formed by laminating a photoresist such as a dry film, pattern exposure using a photomask or the like, and development.

However, in the method using such a photolithography method, metal plating on the substrate,
It is necessary to go through various steps such as formation of a photoresist layer, exposure, and development, the manufacturing method is complicated, and there may be a problem in terms of cost. Further, a large amount of waste liquid generated at the time of development is harmful, and there is also an environmental problem such that treatment is required to discharge the waste liquid to the outside.

There is also a method of manufacturing a printed circuit board by a method using screen printing, but there is a problem in terms of accuracy and it cannot be applied to the manufacture of a highly precise conductive pattern.

[0005]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and it is possible to form a high-definition pattern and to form it in a simple process. The main object of the present invention is to provide a method for manufacturing a conductive pattern that does not have a problem such as processing.

[0006]

In order to achieve the above object, the present invention according to claim 1 provides a base material, a photocatalyst and a binder formed on the base material, the wettability of an energy irradiation portion. By a pattern forming body substrate preparation step of preparing a pattern forming body substrate consisting of a photocatalyst containing layer that changes in the direction of decreasing the contact angle of the liquid, by irradiating the photocatalyst containing layer with energy in a pattern ,
A wettability pattern forming step of forming a wettability pattern composed of a liquid repellent region and a lyophilic region on the photocatalyst containing layer, and a metal colloid solution is applied to the photocatalyst containing layer surface on which the wettability pattern is formed. By applying the metal colloid solution coating step of attaching the metal colloid solution only to the lyophilic area, and the conductive pattern to solidify the metal colloid solution attached to the lyophilic area of the wettability pattern to form a conductive pattern The present invention provides a method for manufacturing a conductive pattern forming body, which comprises a forming step.

According to the present invention, the metal colloid solution can be easily formed in a pattern on the photocatalyst-containing layer by performing a treatment for depositing the metal colloid solution on the entire surface by using, for example, a dip coating method. Therefore, by solidifying this, a highly precise conductive pattern can be obtained. Therefore, since a highly precise conductive pattern can be formed with high precision by a simple process, a highly precise conductive pattern can be formed at low cost.

In the invention described in claim 1, as described in claim 2, the photocatalyst containing layer is decomposed by the action of the photocatalyst by energy irradiation, thereby changing the wettability on the photocatalyst containing layer. It may contain a decomposable substance that can be caused. In the present invention, the change in the wettability of the photocatalyst containing layer due to the action of the photocatalyst may be due to the material of the binder, but the decomposing substance decomposed by the action of the photocatalyst is used as the photocatalyst containing layer. The surface wettability may be changed in a pattern by containing the same in the above.

In the invention described in claim 1 or claim 2, as described in claim 3, when the photocatalyst containing layer contains fluorine and the photocatalyst containing layer is irradiated with energy, It is preferable that the photocatalyst-containing layer is formed such that the fluorine content on the surface of the photocatalyst-containing layer is reduced by the action of the photocatalyst as compared with that before the energy irradiation. If the photocatalyst-containing layer contains fluorine and the amount of fluorine on the surface of the photocatalyst-containing layer is reduced by irradiation with energy, the wettability of the surface of the photocatalyst-containing layer can be largely converted by irradiation with energy. Therefore, even when the metal colloid solution is applied to the entire surface, it is possible to adhere the metal colloid solution only to the lyophilic region.

In the invention described in claim 3, as described in claim 4, the irradiation of energy on the photocatalyst containing layer is performed, and the fluorine content at the site where the fluorine content is reduced is It is preferably 10 or less when the fluorine content in the portion not irradiated with energy is 100. If the amount of fluorine in the photocatalyst containing layer is reduced to this extent, the difference in wettability between the lyophobic region and the lyophilic region can be made sufficient. This is because even if the metal colloid solution is applied to the entire surface of the pattern, the metal colloid solution can be attached only on the lyophilic region.

In the invention described in any one of claims 1 to 4, as described in claim 5, the contact angle to the metal colloid solution on the photocatalyst containing layer is the energy Is preferably 50 ° or more in the non-irradiated portion and 40 ° or less in the irradiated portion. When the wettability between the lyophobic region, which is the portion not irradiated with energy on the photocatalyst-containing layer, and the lyophilic region, which is the irradiated portion, is not within the range as described above, a metal colloid solution This is because it may not be possible to adhere the metal colloid solution only to the lyophilic region when is applied to the entire surface.

In the invention described in any one of claims 1 to 5, the binder is a layer containing an organopolysiloxane as described in claim 6. preferable. In the present invention,
The properties required for the photocatalyst-containing layer are such that it is liquid repellent when not irradiated with energy and becomes lyophilic by the action of the photocatalyst in the photocatalyst containing layer that contacts when energy is irradiated. Is. This is because it is preferable to use organopolysiloxane as a material that imparts such characteristics to the photocatalyst-containing layer.

In the invention described in claim 6, as described in claim 7, it is preferable that the organopolysiloxane is a polysiloxane containing a fluoroalkyl group. This is because if the fluoroalkyl group is contained, it is possible to increase the difference in wettability between the energy-irradiated portion and the unirradiated portion.

In the invention described in claim 6 or 7, as described in claim 8, the organopolysiloxane is Y _n SiX _(4-n) (where Y is an alkyl group). , Fluoroalkyl group, vinyl group,
An amino group, a phenyl group or an epoxy group is shown, and X is an alkoxyl group or a halogen. n is an integer from 0 to 3. It is preferable that the organopolysiloxane is a hydrolysis-condensation product or a co-hydrolysis-condensation product of one or more silicon compounds represented by the formula (1). This is because by using such an organopolysiloxane, it is possible to exhibit the characteristics with respect to the change in wettability as described above.

The present invention also provides a substrate, a photocatalyst treatment layer formed on the substrate and containing at least a photocatalyst, and an energy formed on the photocatalyst treatment layer. A pattern forming body substrate preparing step for preparing a pattern forming body substrate comprising a wettability changing layer which is a layer in which the wettability of an irradiated portion changes in a direction in which the contact angle of a liquid decreases, and the wettability changing layer A wettability pattern forming step of forming a wettability pattern composed of a liquid repellent region and a lyophilic region on the wettability change layer by irradiating energy in a pattern form, and the wettability pattern was formed. A metal colloid solution applying step of applying the metal colloid solution only to the lyophilic region by applying the metal colloid solution to the surface of the wettability changing layer, and the lyophilic region having the above-mentioned wettability pattern. It provides a method for producing a conductive pattern formed body characterized by having a conductive pattern formation step of deposited metal colloid solution to solidify the a conductive pattern.

According to the present invention, since the wettability changing layer is provided, the metal colloid solution can be attached only to the lyophilic region, and a highly precise conductive pattern can be formed. . In addition, since the conductive pattern is formed on the wettability changing layer, the photocatalyst processing layer and the conductive pattern do not directly contact with each other, and the conductive pattern is less likely to be affected by the photocatalyst over time. Therefore, it becomes possible to manufacture a high-quality conductive pattern forming body.

In the invention described in claim 9, as described in claim 10, the contact angle with respect to the metal colloid solution on the wettability changing layer is 50 ° or more in a portion not irradiated with energy. It is preferable that the irradiated portion has an angle of 40 ° or less. When the wettability between the liquid-repellent area, which is the area not irradiated with energy, and the lyophilic area, which is the irradiated area, on the wettability changing layer is not within the range as described above, a metal colloid This is because when the solution is applied to the entire surface, there is a possibility that the metal colloid solution cannot be attached only to the lyophilic region.

In the invention described in claim 9 or 10, as described in claim 11, it is preferable that the wettability changing layer is a layer containing an organopolysiloxane. In the present invention, the properties required of the wettability changing layer are such that it is liquid repellent when not irradiated with energy and becomes lyophilic when irradiated with energy. This is because it is preferable to use organopolysiloxane as a material that imparts such characteristics to the wettability changing layer.

In the invention described in claim 11, as described in claim 12, it is preferable that the organopolysiloxane is a polysiloxane containing a fluoroalkyl group. This is because if the fluoroalkyl group is contained, it is possible to increase the difference in wettability between the energy-irradiated portion and the unirradiated portion.

In the invention described in claim 11 or claim 12, as described in claim 13, the organopolysiloxane is Y _n SiX.
_(4-n) (wherein Y represents an alkyl group, fluoroalkyl group, vinyl group, amino group, phenyl group or epoxy group, and X represents an alkoxyl group or halogen.
n is an integer from 0 to 3. It is preferable that the organopolysiloxane is a hydrolysis-condensation product or a co-hydrolysis-condensation product of one or more silicon compounds represented by the formula (1). This is because by using such an organopolysiloxane, it is possible to exhibit the characteristics with respect to the change in wettability as described above.

The present invention also provides a substrate, a photocatalyst treatment layer formed on the substrate and containing at least a photocatalyst, and an energy formed on the photocatalyst treatment layer. A pattern forming body substrate preparing step of preparing a pattern forming body substrate consisting of a decomposition and removal layer which is a layer which is decomposed and removed by the action of a photocatalyst accompanying irradiation;
A decomposition removal pattern forming step of forming a decomposition removal pattern on the decomposition removal layer by irradiating the decomposition removal layer with energy in a pattern, and a metal colloid on the decomposition removal layer surface on which the decomposition removal pattern is formed. Having a metal colloid solution applying step of applying a metal colloid solution in a pattern by applying a solution, and a conductive pattern forming step of solidifying the metal colloid solution adhered in the above pattern into a conductive pattern The present invention provides a method for producing a formed body.

According to the present invention, by having the above-mentioned decomposition / removal layer, the decomposition / removal layer in the energy-irradiated portion is decomposed and removed by the action of the photocatalyst associated with the energy irradiation, and it becomes possible to form irregularities on the surface. Of. By utilizing the irregularities, it is possible to easily apply the metal colloid solution by, for example, an inkjet method, and it is possible to manufacture a highly precise conductive pattern forming body.

In the invention described in claim 14,
As described in claim 15, it is preferable that a contact angle of the liquid with respect to the decomposition and removal layer and a contact angle of the liquid with respect to the photocatalyst treatment layer exposed by decomposition of the decomposition and removal layer are different. Thereby, it becomes possible to make the portion on the decomposition and removal layer where the decomposition and removal layer, which is not irradiated with energy, remain as a lyophobic region, and the part where the substrate is exposed by irradiation with energy as a lyophilic region. This is because not only the unevenness described above but also the difference in wettability can be utilized, and it becomes possible to manufacture a higher-definition conductive pattern forming body.

Further, in the invention described in claim 14 or claim 15, as described in claim 16,
The decomposition and removal layer is preferably either a self-assembled monolayer film, a Langmuir-Blodgett film, or an alternate adsorption film. This is because when the decomposition and removal layer is the above film, it is possible to form a defect-free film having a relatively high strength.

In the invention according to any one of claims 14 to 16, as described in claim 17, the contact angle to the metal colloid solution on the decomposition and removal layer is It is preferably 50 ° or more in the non-irradiated portion and 40 ° or less in the irradiated portion. When the contact angle with respect to the metal colloid solution is not within the above range, for example, when the metal colloid solution is applied to the entire surface, it may not be possible to attach the metal colloid solution only to the lyophilic region. Because there is.

In the invention according to any one of claims 1 to 17, as described in claim 18, a conductive pattern portion is formed after the conductive pattern forming step. You may have the non-image area removal process which removes the non-conductive pattern part which does not exist. When the photocatalyst-containing layer, the wettability changing layer, or the decomposition / removal layer is formed of a conductive material, it is difficult to form a conductive pattern-formed body even if it has a conductive pattern. Therefore, by removing the non-conductive pattern portion in which the conductive pattern portion is not formed, it is possible to expose the insulating base material and form the conductive pattern formed body.

In the invention described in claim 18,
As described in claim 19, it is preferable that the non-image area removing step is a step of removing the non-conductive pattern area with an alkaline solution. This is because it is possible to easily remove the non-conductive pattern portion, which is preferable in terms of manufacturing efficiency and cost.

Any of the above claims 1 to 19
In the invention described in those claims, claim 20
As described above, the photocatalyst has a titanium oxide (TiO 2_Two),
Zinc oxide (ZnO), tin oxide (SnO)_Two), Titanic acid
Strontium (SrTiO _Three), Tungsten oxide
(WO_Three), Bismuth oxide (Bi_TwoO_Three), And oxidation
Iron (Fe_TwoO_Three) One or more selected from
Preferably, it is a substance, among which
As described above, the photocatalyst has a titanium oxide (TiO 2_Two) Is
It is preferable. This is a titanium dioxide band gap
Since it has a high energy, it is effective as a photocatalyst, and
It is chemically stable, non-toxic and easily available.
It

In the invention described in claim 21, as described in claim 22, when the fluorine content on the surface of the photocatalyst containing layer is analyzed and quantified by X-ray photoelectron spectroscopy, Ti When the element is 100, it is preferable to have a photocatalyst-containing layer in which the fluorine element is contained on the surface of the photocatalyst-containing layer in a ratio of 500 or more.

When the content of the elemental fluorine is large, the liquid repellency of the liquid repellent region is also high, and the removal of the metal colloid solution on the liquid repellent region when the metal colloid solution is applied over the entire surface is smooth. This is because it is possible to apply the metal colloid solution only to the lyophilic region.

In the invention described in any one of claims 1 to 22, it is preferable that the energy irradiation is performed while heating the photocatalyst, as described in claim 23. By heating the photocatalyst during the energy irradiation, the effect of the photocatalyst can be further enhanced, and the conductive pattern forming body can be efficiently formed.

In the invention described in any one of claims 1 to 23, as described in claim 24, the metal colloid solution is a silver colloid aqueous solution or a gold colloid aqueous solution. It is preferable.

In the invention described in any one of claims 1 to 24, as described in claim 25, the application of the metal colloid solution in the step of applying the metal colloid solution is performed. It may be a dip coating method or a spin coating method.

According to the invention described in any one of claims 1 to 24,
As described in 6, the application of the metal colloid solution in the step of applying the metal colloid solution may be a nozzle ejection method, and among them, the nozzle ejection method is an inkjet method. It is preferable.

Further, the present invention provides a layer in which the wettability of the base material and the energy-irradiated portion formed on the base material changes in the direction in which the contact angle of the liquid decreases as described in claim 28. And a photocatalyst-containing layer containing at least a photocatalyst and a binder, and a metal composition formed by solidifying a metal colloid solution in a pattern on the photocatalyst-containing layer to form a conductive pattern. Provide the body. According to the present invention, by having the photocatalyst containing layer, it becomes possible to easily apply the metal colloid solution only to the lyophilic region, and it becomes possible to obtain a highly fine conductive pattern forming body. Of.

According to a twenty-ninth aspect of the present invention, the wettability of the substrate and the energy-irradiated portion formed in a pattern on the substrate changes in the direction in which the contact angle of the liquid decreases. And a photocatalyst-containing layer containing at least a photocatalyst and a binder, and a metal composition formed by solidifying a metal colloid solution on the photocatalyst-containing layer to form a conductive pattern. Provide the body. According to the present invention, by having the photocatalyst-containing layer, it becomes possible to easily form a conductive pattern by utilizing the difference in wettability, and it is possible to obtain a low-cost conductive pattern forming body. Because it will be. Further, since the photocatalyst-containing layer is formed in a pattern and the insulating base material is exposed in a portion other than the conductive pattern, even if the photocatalyst-containing layer is conductive, the conductive It becomes possible to use it as a pattern forming body.

In the invention described in claim 28 or claim 29, as described in claim 30, the photocatalyst-containing layer is decomposed by the action of the photocatalyst by energy irradiation, whereby the photocatalyst-containing layer on the photocatalyst-containing layer is decomposed. It may contain a decomposing substance capable of changing the wettability. In the present invention, the change in the wettability of the photocatalyst containing layer due to the action of the photocatalyst may be due to the material of the binder, but the decomposing substance decomposed by the action of the photocatalyst is used as the photocatalyst containing layer. The surface wettability may be changed into a pattern by containing the same in the above.

In the invention described in any one of claims 28 to 30, the contact angle to the metal colloid solution on the photocatalyst containing layer is irradiated with energy as described in claim 31. It is preferably 50 ° or more in the unexposed portion and 40 ° or less in the irradiated portion. When the wettability between the lyophobic region, which is the portion not irradiated with energy, and the lyophilic region, which is the irradiated portion, on the photocatalyst-containing layer is not within the range as described above, a metal colloid This is because when the solution is applied to the entire surface, there is a possibility that the metal colloid solution cannot be attached only to the lyophilic region.

Further, according to a thirty-second aspect of the present invention, a substrate, a photocatalyst treatment layer containing at least a photocatalyst on the substrate, and a wettability of an energy irradiation portion on the photocatalyst treatment layer. Has a wettability changing layer that changes in a direction in which the contact angle of the liquid decreases, and a metal composition formed by solidifying a metal colloid solution in a pattern on the wettability changing layer. A conductive pattern forming body is provided. According to the present invention, by having the wettability changing layer, it becomes possible to easily attach the metal colloid solution in a pattern with high precision by utilizing the difference in wettability. Further, since the photocatalyst treatment layer and the conductive pattern do not come into direct contact with each other, the conductive pattern is less likely to be affected by the photocatalyst over time, so that a high-quality conductive pattern forming body can be obtained. is there.

Further, according to the present invention, as defined in claim 33, a base material, a photocatalyst processing layer containing at least a photocatalyst on the base material, and a pattern formed on the photocatalyst processing layer, It has a wettability changing layer in which the wettability of the energy-irradiated portion changes in a direction in which the contact angle of the liquid decreases, and a metal composition formed by solidifying a metal colloid solution on the wettability changing layer. A characteristic conductive pattern forming body is provided.

According to the present invention, since the wettability changing layer is provided, it is possible to easily deposit the metal colloid solution in a pattern with high precision by utilizing the difference in wettability. Further, since the photocatalyst treatment layer and the conductive pattern do not come into direct contact with each other, the conductive pattern is less likely to be affected by the photocatalyst over time, so that a high-quality conductive pattern forming body can be obtained. is there. Furthermore, the wettability changing layer is formed in a pattern,
Since the relatively non-conductive photocatalyst treatment layer is exposed in the portion other than the conductive pattern, even if the wettability changing layer is conductive, it is possible to form a conductive pattern forming body. is there.

The present invention also provides a substrate, a photocatalyst treatment layer containing at least a photocatalyst which is formed in a pattern on the substrate, and the photocatalyst treatment layer. A wettability changing layer in which the wettability of the energy-irradiated portion formed changes in the direction in which the contact angle of the liquid decreases, and a metal composition formed by solidifying a metal colloid solution on the wettability changing layer. There is provided a conductive pattern forming body characterized by having.

According to this embodiment, since the wettability changing layer is provided, it is possible to easily deposit the metal colloid solution in a pattern with high precision by utilizing the difference in wettability. Further, since the photocatalyst-containing layer is formed in a pattern, and the wettability changing layer and the conductive pattern are formed on the photocatalyst-containing layer, a relatively insulating base material is exposed in a portion other than the conductive pattern. Therefore, even if the wettability changing layer and the photocatalyst treatment layer are conductive, the conductive pattern forming body can be obtained.

In the invention described in any one of claims 32 to 34, as described in claim 35, the contact angle with respect to the metal colloid solution on the wettability changing layer is equal to the energy. Is preferably 50 ° or more in the non-irradiated portion and 40 ° or less in the irradiated portion. When the wettability between the liquid repellent region, which is a portion not irradiated with energy on the wettability changing layer, and the lyophilic region, which is an irradiated portion, is not within the range as described above, a metal is used. This is because when the colloidal solution is applied to the entire surface, it may not be possible to adhere the metal colloidal solution only to the lyophilic region.

Further, the present invention provides a substrate, a photocatalyst treatment layer containing at least a photocatalyst on the substrate, and a photocatalyst according to energy irradiation on the photocatalyst treatment layer. And a metal composition formed by solidifying a metal colloid solution in a pattern on the photocatalyst-treated layer on which the decomposition and removal layer is decomposed and removed. A characteristic conductive pattern forming body is provided.

According to the present invention, the presence of the decomposition and removal layer makes it possible to form irregularities on the surface by the action of the photocatalyst associated with the energy irradiation. For example, the metal colloid solution can be easily formed by the inkjet method or the like. The conductive pattern forming body can be attached and can be easily manufactured.

Further, in the invention described in Item 36, as described in Item 37, the decomposition removal layer comprises:
Self-assembled monolayer, Langmuir-Blodgett film,
Alternatively, it is preferably either an alternate adsorption film.
This is because when the decomposition / removal layer is the above film, it is possible to obtain a defect-free film having a relatively high strength.

In the invention described in claim 36 or claim 37, as described in claim 38, the contact angle with respect to the metal colloid solution on the decomposition and removal layer is 50 at a portion not irradiated with energy. °
It is above, and it is preferable that it is 40 degrees or less in the irradiated portion. This makes it possible to utilize not only the above-mentioned unevenness on the surface but also the difference in wettability, so that it is possible to obtain a conductive pattern forming body with higher definition.

[0049]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention relates to a method for producing a conductive pattern forming body and a conductive pattern forming body. Each will be described below.

A. Method for Manufacturing Conductive Pattern Formed Body First, a method for manufacturing the conductive pattern formed body of the present invention will be described. The method for producing a conductive pattern forming body of the present invention has three embodiments. Hereinafter, each embodiment will be described separately.

1. First Embodiment First, a first embodiment of the method for producing a conductive pattern forming body of the present invention will be described. A first embodiment of the method for producing a conductive pattern forming body of the present invention has a base material, a photocatalyst and a binder formed on the base material, and the wettability of an energy-irradiated portion reduces the contact angle of a liquid. Pattern forming body substrate preparing step of preparing a substrate for a pattern forming body comprising a photocatalyst containing layer that changes in a direction, by irradiating energy in a pattern on the photocatalyst containing layer, thereby forming a photocatalyst containing layer on the photocatalyst containing layer. A wettability pattern forming step of forming a wettability pattern composed of a liquid repellent area and a lyophilic area, and a photocatalyst-containing layer surface on which the wettability pattern is formed, by applying a metal colloid solution to obtain a lyophilic solution The metal colloid solution coating step of adhering the metal colloid solution only to the hydrophilic area and the conductive pattern by solidifying the metal colloid solution adhered to the lyophilic area of the above-mentioned wettability pattern. It is characterized in that it has a conductive pattern formation step to be down.

As described above, in the method for manufacturing a conductive pattern forming body according to the present embodiment, the photocatalyst-containing layer is irradiated with energy in a pattern, so that the photocatalyst in the photocatalyst-containing layer acts so that the surface of the photocatalyst-containing layer is exposed. The wettability is changed, and a pattern with this wettability changed portion, that is, a lyophilic region is formed on the surface of the photocatalyst-containing layer. Therefore, in pattern formation, development after energy irradiation
Since a post-treatment such as cleaning is not necessary, it is possible to form a pattern having different wettability at a lower cost and with fewer steps than in the past. Then, by applying a metal colloid solution to the wettability pattern on the photocatalyst-containing layer, the metal colloid solution can be attached only on the pattern of the lyophilic region, and it is easy to solidify the solution. A conductive pattern can be formed on the substrate.

The method of manufacturing the conductive pattern forming body of this embodiment will be described in detail with reference to the drawings. FIG. 1 shows an example of a method for manufacturing a conductive pattern forming body according to this embodiment.

In this example, first, a substrate 3 for a pattern-formed body in which a photocatalyst containing layer 2 is formed on a substrate 1 is prepared (see FIG. 1A, substrate preparing step for a pattern-formed body).

Next, as shown in FIG. 1B, a photomask 4 on which a required pattern is drawn is arranged on the photocatalyst containing layer 2 side of the substrate 3 for a pattern forming body, and the photomask 4 is placed therebetween. Irradiate with ultraviolet light 5. As a result, as shown in FIG. 1C, a wettability pattern composed of the lyophilic region 6 and the lyophobic region 7 is formed on the surface of the photocatalyst-containing layer 2 (wettability pattern forming step).

Then, the metal colloid solution is applied over the entire surface of the pattern forming substrate 3 so that the metal colloid solution is adhered only on the lyophilic region 6 (metal colloid solution applying step). It is possible to obtain the conductive pattern forming body 9 in which the conductive pattern 8 is formed on the photocatalyst containing layer 2 by curing the.

The method for manufacturing the conductive pattern forming body of this embodiment will be described in detail for each step.

(1) Pattern Forming Body Substrate Preparing Step The pattern forming body substrate preparing step in this embodiment is as follows:
This is a step of preparing a substrate for a pattern-formed body in which a photocatalyst-containing layer containing a photocatalyst and a binder is formed on a base material.

The substrate for a pattern-formed body produced in this step has at least the photocatalyst-containing layer and the base material as described above, and is usually in the form of a thin film formed on the base material by a predetermined method. A photocatalyst containing layer is formed.

(Photocatalyst-Containing Layer) The photocatalyst-containing layer used in this embodiment is a photocatalyst-containing layer composed of a photocatalyst and a binder, and the wettability of the energy-irradiated portion changes in the direction in which the contact angle of the liquid decreases.

As described above, the photocatalyst-containing layer whose wettability changes so that the contact angle with the liquid is reduced by the energy irradiation, and the energy pattern irradiation is performed as described later, so that the wettability can be easily changed into a pattern. To
It is possible to form a pattern of a lyophilic region having a small contact angle with a liquid. Therefore, the conductive pattern forming body can be efficiently manufactured, and the conductive pattern forming body can be obtained at low cost.

Here, the lyophilic region is a region having a small contact angle with a liquid and having a good wettability with a metal colloid solution described later. Further, the liquid repellent region is a region having a large contact angle with the liquid and having poor wettability with the metal colloid solution.

The photocatalyst-containing layer has a contact angle with the metal colloid solution of 50 ° or more, preferably 60, in the portion not irradiated with energy, that is, in the liquid repellent region.
It is preferably at least °, especially at least 70 °. This is because the portion not irradiated with energy is a portion that is required to have liquid repellency in the present embodiment, and therefore the liquid repellency is not sufficient when the contact angle with the liquid is small, and the metal described below is used. This is because when the metal colloid solution is applied to the entire surface in the colloid solution application step, the metal colloid solution may remain in the region where the conductive pattern is not formed, which is not preferable.

The photocatalyst-containing layer has a contact angle with the metal colloid solution of 40 ° or less, preferably 3 at the portion irradiated with energy, that is, the lyophilic region.
It is preferably 0 ° or less, and particularly preferably 20 ° or less. When the contact angle with the metal colloid solution in the portion irradiated with energy, that is, the lyophilic region is high, the metal colloid solution may be repelled even in the lyophilic region when the entire surface of the metal colloid solution described later is applied. This is because it may be difficult to pattern the metal colloid solution on the lyophilic region.

The contact angle with a liquid referred to herein is measured by using a contact angle measuring device (CA-Z type manufactured by Kyowa Interface Science Co., Ltd.) with a liquid having various surface tensions (micro). The droplet was dropped from the syringe 30 seconds later), and the result was obtained or a graph was obtained. In addition, in this measurement, as a liquid having various surface tensions, wetting index standard liquid manufactured by Junsei Chemical Co., Ltd. was used.

When the photocatalyst-containing layer as described above is used in this embodiment, the photocatalyst-containing layer contains fluorine, and the fluorine content on the surface of the photocatalyst-containing layer is higher than that of the photocatalyst-containing layer. When irradiated with, the photocatalyst-containing layer may be formed by the action of the photocatalyst so as to be lower than that before the energy irradiation, and is decomposed by the action of the photocatalyst by the energy irradiation, thereby the photocatalyst-containing layer The photocatalyst-containing layer may be formed so as to contain a decomposition substance capable of changing the wettability.

The mechanism of action of the photocatalyst represented by titanium dioxide as described below in the photocatalyst-containing layer as described above is not always clear, but the carrier generated by irradiation of light is not clearly defined. It is considered that the chemical structure is changed by the direct reaction or the active oxygen species generated in the presence of oxygen and water. In the present embodiment, it is considered that this carrier acts on the binder compound in the photocatalyst containing layer to change the wettability of the surface.

The photocatalyst, the binder, and other components constituting the photocatalyst containing layer will be described below.

A. Photocatalyst First, the photocatalyst used in the present embodiment will be described.
Examples of the photocatalyst used in this embodiment include titanium dioxide (TiO ₂ ), zinc oxide (ZnO), tin oxide (SnO ₂ ), strontium titanate (SrTiO ₃ ), and tungsten oxide (W) known as photo semiconductors.
O ₃ ), bismuth oxide (Bi ₂ O ₃ ), and iron oxide (Fe ₂ O ₃ ), may be mentioned, and these may be selected and used alone or in combination of two or more.

In the present embodiment, titanium dioxide is particularly preferably used because it has a high band gap energy, is chemically stable, has no toxicity, and is easily available. Titanium dioxide includes anatase type and rutile type, and both can be used in the present embodiment, but anatase type titanium dioxide is preferable. Anatase type titanium dioxide has an excitation wavelength of 380 nm or less.

Examples of such anatase-type titanium dioxide include hydrochloric acid peptization-type anatase-type titania sol (STS-02 (average particle size 7 nm) manufactured by Ishihara Sangyo Co., Ltd.)
Examples include ST-K01 manufactured by Ishihara Sangyo Co., Ltd. and a nitrate-deflocculating anatase-type titania sol (TA-15 manufactured by Nissan Chemical Co., Ltd. (average particle size 12 nm)).

The smaller the particle size of the photocatalyst is, the more effectively the photocatalytic reaction takes place. The average particle size is preferably 50 nm or less, and the photocatalyst of 20 nm or less is particularly preferably used.

The content of the photocatalyst in the photocatalyst containing layer used in this embodiment is 5 to 60% by weight, preferably 20 to
It can be set in the range of 40% by weight. Further, the thickness of the photocatalyst-containing layer is preferably in the range of 0.05 to 10 μm.

B. Binder Next, the binder used in this embodiment will be described. In this embodiment, when the photocatalyst acts on the binder itself to change the wettability on the photocatalyst-containing layer (first embodiment), it is decomposed by the action of the photocatalyst by energy irradiation, whereby the photocatalyst-containing layer is formed. In the case where the photocatalyst-containing layer contains a decomposed substance capable of changing the wettability, the second substance is changed.
And a combination of these (3rd form). The binder used in the first and third forms needs to have a function of changing the wettability on the photocatalyst-containing layer by the action of the photocatalyst. No particular function is required.

Hereinafter, the binder used in the second embodiment, that is, the binder not requiring the function of changing the wettability on the photocatalyst containing layer by the action of the photocatalyst, will be described first, and then the first and third embodiments. The binder used in the above form, that is, the binder having the function of changing the wettability on the photocatalyst containing layer by the action of the photocatalyst will be described.

As the binder used in the second embodiment, which does not require the function of changing the wettability on the photocatalyst containing layer by the action of the photocatalyst, a high bond whose main skeleton is not decomposed by photoexcitation of the photocatalyst is used. There is no particular limitation as long as it has energy. Specific examples thereof include polysiloxanes having no organic substituent or some organic substituents, which can be obtained by hydrolyzing and polycondensing tetramethoxysilane, tetraethoxysilane and the like. .

When such a binder is used, a decomposed substance which is decomposed by the action of a photocatalyst by the energy irradiation described later as an additive and thereby can change the wettability on the photocatalyst containing layer is added to the photocatalyst containing layer. Must be contained in

Next, the binder used in the first and third embodiments, which requires the function of changing the wettability on the photocatalyst containing layer by the action of the photocatalyst, will be described. As such a binder, those having a high binding energy such that the main skeleton is not decomposed by photoexcitation of the photocatalyst, and those having an organic substituent that is decomposed by the action of the photocatalyst are preferable, for example, (1) Organopolysiloxane that hydrolyzes and polycondenses chloro or alkoxysilane etc. by a sol-gel reaction or the like to exhibit great strength, and (2) organopolysiloxane obtained by crosslinking a reactive silicone excellent in water repellency and oil repellency. Etc. can be mentioned.

In the case of the above (1), the general formula: Y _n SiX _(4-n) (wherein Y represents an alkyl group, a fluoroalkyl group, a vinyl group, an amino group, a phenyl group or an epoxy group,
X represents an alkoxyl group, an acetyl group or halogen. n is an integer from 0 to 3. It is preferable that the organopolysiloxane is a hydrolysis-condensation product or a co-hydrolysis-condensation product of one or more silicon compounds represented by the formula (1). The number of carbon atoms of the group represented by Y is preferably within the range of 1 to 20, and the alkoxy group represented by X is a methoxy group, an ethoxy group, a propoxy group or a butoxy group. preferable.

As the binder, a polysiloxane containing a fluoroalkyl group can be preferably used. Specifically, one or more hydrolyzed condensates or co-hydrolyzed fluorofluorosilanes described below can be specifically used. Examples thereof include condensates, and those generally known as fluorine-based silane coupling agents can be used. _{CF 3 (CF 2) 3 CH} 2 CH 2 Si (OCH 3) 3; CF 3 (CF 2) 5 CH 2 CH 2 Si (OCH 3) 3; CF 3 (CF 2) 7 CH 2 CH 2 Si (OCH _{3) 3; CF 3 (CF} 2) 9 CH 2 CH 2 Si (OCH 3) 3; (CF 3) 2 CF (CF 2) 4 CH 2 CH 2 Si (OC
_{H 3) 3; (CF 3} ) 2 CF (CF 2) 6 CH 2 CH 2 Si (OC
_{H 3) 3; (CF 3} ) 2 CF (CF 2) 8 CH 2 CH 2 Si (OC
_{H 3) 3; CF 3 (} C 6 H 4) C 2 H 4 Si (OCH 3) 3; CF 3 (CF 2) 3 (C 6 H 4) C 2 H 4 Si (OCH
₃ ) ₃ ; CF ₃ (CF ₂ ) ₅ (C ₆ H ₄ ) C ₂ H ₄ Si (OCH
₃ ) ₃ ; CF ₃ (CF ₂ ) ₇ (C ₆ H ₄ ) C ₂ H ₄ Si (OCH
₃ ) ₃ ; CF ₃ (CF ₂ ) ₃ CH ₂ CH ₂ SiCH ₃ (OC
_{H 3) 2; CF 3 (} CF 2) 5 CH 2 CH 2 SiCH 3 (OC
_{H 3) 2; CF 3 (} CF 2) 7 CH 2 CH 2 SiCH 3 (OC
H ₃ ) ₂ ; CF ₃ (CF ₂ ) ₉ CH ₂ CH ₂ SiCH ₃ (OC
_{H 3) 2; (CF 3} ) 2 CF (CF 2) 4 CH 2 CH 2 SiCH 3
(OCH ₃ ) ₂ ; (CF ₃ ) ₂ CF (CF ₂ ) ₆ CH ₂ CH ₂ Si CH
₃ (OCH ₃ ) ₂ ; (CF ₃ ) ₂ CF (CF ₂ ) ₈ CH ₂ CH ₂ Si CH
₃ (OCH ₃ ) ₂ ; CF ₃ (C ₆ H ₄ ) C ₂ H ₄ SiCH ₃ (OC
_{H 3) 2; CF 3 (} CF 2) 3 (C 6 H 4) C 2 H 4 SiCH
₃ (OCH ₃ ) ₂ ; CF ₃ (CF ₂ ) ₅ (C ₆ H ₄ ) C ₂ H ₄ SiCH
₃ (OCH ₃ ) ₂ ; CF ₃ (CF ₂ ) ₇ (C ₆ H ₄ ) C ₂ H ₄ SiCH
₃ (OCH ₃ ) ₂ ; CF ₃ (CF ₂ ) ₃ CH ₂ CH ₂ Si (OCH ₂ C
_{H 3) 3; CF 3 (} CF 2) 5 CH 2 CH 2 Si (OCH 2 C
H ₃ ) ₃ ; CF ₃ (CF ₂ ) ₇ CH ₂ CH ₂ Si (OCH ₂ C
_{H 3) 3; CF 3 (} CF 2) 9 CH 2 CH 2 Si (OCH 2 C
_{H 3) 3; CF 3 (} CF 2) 7 SO 2 N (C 2 H 5) C 2 H 4 CH
₂ Si (OCH ₃ ) ₃ By using the polysiloxane containing a fluoroalkyl group as described above as a binder, the liquid repellency of the energy-unirradiated portion of the photocatalyst-containing layer is significantly improved and the adhesion of the metal colloid solution is hindered. Express function.

As the reactive silicone of the above (2), compounds having a skeleton represented by the following general formula can be mentioned.

[0082]

[Chemical 1]

However, n is an integer of 2 or more, and R ¹ ,
R ² is a substituted or unsubstituted alkyl, alkenyl, aryl or cyanoalkyl group having 1 to 10 carbon atoms, and 40% or less by mole of the total is vinyl, phenyl or phenyl halide. Further, it is preferable that R ¹ and R ² have a methyl group because the surface energy becomes the smallest, and the molar ratio of the methyl group is preferably 60% or more. Further, the chain end or side chain has at least one reactive group such as a hydroxyl group in the molecular chain.

In addition to the above-mentioned organopolysiloxane, a stable organosilicon compound which does not cause a crosslinking reaction, such as dimethylpolysiloxane, may be mixed in the binder.

(Decomposition Material) In the second and third embodiments, a decomposition material which is decomposed by the action of the photocatalyst by energy irradiation and which can change the wettability on the photocatalyst containing layer is photocatalyst. It is necessary to include it in the containing layer. That is, when the binder itself does not have the function of changing the wettability on the photocatalyst-containing layer, and when such a function is insufficient, the decomposing substance as described above is added to the photocatalyst-containing layer. It causes a change in wettability or assists such a change.

Examples of such a decomposing substance include a surfactant having a function of decomposing by the action of a photocatalyst and changing the wettability of the surface of the photocatalyst containing layer by being decomposed. Specifically, hydrocarbon series such as NIKKOL BL, BC, BO, and BB series manufactured by Nikko Chemicals Co., Ltd., ZONYL FS manufactured by DuPont.
N, FSO, Surflon S-141, 1 manufactured by Asahi Glass Co., Ltd.
45, Dainippon Ink & Chemicals Co., Ltd. Megafac F-
141, 144, Neos Co., Ltd. Futagent F-2
00, F251, Daikin Industries, Ltd. Unidyne DS
-401, 402, Florade FC manufactured by 3M Co., Ltd.
Examples thereof include fluorine-based or silicone-based nonionic surfactants such as -170 and 176, and cationic surfactants, anionic surfactants and amphoteric surfactants can also be used.

In addition to the surfactant, polyvinyl alcohol, unsaturated polyester, acrylic resin, polyethylene, diallyl phthalate, ethylene propylene diene monomer, epoxy resin, phenol resin, polyurethane, melamine resin, polycarbonate, polyvinyl chloride, Polyamide, polyimide, styrene butadiene rubber, chloroprene rubber, polypropylene, polybutylene, polystyrene, polyvinyl acetate, nylon, polyester, polybutadiene, polybenzimidazole, polyacrylonitrile, epichlorohydrin, polysulfide, polyisoprene, etc. You can

(Containing Fluorine) In the present embodiment, the photocatalyst-containing layer contains fluorine, and the fluorine content on the surface of the photocatalyst-containing layer is the above when the photocatalyst-containing layer is irradiated with energy. It is preferable that the photocatalyst-containing layer is formed so as to be reduced by the action of the photocatalyst as compared with before the energy irradiation.

With the photocatalyst-containing layer having such characteristics, it is possible to easily form a pattern composed of a portion having a low fluorine content, as will be described later, by performing pattern irradiation with energy. Here, since fluorine has an extremely low surface energy, the surface of a substance containing a large amount of fluorine has a smaller critical surface tension. Therefore, the critical surface tension of the portion containing a small amount of fluorine becomes higher than the critical surface tension of the surface of the portion containing a large amount of fluorine. This means that
A portion having a low fluorine content means a lyophilic region as compared with a portion having a high fluorine content. Therefore, forming a pattern composed of a portion having a smaller fluorine content than that of the surrounding surface forms a pattern of the lyophilic region in the lyophobic region.

Therefore, when such a photocatalyst containing layer is used, the pattern of the lyophilic region can be easily formed in the lyophobic region by irradiating the pattern with energy, so that the metal colloid solution is used. Even when applied to the entire surface, it becomes possible to easily form a conductive pattern forming body by attaching the metal colloid solution only to this lyophilic region, and to form a highly precise conductive pattern at low cost. You can

As the content of fluorine contained in the photocatalyst containing layer containing fluorine as described above, the fluorine content in the lyophilic region having a low fluorine content formed by irradiation with energy is the energy irradiation. It is preferable that the fluorine content of the portion not treated is 100 or less, preferably 5 or less, and particularly preferably 1 or less, when the fluorine content is 100.

Within such a range, it is possible to make a large difference in the lyophilicity between the energy-irradiated portion and the unirradiated portion. Therefore, by forming a conductive pattern in such a photocatalyst-containing layer, it becomes possible to accurately form a conductive pattern only in the lyophilic region in which the fluorine content is lowered, and it is possible to accurately form the conductive pattern forming body. Because you can get The rate of decrease is based on weight.

The fluorine content in the photocatalyst-containing layer can be measured by various commonly used methods, for example, X-ray photoelectron spectroscopy (X-ray Phot spectroscopy).
oelectron Spectroscopy, ESCA (Electron Spectroscop
y for Chemical Analysis). ), A fluorescent X-ray analysis method, a mass spectrometry method, or the like, as long as the amount of fluorine on the surface can be quantitatively measured.

In this embodiment, titanium dioxide is preferably used as the photocatalyst as described above.
As described above, the content of fluorine contained in the photocatalyst containing layer when titanium dioxide is used is 10% of titanium (Ti) element when analyzed and quantified by X-ray photoelectron spectroscopy.
When the value is 0, it is preferable that the fluorine (F) element is contained in the photocatalyst-containing layer surface in a ratio of 500 or more, preferably 800 or more, and particularly preferably 1200 or more.

By including fluorine (F) in the photocatalyst-containing layer to such an extent, the critical surface tension on the photocatalyst-containing layer can be made sufficiently low, so that the liquid repellency on the surface can be ensured, and thus the energy can be secured. It is possible to increase the difference in wettability with the lyophilic region of the surface in the pattern portion where the fluorine content is reduced by pattern irradiation, and improve the accuracy of the finally obtained conductive pattern formed body. Because you can

Further, in such a conductive pattern forming body, the fluorine content in the ink-philic area formed by pattern irradiation with energy is titanium (Ti).
When the element is 100, it is preferable that the fluorine (F) element is contained in a ratio of 50 or less, preferably 20 or less, and particularly preferably 10 or less.

If the content of fluorine in the photocatalyst containing layer can be reduced to this extent, sufficient lyophilicity can be obtained for forming a conductive pattern, and the portion of the portion not irradiated with the above energy can be obtained. Due to the difference in wettability from the liquid repellency, it becomes possible to form the conductive pattern with high accuracy, and it is possible to obtain a conductive pattern forming body with high utility value.

C. Method for producing photocatalyst-containing layer When the organopolysiloxane is used as a binder as described above, the photocatalyst-containing layer is prepared by dispersing the photocatalyst and the organopolysiloxane that is the binder in a solvent together with other additives as necessary. Then, a coating solution is prepared, and the coating solution is applied onto a base material to form a coating solution. As the solvent used, alcohol-based organic solvents such as ethanol and isopropanol are preferable. The coating can be carried out by a known coating method such as spin coating, spray coating, dip coating, roll coating or bead coating. When the binder contains an ultraviolet curable component, the photocatalyst-containing layer can be formed by irradiating ultraviolet rays to perform a curing treatment.

(Substrate) In the present embodiment, as shown in FIG. 1, the pattern forming substrate 3 has at least the substrate 1 and the photocatalyst containing layer 2 formed on the substrate 1. Is.

At this time, the material constituting the substrate used is appropriately selected depending on the direction of energy irradiation in the wettability pattern forming step described later, whether the obtained conductive pattern forming body needs to be transparent or the like. It That is,
When the photocatalyst-containing layer side is irradiated, the base material is not particularly required to be transparent, but when the energy is irradiated from the base material side, the base material needs to be transparent.

The substrate used in this embodiment may be a flexible one, such as a resin film, or a non-flexible one, such as a glass substrate. Good.

A primer layer may be formed on the substrate in order to improve the adhesion between the substrate surface and the photocatalyst containing layer. As such a primer layer,
Examples thereof include silane-based and titanium-based coupling agents.

(Light-Shielding Part) The pattern-forming body substrate used in the present embodiment may be one having a light-shielding part formed in a pattern. In the case where the light-shielding portion is provided as described above, it is not necessary to use a photomask or to perform drawing irradiation with laser light at the time of energy irradiation.
Therefore, since it is not necessary to align the pattern forming substrate and the photomask, a simple process can be performed, and an expensive device necessary for drawing irradiation is not necessary, which results in cost reduction. It has an advantage that it becomes advantageous.

The light-shielding portion is formed on the base material, and the photocatalyst-containing layer is formed thereon, that is, between the base material and the photocatalyst-containing layer. In some cases, it is formed in a pattern on the surface on the side where the photocatalyst containing layer is not formed.

In any case, the irradiation of energy is from the substrate side, but by irradiating the entire surface, a wettability pattern can be formed in a pattern on the surface of the photocatalyst containing layer.

The method of forming such a light-shielding portion is not particularly limited, and is appropriately selected and used according to the characteristics of the surface on which the light-shielding portion is formed, the shielding property against required energy, and the like.

For example, it may be formed by forming a thin metal film of chromium or the like having a thickness of about 1000 to 2000 Å by a sputtering method, a vacuum deposition method or the like, and patterning this thin film. As a method of this patterning,
A usual patterning method such as sputtering can be used.

In addition, carbon fine particles in the resin binder,
A method may be used in which a layer containing light-shielding particles such as metal oxides, inorganic pigments, and organic pigments is formed in a pattern.
As the resin binder used, one or a mixture of two or more resins such as polyimide resin, acrylic resin, epoxy resin, polyacrylamide, polyvinyl alcohol, gelatin, casein, and cellulose, a photosensitive resin, and O / It is possible to use a W emulsion type resin composition, for example, an emulsion of reactive silicone. The thickness of such a resin light-shielding portion can be set within the range of 0.5 to 10 μm. As a method of patterning the resin light-shielding portion, a generally used method such as a photolithography method or a printing method can be used.

(2) Wettability Pattern Forming Step In the present embodiment, the surface of the photocatalyst containing layer is then subjected to pattern irradiation with energy from a predetermined direction to form a lyophilic region on the surface of the photocatalyst containing layer. A wettability pattern forming step of forming a wettability pattern including a liquid repellent region is performed.

The energy irradiation (exposure) in the present embodiment is a concept including irradiation with any energy ray capable of changing the wettability of the surface of the photocatalyst containing layer, and is limited to irradiation with visible light. It is not something that will be done.

The wavelength of light used for such energy irradiation is usually in the range of 400 nm or less, preferably 380 n.
It is set from a range of m or less. This is because the preferable photocatalyst used in the photocatalyst-containing layer is titanium dioxide as described above, and the light having the above-mentioned wavelength is preferable as the energy for activating the photocatalytic action by the titanium dioxide.

Examples of light sources that can be used for such energy irradiation include mercury lamps, metal halide lamps, xenon lamps, excimer lamps, and various other light sources.

In addition to the method of performing pattern irradiation through a photomask using the above-mentioned light source, excimer,
It is also possible to use a method of drawing and irradiating in a pattern using a laser such as YAG.

Further, the irradiation amount of energy at the time of energy irradiation is the irradiation amount necessary for the surface of the photocatalyst containing layer to change the wettability of the surface of the photocatalyst containing layer by the action of the photocatalyst in the photocatalyst containing layer.

At this time, by irradiating energy while heating the photocatalyst containing layer, the sensitivity can be increased, and the wettability can be efficiently changed, which is preferable. Specifically, it is preferable to heat within the range of 30 ° C to 80 ° C.

As described above, when the base material is transparent, the direction of energy irradiation in this embodiment is either pattern material irradiation through a photomask or laser light irradiation from either the base material side or the photocatalyst containing layer side. Drawing irradiation may be performed. On the other hand, when the substrate is opaque, it is necessary to perform energy irradiation from the photocatalyst containing layer side,
Further, when the light shielding portion is formed, it is necessary to perform energy irradiation from the base material side.

(3) Metal Colloid Solution Coating Step In the present embodiment, next, the metal colloid solution is applied over the entire surface of the substrate for a pattern forming body on which the wettability pattern is formed, thereby making it lyophilic. A metal colloid solution coating step is performed in which the metal colloid solution is attached only to the region.

The coating method of the metal colloid solution is not particularly limited as long as the metal colloid solution can be coated on the photocatalyst containing layer, and specifically, dip coating method or spin coating method. A method of coating the entire surface of the property changing layer, such as a method, or a method of coating the metal colloidal solution in a desired pattern, such as a nozzle discharge method, may be used. Among the nozzle ejection methods, the inkjet method is preferable because of its good manufacturing efficiency.

The viscosity of the metal colloid solution used in this embodiment is 1 to 100 cps, preferably 5 to 50 cp.
s, especially in the range of 10 to 20 cps, and its concentration is 1 to 70 wt%, preferably 10 to
It is preferably in the range of 50 wt%, particularly 20 to 30 wt%. When the viscosity and the concentration are lower than the above ranges, it depends on the use, but it is not preferable because it may be difficult to put into practical use because the film thickness of the obtained metal pattern is too thin. On the other hand, if the viscosity and the concentration are higher than the above ranges, patterning may not be possible when such a metal colloid solution is applied to the entire surface, which is not preferable.

Further, the surface tension of the metal colloid solution is preferably 20 mN / m or more, preferably 50 mN / m or more, and particularly 70 mN / m or more. If the surface tension is lower than the above range, it may not be possible to obtain a large contact angle in the liquid repellent region, and as a result, the metal colloid solution may remain in the liquid repellent region, which is not preferable. . The upper limit of the surface tension of the metal colloid solution is not particularly limited, but it can be said that it is preferably 80 mN / m or less.

As described above, the metal colloid solution used in the present embodiment is preferably a solution having a large surface tension. This is because it is necessary to remove the metal colloid solution applied to the liquid repellent area other than the lyophilic area when it is applied to the entire surface as described above, or to collect in the lyophilic area. This is because it is preferable that the contact angle of the metal colloid solution in the liquid repellent region is large. From this point of view, in the present embodiment, it is preferable to use an aqueous metal colloid solution using water as a medium.

Further, the kind of metal used in the metal colloid solution used in this embodiment is preferably silver or gold. This is because they have good conductivity and corrosion resistance.

Therefore, in this embodiment, it is preferable to use an aqueous gold colloid solution or an aqueous silver colloid solution.

(4) Conductive Pattern Forming Step In the present embodiment, finally, a conductive pattern forming step of solidifying the metal colloid solution attached to the lyophilic region on the photocatalyst-containing layer to form a conductive pattern. Is done
Finally, the substrate for pattern forming body is made into a conductive pattern forming body.

Heating is the most common solidification method used here, and heating is performed within the range of 100 ° C. to 700 ° C., preferably within the range of 250 ° C. to 500 ° C., and the heating time is 10 minutes to In the range of 60 minutes, preferably 20
It is within the range of 40 minutes.

(5) Non-image area removing step In the method of manufacturing a conductive pattern forming body according to the present embodiment, in addition to the above steps, the non-conductive pattern area where the conductive pattern area is not formed is removed. You may have a non-image area removal process. When the photocatalyst-containing layer described above is conductive, even if it has a conductive pattern on the conductive pattern forming body, it is difficult to form a conductive pattern forming body. By removing the photocatalyst containing layer in the pattern portion, the base material is exposed to form a conductive pattern forming body. At this time, the base material needs to be an insulating material among the above.

Here, the conductive pattern portion is a portion where the conductive pattern formed in the above-mentioned conductive pattern forming step is formed, and the non-conductive pattern portion is above the photocatalyst containing layer. It means a portion where the photocatalyst containing layer is exposed on the surface, other than the portion where the conductive pattern portion is formed.

In the non-image area removing step of this embodiment, for example, the pattern forming body substrate (FIG. 2 (a)) formed in the conductive pattern forming step is exposed on the surface other than the conductive pattern 8 region. This is a step of removing the non-image area 10 composed of the photocatalyst-containing layer (FIG. 2B).
If it is possible to remove 0 and expose the substrate 1,
The method and the like are not particularly limited.

Specific examples of the method for removing the non-image area include a method of spraying an alkaline solution or a strong acid such as hydrofluoric acid or concentrated sulfuric acid, and a method of dipping.

(6) Others In this embodiment, the thickness of the conductive pattern may be increased by further electroplating the conductive pattern forming body. By doing this, it is possible to reduce the resistance of the conductive pattern and at the same time improve the adhesion strength of the conductive pattern to the photocatalyst-containing layer, and to provide a high-quality, high-definition wiring board. Because you can

Further, in the present embodiment, for the reason of improving the adhesion of the obtained conductive pattern to the substrate,
You may make it form a protective layer on the obtained electroconductive pattern.

2. Second Embodiment Next, a second embodiment of the method for producing a conductive pattern forming body of the present invention will be described. The method for producing a conductive pattern forming body of the present embodiment, a substrate, a photocatalyst treatment layer formed on the substrate, at least a photocatalyst is contained, and formed on the photocatalyst treatment layer, the energy irradiation portion of A pattern forming body substrate preparing step of preparing a pattern forming body substrate consisting of a wettability changing layer which is a layer in which the wettability changes in a direction in which the contact angle of the liquid decreases, and the wettability changing layer is patterned in a pattern. A wettability pattern forming step of forming a wettability pattern composed of a liquid repellent region and a lyophilic region on the wettability change layer by irradiating energy, and a wettability change in which the wettability pattern is formed. By applying a metal colloid solution to the surface of the layer, the metal colloid solution application step of attaching the metal colloid solution only to the lyophilic area and the attachment to the lyophilic area of the wettability pattern It is characterized in that it has a conductive pattern formation step of the metal colloid solution to solidify the a conductive pattern was.

As described above, in the method for manufacturing a conductive pattern forming body according to the present embodiment, by irradiating the wettability changing layer with energy in a pattern, the energy irradiating portion can be easily changed to the lyophilic region. It is possible to form a pattern in which the energy non-irradiated area is a liquid repellent area.
The metal colloid solution can be attached only to the lyophilic region formed in this pattern, and by solidifying the solution, the conductive pattern forming body can be easily manufactured.

In the method of manufacturing such a conductive pattern forming body, for example, as shown in FIG. 3, the photocatalyst processing layer 11 is formed on the base material 1 (see FIG. 3A). Next, the wettability changing layer 12 is formed on the photocatalyst processing layer 11 (FIG. 3).
(See (b)). As shown in FIG. 3C, a photomask 4 on which a required pattern is drawn is arranged on the wettability changing layer 12, and ultraviolet light 5 is irradiated through the photomask 4. As a result, as shown in FIG. 3D, the wettability changing layer 12
A wettability pattern composed of the lyophilic region 6 and the lyophobic region 7 is formed on the surface (wettability pattern forming step).

Next, by coating the surface of the wettability changing layer 12 with a metal colloid solution, the metal colloid solution is adhered only on the lyophilic region 6 (metal colloid solution coating step) and solidified. By doing so, a conductive pattern is formed (see FIG. 3E, conductive pattern forming step).

Hereinafter, the method for manufacturing the conductive pattern forming body of this embodiment will be described step by step.

(1) Pattern Forming Body Substrate Preparing Step First, the pattern forming body substrate preparing step in the present embodiment will be described. In the step of preparing a substrate for a pattern-formed body of the present embodiment, a base material, a photocatalyst processing layer formed on the base material and containing at least a photocatalyst, and formed on the photocatalyst processing layer, the energy irradiation portion is wetted. It is a step of preparing a substrate for a pattern forming body which comprises a wettability changing layer which is a layer whose property changes in a direction in which the contact angle of a liquid decreases. Each configuration will be described below.

(Photocatalyst Treatment Layer) The photocatalyst treatment layer in this embodiment contains at least a photocatalyst,
When the photocatalyst processing layer has a binder, it is the same as the photocatalyst containing layer described in the first embodiment, and therefore the description thereof is omitted here. However, in the second embodiment,
Since the wettability on the photocatalyst-treated layer does not need to change in particular, even when the change in wettability due to the action of the photocatalyst on the binder itself does not occur, the decomposed substance is treated with the photocatalyst as in the first embodiment. It is not necessary to include it in the treatment layer.
Further, the method of manufacturing the photocatalyst processing layer having the binder is the same as that of the above-described first embodiment, and therefore the description thereof will be omitted.

On the other hand, as a method of forming the photocatalyst processing layer in the case of not having a binder, for example, a sputtering method,
Examples thereof include a method using a vacuum film forming method such as a CVD method and a vacuum vapor deposition method. By forming the photocatalyst processing layer by the vacuum film forming method, it is possible to obtain a photocatalyst processing layer having a uniform film and containing only the photocatalyst, and thereby uniformly changing the wettability on the wettability changing layer. Since it is possible and the photocatalyst alone is used, the wettability on the wettability changing layer can be changed more efficiently than in the case where a binder is used.

As another method of forming the photocatalyst treatment layer consisting of only the photocatalyst, for example, when the photocatalyst is titanium dioxide, amorphous titania is formed on the base material, and then the phase is changed to crystalline titania by firing. Methods and the like. Examples of the amorphous titania used here include titanium tetrachloride, hydrolysis of titanium inorganic salts such as titanium sulfate, dehydration condensation, tetraethoxy titanium, tetraisopropoxy titanium, tetra-n-propoxy titanium, tetrabutoxy titanium, It can be obtained by hydrolysis and dehydration condensation of an organic titanium compound such as tetramethoxytitanium in the presence of an acid. Then, it is converted into anatase type titania by firing at 400 ° C. to 500 ° C.
It can be converted to rutile type titania by firing at ℃ to 700 ℃.

(Wettability Change Layer) Next, the wettability change layer will be described. In this embodiment, since it is not necessary to include a photocatalyst in the wettability changing layer, it is possible to reduce the possibility that the electroconductive pattern is affected by the photocatalyst over time, and to form a high-quality electroconductive pattern. It becomes possible to become a body.

The wettability changing layer is not particularly limited as long as the wettability is changed by the action of the photocatalyst processing layer, but the same material as the binder in the photocatalyst processing layer of the first embodiment is used. Is preferably formed. The material and forming method of the wettability changing layer when formed of the same material as the binder in the photocatalyst-containing layer of the first embodiment is the same as that of the first embodiment. The description of is omitted.

In the present embodiment, the thickness of the wettability changing layer is determined from the relationship of the change rate of the wettability by the photocatalyst and the like.
The thickness is preferably 0.001 μm to 1 μm, particularly preferably 0.01 to 0.1 μm.

By using the wettability changing layer of the above-mentioned components in this embodiment, the action of the photocatalyst in the adjacent photocatalyst treatment layer prevents the oxidation, decomposition, etc. of the organic groups and additives which are a part of the above-mentioned components. By using the action, the wettability of the energy-irradiated portion can be changed to be lyophilic, and a large difference in wettability with the unirradiated portion can be generated. Therefore, by increasing the receptivity (lyophilicity) and repulsion (lyophobicity) of the metal colloidal solution, it is possible to obtain a conductive pattern forming body with high utility value.

In the wettability changing layer in this embodiment, the contact angle with respect to the metal colloid solution is 50 ° or more in the portion not irradiated with energy, that is, in the liquid repellent area.
It is preferably 60 ° or more, and particularly preferably 70 ° or more. This is because the portion not irradiated with energy is a portion that is required to have liquid repellency in the present embodiment, and therefore the liquid repellency is not sufficient when the contact angle with the liquid is small, and the metal described below is used. This is because when the metal colloid solution is applied to the entire surface in the colloid solution application step, the metal colloid solution may remain in the region where the conductive pattern is not formed, which is not preferable.

In the wettability changing layer, the contact angle to the metal colloid solution is 40 ° or less, preferably 3 in the portion irradiated with energy, that is, the lyophilic region.
It is preferably 0 ° or less, and particularly preferably 20 ° or less. When the contact angle with the metal colloid solution in the portion irradiated with energy, that is, the lyophilic region is high, the metal colloid solution may be repelled even in the lyophilic region when the entire surface of the metal colloid solution described later is applied. This is because it may be difficult to pattern the metal colloid solution on the lyophilic region.

The wettability changing layer contains "fluorine-containing" in the description of the photocatalyst containing layer in the first embodiment.
Similar fluorine can be contained in the same manner as that described in the above section.

(2) Wettability Pattern Forming Step Next, the wettability pattern forming step of this embodiment will be described. In the step of forming the wettability pattern of the present embodiment, the wettability change layer described above is irradiated with energy in a pattern from a predetermined direction so that the wettability change layer surface has a lyophilic region and a liquid repellency. This is a step of forming a wettability pattern composed of regions. The energy, the energy irradiation method, and the like in this wettability pattern forming step are the same as in the wettability pattern forming step of the first embodiment described above, so description thereof will be omitted here.

(3) Metal Colloid Solution Coating Step Next, the metal colloid solution coating step will be described. The metal colloid solution coating step of the present embodiment is a step of attaching the metal colloid solution only to the lyophilic region of the wettability pattern composed of the lyophilic region and the lyophobic region by the above-described wettability pattern forming process. Is.

The metal colloid solution, the coating method and the like in the metal colloid solution coating step of this embodiment are the same as those of the above-described first embodiment metal colloid solution coating step, and therefore the description thereof is omitted here.

(4) Conductive Pattern Forming Step Next, the conductive pattern forming step of solidifying the metal colloid solution adhered only to the lyophilic region of the wettability pattern is performed by the above-mentioned metal colloid solution step. Since the method of solidifying the metal colloid solution in this conductive pattern forming step is the same as that of the conductive pattern forming step of the first embodiment described above, the description thereof is omitted here.

(5) Non-image area removing step In the present embodiment, a non-image area removing step of removing the non-conductive pattern area where the conductive pattern is not formed is performed after the above-described conductive pattern forming step. You may have. When the wettability changing layer described above is conductive,
Even if it has a conductive pattern, since it is difficult to form a conductive pattern forming body, by removing the non-conductive pattern portion, the photocatalyst treatment layer is exposed,
It is used as a conductive pattern forming body. In addition, the non-image area removing step in the present embodiment may be a step of removing the wettability changing layer and the photocatalyst processing layer when the wettability changing layer and the photocatalyst processing layer are conductive materials.
Here, the non-conductive pattern portion is a portion where the conductive pattern is not formed on the wettability changing layer and the wettability changing layer is exposed on the surface.

The non-image area removing step in this embodiment is also the same as the non-image area removing step in the first embodiment described above, and therefore the description thereof is omitted here.

(6) Others In this embodiment, the conductive pattern forming body may be further electroplated to increase the thickness of the conductive pattern. By doing so, it is possible to reduce the resistance of the conductive pattern, and at the same time, it is possible to improve the adhesion strength of the conductive pattern to the wettability changing layer, and to obtain a high-quality, high-definition wiring board. Because you can.

In the present embodiment, for the reason of improving the adhesion of the obtained conductive pattern to the substrate,
You may make it form a protective layer on the obtained electroconductive pattern.

3. Third Embodiment Next, a third embodiment of the method for producing a conductive pattern forming body of the present invention will be described. The method for manufacturing a conductive pattern forming body of the present embodiment, a substrate, a photocatalyst treatment layer formed on the substrate, at least a photocatalyst is contained, and formed on the photocatalyst treatment layer, accompanied by energy irradiation. A pattern forming body substrate preparing step of preparing a pattern forming body substrate comprising a decomposition removing layer which is a layer which is decomposed and removed by the action of a photocatalyst, and by irradiating the decomposition removing layer with energy in a pattern, A decomposition and removal pattern forming step of forming a decomposition and removal pattern on the decomposition and removal layer, and a metal colloid solution is applied to the surface of the decomposition and removal layer on which the above decomposition and removal pattern is formed, thereby attaching the metal colloid solution in a pattern. Metallic colloid solution coating step and conductive pattern that solidifies the metal colloidal solution deposited in the above pattern to form a conductive pattern It is characterized in that it has a growth step.

According to the method for producing a conductive pattern forming body of the present embodiment, the decomposition and removal layer is irradiated with energy in a pattern, so that the decomposition and removal layer is decomposed and removed in a pattern by the action of the photocatalyst. Thus, it becomes possible to form a pattern having unevenness on the surface. It is possible to easily attach the metal colloid solution in a pattern by applying the metal colloid solution by an ink jet method or the like using the irregularities. In the decomposition and removal layer of this embodiment, it is preferable that the contact angle of the decomposition and removal layer with respect to the metal colloid solution is different from the contact angle of the substrate exposed by the decomposition and removal with respect to the metal colloid solution. This makes it possible to deposit the metal colloid solution in a pattern by utilizing not only the above-mentioned unevenness but also the difference in wettability.

In the method of manufacturing such a conductive pattern forming body, for example, as shown in FIG. 4, the photocatalyst treatment layer 11 is formed on the base material 1 (see FIG. 4A). Next, the decomposition removal layer 13 is formed on the photocatalyst processing layer 11 (FIG. 4).
(See (b)). As shown in FIG. 4C, a photomask 4 having a required pattern is arranged on the decomposition / removal layer 13, and ultraviolet light 5 is irradiated through the photomask 4. As a result, as shown in FIG. 4D, the decomposition and removal layer 13 is decomposed and removed in a pattern, and a decomposition and removal pattern composed of an area where the decomposition and removal layer 13 remains and an area where the photocatalyst processing layer 11 is exposed is formed. (Decomposition removal pattern forming step).

Next, a metal colloid solution is applied to the area where the photocatalyst treatment layer 11 is exposed to adhere the metal colloid solution only to the above area (metal colloid solution applying step) and solidify it. Thus, the conductive pattern 8 is formed to form the conductive pattern forming body 9 (see FIG. 4E, conductive pattern forming step).

Hereinafter, the method for manufacturing the conductive pattern forming body of the present embodiment will be described for each step.

(1) Pattern Forming Body Substrate Preparing Step First, the pattern forming body substrate preparing step in the present embodiment will be described. In the substrate for preparing a patterned body of the present embodiment, a substrate, a photocatalyst treatment layer formed on the substrate and containing at least a photocatalyst, and a photocatalyst formed on the photocatalyst treatment layer and accompanied by energy irradiation. Is a step of preparing a substrate for a pattern forming body, which comprises a decomposition and removal layer which is a layer that is decomposed and removed by the action of. Each configuration will be described below.

(Photocatalyst Treatment Layer) Since the photocatalyst treatment layer in this embodiment is the same as that described in the second embodiment, the description is omitted here.

(Decomposition / Removal Layer) Next, the decomposition / removal layer will be described. The decomposition removal layer used in the present embodiment is particularly limited as long as it is a layer in which the decomposition removal layer of the energy-irradiated portion is decomposed and removed by the action of the photocatalyst in the photocatalyst treatment layer when the energy irradiation is performed. Not a thing.

As described above, since the portion irradiated with energy is decomposed and removed by the action of the photocatalyst in the decomposition / removal layer, a pattern consisting of a portion with and without a decomposition / removal layer without performing a developing step or a washing step, A pattern having unevenness can be formed.

The decomposition / removal layer is oxidatively decomposed by the action of a photocatalyst due to energy irradiation and vaporized, so that it is removed without any special post-treatment such as a developing / washing process. A cleaning step or the like may be performed depending on the material of the removal layer.

The decomposition / removal layer used in the present embodiment not only forms irregularities, but the decomposition / removal layer has a higher contact angle with the metal colloid solution than the surface of the substrate. preferable. As a result, the region where the decomposition and removal layer is decomposed and removed and the base material is exposed can be made a lyophilic region, and the region where the decomposition and removal layer remains can be made a liquid repellent region, and various patterns can be formed. Is possible.

Here, in the decomposition / removal layer of this embodiment, that is, in the liquid repellent region, the contact angle with respect to the metal colloid solution is 50 ° or more, preferably 60 ° or more, and particularly 70 °.
The above is preferable. This is because the part which is not irradiated with energy is the part which is required to have liquid repellency in the present embodiment, and therefore when the contact angle with the liquid is small, the liquid repellency is not sufficient and the metal colloid solution This is because when the metal colloid solution is applied to the entire surface in the applying step, the metal colloid solution may remain in the region where the conductive pattern is not formed, which is not preferable.

In the above-mentioned base material, that is, the lyophilic region, the contact angle with the metal colloid solution is preferably 40 ° or less, preferably 30 ° or less, and particularly preferably 20 ° or less. If the contact angle with the metal colloid solution in the area irradiated with energy, that is, the lyophilic area is high, the metal colloid solution may be repelled even in the lyophilic area when the metal colloid solution is applied over the entire surface. Therefore, it may be difficult to pattern the metal colloid solution on the lyophilic region. Here, the contact angle with the liquid is a value measured by the method described in the first embodiment.

Specific examples of the film that can be used for the decomposition / removal layer of the present embodiment include films made of a fluorine-based or hydrocarbon-based resin having liquid repellency. The fluorine-based or hydrocarbon-based resin is not particularly limited as long as it has liquid repellency, and these resins are dissolved in a solvent and, for example, a general method such as spin coating is used. It can be formed by a film method.

Further, in this embodiment, by using a functional thin film, that is, a self-assembled monolayer film, a Langmuir-Brocket film, an alternate adsorption film, etc.,
Since it is possible to form a film having no defects, it can be said that it is more preferable to use such a film forming method.

Here, the self-assembled monolayer, Langmuir-Brockett film, and alternate adsorption film used in this embodiment will be specifically described.

(I) Self-Assembled Monolayer Although the inventors do not know the existence of a formal definition of a self-assembled monolayer, it is generally recognized as a self-assembled monolayer. For example, see the review article “Formation and Structu” by Abraham Ulman.
re of Self-Assembled Monolayers ”, Chemical Revie
w, 96, 1533-1554 (1996) are excellent. With reference to this review, it can be said that a self-assembled monolayer is a monolayer formed as a result of adsorption / bonding (self-assembly) of appropriate molecules to an appropriate substrate surface. Examples of materials capable of forming a self-assembled film include surfactant molecules such as fatty acids, organic silicon molecules such as alkyltrichlorosilanes and alkylalkoxides, organic sulfur molecules such as alkanethiols, and alkylphosphates. Examples of organic phosphoric acid molecules include The general commonality of molecular structures is
That is, it has a relatively long alkyl chain and has a functional group that interacts with the surface of the substrate at one end of the molecule. The portion of the alkyl chain is a source of intermolecular force when the molecules are packed two-dimensionally. However, the example shown here has the simplest structure and has a functional group such as an amino group or a carboxyl group at the other end of the molecule, an alkylene chain portion of which is an oxyethylene chain, or a fluorocarbon chain. , A self-assembled monolayer composed of various molecules such as those of a complex type chain has been reported.
There is also a composite type self-assembled monolayer composed of multiple molecular species. In addition, recently, a polymer such as a dendrimer having a plurality of functional groups (there may be one functional group) or a linear polymer (which may have a branched structure) has been used. It seems that the one formed on the surface of the substrate (the latter is generally called a polymer brush) may be considered as a self-assembled monolayer. In this embodiment,
These are also included in the self-assembled monolayer.

(Ii) Langmuir-Blodgett film Langmuir-Blodgett film used in the present embodiment
The (Langmuir-Blodgett Film) is not so different from the above-described self-assembled monolayer in terms of morphology once formed on the substrate. It can be said that the Langmuir-Blodgett film is characterized by its formation method and a high degree of two-dimensional molecular packing property (high orientation, high ordering property) resulting therefrom. That is,
Generally, the Langmuir-Blodgett film-forming molecules are first spread on the gas-liquid interface, and the spread film is condensed by the trough and converted into a highly packed condensed film. In practice, it is transferred to a suitable base material and used. It is possible to form from a monomolecular film to a multilayer film of an arbitrary molecular layer by the method outlined here. Further, not only low molecular weight compounds but also high molecular weight materials, colloidal particles and the like can be used as the film material. Regarding the recent cases of applying various materials, a review by Tokuharu Miyashita et al. “Prospects for nanotechnology in the creation of soft nanodevices” Polymer 50 September 644-647 (20
01).

(Iii) Alternate Adsorption Film An alternate adsorption film (Layer-by-Layer Self-Assembled Film) is
Generally, it is a film formed by sequentially adsorbing / bonding materials having at least two functional groups having positive or negative charges on a base material and stacking them. Materials having a large number of functional groups have more advantages such as increased strength and durability of the film, and therefore, ionic polymers (polymer electrolytes) are often used as materials recently. Particles having a surface charge such as proteins, metals and oxides, so-called "colloidal particles" are also frequently used as film-forming substances. More recently, membranes that positively utilize interactions weaker than ionic bonds such as hydrogen bonds, coordination bonds, and hydrophobic interactions have also been reported. For the case of the relatively recent alternating adsorption film,
Although it is slightly biased toward material systems that use electrostatic interaction as a driving force, a review by Paula T. Hammond “Recent Explorations
in Electrostatic Multilayer Thin Film Assembly ”Cu
rrent Opinion in Colloid & Interface Science, 4, 4
Details on 30-442 (2000). Taking the simplest process as an example, the alternating adsorption film is obtained by repeating a cycle of adsorption of a material having a positive (negative) charge-cleaning-adsorption of a material having a negative (positive) charge-cleaning a predetermined number of times. This is the film that is formed. No development-condensation-transfer operations are required as with Langmuir-Blodgett membranes. Also, as is clear from the difference in these manufacturing methods, the alternating adsorption film has a two-dimensional high orientation property like the Langmuir-Blodgett film.
There is generally no high order. However, the alternate adsorption film and its manufacturing method have advantages that conventional film forming methods do not have, such as easily forming a dense film with no defects, and forming a film uniformly on minute uneven surfaces, tube inner surfaces, spherical surfaces, etc. Have many.

The film thickness of the decomposition / removal layer is not particularly limited as long as it is a film thickness that can be decomposed and removed by the energy applied in the energy irradiation step described later. The specific film thickness varies greatly depending on the type of energy to be irradiated, the material of the decomposition and removal layer, etc., but generally 0.001 μm to 1 μm
It is preferable to be within the range of 0.01 μm to 0.1 μm.

(2) Disassembly / removal pattern forming step Next, the disassembly / removal pattern forming step of this embodiment will be described. In the step of forming the decomposition-removal pattern of the present embodiment, the decomposition-removal layer is decomposed and removed on the surface of the decomposition-removal layer by irradiating the decomposition-removal layer with energy in a pattern from a predetermined direction. It is a process of forming. In this disassembly and removal pattern forming process,
The energy, the energy irradiation method, and the like are the same as those in the wettability pattern forming step of the first embodiment described above, and thus the description thereof is omitted here.

(3) Metal Colloid Solution Coating Step Next, the metal colloid solution coating step will be described. The metal colloid solution coating step of this embodiment is a step of attaching the metal colloid solution to the decomposition / removal pattern formed by the above-described decomposition / removal pattern forming step.

The metal colloid solution, the coating method, and the like in the metal colloid solution coating step of this embodiment are the same as those of the above-described first embodiment metal colloid solution coating step, and therefore description thereof is omitted here.

When the difference between the contact angle of the decomposition and removal layer with respect to the metal colloid solution and the contact angle of the photocatalyst treatment layer with respect to the metal colloid solution is small, the metal colloid solution coating step is performed in a pattern such as a nozzle discharge method. It is preferable to perform the method by applying a metal colloid solution to

(4) Conductive Pattern Forming Step Next, the conductive pattern forming step of solidifying the metal colloid solution adhered in a pattern is performed by the above-mentioned metal colloid solution step. Since the method of solidifying the metal colloid solution in this conductive pattern forming step is the same as that of the conductive pattern forming step of the first embodiment described above, the description thereof is omitted here.

(5) Non-image area removing step In this embodiment, a non-image area removing step of removing the non-conductive pattern area where the conductive pattern is not formed is performed after the above-described conductive pattern forming step. You may have. When the above-mentioned decomposition and removal layer is conductive, even if it has a conductive pattern, it is difficult to form a conductive pattern forming body, so by removing the remaining decomposition and removal layer, The light color catalyst treatment layer is exposed to form a conductive pattern forming body. In addition, the non-image area removing step in the present embodiment may be a step of removing the decomposition removing layer and the photocatalyst processing layer when the decomposition removing layer and the photocatalyst processing layer are conductive materials.

The non-image area removing step in this embodiment is also the same as the non-image area removing step in the first embodiment described above, and therefore the description thereof is omitted here.

(6) Others In the present embodiment, the conductive pattern forming body may be further electroplated to increase the thickness of the conductive pattern. By doing so, it is possible to reduce the resistance of the conductive pattern, and at the same time, it is possible to improve the adhesion strength of the conductive pattern to the photocatalyst treatment layer, and to obtain a high-quality, high-definition wiring board. Because you can

Further, in the present embodiment, a protective layer may be formed on the obtained conductive pattern for the purpose of improving the adhesion of the obtained conductive pattern to the photocatalyst treatment layer.

B. Pattern Formed Body Next, the pattern formed body of the present invention will be described. The pattern formed body of the present invention has six embodiments. Less than,
Each pattern forming body will be described.

1. First Embodiment First, a first embodiment of the pattern forming body of the present invention will be described. The first embodiment of the pattern-formed body of the present invention is
A substrate, a photocatalyst containing layer containing at least a photocatalyst and a binder, which is a layer in which the wettability of an energy-irradiated portion formed on the substrate changes in a direction in which the contact angle of a liquid decreases, and the photocatalyst containing And a metal composition formed by solidifying a metal colloid solution in a pattern on the layer.

Since the conductive pattern forming body of this embodiment has the photocatalyst-containing layer, it becomes possible to easily form a conductive pattern by utilizing the difference in wettability in a small number of steps, and the cost can be reduced. It is possible to obtain a transparent conductive pattern forming body.

Further, in the case of this embodiment, since the conductive pattern is formed on the photocatalyst containing layer, the electric resistance of the photocatalyst containing layer is 1 × 10 ⁸ Ω · cm to 1 × 10 ¹⁸ Ω.
・ Cm, especially 1 × 10 ¹² Ω · cm to 1 × 10 ¹⁸ Ω
It is preferably within the range of cm. This makes it possible to obtain an excellent conductive pattern forming body.

Such a conductive pattern forming body of the present embodiment has a base material 1, a photocatalyst containing layer 2 formed on the base material 1, and a photocatalyst containing layer 2 as shown in FIG. 5, for example. And a conductive pattern 8 formed in a pattern thereon.

A photocatalyst-containing layer used in the present embodiment,
For the base material, the metal colloid solution, the conductive pattern forming method, etc., refer to the above-mentioned “A. Method for manufacturing conductive pattern forming body”.
Since the one described in the first embodiment can be used, the description thereof will be omitted here.

2. Second Embodiment Next, a second embodiment of the conductive pattern forming body of the present invention will be described. A second embodiment of the conductive pattern forming body of the present invention is a base material, and a layer formed in a pattern on the base material, in which the wettability of the energy-irradiated portion changes in the direction in which the contact angle of the liquid decreases. And a photocatalyst containing layer containing at least a photocatalyst and a binder, and a metal composition formed by solidifying a metal colloid solution on the photocatalyst containing layer.

Since the conductive pattern forming body of the present embodiment has the photocatalyst containing layer, the conductive pattern can be easily formed by utilizing the difference in wettability, and the conductive pattern can be manufactured at low cost. It becomes possible to form it. Further, according to the present embodiment, the photocatalyst-containing layer is
Due to the pattern formation, the base material is exposed in the region where the conductive pattern is not formed. Accordingly, even when the photocatalyst-containing layer has relatively conductivity, it becomes possible to form a conductive pattern forming body. In this case, the electric resistance of the substrate is 1 × 10 ⁸
Ω · cm to 1 × 10 ¹⁸ Ω · cm, especially 1 × 10 ¹²
It is preferably in the range of Ω · cm to 1 × 10 ¹⁸ Ω · cm. This makes it possible to obtain an excellent conductive pattern forming body.

In this embodiment, as shown in FIG. 6, for example, a base material 1, a photocatalyst containing layer 2 formed in a pattern on the base material 1, and a photocatalyst containing layer 2 are formed. And the conductive pattern 8 is formed.

A photocatalyst-containing layer used in the present embodiment,
For the base material, the metal colloid solution, the conductive pattern forming method, etc., refer to the above-mentioned “A. Method for manufacturing conductive pattern forming body”.
Since the one described in the first embodiment can be used, the description thereof will be omitted here.

3. Third Embodiment Next, a third embodiment of the conductive pattern forming body of the present invention will be described. The third embodiment of the conductive pattern forming body of the present invention, a substrate, a photocatalyst treatment layer containing at least a photocatalyst on the substrate, the photocatalyst treatment layer, the wettability of the energy irradiation portion is a liquid. And a metal composition formed by solidifying a metal colloid solution in a pattern on the wettability changing layer, and a wettability changing layer that changes in a direction in which the contact angle decreases. is there.

Since the conductive pattern forming body of this embodiment has the above-mentioned wettability changing layer, it is possible to easily attach the metal colloid solution in a pattern with high precision by utilizing the difference in lyophilicity. It will be possible. Further, since the photocatalyst treatment layer and the conductive pattern do not come into direct contact with each other, the conductive pattern is less likely to be affected by the photocatalyst over time, so that a high-quality conductive pattern forming body can be obtained. is there.

In the case of this embodiment, since the conductive pattern is formed on the wettability changing layer, the electric resistance of the wettability changing layer is 1 × 10 ⁸ Ω · cm to 1 × 10 ¹⁸ Ω.
・ Cm, especially 1 × 10 ¹² Ω · cm to 1 × 10 ¹⁸ Ω
It is preferably within the range of cm. This makes it possible to obtain an excellent conductive pattern forming body.

Such a conductive pattern forming body of the present embodiment has a base material 1, a photocatalyst processing layer 11 formed on the base material 1, and the photocatalyst processing layer 11 as shown in FIG. 7, for example. The wettability changing layer 12 is formed on the upper surface, and the conductive pattern 8 is formed on the wettability changing layer 12 in a pattern.

A photocatalyst treatment layer used in the present embodiment,
As the wettability changing layer, the base material, the metal colloid solution, the conductive pattern forming method and the like, those described in the second embodiment in the above-mentioned “A. Method for producing conductive pattern forming body” can be used. Therefore, the description is omitted here.

4. Fourth Embodiment Next, a fourth embodiment of the conductive pattern forming body of the present invention will be described. The conductive pattern forming body of the present embodiment is a substrate, a photocatalyst treatment layer containing at least a photocatalyst on the substrate, and a pattern formed on the photocatalyst treatment layer, the wettability of the energy irradiation portion. Has a wettability changing layer that changes in a direction in which the contact angle of the liquid decreases, and a metal composition formed by solidifying a metal colloid solution on the wettability changing layer. .

According to this embodiment, since the wettability changing layer is provided, it is possible to easily deposit the metal colloid solution in a pattern with high precision by utilizing the difference in lyophilicity. Further, since the photocatalyst treatment layer and the conductive pattern do not come into direct contact with each other, the conductive pattern is less likely to be affected by the photocatalyst over time, so that a high-quality conductive pattern forming body can be obtained. is there.

Further, according to this embodiment, the wettability changing layer is formed in a pattern, so that the photocatalyst treatment layer is exposed in the region where the conductive pattern is not formed. Thereby, even when the wettability changing layer has a relatively conductive property, it becomes possible to form a conductive pattern forming body. In this case, the electric resistance of the photocatalyst treatment layer is 1 × 10 ⁸ Ω · cm to 1 × 10 ¹⁸ Ω · c.
m, among them ^{1 × 10 1 2 Ω · cm~1} × 10 18 Ω · c
It is preferably within the range of m. This makes it possible to obtain an excellent conductive pattern forming body.

As shown in FIG. 8, the conductive pattern forming body of this embodiment has a base material 1, a photocatalyst processing layer 11 formed on the base material 1, and a photocatalyst processing layer 11.
The wettability changing layer 12 is formed on the upper surface in a pattern and the conductive pattern 8 is formed on the wettability changing layer 12 formed on the pattern.

A photocatalyst treatment layer used in this embodiment,
As the wettability changing layer, the base material, the metal colloid solution, the conductive pattern forming method and the like, those described in the second embodiment in the above-mentioned “A. Method for producing conductive pattern forming body” can be used. Therefore, the description is omitted here.

5. Fifth Embodiment Next, a fifth embodiment of the conductive pattern forming body of the present invention will be described. The conductive pattern forming body of the present embodiment is a base material, a photocatalyst treatment layer containing at least a photocatalyst, which is formed in a pattern on the base material, and an energy irradiation portion formed on the photocatalyst treatment layer. The wettability changing layer whose wettability changes in the direction of decreasing the contact angle of the liquid, and the metal composition formed by solidifying the metal colloid solution on the wettability changing layer. It is a thing.

According to this embodiment, the wettability changing layer is
By having the advantage of easily utilizing the difference in lyophilicity, the metal
It is possible to deposit a colloidal solution in a pattern with high precision.
It will be possible. In addition, the photocatalyst treatment layer and the conductive pattern
The conductive pattern is not
High-quality conductivity
Therefore, it is possible to obtain a sex pattern forming body. It
In addition, the conductive pattern forming body of the present embodiment is
The medium treatment layer is formed in a pattern on the base material, and
A wettability changing layer is formed on the catalyst treatment layer. further
A conductive pattern is formed on the wettability changing layer
Therefore, the part where the conductive pattern is not formed is
The substrate is exposed. Thereby, the photocatalyst treatment layer and
When the wettability changing layer is made of a conductive material,
Even if it is a combination, it can be a conductive pattern forming body
It becomes. In this case, the electric resistance of the substrate is 1 × 1
0 ⁸Ω · cm ~ 1 x 10¹⁸Ω · cm, especially 1 × 10
¹²Ω · cm ~ 1 x 10^{1 8}Be within the range of Ω · cm
And are preferred. This enables excellent conductive pattern formation
This is because the body can be used.

Such a conductive pattern forming body of this embodiment has a substrate 1, a photocatalyst treatment layer 11 formed in a pattern on the substrate 1, and a photocatalyst as shown in FIG. 9, for example. Wettability change layer 12 formed on treatment layer 11
And a conductive pattern 8 formed on the wettability changing layer 12.

A photocatalyst treatment layer used in this embodiment,
As the wettability changing layer, the base material, the metal colloid solution, the conductive pattern forming method and the like, those described in the second embodiment in the above-mentioned “A. Method for producing conductive pattern forming body” can be used. Therefore, the description is omitted here.

6. Sixth Embodiment Next, a sixth embodiment of the conductive pattern forming body of the present invention will be described. A sixth embodiment of the conductive pattern formed body of the present invention, a substrate, a photocatalyst treatment layer containing at least a photocatalyst on the substrate, on the photocatalyst treatment layer, by the action of the photocatalyst accompanying the energy irradiation. A decomposition removal layer which is a layer to be decomposed and removed; and a metal composition formed by solidifying a metal colloid solution in a pattern on the decomposition and removal photocatalyst treatment layer. To do.

Since the conductive pattern forming body of the present embodiment has the above-mentioned decomposition / removal layer, the metal colloid solution can be easily attached in a pattern form by utilizing the unevenness of the surface, for example, by the inkjet method or the like. It will be possible. In the decomposition and removal layer of this embodiment, it is preferable that the contact angle of the decomposition and removal layer with respect to the metal colloid solution is different from the contact angle of the substrate exposed by the decomposition and removal with respect to the metal colloid solution. This makes it possible to attach the metal colloidal solution in a pattern by utilizing not only the above-mentioned unevenness but also the difference in wettability, whereby a pattern-formed body can be easily obtained.

Further, in the case of this embodiment, since the conductive pattern is formed on the photocatalyst processing layer, the electric resistance of the photocatalyst processing layer is from 1 × 10 ⁸ Ω · cm to 1 × 10 ¹⁸ Ω.
・ Cm, especially 1 × 10 ¹² Ω · cm to 1 × 10 ¹⁸ Ω
It is preferably within the range of cm.

Further, since the decomposition / removal layer is present around the conductive pattern, the electric resistance of the decomposition / removal layer is from 1 × 10 ⁸ Ω · cm to 1 × 10 ¹⁸ Ω · cm, especially 1 It is preferably in the range of × 10 ¹² Ω · cm to 1 × 10 ¹⁸ Ω · cm. This makes it possible to obtain an excellent conductive pattern forming body.

The decomposition / removal layer of this embodiment is, for example, as shown in FIG.
As shown in FIG. 3, the photocatalyst processing layer 11 is formed on the base material 1, and the decomposition and removal layer 13 is formed on the photocatalyst processing layer 11. The decomposition and removal layer 13 is decomposed and removed. The conductive pattern 8 is formed on the surface 11.

A photocatalyst treatment layer used in the present embodiment,
As the decomposition / removal layer, the base material, the metal colloid solution, the conductive pattern forming method and the like, those described in the third embodiment in the above-mentioned “A. Method for manufacturing a conductive pattern forming body” can be used. The description here is omitted.

The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, has substantially the same configuration as the technical idea described in the scope of the claims of the present invention, and has any similar effect to the present invention. It is included in the technical scope of the invention.

[0216]

EXAMPLES The present invention will be described in more detail below with reference to examples.

[Example 1] 0.4 g of MF-160E (trade name, manufactured by Tochem Products Co., Ltd.) containing fluoroalkylsilane as a main component in 30 g of isopropyl alcohol and trimethoxymethylsilane (manufactured by Toshiba Silicone Co., Ltd.) Product name TSL811
3) STS, an aqueous dispersion of 3g and titanium dioxide as a photocatalyst
-01 (product name, manufactured by Ishihara Sangyo Co., Ltd.)
The mixture was stirred at 0 ° C for 20 minutes to obtain a photocatalyst-containing layer forming composition.

The above composition was applied onto a soda lime glass by a spin coater and dried at 120 ° C. for 10 minutes to form a photocatalyst containing layer having a thickness of 0.2 μm.

100 μm line & space photoma
Exposure (365nm 500mJ / cm ²) And contains photocatalyst
A lyophilic region was formed on the layer surface.

The contact angle to the silver colloid aqueous solution (concentration 20 wt%) in the unexposed area, that is, the liquid repellent area was 72 °.
And the contact angle in the exposed part, that is, the lyophilic region was 9 °.

[0221] The above substrate was used as an aqueous silver colloid solution (concentration: 20 wt
%) And pulled up at 10 mm / sec., The silver colloid aqueous solution was adhered in a pattern only on the lyophilic region. The pattern of this silver colloid solution is 300
By heating at 0 ° C. for 20 minutes, a conductive pattern forming body in which silver was patterned on the substrate was obtained.

Example 2 0.4 g of MF-160E (trade name, manufactured by Tochem Products Co., Ltd.) whose main component is fluoroalkylsilane in 30 g of isopropyl alcohol and trimethoxymethylsilane (manufactured by Toshiba Silicone Co., Ltd.) Product name TSL811
3) STS, an aqueous dispersion of 3g and titanium dioxide as a photocatalyst
-01 (product name, manufactured by Ishihara Sangyo Co., Ltd.)
The mixture was stirred at 0 ° C for 20 minutes to obtain a photocatalyst-containing layer forming composition.

The above composition was applied onto a soda lime glass by a spin coater and dried at 120 ° C. for 10 minutes to form a photocatalyst containing layer having a thickness of 0.2 μm.

100 μm line & space photoma
Exposure using a mask (365nm 300mJ / cm ²) And contains photocatalyst
A lyophilic region was formed on the layer surface.

The contact angle to the silver colloid aqueous solution (concentration 20 wt%) in the unexposed area, that is, the liquid repellent area was 72 °.
And the contact angle in the exposed portion, that is, the lyophilic region was 30 °.

A silver colloid aqueous solution (concentration: 20 wt.
%) And pulled up at 10 mm / sec., The silver colloid aqueous solution was adhered in a pattern only on the lyophilic region. The pattern of this silver colloid solution is 300
By heating at 0 ° C. for 20 minutes, a conductive pattern forming body in which silver was patterned on the substrate was obtained.

[Example 3] A photocatalyst-containing layer was formed in the same manner as in Example 1 and exposed in a pattern to give a photocatalyst-containing layer.
A lyophilic region was formed on the surface of the photocatalyst containing layer.

The contact angle with respect to the silver colloid aqueous solution (concentration 50 wt%) in the unexposed area, that is, the liquid repellent area was 78 °.
And the contact angle in the exposed part, that is, the lyophilic region was 11 °.

An aqueous solution of silver colloid (concentration: 50 wt.
%) And pulled up at 10 mm / sec., The silver colloid aqueous solution was adhered in a pattern only on the lyophilic region. The pattern of this silver colloid solution is 300
By heating at 0 ° C. for 20 minutes, a conductive pattern forming body in which silver was patterned on the substrate was obtained.

[Comparative Example 1] 30 g of isopropyl alcohol
Fluoroalkylsilane-based MF-160E (trade name, manufactured by Tochem Products Co., Ltd.) and trimethoxymethylsilane (trade name, TSL8 manufactured by Toshiba Silicone Co., Ltd.)
113) S, which is an aqueous dispersion of 3 g and titanium dioxide as a photocatalyst
Mix with TS-01 (trade name, Ishihara Sangyo Co., Ltd.) 20g to give 10
The mixture was stirred at 0 ° C for 20 minutes to obtain a photocatalyst-containing layer forming composition.

The above composition was applied onto a soda lime glass by a spin coater and dried at 120 ° C. for 10 minutes to form a photocatalyst containing layer having a thickness of 0.2 μm.

100 μm line & space photoma
Exposure using a mask (365nm 100mJ / cm ²) And contains photocatalyst
A lyophilic region was formed on the layer surface.

The contact angle to the silver colloid aqueous solution (concentration 20 wt%) in the unexposed area, that is, the liquid repellent area was 72 °.
And the contact angle in the exposed portion, that is, the lyophilic region was 47 °.

A silver colloid solution (concentration: 20 wt.
%) And pulled up at 10 mm / sec., But the silver colloid aqueous solution was repelled over the entire surface including the lyophilic region,
It was not possible to obtain a conductive pattern forming body.

[Comparative Example 2] Isopropyl alcohol 30
trimethoxymethylsilane (Toshiba Silicone Co., Ltd.)
STS-01 (trade name, manufactured by Ishihara Sangyo Co., Ltd.), which is an aqueous dispersion of titanium dioxide as a photocatalyst
20 g was mixed and stirred at 100 ° C. for 20 minutes to obtain a photocatalyst-containing layer forming composition containing no fluorine.

The above composition was applied onto a soda lime glass by a spin coater and dried at 120 ° C. for 10 minutes to form a photocatalyst containing layer having a thickness of 0.2 μm.

100 μm line & space photoma
Exposure (365nm 500mJ / cm ²) And contains photocatalyst
A lyophilic region was formed on the layer surface.

The contact angle to the silver colloid aqueous solution (concentration 20 wt%) in the unexposed area, that is, the liquid repellent area was 45 °.
And the contact angle in the exposed portion, that is, the lyophilic region was 10 °.

An aqueous solution of silver colloid (concentration: 20 wt.
%) And pulled up at 10 mm / sec. However, the entire surface including the liquid repellent region was coated with the aqueous silver colloid solution, and the conductive pattern forming body could not be obtained.

[Example 4] A photocatalyst-containing layer was formed in the same manner as in Example 1, and after patternwise exposure, a conductive pattern was formed with a silver colloid solution to obtain a conductive pattern-formed body. . Next, the substrate on which the conductive pattern was formed was dipped in an alkaline aqueous solution containing PH13 as a main component for 2 minutes, and then rinsed with water for 5 minutes to remove the non-image area.

[Example 5] 30 g of isopropyl alcohol
And 3 g of trimethoxymethylsilane (GE Toshiba Silicone Co., Ltd., TSL8113) and 20 g of ST-K03 (manufactured by Ishihara Sangyo Co., Ltd.), which is a photocatalytic inorganic coating agent.
And were mixed and stirred at 100 ° C. for 20 minutes. This was diluted 3 times with isopropyl alcohol to obtain a photocatalyst treatment layer composition.

The above photocatalyst treatment layer composition was applied onto a glass substrate by a spin coater and dried at 150 ° C. for 10 minutes to form a transparent photocatalyst treatment layer (thickness 0.15 μm).

Next, 2 g of Iupilon Z400 (manufactured by Mitsubishi Gas Chemical Co., Inc.) containing polycarbonate as a main component was dissolved in 30 g of dichloromethane and 70 g of 1,1,2-trichloroethane to obtain a composition for a decomposition layer removing layer. The composition for decomposition and removal layer is applied onto the photocatalyst treatment layer by a spin coater and dried at 100 ° C. for 60 minutes to form a transparent decomposition and removal layer (thickness 0.01 μm),
A substrate for a pattern forming body was obtained.

Next, the substrate for pattern formation body is treated with 10
Exposure with a high-pressure mercury lamp using a photomask with a line and space of 0 μm (365 nm 500 mJ / cm
² ) Then, the decomposition removal layer was decomposed and removed to form a lyophilic region in a pattern.

At this time, the contact angle between the unexposed area and the lyophilic area and the silver colloid solution (concentration 20%) was measured using a contact angle measuring instrument (CA-Z type manufactured by Kyowa Interface Science Co., Ltd.) ( Droplets were dropped from a microsyringe and 30 seconds later), the results were 65 ° and 6 °, respectively.

Next, using an ink jet device, a silver colloid solution (concentration 20%) was attached to the lyophilic region,
This was treated at 300 ° C. for 60 minutes to be cured.

[Example 6] 30 g of isopropyl alcohol
And 3 g of trimethoxymethylsilane (GE Toshiba Silicone Co., Ltd., TSL8113) and 20 g of ST-K03 (manufactured by Ishihara Sangyo Co., Ltd.), which is a photocatalytic inorganic coating agent.
And were mixed and stirred at 100 ° C. for 20 minutes. This was diluted 3 times with isopropyl alcohol to obtain a photocatalyst treatment layer composition.

The photocatalyst treatment layer composition was applied onto a glass substrate by a spin coater and dried at 150 ° C. for 10 minutes to form a transparent photocatalyst treatment layer (thickness 0.15 μm).

Next, 30 g of isopropyl alcohol, fluoroalkylsilane (GE Toshiba Silicone Co., Ltd.) and tetramethoxysilane (GE Toshiba Silicone Co., Ltd.) 3
g and 0.5 g of 0.5 N hydrochloric acid were mixed and stirred for 8 hours. This was diluted 100 times with isopropyl alcohol to obtain a wettability changing layer composition.

The composition for wettability changing layer was applied onto the photocatalyst-treated layer by a spin coater, and the composition was applied at 150 ° C. for 1 hour.
By performing a drying treatment for 0 minutes, a transparent wettability changing layer (thickness 0.1 μm) was formed to obtain a substrate for a pattern forming body.

Next, this pattern forming substrate is used for 10 times.
Exposure with a high-pressure mercury lamp using a photomask with a line and space of 0 μm (365 nm 500 mJ / cm
² ) Then, the lyophilic region was formed in a pattern.

At this time, the contact angle between the unexposed area and the lyophilic area and the silver colloid solution (concentration 20%) was measured using a contact angle measuring instrument (CA-Z type manufactured by Kyowa Interface Science Co., Ltd.) ( As a result of dropping a droplet from a microsyringe for 30 seconds), the results were 80 ° and 8 °, respectively.

Next, using an ink jet device, a silver colloid solution (concentration 20%) was made to adhere to the lyophilic region,
This was treated at 300 ° C. for 60 minutes to be cured.

Next, the substrate on which the conductive pattern is formed is immersed in an alkaline aqueous solution containing PH13 as a main component for 5 minutes, and then rinsed with water for 5 minutes to change the wettability of the non-image area. The layer and the photocatalyst treated layer were removed.

[0255]

According to the present invention, the metal colloid solution can be easily formed in a pattern on the photocatalyst-containing layer by performing a treatment for depositing the metal colloid solution on the entire surface by using, for example, a dip coating method. When it is solidified, a highly precise conductive pattern can be obtained. Therefore, since a highly precise conductive pattern can be formed with high precision by a simple process, it is possible to form a highly precise conductive pattern at low cost.

[Brief description of drawings]

FIG. 1 is a process drawing showing an example of a method for manufacturing a conductive pattern forming body of the present invention.

FIG. 2 is a process drawing showing an example of a non-image area removing process of the method for manufacturing a conductive pattern forming body of the present invention.

FIG. 3 is a process drawing showing another example of the method for manufacturing a conductive pattern forming body of the present invention.

FIG. 4 is a process drawing showing another example of the method for manufacturing a conductive pattern forming body of the present invention.

FIG. 5 is a schematic cross-sectional view showing an example of a conductive pattern forming body of the present invention.

FIG. 6 is a schematic cross-sectional view showing another example of the conductive pattern forming body of the present invention.

FIG. 7 is a schematic cross-sectional view showing another example of the conductive pattern forming body of the present invention.

FIG. 8 is a schematic cross-sectional view showing another example of the conductive pattern forming body of the present invention.

FIG. 9 is a schematic cross-sectional view showing another example of the conductive pattern forming body of the present invention.

FIG. 10 is a schematic cross-sectional view showing another example of the conductive pattern forming body of the present invention.

[Explanation of symbols]

1 ... Base material 2 ... Photocatalyst containing layer 3 ... Substrate for pattern forming body 6 ... lyophilic region 7 ... Liquid repellent area 9 ... Conductive pattern forming body 10 ... Non-image area 11 ... Photocatalyst treatment layer 12 ... Wettability change layer 13 ... Decomposition / removal layer

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 2H097 FA05 FA06 FA10 LA09 LA20                 4K022 AA01 AA42 BA15 BA22 BA33                       CA03 CA22 DA06                 5E343 AA02 BB23 BB25 BB60 BB72                       CC22 CC32 CC54 CC56 CC76                       DD02 ER35 ER47 GG08

Claims (38)

[Claims] 1. A pattern formation comprising a base material and a photocatalyst-containing layer formed on the base material, having a photocatalyst and a binder, and having a wettability of an energy-irradiated portion changed in a direction in which a contact angle of a liquid decreases. Pattern forming body substrate preparing step for preparing a body substrate, by irradiating the photocatalyst-containing layer with energy in a pattern, to wet the photocatalyst-containing layer consisting of a liquid-repellent region and a lyophilic region Pattern forming step of forming a wettability pattern, the photocatalyst-containing layer surface on which the wettability pattern is formed,
A metal colloid solution applying step of applying the metal colloid solution only to the lyophilic region by applying the metal colloid solution, and a conductive pattern by solidifying the metal colloid solution attached to the lyophilic region of the wettability pattern. And a step of forming a conductive pattern. 2. The photocatalyst-containing layer comprises a decomposing substance that is decomposed by the action of a photocatalyst by energy irradiation, thereby changing the wettability on the photocatalyst-containing layer. 1. A method for manufacturing a conductive pattern forming body according to claim 1. 3. The photocatalyst-containing layer contains fluorine, and when the photocatalyst-containing layer is irradiated with energy, the content of fluorine on the surface of the photocatalyst-containing layer is reduced by the action of the photocatalyst as compared with that before the energy irradiation. The method for producing a conductive pattern forming body according to claim 1 or 2, wherein the photocatalyst-containing layer is formed as described above. 4. The photocatalyst-containing layer is irradiated with energy, and the fluorine content in the portion where the fluorine content is reduced is 10 or less when the fluorine content in the portion not irradiated with energy is 100. It exists, The manufacturing method of the electrically conductive pattern formation body of Claim 3 characterized by the above-mentioned. 5. The contact angle with respect to the metal colloid solution on the photocatalyst containing layer is 50 ° or more in a portion not irradiated with energy, and 40 ° or less in an irradiated portion. The method for producing a conductive pattern forming body according to any one of claims 1 to 4. 6. The method for producing a conductive pattern forming body according to claim 1, wherein the binder is a layer containing an organopolysiloxane. 7. The method for producing a conductive pattern forming body according to claim 6, wherein the organopolysiloxane is a polysiloxane containing a fluoroalkyl group. 8. The organopolysiloxane is Y _n S
iX _(4-n) (wherein Y represents an alkyl group, a fluoroalkyl group, a vinyl group, an amino group, a phenyl group or an epoxy group, X represents an alkoxyl group or a halogen, and n is an integer from 0 to 3. 8. The electroconductivity according to claim 6 or 7, which is an organopolysiloxane which is a hydrolyzed condensate or a co-hydrolyzed condensate of one or more silicon compounds represented by the formula (1). Of manufacturing a patterned product. 9. A base material, a photocatalyst treatment layer formed on the base material and containing at least a photocatalyst, and a photocatalyst treatment layer formed on the photocatalyst treatment layer. Pattern forming body substrate preparing step of preparing a substrate for a pattern forming body consisting of a wettability changing layer that is a layer that changes in a direction, and by irradiating the wettability changing layer with energy in a pattern, the wetting A wettability pattern forming step of forming a wettability pattern consisting of a liquid repellent region and a lyophilic region on the property change layer, and the wettability change layer surface on which the wettability pattern is formed,
A metal colloid solution applying step of applying the metal colloid solution only to the lyophilic region by applying the metal colloid solution, and a conductive pattern by solidifying the metal colloid solution attached to the lyophilic region of the wettability pattern. And a step of forming a conductive pattern. 10. The contact angle with respect to the metal colloid solution on the wettability changing layer is 50 ° or more in a portion not irradiated with energy and 40 ° or less in an irradiated portion. Item 10. A method for producing a conductive pattern forming body according to item 9. 11. The wettability changing layer is a layer containing an organopolysiloxane.
Alternatively, the method for manufacturing a conductive pattern forming body according to claim 10. 12. The method for manufacturing a conductive pattern forming body according to claim 11, wherein the organopolysiloxane is a polysiloxane containing a fluoroalkyl group. 13. The organopolysiloxane is Y _n
SiX _(4-n) (wherein Y represents an alkyl group, a fluoroalkyl group, a vinyl group, an amino group, a phenyl group or an epoxy group, X represents an alkoxyl group or a halogen, and n is an integer from 0 to 3. 13. The electroconductivity according to claim 11 or 12, which is an organopolysiloxane which is a hydrolysis-condensation product or a co-hydrolysis-condensation product of one or more silicon compounds represented by the formula (1). Of manufacturing a patterned product. 14. A base material, a photocatalyst treatment layer formed on the base material and containing at least a photocatalyst, and a layer formed on the photocatalyst treatment layer and decomposed and removed by the action of the photocatalyst accompanying energy irradiation. A pattern forming body substrate preparing step of preparing a substrate for a pattern forming body comprising a decomposition removing layer that is, and by irradiating the decomposition removing layer with energy in a pattern, a decomposition removing pattern is formed on the decomposition removing layer. A decomposition removal pattern forming step to be formed, on the decomposition removal layer surface on which the decomposition removal pattern is formed,
A metal colloid solution applying step of applying the metal colloid solution in a pattern by applying the metal colloid solution, and a conductive pattern forming step of solidifying the metal colloid solution adhered in the pattern to form a conductive pattern. A method of manufacturing a conductive pattern forming body, comprising: 15. The contact angle of the liquid with respect to the decomposition and removal layer is different from the contact angle of the liquid with respect to the photocatalyst processing layer exposed by decomposition of the decomposition and removal layer. 1. A method for manufacturing a conductive pattern forming body according to claim 1. 16. The conductive material according to claim 14 or 15, wherein the decomposition and removal layer is one of a self-assembled monolayer film, a Langmuir-Blodgett film, and an alternate adsorption film. A method for manufacturing a pattern forming body. 17. The contact angle with respect to the metal colloid solution on the decomposition and removal layer is 50 ° or more in a portion not irradiated with energy, and 40 ° or less in an irradiated portion. The method for producing a conductive pattern forming body according to any one of claims 14 to 16. 18. The method according to claim 1, further comprising a non-image area removing step of removing a non-conductive pattern portion on which no conductive pattern portion is formed after the conductive pattern forming step. The method for producing a conductive pattern forming body according to any one of claims 1 to 7. 19. The method for producing a conductive pattern forming body according to claim 18, wherein the non-image area removing step is a step of removing the non-conductive pattern area with an alkaline solution. 20. The photocatalyst is titanium oxide (Ti
O_Two), Zinc oxide (ZnO), tin oxide (SnO)_Two),
Strontium titanate (SrTiO_Three), Oxide tongue
Stainless (WO_Three), Bismuth oxide (Bi_TwoO_Three), And
And iron oxide (Fe _TwoO_Three1 type or 2 types selected from
Claims 1 to 6, which are the above substances
Conductive pattern shape according to any of claims 19
Adult manufacturing method. 21. The photocatalyst is titanium oxide (TiO ₂ ).
21. The method for manufacturing a conductive pattern forming body according to claim 20, wherein 22. When the content of fluorine on the surface of the photocatalyst containing layer is analyzed and quantified by X-ray photoelectron spectroscopy, Ti
22. The conductive pattern forming body according to claim 21, further comprising a photocatalyst-containing layer in which the fluorine element is contained on the surface of the photocatalyst-containing layer in a ratio of 500 or more when the number of elements is 100. Production method. 23. The method for producing a conductive pattern forming body according to claim 1, wherein the energy irradiation is performed while heating the photocatalyst. 24. The method for producing a conductive pattern forming body according to claim 1, wherein the metal colloid solution is a silver colloid aqueous solution or a gold colloid aqueous solution. . 25. The method according to any one of claims 1 to 24, wherein the coating of the metal colloid solution in the metal colloid solution coating step is a dip coating method or a spin coating method. A method for manufacturing a conductive pattern forming body. 26. The conductive pattern formation according to claim 1, wherein the coating of the metal colloid solution in the metal colloid solution coating step is a nozzle discharge method. Body manufacturing method. 27. The method of manufacturing a conductive pattern forming body according to claim 26, wherein the nozzle discharging method is an inkjet method. 28. A photocatalyst-containing layer which is a layer in which the wettability of a substrate and an energy-irradiated portion formed on the substrate changes in a direction in which the contact angle of a liquid decreases, and which contains at least a photocatalyst and a binder. And a metal composition formed by solidifying a metal colloid solution in a pattern on the photocatalyst-containing layer, the conductive pattern forming body. 29. A base material, and a layer formed in a pattern on the base material, in which the wettability of an energy-irradiated portion changes in the direction of decreasing the contact angle of a liquid, and contains at least a photocatalyst and a binder. And a metal composition formed by solidifying a metal colloid solution on the photocatalyst-containing layer. 30. The photocatalyst-containing layer contains a decomposable substance that is decomposed by the action of a photocatalyst by energy irradiation, thereby changing the wettability on the photocatalyst-containing layer. Item 32. A conductive pattern formed product according to item 29. 31. The contact angle with respect to the metal colloid solution on the photocatalyst-containing layer is 50 ° or more in a portion not irradiated with energy and 40 ° or less in an irradiated portion. 28. The conductive pattern forming body according to claim 28. 32. On the substrate, the photocatalyst treatment layer containing at least a photocatalyst on the substrate, and the photocatalyst treatment layer, the wettability of the energy irradiation portion changes in the direction in which the contact angle of the liquid decreases. A conductive pattern forming body comprising a wettability changing layer and a metal composition formed by solidifying a metal colloid solution in a pattern on the wettability changing layer. 33. A base material, a photocatalyst processing layer containing at least a photocatalyst on the base material, and a pattern formed on the photocatalyst processing layer. 1. A conductive pattern forming body comprising: a wettability changing layer that changes in a decreasing direction; and a metal composition formed by solidifying a metal colloid solution on the wettability changing layer. 34. The wettability of the substrate, the photocatalyst treatment layer formed on the substrate in a pattern and containing at least a photocatalyst, and the energy irradiation portion formed on the photocatalyst treatment layer has a liquid wettability. A conductive pattern forming body, comprising: a wettability changing layer that changes in a direction of decreasing a contact angle; and a metal composition formed by solidifying a metal colloid solution on the wettability changing layer. 35. The contact angle with respect to the metal colloid solution on the wettability changing layer is 50 ° or more in a portion not irradiated with energy and 40 ° or less in an irradiated portion. Item 35. The conductive pattern formed body according to any one of items 32 to 34. 36. A base material, a photocatalyst processing layer containing at least a photocatalyst on the base material, and a decomposition and removal layer which is a layer on the photocatalyst processing layer that is decomposed and removed by the action of the photocatalyst accompanying energy irradiation. And a metal composition formed by solidifying a metal colloid solution in a pattern on the photocatalyst treatment layer from which the decomposition and removal layer has been decomposed and removed. 37. The conductive pattern forming body according to claim 36, wherein the decomposition and removal layer is one of a self-assembled monolayer film, a Langmuir-Blodgett film, and an alternate adsorption film. 38. The contact angle with respect to the metal colloid solution on the decomposition and removal layer is 50 ° or more in a portion not irradiated with energy and 40 ° or less in an irradiated portion. 36. The conductive pattern forming body according to claim 36 or 37.